JPH08104306A - Carrier-embossing/taping device - Google Patents

Abstract

PURPOSE: To improve the checking precision for the polarity of an electronic component by providing a hole-making unit which forms a plurality of inspection holes at specified locations on an embossed part, and a enclosed direction- checking unit which electrically checks the enclosed direction of an electronic component by inserting probes from the inspection holes after a sealing with a tape. CONSTITUTION: When a carrier embossed tape 10 is formed, an embossed part (11a) which matches the outer shape of an electronic component 20 to be enclosed is formed on one tape 11 by an embossing unit 2. Then, a hole-making unit 3 is provided, and in the case of a diode with terminal parts 20a at locations, corresponding two inspection holes 11b are provided on the embossed part (11a). After a sealing with a tape 12 is performed at a sealing unit 5, the polarity of the electronic component 20 to the embossed part (11a) is inspected at an enclosed direction-checking unit 6. The enclosed direction- checking unit 6 has probes 6a and a continuity meter 6b, and the probes 6a are brought into contact with the terminal parts 20a of the electronic component 20 from the inspection holes 11b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention, when shipping electronic components such as transistors for chip mounting, sets the polarity and the like so as to be convenient for mounting on a printed circuit board by the user. The present invention relates to a carrier embossing and taping device that performs sealing in a unified direction.

[0002]

2. Description of the Related Art FIG. 3 shows an example of the structure of a conventional carrier embossing and taping device 90. First, an embossing portion 81a is formed on one tape 81 by an embossing portion 91 at a predetermined pitch. Then, the electronic component 70 such as a transistor, a diode or a resistor is dropped into the embossed portion 81a in a predetermined direction by the component supply unit 92, and then the embossed portion 82 is sealed by the other tape 82 by the sealing unit 93. The bottom surface of the portion 81a is sealed.

FIG. 4 shows a carrier embossing tape 80 formed by using the carrier embossing and taping device 90, and the embossed portion 81a is formed so as to match the outer shape of the electronic component 70 to be sealed. Further, by sealing with the other tape 82, the electronic component 70 does not change its orientation even during the transportation process. Therefore, the user can mount the printed circuit board on the printed circuit board one by one. It can be done without checking the polarity.

[0004]

As described above, in the state where the carrier embossed tape 80 is completed, there is no possibility that the electronic component 70 changes its direction. However, in the carrier emboss taping device 90,
If vibration or the like is applied in the process of reaching the sealing portion 93 from the component supply portion 92, it is fully conceivable that the electronic component 70, which is only being dropped, changes its direction.

Therefore, in reality, the electronic component 70 is inspected for its directivity after the sealing portion 93, but at this time, the other tape 82 has already been used for sealing. The inspection must rely on visual recognition or image recognition by a video camera, and the inspection is performed by an indirect element with respect to the shape of the electronic component 70 or the function such as a mark printed on the outer shape of the electronic component 70. However, there arises a problem that the detection accuracy is lowered, and it has been a problem to solve this problem.

[0006]

As a concrete means for solving the above-mentioned conventional problems, the present invention forms an embossed portion corresponding to the shape of an electronic component to be enclosed in one tape, and the inside of the embossed portion is formed. In a carrier embossed taping device formed by sealing the bottom surface of the embossed portion with the other tape after dropping the electronic component in a predetermined direction, the carrier embossed taping device includes the embossed portion at a designated position. A hole processing part that forms a plurality of inspection holes, and a sealed direction verification part that electrically verifies the sealed direction of the electronic component by inserting a probe from the inspection hole after sealing with the other tape. By providing a carrier embossed taping device characterized by being provided with As things, it is intended to solve the conventional problems described above.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail based on an embodiment shown in the drawings. Reference numeral 1 in FIG. 1 denotes a carrier embossing taping device (hereinafter abbreviated as taping device 1), and this taping device 1 forms the carrier embossing tape 10 shown in FIG. 2 as in the conventional example. First, as the first step, the embossing section 2 forms an embossed section 11a matching the outer shape of the electronic component 20 to be encapsulated on one tape 11 by an appropriate means such as a heat press. It is a thing.

Actually, the electronic component 2 is used by utilizing gravity.
Since the number 0 is dropped, the embossed portion 11a is formed so that the open bottom portion is upward and protrudes downward. In FIG. 2, understanding of the configuration, operation, and effect of the present invention is made. In order to facilitate the above, the upper and lower sides are shown inverted.

In the present invention, the embossed portion 2 is used.
After that, the hole processing section 3 is provided. In the case where the hole processing section 3 is, for example, the electronic component 20 is a diode and has two terminal portions 20a of an anode terminal and a cathode terminal. The two inspection holes 11b are provided in the embossed portion 11a by punching so as to correspond to the anode terminal and the cathode terminal, respectively. The diameter of the inspection hole 11b may be a diameter sufficient for the probe 6a, which will be described later, to pass through.

At this time, if the taping device 1 seals only the same electronic component 20, the embossed portion 11 processed by the embossed portion 2 is processed.
The shape of a and the inspection hole 1 processed by the hole processing part 3
Since the position and the number of 1b are constant, the embossing section 2 may be provided with the function of the hole processing section 3.

In the embossed portion 11a in which the inspection hole 11b is formed as described above, an electronic component 20 oriented in a predetermined direction by the component supply unit 4 is dropped by, for example, an industrial robot, as described in the conventional example. Will be used. Therefore, in the state in which the component supply unit 4 is dropped, the inspection hole 11b is the anode terminal of the electronic component 20,
It is located at a position corresponding to the terminal portion 20a such as the cathode terminal.

After that, the other tape 12 is sealed in the sealing portion 5 by a suitable means such as heat welding to seal the bottom portion of the embossed portion 11a, whereby the electronic component 20 is sealed. Encapsulation will be performed. here,
In the present invention, instead of the visual inspection process of the conventional example, a sealing direction verification unit 6 is provided after the sealing unit 5, and the sealing direction verification unit 6 makes the direction of the electronic component 20 relative to the embossed section 11a. Inspect sex.

The enclosing direction verification section 6 is, for example, two probes 6a and a continuity meter 6b. When the embossed section 11a reaches a fixed position, the probe 6a advances to pass through the inspection hole 11b. Then, it comes into contact with the terminal portion 20a of the electronic component 20. At this time, when the electronic component 20 is, for example, a diode, a positive electrode is applied to the anode terminal side and a negative electrode is applied to the cathode terminal side, whereby the continuity meter 6b responds and the electronic component 20 is oriented in the correct direction. Then, it is announced that it is located in the embossed portion 11a.

Therefore, when the continuity meter 6b does not react, for example, the component supply section 4 itself is defective, or the electronic component 20 is moved due to vibration in the path from the component supply section 4 to the sealing section 5. Therefore, it can be determined that the electronic component 20 is not sealed in the correct direction in the embossed portion 11a.

The determination by the continuity meter 6b may be made by the presence or absence of conduction as described above. For example, when the electronic component 20 is a resistor, its resistance value is measured. Alternatively, when the electronic component 20 does not generate direct current conduction such as a capacitor, the continuity meter 6b may be operated with alternating current or high frequency.

Further, when the electronic component 20 is a circuit element in which a plurality of resistors, capacitors, semiconductor elements, etc. are combined, and conduction is generated between most of the terminals, a certain conduction is conducted. Electronic component between terminals that does not cause
0 may be measured, and the point is to know that the electronic component 20 is in the correct direction in the embossed portion 11a.

When the inspection is carried out as described above and a defective portion is detected, for example, marking or separation is carried out to clearly indicate or exclude the defective portion, and thereafter, it is wound into a roll or the like. Will be prepared for shipment. Therefore, when marking is performed, continuous winding is possible, and for example, it is possible to have a fixed length (constant) such as 1000 rolls, but there is a possibility that unfixed length is used when separating. And which one to select may be in accordance with the request from the user.

With the configuration described above, in the taping device 1 of the present invention, the direction of the electronic component 20 in the embossed portion 11a is directly changed by an electric means close to the usage state of the electronic component 20. Since it is verified, it is possible to significantly improve the accuracy as compared with, for example, the shape of the electronic component 20 or the means for indirectly verifying the direction by marking or the like.

[0019]

As described above, according to the present invention, a hole processing portion for forming a plurality of inspection holes at a designated position of an embossed portion and the inspection hole after the other tape is sealed. By using a carrier emboss taping device that is provided with an encapsulation direction verification unit that inserts a probe and electrically verifies the encapsulation direction of electronic components, the inspection hole is formed in the electronic component after encapsulation is performed. The probe of the enclosing direction inspection unit can be contacted via this, and as the means for inspecting the directionality of this type of electronic component, it is possible to perform the inspection by the optimum electrical means, and the directionality of the electronic component in the embossed section can be measured accurately. Therefore, it is extremely effective in improving the quality of the carrier embossed tape.

[Brief description of drawings]

FIG. 1 is an explanatory view showing an embodiment of a carrier embossed taping device according to the present invention.

FIG. 2 is an explanatory view showing an example of a carrier embossing tape of the same embodiment.

FIG. 3 is an explanatory diagram showing a conventional example.

FIG. 4 is an explanatory diagram showing an example of a conventional carrier embossing tape.

[Explanation of symbols]

 1 ... Carrier embossed taping device 2 ... Embossing part 3 ... Hole processing part 4 ... Component supply part 5 ... Sealing part 6 ... Encapsulation direction verification part 6a ... Probe 6b ... Continuity meter 10 ... Carrier embossed tape 11 ... One tape 11a ... Embossed portion 11b ... Inspection hole 12 ... Other tape

Claims (1)

[Claims] 1. An embossed portion corresponding to the shape of an electronic component to be encapsulated in one tape is formed, and the electronic component is dropped in the embossed portion in a predetermined direction, and then the bottom surface of the embossed portion is sealed with the other tape. In the carrier embossed taping device formed by wearing, the carrier embossed taping device is provided with a hole processing part that forms a plurality of inspection holes at designated positions of the embossed part, and sealing with the other tape. A carrier emboss taping device, further comprising: an encapsulation direction verification unit that later verifies a direction in which the electronic component is encapsulated by inserting a probe through the inspection hole.