JP2003243871A - Shielding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shielding device which surrounds an electronic component on a printed board and can be reduced in size and weight. <P>SOLUTION: The shielding device can be reduced in size and weight by mounting one opening of a frame 3 on a printed board 1 so as to surround electronic component group 2 for constituting a high-frequency circuit mounted on the board 1, coating a detachable conductive adhesive 5 on an adhesive surface 4 of the other opening of the frame 3, and adhering the frame 3 and a cover 6 having a plate-like metal component without side plate for surrounding the frame 3 with the adhesive 5. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield device for covering a group of electronic components mounted on a printed board with a frame or a lid.

[0002]

2. Description of the Related Art Conventionally, this type of shield device has been disclosed in Japanese Patent Laid-Open No.
The thing described in the 001-196758 gazette is known. In such a conventional shield device, one opening of the frame is attached to the printed board so as to surround the electronic component group mounted on the printed board, and a side plate is provided so that the side plate is larger than the outer shape of the frame. A cover body having a large outer shape corresponding to the plate thickness closes the other opening of the frame body, and is fitted by a locking hole provided on the side plate of the frame body and an engaging projection provided on the side plate of the lid body. In this configuration, unnecessary electromagnetic radiation to the outside is reduced, or the influence of electromagnetic waves and noise from other circuits or the outside is prevented.

[0003]

However, in the above-described conventional shield device, since the side plate of the lid body surrounds the frame body, the outer shape of the lid body is larger than the outer shape of the frame body by the plate thickness of the side plate. Therefore, there is a problem that the outer shape of the shield device becomes large.

The present invention has been made in order to solve such a conventional problem, and provides a shield device having an excellent effect that it can be reduced in size and weight.

[0005]

A shield device according to the present invention is applied to a frame body having a metal component that surrounds an electronic component group and stands upright on a printed circuit board, and a periphery of the frame body that is not in contact with the printed circuit board. And a lid having a metal component that seals the inside of the frame with the conductive adhesive. With this configuration, it is possible to reduce the size and the weight without increasing the outer size of the lid body than the outer size of the frame body.

The shield device according to the present invention has a structure in which the lid body to which the conductive adhesive is applied is L-shaped. With this configuration, it is possible to improve the electrical characteristics and increase the adhesive strength by increasing the adhesive area between the frame body and the lid body.

The shield device according to the present invention has a structure in which at least one of the frame body and the lid body is provided with a hole. With this configuration, it is possible to reduce the weight of the shield device while satisfying the shield effect.

The shield device according to the present invention has a structure in which a reinforcing body is provided inside the frame body. With this configuration, the strength of the shield device against pressure and the like can be increased.

The shield device according to the present invention has a structure in which the frame body is provided with a suction surface for sucking the frame body. With this configuration, when the frame body is reflowed onto the printed circuit board in the production process, the frame body can be sucked and operated by the suction nozzle of the mounting machine.

The shield device according to the present invention has a structure in which a notch is provided in an opening portion of the frame body on a side to be attached to the printed circuit board. With this configuration, when the frame body is reflow-soldered on the printed circuit board, the solder can be reliably attached to the frame body.

The shield device according to the present invention has a structure in which a positioning protrusion for positioning the lid with respect to the frame is provided. With this configuration, when the lid body is attached to the frame body, the lid body can be easily positioned.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The first to seventh embodiments of the present invention will be described in detail below with reference to the accompanying drawings. (First Embodiment) First, a shield device according to a first embodiment of the present invention will be described with reference to FIGS. As shown in the exploded perspective view of the shield device shown in FIG. 1 and the perspective view of the main part of the shield device shown in FIG. 2, the shield device according to the present embodiment is provided with one opening of the metal rectangular frame body 3. A conductive member that is attached to the printed circuit board 1 so as to surround the electronic component group 2 constituting the high frequency circuit mounted on the printed circuit board 1 and is detachable from the adhesive surface 4 of the other opening of the frame body 3. The adhesive 5 is applied, and the conductive adhesive 5 is used to bond the frame 3 and the plate-like metal lid 6 surrounding the frame 3 without a side plate.

As described above, according to the shield apparatus of the first embodiment of the present invention, the outer shape of the lid 6 is not larger than the outer shape of the frame body 3.
The shield device can be reduced in size and weight.

In this embodiment, the frame 3 is made of metal and has a rectangular shape. However, the frame 3 has conductivity such as a conductive resin or a resin coated with a conductive paint. The shape is not particularly limited as long as the shape can surround 2 The lid 6 is also made of metal in the present embodiment and has a plate shape. However, as long as the lid 6 has a shape capable of covering the opening of the frame 3, any shape can be used. However, there is no particular limitation.

(Second Embodiment) Next, a shield device according to a second embodiment of the present invention will be described with reference to FIGS. 3 and 4. As shown in the exploded perspective view of the shield device shown in FIG. 3 and the sectional view of the main part of the shield device shown in FIG. 4, the shield device in the present embodiment covers the frame body 3 on the side where the lid body 6 is adhered. The end face is bent inward to form an L-shape to form the adhesive surface 4a, which is a difference from the first embodiment of the present invention.

As described above, according to the shield device of the second embodiment of the present invention, the frame body 3 can be easily formed by sheet metal, and the adhesion area between the frame body 3 and the lid body 6 can be increased. Is increased, the electrical characteristics are improved and
The adhesive strength can be increased. In the present embodiment, an example in which the frame 3 is bent to form the adhesive surface 4a has been described, but the adhesive surface 4a of the frame 3 may be formed by cutting or the like, and the same method can be used. However, it is not particularly limited.

(Third Embodiment) Next, a shield device according to a third embodiment of the present invention will be described with reference to FIG. As shown in the exploded perspective view of the shield device shown in FIG. 5, the shield device according to the present embodiment is configured such that the frame body 3 and the lid body 6 are provided with a plurality of circular holes 7, respectively. First and second
This is different from the embodiment.

As described above, according to the shield device in the third embodiment of the present invention, the shield device can be made lightweight by providing the hole 7 in the frame body 3 and the lid body 6. In addition, in the present embodiment, an example in which a plurality of holes 7 are formed in the frame body 3 and the lid body 6 respectively and in a circular shape has been described, but at least one or more holes 7 are provided in either the frame body 3 or the lid body 6. However, the shape is not particularly limited.

(Fourth Embodiment) Next, a shield device according to a fourth embodiment of the present invention will be described with reference to FIG. As shown in the exploded perspective view of the shield device shown in FIG. 6, the shield device according to the present embodiment is configured to include a cross-shaped rib 8 inside the frame body 3, but the first to the first embodiments of the present invention. This is different from the third embodiment.

As described above, according to the shield device in the fourth embodiment of the present invention, by providing the rib 8 inside the frame body 3, it is possible to increase the strength of the shield device against pressing and the like. . In addition, in the present embodiment, an example in which the cross-shaped rib 8 is configured has been described.
The shape is not particularly limited as long as it does not hit the electronic component group 2 mounted on the printed board 1 and can increase the strength of the shield device.

(Fifth Embodiment) Next, a shield device according to a fifth embodiment of the present invention will be described with reference to FIG. As shown in the exploded perspective view of the shield device shown in FIG. 7, the shield device according to the present embodiment has two triangular corners on the diagonally opposite side of the surface of the frame 3 that is bonded to the lid 6. Where the suction surface 9 is provided,
It is different from the first to fourth embodiments of the present invention.

As described above, according to the shield device of the fifth embodiment of the present invention, by providing the frame 3 with the suction surface 9, the frame 3 is reflowed to the printed circuit board in the production process. At this time, since the frame 3 can be sucked by the suction nozzle of the mounting machine, the production process can be facilitated. In addition, in the present embodiment, an example in which the suction surface 9 is formed in two places with a triangle has been described.
As long as the suction nozzle can be sucked, it may be provided in any shape and in any number of places, and is not particularly limited.

(Sixth Embodiment) Next, a shield device according to a sixth embodiment of the present invention will be described with reference to FIG. As shown in the exploded perspective view of the shield device shown in FIG. 8, the shield device according to the present embodiment is provided with a plurality of notches 10 on the side of the frame 3 to be attached to the printed board 1, This is a difference from the first to fifth embodiments of the present invention.

As described above, according to the shield device in the sixth embodiment of the present invention, when the frame 3 is reflow-soldered onto the printed board 1, the solder is surely attached to the frame 3. You can In the present embodiment,
An example in which a plurality of notches 10 are provided has been described, but any number and shape may be used as long as the number of notches 10 required for soldering is provided, and there is no particular limitation. .

(Seventh Embodiment) Next, a shield device according to a seventh embodiment of the present invention will be described with reference to FIGS. 9 and 10. As shown in the exploded perspective view of the shield device shown in FIG. 9 and the perspective view of the main part of the shield device shown in FIG. It is different from the first to sixth embodiments of the present invention in that two positioning pieces 11 are provided on the corner surfaces at several places.

As described above, according to the shield device of the seventh embodiment of the present invention, the lid body 6 and the frame body 3 are provided.
The lid 6 can be easily positioned by the positioning piece 11 when it is mounted on. In the present embodiment, an example in which two positioning pieces 11 are provided on one corner surface of the frame body 3 on the side where the positioning pieces 11 are bonded to the lid body 6 has been described. There is no particular limitation as long as the body 6 can be positioned, the number, and the shape.

[0027]

The shield device according to the present invention is configured as described above, and in particular, the outer shape of the lid body is made to be the outer shape of the frame body by adhering the frame body and the lid body with a removable conductive adhesive. It has an excellent effect that the size and weight can be reduced without making the size larger than the outer shape.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a configuration of a shield device according to a first embodiment of the present invention,

FIG. 2 is a perspective view of essential parts showing the configuration of the shield device according to the first embodiment of the present invention;

FIG. 3 is an exploded perspective view showing a configuration of a shield device according to a second embodiment of the present invention,

FIG. 4 is a cross-sectional view of an essential part showing the configuration of a shield device according to a second embodiment of the present invention,

FIG. 5 is an exploded perspective view showing a configuration of a shield device according to a third embodiment of the present invention,

FIG. 6 is an exploded perspective view showing a configuration of a shield device according to a fourth embodiment of the present invention,

FIG. 7 is an exploded perspective view showing a configuration of a shield device according to a fifth embodiment of the present invention,

FIG. 8 is an exploded perspective view showing a configuration of a shield device according to a sixth embodiment of the present invention,

FIG. 9 is an exploded perspective view showing the configuration of a shield device according to a seventh embodiment of the present invention,

FIG. 10 is a perspective view of a main part showing a configuration of a shield device according to a seventh embodiment of the present invention.

[Explanation of symbols]

1 printed circuit board 2 Electronic parts group 3 frame 4 Adhesive surface 4a Adhesive surface 5 Conductive adhesive 6 lid 7 holes 8 ribs (reinforcement) 9 Adsorption surface 10 notches 11 Positioning piece (projection)

Claims (7)

[Claims] 1. A frame body having a metal component that surrounds an electronic component group and stands on a printed circuit board, a conductive adhesive applied around the frame body that is not in contact with the printed circuit board, and the conductive adhesive. And a lid having a metal component that seals the inside of the frame with an agent. 2. The shield device according to claim 1, wherein the lid body to which the conductive adhesive is applied is L-shaped. 3. The shield device according to claim 1, wherein at least one of the frame body and the lid body is provided with a hole. 4. The shield device according to claim 1, wherein a reinforcing body is provided inside the frame body. 5. The shield device according to claim 1, wherein the frame body is provided with a suction surface for sucking the frame body. 6. The shield device according to claim 1, wherein a cutout portion is provided in an opening portion of the frame body on a side to be attached to the printed circuit board. 7. A positioning protrusion for positioning the lid body with respect to the frame body is provided.
The shield device according to any one of 1.