JP2003231042A - Hole image pickup device and working device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hole image pickup device for obtaining an image having a high contrast between an object and an object hole independently of an image pickup condition. <P>SOLUTION: A plate body 28 is irradiated with the lighting light having radiation optical axes C28a and C28b inclined against an image pickup optical axis C27 of a camera 27 by luminaires 28a and 28b to pickup an image of the plate 21 with the camera 27. The image thereby picked up has a high lightness in an image part of the plate body 21 and a low lightness in an image part of a through hole 22 even if the image pickup condition such as an angle of the image pickup axis C27 in relation to the plate body 21 is changed, and has the high contrast having a large difference of lightness between both the parts. The through hole 22 can be easily and securely detected on the basis of the obtained image. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus for picking up an image of a target hole near a target hole in which the target hole is formed.

In the present invention, the term "substantially parallel" includes "parallel" and the term "parallel" includes "coaxial".

[0003]

2. Description of the Related Art FIG. 16 is a sectional view showing a conventional hole image pickup device 1. The hole imaging device 1 is a device for imaging the vicinity of the through hole 2 of the plate body 3 in order to detect the through hole 2 of the plate body 3 in which the through hole 2 is formed. This hole imaging device 1
Is provided with a camera 4 having an imaging optical axis C4 and an illuminator 5 provided adjacent to the camera 4 and having an irradiation optical axis C5 parallel to the imaging optical axis C4, and in the vicinity of the through hole 2 of the plate body 3. Illumination light is emitted from the illuminator 5, and the camera 4 images the vicinity of the through hole 2 of the plate body 3. The image thus picked up is given to the image processing means, the image is processed, and the through hole 2 is detected.

[0004]

In the hole image pickup device 1, since the image pickup optical axis C4 and the irradiation optical axis C5 are parallel to each other as described above, the image pickup is performed under the illumination of coaxial incident light. The image obtained is the surface state of the plate body 3, the optical axis C4,
Imaging conditions such as the angle between C5 and the plate 3 and the state behind the through hole 2 are greatly affected. Specifically, if the surface state of the plate 3 and the angles between the optical axes C4, C5 and the plate 3 change even slightly, the illumination light reflected by the surface of the plate 3 and incident on the camera 4 The reflected light changes greatly and various shadows are generated, so that the contrast between the image portion of the plate 3 and the image portion of the through hole 2 becomes small. Also, as shown in FIG. 17, when an object 6 such as another tool or member exists behind the through hole 2, the illumination light transmitted through the through hole 2 is reflected by the object 6, and the reflected light is again reflected through the through hole 2. After passing through, the light enters the camera 4 and the contrast between the image portion of the plate 3 and the image portion of the through hole 2 is almost lost.

As described above, in the hole image pickup device 1, the contrast between the image portion of the plate 3 and the image portion of the through hole 2 becomes small as shown in FIG. More specifically, as shown in FIG. 19, the lightness change range 9 of the image portion of the plate 3 that changes according to the change of the imaging condition and the lightness change range of the image portion of the through hole 2 that changes according to the change of the imaging condition. 10 partially overlaps each other, and as shown in an example, there is almost no difference between the lightness 11 of the image portion of the plate 3 and the lightness 12 of the image portion of the through hole 2, that is, FIG.
In addition to the state shown in (1), the brightness of the image portion of the through hole 2 may be higher than the brightness of the image portion of the plate body 3. Therefore, even if image processing such as binarization using a threshold value is performed, the through hole 2 cannot be detected.

An object of the present invention is to provide a hole image pickup device which can obtain an image having a high contrast between an object and an object hole without being influenced by the image pickup condition.

[0007]

The present invention according to claim 1 is an image pickup means for picking up an image of an object in which an object hole is formed,
A hole image pickup device comprising: an irradiation unit that irradiates the object with illumination light of an irradiation optical axis that is inclined with respect to the image pickup optical axis of the image pickup unit from the same side as the image pickup unit.

According to the present invention, the illumination light of the irradiation optical axis inclined with respect to the imaging optical axis is irradiated by the irradiation means from the same side as the imaging means with respect to the object, and the object is imaged by the imaging means. be able to. By thus inclining the irradiation optical axis with respect to the imaging optical axis, the light amount of the illumination light reflected by the surface of the object and incident on the imaging means is determined by the surface state of the object and each optical axis with respect to the object. It is possible to make it less susceptible to the imaging conditions including the angle and the like.
As a result, even if the imaging condition changes, it is possible to obtain an image that includes the image portion of the object that is stable and has a small change in brightness with high brightness.

By tilting the irradiation optical axis with respect to the image pickup optical axis, even if an object exists on the side opposite to the image pickup means with respect to the object hole, the illumination light transmitted through the object hole is reflected by the object, It is possible to prevent the light from passing through the target hole again and entering the imaging unit. With this, regardless of the existence of the object on the side opposite to the imaging means with respect to the target hole,
The amount of illumination light incident on the image pickup means from a region in the direction in which the target hole exists with respect to the image pickup means can be suppressed to a small amount, and even if the image pickup conditions change, the target hole that is stable and has a small change in brightness with low brightness. It is possible to obtain an image including the image portion of.

As described above, in the image portions of the object and the object hole, the change in brightness is small, the differences in brightness are large, and an image having high contrast can be obtained. Therefore, the target hole can be easily and surely detected based on the image obtained by imaging. For example, it is possible to easily and surely detect the target hole by performing simple processing such as binarization processing on the obtained image.

According to a second aspect of the present invention, the image pickup means is provided such that the image pickup optical axis and the hole axis of the target hole are substantially parallel to each other.

According to the present invention, it is possible to suppress the problem that the illumination light of the irradiation optical axis tilted with respect to the imaging optical axis is reflected on the inner surface of the object facing the object hole and enters the imaging means. it can. This makes it possible to obtain an image in which the boundary between the object and the object hole is clear. Therefore, by processing the obtained image, the target hole can be detected with higher accuracy.

According to a third aspect of the present invention, an image pickup means for picking up an image of an object in which an object hole is formed is provided on the same side as the image pickup means with respect to the object, and is inclined with respect to the image pickup optical axis of the image pickup means. A processing apparatus comprising: an irradiation unit that irradiates an object with illumination light of an irradiation optical axis; and a processing unit that processes the object in association with the target hole.

According to the present invention, the object can be imaged by the imaging means to detect the object hole, and the object can be processed in association with the object hole by the processing means. When capturing an image of an object, illuminating light from the same side as the image capturing means with respect to the object with an irradiation optical axis that is inclined with respect to the image capturing optical axis, and capturing the object with the image capturing means. You can By thus inclining the irradiation optical axis with respect to the imaging optical axis, the light amount of the illumination light reflected by the surface of the object and incident on the imaging means is determined by the surface state of the object and each optical axis with respect to the object. It is possible to make it less susceptible to the imaging conditions including the angle and the like. As a result, even if the imaging condition changes, it is possible to obtain an image that includes the image portion of the object that is stable and has a small change in brightness with high brightness.

Further, by tilting the irradiation optical axis with respect to the imaging optical axis, even if an object exists on the opposite side of the imaging hole with respect to the object hole, the illumination light transmitted through the object hole is reflected by the object, It is possible to prevent the light from passing through the target hole again and entering the imaging unit. With this, regardless of the existence of the object on the side opposite to the imaging means with respect to the target hole,
The amount of illumination light incident on the image pickup means from a region in the direction in which the target hole exists with respect to the image pickup means can be suppressed to a small amount, and even if the image pickup conditions change, the target hole that is stable and has a small change in brightness with low brightness. It is possible to obtain an image including the image portion of.

As described above, in the image portions of the object and the object hole, the change in brightness is small, the differences in brightness are large, and an image having high contrast can be obtained. Thereby, the target hole can be detected easily and surely based on the image obtained by imaging. Therefore, when the object is machined, the object hole is surely detected, so that the object can be machined accurately in relation to the object hole.

The present invention according to claim 4 is characterized in that the image pickup means is provided such that the image pickup optical axis and the hole axis of the target hole are substantially parallel to each other.

According to the present invention, it is possible to suppress the problem that the illumination light of the irradiation optical axis inclined with respect to the imaging optical axis is reflected on the inner surface of the object facing the object hole and is incident on the imaging means. it can. This makes it possible to obtain an image in which the boundary between the object and the object hole is clear, and by processing the obtained image, the object hole can be detected with higher accuracy.
Therefore, the object can be processed more accurately in relation to the object hole.

According to a fifth aspect of the present invention, the processing means is means for processing along a predetermined processing axis line, and when the image pickup means images the object, the processing axis line for processing the object. It is characterized in that the object is processed in conformity with the imaging optical axis.

According to the present invention, the processing axis can be aligned with the image pickup optical axis when the image pickup means picks up an image of the object, and the object can be processed along the processing axis. This makes it possible to accurately align the machining axis with respect to the target hole detected based on the image obtained by picking up the image, and to more accurately process the target object.

According to the sixth aspect of the present invention, the processing means is provided on the same side as the imaging means with respect to the object, and a drill for cutting the object by rotating around the processing axis can be detachably mounted. It is characterized by having a drill chuck that can be used.

According to the present invention, the drill can be attached to the drill chuck, and the object can be cut from the same side as the imaging means. The opening of the target hole on the imaging means side is an opening on the side that is reliably detected based on the image obtained by imaging, and the drill can be aligned with this opening to process the target object. it can. For example, when drilling to expand the target hole, the hole axis in the opening on the imaging device side and the processing axis of the drill can be matched exactly, and the shake of the drill is prevented and the diameter is expanded accurately. be able to.

In the present invention according to claim 7, the processing means is provided on either side of the object, and is provided with a support tool for supporting a rivet arranged along the processing axis, and with respect to the object. It has a pressing tool which is provided on the other side and presses and deforms the rivet supported by the supporting tool.

According to the present invention, the rivet having the object inserted therethrough can be sandwiched and pressed from both sides of the object by the support and the pressing portion, and the rivet can be deformed and struck on the object. The rivet may be directly inserted into the target hole and driven, or it may be inserted into the processed hole after being processed, such as by expanding the diameter of the target hole, and then driven. When the processing means for driving the rivet is provided in this way, tools are required on both sides of the target object, and when the target object is imaged by the imaging means, the tool exists on the side opposite to the target object with respect to the target hole. Even in such a case, an image including the image portion of the target hole of low brightness can be obtained, and the target hole can be reliably detected, so that the target object can be accurately processed. As described above, the processing device capable of driving the rivet with high accuracy can be obtained.

According to the present invention of claim 8, the object is configured by temporarily fixing a plurality of constituent members by a hollow cylindrical temporary tack, and the target hole is a hole of the tack, and the plurality of the tack holes are provided. It is characterized by including a temporary fixing means for temporarily fixing the plate member with a temporary tack.

According to the present invention, the object can be formed by temporarily fixing the plurality of constituent members by using the temporary tacking means having the hollow cylindrical shape by using the temporary fixing means. The object formed in this way can be imaged by the imaging means to detect the object hole which is the hole of the temporary tack, and the object can be processed by the processing means in relation to this object hole. As described above, it is possible to temporarily fix a plurality of constituent members and align them with each other, and to perform further processing in relation to the temporarily fixed position, and to process the plurality of constituent members in a mutually associated state. be able to.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a hole image pickup device 20 of the present invention.
FIG. FIG. 2 is a sectional view showing the hole imaging device 20 in a simplified manner. The hole image pickup device 20 is a device for picking up an image of the plate body 21 in order to detect a through hole 22 formed by inserting the plate body 21 constituting the body of an aircraft in the thickness direction. In the present embodiment, the hole imaging device 20 is
With the approximate position of the through hole 22 being known in advance,
In order to accurately detect the through hole 22, the vicinity of the through hole 22 is imaged.

The plate 21, which is an object, has a substantially flat shape (including a flat shape), and a plurality of, in the present embodiment, two plate members 23 and 24 are laminated and temporarily fixed by a tack 25. It is configured by stopping. The temporary tack 25 has a hollow cylindrical shape, and the through hole 22 that is the target hole is configured by the hole of the temporary tack 25.

The hole image pickup device 20 includes a camera 27 as an image pickup means and a plurality of, and in the present embodiment, two illuminators 28a and 28b (hereinafter, collectively referred to as unspecified illuminators). When referred to, the suffix is omitted and the reference numeral "28" is added). The camera 27 images the plate 21, and the illuminators 28 irradiate the plate 21 with illumination light to illuminate an area to be imaged by the camera 27, and thus an imaged portion of the plate 21 by the camera 27. To do.

The camera 27 is provided on one side in the thickness direction of the plate body 21, the imaging optical axis C27 is substantially parallel to the thickness direction of the plate body 21, and the axis line of the through-hole 22 which is roughly grasped in advance ( Hereinafter, it is provided so as to be substantially parallel to L22). The imaging optical axis C27 is the camera 27
Is the axis of the light that is incident on, that is, the imaging light. The camera 27 includes, for example, a charge coupled device (Charge Coupled D).
evice: Abbreviated name CCD) may be used for the image sensor, or may be realized by another camera.

Each illuminator 28 is provided symmetrically with respect to the image pickup optical axis C27 on the same side as the camera 27 with respect to the plate 21, and an irradiation optical axis C28 which is inclined with respect to the image pickup optical axis C27.
The illumination light of a and C28b is emitted from the same side as the camera 27 with respect to the plate body. Each illuminator 28 has an area to be illuminated,
Therefore, the light source may be arranged in the vicinity of the region to be imaged by the camera 27, or in order to widen the vicinity of the region to be imaged, a light source such as an optical fiber is provided from a light source provided at a distant position. The configuration may be such that the illumination light is guided and irradiated using a light means. The light source may be, for example, a halogen lamp.

Irradiation optical axis C28a of one illuminator 28a
The irradiation optical axis C28b of the other illuminator 28b and the imaging optical axis C27 exist on a common virtual one plane, and the plate 21
At the intersection P existing on the side where the camera 27 and the illuminators 28 are provided. Each imaging optical axis C28a,
The angle θ1 formed by C28b with respect to the imaging optical axis C27 is
For example, it is about 45 degrees. Each irradiation optical axis C28a, C2
8b (hereinafter, including generically, when referring to an unspecified irradiation optical axis, a suffix is omitted and a reference numeral “C28” is attached) is an axis line of the irradiation light emitted from each illuminator 28. is there.

FIG. 3 is a diagram showing an example of a picked-up image picked up by the camera 27. Hole imaging device 20
Is illuminated by each illuminator 28, and the camera 2
The plate body 21 is imaged by 7 and the plate body 2 as shown in FIG.
It is possible to obtain one image 30 (hereinafter referred to as “captured image”). The captured image 30 has an image portion 31 that represents the plate 21 (hereinafter referred to as “plate image portion”) 31 and an image portion that represents the through hole 22 (hereinafter referred to as “through hole image portion”) 32.

The hole image pickup device 20 further includes an image processing means 2.
The image processing means 29 is provided with a captured image 30 from the camera 27. The image processing means 29 is realized by a computer, for example, and performs predetermined image processing such as binarization processing on the captured image 30 using a predetermined threshold value, and the captured image 30 is converted into a plate body. Region selection is performed for the image portion 31 and the through hole image portion 32, and the through hole image portion 32 is extracted from the captured image 30.

In the hole image pick-up device 20, the picked-up image 30 picked up by the camera 27 is processed by the image processing means 29.
The through-hole image portion 32 can be extracted from the captured image 30 by performing the processing by. By extracting the through hole image portion 32 in this way, the through hole 22 can be detected. More specifically, the position of the through hole 22 and the hole axis L
Information about the through hole 22 including the position of the through hole 22, the shape of the through hole 22, and the size of the through hole 22 can be obtained.

In order to detect the through hole 22 in this way, when the plate 21 is imaged, the hole imaging device 20 picks up the imaging optical axis C2 from the same side as the camera 27 with respect to the plate 21.
Illumination light having an illumination optical axis C28 that is inclined with respect to 7 is emitted by the illuminator 28, and in this state, the plate 21 is attached to the camera 27.
Can be imaged by. In this way, the imaging optical axis C
By illuminating the irradiation optical axis C28 with respect to 27, the light amount of the illumination light reflected by the surface of the plate 21 and incident on the camera 27 is imaged on the surface state of the plate 21 and the image of the plate 21. It is possible to reduce the influence of imaging conditions including the angles of the optical axis C27 and the irradiation optical axis C28. As a result, even if the imaging conditions change, the brightness change is small, and it is possible to obtain the captured image 30 including the image part of the plate body 21 stable with high brightness, that is, the plate body image part 31.

Further, with respect to the image pickup optical axis C27, the irradiation optical axis C2
By inclining 8, even if an object such as a ram 75 described later is present on the side opposite to the camera 27 with respect to the through hole 22, the illumination light transmitted through the through hole 22 is reflected by the ram 75 and the through hole is again provided. It is possible to prevent the light from passing through 22 and entering the camera 27. This makes it possible to suppress the amount of illumination light incident on the camera 27 from a region in the direction in which the through hole 22 exists with respect to the camera 27, regardless of the presence of an object on the opposite side of the camera 27 with respect to the through hole 22. Even if the imaging conditions change, it is possible to obtain a stable image of the through-hole 22 with a small change in brightness and a low brightness, that is, the captured image 30 including the through-hole image portion 32.

FIG. 4 is a graph showing the brightness of the plate image portion 31 and the through hole image portion 32 in the captured image 30. As described above, the brightness change of the plate image portion 31 and the through-hole image portion 32 due to the change of the imaging condition is small, the brightness is largely different from each other, and the captured image 30 having high contrast can be obtained. it can. Therefore, the through hole 22 can be easily and surely detected based on the captured image 30.

Explaining in more detail, the plate image portion 3
The brightness change range 35 of the plate image portion 31, which is a range in which the brightness of 1 changes according to the change of the imaging condition, is smaller than that of the conventional technique, and the brightness 36 of the plate image portion 31 is stable at high brightness. There is. The brightness 37 of the through-hole image portion 32 hardly changes even if the imaging condition changes, and takes a substantially constant value with low brightness.

As a result, the brightness 3 of the plate image portion 31
6 changes with the change of the imaging condition, the brightness 36 of the plate image portion 31 and the brightness 3 of the through hole image portion 32
7 has a big difference. Therefore, it is sufficiently lower than the lightness 36 of the plate image portion 31 and sufficiently higher than the lightness 37 of the through hole image portion 32 so that the binarization process can be performed more stably than the lightness 36 of the plate image portion 31. A high threshold value 38 can be set. Using this threshold value 38, the image processing means 29 causes the captured image 3
The through-hole image portion 32 can be accurately detected by binarizing 0.

As described above, the through-hole image portion 32 is easily and surely extracted by the simple image processing of binarization,
The through hole 22 can be easily and surely detected. Therefore, information about the through hole 22, such as the shape and size of the through hole 22 and the position of the hole axis L22, can be obtained easily and with high accuracy.

Further, it is possible to prevent the illumination light of the irradiation optical axis C28 inclined with respect to the imaging optical axis C27 from being reflected on the inner surface of the plate 21 facing the through hole 22 and entering the camera 27. . This makes it possible to obtain a captured image 30 with a clear boundary between the plate 21 and the through hole 22. Therefore, by processing the captured image 30 obtained, the through hole 22 can be detected with higher accuracy.

FIG. 5 is a perspective view showing an automatic hole punching and tacking device 40 including the hole image pickup device 20. Automatic drilling and tacking device provided in the processing device (hereinafter referred to as "punching device") 40
Is an apparatus for processing the plate body 21 which is a work in association with the through hole 22. Specifically, the driving device 40 is provided with the provisional tack 2
In order to finally and surely fix the two plate members 23 and 24 temporarily fixed by 5, the temporary tack 25 is removed and the through hole 22 is perforated to have a predetermined shape and size. This is a device for setting a rivet 60 (illustrated in FIG. 8 etc.) in the hole after the processing. The processing device includes, in addition to the driving device 40, temporary fixing means 100 for temporarily fixing the plate members 23 and 24.

The driving device 40 has a holding unit 41 and two processing units 42 and 43. The holding unit 41 grips both ends of the plate body 21 and arranges and holds the plate body 21 substantially horizontally (including the horizontal direction). One processing unit (hereinafter referred to as “upper unit”) 42 is a plate body 21.
Is provided on one side which is the upper side of the. The other processing unit (hereinafter referred to as “lower unit”) 43 is provided on the other side, which is the lower side of the plate body 21.

FIG. 6 is a perspective view showing the main structure of the upper unit 42. The upper unit 42 includes the camera 27,
Each illuminator 28, a perforation means 44, and a tack support means 45 are included. The upper unit 42 further includes a base 46, and a predetermined reference axis L of the base 46.
46 is arranged so as to be substantially parallel to the thickness direction of the plate body 21 and substantially parallel to the axis L22 of the through hole 22, which is roughly grasped in advance. In addition, the upper unit 42,
Based on the detection result of the hole imaging device 20, the reference axis L
The hole 46 can be displaced so as to match the hole axis L22 detected.

The camera 27 is the base 4 of the upper unit 42.
6 to fix the plate 2 of the upper unit 42 in the vicinity of the through hole 22 in order to secure a work area for work by other means.
It is provided at a portion far from 1 and therefore at a position far from the through hole 22. With the camera 27 thus provided, the imaging optical axis C27 coincides with the reference axis L46.

In the present embodiment, each illuminator 28 is configured to guide the illumination light from the light source through an optical fiber and irradiate it from its emission end 47, and is fixed to the base 46. In order to illuminate the vicinity of the through hole 22 so that the upper unit 42 does not produce a shadow, the exit end 47 of the optical fiber is
The upper unit 42 is provided in a portion near the plate body 21 while avoiding a region near the reference axis L46. The light source is provided in the vicinity of the through hole 22 at a position distant from the through hole 22 in order to secure a work area for work by other means.

FIG. 7 is a simplified plan view showing the punching means 44 in a direction along the reference axis L46. Referring also to FIG. 6, the perforation means 44 is one of the processing means for processing the plate body 21 in association with the through holes 22, and has a drill unit section 50 and a drill unit holding section 51.

The drill unit 50 has a drill chuck 54 to which a drill 53 can be detachably mounted. The drill chuck 54 is rotationally driven around a drill axis L50 which is an axis of the drill 53 by a motor which is a drive source built in the drill unit 50, and the drill 53 is thereby rotated around the drill axis L50. The drill axis L50 is a machining axis in the drilling means 44.

The drill unit holding portion 51 has a support base 55.
And an arm 56. The support base 55 has a reference axis L
It is fixed to the base 46 while avoiding the area near 46. The arm 56 has a base end portion which is angularly displaceable in the angular displacement direction A about the support axis L51 on the support base 55, and the support axis L5.
It is supported so as to be displaceable along 1. This arm 56
Attach the drill unit 50 to the tip and the drill 53 to the plate 2
It is arranged on the side facing 1 and is held so that the drill axis L50 is parallel to the support axis L51.

This arm 56 is supported by, for example, a motor which is a drive source built in the support portion 55 and is supported by a support axis L51.
Not only is it angularly driven around, but it is also driven along the support axis L51. As a result, the drill unit portion 50 is angularly displaced in the angular displacement direction A between the machining position 58 where the drill axis L50 coincides with the reference axis L46 and the retracted position 59 which is retracted from the area near the reference axis L46. As described above, the drilling means 44 sets the drill unit portion 50 to the processing position 58 only when performing the drilling processing, and sets the drill unit portion 50 to the retracted position 59 when not performing the drilling processing. It can be kept out of the way by other means. Further, the drill unit section 50 is displaced along the drill axis L50.

The boring means 44 is used for the drill unit 5
0 can be arranged at the processing position 58, and the plate body 21 can be drilled by rotating the drill 53 around the drill axis L50 and displacing it along the drill axis L50. Based on the detection result of the through hole 22 by the hole imaging device 20, the base 46 is arranged so that the reference axis L46 coincides with the detected hole axis L22, and the plate body 21 is perforated to form the through hole 21. It is possible to perform a perforating process related to the through hole 21, that is, a perforating process, such as expanding and changing the shape and removing the temporary tack 25. Moreover, since the through hole 22 is accurately detected as described above, it is possible to perform the drilling with high accuracy.

FIG. 8 is a side view schematically showing the tack supporting means 45, except for the tack holding portion 82, when viewed in a direction perpendicular to the reference axis L46. FIG. 9 is a front view showing the vicinity of the anvil 61 as viewed from the left side of FIG. FIG. 10 is a side view showing the vicinity of the anvil 61 when viewed from the same direction as FIG. Referring also to FIG. 6, the tack support means 45 is a means for supporting the rivet 60, which is a tack to be inserted into the plate body 21, from one side of the plate body 21, and is an anvil 61 and a hydraulic cylinder 62. And a transmission mechanism 63 and a tack holding portion 82.
In the present embodiment, the tack supporting means 45 supports the rivet 60 which is inserted into the processed through hole 22 processed by the boring means 44. The code "2" is used for both the plate body before and after the punching process.
In addition to "1", the through holes before and after the perforating process are also denoted by "22".

The anvil 61 is a columnar member, and is a member that comes into contact with the rivet 60 inserted through the processing hole 22. The base end of the anvil 61 is connected to the transmission mechanism 63, and the free end of the anvil 61 contacts the rivet 60.

Hydraulic cylinder 62 which is a fluid pressure cylinder
Is a cylinder tube 64 which is provided on the base 46 so as to be angularly displaceable around the cylinder angular displacement axis L62, and a piston rod 65 which is provided so as to be extendable and retractable in a state in which a tip portion of the cylinder tube 64 is projected. Have and. Cylinder tube 6 from a hydraulic source that is a fluid source
The piston rod 65 can be expanded and contracted by controlling the supply state of the hydraulic oil that is the hydraulic fluid to the piston 4.

The transmission mechanism 63 is a link mechanism having a first link member 66 and a second link member 67. First
One end of the link member 66 is connected to the base 46 so as to be angularly displaceable around the first mechanical axis L63a. The first link member 66 has the second mechanism axis L63 at the other end.
The piston rod 65 is connected to the tip portion of the piston tube 65 protruding from the cylinder tube 64 so as to be angularly displaceable around b.

The second link member 67 has one end portion connected to the other end portion of the first link member 66 and the tip end portion of the piston rod 65 so as to be angularly displaceable around the second mechanism axis L63b. The anvil 61 is connected to the other end of the second link member 67 at its base end so as to be angularly displaceable around the third mechanical axis L63c.

The cylinder angle displacement axis L62 and the first to third mechanism axes L63a to L63c are parallel to each other,
The piston rod 65 extends in a direction perpendicular to the extending and retracting directions. Also, these cylinder angular displacement axis L
62 and the first to third mechanism axes L63a to L63c are
It extends in a direction perpendicular to the reference axis L56.

Tack holding portion 8 also called rivet finger
2 is a plurality of locking claws 8 that can be displaced toward and away from each other.
4, the tip of the rivet 60 can be opened and closed by approaching and separating the locking claws 84, and the head of the rivet 60 can be inserted and removed in the open state, and the rivet 60 in the closed state. The 60 head cannot be inserted or removed. Therefore, the tack holding means 82 is opened by inserting the head of the rivet 60 and then closing it.
The rivet 60 can be held, and the holding of the rivet 60 can be released by opening the rivet 60 from the held state. The tack holding portion 82 is coaxially arranged so as to surround the anvil 61, and its base end portion is angularly displaceable at the other end portion of the second ring member 67 and along the axis line of the tack holding portion 82. It is provided so that it can be displaced.

When the anvil axis line L61 is on the reference axis line L46, the anvil 61 is on the reference axis line L with respect to the base 46.
46 is provided so as to be displaceable along the axis 46, and the tack holding portion 82 is prevented from being displaced along the reference axis L46. Anvil 6
1 is a position where the free end of the tack holding portion 82 projects from the tack holding portion 82 along the anvil axis L61, that is, the reference axis L61, and the tack end holding portion 8 has the free end.
It is freely displaceable to the position where it is immersed in 2.

Further, a part of the base 46 allows the anvil 6 to be
1, the axis (hereinafter referred to as "anvil axis") L61
Is held in parallel with the reference axis L46,
Means for guiding the anvil 61 are configured. A shaft for connecting the anvil 61 and the second link member 67 to each other in angular displacement is fitted into the base 46, and a guide groove 68 for guiding the base end portion of the anvil 61 is formed. Guide groove 68
Is an L-shape having a distance guide portion 68a and an advance / retreat guide portion 68b.

In the distance guide portion 68a, the anvil axis L61 is the reference axis L46 in the direction B toward and away from the plate body 21 with the upper unit 42 facing the plate body 21.
And guide the anvil 61 along the reference axis L46. The advancing / retreating guide portion 68b is connected to the end portion of the distance guide portion 68a far from the plate body 21, extends in the direction perpendicular to the reference axis line L46, and is aligned with the reference axis line L46 with the upper unit 42 facing the plate body 21. On the other hand, the anvil 61 and the tack holding portion 82 are guided perpendicularly to the reference axis L46 in the direction C for advancing and retreating.

The advancing / retreating guide portion 68b has an anvil axis L
The guide 61 extends to an advanced position 90 where it coincides with the reference axis L46 and a retracted position 91 where the anvil axis L61 is retracted from the reference axis L46. Anvil 61 is in the advance position 9
When it is 0, the anvil axis L61 coincides with the axis L22 of the machining hole 22 (hereinafter referred to as "machining hole axis").

The stud support means 45 is used for the piston rod 6
In the retracted state where 5 is retracted and the anvil 61 is arranged at the retracted position 91, the anvil 61 is retracted from the vicinity of the reference axis L46, so that it is possible to prevent it from disturbing the work by other means. In this state, when the rivet holding portion 82 is opened and closed to hold the rivet 60 and then the piston rod 65 is extended, the anvil 61 and the rivet holding portion 82 are guided by the advance / retreat guide portion 68b and are displaced to the advanced position. When the piston rod 65 is further extended, the anvil 61
It is guided by the distance guide portion 68a to approach the plate body 21, and thus approaches the processing hole 22. At this time, the holding of the rivet 60 by the tack holding portion 82 is released, and the rivet 60 is inserted into the processing hole 22. When the piston rod 65 is further extended, the free end portion of the anvil 61 eventually becomes the rivet 60.
To support the rivet 60.

When the piston rod 65 is retracted from the supporting state in which the rivet 60 is supported by the anvil 61 in this way, the anvil 61 is guided by the distance guide portion 68a and moves away from the plate body 21 and the rivet 60, and the advance position 90 is reached. Displace to. When the piston rod 65 is further retracted, the anvil 61 is guided by the advancing / retreating guide portion 68b to be displaced to the retracted position, and the tack support means 45 is in the retracted state.

FIG. 11 is a perspective view showing the main structure of the lower unit 43. Referring also to FIG. 1, the lower unit 43 is configured to include the tack pressing means 70. The tack pressing means 70 is configured so that the tack pressing portion 71 can be driven by the pressing driving portion 72.

The tack pressing portion 71 has a ram 75 and a ram cylinder 76. The pressing drive unit 72 can drive the ram 75 and the ram cylinder 76 together along displacement along the ram axis L75 which is the axis of the ram 75, as well as drive along the ram 75 along the ram axis L75. it can.

The lower unit 43 has the ram axis L75
The tack pressing means 70 is driven so that it can be displaced along at least two axes that are provided so as to match the reference axis L46 of the upper unit 42 and intersect with the ram axis L75 and intersect with each other. It is configured to include a motor that is a drive source. As a result, the lower unit 43
Based on the detection result of the hole imaging device 20, the ram axis L
It is possible to displace the tack pressing means 70 together with the base 46 so that 75 is aligned with the reference axis L46, and thus the ram axis L75 is aligned with the detected hole axis L22.

The pressing drive unit 72 controls the supply state of the working oil, which is the working fluid, to the tack pressing unit 71,
The ram 75 and the ram cylinder 76 can be driven. With the rivet 60 supported by the tack supporting means 45 of the upper unit 42 as described above, the rivet 60 is pressed by the tack pressing means 70 from the side opposite to the tack supporting means 45 with respect to the plate body 21, and the rivet 60 is moved. Transforms
The plate body 21 to which the plate members 23 and 24 are finally fixed can be obtained by hitting the rivets 60.

The rivet supporting means is constituted by the rivet supporting means 45 of the upper unit 42 and the rivet pressing means 70 of the lower unit 43, and the rivet activating means also penetrates the plate 21 through the through hole 22.
In relation to, it is a processing means for processing along the processing axis. The machining axis of the driving means is an axis that coincides with the anvil axis L61 of the anvil 61 that is the support tool and the ram axis L75 of the ram 75 that is the pressing tool. As described above, the driving device 40 has two processing means.

In FIG. 12, each plate member 23, 24 is provided with a temporary tack 25.
FIG. 7 is a simplified cross-sectional view showing a method of temporarily fixing with. The temporary fixing means 100 includes the plate members 23, 2 to be temporarily fixed.
4. A sandwiching device for sandwiching 4 and each plate member 2 sandwiched by the sandwiching device
The temporary tack hole forming device for forming the temporary tack hole 101 common to the holes 3, 24, the temporary tack insert device for inserting the temporary tack 25 into the temporary tack hole 101, and the temporary tack 25 inserted in the temporary tack hole 101 are provided. It has a caulking device 79 for caulking so as to expand the diameter, and a drive source for driving the caulking device 79. The caulking device 79 has a caulking device main body 78 having a spherical shape having an outer diameter larger than that of the temporary tack 25 without the diameter expansion, and a cord 77 having one end fixed to the caulking device main body 79.

In the temporary fixing by the temporary tack 25 using the temporary fixing means 100, first, the plate members 23 and 24 are clamped by the clamping device, and the temporary tack insertion device is inserted into the temporary fixing hole 101 formed by the temporary fixing hole forming device. The temporary tack 25 is inserted by. After the provisional tack 25 is thus inserted, the cord 77 of the caulking device 79 is inserted as shown in FIG. 12 (1). From this state, as shown in FIG. 12 (2), the cord 77 is pulled by the drive source to allow the caulking device body 78 to pass through the provisional tack 25. As a result, the temporary tack 25 is deformed so as to expand its diameter, and is, so to speak, crimped. In this way, as shown in FIG. 12C, the temporary tack 25 is struck and the plate members 23 and 24 are temporarily fixed.

FIG. 13 is a flow chart showing a method of automatic drilling and driving by the driving device 40. 14
[FIG. 4] is a simplified cross-sectional view showing a method of punching. FIG. 15 is a simplified sectional view showing a method of setting the rivet 60. The tack device 40 includes the above-mentioned camera 27, each illuminator 28, the image processing means 29, the perforating means 44, the tack supporting means 45, and the tack pressing means 70, and comprehensively configures each component of the tack device 40. It has control means for controlling.

The control means is realized by, for example, a computer, and the control means comprehensively controls the respective components of the rivet driving device 40, and causes the rivet driving device 40 to execute automatic drilling and rivet working. Automatic drilling and tack processing
As shown in FIG. 12, each plate member 23, 24 is attached to the temporary tack 2
5, the plate body 21 temporarily fixed to the holding unit 41
With the state held by, the process starts at step s0.

When the automatic drilling and tacking process is started in step s0, the through hole 22 is detected in step s1 as shown in FIG. 14 (1). The detection of the through-hole 22 is performed by the hole imaging device 20 as described above, by imaging the plate 21 under oblique illumination by the illumination light of the irradiation optical axis C28 that is inclined with respect to the imaging optical axis C27, and the obtained imaging. Process and detect the image. At this time, the punching means 44 and the tack supporting means 45 are in the retracted state.

When the through hole 22 is detected in step s1,
In step s2, the reference axis L46 and the ram axis L75.
The base 46 and the stud pressing means 70 are displaced so that the line accords with the hole axis L22. In this manner, with the reference axis L46 and the ram axis L75 aligned with the hole axis L22,
As shown in FIG. 14B, the plate body 21 is clamped by the upper unit 42 and the lower unit 43.

The upper unit 42 has a clamp body 80 provided on the base 46. The clamp body 80 has a substantially cylindrical shape with a bottom, and an opening is formed in the center of the bottom portion thereof so as to be inserted along the axis line (hereinafter, referred to as “clamp axis line”) L80. The clamp body 80 is provided with the clamp axis L80 aligned with the reference axis L46, is provided so as to be displaceable along the reference axis L46, and is driven by a motor, which is a drive source incorporated in the upper unit 42, to provide the reference axis L46. Displacement is driven along.

The clamp body 80 is displaced in the direction of approaching the plate body 21, and the ram 75 and the ram cylinder 76 are displaced in the direction of approaching the plate body 21 together, whereby the ram 75 and the ram cylinder 76 are clamped together. The plate body 21 is clamped by the ram cylinder 76 and the clamp body 80 by bringing the body 80 close to each other. At this time, the ram 75 is retracted with respect to the ram cylinder 76 from the tip of the ram cylinder 76 to the most retracted state.
In this most immersive state, the ram 75 does not interfere with work by other means. Further, since the clamp body 80 is formed with the openings as described above, it does not interfere with the work by other means.

When the plate body 21 is clamped by the upper unit 42 and the lower unit 43 in step s2,
In step s3, as shown in FIG.
Drilling. In step s3, the drill unit section 50 is placed at the processing position 58, the drilling means 44 is brought into the processing state, and the drill 50 is rotated and displaced so as to approach the plate body 21 to drill the plate body 21, Provisional tack 25
The diameter is increased while removing the to form a predetermined shape. In this way, as shown in FIGS. 14 (4) and 15 (1), the cylindrical small-diameter portion having a small inner diameter, the truncated cone-shaped inclined portion, and the cylindrical large-diameter portion having a large inner diameter are formed. Processed hole 22
To form. When the formation of the processed hole 22 is completed, the punching means 44 returns to the retracted state.

When the machined hole 22 is formed in step s3, the rivet 60 is inserted into the machined hole 22 by the tack supporting means 45 as shown in FIG. 15 (2) in step s4. The rivet 60 is inserted by carefully checking the piston rod 85 of the hydraulic cylinder 62 while the rivet 60 is held by the tack holding portion 82.
0 is conveyed to a position coaxial with the reference axis L46, and is held and released at this position to be inserted into the processing hole 22.

When the rivet 60 is inserted in step s4, the rivet 60 is supported from one side with respect to the plate body 21 in step s5, as shown in FIG. 15 (3). In step s5, the fluid pressure cylinder 6 in step s4
The anvil 61 in which the piston rod 65 of No. 2 is extended and advanced to the advanced position causes the anvil 61 to approach the processing hole 22 by further extension of the piston rod 65, and this anvil 61 supports one end of the rivet 60 from above. To be done.

When the rivet 60 is supported in step s5, the ram 75 is displaced with respect to the ram cylinder 76 so as to be close to the plate body 21 in step s6.
The rivet 60 is pressed from below. At this time, since the rivet 60 is supported from above, the rivet 6
0 is transformed as shown in FIG. In this manner, the rivet 60 can be hit and the plate members 23 and 24 can be permanently fixed by the rivet 60. Rivets 6
When the deformation of 0 is completed, the tack supporting means 45 returns to the retracted state, and the tack pressing portion 71 returns to the state where the ram 75 is most retracted.

When the rivet 60 is pressed and deformed in step s6, the clamp is released in step s7 as shown in FIG. 15 (5), and the automatic drilling and tacking process for one through hole 22 is completed. . Such a series of automatic drilling and tacking processing is automatically controlled and executed for the plurality of through holes 22 formed in the plate body 21.

According to such a driving device 40, the plate body 21 can be imaged by the camera 27 to detect the through hole 22, and the plate body 21 can be processed in relation to the through hole 22. When the plate body 21 is imaged, it can be imaged by the hole imaging device 20 described above, and the through hole 22 can be easily and surely detected. Therefore, the plate 21
The plate body 21 can be accurately machined in relation to the through holes 22 in machining.

The plate axis 21 can be processed along the processing axis by aligning the processing axis with the image pickup optical axis C27 when the camera 27 takes an image of the plate 21. As a result, the plate axis 21 can be processed more accurately by accurately aligning the processing axis with the through hole 22 detected based on the image obtained by imaging.

Further, the punching means 44 which is one of the processing means
Attaches the drill 53 to the drill chuck 54,
With respect to 1, the plate body 21 can be cut from the same side as the camera 27. The opening of the through-hole 22 on the camera 27 side is an opening on the side that can be reliably detected based on the image obtained by imaging, and the drill 53 is aligned with this opening to process the plate body 21. can do. Therefore, it is possible to prevent the drill 53 from moving and to perform accurate machining.

Further, in the driving means which is one of the processing means,
In hitting the rivet 60, a tool is required on both sides of the plate body 21, and when the plate body 21 is imaged by the camera 27, the tool exists on the plate body 21 with respect to the through hole 22, but in such a case. Also, since the plate body is imaged by oblique illumination, the through hole 22 can be reliably detected, and highly accurate riveting can be performed.

The above-described embodiment is merely an example of the present invention, and the configuration can be changed within the scope of the present invention. For example, the hole imaging device 20 may be incorporated in a device other than the driving device 40 or may be used alone. Further, the target hole to be detected may be a through hole formed in an object other than the plate body constituting the body of the aircraft.

[0089]

According to the present invention as set forth in claim 1, the irradiation means irradiates the illumination light of the irradiation optical axis inclined with respect to the imaging optical axis from the same side as the imaging means with respect to the object,
The object can be imaged by the imaging means. By thus inclining the irradiation optical axis with respect to the imaging optical axis, the light amount of the illumination light reflected by the surface of the object and incident on the imaging means is determined by the surface state of the object and each optical axis with respect to the object. It is possible to make it less susceptible to the imaging conditions including the angle and the like. Even if the imaging conditions change due to this,
It is possible to obtain an image including an image portion of an object of high brightness that is stable and has a small change in brightness.

By tilting the irradiation optical axis with respect to the image pickup optical axis, even if an object exists on the side opposite to the image pickup means with respect to the object hole, the illumination light transmitted through the object hole is reflected by the object, It is possible to prevent the light from passing through the target hole again and entering the imaging unit. With this, regardless of the existence of the object on the side opposite to the imaging means with respect to the target hole,
The amount of illumination light incident on the image pickup means from a region in the direction in which the target hole exists with respect to the image pickup means can be suppressed to a small amount, and even if the image pickup conditions change, the target hole that is stable and has a small change in brightness with low brightness. It is possible to obtain an image including the image portion of.

As described above, it is possible to obtain an image in which the image portions of the object and the object hole have a small change in brightness, a large difference in brightness, and a high contrast. Therefore, the target hole can be easily and surely detected based on the image obtained by imaging. For example, it is possible to easily and surely detect the target hole by performing simple processing such as binarization processing on the obtained image.

According to the second aspect of the present invention, the illumination light of the irradiation optical axis inclined with respect to the imaging optical axis is reflected by the inner surface of the object facing the object hole and is incident on the imaging means. It is possible to suppress defects. This makes it possible to obtain an image in which the boundary between the object and the object hole is clear. Therefore, by processing the obtained image, the target hole can be detected with higher accuracy.

According to the present invention of claim 3, the object can be imaged by the imaging means to detect the object hole, and the object can be processed by the processing means in association with the object hole. When capturing an image of an object, illuminating light from the same side as the image capturing means with respect to the object with an irradiation optical axis that is inclined with respect to the image capturing optical axis, and capturing the object with the image capturing means. You can By thus inclining the irradiation optical axis with respect to the imaging optical axis, the light amount of the illumination light reflected by the surface of the object and incident on the imaging means is determined by the surface state of the object and each optical axis with respect to the object. It is possible to make it less susceptible to the imaging conditions including the angle and the like. As a result, even if the imaging condition changes, it is possible to obtain an image that includes the image portion of the object that is stable and has a small change in brightness with high brightness.

By tilting the irradiation optical axis with respect to the imaging optical axis, even if an object exists on the side opposite to the imaging means with respect to the object hole, the illumination light transmitted through the object hole is reflected by the object, It is possible to prevent the light from passing through the target hole again and entering the imaging unit. With this, regardless of the existence of the object on the side opposite to the imaging means with respect to the target hole,
The amount of illumination light that is incident on the image pickup means from a region in the direction in which the target hole exists with respect to the image pickup means can be suppressed to a small amount, and even if the image pickup conditions change, the target hole that is stable and has a small change in brightness with low brightness. It is possible to obtain an image including the image portion of.

As described above, in the image portions of the object and the object hole, the change in brightness is small, the brightness is largely different from each other, and an image having high contrast can be obtained. Thereby, the target hole can be detected easily and surely based on the image obtained by imaging. Therefore, when the object is machined, the object hole is surely detected, so that the object can be machined accurately in relation to the object hole.

According to the present invention of claim 4, the illumination light of the irradiation optical axis inclined with respect to the imaging optical axis is reflected by the inner surface of the object facing the object hole and is incident on the imaging means. It is possible to suppress defects. This makes it possible to obtain an image in which the boundary between the object and the object hole is clear, and by processing the obtained image, the object hole can be detected with higher accuracy. Therefore, the object can be processed more accurately in relation to the object hole.

According to the fifth aspect of the present invention, the processing axis can be aligned with the imaging optical axis when the imaging means images the object, and the object can be processed along the processing axis. This makes it possible to accurately align the machining axis with respect to the target hole detected based on the image obtained by picking up the image, and to more accurately process the target object.

According to the present invention described in claim 6, the drill can be attached to the drill chuck, and the target can be cut from the same side as the image pickup means with respect to the target. The opening of the target hole on the imaging means side is an opening on the side that is reliably detected based on the image obtained by imaging, and the drill can be aligned with this opening to process the target object. it can. For example, when drilling to expand the target hole, the hole axis in the opening on the imaging device side and the processing axis of the drill can be matched exactly, and the shake of the drill is prevented and the diameter is expanded accurately. be able to.

According to the seventh aspect of the present invention, the rivet having the object inserted therethrough can be clamped from both sides of the object by the support tool and the pressing portion, and the rivet can be deformed and struck on the object. it can. The rivet may be directly inserted into the target hole and driven, or it may be inserted into the processed hole after being processed, such as by expanding the diameter of the target hole, and then driven. When the processing means for driving the rivet is provided in this way, tools are required on both sides of the target object, and when the target object is imaged by the imaging means, the tool exists on the side opposite to the target object with respect to the target hole. Even in such a case, an image including the image portion of the target hole of low brightness can be obtained, and the target hole can be reliably detected, so that the target object can be accurately processed. As described above, the processing device capable of driving the rivet with high accuracy can be obtained.

According to the eighth aspect of the present invention, the object can be formed by temporarily fixing the plurality of constituent members with the hollow cylindrical temporary tack using the temporary fixing means. The object formed in this way can be imaged by the imaging means to detect the object hole which is the hole of the temporary tack, and the object can be processed by the processing means in relation to this object hole. As described above, it is possible to temporarily fix a plurality of constituent members and align them with each other, and to perform further processing in relation to the temporarily fixed position, and to process the plurality of constituent members in a mutually associated state. be able to.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a hole imaging device 20 of the present invention.

FIG. 2 is a simplified cross-sectional view showing a hole imaging device 20.

FIG. 3 is a diagram showing an example of a captured image obtained by capturing with a camera 27.

FIG. 4 is a graph showing the brightness of a plate image portion 31 and a through hole image portion 32 in a captured image 30.

FIG. 5 is an automatic hole punching device 4 including a hole imaging device 20.
It is a perspective view which shows 0.

FIG. 6 is a perspective view showing a main configuration of an upper unit 42.

FIG. 7 is a simplified plan view showing a punching unit 44 in a direction along a reference axis L46.

FIG. 8 is a side view showing, in a simplified manner, the tack supporting means 45, except for the tack retaining portion, as viewed in a direction perpendicular to a reference axis L46.

9 is a front view showing the vicinity of the anvil 61 as viewed from the left side of FIG.

10 is a side view showing the vicinity of the anvil 61 when viewed from the same direction as FIG.

11 is a perspective view showing the main configuration of a lower unit 43. FIG.

FIG. 12 is a simplified cross-sectional view showing a method of temporarily fixing each plate member 23, 24 with a temporary tack 25.

FIG. 13 is a flowchart showing a method of automatic drilling and tacking processing by the punching device 40.

FIG. 14 is a simplified cross-sectional view showing a method of punching.

FIG. 15 is a simplified cross-sectional view showing a method of setting a rivet 60.

FIG. 16 is a cross-sectional view showing a conventional hole image pickup device 1.

FIG. 17 is a cross-sectional view showing the hole imaging device 1 in a simplified manner.

FIG. 18 is a diagram showing an example of an image obtained by the hole imaging device 1.

FIG. 19 is a graph showing the brightness of the image portion of the plate and the image portion of the through hole in the image obtained by the hole imaging device 1.

[Explanation of symbols]

20-hole imaging device 21 plate 22 Through hole (processed hole) 23, 24 Plate member 25 provisional tacks 27 cameras 28a, 28b illuminator 40 Automatic hole punching device 41 Holding unit 42 Upper unit 43 Lower unit 44 Perforating means 45 Tack support means 53 drill 54 drill chuck 61 anvil 70 Tack pressing means 75 Ram 100 temporary fixing means 100 C27 Imaging optical axis C28a, C28 irradiation optical axis L22 hole axis (machining hole axis) L46 Reference axis L50 drill axis L61 anvil axis L75 Ram axis

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G03B 15/00 G03B 15/00 T 15/02 15/02 Z H04N 5/225 H04N 5/225 C // B21J 15/28 B21J 15/28 F F term (reference) 3C029 AA02 AA40 3C036 AA12 CC08 CC09 5C022 AA01

Claims (8)

[Claims] 1. An image pickup means for picking up an image of an object in which an object hole is formed, and an illumination light of an irradiation optical axis tilted with respect to the image pickup optical axis of the image pickup means from the same side as the image pickup means. An image pickup device for irradiating a hole with a hole. 2. The hole image pickup device according to claim 1, wherein the image pickup means is provided such that the image pickup optical axis and the hole axis line of the target hole are substantially parallel to each other. 3. Image pickup means for picking up an image of an object in which an object hole is formed, and illumination light of an irradiation optical axis which is provided on the same side of the object as the image pickup means and is inclined with respect to the image pickup optical axis of the image pickup means. A processing apparatus including: an irradiation unit that irradiates an object and a processing unit that processes the object in relation to the target hole. 4. The processing apparatus according to claim 3, wherein the image pickup means is provided such that the image pickup optical axis and the hole axis of the target hole are substantially parallel to each other. 5. The processing means is means for processing along a predetermined processing axis, and the processing axis when processing the object is made to coincide with the imaging optical axis when the imaging means images the object. The processing device according to claim 3 or 4, which processes an object. 6. The processing means has a drill chuck provided on the same side as the imaging means with respect to the object, and capable of detachably mounting a drill that rotates around a processing axis and cuts the object. The processing apparatus according to claim 5, which is characterized in that. 7. The processing means is provided on either one side of the object, and is provided with a support tool for supporting the rivet arranged along the processing axis, and is provided on the other side of the object to support the rivet. 7. The processing apparatus according to claim 5, further comprising a pressing tool that presses and deforms a rivet supported by the tool. 8. The object is configured by temporarily fixing a plurality of constituent members with a hollow cylindrical temporary tack, the target hole is a hole of a temporary tack, and the plurality of plate members are temporarily tacked with the temporary tack. The processing apparatus according to any one of claims 3 to 7, comprising a temporary fixing means for stopping.