JP2003224128A5 - - Google Patents

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Publication number
JP2003224128A5
JP2003224128A5 JP2002022190A JP2002022190A JP2003224128A5 JP 2003224128 A5 JP2003224128 A5 JP 2003224128A5 JP 2002022190 A JP2002022190 A JP 2002022190A JP 2002022190 A JP2002022190 A JP 2002022190A JP 2003224128 A5 JP2003224128 A5 JP 2003224128A5
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JP
Japan
Prior art keywords
substrate
catalyst
electroless plating
wiring
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002022190A
Other languages
English (en)
Japanese (ja)
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JP3812891B2 (ja
JP2003224128A (ja
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Publication date
Application filed filed Critical
Priority to JP2002022190A priority Critical patent/JP3812891B2/ja
Priority claimed from JP2002022190A external-priority patent/JP3812891B2/ja
Publication of JP2003224128A publication Critical patent/JP2003224128A/ja
Publication of JP2003224128A5 publication Critical patent/JP2003224128A5/ja
Application granted granted Critical
Publication of JP3812891B2 publication Critical patent/JP3812891B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002022190A 2002-01-30 2002-01-30 配線形成方法 Expired - Fee Related JP3812891B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002022190A JP3812891B2 (ja) 2002-01-30 2002-01-30 配線形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002022190A JP3812891B2 (ja) 2002-01-30 2002-01-30 配線形成方法

Publications (3)

Publication Number Publication Date
JP2003224128A JP2003224128A (ja) 2003-08-08
JP2003224128A5 true JP2003224128A5 (https=) 2005-07-14
JP3812891B2 JP3812891B2 (ja) 2006-08-23

Family

ID=27745241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002022190A Expired - Fee Related JP3812891B2 (ja) 2002-01-30 2002-01-30 配線形成方法

Country Status (1)

Country Link
JP (1) JP3812891B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005174961A (ja) * 2003-12-05 2005-06-30 Ebara Corp 基板処理方法及び装置
JP2006009130A (ja) * 2004-06-29 2006-01-12 Ebara Corp 基板処理方法及び装置
WO2005071138A1 (ja) * 2004-01-23 2005-08-04 Ebara Corporation 基板処理方法及び触媒処理液及び基板処理装置
JP2006009131A (ja) * 2004-06-29 2006-01-12 Ebara Corp 基板処理方法及び装置
US7335588B2 (en) * 2005-04-15 2008-02-26 International Business Machines Corporation Interconnect structure and method of fabrication of same
JP5022828B2 (ja) * 2006-09-14 2012-09-12 富士フイルム株式会社 基板用水切り剤、これを使用する水切り方法及び乾燥方法
JP4936878B2 (ja) * 2006-12-25 2012-05-23 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2013052361A (ja) * 2011-09-05 2013-03-21 Fujifilm Corp 化学浴析出装置
JP7011388B2 (ja) * 2016-12-28 2022-01-26 エスアイアイ・プリンテック株式会社 溝構造のめっき方法
JP2026050588A (ja) * 2024-09-10 2026-03-23 ウシオ電機株式会社 配線基材の製造方法及び配線基材の製造装置

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