JP2003222637A5 - - Google Patents

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Publication number
JP2003222637A5
JP2003222637A5 JP2002022873A JP2002022873A JP2003222637A5 JP 2003222637 A5 JP2003222637 A5 JP 2003222637A5 JP 2002022873 A JP2002022873 A JP 2002022873A JP 2002022873 A JP2002022873 A JP 2002022873A JP 2003222637 A5 JP2003222637 A5 JP 2003222637A5
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JP
Japan
Prior art keywords
hole
inspection jig
conductive wire
contact pin
contact
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JP2002022873A
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Japanese (ja)
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JP3690796B2 (en
JP2003222637A (en
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Priority to JP2002022873A priority Critical patent/JP3690796B2/en
Priority claimed from JP2002022873A external-priority patent/JP3690796B2/en
Publication of JP2003222637A publication Critical patent/JP2003222637A/en
Publication of JP2003222637A5 publication Critical patent/JP2003222637A5/ja
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Publication of JP3690796B2 publication Critical patent/JP3690796B2/en
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Claims (14)

検査対象の電気的特性を検査するために前記検査対象に対する電気的な接触を得るための検査冶具であって、前記検査対象に導電接触するように構成された接触ピンと、該接触ピンを保持するヘッド部と、該ヘッド部に隣接配置され、前記接触ピンに対し直接若しくは間接的に導電接触する接続電極を備えた電極部と、を有し、前記電極部は、一方の表面から他方の表面まで貫通する通孔を備えた基材と、前記他方の表面側から前記通孔内に挿入された導電線と、前記他方の表面側から前記通孔内に付着され前記導電線を前記基材に固着させる封着材とを有し、前記接続電極は、前記通孔内から前記一方の表面に露出した前記導電線の端面上に構成されていることを特徴とする検査冶具。  An inspection jig for obtaining an electrical contact with the inspection object in order to inspect an electrical characteristic of the inspection object, and holding the contact pin configured to be in conductive contact with the inspection object A head portion, and an electrode portion that is disposed adjacent to the head portion and includes a connection electrode that is in direct or indirect conductive contact with the contact pin, and the electrode portion is connected from one surface to the other surface. A base material provided with a through-hole penetrating up to, a conductive wire inserted into the through-hole from the other surface side, and the conductive wire attached to the through-hole from the other surface side. An inspection jig, wherein the connection electrode is formed on an end surface of the conductive wire exposed on the one surface from the inside of the through hole. 前記通孔は、前記一方の表面側に構成された第1孔部と、該第1孔部よりも大径に構成され前記他方の表面に臨む第2孔部とを有する段付き孔であり、前記封着材は、前記第2孔部の内部に導入された状態で硬化されていることを特徴とする請求項1に記載の検査冶具。  The through hole is a stepped hole having a first hole portion formed on the one surface side and a second hole portion having a larger diameter than the first hole portion and facing the other surface. The inspection jig according to claim 1, wherein the sealing material is hardened in a state of being introduced into the second hole portion. 前記導電線は外周に絶縁被覆を有することを特徴とする請求項1又は請求項2に記載の検査冶具。  The inspection jig according to claim 1, wherein the conductive wire has an insulating coating on an outer periphery. 前記接触ピンは可撓性及び弾性を備え、前記ヘッド部は、前記接触ピンの先端側を保持する第1保持孔を備えた第1プレートと、前記接触ピンの基端側を前記接続電極に整合するように保持する第2保持孔を備えた第2プレートと、前記第1プレートと前記第2プレートとの間に介挿され、前記接触ピンに撓み余裕をもたらす空間を備えた中間プレートと、を有することを特徴とする請求項1乃至請求項4のいずれか1項に記載の検査冶具。  The contact pin has flexibility and elasticity, and the head portion includes a first plate having a first holding hole for holding a distal end side of the contact pin, and a base end side of the contact pin as the connection electrode. A second plate having a second holding hole for holding it in alignment, and an intermediate plate having a space interposed between the first plate and the second plate to provide a bending margin for the contact pin; The inspection jig according to any one of claims 1 to 4, characterized by comprising: 前記ヘッド部は、前記第1保持孔と前記第2保持孔とが平面方向にシフトしたシフト状態と、前記第1保持孔と前記第2保持孔とが平面的に重なる整合状態とを切換可能に構成されていることを特徴とする請求項4に記載の検査冶具。  The head portion can be switched between a shifted state in which the first holding hole and the second holding hole are shifted in a planar direction and an alignment state in which the first holding hole and the second holding hole overlap in a plane. The inspection jig according to claim 4, wherein the inspection jig is configured as follows. 前記ヘッド部を前記シフト状態に固定する固定手段を有することを特徴とする請求項5に記載の検査冶具。  6. The inspection jig according to claim 5, further comprising fixing means for fixing the head portion in the shifted state. 前記ヘッド部を前記整合状態に規制する規制手段を有することを特徴とする請求項5又は請求項6に記載の検査冶具。  The inspection jig according to claim 5, further comprising a restricting unit that restricts the head portion to the aligned state. 検査対象の電気的特性を検査するために前記検査対象に対する電気的な接触を得るための接触ピンと、該接触ピンを保持するヘッド部と、該ヘッド部に隣接配置され、前記接触ピンに対し直接若しくは間接的に導電接触する接続電極を備えた電極部と、を有する検査冶具の製造方法であって、前記電極部の製造工程では、一方の表面から他方の表面まで貫通する通孔を設けた基材に対して、導電線を前記他方の表面側から前記通孔内に到達するように配置し、次に、前記他方の表面側から前記通孔内に封着材を付着させ硬化させて前記導電線を前記基材に固着させることにより、前記一方の表面上に前記導電線の端面が露出した状態とすることを特徴とする検査冶具の製造方法。  A contact pin for obtaining an electrical contact with the inspection object in order to inspect an electrical property of the inspection object, a head part for holding the contact pin, and a head part disposed adjacent to the head part, and directly with respect to the contact pin Or an inspection jig having a connection electrode that is indirectly conductively contacted, and in the manufacturing process of the electrode part, a through-hole penetrating from one surface to the other surface is provided. A conductive wire is disposed on the substrate so as to reach the through hole from the other surface side, and then a sealing material is attached and cured from the other surface side into the through hole. A method for manufacturing an inspection jig, wherein the conductive wire is fixed to the base material so that an end face of the conductive wire is exposed on the one surface. 前記通孔は、前記一方の表面側に構成された第1孔部と、該第1孔部よりも大径に構成され前記他方の表面に臨む第2孔部とを有する段付き孔であり、前記封着材は、前記第2孔部の内部に導入された状態で硬化されることを特徴とする請求項8に記載の検査冶具の製造方法。  The through hole is a stepped hole having a first hole portion formed on the one surface side and a second hole portion having a larger diameter than the first hole portion and facing the other surface. The method for manufacturing an inspection jig according to claim 8, wherein the sealing material is hardened while being introduced into the second hole. 前記導電線を前記通孔に挿通させる工程と、前記封着材で前記導電線を前記基材に固着した後に、前記導電線における前記一方の表面から突出した部分を除去する工程とを有することを特徴とする請求項8又は請求項9に記載の検査冶具の製造方法。  Inserting the conductive wire through the through-hole, and removing the portion of the conductive wire protruding from the one surface after the conductive wire is fixed to the base material with the sealing material. A method for manufacturing an inspection jig according to claim 8 or 9, wherein: 前記導電線における前記一方の表面から突出した部分を除去する工程では、前記部分を切断する段階と、前記一方の表面を平坦化する段階とを順次有することを特徴とする請求項10に記載の検査冶具の製造方法。  The step of removing a portion protruding from the one surface of the conductive line sequentially includes a step of cutting the portion and a step of flattening the one surface. Inspection jig manufacturing method. 前記導電線は、外周に絶縁被覆を有することを特徴とする請求項8乃至請求項11のいずれか1項に記載の検査冶具の製造方法。  The method of manufacturing an inspection jig according to claim 8, wherein the conductive wire has an insulating coating on an outer periphery. 前記導電線の前記端面上に導電層を被覆して前記接続電極を形成する工程を有することを特徴とする請求項8乃至請求項12のいずれか1項に記載の検査冶具の製造方法。  The method for manufacturing an inspection jig according to claim 8, further comprising a step of covering the end face of the conductive wire with a conductive layer to form the connection electrode. 回路基板に導電接触するように構成された接触ピンと、Contact pins configured to make conductive contact with the circuit board;
該接触ピンをその軸方向に上下動可能かつ挿通可能に保持するヘッド部と、A head portion for holding the contact pin so as to be vertically movable and insertable in the axial direction;
一方の表面から他方の表面まで貫通する通孔を備えた基材と、前記通孔内に挿入された導電線と、前記他方の表面側から前記通孔内に付着され前記導電線を前記基材に固着させる封着材と、前記通孔内から前記一方の表面に露出した前記導電線の端面上に構成され、前記接触ピンに対し直接若しくは間接的に導電接触する接続電極と、を備えると共に、前記ヘッド部に隣接配置される電極部と、を有する検査冶具を用い、A base material provided with a through hole penetrating from one surface to the other surface; a conductive wire inserted into the through hole; and the conductive wire attached to the through hole from the other surface side. A sealing material to be fixed to the material, and a connection electrode that is formed on the end surface of the conductive wire exposed on the one surface from the inside of the through hole, and is in direct or indirect conductive contact with the contact pin. And using an inspection jig having an electrode part disposed adjacent to the head part,
この検査治具の前記接触ピンの一方端を、前記回路基板に対して電気的かつ物理的な接触を得させ、前記接触ピンの他方端を前記電極部に物理的な接触を得させ、前記接触ピンに撓みを生じさせ、その撓みによって生じる弾性力を前記回路基板と前記接触ピンの一方端との間に作用する接触圧とすることで、前記回路基板の電気的特性を検査する検査工程、One end of the contact pin of the inspection jig is made to obtain electrical and physical contact with the circuit board, and the other end of the contact pin is made to make physical contact with the electrode part, An inspection step of inspecting the electrical characteristics of the circuit board by causing the contact pin to bend and using an elastic force generated by the bend as a contact pressure acting between the circuit board and one end of the contact pin. ,
を有することを特徴とする回路基板の製造方法。A method of manufacturing a circuit board, comprising:
JP2002022873A 2002-01-31 2002-01-31 Inspection jig, manufacturing method thereof, and circuit board manufacturing method Expired - Fee Related JP3690796B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002022873A JP3690796B2 (en) 2002-01-31 2002-01-31 Inspection jig, manufacturing method thereof, and circuit board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002022873A JP3690796B2 (en) 2002-01-31 2002-01-31 Inspection jig, manufacturing method thereof, and circuit board manufacturing method

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2004333576A Division JP3690801B2 (en) 2004-11-17 2004-11-17 Contact pin
JP2004333572A Division JP3690800B2 (en) 2004-11-17 2004-11-17 Inspection jig

Publications (3)

Publication Number Publication Date
JP2003222637A JP2003222637A (en) 2003-08-08
JP2003222637A5 true JP2003222637A5 (en) 2005-07-14
JP3690796B2 JP3690796B2 (en) 2005-08-31

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035856A1 (en) * 2004-09-30 2006-04-06 Jsr Corporation Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus
JP3849948B1 (en) * 2005-11-16 2006-11-22 日本電産リード株式会社 Substrate inspection jig and inspection probe
JP2008058215A (en) * 2006-09-01 2008-03-13 Nidec-Read Corp Manufacturing method of contact fixture, and contact fixture
WO2008081704A1 (en) * 2006-12-28 2008-07-10 Nhk Spring Co., Ltd. Method for fixing probe unit wiring, and probe unit
JP5386769B2 (en) * 2008-09-29 2014-01-15 日本電産リード株式会社 Inspection jig
JP2012078297A (en) * 2010-10-05 2012-04-19 Tokuso Riken:Kk Jig for wire probe, and inspection device and inspection method using the same
KR101317634B1 (en) * 2012-03-28 2013-10-10 주식회사 브리지 MVP Probe Board Manufacturing Method For Semiconductor Test
KR20140020627A (en) * 2012-08-10 2014-02-19 삼성전기주식회사 Method of manufacturing for electric inspection jig
KR101496081B1 (en) * 2014-01-06 2015-03-02 양희성 Method of manufacturing micro contact array structure for interposer and semiconductor device test

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