JP2003222637A5 - - Google Patents
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- Publication number
- JP2003222637A5 JP2003222637A5 JP2002022873A JP2002022873A JP2003222637A5 JP 2003222637 A5 JP2003222637 A5 JP 2003222637A5 JP 2002022873 A JP2002022873 A JP 2002022873A JP 2002022873 A JP2002022873 A JP 2002022873A JP 2003222637 A5 JP2003222637 A5 JP 2003222637A5
- Authority
- JP
- Japan
- Prior art keywords
- hole
- inspection jig
- conductive wire
- contact pin
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (14)
該接触ピンをその軸方向に上下動可能かつ挿通可能に保持するヘッド部と、A head portion for holding the contact pin so as to be vertically movable and insertable in the axial direction;
一方の表面から他方の表面まで貫通する通孔を備えた基材と、前記通孔内に挿入された導電線と、前記他方の表面側から前記通孔内に付着され前記導電線を前記基材に固着させる封着材と、前記通孔内から前記一方の表面に露出した前記導電線の端面上に構成され、前記接触ピンに対し直接若しくは間接的に導電接触する接続電極と、を備えると共に、前記ヘッド部に隣接配置される電極部と、を有する検査冶具を用い、A base material provided with a through hole penetrating from one surface to the other surface; a conductive wire inserted into the through hole; and the conductive wire attached to the through hole from the other surface side. A sealing material to be fixed to the material, and a connection electrode that is formed on the end surface of the conductive wire exposed on the one surface from the inside of the through hole, and is in direct or indirect conductive contact with the contact pin. And using an inspection jig having an electrode part disposed adjacent to the head part,
この検査治具の前記接触ピンの一方端を、前記回路基板に対して電気的かつ物理的な接触を得させ、前記接触ピンの他方端を前記電極部に物理的な接触を得させ、前記接触ピンに撓みを生じさせ、その撓みによって生じる弾性力を前記回路基板と前記接触ピンの一方端との間に作用する接触圧とすることで、前記回路基板の電気的特性を検査する検査工程、One end of the contact pin of the inspection jig is made to obtain electrical and physical contact with the circuit board, and the other end of the contact pin is made to make physical contact with the electrode part, An inspection step of inspecting the electrical characteristics of the circuit board by causing the contact pin to bend and using an elastic force generated by the bend as a contact pressure acting between the circuit board and one end of the contact pin. ,
を有することを特徴とする回路基板の製造方法。A method of manufacturing a circuit board, comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002022873A JP3690796B2 (en) | 2002-01-31 | 2002-01-31 | Inspection jig, manufacturing method thereof, and circuit board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002022873A JP3690796B2 (en) | 2002-01-31 | 2002-01-31 | Inspection jig, manufacturing method thereof, and circuit board manufacturing method |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004333576A Division JP3690801B2 (en) | 2004-11-17 | 2004-11-17 | Contact pin |
JP2004333572A Division JP3690800B2 (en) | 2004-11-17 | 2004-11-17 | Inspection jig |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003222637A JP2003222637A (en) | 2003-08-08 |
JP2003222637A5 true JP2003222637A5 (en) | 2005-07-14 |
JP3690796B2 JP3690796B2 (en) | 2005-08-31 |
Family
ID=27745759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002022873A Expired - Fee Related JP3690796B2 (en) | 2002-01-31 | 2002-01-31 | Inspection jig, manufacturing method thereof, and circuit board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3690796B2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006035856A1 (en) * | 2004-09-30 | 2006-04-06 | Jsr Corporation | Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus |
JP3849948B1 (en) * | 2005-11-16 | 2006-11-22 | 日本電産リード株式会社 | Substrate inspection jig and inspection probe |
JP2008058215A (en) * | 2006-09-01 | 2008-03-13 | Nidec-Read Corp | Manufacturing method of contact fixture, and contact fixture |
WO2008081704A1 (en) * | 2006-12-28 | 2008-07-10 | Nhk Spring Co., Ltd. | Method for fixing probe unit wiring, and probe unit |
JP5386769B2 (en) * | 2008-09-29 | 2014-01-15 | 日本電産リード株式会社 | Inspection jig |
JP2012078297A (en) * | 2010-10-05 | 2012-04-19 | Tokuso Riken:Kk | Jig for wire probe, and inspection device and inspection method using the same |
KR101317634B1 (en) * | 2012-03-28 | 2013-10-10 | 주식회사 브리지 | MVP Probe Board Manufacturing Method For Semiconductor Test |
KR20140020627A (en) * | 2012-08-10 | 2014-02-19 | 삼성전기주식회사 | Method of manufacturing for electric inspection jig |
KR101496081B1 (en) * | 2014-01-06 | 2015-03-02 | 양희성 | Method of manufacturing micro contact array structure for interposer and semiconductor device test |
-
2002
- 2002-01-31 JP JP2002022873A patent/JP3690796B2/en not_active Expired - Fee Related
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