JP2003221557A - Adhesive composition, adhesive composition for connecting circuit and method for connecting circuit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an adhesive composition which exhibits high bond strength to a substrate constituted of a metal and an inorganic material, has excellent storage stability at a room temperature (20-30°C) and sufficient performances even after a reliability test, an adhesive composition for connecting a circuit and to provide a method for connecting a circuit. <P>SOLUTION: This adhesive composition comprises (a) a radically polymerizable compound, (b) a radical generator and (c) a chain transfer agent. The chain transfer agent (c) is preferably a mercapto compound of alcohol. In this method for connecting a circuit in which an adhesive composition is laid between substrates having mutually opposing circuit electrodes, the substrates having the mutually opposing circuit electrodes are pressurized and the electrodes in the pressure direction are electrically connected, the adhesive composition for connecting a circuit is obtained by using this adhesive composition. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an adhesive composition, an adhesive composition for circuit connection, and a circuit connection method.

[0002]

2. Description of the Related Art In semiconductor elements and liquid crystal display elements,
Conventionally, various adhesives have been used for the purpose of bonding various members in the device. The adhesives are required to have various properties such as adhesiveness, heat resistance, and reliability under high temperature and high humidity conditions. The adherends used for adhesion include printed wiring boards, organic base materials such as polyimide, copper, aluminum and other metals, ITO,
Substrates having various surface states such as SiN and SiO ₂ are used, and it is necessary to design a molecule according to each adherend. Conventionally, a thermosetting resin using an epoxy resin having high adhesiveness and high reliability has been used as an adhesive for the semiconductor element and the liquid crystal display element. As a constituent component of the resin, an epoxy resin, a curing agent such as a phenol resin having reactivity with the epoxy resin, and a thermal latent catalyst that accelerates the reaction between the epoxy resin and the curing agent are generally used. The thermal latent catalyst is an important factor that determines the curing temperature and the curing rate, and various compounds are used from the viewpoint of the storage stability at room temperature and the curing rate during heating, and generally, The desired adhesion was obtained by curing for 1 to 3 hours at a temperature of 170 to 250 ° C. However,
With the recent trend toward higher integration of semiconductor elements and higher definition of liquid crystal elements, the pitch between elements and wiring has become narrower, and heating during curing may adversely affect peripheral members.
In order to further reduce costs, it is necessary to improve throughput, low temperature (100-170 ℃), short time (1
Within a time), in other words, low temperature and fast curing adhesion is required. To achieve this low temperature fast cure, it is necessary to use a thermal latent catalyst with low activation energy,
It is known that it is extremely difficult to combine storage stability near room temperature. Recently, radical curable adhesives using a combination of a (meth) acrylate derivative and a peroxide which is a radical initiator have been attracting attention. In radical curing, radicals, which are reactive species, are extremely reactive and can be cured for a short time.Because they remain stable below the decomposition temperature of the radical initiator, low-temperature rapid curing and around room temperature are possible. It is possible to design a curing system that is compatible with storage stability at room temperature.

[0003]

However, it has been found that the radical-curing type adhesive has inferior adhesive strength as compared with the case where an epoxy resin is used, because the curing shrinkage during curing is large, In particular, it has been found that the adhesive strength to a substrate of an inorganic material or a metal material is reduced. Therefore, when it is used as an adhesive for semiconductor elements or liquid crystal display elements, sufficient performance (adhesive strength, etc.) may not be obtained in a reliability test of leaving it under high temperature and high humidity conditions such as 85 ° C./85% RH. I know it.

Although the present invention is a radical curing system,
Adhesive composition and circuit showing high adhesive strength to a base material composed of metal and inorganic material, excellent storage stability at room temperature (20 to 30 ° C.), and having sufficient performance even after reliability test An adhesive composition for connection and a method for connecting a circuit are provided.

[0005]

The adhesive composition of the present invention is characterized by containing [1] (a) a radically polymerizable compound, (b) a radical generator, and (c) a chain transfer agent. It is an adhesive composition. The present invention also relates to [2] (b).
The radical generator is a curing agent that generates radicals by irradiation with light having a wavelength of 150 to 750 nm, heating at 80 ° C. to 200 ° C., or combined use of light irradiation and heat [1].
The adhesive composition described in 1. The present invention also provides [3]
(C) The adhesive composition according to the above [1] or [2], wherein the chain transfer agent has a chain transfer constant of 0.001 to 30 for a styrene monomer at 99 ° C.
The present invention also provides the adhesive composition according to any one of the above [1] to [3], wherein the [4] (c) chain transfer agent is at least one compound selected from mercapto compounds and alcohols. Is. Further, the present invention is
[5] (b) 0.5 to 30 parts by weight of radical generator, (c) to 100 parts by weight of radically polymerizable compound (a)
The adhesive composition according to any one of the above [1] to [4], which comprises 0.05 to 20 parts by weight of a chain transfer agent. Further, the present invention provides [6] adhesive composition 100.
The adhesive composition according to any one of the above [1] to [5], further containing 0.1 to 30% by volume of conductive particles with respect to the volume. Furthermore, in the present invention, [7] an adhesive composition is interposed between substrates having circuit electrodes facing each other,
In the circuit connection in which the substrates having the circuit electrodes facing each other are pressed to electrically connect the electrodes in the pressing direction, the adhesive composition comprises the adhesive according to any one of the above [1] to [6]. It is an adhesive composition for circuit connection which is an agent composition.
[8] The circuit composition adhesive composition according to the above [7] is interposed between substrates having circuit electrodes facing each other [8], and the substrates having circuit electrodes facing each other are pressurized. This is a circuit connection method for electrically connecting the electrodes in the pressing direction.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION As the radically polymerizable compound (a) in the present invention, known compounds can be used without particular limitation as long as they are compounds having a functional group capable of being polymerized by an active radical. Examples of such a functional group include an acryloyl group, a methacryloyl group, an allyl group, a maleimide group, a vinyl group and the like in the molecule, but an acryloyl group and a methacryloyl group are included because of ease of selection.
(Hereinafter, both are collectively referred to as (meth) acryloyl) is preferably a resin having one or more in the molecule, and further, a resin having two or more (meth) acryloyl groups in the molecule,
It is more preferable because a high cured density can be obtained by curing.

Specifically, oligomers such as epoxy (meth) acrylate oligomer, urethane (meth) acrylate oligomer, polyether (meth) acrylate oligomer, polyester (meth) acrylate oligomer, trimethylolpropane tri (meth) acrylate, polyethylene. Glycol di (meth) acrylate,
Polyalkylene glycol di (meth) acrylate, pentaerythritol (meth) acrylate, 2-cyanoethyl (meth) acrylate, cyclohexyl (meth)
Acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate,
2-ethylhexyl (meth) acrylate, n-hexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, isobornyl (meth) acrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, n-lauryl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (meth) ) Acrylate, isocyanuric acid modified bifunctional (meth)
Monofunctional and polyfunctional (meth) acrylate compounds such as acrylate, isocyanuric acid-modified trifunctional (meth) acrylate, 2- (meth) acryloyloxyethyl phosphate, and 2,2′-di (meth) acryloyloxydiethyl phosphate are available. Can be mentioned. These compounds may be used alone or as a mixture, if necessary.

(B) 150-75 used in the present invention
Radical generators (curing agents) that generate radicals by 0 nm light irradiation, heating at 80 to 200 ° C., or light irradiation and heating in combination include α-acetaminophenone derivatives, peroxides, azo compounds, and the like. Any known material can be used without particular limitation. As these compounds, peroxides are more preferable from the viewpoint of ease of designing the curing temperature. As the usable peroxide, it is easy to refer to the one-minute half-life temperature which indicates the scale of peroxide decomposition, and the one-minute half-life temperature is preferably 40 ° C. or higher and 200 ° C. or lower, and among them, 1 Half-life temperature of 60 minutes
More preferably, it is 170 ° C. or lower. Specific examples include diacyl peroxide derivatives, peroxydicarbonate derivatives, peroxyester derivatives, peroxyketal derivatives, dialkyl peroxide derivatives, and hydroperoxide derivatives.

As the diacyl peroxide derivative,
2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, benzoylperoxytoluene, benzoyl peroxide, etc. To be

Examples of peroxydicarbonate derivatives include di-n-propylperoxydicarbonate, diisopropylperoxydicarbonate and bis (4-t-
Butylcyclohexyl) peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, di (2-ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate, di (3-methyl-3-methoxybutylperoxy) Dicarbonate etc. are mentioned.

As the peroxy ester derivative, 1,1,
3,3-Tetramethylbutylperoxyneodecanoate, 1-Cyclohexyl-1-methylethylperoxynoedecanoate, t-hexylperoxyneodecanoate, t-butylperoxypivalate, 1,1 , 3,3-
Tetramethylbutylperoxy-2-ethylhexanonate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, 2,5-dimethyl-2,5-bis (2-benzoyl) Peroxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanonate, t-hexylperoxy-2-ethylhexanonate, t-butylperoxyisobutyrate, 1,1
-Bis (t-butylperoxy) cyclohexane, t-hexylperoxyisopropyl monocarbonate, t-
Butyl peroxy-3,5,5-trimethyl hexanonate, t-butyl peroxy laurate, 2,5-dimethyl-
2,5-di (m-toluoylperoxy) hexane, t-
Butyl peroxyisopropyl monocarbonate, t-
Butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxy benzoate, t-butyl peroxy acetate, etc. are mentioned.

As the peroxyketal derivative, 1,1
-Bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy)
-3,3,5-Trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (4,4-di-
t-Butylperoxycyclohexyl) propane, 2,2-
Examples thereof include bis (t-butylperoxy) decane.

As the dialkyl peroxide derivative, α, α'bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butyloxy) hexane, t- Butyl cumyl peroxide and the like can be mentioned.

As the hydroperoxide derivative,
Examples include diisopropylbenzene hydroperoxide and cumene hydroperoxide. These compounds may be used alone or in combination of two or more kinds.

(B) The amount of the radical generator compounded is (a)
0.5 to 30 with respect to 100 parts of the radically polymerizable compound
Parts by weight, preferably 1 to 20 parts by weight. If the addition amount is less than 0.5 parts by weight, insufficient curing may occur, and if it is 30 parts by weight or more, leaving stability (storage stability) may decrease.

As the chain transfer agent (c) in the present invention, known compounds can be used without particular limitation, and the chain transfer constant at 99 ° C. with respect to the styrene monomer is 0.00.
Compounds which are 1 to 30 are particularly preferred. Examples of such compounds include mercapto compounds and alcohols, and among them, mercapto compounds are more preferable. As the mercapto compound, dithiodiacetic acid, dithiodiacetic acid methyl ester, mercaptoacetic acid, mercaptoacetic acid methyl ester, thioacetic acid, α, α′-dithiobis-p
-Methylanisole, allylbenzenethiol sulfonate, benzenethiol, o- (or p-) ethoxybenzenethiol, 2-benzimidazole thiol, 2,2 '
-Dithiodibenzoic acid dimethyl ester, o-mercaptobenzoic acid, o-mercaptobenzoic acid methyl ester, thiobenzoic acid, 2,2'-dithiobisbenzothiazole, 2,2 '
-Thiobisbenzothiazole, 2-benzothiazolethiol, benzoyl disulfide, benzyl disulfide, butanethiol, bis (dimethylthiocarbonyl)
Disulfide, dodecanethiol, o, o'-dithiobisthioformate diisopropyl ester, heptanethiol, hexanethiol, naphthalenemethanethiol, mercaptobenzoxazole, naphthalenethiol, octadecanethiol, octanethiol, 2,2'-dithiodiphenetol, 4, 4'-dithiodiphenetol, 2-methyl-2
-Propanethiol, toluenethiol, thiobisbenzenethiol, p-methoxy-toluenethiol and the like.

Alcohols include allyl alcohol, 1,4-butanediol, butyl alcohol, ethyl alcohol, ethylene glycol, isobutyl alcohol, isopropyl alcohol, methanol, 1,2-propanediol, propyl alcohol, 2-propyne-1. −
All can be given. These compounds may be used alone or as a mixture of two or more kinds.

The amount of the chain transfer agent (c) added in the present invention is preferably 0.05 to 20 parts by weight, and is 0.1 to 100 parts by weight of the radically polymerizable compound (a).
It is particularly preferable to use 10 to 10 parts by weight. Addition amount is 0.
If it is less than 05 parts by weight, it is difficult to obtain high adhesive strength, and if it is 20 parts by weight or more, excessive chain transfer may occur, resulting in low crosslink density.

The conductive particles used in the present invention include Au,
Examples thereof include metal particles such as Ag, Ni, Cu, and solder, carbon, and the like. Alternatively, a non-conductive glass, ceramic, plastic or the like may be used as a core, and the core may be coated with the metal, metal particles or carbon. When the conductive particles have a core of plastic and the core is coated with the above metal, metal particles or carbon, or heat-melted metal particles, they are deformable by heating and pressurization, so the height variations of the circuit electrodes are absorbed during connection. Or the contact area with the electrode is increased and the reliability is improved, which is preferable. In addition, the surface of these conductive particles,
Further, fine particles coated with a polymer resin or the like can suppress short-circuiting due to contact between particles when the blending amount of conductive particles is increased, and can improve the insulating property between electrode circuits. You may mix and use with.

The average particle size of the conductive particles is preferably 1 to 18 μm from the viewpoint of dispersibility and conductivity. The amount of the conductive particles used is not particularly limited, but is preferably 0.1 to 30% by volume, and more preferably 0.1 to 10% by volume with respect to 100% by volume of the total amount of the adhesive composition. . If this value is less than 0.1% by volume, the conductivity tends to be poor, and if it exceeds 30% by volume, a circuit short circuit tends to occur. The volume% is determined based on the volume of each component before curing at 23 ° C., but the volume of each component can be converted from the weight to the volume by utilizing the specific gravity. Also, add the appropriate solvent (water, alcohol, etc.) that does not dissolve or swell the component into the graduated cylinder, but wet the component well, and add the increased volume as the volume. You can also ask.

The adhesive composition of the present invention may be appropriately added with additives such as an adhesion improver such as a coupling agent, a leveling agent, a colorant, an antioxidant, an ultraviolet absorber, a lubricant and a filler. Good.

Various polymers may be appropriately added to the adhesive composition of the present invention for the purpose of thickening or forming a film. The polymer used is not particularly limited, but it is essential that it does not adversely affect the (a) radically polymerizable compound, the (b) radical generator, the (c) chain transfer agent, and the conductive particles. Examples of such polymers include polyimide, polyamide, phenoxy resins, polymethacrylates, polyacrylates, polyimides, polyurethanes, polyesters, polyvinyl butyral, SBS and epoxy modified products thereof, and SEBS and modified products thereof. Can be used. These may be used alone or in combination of two or more. Furthermore, these polymers may contain a siloxane bond or a fluorine substituent. These are completely compatible with each other,
Alternatively, it can be preferably used as an adhesive composition in the state where microphase separation occurs and it becomes cloudy. The larger the molecular weight of the polymer, the easier it is to obtain a film-forming property, and the melt viscosity that affects the fluidity as an adhesive can be set in a wide range. The molecular weight is not particularly limited, but a general weight average molecular weight is 5,000-
150,000 is preferable and 10,000 to 80,000
0 is particularly preferred. If this value is less than 5,000, the film formability tends to be poor, and if it exceeds 150,000, the compatibility with other components tends to be poor. The amount used is preferably 20 to 320 parts by weight with respect to 100 parts by weight of the radically polymerizable compound. If the amount used is less than 20 parts by weight or more than 320 parts by weight,
Flowability and adhesiveness tend to decrease.

The adhesive composition of the present invention can be used in a paste form when it is liquid at room temperature. When it is solid at room temperature, it may be used by heating, or may be made into a paste by using a solvent. The solvent that can be used is not particularly limited as long as it has no reactivity with the adhesive composition and the additive and exhibits sufficient solubility, but the boiling point at normal pressure is 50 to 150 ° C. Those are preferable. Boiling point is 5
If the temperature is 0 ° C. or lower, there is a risk of volatilization when left at room temperature, which limits use in an open system. Also, the boiling point is 150
If the temperature is higher than ℃, it is difficult to volatilize the solvent, which may adversely affect the reliability after adhesion.

The adhesive composition of the present invention can also be used in the form of a film. A solution obtained by adding a solvent or the like to the adhesive composition as necessary is applied on a releasable substrate such as a fluororesin film, a polyethylene terephthalate film, a release paper, or a substrate such as a non-woven fabric is impregnated with the solution. It can be used as a film by removing the solvent and the like by placing it on a peelable substrate. When used in the form of a film, it is even more convenient in terms of handleability.

The adhesive composition of the present invention can be adhered by light irradiation, heating, or simultaneous use of heat and pressure simultaneously with light irradiation. By using these in combination, it becomes possible to bond at a lower temperature and in a shorter time. Light irradiation is 150-75
Irradiation light in the wavelength range of 0 nm is preferable, and low-pressure mercury lamp, medium-pressure mercury lamp, high-pressure mercury lamp, ultra-high-pressure mercury lamp, xenon lamp,
0.1 to 10 J / cm ² using a metal halide lamp
It can be cured at an irradiation dose of. The heating temperature is not particularly limited, but a temperature of 80 to 200 ° C. is preferable. The pressure is not particularly limited as long as it does not damage the adherend, but is generally preferably 0.1 to 10 MPa. It is preferable that these heating and pressurization be performed within a range of 0.5 seconds to 3 hours.

The adhesive composition of the present invention can be used as an adhesive for different kinds of adherends having different thermal expansion coefficients. Specifically, use as an anisotropic conductive adhesive, a silver paste, a circuit connecting material typified by silver film, an elastomer for CSP, an underfill material for CSP, a semiconductor element adhesive material typified by LOC tape, etc. You can

An example of the connection between the anisotropic conductive film produced by using the adhesive composition of the present invention and the conductive particles and the electrode will be described below. The anisotropic conductive film is provided between the electrodes on the substrate facing each other, and is heated and pressed to obtain contact between both electrodes and adhesion between the substrates so that the electrodes can be connected. As the substrate for forming the electrodes, semiconductors, inorganic substances such as glass and ceramics, organic substances such as polyimide and polycarbonate, and combinations of these compounds such as glass / epoxy can be applied.

[0028]

EXAMPLES The present invention will be specifically described below based on examples, but the present invention is not limited thereto.

Examples 1 to 3 and Comparative Example 1 Phenoxy resin (manufactured by Union Carbide Co., trade name PKHC,
50 g of average molecular weight of 45,000, in weight ratio, toluene (boiling point 110.6 ° C) / ethyl acetate (boiling point 77.1 ° C)
It was dissolved in a mixed solvent of 50/50 to obtain a solution having a solid content of 40%. Hydroxyethyl glycol dimethacrylate (Kyoeisha Chemical Co., Ltd., trade name 80MFA) and phosphoric acid ester dimethacrylate (Kyoeisha Chemical Co., Ltd., trade name Light Ester P-2M) were used as the radically polymerizable compounds. As a chain transfer agent, mercaptobenzothiazole (manufactured by Tokyo Chemical Industry Co., Ltd.), mercaptobenzoxazole (manufactured by Tokyo Chemical Industry Co., Ltd.)
And thiobisbenzenethiol (manufactured by Tokyo Chemical Industry Co., Ltd.) were used. As a radical generator, 1,1-bis (t-
Hexylperoxy) -3,3,5-trimethylcyclohexane (Nippon Yushi Co., Ltd., trade name Perhexa TMH)
Was used. A 0.2 μm thick nickel layer was provided on the surface of polystyrene-based particles, and a 0.04 μm thick gold layer was provided outside the nickel layer to prepare conductive particles having an average particle size of 5 μm. Blended as shown in Table 1 in solid weight ratio, further blended and dispersed 1.5% by volume of conductive particles, applied to a fluororesin film having a thickness of 80 μm using a coating device, and dried at 70 ° C. for 10 minutes with hot air. Thus, a film-like adhesive having an adhesive layer thickness of 20 μm was obtained. The obtained film adhesive showed sufficient flexibility at room temperature (25 ° C.), and even when left at 40 ° C. for 10 hours, there was almost no change in the properties of the film and good storage stability was exhibited. .

[0030]

[Table 1]

[Measurement of Adhesive Strength and Connection Resistance] Using the film-like adhesive obtained by the above-mentioned manufacturing method, the line width was 50 μm.
m, pitch 100 μm, thickness 18 μm copper circuit 500
Flexible circuit board (FPC) with a book, 0.2 μm
Glass (thickness 1.1 mm, surface resistance 20 Ω / □) on which a thin layer of indium oxide (ITO) was formed using a thermocompression bonding apparatus (heating method: constant heat type, manufactured by Toray Engineering Co., Ltd.) 1 at 3 MPa
Heating and pressurization was performed for 5 seconds to connect over a width of 2 mm to prepare a connected body. The resistance value between the adjacent circuits of this connection body is measured with a multimeter, and the resistance value is 150
The average of points is shown.

Further, the adhesive strength of this connector is determined by JIS-Z.
According to 0237, it was measured by the 90 degree peeling method and evaluated. Here, the measuring device of the adhesive strength is Tensilon UTM-4 (Peeling speed 50 mm / mi manufactured by Toyo Baldwin Co., Ltd.
n, 25 ° C.) was used.

[Measurement of Curing Rate]
After heating and curing at 150 ° C. for 10 seconds, the calorific value was measured using DSC (differential scanning calorimetry), and the curing rate was calculated using this. The method of calculating the curing rate is shown below. Curing rate (%) = (Q ₀ −Q) / Q ₀ Here, Q _{0 is} the calorific value before curing, and Q is the calorific value after curing. Table 2 shows the results of the measurement of the adhesive strength, the connection resistance, and the curing rate of the connected body performed as described above.

[0034]

[Table 2]

The adhesive composition (adhesive composition for circuit connection) obtained in Example 1 has good connection resistance and adhesive strength (adhesion) immediately after bonding even at 160 ° C. for 15 seconds at a low temperature. Strength). On the other hand, in Comparative Example 1 in which the chain transfer agent in the present invention was not used, the connection resistance showed a good value, but the adhesive strength showed a low value, and the connection reliability was poor and a satisfactory connection product could not be obtained. It was Further, the reaction rate is low, and it is necessary to heat for a longer period of time or to connect at a higher temperature in order to cure as in Examples.

Example 4 The film adhesive obtained in Example 1 was allowed to stand at 40 ° C. for 5 days, after which it was subjected to FPC and IT.
When thermocompression bonding with O was performed in the same manner as in the above method, the connection resistance immediately after adhesion was 2.3Ω, and the adhesive strength was 1050 N / m, showing the same good values as before being left and having excellent leaving stability. It was

[0037]

According to the present invention, it is possible to provide an adhesive composition capable of being cured at a low temperature for a short time and excellent in storage stability, and an adhesive composition for circuit connection.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masami Yusa             48 Wadai, Tsukuba, Ibaraki Prefecture Hitachi Chemical Co., Ltd.             Company Research Institute F-term (reference) 4J040 FA131 FA261 FA271 FA281                       FA291 HB07 HB41 HD02                       JB07                 5F044 KK01 LL09 LL11

Claims (8)

[Claims] 1. An adhesive composition containing (a) a radically polymerizable compound, (b) a radical generator, and (c) a chain transfer agent. 2. The (b) radical generator is 150 to 75.
The adhesive composition according to claim 1, which is a curing agent that generates radicals by irradiation with 0 nm light, heating at 80 ° C to 200 ° C, or combined use of light irradiation and heat. 3. The chain transfer agent (c) has a chain transfer constant of 0.001 to 30 with respect to a styrene monomer at 99 ° C.
The adhesive composition according to claim 1 or 2, which is 4. The adhesive composition according to any one of claims 1 to 3, wherein the chain transfer agent (c) is at least one compound selected from mercapto compounds and alcohols. 5. Based on 100 parts by weight of the radically polymerizable compound (a), 0.5 to 30 parts by weight of the radical generator (b) and 0.05 to 20 parts by weight of the chain transfer agent (c) are contained. The adhesive composition according to any one of claims 1 to 4. 6. The adhesive composition according to claim 1, further comprising 0.1 to 30% by volume of conductive particles with respect to 100 volumes of the adhesive composition. 7. A circuit connection in which an adhesive composition is interposed between substrates having circuit electrodes facing each other, and the substrates having circuit electrodes facing each other are pressed to electrically connect the electrodes in the pressing direction. An adhesive composition for circuit connection, wherein the adhesive composition is the adhesive composition according to any one of claims 1 to 6. 8. A substrate having circuit electrodes facing each other,
Interposing the adhesive composition for circuit connection according to claim 7,
A circuit connecting method in which a substrate having circuit electrodes facing each other is pressed to electrically connect electrodes in a pressing direction.