JP2003213497A - Electronic part and plating tool and plating method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating tool for electronic parts which can plate a multiplicity of the electronic parts at a time by improving current efficiency in a shorter time without the occurrence of deformation and damage and without the occurrence of plating trouble, such as nonuniform plating film thicknesses and a plating method. <P>SOLUTION: The plating method by contact energization with an electrode in an electrolyte cell comprises using a casing of a resin system as a casing to form the negative electrode, installing a magnet into the easing, installing the negative electrode formed of a conductive material to one surface of the casing which surface comes into contact with the electronic parts, bringing the electronic parts into contact at all times with the plating tool having an aligning tool of a resin material type used to align the electronic parts and immersing the electronic parts into the electrolyte cell, then energizing the electronic parts to plate the electronic parts. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a plating jig and a plating method for electronic parts.

[0002]

2. Description of the Related Art As a conventional plating jig for electronic parts,
In some cases, a large number of substantially elliptical through holes are formed in alignment (see, for example, Patent Document 1).

In FIG. 9, copper foil layers 104a, 104 are formed on the upper and lower surfaces of the plating jig 101 at the periphery of the through holes 102.
b is formed, and the through hole 102 is formed so as to connect between them.
A through-hole copper plating layer 103 is formed on the inner wall of the. Due to the nature of through-hole plating, the through-hole copper plating layer 103 is formed not only on the inner wall of the through hole 102 but also on the surface of the plating jig 101 so as to cover the copper foil layers 104a and 104b. is doing. Figure 9
As shown in (b), on the lower surface of the plating jig 101, there are energized regions 105 with external electrodes (not shown) at several places (only two places are shown), and the energized regions 105 and the through holes 102.
A pattern of a copper foil layer 104b for connecting to the peripheral through-hole copper plating layer 103 is formed. The through hole 102 is formed to be slightly larger than the length between the two leads A2, A2 of the airtight terminal A and slightly smaller than the base A1 of the airtight terminal A, and the base A1 is caught on the upper surface of the plating jig 101. keeping. At this time, the plating jig 101
The through-hole copper plating layer 103 on the upper surface serves as an energizing electrode to the base A1, and the through-hole copper plating layer 103 on the inner wall of the through hole 102 serves as an energizing electrode to the lead A2.

Next, a conventional plating method is shown in FIG. The plating jig 101 in which a large number of airtight terminals A are aligned and held is
The airtight terminal A is fixed by the plating jig holder 106 so as not to drop, and is detachably attached to the side surface of the drum 107. On the side surface of the drum 107, a plurality of (two in the figure) external electrode rods 108 are provided so as to project.
It is applied to a current-carrying region (not shown) formed on the lower surface. The drum 107 is immersed in the plating bath 109, and a negative voltage is applied to the electrode rod 108 and a positive voltage is applied to the electrode plates 110 provided on both sides of the drum 107. When the drum 107 rotates in the plating bath 109, the leads come into contact with the through-hole copper plating layer 103 on the inner wall of the through-hole due to gravity, and plating is performed.

[0005]

[Patent Document 1] Japanese Unexamined Patent Publication No. 10-130894

[0006]

In such a plating method, the contact between all electronic components and the electrodes may still be insufficient, which may cause unevenness on the surface of the plating film or uneven plating film thickness. In addition, there is a problem that current efficiency is poor and it is difficult to shorten the plating time.

In order to solve all of these problems, the present invention can prevent the occurrence of uneven plating on the surface of electronic parts, make the plating thickness uniform, and improve the current efficiency to shorten the plating time. An object is to provide a plating jig and a plating method.

[0008]

In order to solve the above-mentioned conventional problems, a negative electrode having a magnet attached thereto and an alignment plate having an array hole or groove detachably attached to at least one surface of the negative electrode. Since it is a plating jig for electronic components, it has an effect that the end faces of the lead wires of the electronic components are brought into contact with each other and the electronic components are vertically aligned, so that a stable current can be applied to the electronic components.

Further, since it is a plating jig for electronic parts in which a magnet is embedded and sealed inside the electrode plate, it has an effect of preventing deterioration of the magnet.

Further, the electronic parts are inserted into the arrangement holes or grooves provided in the alignment plate of the plating jig, and then the alignment plate is placed on the electrode plate, and the end faces of the lead wires of the electronic parts are set to the above-mentioned positions. The electronic parts are placed upright in contact with the electrode plate, and then the plating jig is installed in the plating jig holder formed in the plating solution tank to hold each plating jig, Since it is a method of plating an electronic component in which the plating is performed by rotating the rotary rod formed in the plating jig holder in the coaxial direction, it is possible to hold one or more plating jigs in the plating jig holder. It is also possible to plate many electronic components at one time.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1A is a sectional view showing, for example, an airtight terminal for a laser diode as an electronic component of this embodiment, and FIG. 1B is an enlarged view of a portion A of FIG. 1A.

(Embodiment 1) In FIG. 1A, 1 is a base formed by molding a plate material of iron, iron-nickel alloy or the like, 2 is a ground lead made of iron, iron-nickel alloy or the like, and 3 is Insulator made of glass or epoxy resin, 4 is an insulating lead made of iron, iron-nickel alloy, or the like, 5 is a second metal coating layer made of a plated layer of copper, nickel, or the like,
Reference numeral 6 is a first metal coating layer made of a plated layer of gold, palladium or the like. The detailed configuration will be described below. Through holes 7 are formed in the base 1 when forming a mold. A second metal coating layer 5 is formed on the base 1, the ground lead 2 and the insulating lead 4. The insulating lead 4 is inserted into the through hole 7 in the base 1 and sealed by the insulator 3 and the ground lead 2 is conductively connected to one side in a state substantially parallel to the insulating lead 4 by resistance welding, a metal brazing material or the like. Has been done. Further, the insulating lead 4 has a first metal coating layer 6 formed thereon. According to this, the first metal coating layer 6 is applied only to the insulating lead 4 which is electrically connected to the semiconductor element (not shown) through the conductive wire (not shown). The cost of the coating layer 6 can be suppressed.

FIG. 2 is a perspective view showing an outline of a plating jig for the airtight terminal for laser diode of this embodiment.
Is a sectional view.

(Embodiment 2) In FIGS. 2 and 3, a magnet 11 is embedded and sealed in a negative electrode plate 10 by a member having excellent corrosion resistance, and a negative electrode 9 is mounted. Furthermore, a pin 13 for fitting the negative electrode 9 and the alignment plate 12 is formed. Next, the alignment plate 12 is the airtight terminal 1 for the laser diode.
Through holes or slits 15 are provided so that 4 are aligned at regular intervals, a hole 16 for fitting with the negative electrode plate 10 is formed, and the aligning plate 12 in which a large number of laser diode airtight terminals 14 are vertically arranged is provided. It is attached to the electrode plate 10. Further, the alignment plate 12 does not come into contact with the laser diode airtight terminal 14 after fitting with the negative electrode plate 10. Further, at this time, the negative electrode 9 is installed so as to cover the upper surface of the negative electrode 9 except for through holes or slits 15 formed so as to be aligned at regular intervals, and plays a role of masking for suppressing plating deposition on the negative electrode 9.

(Embodiment 3) In FIGS. 4 and 5, a negative electrode 9 is mounted by sealing a magnet 11 inside a negative electrode plate 10 with a member having excellent corrosion resistance. Furthermore, a pin 13 for fitting the negative electrode plate 10 and the alignment plate 12 is formed. The negative electrode 9 is equipped with, for example, a conductive non-woven fabric 17 as a flexible conductive substance such as steel wool, a conductive non-woven fabric, conductive rubber, and a conductive foam. According to this, the contact property between the negative electrode 9 and the laser diode hermetic terminal 14 is further improved. Next, the aligning plate 12 is provided with through holes or slits 15 so that the laser diode airtight terminals 14 are aligned at regular intervals, and a hole 16 for fitting with the negative electrode plate 10 is formed. A large number of vertically arranged alignment plates 12 are attached to the negative electrode plate 10. Further, the alignment plate 12 does not come into contact with the laser diode airtight terminal 14 after fitting with the negative electrode plate 10. Further, at this time, the negative electrode 9 is installed so as to cover the upper surface of the negative electrode 9 except for through holes or slits 15 formed so as to be aligned at regular intervals, and plays a role of masking for suppressing plating deposition on the negative electrode 9.

The insulating lead 4 is formed by forming a pattern of an insulating layer on the contact surface of the negative electrode plate 10 with the laser diode airtight terminal 14 and limiting the conduction with a part of the laser diode airtight terminal 14. It enables partial plating on.

(Embodiment 4) Next, a plating method using the plating jig 18 will be described with reference to FIG. Align a large number of laser diode airtight terminals 14,
The held plating jig 18 is held by the plating jig holder 19 formed in the electrolytic solution tank 8 in a direction perpendicular to the electrolytic solution surface 22.
The rotary rod 20 formed in the central portion of the shaft 9 rotates in the coaxial direction, and a negative voltage is applied to the negative electrode 9 and a positive voltage is applied to the positive electrode 21. The outer lead of the hermetic terminal 14 for the laser diode and the negative electrode 9 are always in contact with each other and energized. Further, the variation of the electrolytic action between the plating jigs 18 can be reduced by the action of rotation of the plating jig holder 19, and after the plating is completed, the alignment plate 12 is removed to keep the laser diode aligned. The airtight terminal 14 is taken out.

(Fifth Embodiment) Next, a plating method using the plating jig 18 will be described with reference to FIG. Align a large number of laser diode airtight terminals 14,
The held plating jig 18 is immersed in the plating solution by holding a plurality of plating jigs 18 at a constant interval in the direction perpendicular to the electrolytic solution surface 22 by the plating jig holder 19 and applying a negative voltage to the negative electrode 9. A positive voltage is applied to the positive electrode 21. The outer lead of the hermetic terminal 14 for the laser diode and the negative electrode 9 are always in contact with each other and energized. Further, plating is performed by alternately arranging two or more rows of positive electrodes 21 and the laser jig hermetically-sealed terminals 14 provided upright at regular intervals in the plating solution. According to this, the electrolytic solution tank 8
It is possible to efficiently use the internal space, and it is possible to plate a large number of laser diode airtight terminals 14 at one time. Next, after the contact energization, the aligning plate 12 is removed, and the hermetic terminal 14 for the laser diode is taken out in the aligned state.

In the present embodiment, the plating jig is formed by using the permanent magnet, but by using the electric magnet, the attachment / detachment efficiency of the electronic component is further improved.

[0021]

As described above, according to the electronic component plating jig of the present invention, since all the electronic components are constantly in contact with the electrodes through the respective external lead wires, the occurrence of uneven plating on the surface of the electronic component is prevented. Also, the plating time can be shortened by making the plating thickness uniform and improving the current efficiency. Further, according to the electronic component plating method of the present invention, since a plurality of plating jigs can be held at one time, a large number of electronic components can be plated in one batch.

[Brief description of drawings]

FIG. 1 is a first embodiment of the present invention. (A) is a sectional view FIG. 1B is an enlarged view of part A of FIG.

FIG. 2 is a schematic perspective view of a plating jig according to a second embodiment of the present invention.

FIG. 3 is a sectional view of a plating jig according to Example 2 of the embodiment of the present invention.

FIG. 4 is a schematic perspective view of a plating jig according to Example 3 of the embodiment of the present invention.

FIG. 5 is a sectional view of a plating jig according to Example 3 of the embodiment of the present invention.

FIG. 6 is a perspective view for explaining a plating method according to Example 4 of the embodiment of the present invention.

FIG. 7 is a perspective view for explaining a plating method according to example 5 of the embodiment of the present invention.

FIG. 8 is a schematic view showing a conventional plating method.

9A and 9B are schematic top views showing a conventional plating jig, and FIG. 9C is a schematic cross-sectional view showing the conventional plating jig.

[Explanation of symbols]

1 base 2 Earth lead 3 insulator 4 insulated leads 5 Second metal coating layer 6 First metal coating layer 7 through holes 8 Electrolyte tank 9 Negative electrode 10 Negative electrode plate 11 magnets 12 Alignment plate 13 Mating pin 14 Airtight terminal for laser diode 15 through holes or slits 16 mating holes 17 Conductive non-woven fabric 18 Plating jig 19 Plating jig holder 20 rotating rod 21 Positive electrode 22 Electrolyte surface 101 plating jig 102 through hole 103 Copper plating layer 104a copper foil layer 104b Copper foil layer 105 energized area 106 Plating jig holder 107 drums 108 electrode rod 109 plating bath 110 electrode plate

Claims (12)

[Claims] 1. A base having a through hole, an earth lead electrically connected to the base, and an insulating lead sealed in the through hole via an insulating material. An electronic component having a metal coating formed thereon. 2. A base having a through hole, an earth lead electrically connected to the base, and an insulating lead sealed in the through hole via an insulator. And second to the insulated lead
An electronic component, wherein a metal coating is formed, and a first metal coating is formed on the second metal coating of the insulating lead. 3. The electronic component according to claim 1, wherein the first metal film is formed by gold plating. 4. A plating jig used for electroplating,
A plating jig for electronic parts, wherein a magnet is attached to the negative electrode. 5. A plating jig for electronic parts, wherein a magnet is embedded in a sealed state inside the negative electrode. 6. The plating jig for an electronic component according to claim 5, wherein an insulating material is applied to a non-contact portion of the negative electrode with the electronic component. 7. A plating jig for electronic parts, comprising a negative electrode and a negative electrode plate attached to the negative electrode, wherein a magnet is hermetically embedded in the negative electrode plate. 8. The negative electrode is formed of a conductor having flexibility, claim 4, claim 5, claim 6,
A plating jig for an electronic component according to claim 7. 9. The method according to claim 4, wherein a pattern made of an insulating material is formed on a contact surface of the negative electrode with the electronic component to have a function of limiting conduction with a part of the electronic component. The plating jig for electronic parts according to claim 5, claim 6, claim 7, and claim 8. 10. An aligning plate having an array hole or groove on at least one surface for holding an electronic component of the negative electrode, and the aligning plate is detachably attached to the negative electrode. A plating jig for an electronic component according to claim 7, claim 8 or claim 9. 11. An electronic component is inserted into an array hole or groove provided in an alignment plate of a plating jig, the alignment plate is then placed on an electrode plate, and an end face of a lead wire of the electronic component is attached. The electronic parts are placed upright in contact with the electrode plate, then the plating jig is installed on the plating jig holder formed in the plating solution tank, and the plating jig holding jig is immersed in the plating solution tank. Then
A method of plating an electronic component, which comprises rotating the plating jig in a coaxial direction of a rotary rod formed on a plating jig holder to perform plating. 12. An electronic component is inserted into an array hole or groove provided in an alignment plate of a plating jig, and then the alignment plate is placed on an electrode plate to fix an end face of a lead wire of the electronic component. The electronic parts are placed upright in contact with the electrode plate, and then the plating jig is held in the plating jig holder at a constant interval and immersed in the plating solution to provide the plating solution at a constant interval. A method of plating an electronic component, characterized by alternately arranging the two or more rows of anodes and a plating jig on which the electronic component is erected.