JPH0766321A - Method and jig for electroplating package for semiconductor device - Google Patents

Abstract

PURPOSE:To obtain an electroplating method of packages for semiconductor devices by which multiple connecting lines on the upper surface of a sidewall around a cavity can be easily electroplated without requiring much man-hour. CONSTITUTION:Elastic bars 100a are installed across the middle sections of multiple connecting lines 30 on the upper surface of a side wall 20 and metallic layers 120 around the bars 100a are electrically connected to the lines 30 by pressing the bars 100a against the middle sections of lines 30 by using pressing means 200a. Then the multiple connecting lines 30 of a package for semiconductor are electroplated by dipping the package in a plating solution while the metallic layers 120 around the bars 100a are electrically connected on electroplating electrode.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for electroplating a semiconductor device package for electrolytically plating a connection line of the semiconductor device package, and a plating jig used therefor.

[0002]

2. Description of the Related Art As a semiconductor device package, FIG.
A package as shown in FIG. 12 is known. In this package, the side wall 20 around the cavity 12 that accommodates the semiconductor chip 10 is made of ceramic. On the upper surface of the side wall 20, a large number of strip-shaped connecting lines 30 made of metallized are provided substantially radially so as to cross the upper surface of the side wall. A strip-shaped insulating layer 40 is provided on the upper surface of the side wall 20 across the midpoints of the plurality of connection lines 30 on the upper surface of the side wall 20. The cap 50 that covers the upper surface of the cavity 12 can be joined to the upper surface of the insulating layer 40.

In this package, the side wall 20
A lead 60 for connecting an external circuit is provided on the outer end of the connection line 30 on the upper surface.
Need to connect by soldering. As the lead 60, it is preferable to use a lead made of Cu or a Cu alloy having low resistance and good electrical characteristics and low resistance.

In order to easily and reliably solder the lead 60 made of Cu or Cu alloy to the outer end of the connection line 30, the connection line 30 made of a metallized package is provided with an undercoat such as Ni plating and Au. Surface plating such as plating needs to be sequentially performed using an electrolytic plating method.

Therefore, in manufacturing the above-mentioned package, conventionally, as shown in FIG. 13, the inside surface of the side wall 20 of the package or the outside surface thereof (the outside surface is shown in the figure).
Further, the connection line 30 is provided with a series of dummy lines 32 made of metallized, and the dummy lines 32 electrically connect a plurality of connection lines 30 on the upper surface of the side wall 20 in series. Then, one of the electrodes for electrolytic plating is electrically connected to the dummy line 32, the package is immersed in an electrolytic plating solution, and electrolytic plating is simultaneously applied to the plurality of connection lines 30 on the upper surface of the side wall 20. There is. After that, the inner side surface of the side wall 20 or the outer side surface thereof is shaved off by a predetermined thickness, the dummy lines 32 provided on those surfaces are removed, and the plurality of connection lines 30 on the upper surface of the side wall 20 are separated and independent.

[0006]

However, performing electrolytic plating on each of the plurality of connection lines 30 on the upper surface of the side wall 20 of the package as described above requires a great deal of labor and time, and each of those connections. There has been a demand for a simple method that can easily and quickly perform electrolytic plating on the line 30.

The present invention provides a package for a semiconductor device which can easily and quickly perform electrolytic plating on a plurality of connection lines on the upper surface of a side wall of the package in order to meet such a demand, without bothering and labor. It is intended to provide an electrolytic plating method (hereinafter referred to as a plating method) and a plating jig used for the method.

[0008]

In order to achieve the above object, the plating method of the present invention is characterized by including the following steps. a. A step of horizontally extending an elastic rod having a conductor at least around the middle of a plurality of connection lines on the upper surface of the side wall around the cavity of the semiconductor device package. b. A step of pressing the elastic rods, which are laid horizontally in the step a, onto a plurality of connection line midway portions by using a pressing means to electrically connect the conductors around the elastic rods to these connection lines. c. The semiconductor device package is immersed in the electrolytic plating solution while the conductor around the elastic rod electrically connected to the connection line in the step b is electrically connected to the electrode for electrolytic plating, and the semiconductor device package is connected to the connection line of the semiconductor device package. Electrolytic plating process.

In the plating method of the present invention, in the step a, elastic rods are inserted between the insulating layers in the form of strips for cap joining, which are provided in two rows on the upper surface of the side wall of the cavity of the semiconductor device package at a predetermined interval. Then, it is preferable that the elastic rods are laid across the plurality of connecting line midway portions on the upper surface of the side wall exposed between the two rows of insulating layers.

The plating jig of the present invention comprises an elastic rod which is made of a conductor at least in the periphery of a plurality of connecting lines on the upper surface of the side wall around the cavity of the semiconductor device, and which is a plurality of the elastic rod. It is characterized in that it is provided with a pressurizing means for pressing the connection line in the middle thereof.

In the plating jig of the present invention, the elastic rod is formed by depositing a metal layer around the rod made of silicon rubber, or the elastic rod is made of a rod made of conductive rubber. Is preferred.

At the same time, it is preferable that the elastic rod is formed to have a circular cross section, a cylindrical shape, or a shape close thereto.

[0013]

In the plating method of the present invention, the elastic rod having the conductor at least the periphery is laterally provided across the middle of the plurality of connecting lines on the upper surface of the side wall of the cavity of the semiconductor device package, and the elastic rod is provided. Are pressed against the middle of a plurality of connecting lines by using a pressurizing means.

Therefore, even if a plurality of connecting line midway portions on the upper surface of the side wall are not located on the same plane and some of the connecting line midway portions are protruding or dented, the plurality of connecting line midway portions are not formed. The middle part of each connection line can be reliably electrically connected to the conductor around the elastic rod by using the elastic force of the elastic rod.

The plurality of connection lines are electrolyzed by only electrically connecting a part of the conductor around the elastic rod electrically connected to the middle of each of the plurality of connection lines to the electrode for electrolytic plating. Electrical connection can be made easily and quickly to the plating electrode without any trouble.

In the step a, the upper surface of the side wall around the cavity of the semiconductor device package is spaced by a predetermined distance.
Elastic rods are inserted between the strip-shaped insulating layers for cap joining arranged side by side, and the elastic rods are laid across the connecting line midway portions of the upper side walls exposed between the two rows of insulating layers. In the plating method for mounting, by inserting the elastic rod between the two rows of insulating layers provided on the upper surface of the side wall, both sides of the elastic rod are supported by the side edges of the two rows of insulating layers, and the elastic rod is arranged in two rows. It can be positioned and fixed so that it does not move between the insulating layers. Further, the elastic rod can be accurately crossed horizontally so as not to move over the middle portions of the plurality of connection lines on the upper surface of the side wall exposed between the two rows of insulating layers.
At the same time, by covering the upper surface of the two rows of insulating layers on the upper surface of the side wall with the cap and joining them to the upper surfaces of the insulating layers of the two rows, it is covered with the elastic rods, so that electrolytic plating cannot be performed. It is possible to cover the middle portions of the plurality of connection lines exposed between the two rows of insulating layers where the plating marks appear, with a cap.

In the plating jig of the present invention, a plurality of elastic rods are provided on the upper surface of the side wall of the semiconductor device package while the elastic rod is laid across the middle of a plurality of connecting lines on the upper surface of the side wall of the cavity. The conductor around the elastic rod can be easily and quickly electrically connected to the middle portions of the plurality of connection lines on the upper surface of the side wall by pressing the middle portion of the connection line of the book using the pressurizing means. . Then, by electrically connecting a part of the conductor around the elastic rod to the electrode for electrolytic plating, the plating method of the present invention makes it possible to easily and quickly connect each of the plurality of connection lines on the upper surface of the side wall to the electrode for electrolytic plating. Can be electrically connected to.

Further, when the elastic rod is pressed against the middle portions of the plurality of connecting lines on the upper surface of the side wall, the middle portions of the plurality of connecting lines are not located on the same plane, but a part of the middle portions of the connecting lines. Even if is protruding or dented, the conductor around the elastic rod can be reliably electrically connected to each of the plurality of connection lines by using the elastic force of the elastic rod.

Further, in the plating jig in which the elastic rod has a circular or cylindrical cross section or a shape close thereto, any conductor portion around the elastic rod is in line contact with the connecting line midway portion. Therefore, it is possible to omit the work of rotating the elastic rod and determining the conductor portion around the elastic rod that is pressed against the middle portion of the connection line when the elastic rod is laid across the middle portion of the connection line.

[0020]

Embodiments of the present invention will now be described with reference to the drawings. 1 to 4 show a preferred embodiment of a plating jig used in the plating method of the present invention, FIG. 1 is a plan view of the elastic rod, FIG. 2 is a sectional view taken along line AA of the elastic rod of FIG. 3 is a plan view showing the usage state, and FIG. 4 is a front view showing the usage state. The plating jig will be described below.

In the figure, reference numeral 100a denotes an elastic rod, which is formed by successively depositing a metal layer 120 of Cu, Al, Au or the like around a rod member 102 made of silicon rubber which is not corroded by a plating solution. .

The elastic rod 100a is formed such that its cross-sectional shape is circular, cylindrical, or an elliptical shape close to them, an elliptic cylindrical shape (formed into a circular shape in the figure), or the like.

The elastic rods 100a are connected in the shape of a rectangular frame, and as shown in FIG.
A plurality of connecting lines 30 on the upper surface of the surrounding side wall 20 can be continuously crossed over the middle part.

Reference numeral 200a is a pressurizing means, and as shown in FIG. 4, is formed of clampers 210 provided on two sides of the base 220, three sides thereof, or four sides thereof. Then, the elastic rods 1 horizontally laid across the midpoints of the plurality of connection lines 30 on the upper surface of the side wall 20 of the package mounted on the base 220.
00a is pressed toward the base 220 by the clamper 210 from the two sides, the three sides, or the four sides, so that the elastic rod 100a
The plurality of connecting lines 30 can be pressed in the middle.

The plating jig shown in FIGS. 1 to 4 is composed of the elastic rod 100a and the pressing means 200a.

5 to 8 show another preferred embodiment of the plating jig used in the plating method of the present invention. FIG. 5 is a plan view of the elastic rod, and FIG. 6 is a view of the elastic rod B- of FIG. B sectional view,
FIG. 7 is a plan view showing the usage state, and FIG. 8 is a front view showing the usage state. The plating jig will be described below.

In the plating jig shown in the figure, the elastic rod 100b is formed of a rod material 104 made of conductive rubber, and the periphery thereof is made of a conductor made of the conductive rubber 104.

Similar to the elastic rod 100a shown in FIGS. 1 to 4, the elastic rod 100b has a circular or cylindrical cross section, an elliptical shape close to them, or an elliptic cylindrical shape (in the drawings, a circular shape). It has been formed) etc. At the same time, the elastic rods 100b are connected in the shape of a rectangular frame, and as shown in FIG.
A plurality of connecting lines 30 on the upper surface of the surrounding side wall 20 can be continuously crossed over the middle part.

The pressurizing means 200b is similar to the pressurizing means 200a shown in FIG. 4 and has the base 2 as shown in FIG.
20 Clamper 21 provided on two sides, three sides or four sides of the upper surface
It is formed from 0.

The plating jig shown in FIGS. 5 to 8 is composed of the elastic rod 100b and the pressing means 200b.

Next, a method of electrolytically plating a plurality of connection lines 30 on the upper surface of the side wall 20 of the package by the plating method of the present invention using these plating jigs will be described.

As shown in FIG. 3 or 7, the elastic rod 100a in the shape of a rectangular frame is formed in the middle of a plurality of connecting lines 30 on the upper surface of the side wall 20 around the cavity 12 of the package.
Alternatively, 100b is continuously laid horizontally.

Here, the elastic rod 100a or 100b is
It is preferable that the plurality of connecting lines 30 on the upper surface of the side wall 20 exposed inside the insulating layer 40 be laterally bridged over the middle part. The reason is that when the elastic rod 100a or 100b is laid across the middle of a plurality of connecting lines 30 on the upper surface of the side wall 20 exposed to the outside of the insulating layer 40, the elastic rod 100a or 100b is covered with the elastic rod 100a or 100b. Since electrolytic plating cannot be applied to the upper surface of the insulating layer 40, the middle portion of the connecting line 30 on the upper surface of the sidewall 20 outside the insulating layer 40 cannot be covered with the cap 50 that joins the upper surface of the insulating layer 40. is there.

When the elastic rod 100a or 100b is laid across a plurality of connecting lines 30 halfway, the elastic rod 10
It is preferable that the side portion of 0a or 100b is supported by the side edge of the insulating layer 40, and the elastic rod 100a or 100b is positioned and fixed so as not to move along the middle portion of the plurality of connection lines 30 on the upper surface of the side wall 20.

Next, the elastic rod 100a or 100b is pressed toward the upper surface of the side wall 20 by using the pressurizing means 200a or 200b, and the elastic rod 100a or 100b is pressed against the middle of the plurality of connecting lines 30. More specifically, as shown in FIG. 4 or FIG. 8, two elastic rods 100a or 100b are installed across the middle of a plurality of connection lines 30 on the upper surface of the side wall 20 of the package mounted on the base 220. One, three, or four sides are pressed by the clamper 210 toward the base 220,
The elastic rod 100a or 100b is pressed against the middle part of the plurality of connection lines 30. Then, the elastic rod 100a or 100
The surrounding metal layer 120 or the conductive rubber 104 is electrically connected to each of the plurality of connection lines 30.

Then, even if the middle portions of the plurality of connection lines 30 on the upper surface of the side wall 20 are not located on the same plane and some of the middle portions of the connection lines 30 project or are recessed, The elastic rod 1 is provided at the middle of each of the plurality of connection lines 30.
00a or 100b around the metal layer 120 or the conductive rubber 104 is easily and accurately electrically connected by using the elastic force of the elastic rod 100a or 100b.
It is possible to electrically connect a plurality of connection lines 30 on the upper surface of the side wall 20 in series via 0 or the conductive rubber 104.

Next, with the metal layer 120 around the elastic rod 100a or 100b or a part of the conductive rubber 104 electrically connected to one electrode (not shown) for electrolytic plating, the package is plated with a plating solution ( (Not shown). Then, the plurality of connection lines 30 on the upper surface of the side wall 20 of the package are subjected to electrolytic plating such as Ni plating and Au plating. In that case, the clamper 210 of the pressurizing means 200a or 200b is formed of a conductor such as metal, and the clamper 2
It is preferable that the metal layer 120 or the conductive rubber 104 around the elastic rod 100a or 100b can be electrically and easily connected to the electrode for electrolytic plating through the electrode 10.

Then, each of the plurality of connection lines 30 is electrically connected to the electrode (not shown) for electrolytic plating easily and quickly without any trouble, and each of the plurality of connection lines 30 on the upper surface of the side wall 20 of the package is connected. Electrolytic plating such as Ni plating and Au plating can be easily and quickly applied to the connection line 30 without trouble.

The plating method of the present invention comprises the above steps.

Next, another embodiment shown in FIG. 9 in which the plurality of connection lines 30 on the upper surface of the side wall 20 of the package is electrolytically plated by the plating method of the present invention using the above-described plating jig of the present invention will be described. To do.

In the plating method shown in the figure, in the step of horizontally extending the elastic rod 100a or 100b over the middle of the plurality of connecting lines 30 on the upper surface of the side wall 20 around the cavity 12,
Elastic package 100a or 10
0b is laid across the connecting lines 30 on the upper surface of the side wall 20 accurately so as not to move.

That is, as shown in FIG. 9, a plurality of connecting lines 3 are provided on the upper surface of the side wall 20 around the cavity 12 of the package, and the insulating layers 400 and 420 in the form of strips for cap bonding.
It is arranged in two rows at a predetermined interval across the 0 middle part. The insulating layers 400 and 420 are provided on the upper surface of the side wall 20 by coating the upper surface of the side wall 20 with alumina ceramic paste in a strip shape and baking or by using a ceramic green sheet and integrally baking the side wall 20. ing. Then, the elastic rod 100a or 100b is attached to the side wall 2
0 In the step of bridging over a plurality of connecting lines 30 on the upper surface, the elastic rod 100a or 100b (in the figure, referred to as the elastic rod 100a) is inserted between the two rows of insulating layers 400 and 420. The elastic rods 100a or 100b are supported on both sides by the side edges of the two rows of insulating layers 400 and 420, and the elastic rods 100a or 100b are positioned and fixed so as not to move between the two rows of insulating layers 400 and 420. . Then, the elastic rod 100a or 100b is arranged in two rows of insulating layers 400 and 420.
The plurality of connecting lines 30 on the upper surface of the side wall 20 exposed between them are laid horizontally so as not to move over the middle part.

Other than that, electrolytic plating is applied to each of the plurality of connection lines 30 on the upper surface of the side wall 20 of the package by following the same steps as the plating method of the present invention.

After that, the cap 50 covering the upper surface of the cavity 12 is joined to the upper surfaces of the two rows of insulating layers 400 and 420 formed by firing the alumina ceramic paste by using an insulating adhesive, a glass material or the like. Alternatively, the cap 50 covering the upper surface of the cavity 12 may be brazed over the sealing layer (not shown) formed of the metallization provided on the upper surfaces of the two rows of insulating layers 400 and 420 formed by firing the ceramic green sheet. Then, the elastic rod 100a or 10
Insulation layers 400 and 420 in two rows in which electroplating cannot be performed because the surface is covered with 0b and a plating rough appears.
The cap 50 covers the midway portions of the plurality of connection lines 30 exposed between them.

The plating method shown in FIG. 9 of the present invention comprises the above steps.

In the above-described plating jigs and plating methods of the present invention, the pressing means 200a or 200b is used.
Further, for example, as shown in FIG. 10, the plate member 2 mounted over the upper surface of the elastic rod 100a or 100b in the shape of a rectangular frame.
30 and a through hole 232 for circulating the plating solution on its surface
Is wound around the plate member 230 and a base 220 on which the package is mounted, and the elastic rod 100a or 100b (in the figure, the elastic rod 1
00a) and a rubber band 240 having corrosion resistance for clamping together with the package or other various general-purpose clampers (not shown) may be used.

Further, the elastic rod 100a or 100 of the plating jig used in each plating jig and each plating method of the present invention is used.
b has a cross-sectional shape of a triangular shape, a quadrangular shape, a trapezoidal shape, a polygonal shape or a triangular tubular shape, a square tubular shape, a trapezoidal tubular shape, a polygonal tubular shape, or a shape similar thereto, or a rectangular frame shape. May be formed in a rod shape or a U-shape without being connected to each other. Even if such an elastic rod 100a or 100b is used, a plurality of respective connections on the upper surface of the side wall of the package are formed by the plating method of the present invention. Electrolytic plating can be easily and quickly applied to the line without any trouble.

[0048]

As described above, according to the plating method of the present invention, it is possible to easily and quickly perform electrolytic plating on each of the plurality of connection lines on the upper surface of the side wall of the package without trouble. Also, the manufacturing of the package can be greatly labor-saving and rationalized.

Further, according to the plating jig of the present invention, the plurality of connection lines on the upper surface of the side wall of the package are easily and surely electrically connected to the electrodes for electrolytic plating by the plating method of the present invention using the jig. Of the plurality of connection lines can be easily and accurately subjected to electrolytic plating without trouble.

[Brief description of drawings]

FIG. 1 is a plan view of an elastic rod of a plating jig of the present invention.

2 is a cross-sectional view taken along the line AA of the elastic rod of FIG.

FIG. 3 is a plan view showing an example of use of the plating jig of the present invention.

FIG. 4 is a front view showing an example of use of the plating jig of the present invention.

FIG. 5 is a plan view of an elastic rod of the plating jig of the present invention.

6 is a cross-sectional view taken along line BB of the elastic rod of FIG.

FIG. 7 is a plan view showing an example of use of the plating jig of the present invention.

FIG. 8 is a front view showing an example of use of the plating jig of the present invention.

FIG. 9 is a process explanatory view of the plating method of the present invention.

FIG. 10 is a sectional view showing an example of use of the plating jig of the present invention.

FIG. 11 is a plan view of the package.

12 is a sectional view taken along line CC of the package of FIG.

FIG. 13 is an explanatory diagram of the manufacturing process of the package.

[Explanation of symbols]

 10 Semiconductor Chip 12 Cavity 20 Side Wall 30 Connection Line 32 Dummy Line 40, 400, 420 Insulation Layer 50 Cap 60 Lead 100a, 100b Elastic Rod 102 Silicon Rubber 104 Conductive Rubber 120 Metal Layer 200a, 200b Pressing Means 210 Clamper 220 Base 230 plate material 232 through hole 240 rubber band

Claims (6)

[Claims] 1. A method for electroplating a package for a semiconductor device, comprising the following steps. a. A step of horizontally extending an elastic rod having a conductor at least around the middle of a plurality of connection lines on the upper surface of the side wall around the cavity of the semiconductor device package. b. A step of pressing the elastic rods, which are laid horizontally in the step a, onto a plurality of connection line midway portions by using a pressing means to electrically connect the conductors around the elastic rods to these connection lines. c. The semiconductor device package is immersed in the electrolytic plating solution while the conductor around the elastic rod electrically connected to the connection line in the step b is electrically connected to the electrode for electrolytic plating, and the semiconductor device package is connected to the connection line of the semiconductor device package. Electrolytic plating process. 2. The elastic rod is inserted between strip-shaped insulating layers for cap bonding, which are provided in two rows at predetermined intervals on the upper surface of the side wall around the cavity of the semiconductor device package in the step a. 2. The electrolytic plating method for a package for a semiconductor device according to claim 1, wherein said is horizontally extended over a plurality of connecting lines on the upper surface of the side wall exposed between said two rows of insulating layers. 3. An elastic rod having a conductor at least the periphery of which is laid across a plurality of connecting line midway portions on the upper surface of the side wall around the cavity of the semiconductor device package, and the elastic rods are provided in the plurality of connecting line midway portions. A plating jig comprising a pressing means for pressing. 4. The plating jig according to claim 3, wherein the elastic rod is formed by coating a metal layer around a rod made of silicon rubber. 5. The plating jig according to claim 3, wherein the elastic rod is formed of a rod material made of conductive rubber. 6. The plating jig according to claim 3, 4 or 5, wherein the elastic rod is formed to have a circular cross section, a cylindrical cross section, or a shape close thereto.