JP2003209198A - Electronic component package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that, since the base of an electric component package where conductive paste is packed in a through-hole is a multi-layered structure, it is difficult to make thin the electronic component package, and manufacturing costs are increased. <P>SOLUTION: This electronic component package 10 is constituted of a base member 12 made of glass on which an electronic component 11 is mounted, a gap member 13 covering the base member 12, and a conductive member for electrically connecting the electronic component 11 mounted on the base member 12 to an electrode 23 formed outside the base member 12. A metallic pin 15 is adopted to the conductive member. Therefore, the metallic pin enables the organization fine, and prevents any clearance as the factor of leak from existing. In addition, the metallic pin is heat-sealed to the glass board so that any clearance between the metallic pin and a through-hole can be eliminated. Even when there is only one base, the seal performance of the conductive member can be sufficiently ensured. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for housing electronic parts such as a crystal oscillator and a piezoelectric element.

[0002]

2. Description of the Related Art Crystal oscillators are widely used as devices, specifically as one of printed circuit board mounting parts, because of their excellent frequency characteristics. However, in order to stabilize the characteristics of the crystal unit, it is desirable to put it in a hermetically sealed container in order to block the influence of the outside air. And a flat package type piezoelectric component using the same.

Specifically, FIG. 1 of the above publication shows a package 15 in which a crystal member 12 is housed in a base member 11 (the reference numerals are as described in the publication. The same applies hereinafter) and a cap member 13 is covered. There is. The present invention is characterized in that the package 15 is made of a material having substantially the same coefficient of thermal expansion as that of the crystal blank 12, and the package 15 is made of a mixture of ceramics and glass powder.

If there is a significant difference between the coefficient of thermal expansion of the package 15 and the coefficient of thermal expansion of the crystal blank 12, the thermal expansion and contraction of the package 15 affects the crystal blank 12 and adversely affects the frequency characteristics of the crystal blank 12. Well thought out. In the invention of the above publication, the thermal expansion coefficients of the two are approximated, and therefore there is no concern.

However, since the package 15 is a glass-ceramic composite body, the crystal piece 12 is placed on one base member 11 and the cap member 13 is covered, so that the productivity is extremely low. In addition, the glass-ceramic composite is difficult to process, which increases the production cost. In order to eliminate these drawbacks, the present inventors have started an attempt to manufacture a package from glass that is easy to process.

FIG. 7 is a cross-sectional view of an electronic component package that has been tried in the past. An electronic component package 100 has a substantially flat glass base member 101, a cap member 102 to cover the glass base member 101, and a low melting point for joining them. Sealing material 103
It is a hermetically sealed container capable of having a vacuum space inside, and houses the crystal unit 104 therein, and electrically connects the crystal unit 104 and the electrode 105 with the conductive material 106.

The conductive material 106 is a through hole 107.
It is completed by filling a conductive paste into. But,
There is a minute gap in the conductive material 106 or the conductive material 1
Since there is a slight gap between 06 and the through hole 107, outside air may enter the package 100 and the degree of vacuum may be deteriorated. Then, the following structure was examined as a leak countermeasure.

FIG. 8 is a cross-sectional view of an improved electronic component package tried in the past, and this improved electronic component package 11 is shown.
0 is characterized in that the length of the conductive material 106 is made sufficiently long and the auxiliary base member 111 is attached to the base member 101. The other elements are the same as those in FIG. 7, and the description thereof will be omitted. Considering the leak performance of the conductive material 106, the leak amount is proportional to the cross-sectional area of the conductive material 106,
It is inversely proportional to the length of the conductive material 106. As shown in FIG. 8, if the length of the conductive material 106 is made 5 to 10 times as long as that in FIG. 7, the leak amount becomes 1/5 to 1/10, and the airtightness can be significantly improved.

[0009]

However, in the above-described improved electronic component package 110, since the base has a multi-layer structure, it is difficult to reduce the thickness and the manufacturing cost increases.
Therefore, an object of the present invention is to provide an electronic component package,
It is an object of the present invention to provide a technique capable of strengthening the seal of a conductive member without forming a multilayer base.

[0010]

In order to achieve the above object, the first aspect of the present invention is to provide a glass base member on which an electronic component is mounted, a cap member for covering the base member, and an electronic component mounted on the base member. Also, in the electronic component package consisting of a conductive member for electrically connecting electrodes provided outside the base member, the conductive member is a metal pin including a head on which the electronic component is placed and a neck extending from the head to the electrode. The metal pin is firmly fixed to the base member by melting the glass by heating the base member at a temperature equal to or higher than the softening point of the glass.

A metal pin is used as the conductive member. With a metal pin, the structure is dense and there are no gaps that cause leakage. In addition, if the metal pin is heat-sealed to the glass plate, the gap between the metal pin and the through hole can be eliminated. Therefore, according to the first aspect, it is possible to sufficiently secure the sealing performance of the conductive member even with one base, and it is possible to promote the thinning and cost reduction of the electronic component package.

According to a second aspect of the present invention, the cap member is a flat plate.

If the cap member is a flat plate, the press work can be omitted and the manufacturing cost can be reduced.

According to a third aspect of the present invention, the base member is a glass molded product obtained by press-molding a glass plate while heating it to a temperature equal to or higher than the softening point.

The composition of the glass plate can be easily deformed by heating it to a temperature above the softening point. Therefore, if the base member is mass-produced by press molding, the base member can be manufactured at low cost.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. The drawings should be viewed in the direction of the reference numerals. FIG. 1 is an exploded view of an electronic component package according to the present invention, and an electronic component package 10 is an electronic component 1
1. A glass base member 12 on which 1 is mounted, a cap member 13 which covers the base member 12, and a base member 12
Pin 1 as a conductive member for electrically connecting the electronic component 11 mounted on the substrate and an electrode provided outside the base member 12
It consists of 5 and 15.

As is apparent from the figure, the cap member 13
Is a flat plate, for example, by cutting it from a metal plate,
It can be easily manufactured. On the other hand, the base member 12 is a molded product having a complicated shape including a bottom portion 17 including the concave portion 16 and a wall portion 18 extending around the bottom portion 17.

FIG. 2 is a sectional view of a completed electronic component package according to the present invention. The electronic component package 10 is fitted into a base member 12 having a complicated shape and a through hole 19 formed in the base member 12. The metal pin 15 as a conductive member, the electronic component 11 placed on the head 21 of the metal pin 15, the electrode 23 joined to the tip of the neck 22 of the metal pin 15, and the base member 12 having the low melting point sealing material 24. And a cap member 13 joined by using
It is a package kept in a vacuum of ^-3 Torr or less.

The metal pin 15 is, for example, a headed pin having a head 21 having a diameter of 0.35 mm, a neck 22 having a diameter of 0.15 mm, and a total length of 0.45 to 0.48 mm. SUS426, SUS476, and Dumet (electric material having Fe-Ni as a core material and coated with Cu).

The glass constituting the base member 12 is preferably soda lime silicate glass, non-alkali glass or aluminosilicate glass.

An electronic component package 1 having the above structure
The manufacturing method of 0 will be described with reference to FIGS. Figure 3 (a),
FIG. 3B is a manufacturing explanatory diagram (1) of the electronic component package according to the present invention. (A) is a through-hole opening process drawing, and the die 26 provided with the heaters 25 ... (... indicates a plurality; the same applies hereinafter), the heaters 27 ... And the punching pins 28.
After preparing a punching machine consisting of a punch 29 equipped with, a glass plate 31 is placed on the die 26 and heated to a predetermined temperature,
The punch 29 is lowered to form a through hole.

(B) is a pin driving step diagram. In this step, the frit blowing tube 33 for blowing the glass frit 32 and the pin driving machine 34 for driving the metal pin 15 are moved from left to right in FIG. To do.

Of the plurality of through holes 19A to 19D (A, B ... Are added for convenience) opened in the glass plate 31 placed on the table 35, the rightmost through hole 19A is only a hole. . An appropriate amount of glass frit 32 is supplied to the second through hole 19B from the right. Glass frit 32
Is a low melting point glass powder that melts at 400 to 500 ° C. The glass frit 32 is attached to the third through hole 19C from the right, and the metal pin 15 is driven therein. The leftmost through hole 19D indicates that the driving of the metal pin 15 is completed.

Thus, the plurality of through holes 19 ...
Then, the metal pin 15 is efficiently driven in while supplying the glass frit 32. The glass frit 32 may be formed by inserting a glass frit molded body, which has been formed into a cylindrical shape in advance, into the through holes 19.

4 (a) and 4 (b) are manufacturing explanatory views (2) of the electronic component package according to the present invention. (A) shows the preparatory stage of the press molding process, in which the lower press die 36 and the upper press die 37 are prepared. The lower press die 36 is shown in FIG.
The stand 35 in (b) does not matter. Press upper mold 3
7 is a punch type having a partition projection 38, a pin head storage recess 39, a recess forming projection 41, etc. on its lower surface. The glass plate 31 is placed on the press lower mold 36, and the glass plate 31 is put into an electric furnace (not shown) together with the press upper mold 37 to heat the glass plate 31 to a softening point temperature (about 1000 ° C.) or higher.

(B) shows the completion stage of the press forming step, in which the dividing grooves 42, the recesses 16 ... Can be formed in the glass plate 31 by the pressing action of the upper press die 37 and the metal It indicates that the heads of the pins 15 ... Slightly sinked into the glass plate 31. During this process, the glass frit melts and acts to close the gap between the metal pin and the through hole.

FIG. 5 is a perspective view of a press-formed product according to the present invention, in which a bottom portion 17 ... Recessed portion 16 ... And a metal pin 15 ...
The base member 12, which is provided with the bottom portion 17 and is surrounded by the wall portion 18, has a large number of base members 12 ... To be A large number of base members 12 ... Can be obtained by separating the bottoms of the dividing grooves 42 ... By hand, by cutting with a cutter, or by cutting with a laser.

After that, in FIG. 2, the electrode 23 is provided by the screen printing method, and the electronic component 1 is attached to the head 21 of the metal pin 15.
1 is placed, the cap member 13 is covered in a vacuum atmosphere, and the cap member 13 is bonded to the base member 12 with the sealing material 24, whereby the electronic component package 10 is completed.

FIGS. 6A and 6B are views of another embodiment of the metal pin according to the present invention. The metal pin 15 in (a) has a head 21.
The head 21 is formed of a truncated cone whose diameter is reduced downward. When the head 21 is slightly submerged in the glass plate 31 in FIGS. 4A and 4B, if it is a cone, it can be smoothly submerged by the taper action of the cone, and the finished shape becomes good.

The metal pin 15 of (b) also has a head 21 and a neck 2.
2, the head 21 is composed of a large-diameter cylinder 43 and a truncated cone 44. By projecting the large-diameter cylinder 43 upward from the glass plate 31, the driving amount of the metal pin 15 can be controlled. That is, it is possible to easily inspect whether or not the upper protrusion margin L of the metal pin 15 is a predetermined amount. The truncated cone 44 is used when the head 21 is slightly submerged in the glass plate 31.
The tapered action of the cone allows for smooth subsidence.

Therefore, if the metal pin 15 has the head 21 and the neck 22 as a basic structure, the detailed structure can be arbitrarily changed.

The manufacturing method of the electronic component package according to the first aspect is not limited to the manufacturing method described in the above embodiment.

Further, a glass frit (reference numeral 3 in FIG. 3 (b))
2) can be omitted. That is, when there is no glass frit, the metal pin is directly heat-sealed to the glass plate. Since the glass frit acts as an adhesive and a filler, even if the heat fusion between the metal pin and the glass plate is incomplete, the presence of the glass frit ensures the sealing property.

[0034]

The present invention has the following effects due to the above configuration. According to a first aspect of the present invention, a glass base member on which an electronic component is placed, a cap member that covers the base member, an electronic component placed on the base member, and a conductive material that electrically connects an electrode provided outside the base member. In an electronic component package including a member, a metal pin is used as the conductive member. With a metal pin, the structure is dense and there are no gaps that cause leakage. In addition, if the metal pin is heat-sealed to the glass plate, the gap between the metal pin and the through hole can be eliminated.

Therefore, according to the first aspect, it is possible to sufficiently secure the sealing performance of the conductive member even if the number of bases is one, and it is possible to promote the thinning and cost reduction of the electronic component package.

In the second aspect, the cap member is a flat plate. If the cap member is a flat plate, the pressing process can be omitted and the manufacturing cost can be reduced.

According to a third aspect of the present invention, the base member is a glass molded product obtained by press-molding a glass plate while heating it to a temperature equal to or higher than the softening point. If the glass plate is heated to a temperature equal to or higher than the softening point, the composition can be easily deformed. Therefore, if the base member is mass-produced by press molding, the base member can be manufactured at low cost.

[Brief description of drawings]

FIG. 1 is an exploded view of an electronic component package according to the present invention.

FIG. 2 is a sectional view of a completed electronic component package according to the present invention.

FIG. 3 is a manufacturing explanatory diagram (1) of an electronic component package according to the present invention.

FIG. 4 is a manufacturing explanatory view (2) of the electronic component package according to the present invention.

FIG. 5 is a perspective view of a press-formed product according to the present invention.

FIG. 6 is a diagram of another embodiment of the metal pin according to the present invention.

FIG. 7 is a sectional view of an electronic component package tried in the past.

FIG. 8 is a cross-sectional view of an improved electronic component package tried in the past.

[Explanation of symbols]

10 ... Electronic component package, 11 ... Electronic component, 12 ... Base member, 13 ... Cap member, 15 ... Metal pin, 1
9, 19A to 19D ... Through hole, 21 ... Metal pin head, 22 ... Metal pin neck, 23 ... Electrode, 24 ... Sealing material, 31 ... Glass plate, 36 ... Press lower mold, 37 ... Press upper mold.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hiroshi Higuchi             6-7 Chitose-cho, Yokkaichi-shi, Mie Co., Ltd.             NSG Glass Components             Within F term (reference) 5J108 BB02 CC06 EE03 EE07 EE11                       FF11 GG03 GG08 GG17 GG20

Claims (3)

[Claims] 1. A conductive member for electrically connecting a glass base member on which an electronic component is mounted, a cap member covering the base member, an electronic component mounted on the base member, and an electrode provided outside the base member. In the electronic component package including a member, the conductive member is a metal pin including a head on which the electronic component is placed and a neck extending from the head to the electrode, and heats the base member at a temperature equal to or higher than the softening point of glass. The electronic component package is characterized in that it is a metal pin fixedly attached to a base member by welding glass. 2. The electronic component package according to claim 1, wherein the cap member is a flat plate. 3. The electronic component package according to claim 1, wherein the base member is a glass molded product obtained by press-molding a glass plate while heating it to a temperature equal to or higher than a softening point.