JP2003200577A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003200577A5 JP2003200577A5 JP2002001629A JP2002001629A JP2003200577A5 JP 2003200577 A5 JP2003200577 A5 JP 2003200577A5 JP 2002001629 A JP2002001629 A JP 2002001629A JP 2002001629 A JP2002001629 A JP 2002001629A JP 2003200577 A5 JP2003200577 A5 JP 2003200577A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring tape
- tape
- recording element
- electric wiring
- recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009429 electrical wiring Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002001629A JP4078077B2 (ja) | 2002-01-08 | 2002-01-08 | 記録録素子ユニット及び記録装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002001629A JP4078077B2 (ja) | 2002-01-08 | 2002-01-08 | 記録録素子ユニット及び記録装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003200577A JP2003200577A (ja) | 2003-07-15 |
| JP2003200577A5 true JP2003200577A5 (cg-RX-API-DMAC7.html) | 2005-08-04 |
| JP4078077B2 JP4078077B2 (ja) | 2008-04-23 |
Family
ID=27641707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002001629A Expired - Fee Related JP4078077B2 (ja) | 2002-01-08 | 2002-01-08 | 記録録素子ユニット及び記録装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4078077B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7210091B2 (ja) * | 2017-03-28 | 2023-01-23 | 株式会社レゾナック | 転写型感光性フィルム、硬化膜パターンの形成方法、硬化膜及びタッチパネル |
-
2002
- 2002-01-08 JP JP2002001629A patent/JP4078077B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101484799B1 (ko) | 전기 제어 장치 | |
| US8593813B2 (en) | Low profile heat dissipating system with freely-oriented heat pipe | |
| CN100575150C (zh) | 控制模块 | |
| TW200600815A (en) | Semiconductor device, magnetic sensor, and magnetic sensor unit | |
| CA2418591A1 (en) | Electrical air heating apparatus in particular for a motor vehicle | |
| JPH11112172A (ja) | プリント配線板を備えた電気機器及び該電気機器の接合法 | |
| WO2004015771A3 (en) | Semiconductor device and method of manufacturing the same | |
| JP5950684B2 (ja) | 半導体装置 | |
| JP2003200577A5 (cg-RX-API-DMAC7.html) | ||
| US6300566B1 (en) | Electrical connection of a circuit carrier to a conductor-track carrier | |
| JPH10321912A5 (cg-RX-API-DMAC7.html) | ||
| JP2504486B2 (ja) | 混成集積回路構造 | |
| JP2005500677A5 (cg-RX-API-DMAC7.html) | ||
| JPS60138815A (ja) | 加圧スイツチおよびその製造方法 | |
| GB2218932A (en) | Hot-press head for connection of electrodes | |
| WO1999002023A1 (en) | Device for a circuit board | |
| JPH11135842A5 (cg-RX-API-DMAC7.html) | ||
| JP2008041953A5 (cg-RX-API-DMAC7.html) | ||
| JP3142746U (ja) | 半導体実装基板 | |
| CN2922118Y (zh) | 一种用于晶片夹持的静电卡盘 | |
| JP2518559Y2 (ja) | プリントヘッド | |
| WO2004046766A3 (en) | Optical component mounting and interconnect apparatus | |
| JP2642718B2 (ja) | 混成集積回路 | |
| JP2575520Y2 (ja) | 画像形成装置 | |
| JPH0531122U (ja) | 配線基板の接続固定構造 |