WO2004046766A3 - Optical component mounting and interconnect apparatus - Google Patents

Optical component mounting and interconnect apparatus Download PDF

Info

Publication number
WO2004046766A3
WO2004046766A3 PCT/US2003/036930 US0336930W WO2004046766A3 WO 2004046766 A3 WO2004046766 A3 WO 2004046766A3 US 0336930 W US0336930 W US 0336930W WO 2004046766 A3 WO2004046766 A3 WO 2004046766A3
Authority
WO
WIPO (PCT)
Prior art keywords
pad
major surfaces
electrical
component mounting
mounting
Prior art date
Application number
PCT/US2003/036930
Other languages
French (fr)
Other versions
WO2004046766A2 (en
Inventor
Michael H Ayliffe
Phillip J Edwards
Bradley S Levin
Robert William Musk
Joseph John Vandenberg
Brett M Zaborsky
Original Assignee
Bookham Technology Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bookham Technology Plc filed Critical Bookham Technology Plc
Priority to AU2003295639A priority Critical patent/AU2003295639A1/en
Priority to EP03786840A priority patent/EP1573825A4/en
Publication of WO2004046766A2 publication Critical patent/WO2004046766A2/en
Publication of WO2004046766A3 publication Critical patent/WO2004046766A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Optoelectronic component mounting and interconnect apparatus is disclosed that includes an optoelectronic mounting plate with a substantially parallepiped-shaped base plate having opposed major surfaces and a mounting edge extending between the major surfaces. A plurality of electrical contact pads are positioned on one of the major surfaces and electrically insulated from each other. One of the electrical contact pads is designed to have an optoelectronic device physically and electrically mounted thereon. A support plate is physically attached to the mounting edge and has electrical traces connected to at least some of the electrical contact pads. An optoelectronic component with two electrical contacts is mounted on a first contact pad with one contact connected to the pad and a second contact connected to a second pad.
PCT/US2003/036930 2002-11-19 2003-11-19 Optical component mounting and interconnect apparatus WO2004046766A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003295639A AU2003295639A1 (en) 2002-11-19 2003-11-19 Optical component mounting and interconnect apparatus
EP03786840A EP1573825A4 (en) 2002-11-19 2003-11-19 Optical component mounting and interconnect apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42744102P 2002-11-19 2002-11-19
US60/427,441 2002-11-19

Publications (2)

Publication Number Publication Date
WO2004046766A2 WO2004046766A2 (en) 2004-06-03
WO2004046766A3 true WO2004046766A3 (en) 2004-12-29

Family

ID=32326537

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/036930 WO2004046766A2 (en) 2002-11-19 2003-11-19 Optical component mounting and interconnect apparatus

Country Status (4)

Country Link
EP (1) EP1573825A4 (en)
CN (1) CN1711646A (en)
AU (1) AU2003295639A1 (en)
WO (1) WO2004046766A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110249947A1 (en) * 2010-04-12 2011-10-13 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Opto-electronic transceiver module with castellated electrical turn
CN110275252B (en) * 2018-03-13 2023-06-30 珠海保税区光联通讯技术有限公司 Optical transceiver module
US12111512B2 (en) 2020-12-15 2024-10-08 Plx, Inc. Mount for an optical structure and method of mounting the optical structure to the mount

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132532A (en) * 1990-03-13 1992-07-21 Nec Corporation Photoelectric converter module
US5841178A (en) * 1996-10-04 1998-11-24 Lucent Technologies Inc. Optical component package

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19755806A1 (en) * 1997-12-16 1999-06-17 Bosch Gmbh Robert Electro-optical module
JPH11258467A (en) * 1998-03-16 1999-09-24 Sumitomo Electric Ind Ltd Lead frame for optical module, manufacture of optical module and optical module
GB2365989B (en) * 2000-05-08 2003-05-14 Mitel Semiconductor Ab Optic fiber interface device on folded circuit board
US6492698B2 (en) * 2000-12-15 2002-12-10 Agilent Technologies, Inc. Flexible circuit with two stiffeners for optical module packaging
US6781727B2 (en) * 2000-12-18 2004-08-24 Infineon Technologies Ag Configuration for operating an optical transmission or reception module at high data rates of up to 10 Gbit/s
US6477056B1 (en) * 2001-03-12 2002-11-05 Phillip J. Edwards Optoelectric mounting and interconnect apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132532A (en) * 1990-03-13 1992-07-21 Nec Corporation Photoelectric converter module
US5841178A (en) * 1996-10-04 1998-11-24 Lucent Technologies Inc. Optical component package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1573825A4 *

Also Published As

Publication number Publication date
WO2004046766A2 (en) 2004-06-03
EP1573825A4 (en) 2006-02-08
CN1711646A (en) 2005-12-21
EP1573825A2 (en) 2005-09-14
AU2003295639A1 (en) 2004-06-15
AU2003295639A8 (en) 2004-06-15

Similar Documents

Publication Publication Date Title
JP2826277B2 (en) Electronic package assembly and connectors used with it
EP1523229A3 (en) Assembly of an electronic component with spring packaging
US20120244742A1 (en) Low profile heat dissipating system with freely-oriented heat pipe
MY142691A (en) Contact structure having silicon finger contactor
US5175491A (en) Integrated circuit testing fixture
TW200504965A (en) Folded flex circuit interconnect having a grid array interface
TW200615654A (en) Backlight module
TW200509420A (en) Heatsinking electronic devices
AU2003214178A1 (en) Shielded cable terminal with contact pins mounted to printed circuit board
ATE96912T1 (en) ADAPTER FOR ELECTRONIC TESTING DEVICES FOR CIRCUIT BOARDS AND LIKE.
DE60234182D1 (en) INTERPOSER MODULE AND METHOD
WO2001054232A3 (en) Flexible compliant interconnect assembly
SG191437A1 (en) Electrical connector assembly
WO2005112113A3 (en) Mounting with auxiliary bumps
CA2355037A1 (en) Circuit board assembly with heat sinking
ATE84168T1 (en) DETACHABLE MOUNTING SYSTEM FOR SEMICONDUCTORS ON A CONDUCTIVE SUBSTRATE.
KR970060594A (en) socket
US5199887A (en) Surface mounting connector
SG86366A1 (en) Packaging and interconnection of contact structure
MY112126A (en) Socket
US7559777B2 (en) Electrical connector for connecting electrically an antenna module to a grounding plate
TWI266069B (en) Testing assembly for electric test of electric package and testing socket thereof
KR20040066647A (en) Notebook computer
US8385082B2 (en) Electrical connection arrangement having PCB with contacts received therein
WO2004046766A3 (en) Optical component mounting and interconnect apparatus

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003786840

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 20038A34217

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2003786840

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 2003786840

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP