JP2003198215A - Transmission line substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve signal transmission characteristics between circuit components and realize miniaturization by forming a transmission line or the line on a dielectric substrate, without forming redundant wiring. <P>SOLUTION: A plurality of circuit components 3, 4 are mounted on the dielectric substrate 2, and connected by using many transmission lines 5 different in length which are patterned and formed on the substrate 2. As to the transmission lines 5, a transmission line 5a whose line length is long is formed in a low-permitivity region 6a, and a transmission line 5e whose line-length is short is formed in a high permitivity region 6c, thereby adjusting the transmission rate of signals transmitted, without formation of redundant wiring to be nearly equal. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mounts a plurality of circuit components on a dielectric substrate, and the circuit components are connected by transmission lines patterned on the dielectric substrate for signal transmission. Transmission line substrate.

[0002]

2. Description of the Related Art In personal computers, mobile devices, etc., a plurality of IC elements (integrated circuit elements) and L
Circuit components such as SI elements (large-scale integrated circuit elements) are mounted on the dielectric substrate, and a large number of transmission lines made of conductor patterns connecting these circuit components are formed on the dielectric substrate. A transmission line substrate is provided through which signals are transmitted between the circuit components via. In personal computers and the like, the CPUs mounted therein have been remarkably speeded up, and, for example, those exceeding 1 GHz have been provided and further speeded up.

In the transmission line substrate, the structure of the transmission line has become extremely important in order to transmit signals at high speed without causing an operation error as the operation speed of circuit elements and the like increases. For example, the conventional transmission line substrate 100 shown in FIG.
The CPU 102 and the memory 103 are mounted on the dielectric substrate 101, and a large number of transmission lines 104 (which connect the respective input / output units provided on the circuit elements 102 and 103 on the dielectric substrate 101) are connected. 104a-10
4n) is patterned. Transmission line board 100
Becomes faster with the CPU 102 and the memory 103.
The frequency of signal transmission through the transmission line 104 is increased.

In the transmission line board 100, the CPU 1
02 and the memory 103, each transmission line 104a-
Ideally, 104n are formed by equal length wirings having the same length as shown in FIG. The transmission line substrate 100 is a CPU mounted on the dielectric substrate 101.
As shown in FIG. 5, the transmission lines 104a to 104n of the memory 102 and the memory 103 can be formed with the same line length if their input / output sections face each other and have the same intervals.

However, the transmission line substrate 100 is C
Since the PU 102 and the memory 103 are formed with the input / output section on the entire outer periphery thereof, the transmission lines 104a are actually formed.
To 104n are formed on the dielectric substrate 101 with different wiring lengths. In the transmission line substrate 100, when the transmission lines 104a to 104n are formed with different wiring lengths, a difference occurs in the transmission time of signals transmitted to each. For this reason, the transmission line substrate 100 has a problem in that a processing error occurs due to a timing shift, and a so-called “whisker” or “glass” noise is generated.

Further, the conventional transmission line substrate 1 shown in FIG.
A high-frequency circuit element 112 and a balun 113 are mounted on a dielectric substrate 111, and a balanced line 114 (114a, 11a) connecting between input / output units provided in these circuit components.
4b) is a patterned high-frequency circuit board. In the high-frequency circuit board 110, the balun 113 shifts the phase of each differential signal with respect to the balanced (differential) input / output signal from the high-frequency circuit element 112, and combines the signals.

[0007]

In the transmission line substrate and the high frequency circuit substrate, various studies have been made to solve the above-mentioned problems caused by the transmission line and the balanced line having different wiring lengths. . For example, in the transmission line substrate 120 shown in FIG. 7, the CPU 122 and the memory 123 are mounted on the dielectric substrate 121 as with the transmission line substrate 100 described above, and the circuit components 12 are mounted on the dielectric substrate 121.
A large number of transmission lines 124 (124a to 124n) that connect between the input and output units facing each other are patterned. In the transmission line board 120, the transmission lines 124a to 124n are formed to have substantially the same line length.

That is, in the transmission line substrate 120, an input / output unit is provided on each side of the CPU 122 and the memory 123. For example, the opposite side 122 on the outer side of each side.
The straight line distance between the input / output portions of a and 123a is the largest, the straight line distance between the upper and lower sides 122b and 123b is larger, and the straight line distance between the input / output portions of the inner opposite sides 122c and 123c is next. It is the smallest. In the transmission line substrate 120, the upper and lower sides 122 are based on the first transmission line 124a that connects between the input / output unit provided on the side 122a of the CPU 122 and the input / output unit provided on the side 123a of the memory 123.
The second transmission line 1 for connecting between the input and output parts of b and 123b
The third transmission line 124c that connects the input / output portions of 24b and the opposite sides 122c and 123c is patterned on the dielectric substrate 121 so that their respective line lengths are matched.

That is, the second transmission line 124b includes
By forming the refraction part 125a in a part thereof,
The line length thereof is substantially the same as the line length of the first transmission line 124a. Further, the third transmission line 124c has a so-called meander pattern in which a large number of folded portions 125b are formed, so that the line length thereof is substantially the same as that of the first transmission line 124a and the second transmission line 124b. It becomes.

On the other hand, in the above-described high-frequency circuit board 110 as well, the first balanced line 114a having a short linear distance between the high-frequency circuit element 112 and the balun 113 has a folded-back portion 116 at a part thereof as shown by a chain line in FIG. By forming it, the second balanced line 114b can be formed to have a line length substantially equal to that of the second balanced line 114b.

However, such a transmission line substrate 120
The high-frequency circuit board 110 is a transmission line 1 with a short linear distance.
Since the bent portions 125a and 125b and the folded portion 116 are purposely formed in the 24b and 124c and the balanced line 114a to achieve equal length wiring, the line length increases and a so-called redundant wiring structure is formed. In the transmission line substrate and the like, miniaturization is sought by increasing the wiring density, and the above-described redundant wiring structure is not practical. In addition, in the transmission line board, etc., not only is there a problem that the impedance component increases due to the increase in the line length of the transmission line and the transmission efficiency of high frequency signals deteriorates, but also it is easy to radiate and receive electromagnetic noise. Therefore, there is a problem that the electromagnetic matching characteristics (EMC: elctromagnetic compatibility) and the electromagnetic interference noise characteristics (EMI: elctromagnetic interference) are deteriorated.

In the high-frequency circuit board 110, if the balanced lines 114a and 114b are formed with different line lengths, the phase shift of the high-frequency signal transmitted to each line deviates from π. Therefore, the high-frequency circuit board 110 has a problem that the loss of the high-frequency signal after conversion becomes large.

The transmission line board 120 and the like are provided with a large number of input / output terminals and a high density due to the multi-functionalization and sophistication of circuit components and circuit elements. Therefore, in the transmission line substrate 120 and the like, it is extremely difficult to take the above-mentioned measures, the redundant wiring becomes complicated and longer, and the problems such as an increase in size and deterioration of characteristics are even greater.

Therefore, according to the present invention, transmission lines and the like are formed on a dielectric substrate without redundant wiring to improve signal transmission characteristics between circuit components and the like, thereby reducing the size of the transmission line substrate. It was proposed for the purpose of providing.

[0015]

A transmission line substrate according to the present invention that achieves the above-mentioned object is a line in which a plurality of circuit components are mounted on a dielectric substrate and these circuit components are patterned on the dielectric substrate. It is connected by many transmission lines having different lengths. The transmission line board is configured so that each transmission line forms a transmission line with a long line length in the low dielectric constant region and a transmission line with a short line length in the high dielectric constant region according to each line length. It is formed in regions having different dielectric constants.

According to the transmission line substrate of the present invention having the above-described structure, the transmission line formed on the dielectric substrate transmits a signal transmitted through the transmission line as the dielectric constant of the dielectric substrate increases. Since it has a characteristic that the speed becomes slow, the signal transmission speed of the transmission line having a long line length formed in the low dielectric constant region and the signal transmission speed of the transmission line having a short line length formed in the high dielectric constant region are respectively It is almost the same. Therefore, according to the transmission line substrate, it is possible to freely form the transmission line on the dielectric substrate without redundant wiring, and it is possible to reduce the size and improve the signal transfer characteristic.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION The embodiments of the present invention shown in the drawings will be described in detail below. The transmission line substrate 1 shown in FIGS. 1 and 2 as the first embodiment is mounted on a communication terminal device having a wireless communication function such as a mobile device. The transmission line substrate 1 is mounted with a CPU 3 and a memory 4 by connecting input / output terminals to lands (not shown) formed on the dielectric substrate 2 respectively, and between the input / output portions of the CPU 3 and the memory 4 facing each other. A large number of transmission lines 5 that connect to each other are patterned. The transmission line substrate 1 allows a high-frequency signal to be transmitted at a high speed through the transmission line 5 between the CPU 3 and the memory 4, which have been operated at high speed, to perform a predetermined process. Although not shown, the transmission line substrate 1 has a C on the main surface of the dielectric substrate 2.
Not only the PU 3 and the memory 4, but also appropriate circuit elements are mounted and element patterns and the like are formed.

Although not described in detail, the CPU 3 and the memory 4 are provided with input / output units on their respective sides 3a to 3d and 4a to 4d, and the opposing input / output terminals are connected by a transmission line 5. . The CPU 3 and the memory 4 have the maximum linear distance between the input and output portions of the outer facing sides 3a and 4a,
They are connected by the first transmission line 5a and the second transmission line 5b having the maximum line length. The CPU 3 and the memory 4 are
The straight line distances between the input / output portions of the upper and lower sides 3b and 3c and the upper and lower sides 4b and 4c are slightly short, and they are connected by the third transmission line 5c and the fourth transmission line 5d, respectively. In the CPU 3 and the memory 4, the sixth transmission line 5 in which the straight line distance between the input and output portions of the inner facing sides 3d and 4d is minimum and the line length is minimum.
connected by e.

Of course, the CPU 3 and the memory 4 are provided on each side 3a ...
A large number of input / output terminals are formed on 3d, 4a-4d, and a large number of transmission lines 5a-5e connecting the input / output portions of the sides 3a-3d, 4a-4d are formed. Transmission line 5a-
In detail, 5e has different line lengths even for the transmission lines that connect the input and output parts between the same sides 3a to 3d and 4a to 4d, but for the sake of convenience of explanation, the transmission lines have substantially the same length. Shall be considered.

The dielectric substrate 2 is formed of a dielectric insulating material having a low dielectric constant and a low Tan δ characteristic, that is, a high frequency characteristic and having a predetermined thickness. The dielectric substrate 2 is
As a specific example, for example, polyphenylene ether (PP
E), bismaleide triazine (BT-resin),
Polytetrafluoroethylene (Teflon brand name), polyimide, liquid crystal polymer (LCP), polynorbornene (P
It is formed of an organic base material made of a resin material such as NB), a polyolefin resin, and a phenol resin. The dielectric substrate 2 is formed of, for example, an inorganic base material such as ceramics or a mixture of an inorganic base material and an organic base material such as glass epoxy.

On the dielectric substrate 2, each transmission line 5 and a large number of lands or through holes are formed by a pattern forming method which is generally used in the past. Dielectric substrate 2
Needless to say, it may have a multi-layer structure in which a wiring pattern, a ground pattern, or the like is formed in the inner layer as necessary, or a double-sided substrate. The dielectric substrate 2 has a large number of through holes formed by drilling or laser-drilling a base material having copper foil or the like bonded to the entire surface, and the inner wall of the through holes is subjected to conduction treatment by plating or the like. After that, a conductive paste is embedded and a lid is formed by plating or the like to form a through hole. Dielectric substrate 2
Is patterned by performing a photolithography process on the copper foil layer and then performing a wet etching process to remove unnecessary copper foil. Of course, the dielectric substrate 2
The other transmission lines 5 and the like are patterned by other appropriate methods.

In the transmission line substrate 1, each of the above-mentioned transmission lines 5 has a different dielectric constant ε from the dielectric substrate 2 as will be described later in detail. The pattern is formed in the pattern forming region 6c. In the transmission line substrate 1, the dielectric constant ε1 of the first pattern formation region 6a (the region surrounded by the one-dot chain line in FIG. 1) is the second pattern formation region 6b (the region surrounded by the two-dot chain line in the same figure). Smaller than the dielectric constant ε2 of
The dielectric constant ε2 of the second pattern formation region 6b is smaller than the dielectric constant ε3 of the third pattern formation region 6c (region surrounded by a dotted line in the figure).

By the way, the phase velocity vp of the sine wave propagating through the transmission line 5 is represented by vp = 2πf / kz (1) where kz is a phase constant (propagation constant imaginary term), and f is a frequency. .

For a sine wave, assuming that the phase velocity vp ₀ propagating in a vacuum, the phase constant kz ₀ , and the wavelength λ ₀ , vp ₀ = 2πf / kz ₀ = fλ ₀ ... Become.

The phase constant kz is such that the transmission line has a dielectric constant εr.
When the microstrip line is formed on the dielectric substrate of, kz = √εw × kz _{0 (} 3)

Here, εw is an effective permittivity, and using a filling vertical q determined by the electric field distribution between the dielectric substrate on which the microstrip line is formed and the air, εw = 1 + q (εr-1). -Represented by Formula 4. In the strip line, since the electric field is entirely present in the dielectric and q = 1, from Equation 4, εw = εr.

The phase velocity vp of the transmission line formed by the microstrip line on the dielectric substrate having the permittivity εr can be calculated from Equations 1 to 4 as follows: vp = 2πf / kz = fλ vp = 2πf / (√εw × kz ₀ ) = fλ vp = vp ₀ / √εw = fλ ₀ / √εw (5)

Therefore, the transmission line formed on the dielectric substrate has a characteristic that the propagation speed of the signal gradually decreases as the dielectric constant increases, as is clear from the equation (5). In the transmission line substrate 1, the signal transmitted between the CPU 3 and the memory 4 via the transmission line 5 is naturally a digital modulation signal, but can be regarded as an electric signal composed of various high frequency sine wave aggregates. it can.

In the transmission line substrate 1, as described above, the first transmission line 5a and the second transmission line 5b having the maximum line length are formed in the first pattern forming region 6a having the low dielectric constant ε1, The third transmission line 5c and the fourth transmission line 5d are formed in the second pattern formation region 6b having the medium dielectric constant ε2, and the sixth transmission line 5e having the minimum line length has the high dielectric constant ε3. It is formed in the third pattern formation region 6c. In the transmission line substrate 1, the transmission lines 5 that connect the CPU 3 and the memory 4 have different line lengths due to such a configuration, but are formed in the respective pattern formation regions having different permittivity ε. The transmission speed of the high frequency signal to be transmitted is adjusted to form a pseudo transmission line of equal length.

Therefore, in the transmission line substrate 1,
The transmission time difference of the high-frequency signals transmitted through the respective transmission lines 5 is suppressed, the malfunction of the processing due to the timing shift and the generation of noise components called so-called “whiskers” and “glasses” are suppressed, and the accuracy is improved. Planned. Further, in the transmission line substrate 1, since each transmission line 5 connecting between the CPU 3 and the memory 4 is formed in the shortest length, the dielectric substrate 2 can be downsized and the pattern of each transmission line 5 can be simplified or It is possible to increase the density. Furthermore, in the transmission line substrate 1, by shortening each transmission line 5,
Radiation and absorption of electromagnetic noise are also reduced, and electromagnetic matching characteristics and electromagnetic interference noise characteristics can be improved.

In the transmission line substrate 10, a simulation is performed with the line length of each transmission line 5 and the dielectric constant of the pattern forming region 6 as factors, based on the above-mentioned line length of the transmission line and the dielectric constant of the dielectric substrate. Then, the dielectric constant of the pattern formation region 6 is set to be optimum. Of course,
In the transmission line substrate 10, the pattern forming regions 6 are formed so that all the transmission lines 5 have the same transmission speed.
It is not necessary to precisely determine the dielectric constant of the pattern forming region 6 and the pattern forming region 6 may be formed by grouping within a certain allowable range.

In the transmission line substrate 1, the above-mentioned first pattern forming region 6a to third pattern forming region 6c are formed by various methods. For example, in the transmission line substrate 10 shown in FIG. 2, a plurality of sets of transmission lines 12 to 15 having different line lengths are patterned on the main surface of the dielectric substrate 11. In the transmission line substrate 10, the line length of the first transmission line 12 is the maximum, and the line lengths of the second transmission line 13 to the fourth transmission line 15 are gradually shortened. First transmission line 12 to fifth transmission line 15
Are covered with a first dielectric insulating layer 16 to a fifth dielectric insulating layer 19, respectively, as shown in FIG.

The first dielectric insulating layer 16 to the fifth dielectric insulating layer 19 are formed of dielectric insulating materials having different permittivities ε. The dielectric insulating layer is the first dielectric insulating layer 16
Is made of a dielectric insulating material having a lower dielectric constant than the second dielectric insulating layer 17, the second dielectric insulating layer 17 is made of a dielectric insulating material having a lower dielectric constant than the third dielectric insulating layer 18, and The third dielectric insulating layer 18 is formed of a dielectric insulating material having a lower dielectric constant than that of the fourth dielectric insulating layer 19. First
Each of the dielectric insulating layers 16 to 19 has a dielectric constant ε so defined as to correct the difference in the transmission time of the high frequency signal due to the difference in the line lengths of the transmission lines 12 to 15.

In the transmission line substrate 10, as shown in FIG. 2, the cavity portion 20 may be formed in the inner layer of the dielectric substrate 11 to form pattern forming regions having different permittivities ε. In the transmission line substrate 10, the pattern forming region is a low dielectric constant region due to the cavity 20, and the transmission speed of the high frequency signal transmitted through the transmission line 16 formed over the cavity 20 and having a large line length has another pattern. It becomes faster than the transmission speed of the high frequency signal transmitted through the transmission lines 17 to 19 formed in the formation region.

The first to fifth dielectric insulating layers 16 to 19 described above are formed over the entire surface after the transmission lines 12 to 15 are patterned on the dielectric substrate 11 as shown in FIG. 3, for example. By applying a dielectric insulating material, the dielectric insulating layer 2
1 is formed into a film. The dielectric insulating layer 21 is made of, for example, a photosensitive dielectric insulating material that forms the third dielectric insulating layer 18 that covers the third transmission line 14. The dielectric insulating layer 21 includes
As shown in FIG. 3A, a light-shielding mask 22 is arranged so as to face the formation region of the third transmission line 14, and an exposure / development process is performed. The dielectric insulating layer 21 forms a third dielectric insulating layer 18 that covers the third transmission line 14 by removing the exposed portion and leaving the unexposed portion as shown in FIG. The transmission line substrate 10 will be described below in the same manner by using dielectric insulating materials having different permittivities ε.
First dielectric insulating layer 16 to fifth dielectric insulating layer 19 covering 2 to 15 are formed.

For the dielectric insulating layer 21, not only the above-mentioned photosensitive dielectric insulating material but also another material such as a resist material is used, and unnecessary portions are removed by an etching method while masking a predetermined region. Each transmission line 1
You may make it form the 1st dielectric insulating layer 16 thru | or 5th dielectric insulating layer 19 which coat | covers 2-15. The masking dielectric insulating layers 16 to 19 can also be formed by, for example, a silk screen printing method or the like.

In the transmission line substrate 1, each transmission line 5 is pattern-formed on the dielectric substrate 2 as described above. For example, a copper-clad organic substrate is used to form a plurality of wiring layers and a flattening process is performed on the uppermost layer. It may be built in a communication module substrate including a base substrate part formed by applying the high frequency circuit part and a high frequency circuit part formed on the base substrate part. In the communication module substrate, a power supply circuit and a control circuit are formed on the base substrate portion, and a BPF circuit, a high frequency signal circuit or a processing circuit is formed on the high frequency circuit portion.

In the communication module substrate, the power supply circuit and the ground can be formed on the base substrate with a sufficient area, and it is possible to supply power with high regulation to each circuit. Further, since the communication module substrate has a configuration in which the base substrate portion and the high frequency circuit portion are electrically separated from each other and the occurrence of mutual interference is suppressed, the characteristics are improved. The communication module substrate has a relatively inexpensive organic substrate as a base, and an insulating dielectric layer is laminated on the uppermost layer in a planarized state. In the communication module substrate, an appropriate transmission line and a passive element such as an inductor element, a capacitor element or a resistor element are formed on the insulating dielectric layer by thin film technology.
Therefore, each transmission line can be formed on the communication module substrate with high precision and high density.

In the high frequency circuit board 30 shown in FIG. 4 as the second embodiment, the high frequency circuit element 3 is formed on the dielectric substrate 31.
2 and balun 33 are mounted, and these high frequency circuit elements 3
The first balanced line 34 and the second balanced line 35, which connect between the input / output units provided on the 2 and the balun 33, are patterned. In the high frequency circuit board 30, the balun 33 synthesizes the balanced (differential) input / output signals from the high frequency circuit element 32 by shifting the phase of each differential signal by π.

The high frequency circuit board 30 is formed of a dielectric substrate 31 made of the same dielectric insulating material as that of the dielectric substrate 2 of the transmission line board 1 described above and having a predetermined thickness. In the high frequency circuit board 30, the first balanced line 34 is formed with a line length shorter than that of the second balanced line 35. In the high-frequency circuit board 30, the first balanced line 34 and the second balanced line 35 have a first pattern formation region 37 (one point in FIG. 4) in which the dielectric constant ε is different from that of the dielectric substrate 31. Area surrounded by chain line) and second pattern formation area 3
8 (a region surrounded by a chain double-dashed line in the figure). In the high frequency circuit board 30, the dielectric constant ε of the first pattern forming region 37 is configured to be larger than the dielectric constant ε of the second pattern forming region 38.

The high frequency circuit board 30 is also applied when a plurality of high frequency circuit elements 32 and a balun 33 are mounted on a dielectric substrate 31 and are connected by balanced lines having different line lengths. . In addition, the high frequency circuit element 32
For, it is also possible to use a dipole antenna.

High frequency circuit board 3 constructed as described above
At 0, the transmission rate of the high-frequency signal transmitted through the first balanced line 34 and the second balanced line 35 is adjusted by the transmission rate characteristic due to the line length of the transmission line and the dielectric constant of the dielectric substrate described above. As a result, the transmission line having a pseudo equal length is constructed. Therefore, in the high-frequency circuit board 30, it is possible to prevent the disadvantage that the phase shift of the high-frequency signal deviates from π and to improve the characteristics without loss of the high-frequency signal after conversion. Further, in the high frequency circuit board 30, the first balanced line 3
By suppressing the increase in size of the dielectric substrate 31 due to the redundant wiring of 4, the miniaturization is achieved and the balanced lines 34,
It is possible to simplify the pattern of 35 or to increase the density. Further, in the high-frequency circuit board 30, the shortening of each of the balanced lines 34, 35 also reduces the emission and absorption of electromagnetic noise, thereby improving the electromagnetic matching characteristic and the electromagnetic interference noise characteristic.

[0043]

As described in detail above, according to the transmission line substrate of the present invention, the transmission line having a long line length is formed in the low dielectric constant region and the transmission line having a short line length is formed in the high dielectric constant region. Since the transmission speeds of the signals transmitted through these transmission lines are adjusted to be almost equal by forming the transmission lines, it is possible to increase the transmission line on the dielectric substrate without using redundant wiring and by using a free wiring pattern. The density can be formed, the size can be reduced, and the signal transfer characteristic can be improved by improving the electromagnetic matching characteristic and the electromagnetic interference noise characteristic or reducing the inductance component.

[Brief description of drawings]

FIG. 1 is a plan view of a main part of a transmission line board shown as an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of an essential part for explaining a configuration of a transmission line formed on a transmission line substrate.

FIG. 3 is an explanatory diagram of a process of forming a dielectric insulating layer that covers the transmission line.

FIG. 4 is a plan view of a main part of a high-frequency circuit board having a balun.

FIG. 5 is a plan view of a main part of a conventional transmission line board.

FIG. 6 is a plan view of a main part of a conventional high-frequency circuit board.

FIG. 7 is a plan view of a main part of a transmission line substrate in which a signal transmission speed is adjusted by using redundant wiring.

[Explanation of symbols]

1 transmission line substrate, 2 dielectric substrate, 3 CPU, 4
Memory, 5 transmission lines, 6 pattern formation areas, 10
Transmission line substrate, 11 dielectric substrate, 12 first transmission line, 13 second transmission line, 14 third transmission line, 1
5 4th transmission line, 16 1st dielectric insulating layer, 17
2nd dielectric insulating layer, 18 3rd dielectric insulating layer, 19 4th dielectric insulating layer, 20 cavity part, 21 dielectric insulating layer, 2
2 mask, 30 high frequency circuit board, 31 dielectric substrate, 32 high frequency circuit element, 33 balun, 34 first balanced line, 35 second balanced line, 36 input / output terminal,
37 first pattern formation region, 38 second pattern formation region

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 5E314 AA24 AA31 AA32 BB06 BB11                       CC01 CC07 DD07 FF05 FF16                       GG26                 5E338 AA16 BB63 BB80 CC01 CD12                       EE11                 5J014 CA06 CA07

Claims (6)

[Claims] 1. A plurality of circuit components are mounted on a main surface of a dielectric substrate, and these circuit components are connected to the dielectric substrate by a large number of transmission lines patterned with different line lengths. , Each of the above transmission lines forms a transmission line having a long line length in the low dielectric constant region and a transmission line having a short line length in the high dielectric constant region, and has a different dielectric constant according to each line length. The transmission line substrate is characterized in that the signal transmission speeds of the above-mentioned transmission lines are made substantially equal by being formed in the region. 2. The low dielectric constant region is formed by coating the long transmission line of the transmission line with a dielectric insulating material having a low dielectric constant, and the high dielectric constant region has a short transmission line length. The transmission line substrate according to claim 1, wherein the transmission line substrate is formed by coating the dielectric insulating material having a high dielectric constant. 3. The dielectric insulating material is any one of an organic dielectric insulating material, an inorganic dielectric insulating material, and an organic-inorganic composite dielectric insulating material.
The transmission line substrate according to claim 2, wherein: 4. The low dielectric constant region is formed by forming a cavity inside the dielectric substrate, and the transmission line having a long line length is formed across the cavity. The transmission line board according to claim 1. 5. The transmission line board according to claim 1, wherein the circuit component includes a high frequency CPU and a memory, and a high speed digital circuit is configured by transmitting a digital signal through the transmission line. . 6. The circuit component comprises a balun connected to a differential input / output section of an amplifier or an input / output section of a dipole antenna, and a high frequency signal is transmitted through the transmission line to form a high frequency differential circuit. The transmission line board according to claim 1, which is configured.