JP2003197842A - Semiconductor device, method and device for manufacturing it, circuit board and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability and production efficiency of a product in forming a lead. <P>SOLUTION: Related to a method for manufacturing a semiconductor device, a sealing part 30 supporting a plurality of outer leads 24 is set on a mold 50. The outer lead 24 set on the mold 50 is covered with a film 60. The film 60 is made to stick fast to the mold 50, and the outer lead 24 is formed into the shape of the mold 50. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, a semiconductor device manufacturing method and device, a circuit board, and an electronic device.

[0002]

BACKGROUND OF THE INVENTION As one form of a semiconductor package,
A package using a lead frame is known, such as a QFP (Quad Flat Package) type. In this semiconductor package, the outer leads protrude from the end of the sealing portion. The outer leads are often formed into a predetermined shape after plating.

Conventionally, the forming process has been carried out by setting the outer lead in one die and pressing the other die such as a punch. According to this, since the outer lead is impacted by the mold, the metal film (plating film) of the outer lead may be peeled off. As a result, a semiconductor device may be defective, such as a decrease in connection strength during mounting, corrosion of the outer leads, and a short circuit between the outer leads due to peeled metal scrap. Also,
The management of the mold was complicated, for example, the number of times the mold was regularly cleaned was increased.

The present invention is intended to solve the above-mentioned problems, and an object thereof is to improve the reliability and production efficiency of products and form leads.

[0005]

(1) In a method of manufacturing a semiconductor device according to the present invention, a sealing portion that supports a plurality of outer leads is set in a mold, and the outer leads are set in the mold by a film. And adsorbing the film to the mold to form the outer lead into the shape of the mold.

According to the present invention, the outer lead is formed by adsorbing the film to the mold.
When the film is adsorbed, the film follows the shape of the mold and overlaps the outer leads, so that the outer leads can be easily formed.

As a result, the impact applied to the outer leads is alleviated, so that the metal coating on the surface of the outer leads can be prevented from peeling off, and the reliability of the device can be improved. In addition, if the film is made large, the outer leads of the plurality of sealing portions can be collectively formed, so that the production efficiency can be improved.

(2) In this method of manufacturing a semiconductor device, a plurality of holes may be formed in the mold, and the film may be adsorbed by sucking gas through the holes of the mold.

(3) In this method of manufacturing a semiconductor device, the film may be sucked by pressing the film in a region surrounding the mold.

As a result, for example, the gas between the mold and the film can be easily sucked. Therefore,
The film can be surely adsorbed to the mold.

(4) This semiconductor device manufacturing method may further include plating the outer leads before the forming step.

As a result, it is possible to prevent the plating metal film of the outer leads from peeling off in the forming step.

(5) In this method of manufacturing a semiconductor device, adjacent outer leads are connected to each other, and a group of the connected outer leads are formed. After the forming step, the adjacent outer leads are formed. It may further include cutting a connection between the two.

As a result, it is possible to prevent each outer lead from bending laterally in the forming process.

(6) In this method of manufacturing a semiconductor device, each of the outer leads may be independently supported by the sealing portion without being connected.

(7) In this method of manufacturing a semiconductor device, the sealing portion may be connected to the outer frame of the lead frame.

As a result, for example, the outer leads of the plurality of sealing portions connected to the lead frame can be collectively formed, so that the production efficiency can be improved.

(8) In this method of manufacturing a semiconductor device, the sealing portion may be cut into individual pieces from the lead frame.

(9) The semiconductor device according to the present invention is manufactured by the above method.

(10) A circuit board according to the present invention has the above semiconductor device mounted thereon.

(11) An electronic device according to the present invention has the above semiconductor device.

(12) A semiconductor device manufacturing apparatus according to the present invention includes a mold in which a sealing portion for supporting a plurality of outer leads is set, and a film covering the outer leads set in the mold. The die adsorbs the film to form the outer leads into the shape of the die.

According to the present invention, the mold adsorbs the film and forms the outer leads into the shape of the mold. When the film is adsorbed, the film follows the shape of the mold and overlaps the outer leads, so that the outer leads can be easily formed.

As a result, the impact applied to the outer leads is alleviated, so that the metal coating on the surface of the outer leads can be prevented from peeling off, and the reliability of the device can be improved. In addition, if the film is made large, the outer leads of the plurality of sealing portions can be collectively formed, so that the production efficiency can be improved.

(13) In this semiconductor device manufacturing apparatus, the mold may be provided with a plurality of holes for sucking gas between the mold and the film.

(14) This semiconductor device manufacturing apparatus may further include a sheet for pressing the film in a region surrounding the mold.

As a result, for example, the gas between the mold and the film can be easily sucked. Therefore,
The film can be surely adsorbed to the mold.

(15) In this semiconductor device manufacturing apparatus, the mold has a recess for supporting the sealing portion and the base end of the outer lead, and the outer lead is bent obliquely from the base end. You may have a 1st surface and a 2nd surface which bends the said front-end | tip part of the said outer lead so that it may become substantially parallel to the said base end part.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following embodiments.

FIG. 1 is a diagram showing a lead frame used in this embodiment.

The lead frame 10 is formed by processing a copper-based or iron-based plate material. As the processing method, chemical etching or mechanical punching is applied. The lead frame 10 has an outer frame 12. The outer frame 12 often has a rectangular shape, and the outer frame 12 has the outer shape of the lead frame 10.

At least one hole (jig hole) 16 is formed in the outer frame 12. Thereby, the lead frame 10 can be easily positioned with respect to the mold. Outer frame 12
At least one hole 16 may be formed in each of both ends of the. In that case, a hole 16 formed at one end (for example, the left end in FIG. 1) of the outer frame 12 and a hole 16 formed at the other end (for example, the right end in FIG. 1) Are preferably formed at positions displaced in the length direction of the outer frame 12 (for example, the vertical direction in FIG. 1). By doing so, the lead frame 10 can be set in the mold without making a mistake in the orientation.

At least one lead frame 10 (only one is shown in FIG. 1, but generally a plurality) is provided.
The die pad 14 of FIG. The die pad 14 is a portion on which an electronic component such as a semiconductor chip is mounted, and often has a rectangular shape (particularly a square shape). The die pad 14 is attached to the outer frame 12 by hanging pins (tie bars or hanging leads) 18.
Supported by. The die pad 14 is down-set by bending the hanging pins 18.

The lead frame 10 includes a plurality of leads 20.
Have. From the outer frame 12 to the die pad 14
It is provided so as to extend toward. Specifically, the lead 20 includes an inner lead 22 and an outer lead 24. The inner lead 22 is a portion sealed with a sealing material 30 shown by a two-dot chain line in the semiconductor device, and the outer lead 26 is a portion pulled out from the sealing material 30 and electrically connected to the outside. This is the part used for connection.

The outer leads 24 extend at right angles to the sides of the rectangular die pad 14. The inner lead 22 extends obliquely from the outer lead 24 toward the center of the die pad 14. Leads 20 next to each other
Are connected by a dam bar 26. For more information,
The dam bar 26 connects the portions of the outer leads 24 adjacent to each other near the inner lead 22.

The outer leads 24 adjacent to each other are connected to each other by the connecting portion 2.
8 are connected. Specifically, the rectangular die pad 14
Of outer leads 24 extending along one side of the
Are connected by a connecting portion 28 that extends at a right angle to the outer lead 24. The connecting portion 28 connects the tip portions of the outer leads 24. In other words, the outer lead 24 extends from the connecting portion 28 toward the die pad 14. The connecting portion 28 is supported by the outer frame 12 at both ends in the extending direction.

In addition to the lead frame 10 described above, a well-known lead frame structure is applied to the method of manufacturing the semiconductor device of the present embodiment.

2 to 4 are views for explaining the method of manufacturing the semiconductor device according to the present embodiment. 4 is a diagram showing a circuit board on which the semiconductor device according to the present embodiment is mounted.

First, the lead frame 10 described above is prepared, and the semiconductor chip 32 is fixed to the die pad 14 (die bonding step). For example, the die pad 14 and the semiconductor chip 32 are bonded with the adhesive 34 (see FIG. 4).
As the adhesive 34, a thermosetting resin may be used, but a material having high thermal conductivity, for example, a metal paste (silver paste or the like) may be used. By doing this, the semiconductor chip 3
It is possible to easily dissipate the heat during the operation of No. 2 through the die pad 14 and dissipate it.

Next, a wire bonding process is performed.
For example, the wire 36 is bonded to the pad (not shown) of the semiconductor chip and the inner lead 22 (see FIG. 1).

Next, a molding process is performed. Specifically, the lead frame 10 on which the semiconductor chip 32 is mounted is set in a molding die. When the semiconductor device includes the heat sink (heat dissipation member) 40, the heat sink 40 is set on the lower surface of the die pad 14. The mold is composed of an upper mold and a lower mold, and the lead frame 10 is sandwiched between the upper and lower molds. A recess is formed in each of the upper die and the lower die, and the cavity of the mold is formed by the both recesses. Then, a sealing material (for example, thermosetting resin) is injected into the cavity, and the semiconductor chip 32,
The wire 36 and the inner lead 22 are sealed to seal the sealing portion 3
Form 0.

A hole 29 is formed in the lead frame 10 at the gate position in order to simultaneously inject the sealing material from above and below the lead frame 10.

Next, a dam bar cutting process is performed. Specifically, the dam bar 26 near the sealing portion 30 (see FIG. 1)
To cut. In addition, it is preferable to remove the burr of the sealing material after the molding step. Burrs may be removed simultaneously in the dam bar cutting process.

Next, a plating process is performed. For example, electrolytic plating may be performed. That is, a metal coating 38 (see FIG. 4) of brazing material (for example, solder) or tin is formed on the portion of the lead frame 10 exposed from the sealing portion 30.
For example, the plurality of outer leads 24 are connected to the outer frame 12 by the connecting portion 28, and are electrically connected via the outer frame 12, so that electrolytic plating is possible. By thus forming the metal film 38, the corrosion resistance is improved. Further, if a brazing material such as solder is plated, the outer lead 24 and the wiring pattern can be easily joined.

After the plating process, of the connecting portion 28 of the outer lead 24, the portion connected to the outer frame 12 is cut. In that case, as shown in FIG. 2, each outer lead 2
4 are preferably connected by a connecting portion 28. By doing so, a group of connected outer leads 24 can be simultaneously formed in the subsequent forming step. Therefore, it is possible to prevent each outer lead 24 from bending laterally.

Thus, the lead frame 10 shown in FIG.
Is manufactured. The sealing portion 30 includes a plurality of outer leads 2
Supports 4. The sealing portion 30 is connected to the outer frame 12 by the hanging pins 18. Therefore, the plurality of sealing parts 30 can be handled by one lead frame 10.

Next, as shown in FIGS. 3A and 3B, a forming process is performed. In this process, the mold 50
And the film 60 are prepared. The semiconductor device manufacturing apparatus according to the present embodiment includes a mold 50, a film 60,
including.

The mold 50 is preferably made of a material such as metal or ceramic which is hard to deform. By doing so, it becomes possible to form the outer lead 24 according to the shape of the mold 50. Alternatively, the mold 50 may be made of plastic such as resin as long as it can be formed. The mold 50 may be formed by injection molding, for example.

In the illustrated example, the mold 50 has a concave portion 54 for supporting the sealing portion 30 and the base end portion of the outer lead 24,
It has a first surface 56 connected to the recess 54 and a second surface 58 connected to the first surface 56. The recess 54 is shaped so as to be in close contact with the sealing portion 30. By doing so, it is possible to prevent the sealing portion 30 from being displaced from the mold 50 in the forming process. First side 56
Bends the outer leads 24 at an angle. That is, the first surface 56 is an inclined surface that restricts the bending of the outer lead 24. The second surface 58 is the outer lead 24.
Bend the tip of the to be almost parallel to the base.
That is, the second surface 38 is the sealing portion 3 in the recess 54.
It is a plane parallel to the plane supporting the largest plane of 0. By using such a mold 50, the outer lead 24 can be formed into a gull wing shape. In addition,
The mold is not limited to the above-described shape, and is configured to have a shape that matches the predetermined bent shape (for example, I-shape (including L-shape) or J-shape) of the outer lead 24. In that case, the above-mentioned first and second surfaces are formed in a shape that matches a predetermined shape.

In the illustrated example, the mold 50 has holes 52. The hole 52 is a hole that communicates with the outside, and is capable of sucking gas from the work surface (surface on the forming side) of the mold 50. The hole 52 is formed at least in a region where the outer lead 24 is arranged. The holes 52 may be many fine small holes communicating in any direction. In that case, the mold 50 may be called a porous member (porous block).

The mold 50 is a suction device (for example, a vacuum pump).
May be Alternatively, the suction device may be separate from the mold 50, and the gas suction means of the suction device may be connected to the hole 52 of the mold 50.

The film 60 is made of an elastically deformable material. For example, it is made of a material (for example, resin) that is elastically deformed by suction by the suction device described above. Film 60
Has a larger planar shape than the mold 50. Film 6
0 is preferably stretchable (for example, stretchable about 4 times). As a result, when the film 60 is attracted to the mold 50, the film 60 closely follows the shape of the mold 50, so that the outer lead 24 can be formed into the accurate shape of the mold 50. In addition, the film 60 is preferably made of a material that does not easily break when stretched (for example, when stretched about four times).

A forming process is performed using the above-mentioned apparatus. First, the sealing unit 30 is set in the mold 50. Figure 3
In the example shown in (A), the outer frame 12 of the lead frame 10 is placed on a table 62 provided on the outer periphery of the mold 50, and the sealing portion 30 is placed.
Is set in the recess 54 of the mold 50. Outer lead 24
The base end portion of is supported by the rising portion of the outer periphery of the recess 54, and is arranged so as to extend straight from the sealing portion 30. Then, the film 60 is arranged above the sealing portion 30 (specifically, the outer lead 24), and the outer lead 24 is covered with the film 60. After that, the film 60 is adsorbed by the mold 50. For example, the gas between the film 60 and the mold 50 may be sucked through the plurality of holes 52 of the mold 50.

Thus, as shown in FIG. 3B, the outer lead 24 is sandwiched between the film 60 and the mold 50. Since the film 60 is attracted to the mold 50, the outer lead 24 can be pressed toward the mold 50. Further, since one of the ones sandwiching the outer lead 24 is the elastically deformable film 60, the impact applied to the outer lead 24 can be mitigated.

When adsorbing the film 60, the sheet (pressing member) 64 may press the film 60 in a region surrounding the mold 50. For example, the base 62 and the seat 6
4, the outer frame 12 and the film 60 may be sandwiched, and the lead frame 10 and the film 60 may be fixed. Sheet 6
4 may be formed in a ring shape. According to this, since the ventilation path between the mold 50 and the film 60 can be only the hole 52, the film 60 can be easily adsorbed to the mold 50.

According to the present embodiment, the outer lead 24 is formed by adsorbing the film 60 on the mold 50. When it is adsorbed, the film 60 forms
Since it follows the shape of 0 and overlaps the outer lead 24,
The outer lead 24 can be easily formed. As a result, the impact applied to the outer leads 24 is mitigated, and for example, the metal coating 38 (see FIG. 4) on the surface of the outer leads 24 can be prevented from peeling off, and the reliability of the device can be improved.

A plurality of (for example, several tens to several hundreds) sealing portions 3
You may form 0 collectively. That is, a plurality of sealing parts 30 supported by one or a plurality of lead frames 10 may be set in a plurality of molds 50, and a plurality of outer leads 24 of each sealing part 30 may be collectively formed. . According to this, if the film 60 is made larger, the outer leads 24 of the plurality of sealing portions 30 can be collectively formed, so that the production efficiency can be improved.

The film 60 may be replaced every one or more cycles of the forming process. In that case, if the film 60 can be pulled out and taken up by a reel (not shown), the management of the manufacturing apparatus becomes easy. Further, the film 60 may be discarded without cleaning since the cost of the manufacturing apparatus itself is lower than that of the conventional mold. Therefore, the work of cleaning (or maintaining) the manufacturing apparatus can be omitted or reduced.

After the forming step, other trimming steps (other than the dam bar cut) are performed. The connecting portion 28 between the outer leads 24 adjacent to each other is cut, and the sealing portion 30
The hanging pin 18 that connects the outer frame 12 with the outer frame 12 is cut. Then, if necessary, a marking process is performed. afterwards,
A semiconductor device can be manufactured through the above steps including an inspection step and the like.

Apart from the above example, the outer leads 24 of the sealing portion 30 may be formed after the sealing portion 30 is cut into individual pieces from the lead frame 10. According to this, since there is no unnecessary portion such as the outer frame 12, it is possible to easily form the outer lead 24 easily. Further, the forming process may be performed in a state where the outer leads 24 are not connected but are independent. In that case, in the case of the lead frame 10 described above, the forming step is performed after cutting the portion of the connecting portion 28 that connects the adjacent outer leads 24. According to this
It is not necessary to cut the outer leads 24 after forming.

As shown in FIG. 4, the semiconductor device according to the present embodiment includes a sealing portion 30 having a semiconductor chip 32,
The lead 20 (inner lead 2) supported by the sealing portion 30.
2 and outer leads 24). As illustrated, when the heat sink 40 is provided, one surface of the heat sink 40 is exposed from the sealing section 30.

In FIG. 4, the semiconductor device is a circuit board 1.
It is implemented in 00. For the circuit board 100, it is common to use an organic substrate such as a glass epoxy substrate. A wiring pattern 102 made of, for example, copper or the like is formed on the circuit board 100 so as to form a desired circuit.
Wiring pattern 102 and outer leads 24 of the semiconductor device
And are joined. A heat dissipation member (heat spreader) 104 is provided on the circuit board 100, and the heat dissipation member 104 is bonded to the exposed surface of the die pad 14 (or the heat sink 40) of the semiconductor device. By doing so, the heat generated in the semiconductor chip 32 is transferred to the die pad 1
4 (or the heat sink 40) can be radiated from the heat dissipation member 104. The other configurations of the semiconductor device according to the present embodiment are as described in the above-described lead frame 10 and the method for manufacturing the semiconductor device.

As an electronic device having a semiconductor device to which the present invention is applied, a notebook personal computer 200 is shown in FIG. 5, and a mobile phone 300 is shown in FIG.

The present invention is not limited to the above-mentioned embodiment, but various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations having the same function, method and result, or configurations having the same purpose and result). Further, the invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. Further, the present invention includes a configuration having the same effects as the configurations described in the embodiments or a configuration capable of achieving the same object. Further, the invention includes configurations in which known techniques are added to the configurations described in the embodiments.

[Brief description of drawings]

FIG. 1 is a diagram showing a lead frame used in the present embodiment.

FIG. 2 is a diagram illustrating a method for manufacturing the semiconductor device according to the present embodiment.

FIG. 3A and FIG. 3B are views for explaining the method for manufacturing the semiconductor device according to the present embodiment.

FIG. 4 is a diagram showing a semiconductor device and a circuit board according to the present embodiment.

FIG. 5 is a diagram showing an electronic device according to the present embodiment.

FIG. 6 is a diagram showing an electronic device according to the present embodiment.

[Explanation of symbols]

10 lead frame 12 outer frame 24 Outer leads 28 Connection 30 Sealing part 50 type 52 holes 54 recess 56 First side 58 Second side 60 films 64 sheets

Claims (15)

[Claims] 1. A sealing part for supporting a plurality of outer leads is set in a mold, and the outer leads set in the mold are covered with a film, and the film is adsorbed to the mold to obtain the shape of the mold. A method of manufacturing a semiconductor device, comprising forming the outer lead. 2. The method of manufacturing a semiconductor device according to claim 1, wherein a plurality of holes are formed in the mold, and gas is sucked through the holes of the mold,
A method for manufacturing a semiconductor device, wherein the film is adsorbed. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the film is held in a region surrounding the mold to adsorb the film. 4. The method of manufacturing a semiconductor device according to claim 1, further comprising plating the outer lead before the forming step. 5. The method for manufacturing a semiconductor device according to claim 1, wherein the outer leads adjacent to each other are connected, and a group of the connected outer leads is formed. A method of manufacturing a semiconductor device, further comprising cutting a connecting portion between adjacent outer leads after the forming step. 6. The method of manufacturing a semiconductor device according to claim 1, wherein the outer leads are not connected to each other but are independently supported by the sealing portion. Manufacturing method. 7. The method of manufacturing a semiconductor device according to claim 1, wherein the sealing portion is connected to an outer frame of a lead frame. 8. The method of manufacturing a semiconductor device according to claim 1, wherein the encapsulation portion is cut into individual pieces from a lead frame. 9. A semiconductor device manufactured by the method according to claim 1. Description: 10. A circuit board on which the semiconductor device according to claim 9 is mounted. 11. An electronic device including the semiconductor device according to claim 9. 12. A mold in which a sealing part supporting a plurality of outer leads is set, and a film covering the outer leads set in the mold, wherein the mold adsorbs the film, A semiconductor device manufacturing apparatus for forming the outer lead into the shape of the mold. 13. The semiconductor device manufacturing apparatus according to claim 12, wherein the mold is formed with a plurality of holes for sucking gas between the mold and the film. 14. The apparatus for manufacturing a semiconductor device according to claim 12, further comprising a sheet that holds the film in a region surrounding the mold. 15. The semiconductor device manufacturing apparatus according to claim 12, wherein the mold includes a concave portion that supports the sealing portion and a base end portion of the outer lead, and the outer portion. Manufacture of a semiconductor device having: a first surface that bends the lead obliquely from the base end portion; and a second surface that bends the tip end portion of the outer lead so as to be substantially parallel to the base end portion. apparatus.