JP2003191371A - Gas barrier transparent film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transparent film which shows especially outstanding surface smoothness and water vapor barrier properties and an extremely low level of dimensional change after heating at a high temperature, and demonstrates a distinguished reliability when a printed wiring board is connected with the use of a connecting material including a conducting particle such as a heat seal connector or an anisotropic conducting film as a best-suited film for a variety of displays. <P>SOLUTION: This film has a gas barrier layer (B) composed of an inorganic thin film formed on a transparent polymer substrate (S) comprising a polycarbonate film containing 30 to 80 mol%, out of the entirety, of a repeating unit represented by formula (1), for example, [wherein, R<SB>1</SB>to R<SB>8</SB>are independently at least one kind selected from among a hydrogen atom, a halogen atom and a 1-6C hydrocarbon group]. In addition, the surface smoothness of a face forming the gas barrier layer (B) is 10 nm or less in terms of SRa. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a gas barrier transparent film, and more specifically, a liquid crystal display device, a photoconductive photoconductor, a surface light emitter, an inorganic and organic EL device, electrophoresis, a field emission device, a plasma device, The present invention relates to a gas barrier transparent film that provides a flat panel display or electronic paper that is highly reliable even when left as a transparent substrate for a surface heating element or the like under high temperature and high humidity for a long time.

[0002]

2. Description of the Related Art In recent years, in the field of flat panel displays such as liquid crystal display devices and organic EL display devices, a plastic film made of a transparent polymer has been used as a conventional glass substrate in order to improve breakage resistance, reduce weight and reduce thickness. Continuing to consider replacing. However, plastics generally have optical anisotropy caused by distortion during molding, and moreover, gas and water vapor easily pass through.

Plastic films for liquid crystal display devices are required to have resistance to various chemicals used in the manufacturing process of liquid crystal panels, heat resistance of alignment films and sealants, and heat resistance required for connecting drive circuits. . For this reason, a plastic molding having excellent optical isotropy is used as a base material, and a gas barrier layer, a chemical resistance layer, and a transparent conductive layer are laminated on the base material. Further, in recent years, in order to improve the display quality of a liquid crystal display, studies have been made on high definition and high capacity and multi-tone color display. For the former,
Alignment film baked at high temperature to obtain high pretilt angle, anisotropic conductive film bonded at high temperature with fine pitch and good connection reliability are used. For the latter, fine processing of pixel electrode and color filter is elemental technology Has become one of the. Therefore, in addition to the above-mentioned required characteristics, the plastic film as the base material is required to have further higher heat resistance and dimensional stability, particularly to minimize dimensional change after heating at high temperature.

Further, a plastic film for an organic EL display device is required to have extremely excellent smoothness on the surface forming an EL layer and excellent gas barrier property. An order of magnitude better performance is required. Further, it is required to have resistance to various chemicals used in the panel manufacturing process, baking of the cathode partition walls and seals, and heat resistance required in the drive circuit connecting process.

On the other hand, Japanese Patent Application Laid-Open No. 59-158015 describes a transparent conductive film for a display in which an indium oxide film is laminated on a polyether sulfone film having a small birefringence. Although it has excellent heat resistance, it has a large heat shrinkage ratio, the dimensional change due to water absorption is remarkable, and since the film is produced by heat melt extrusion molding, die line, gelled product,
There are many defects such as fish eyes, and it is difficult to realize a display having excellent display quality with the film. Also,
Japanese Patent Laid-Open No. 7-246661 discloses a phase difference of 10 to 2
There is a description that a polycarbonate or polyester carbonate composed of a 1,1-bis (4-hydroxyphenyl) -alkylcycloalkane adjusted in the range of 000 nm and its substitution product is used as a substrate for a display, but the film has high heat resistance. However, since the amount of dimensional change after high temperature heating is large and the water vapor barrier property is poor, it is difficult to obtain a display having excellent display quality with the film.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances and realizes a (flat) panel display excellent in display quality such as high definition, high capacity, multi-tone and color display. It has optical isotropy, heat resistance, and dimensional stability, and in particular, has excellent surface smoothness and water vapor barrier properties, and there is very little dimensional change after high temperature heating.
An object of the present invention is to provide a transparent film suitable for a display, which has excellent reliability when a printed wiring board is connected using a connecting material containing conductive particles such as a heat seal connector or an anisotropic conductive film. .

[0007]

Means for Solving the Problems The inventors of the present invention have intensively studied a polymer material for a display such as a liquid crystal in order to solve the above problems, and as a result, a polymer material having a specific molecular structure as a transparent polymer substrate. By controlling the three-dimensional refractive index with high precision film forming technology using
We have found a film with very good optical isotropy, dimensional stability, especially dimensional change after heating at high temperature, and very good surface smoothness, and an inorganic material containing a metal oxide as a main component on at least one surface of this film. It has been found that a transparent film having an extremely excellent gas barrier property can be obtained by stacking thin film layers even in a high temperature and high humidity environment, and has completed the present invention.

That is, the present invention is as follows. 1. A film having a gas barrier layer (B) made of an inorganic thin film on at least one surface of a transparent polymer substrate (S), wherein the transparent polymer substrate (S) has the following formula (1):

[0009]

[Chemical 3]

[In the above formula (1), R _{1 to} R ₈ are each independently a hydrogen atom, a halogen atom and a carbon number of 1 to 6]
Is at least one selected from the hydrocarbon groups of ] And the following formula (2)

[0011]

[Chemical 4]

[In the above formula (2), R _{9 to} R ₁₆ are each independently a hydrogen atom, a halogen atom and a carbon number of 1 to 1.
6 is selected from hydrocarbon groups, and X is a hydrocarbon group having 1 to 15 carbon atoms. ] It consists mainly of the polycarbonate which consists of the repeating unit represented by these, and the repeating unit represented by said Formula (1) is 30-80 mol% of the whole, and the surface smoothness of the gas barrier layer (B) formation surface is SRa. 10n
A gas barrier transparent film having a thickness of m or less.

2. The gas barrier layer (B) is Si, Al,
Oxides and fluorides of at least one metal selected from Ti, Mg and Zr or a mixture of two or more metals,
The gas barrier transparent film as described in 1 above, which is an inorganic material of nitride or oxynitride.

3. The gas barrier layer (B) comprises a silicon oxide thin film containing silicon and oxygen as main components, the ratio of oxygen atoms to silicon atoms is 1.5 or more and less than 2, and the film thickness is in the range of 1 nm to 1 μm. A transparent film having a gas barrier property of ~ 2.

4. The transparent polymer substrate (S) has a total light transmittance of 85% or more, and a three-dimensional refractive index simultaneously satisfies the following formulas (A) and (B), and the gas barrier transparent film according to 1 to 3 above. | R (550) | ≦ 20 (nm) (A) K = | [nz− (nx + ny) / 2] × d | ≦ 100 (nm) (B) [In the above formula (A), R (550) is Wavelength 550n
It is an in-plane retardation of the transparent polymer substrate (S) with respect to light of m, and in the formula (B), nx, ny, and nz are x-axes with the thickness direction of the transparent polymer substrate (S) as the z-axis, y-axis, z
It is a three-dimensional refractive index for light having a wavelength of 550 nm in the axial direction, and d is the thickness of the transparent polymer substrate (S). ]

5. The transparent polymer substrate (S) has a wavelength of 45.
The in-plane retardation for 0 nm light is R (450), wavelength 5
The gas barrier transparent film according to any one of 1 to 4 above, wherein R (450) / R (550) ≦ 1.06, where R (550) is the in-plane retardation for 50 nm light.

6. Transparent polymer substrate (S) is 180 ℃
The gas barrier transparent film according to any one of 1 to 5 above, which has a dimensional change rate of 0.1% or less after heat treatment for 2 hours.

7. Oxygen permeability P at relative humidity 0%
₁ satisfies the following formula (I) and the water vapor permeability P _{2 at a} relative humidity of 100% satisfies the following formula (II).
A transparent film having a gas barrier property of ~ 6. ^{_{P 1 <1 × 10 7 exp}} (-5000 / T) [cc / m 2 / 24hr / atm] (I) P 2 <5 × 10 11 exp (-8000 / T) [g / m 2 / 24hr] ( II) [In the above formulas (I) and (II), T is an absolute temperature (K)
Is the measurement temperature for oxygen permeability and water vapor permeability,

8. The gas barrier transparent film is the gas barrier transparent film according to 1 to 7 above, which has at least one coating layer (C) having a crosslinked structure.

9. The gas-barrier transparent film is the gas-barrier transparent film according to 1 to 8 above, which has a transparent conductive layer (E) on at least one surface.

10. The gas barrier transparent film as described in 1 to 9 above, which has a hardness of 18 or more and a plastic deformation rate of 50% or less when measured with an ultra-micro hardness meter.

11. A liquid crystal display device or an organic EL display device, comprising the gas barrier transparent film of 1 to 10 above.

The present invention is a process of searching for a plastic film substrate as a transparent polymer substrate which gives an ideal liquid crystal display having an extremely high display quality, and has a high glass transition temperature, a low water absorption property, a water vapor barrier property and an excellent optical property. Not only is it isotropic, but it also has excellent surface smoothness. By stacking a thin film layer containing a metal oxide as the main component on at least one side of this film, it is extremely excellent even in high temperature and high humidity environments. Further, it is possible to obtain a film having a gas barrier property, and further, to provide a gas barrier transparent film having an extremely small dimensional change after heating at a high temperature and a high surface hardness and having excellent connection reliability with a drive circuit.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION The transparent polymer substrate constituting the gas barrier transparent film of the present invention is a film mainly composed of polycarbonate represented by the following formula.
That is, the following formula (1)

[0025]

[Chemical 5]

A polycarbonate containing a repeating unit having a fluorene skeleton represented by (copolymerization) component is particularly excellent in the above properties. In the above formula, R _{1 to} R ₈ are each a hydrogen atom, a halogen atom such as bromine, fluorine or iodine, an alkyl group such as a methyl group, an ethyl group or an isopropyl group, a hydrocarbon group having 1 to 6 carbon atoms such as a phenyl group. Can be mentioned.

Here, as specific examples of the monomer used for introducing the (copolymerization) component of the above formula into the polymer, fluorene-9,9-di (4-phenol), fluorene-9, 9-di (3-methyl-4-phenol) may be mentioned. The copolymerization component represented by the above formula is 30 to 80 mol% of the entire repeating unit. If it is less than 30 mol%, the sufficiently excellent isotropicity and heat resistance described below cannot be obtained, and the dimensional change before and after high temperature heating also becomes large, and if it is more than 80 mol%, the light transmittance decreases and the film Becomes brittle.

Further, as the transparent polymer substrate constituting the transparent film of the present invention, the repeating unit represented by the above formula (1) and the following formula (2)

[0029]

[Chemical 6]

The repeating unit represented by the formula (1) is used as a copolymerization component, and the repeating unit represented by the above formula (1) is 30
Polycarbonates of -80 mol% are preferred. In the above formula (2), R _{9 to} R ₁₆ are each independently selected from a hydrogen atom, a halogen atom and a hydrocarbon group having 1 to 6 carbon atoms, and X is a hydrocarbon group having 1 to 15 carbon atoms. Examples of such a hydrocarbon group include those described in the above formula (1). Specific examples of X include, for example, methylene, 1,1-ethylene, 2,2-propylene, 2,
2-butylene, 2,2- (4-methyl) pentylene,
1,1-cyclohexylene, 1,1- (3,3,5-trimethyl) cyclohexylene, norbornane-2,2-
Diyl, tricyclo [5.2.1.0 ^2,6 ] decane-
8,8'-diyl, phenylmethylene, diphenylmethylene, 1,1- (1-phenyl) ethylene, 2,2-hexafluoropropylene, 2,2- (1,1,3,3-
Tetrafluoro-1,3-dichloro) propylene and the like can be mentioned.

The polycarbonate in the present invention may contain the repeating units represented by the above formulas (I) and (II) as a whole in an amount of 30 to 80 mol%, and may be a copolymer or a copolymer of two or more kinds. Alternatively, it may be a blend of homopolycarbonates. A particularly preferred polycarbonate is fluorene-9,9-di (3-methyl-4).
-Repeating unit represented by the above formula (1) derived from phenol (in the above formula (1), R _{1 to} R ₈ are hydrogen atoms (wherein _{one of} R ₂ and R ₃ is a methyl group, R ₅
And one of R ₈ is a methyl group)), X is 2,2-propylene, and R _{9 to} R ₁₆ are all hydrogen atoms, a repeating unit represented by the above formula (2). It is a polycarbonate containing and as a copolymerization component. Here, the repeating unit represented by the above formula (1) is 30 to 80 in total.
Mol%, preferably 35 to 70 mol%, more preferably 40 to 60 mol%. By setting the repeating unit represented by the above formula (1) to 30 mol% or more, the glass transition temperature becomes 170 ° C. or more, excellent heat resistance is obtained, and the water absorption rate and the water vapor permeability are small. Further, the surface hardness is remarkably improved, plastic deformation is unlikely to occur, and the dimensional change after heating at a high temperature is extremely small, so that the transparent polymer substrate for a display exhibits preferable characteristics. Further, since it has good resistance to various liquid crystals, it is particularly useful for liquid crystal display applications. Furthermore, as the number of repeating units represented by the above formula (1) increases, the optical isotropy of the transparent polymer substrate increases,
When a polycarbonate having a content of more than mol% is used, it becomes possible to reduce the respective values of the in-plane retardation R (450) for the light of wavelength 450 nm and the in-plane retardation R (550) for the light of wavelength 550 nm. , And even R (4
50) / R (550) ≦ 1.06, and further R (45
Since 0) / R (550) ≦ 1.00, the film has excellent optical isotropy. In particular, when a transparent polymer substrate is molded using a polycarbonate containing 30 mol% or more of the repeating unit represented by the above formula (1), it can be molded by the solution casting method described below to obtain the above formulas (A) and (B). ) Can be satisfied at the same time, and 180 ° C 2
The dimensional change rate after heat treatment for a long time is extremely small, and SRa
A polycarbonate film as a transparent polymer substrate for displays having a surface smoothness of 10 nm or less is very good.

Furthermore, the value of R (450) / R (550) becomes smaller as the number of repeating units represented by the above formula (1) is increased, and when it becomes about 55 mol% or more, R (45).
0) / R (550) <1. This characteristic is very useful for compensating the viewing angle characteristics and the optical rotatory dispersion of the liquid crystal display, especially when the transparent film for display of the present invention is used for the liquid crystal display.

The number average molecular weight of the polycarbonate is preferably 30,000 to 300,000, more preferably 35,000 to 100,000. A polymer having a larger molecular weight has improved mechanical properties and heat resistance, but if it is too large, molding becomes difficult.

The above polycarbonate in the present invention is
Provided are a transparent polymer substrate and a gas barrier transparent film which are optically excellent in transparency and isotropy and have good optical properties such as optical isotropy. Here, the excellent optical isotropy means the following formulas (A) and (B) | R (550) | ≦ 20 (nm) (A) K = | [nz− (nx + ny) / 2] × d | ≦ It means that 100 (nm) (B) is satisfied. In the above formula (A), R (55
0) is the in-plane retardation of the transparent polymer substrate for light having a wavelength of 550 nm, K in the above formula (B) represents three-dimensional optical isotropy, and nx, ny, and nz are transparent polymer substrates. Is a three-dimensional refractive index for light having a wavelength of 550 nm in the x-axis, y-axis, and z-axis directions with the thickness direction of z as the z-axis, and d is the thickness of the transparent polymer substrate.

The optical isotropy is preferably expressed by the following formulas (A ′) and (B ′) | R (550) | ≦ 15 (nm) (A ′) K = | [nz− (nx + ny) / 2. ] × d | ≦ 50 (nm) (B ′), more preferably the following formulas (A ″) and (B ″) | R (550) | ≦ 13 (nm) (A ″) K = | [ nz− (nx + ny) / 2] × d | ≦ 30 (nm) (B ″).

The in-plane retardation of the transparent polymer substrate is the difference Δn in the refractive index between the orientation direction of the transparent polymer substrate and the direction perpendicular thereto when light passes through the transparent polymer substrate having the thickness d. It is represented by the product Δn · d (nm) of the thickness d of the transparent polymer substrate. This phase difference can also be expressed by an angle, and the conversion formula of the phase difference R1 expressed by the angle and the phase difference R2 in nm is expressed as R1 (degree) = (R2 (nm) / λ) × 360. (Λ is the measurement wavelength of the phase difference).

The transparent polymer substrate made of the above polycarbonate film has very high heat resistance, has very little dimensional change after high temperature heating, and has a dimensional change rate of not more than 0.05% after heat treatment at 150 ° C. for 2 hours. And provide a display having excellent display quality. The dimensional change rate is 0.1 after the heat treatment at 180 ° C. for 2 hours.
% Or less is more preferable.

The transparent polymer substrate made of the above polycarbonate film used in the present invention has excellent heat resistance,
It has a glass transition temperature of not less than 0 ° C, preferably not less than 190 ° C, and has good optical characteristics.

Examples of the method for molding the above-mentioned polycarbonate film as the transparent polymer substrate used in the present invention include a melt extrusion film forming method and a solution casting film forming method. , And is excellent in optical isotropy satisfying the above formulas (A) and (B), which is preferable. In particular, by solution casting, a transparent polymer film for display having SRa of 10 nm or less and good surface smoothness can be obtained. Here, SRa is a three-dimensional center plane average roughness, and a portion having an area Sm is extracted from the roughness surface on the center plane, and the axis orthogonal to the center plane of the extracted portion is represented by the Z axis, and The value obtained in 1. is expressed in μm.

[0040]

[Equation 1] (However, Lx × Ly = Sm)

The polycarbonate film as the transparent polymer substrate in the present invention has a low water absorption rate and is important for a display which requires a very high quality. The water absorption is selected to be 0.4% or less, preferably 0.2% or less in water absorption after 24 hours in water measured by a method according to ASTM D570.

Further, it is important that the polycarbonate film as the transparent polymer substrate in the present invention has excellent water vapor barrier properties. It is important to select a material having a water vapor transmission coefficient at 40 ° C. and 90% RH of 50 g · 100 μm / m ² / day or less, preferably 35 g · 100 μm / m ² / day or less. By having such a high water vapor barrier property, it is possible to suppress deterioration of the element due to the influence of water when used as a substrate of a liquid crystal panel, an organic EL panel or the like. Note that some organic EL panels use a low molecular weight material and a high molecular weight material for the light emitting layer. In each system, a transparent conductive film, a hole transport layer, an RGB light emitting layer, an electron transport layer are formed on the substrate. , A method called bottom emission in which a film is formed in the order of metal cathode, a metal anode, a hole transport layer, and
A method called top emission has been proposed in which a film is formed in the order of RGB light emitting layer, electron transport layer and cathode. The gas barrier transparent film of the present invention using the above-mentioned transparent polymer substrate is useful for all of these methods. Further, it is also useful as a sealing film used by sandwiching the light emitting layer with the substrate on which the light emitting layer is formed in each method.

Examples of the method for molding the polycarbonate film as the transparent polymer substrate in the present invention include a melt extrusion film forming method and a solution casting film forming method. As mentioned above, the solution casting method is preferable. Although the solution casting method is inferior in productivity to the melt extrusion method, it has few defects such as die line, gelation product and fish eye, and has much better surface smoothness than the melt extrusion method. Further, in the solution casting method, even in the case of a high molecular weight resin whose melt viscosity is too high or easy to be colored or cannot be molded by melt extrusion in the case of being soluble in the solvent used, it is possible to mold, A film having excellent heat resistance can be obtained. Further, in the solution casting method, the three-dimensional refractive index of the film can be controlled by adjusting the characteristics of the die, the condition of the casting belt, the drying conditions, the film tension and the transport conditions, and the like. In order to satisfy the above formulas (A) and (B), it is particularly important to adjust the amount of solvent contained in the film in the molding step, the drying temperature, and the tension applied to the film. Although the apparent Tg of the film is determined by the amount of solvent contained in the film, it is preferable to set the drying temperature at or below the apparent Tg. The tension applied to the film tends to increase in the film transport direction when the film is formed by, for example, a roll winding method, but a device that can apply the tension in the direction perpendicular to the film transport direction is used. It is also effective to perform molding under the condition that the difference between the two tensions does not occur as much as possible and the tension is suppressed as much as possible.

In the solution casting method, the solvent used for film formation may remain in the film. The residual solvent causes the film to be plasticized, resulting in a decrease in glass transition temperature and a decrease in mechanical properties. Therefore, it is preferable to completely remove the residual solvent, preferably 1% by weight or less, more preferably 0.5% or less.
It is preferable that the content is not more than wt%. When a plasticizer, a surfactant or the like is added to the film, the residual amount of these is not included in the residual amount of solvent.

By the way, a method for reducing the amount of residual solvent is as follows.
Although the heat treatment is mainly used, a low boiling point solvent such as dichloromethane is preferably used as the main solvent for the solution casting method in consideration of effects and economy. Not only the low boiling point solvent but also a solvent such as dioxolane can be used.

The thickness of the polycarbonate film as the transparent polymer substrate in the present invention is the display quality when processed into various displays, the ease of handling in the process of molding the substrate, and the ease of handling in the process of assembling the display. Further, from the viewpoint of film formation efficiency during solution casting film formation, 20 to 500 μm, preferably 50 to 400 μm,
Furthermore, it is preferably 70 to 200 μm. Further, when the transparent film of the present invention using such a polycarbonate film is used as an electrode for a liquid crystal display by providing an electrode composed of a transparent conductive layer, the gap unevenness of the liquid crystal cell deteriorates the display quality. It is preferable that the spots be ± 5% or less,
Furthermore, it is preferable to be ± 2% or less.

In the gas barrier transparent film of the present invention, the above SRa is less than 10 nm, more preferably 5 n.
A gas barrier layer consisting essentially of an inorganic thin film is laminated on at least one surface of a transparent polymer substrate having a surface smoothness smaller than m.

Examples of the gas barrier layer include Si, Al,
Inorganic materials such as oxides, fluorides, nitrides, or oxynitrides of at least one metal selected from Ti, Mg, Zr, and the like or a mixture of two or more metals can be used.
Among them, an inorganic material containing Si oxide, nitride, or oxynitride as a main component is preferable because it has excellent transparency, gas barrier property, surface smoothness, and adhesion to the above-mentioned transparent polymer substrate. Particularly preferred is silicon oxide containing silicon and oxygen as main components. Alternatively, a thin film containing silicon and oxygen as main components, containing at least fluorine and magnesium, and chemically bonding with silicon and fluorine is preferable in terms of gas barrier property, transparency, surface smoothness, and small film stress. Here, the ratio of oxygen atoms to silicon atoms is preferably 1.5 or more and less than 2. Due to this ratio, the transparency and gas barrier properties of the thin film change in a trade-off relationship, and if it is less than 1.5, the transparency required for display applications may not be obtained. Further, the fluorine atom is chemically bonded to silicon and magnesium, and the ratio of the bond (A) between the fluorine atom and the silicon atom and the bond (B) between the fluorine atom and the magnesium is preferably (A)> (B). In addition, the ratio of magnesium contained in the gas barrier layer is 2.5 to 20 a in terms of element ratio with respect to coexisting silicon.
The range of tom% is preferable. It is presumed that such a ratio can reduce not only good gas barrier properties and transparency but also particularly film stress. Therefore, even if the film thickness of the gas barrier layer is increased, the transparent film for display is not deformed. Can be reduced. The chemical bonding state of elemental fluorine existing in the gas barrier film is analyzed and determined by, for example, X-ray photoelectron spectroscopy. In X-ray photoelectron spectroscopy, Kα ray of Al was used as an X-ray source, and 284.6e of neutral carbon C1s was used.
When the horizontal axis is corrected with V, the chemical bond state of fluorine is 68
The presence of the F1s peak (A) derived from the bond between fluorine and silicon observed near 7 eV and the F1s peak (B) derived from the bond between fluorine and magnesium observed at a low bond energy side of about 1.5 eV from this, and , Determined by their intensity ratio.

As a method of forming the gas barrier layer (B),
For example, a vapor deposition method such as a sputtering method, a vacuum vapor deposition method, an ion plating method, a plasma CVD method, etc., in which a material is deposited from a vapor phase to form a film, can be mentioned. These gas barrier layers can be used alone or in combination of two or more. The thickness of the gas barrier layer is preferably in the range of 1 nm to 1 μm, more preferably 2 nm to 200 nm. If the thickness of the gas barrier layer is less than 1 nm, it is difficult to uniformly form a film, and a portion where the film is not formed is generated, so that the gas permeability is increased. on the other hand,
If the thickness is more than 1 μm, not only the transparency is deteriorated, but also when the substrate is bent, cracks are generated in the gas barrier layer to increase the gas permeability.

According to the present invention, in particular, when the gas barrier layer (B) containing the above-mentioned oxide, nitride or oxynitride of silicon as a main component is formed on the above-mentioned transparent polymer substrate, the gas barrier layer is formed. (B) The surface on which the gas barrier layer (B) is formed, that is, the surface smoothness of the gas barrier layer (B) is 10 nm or less in SRa, which is excellent even under high temperature and high humidity environments satisfying the following formulas (I) and (II) A gas-barrier transparent film having excellent gas-barrier property is obtained. ^{_{P 1 <1 × 10 7 exp}} (-5000 / T) [cc / m 2 / 24hr / atm] (I) P 2 <5 × 10 11 exp (-8000 / T) [g / m 2 / 24hr] ( II) In the above formulas (I) and (II), P ₁ is oxygen permeability at 0% relative humidity of the substrate, P ₂ is water vapor permeability at 100% relative humidity, and T is oxygen permeability and water vapor permeability. The measured temperature of the degree is represented by an absolute temperature (K).

The gas barrier transparent film of the present invention comprises:
If necessary, on at least one surface of the transparent film, for example, directly on the surface side of the gas barrier layer (B) or via an intermediate layer, or on the surface of the transparent polymer substrate on which the gas barrier layer (B) is not formed. An intermediate layer made of an organic or inorganic compound having a crosslinked structure, for example, a chemical-resistant layer such as a hard coat layer, a transparent conductive layer, or the like can be formed thereon directly or through an intermediate layer.

As the chemical resistant layer, a crosslinked structure of polysiloxane resin, a crosslinked structure of acrylic resin, a crosslinked structure of epoxy resin and the like can be formed by using a known coating method and curing method. . Here, the chemical resistance is intended to impart resistance to solvents and chemicals when assembling the panel, and is resistant to alkali, acid, and N.
It is preferable to select materials and curing conditions that can sufficiently ensure stability against organic solvents such as methylpyrrolidone.
When the gas barrier layer and the chemical resistant layer are laminated on each other, a primer layer may be appropriately provided for the purpose of improving the adhesion between the layers. As the primer layer, a silicon material containing a silane coupling agent, an acrylic material, an acryl-urethane material, or a material containing alkoxy titanium can be used. The thickness of the chemical resistant layer can be appropriately selected from the range of generally 0.01 to 20 μm. When the gas barrier transparent film of the present invention is used for a liquid crystal display element or an organic EL display element, the surface of the chemical resistant layer laminated on the liquid crystal layer or EL layer side of the substrate has the same surface smoothness as that of the transparent film. It is preferable to select the conditions of the coating solution adjustment and coating method so that equivalent SRa can be obtained.

The transparent film having gas barrier properties of the present invention can be used as, for example, an electrode by forming a transparent conductive layer according to its use. As the transparent conductive layer, a known metal film, metal oxide film or the like can be applied, but among them, the metal oxide film is preferable from the viewpoint of transparency, conductivity and mechanical properties. For example, metal oxide films such as indium oxide added with tin, tellurium, cadmium, molybdenum, tungsten, fluorine, zinc and germanium as impurities, cadmium oxide and tin oxide, zinc oxide added with aluminum as impurities, titanium oxide, etc. Can be mentioned. Among them, indium oxide as a main component and one or more kinds of oxides selected from the group consisting of tin oxide and zinc oxide are included, and 2 to 20% by weight of tin oxide and / or zinc oxide is contained. A transparent conductive layer containing 2 to 20% by weight is excellent in transparency and conductivity and is preferably used. When the film of the present invention is used in an organic EL, it is selected from the group consisting of tin oxide and zinc oxide containing indium oxide as a main component for the purpose of controlling the work function of the transparent conductive layer and improving the luminous efficiency. Further, elements other than tin and zinc may be added to the film containing one or more kinds of oxides.

As a method for forming the transparent conductive layer, a sputtering method is mainly used, and a direct current magnetron sputtering method, a high frequency magnetron sputtering method, an ion beam sputtering method and the like can be applied. The thickness of the transparent conductive layer is 10 to 1000 n in order to obtain sufficient conductivity.
It is preferably m. The transparent polymer film for display of the present invention preferably has a total light transmittance in the visible light region of 80% or more, more preferably 85% or more. If it is less than 80%, problems such as deterioration of visibility may occur.

The hardness and the plastic deformation rate of the gas barrier transparent film of the present invention are, for example, commercially available Elionix Co., Ltd., Shimadzu Corporation, Akashi Co., Ltd., and NEC Corporation.
Etc. are measured with a micro hardness meter. For example, in ENT-1100 manufactured by Elionix Co., Ltd., the measurement conditions are a maximum load of 50 mgf and a data acquisition step of 0.2 mg.
f, data acquisition interval 40 msec, load holding time 1 sec when the maximum load is reached, the indenter used is a triangular pyramid (115 °) whose tip material is diamond, and is the average of 5 consecutive measurements for each load. The measurement is carried out after fixing to a metal sample stand with Aron Alpha (201), an instant adhesive manufactured by Toagosei Co., Ltd., and leaving it in an atmosphere of 25 ° C. for 24 hours. The hardness and the plastic deformation rate can be measured under measurement conditions other than the above, but the hardness may vary depending on the wear condition of the indenter used. Therefore, before measuring the hardness and the plastic deformation rate, it is necessary to confirm in advance that the measured value is always constant by using a material having a certain hardness, for example, a single crystal silicon wafer. In particular, if the measurement load is other than the above, variations in the measured values can be seen even with the same sample due to the difference in the tip shape of the indenter, so measure as much as possible according to the above measurement method, and compare. Is preferred.

The hardness is a value given by the following formula [III]. The plastic deformation rate is a value given by the following formula [IV]. Hardness = 3.7926 × 10 ^-2 × maximum load / (maximum displacement amount) ² [III] (hardness: kg / mm ² , maximum load: mg, maximum displacement amount: μm) Plastic deformation rate = after unloading Displacement amount / maximum displacement amount × 100 [IV] (Plastic deformation rate:%, Displacement amount after unloading: μm, Maximum displacement amount: μm) Within the range where the hardness is 18 or more and the plastic deformation rate is 50% or less. The transparent film of the present invention to be filled is, for example, HSC (heat seal connector) or ACF (anisotropic conductive film).
When connected to a printed wiring board using, it is possible to secure extremely good connection reliability. Further, particularly when the transparent film for a display of the present invention is applied to a liquid crystal display, the amount of the substrate deformed by the spacer arranged inside the liquid crystal cell becomes small, and a liquid crystal panel having uniform display characteristics with few spots is obtained. Is possible.

[0057]

According to the present invention, by using a polycarbonate film having a fluorene skeleton, the three-dimensional refractive index is extremely small, the optical isotropy is very good, the heat resistance is excellent, and the temperature after heating at high temperature is high. It is possible to obtain a transparent polymer substrate which is extremely small in dimensional change and has extremely excellent surface smoothness. By having an inorganic thin film layer containing a metal oxide as a main component on at least one surface of this transparent polymer substrate, a particularly excellent gas barrier property can be imparted even under a high temperature and high humidity environment. Even when a printed wiring board is connected using a connecting material containing conductive particles, such as an anisotropic conductive film, it is possible to provide a gas barrier transparent film which is particularly highly reliable and suitable for a display.

Examples of such transparent film include liquid crystal display devices, photoconductive photoconductors, surface light emitters, inorganic and organic ELs.
When used as a transparent substrate for devices, electrophoresis, field emission devices, plasma devices, surface heating elements, etc., it is a gas barrier transparent that gives a highly reliable flat panel display or electronic paper even if it is left under high temperature and high humidity for a long time. It is particularly useful as a film.

[0059]

EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. In the examples, parts and% are based on weight unless otherwise specified. Further, various measurements in the examples were performed as follows.

(1) Total light transmittance It measured using Nippon Denshoku Industries Co., Ltd. COH-300A.

(2) Oxygen permeability Using Oxytran 2 / 20ML manufactured by MOCON, 2
Oxygen permeability was measured at a relative humidity of 0% in a temperature range of 0 to 80 ° C (293 to 353K). The test was conducted on the gas barrier transparent film before the transparent conductive layer was formed.

(3) Water vapor transmission rate Percontran W1A manufactured by MOCON Co. is used for 20 to 20 minutes.
Relative humidity 10 in the temperature range of 50 ° C (293-323K)
The water vapor transmission rate at 0% was measured. The test was conducted on the gas barrier transparent film before the transparent conductive layer was formed.

(4) Retardation value, three-dimensional refractive index The value of the phase difference and the three-dimensional refractive index, which are the product of the birefringence Δn of the transparent polymer substrate (S) and the film thickness d, are measured by a spectroscopic ellipsometer. It was measured by a certain trade name "M150" manufactured by JASCO Corporation. The retardation value was measured with the incident light beam and the film surface orthogonal to each other. The three-dimensional refractive index is measured by changing the angle between the incident light beam having a wavelength of 550 nm and the film surface, and the phase difference value at each angle is measured. The three-dimensional refractive index is obtained by curve fitting with a known refractive index ellipsoidal formula. The rates nx, ny, and nz are calculated, and | (nz-
(Nx + ny) / 2) × 2 | was calculated.

(5) Dimensional change rate Used for a transparent polymer substrate, width 10 mm, length 100 mm
After cutting the film sample of the size in the machine direction (MD) and the width direction (TD) of the film, and measuring the length precisely with an electronic micrometer, 150 ° C. 2
Heat treatment for 2 hours and 180 ℃ for 2 hours, 50 ℃ at 50 ℃
The length after left for 1 hour or more in an environment of% RH was precisely measured, and the value obtained by dividing the difference between the length before and after heating by the length before heating was calculated as%.

(6) Residual Solvent Amount The sample is heated at a temperature 5 ° C. lower than the glass transition temperature of the polycarbonate film used as the transparent polymer substrate until the weight of the measured sample does not decrease, and the difference from the initial sample weight is adjusted to the initial value. The value divided by the sample weight was calculated in%.

(7) Polymer molecular weight Tetrahydrofuran is used as a mobile phase by GPC and column temperature is 4
Measurement was performed at 0 ° C., and polystyrene was used as a calibration curve sample to calculate the number average molecular weight.

(8) Film thickness It was measured with an electronic micrometer manufactured by Anritsu.

(9) Glass transition temperature: Regarding the transparent polymer substrate, "DSC2" manufactured by TA Instruments Co., Ltd.
920 modulated DSC ".

(10) Water Absorption: The transparent polymer substrate was estimated by the weight change after the film was immersed in water at 25 ° C. for 24 hours by the method according to ASTM D570.

(11) Hardness Measurement For the transparent polymer substrate, the hardness of the thin film was measured by using ENT-1100, an ultrafine hardness measuring device manufactured by Elionix Co., Ltd. Measurement conditions are maximum load 50mgf data loading step 0.2mgf, data loading interval 40
msec, load holding time when the maximum load is reached 1 sec, the indenter used is a triangular pyramid (115
°) is the average of 5 consecutive measurements for each load, and the sample is fixed to a metal sample stand with instant adhesive, Aron Alpha (201) manufactured by Toagosei Co., Ltd., at 25 ° C.
After being left for 24 hours in the atmosphere, the measurement is performed. The hardness is a value given by the following formula [I]. Hardness = 3.7926 × 10 ^-2 × maximum load / (maximum displacement amount) ² [I] (hardness: kg / mm ² , maximum load: mg, maximum displacement amount:
μm) Plastic deformation rate measurement: The plastic deformation rate is the same as the above hardness measurement, and is a value given by the following formula [II] from the displacement after unloading obtained by the same measurement and the maximum displacement. Plastic deformation rate = displacement after unloading / maximum displacement × 100 [II] (Plastic deformation:%, displacement after unloading: μm, maximum displacement:
μm)

(12) Evaluation of surface smoothness The surface smoothness is determined by the amplification supporting device SE3C manufactured by Kosaka Laboratory Ltd.
K, measured using an analyzer SPA-11 Co., cutoff 0.08 mm, scanning pitch 2 μm, recording pitch 2 m
m, measuring length 1 mm, and number of scanning 80
a was calculated. Here, SRa is a three-dimensional center plane average roughness, and a portion having an area Sm is extracted from the roughness surface on the center plane, and the axis orthogonal to the center plane of the extracted portion is represented by the Z axis, and The value obtained in 1. is expressed in μm.

[0072]

[Equation 2] (However, Lx × Ly = Sm)

(13) Liquid crystal panel A 160 × 100 dot display electrode is formed by photolithography on a transparent conductive layer of a substrate having a reliability dimension of 70 mm long × 50 mm wide, and a 1000 angstrom alignment film is formed on the electrode surface. Was formed and subjected to rubbing treatment so that each twist was 220 °. Then, 6.5 μm plastic beads are dispersed as a gap agent on one of the electrode surfaces so as to have a dispersion density of 150 / mm ^2, and two transparent conductive substrates are attached by an epoxy adhesive with the electrode surface inside. A cell was also prepared. Next, a nematic liquid crystal containing a chiral nematic liquid crystal was injected into this cell through an injection port, then the cell gap was made uniform by a pressure method, and the injection port was sealed. Next, polarizing plates were attached to both sides of the cell to obtain a liquid crystal panel. The liquid crystal panel thus obtained is 50
The liquid crystal cell was left for 250 hours in a 90 ° C. RH environment and examined for changes in the specific resistance of the liquid crystal cell.

(14) Preparation of Organic EL Element The transparent conductive layer of the transparent film for display of the present invention on which the transparent conductive layer was formed was subjected to a photolithography method.
A display electrode was formed. Next, by using a vacuum deposition method on the transparent electrode, TPD (N, N′-bis (3-methylphenyl) 1, which is a triphenylamine derivative, was formed as a hole transport layer.
1'-biphenyl-4,4'-diamine) was laminated in a thickness of 50 nm, and then Alq3 (tris- (8-hydroxyquinoline) aluminum) was evaporated to a thickness of 50 nm as a light emitting layer. 200g of magnesium and silver on top
An organic EL layer was formed by vapor deposition to a thickness of m to form a metal electrode. Subsequently, before the transparent conductive layer is formed, using the same film as the display film having the above EL layer formed thereon, after applying a UV-curable sealant on the surface on which the transparent conductive layer is formed, Both substrates were bonded together with the organic EL surface of the above-mentioned film on which the organic EL layer was formed facing inward, and the organic EL layer was sealed by ultraviolet irradiation. A voltage was applied to the organic EL device to confirm the presence or absence of light emission.

The following abbreviations were used for the compound names shown below. BisA: 2,2-bis (4-hydroxyphenyl) propane BCF: 9,9-bis (4-hydroxy-3-methylphenyl) fluorene IP: 3,3,5-trimethyl-1,1-di (4- Phenol) Cyclohexylidene ITO: Indium-tin oxide ECHETMOS: 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane APTMOS: 3-Aminopropyltrimethoxysilane EVOH: Ethylene vinyl alcohol copolymer (Kuraray's "Eval"") DCPA: dimethylol tricyclodecane diacrylate (Kyoeisha Chemical Co., Ltd." light acrylate DCP-
A ") UA: Urethane acrylate (" NK Oligo U-15HA "manufactured by Shin Nakamura Chemical Co., Ltd.)

[Example 1] Bisphenol component is Bis
A polycarbonate resin having A / BCF = 70/30 (molar ratio) and an average molecular weight of 37,000 and a Tg of 193 ° C. was dissolved in methylene chloride so as to be 20% by weight. Then, this solution is applied to a thickness of 1 by a die coating method.
Cast on a 75 μm polyester film. Then, it was dried in a drying oven until the residual solvent concentration reached 13% by weight, and peeled from the polyester film. Then, while keeping the obtained polycarbonate film in a drying oven at a temperature of 180 ° C. so that the vertical and horizontal tensions do not differ as much as possible and the film is balanced with a minimum tension that can hold the film, the residual solvent concentration in the film is Dry to 0.3% by weight and have surface smoothness of SRa of 2 nm and a thickness of 10
A 0 μm transparent film was obtained.

On one side of the film thus obtained, a coating composition for providing a polysiloxane resin layer was coated and heat-treated at 130 ° C. for 3 minutes to give a thickness of 0.
A polysiloxane resin layer having a thickness of 05 μm was formed. In addition,
The coating composition that gives the polysiloxane resin is
After adding 88 parts by weight of acetic acid to a mixed solvent of 720 parts by weight of water and 1080 parts by weight of 2-propanol, ECHETMO was added.
S640 parts by weight and APTMOS 154 parts by weight were sequentially added, and the mixture was obtained by stirring for 3 hours. Then, a gas barrier layer made of a silicon oxide thin film having a thickness of 40 nm was laminated on the polysiloxane resin layer by a sputtering method. The smoothness of the surface of the gas barrier layer was 4 nm in SRa. Table 1 shows the oxygen permeability, water vapor permeability, and surface hardness (hardness).

Further, a coating composition for forming a coating layer having a crosslinked structure was prepared as follows.

100 parts of EVOH was dissolved by heating in a mixed solvent of 720 parts of water and 1080 parts of n-propanol to obtain a uniform solution. To this solution was added 0.1 part of Tohle Dow Corning's "SH30PA" and 39 parts of acetic acid, 211 parts of ECHETMOS was added and stirred for 10 minutes. 77 parts of APTMOS was added to this solution and stirred for 3 hours for coating. The coating composition was coated on both sides of a film of a polycarbonate film on which a polysiloxane resin layer and a gas barrier layer composed of a silicon oxide thin film were laminated, and heat-treated at 130 ° C. for 3 minutes to obtain a thickness. Then, a transparent film was obtained by forming ITO with a thickness of 120 nm on the surface of the film opposite to the surface on which the silicon oxide thin film was laminated by a sputtering method. The evaluation results of the obtained gas-barrier transparent film were good as shown in Table 1.

[Embodiment 2] BisA / BCF = 50/5
0 (molar ratio) and Tg of 211 ° C. made of a polycarbonate copolymer having a thickness of 120 μm and a surface smoothness of SRa of 1
nm film as transparent polymer substrate, thickness 25
A film was obtained in the same manner as in Example 1 except that a gas barrier layer made of a silicon oxide thin film having a thickness of 10 nm was laminated. The evaluation results of the obtained gas barrier film were good as shown in Table 1.

[Embodiment 3] In the same manner as in Embodiment 1, Bis
A film having a thickness of 120 μm and a surface smoothness of SRa of 2 nm was formed from a polycarbonate copolymer having A / BCF = 50/50 (molar ratio) and Tg of 211 ° C. Then
A gas barrier layer made of a silicon oxide thin film having a thickness of 40 nm was laminated on one surface of the film by a sputtering method.

The surface smoothness of the gas barrier layer is SRa of 2
was nm. Then, a coating composition for providing a polysiloxane resin layer was coated on the gas barrier layer and heat-treated at 130 ° C. for 3 minutes to form a polysiloxane resin layer having a thickness of 2 μm. The coating composition that gives the polysiloxane resin is 720 parts by weight of water,
To a mixed solvent of 1080 parts by weight of 2-propanol, 8 parts of acetic acid was added.
After adding 8 parts by weight, 640 parts by weight of ECHETMOS and 154 parts by weight of APTMOS were sequentially added, and the mixture was obtained by stirring for 3 hours. Further, a coating layer having a crosslinkability and having a thickness of 4 μm was formed on the surface opposite to the surface on which the gas barrier layer was formed by the following method, and then the silicon oxide thin film of the film was laminated. A transparent film was obtained by forming ITO with a thickness of 120 nm on the surface opposite to the surface by a sputtering method.

20 parts by weight of DCPA, 10 parts by weight of UA, 30 parts by weight of 1-methoxy-2-propanol and 2 parts by weight of 1-hydroxycyclohexyl phenyl ketone as an initiator were mixed to obtain a coating composition. This composition was coated, heated at 60 ° C. for 1 minute, and then photocured with a high pressure mercury lamp at an integrated light amount of 700 mJ / m ² to form a cured resin layer as a chemical resistant layer. The evaluation results of the obtained gas barrier transparent film were good as shown in Table 1.

[0084]

[Table 1]

Example 4 A gas barrier layer made of a silicon oxide thin film having a thickness of 50 nm was laminated on one surface of the transparent film described in Example 3 by the sputtering method. The surface smoothness of the surface on which the gas barrier layer was formed was 3 nm in SRa. Further, ITO was formed in a thickness of 120 nm on the gas barrier layer by a sputtering method to obtain a gas barrier transparent film. The evaluation results of the obtained film were good as shown in Table 2.

[Example 5] A gas barrier layer made of a silicon oxide thin film having a thickness of 50 nm was laminated on both surfaces of the transparent film described in Example 3 by the sputtering method under the same conditions as in Example 4, and the gas barrier was further formed. On one side of the layer,
A film was obtained by forming ITO with a thickness of 120 nm by a sputtering method under the same conditions as in Example 4. The evaluation results of the obtained gas barrier transparent film were good as shown in Table 2.

Example 6 A film was obtained in the same manner as in Example 3 except that a gas barrier layer made of a silicon oxide thin film having a thickness of 500 Å was laminated by sputtering before forming ITO. The evaluation results of the obtained gas barrier transparent film were good as shown in Table 2.

[0088]

[Table 2]

[Comparative Example 1] Polycarbonate consisting only of BisA and having a Tg of 155 ° C was used, and the temperature in the drying oven was set to 1
A film was obtained in the same manner as in Example 1 except that the temperature was changed to 45 ° C. As shown in Table 3, the evaluation results of the obtained film show that the transparency is good, but the heat resistance and the optical isotropy are poor, the water vapor transmission coefficient is large, and the dimensional change after heating is large. Became.

[Comparative Example 2] BisA / IP = 40/60
A transparent film was obtained in the same manner as in Example 1, except that a polycarbonate copolymer having a Tg of 205 ° C. was used. The evaluation results of the obtained film are, as shown in Table 3,
Although the heat resistance and the transparency were good, the optical isotropy was poor, the water vapor transmission coefficient was large, and the dimensional change after heating was large.

[Comparative Example 3] A polycarbonate having a Tg of 155 ° C consisting of BisA alone was used and the temperature in the drying oven was set to 1
A transparent film was obtained in the same manner as in Example 3 except that the temperature was changed to 45 ° C. As a result of evaluation of the obtained transparent conductive substrate, the transparency was good as shown in Table 3, but in the organic EL element lighting test, although the initial light emission was observed, there was a lighting failure after standing for 24 hours at room temperature. occured.

[0092]

[Table 3]

Front page continuation (51) Int.Cl. ⁷ identification code FI theme code (reference) H05B 33/14 H05B 33/14 A // C08J 7/06 CFD C08J 7/06 CFDZ (72) Inventor Saito Tokuaki Tokyo 4-3-2 Asahigaoka, Tohino-shi, Teijin Ltd. Tokyo Research Center (72) Inventor Toshiaki Yatabe 4--3-2 Asahigaoka, Hino-shi, Tokyo F-Term (Reference) in Teijin Ltd. Tokyo Research Center 2H090 HA08 HB03X HB07X JB03 JB13 JD08 JD11 JD12 JD17 LA15 3K007 AB13 AB14 BA07 CA06 DB03 4F006 AA36 AB73 BA05 CA05 DA01 4F100 AA01B AA05B AA12B AA17B AA20B AB09B AB10B AB11B AB12B AB19B AK01A AK45A AK52 AR00D BA02 BA04 CC00C EH66 EJ06C EJ41 GB41 JD02 JD03 JD04 JG01D JK12 JK15B JK20A JL04 JM02B JN01A JN01D JN08A JN18A JN30A 4J029 AA10 AB07 AC02 AD01 AE03 AE04 BB12 BB13 BB18 BC09 BD08 BG06 BG09 BG17 HC01 HC03

Claims (11)

[Claims] 1. A film having a gas barrier layer (B) made of an inorganic thin film on at least one surface of a transparent polymer substrate (S), wherein the transparent polymer substrate (S) has the following formula (1): [In the above formula (1), R _{1 to} R ₈ are each independently at least one selected from a hydrogen atom, a halogen atom, and a hydrocarbon group having 1 to 6 carbon atoms. ] And a repeating unit represented by the following formula (2): [In the above formula (2), R _{9 to} R ₁₆ are each independently selected from a hydrogen atom, a halogen atom and a hydrocarbon group having 1 to 6 carbon atoms, and X is a hydrocarbon group having 1 to 15 carbon atoms. ] It consists mainly of the polycarbonate which consists of the repeating unit represented by these, and the repeating unit represented by said Formula (1) is 30-80 mol% of the whole, and the surface smoothness of the gas barrier layer (B) formation surface is SRa. Is 10 nm or less, and a transparent film having a gas barrier property. 2. The gas barrier layer (B) is Si, Al, T
The gas barrier transparent film according to claim 1, which is an inorganic material of an oxide, a fluoride, a nitride or an oxynitride of at least one metal selected from i, Mg and Zr or a mixture of two or more metals. 3. The gas barrier layer (B) is composed of a silicon oxide thin film containing silicon and oxygen as main components, the ratio of oxygen atoms to silicon atoms is 1.5 or more and less than 2, and the film thickness is 1 n.
The gas barrier transparent film according to any one of claims 1 to 2, which has a range of m to 1 µm. 4. The transparent polymer substrate (S) has a total light transmittance of 85% or more and a three-dimensional refractive index represented by the following formula (A).
And (B) are satisfied at the same time.
4. The transparent film having gas barrier properties according to any one of 3 to 3. | R (550) | ≦ 20 (nm) (A) K = | [nz− (nx + ny) / 2] × d | ≦ 100 (nm) (B) [In the above formula (A), R (550) is Wavelength 550n
It is an in-plane retardation of the transparent polymer substrate (S) with respect to light of m, and in the formula (B), nx, ny, and nz are x-axes with the thickness direction of the transparent polymer substrate (S) as the z-axis, y-axis, z
It is a three-dimensional refractive index for light having a wavelength of 550 nm in the axial direction, and d is the thickness of the transparent polymer substrate (S). ] 5. The transparent polymer substrate (S) has a wavelength of 450 n.
The in-plane retardation for light of m is R (450), wavelength is 550
The gas barrier transparent film according to claim 1, wherein R (450) / R (550) ≦ 1.06, where R (550) is the in-plane retardation for nm light. 6. The gas barrier transparent film according to claim 1, wherein the transparent polymer substrate (S) has a dimensional change rate of 0.1% or less after heat treatment at 180 ° C. for 2 hours. 7. The oxygen permeability P _{1 at a} relative humidity of 0% satisfies the following formula (I), and the water vapor permeability P _{2 at a} relative humidity of 100% satisfies the following formula (II). The gas barrier transparent film according to any one of claims 1 to 6. ^{_{P 1 <1 × 10 7 exp}} (-5000 / T) [cc / m 2 / 24hr / atm] (I) P 2 <5 × 10 11 exp (-8000 / T) [g / m 2 / 24hr] ( II) [In the above formulas (I) and (II), T is an absolute temperature (K)
Is the measurement temperature for oxygen permeability and water vapor permeability, 8. The gas barrier transparent film according to claim 1, which has at least one coating layer (C) having a crosslinked structure. 9. The gas barrier transparent film according to claim 1, wherein the gas barrier transparent film has a transparent conductive layer (E) on at least one surface. 10. The gas barrier according to claim 1, which has a hardness of 18 or more and a plastic deformation rate of 50% or less as measured by an ultra-micro hardness meter. Transparent film. 11. A liquid crystal display device or an organic EL display device, comprising the gas barrier transparent film according to claim 1.