JP2003188077A5 - - Google Patents
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- JP2003188077A5 JP2003188077A5 JP2001386424A JP2001386424A JP2003188077A5 JP 2003188077 A5 JP2003188077 A5 JP 2003188077A5 JP 2001386424 A JP2001386424 A JP 2001386424A JP 2001386424 A JP2001386424 A JP 2001386424A JP 2003188077 A5 JP2003188077 A5 JP 2003188077A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- main body
- hot air
- apparatus main
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (2)
上面に連通する複数の通風孔が形成された装置本体と、
上記通風孔から装置本体の上面側に熱風を供給する熱風供給手段と、
上記装置本体の上面に設けられ上記基板の周縁部を支持する支持手段と、
上記熱風供給手段から上記装置本体の上面側に供給された熱風を上記装置本体の上面側から排出する排出手段とを具備すること
を特徴とする基板乾燥装置。In a substrate drying apparatus that forms a functional thin film by heating and drying the solution applied to the upper surface of the substrate,
An apparatus main body formed with a plurality of ventilation holes communicating with the upper surface ;
Hot air supply means for supplying hot air from the ventilation hole to the upper surface side of the apparatus body;
A support means provided on the upper surface of the apparatus main body for supporting the peripheral edge of the substrate;
A substrate drying apparatus comprising: discharge means for discharging hot air supplied from the hot air supply means to the upper surface side of the apparatus main body from the upper surface side of the apparatus main body.
ホットプレートと、
このホットプレートの上面に設けられホットプレートによって加熱される上記基板の下面を支持する支持手段と、
上記基板の上面側に設けられこの基板の上方から基板に向けて供給される気体を基板の上面の所定方向に沿って流す整流手段と
を具備したことを特徴とする基板乾燥装置。In a substrate drying apparatus that forms a functional thin film by heating and drying the solution applied to the upper surface of the substrate,
A hot plate,
Support means for supporting the lower surface of the substrate which is provided on the upper surface of the hot plate and is heated by the hot plate;
A substrate drying apparatus, comprising: a rectifying unit that is provided on an upper surface side of the substrate and flows a gas supplied from above the substrate toward the substrate along a predetermined direction of the upper surface of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001386424A JP4224235B2 (en) | 2001-12-19 | 2001-12-19 | Substrate dryer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001386424A JP4224235B2 (en) | 2001-12-19 | 2001-12-19 | Substrate dryer |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003188077A JP2003188077A (en) | 2003-07-04 |
JP2003188077A5 true JP2003188077A5 (en) | 2005-07-28 |
JP4224235B2 JP4224235B2 (en) | 2009-02-12 |
Family
ID=27595580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001386424A Expired - Fee Related JP4224235B2 (en) | 2001-12-19 | 2001-12-19 | Substrate dryer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4224235B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3718688B2 (en) | 2003-06-17 | 2005-11-24 | 東京エレクトロン株式会社 | Heating device |
JP4662479B2 (en) * | 2006-05-30 | 2011-03-30 | 東京エレクトロン株式会社 | Heat treatment equipment |
JP5144299B2 (en) * | 2008-02-12 | 2013-02-13 | 光洋サーモシステム株式会社 | Vacuum dryer |
JP5786487B2 (en) * | 2011-06-22 | 2015-09-30 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
CN104681402B (en) * | 2015-03-16 | 2018-03-16 | 京东方科技集团股份有限公司 | Substrate heating equipment and substrate heating method |
KR102426224B1 (en) * | 2017-11-15 | 2022-07-28 | 주식회사 케이씨텍 | Substrate heating apparatus and substrate treating system having the same |
CN110207470A (en) * | 2019-05-27 | 2019-09-06 | 武汉华星光电半导体显示技术有限公司 | Drying device |
-
2001
- 2001-12-19 JP JP2001386424A patent/JP4224235B2/en not_active Expired - Fee Related
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