JP2003188015A - 集積回路上に平形に形成された誘導マイクロセンサ - Google Patents

集積回路上に平形に形成された誘導マイクロセンサ

Info

Publication number
JP2003188015A
JP2003188015A JP2002313945A JP2002313945A JP2003188015A JP 2003188015 A JP2003188015 A JP 2003188015A JP 2002313945 A JP2002313945 A JP 2002313945A JP 2002313945 A JP2002313945 A JP 2002313945A JP 2003188015 A JP2003188015 A JP 2003188015A
Authority
JP
Japan
Prior art keywords
segment
microsensor
inductive
integrated circuit
long
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002313945A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003188015A5 (enExample
Inventor
Pierre Andre Farine
ピエール・アンドレ・ファリーン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asulab AG
Original Assignee
Asulab AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asulab AG filed Critical Asulab AG
Publication of JP2003188015A publication Critical patent/JP2003188015A/ja
Publication of JP2003188015A5 publication Critical patent/JP2003188015A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
JP2002313945A 2001-11-06 2002-10-29 集積回路上に平形に形成された誘導マイクロセンサ Pending JP2003188015A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01204214A EP1308969B1 (fr) 2001-11-06 2001-11-06 Micro-capteur inductif formé à plat sur un substrat
EP01204214.9 2001-11-06

Publications (2)

Publication Number Publication Date
JP2003188015A true JP2003188015A (ja) 2003-07-04
JP2003188015A5 JP2003188015A5 (enExample) 2005-10-27

Family

ID=8181186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002313945A Pending JP2003188015A (ja) 2001-11-06 2002-10-29 集積回路上に平形に形成された誘導マイクロセンサ

Country Status (4)

Country Link
US (1) US20030085790A1 (enExample)
EP (1) EP1308969B1 (enExample)
JP (1) JP2003188015A (enExample)
DE (1) DE60138388D1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008066141A1 (fr) * 2006-11-29 2008-06-05 Linkcom Manufacturing Co., Ltd. Bobine
JP2008141202A (ja) * 2006-11-29 2008-06-19 Ud Tech Kk コイル装置
JP2008141201A (ja) * 2006-11-29 2008-06-19 Holy Loyalty Internatl Co Ltd コイル装置
US7999650B2 (en) 2005-11-30 2011-08-16 Ryutaro Mori Coil device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187179B1 (en) * 2005-10-19 2007-03-06 International Business Machines Corporation Wiring test structures for determining open and short circuits in semiconductor devices
CN109801769B (zh) * 2017-11-16 2021-06-11 世界先进积体电路股份有限公司 电感结构
US10600556B2 (en) * 2018-01-04 2020-03-24 Vanguard International Semiconductor Corporation Inductor structure
JP7176435B2 (ja) * 2019-02-15 2022-11-22 株式会社村田製作所 インダクタ部品
DE102021122810A1 (de) 2021-09-03 2023-03-09 Turck Holding Gmbh Miniaturisierter, induktiver Näherungssensor und Verfahren zur Detektion eines Erfassungskörpers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
DE4205084A1 (de) * 1992-02-17 1993-09-02 Karl Harms Handels Gmbh & Co K Vorrichtung zum empfangen elektromagnetischer wellen, insbesondere fuer diebstahlsicherungssysteme
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7999650B2 (en) 2005-11-30 2011-08-16 Ryutaro Mori Coil device
WO2008066141A1 (fr) * 2006-11-29 2008-06-05 Linkcom Manufacturing Co., Ltd. Bobine
WO2008066143A1 (en) * 2006-11-29 2008-06-05 Linkcom Manufacturing Co., Ltd. Transformer device
JP2008141202A (ja) * 2006-11-29 2008-06-19 Ud Tech Kk コイル装置
JP2008141201A (ja) * 2006-11-29 2008-06-19 Holy Loyalty Internatl Co Ltd コイル装置

Also Published As

Publication number Publication date
DE60138388D1 (de) 2009-05-28
EP1308969A1 (fr) 2003-05-07
EP1308969B1 (fr) 2009-04-15
US20030085790A1 (en) 2003-05-08

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