DE60138388D1 - Induktiver Mikrosensor, flach hergestellt auf einem Substrat - Google Patents

Induktiver Mikrosensor, flach hergestellt auf einem Substrat

Info

Publication number
DE60138388D1
DE60138388D1 DE60138388T DE60138388T DE60138388D1 DE 60138388 D1 DE60138388 D1 DE 60138388D1 DE 60138388 T DE60138388 T DE 60138388T DE 60138388 T DE60138388 T DE 60138388T DE 60138388 D1 DE60138388 D1 DE 60138388D1
Authority
DE
Germany
Prior art keywords
microsensor
inductive
substrate
fabricated flat
fabricated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60138388T
Other languages
English (en)
Inventor
Pierre-Andre Farine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asulab AG
Original Assignee
Asulab AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asulab AG filed Critical Asulab AG
Application granted granted Critical
Publication of DE60138388D1 publication Critical patent/DE60138388D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/003Printed circuit coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
DE60138388T 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat Expired - Lifetime DE60138388D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01204214A EP1308969B1 (de) 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat

Publications (1)

Publication Number Publication Date
DE60138388D1 true DE60138388D1 (de) 2009-05-28

Family

ID=8181186

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60138388T Expired - Lifetime DE60138388D1 (de) 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat

Country Status (4)

Country Link
US (1) US20030085790A1 (de)
EP (1) EP1308969B1 (de)
JP (1) JP2003188015A (de)
DE (1) DE60138388D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187179B1 (en) * 2005-10-19 2007-03-06 International Business Machines Corporation Wiring test structures for determining open and short circuits in semiconductor devices
WO2007063884A1 (ja) * 2005-11-30 2007-06-07 Holy Loyalty International Co., Ltd. 面状インダクタ装置
JP4904503B2 (ja) * 2006-11-29 2012-03-28 隆太郎 森 コイル装置
JP4968588B2 (ja) * 2006-11-29 2012-07-04 隆太郎 森 コイル装置
TWI425535B (zh) * 2006-11-29 2014-02-01 Ryutaro Mori 線圈裝置
CN109801769B (zh) * 2017-11-16 2021-06-11 世界先进积体电路股份有限公司 电感结构
US10600556B2 (en) * 2018-01-04 2020-03-24 Vanguard International Semiconductor Corporation Inductor structure
DE102021122810A1 (de) 2021-09-03 2023-03-09 Turck Holding Gmbh Miniaturisierter, induktiver Näherungssensor und Verfahren zur Detektion eines Erfassungskörpers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
DE4205084A1 (de) * 1992-02-17 1993-09-02 Karl Harms Handels Gmbh & Co K Vorrichtung zum empfangen elektromagnetischer wellen, insbesondere fuer diebstahlsicherungssysteme
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils

Also Published As

Publication number Publication date
EP1308969B1 (de) 2009-04-15
JP2003188015A (ja) 2003-07-04
EP1308969A1 (de) 2003-05-07
US20030085790A1 (en) 2003-05-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition