EP1308969A1 - Induktiver Mikrosensor Flach hergestelt auf einem Substrat - Google Patents

Induktiver Mikrosensor Flach hergestelt auf einem Substrat Download PDF

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Publication number
EP1308969A1
EP1308969A1 EP01204214A EP01204214A EP1308969A1 EP 1308969 A1 EP1308969 A1 EP 1308969A1 EP 01204214 A EP01204214 A EP 01204214A EP 01204214 A EP01204214 A EP 01204214A EP 1308969 A1 EP1308969 A1 EP 1308969A1
Authority
EP
European Patent Office
Prior art keywords
segment
micro
inductive
segments
long
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01204214A
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English (en)
French (fr)
Other versions
EP1308969B1 (de
Inventor
Pierre-André Farine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asulab AG
Original Assignee
Asulab AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asulab AG filed Critical Asulab AG
Priority to DE60138388T priority Critical patent/DE60138388D1/de
Priority to EP01204214A priority patent/EP1308969B1/de
Priority to US10/259,570 priority patent/US20030085790A1/en
Priority to JP2002313945A priority patent/JP2003188015A/ja
Publication of EP1308969A1 publication Critical patent/EP1308969A1/de
Application granted granted Critical
Publication of EP1308969B1 publication Critical patent/EP1308969B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an inductive micro-sensor comprising a micro-coil formed flat on a substrate, and more particularly such a micro-sensor integrated into a microelectronic circuit board of an inductive device detection or measurement.
  • induction coils made by winding a wire conductor on a core having a diameter of the order of 30 to 50 mm are used for a long time in industry, for example to detect the proximity of objects metallic or their appearance defects. These coils were first used as a model for go to a smaller scale, with a diameter of the order of a millimeter. This miniaturization allows these coils to be used in microsystems, for very numerous applications, for example to produce inductive sensors proximity for piece counting, for safety devices, or for servos such as angular control of a stepper motor of a movement watchmaker. These coils with wound wire allow to have a sufficient signal high but the coil itself still has a bulk which is a disadvantage in certain applications, in particular in the watchmaking field where it is the rule for all movement components to have the highest height possible and occupy the smallest possible area.
  • these micro-coils were then produced in planar form by conformation of a conductive material on a substrate according to known techniques for producing the tracks of a printed circuit. Quite naturally, the coil was formed by a series of segments leading to a spiral-type structure with a rectangular or square outline. A strong reduction in the inductance is then observed. According to the work published by Ph. A. Passeraub & col. ("Metallic profile and coin imaging using an inductive proximity sensor microsystem" Sensors and Actuators A, vol. 66 (1998), pp 225-230 and "First integrated inductive proximity sensor with on-chip CMOS read out circuit and electrodeposited 1mm flat coil "Sensors Series, Eurosensors XII, vol.
  • the invention therefore aims to overcome the drawbacks of the aforementioned prior art in providing a microsensor having a flat coil with spiral winding at rectangular or square contour, allowing a fairly high inductance, and can be produced in a simple way with a minimum of waste.
  • the invention relates to an inductive micro-sensor comprising on a substrate a flat micro-coil formed by long conductive segments at high aspect ratio, each segment being arranged relative to the next segment in a perpendicular direction to form a spiral-like structure at generally rectangular or square outline.
  • the micro-coil is characterized in that that each long segment is connected to the next long segment by means of a short segment forming with the two long segments angles ⁇ and ⁇ 'greater than 90 °.
  • Figures 1 to 3 show an inductive microsensor of the prior art for example for performing the angular detection of a mobile in a movement, as described for example in European patent EP 0 952 426.
  • the microphone -sensor consists of a flat coil 1 disposed on the wafer 3 of a printed circuit (not shown) comprising contact pads 5 for transmitting signals, for example to a servo unit.
  • the segments S i of this winding are produced by known techniques, such as screen printing or photolithography with electrodeposition. As shown in Figure 2, the segments have a low aspect ratio (height to width quotient less than 1).
  • the angle ⁇ formed between a large segment S i and a small segment s; and the angle ⁇ 'formed by the small segment s i and a following large segment S i + 1 is greater than 90 °.
  • the winding being preferably regular, the angle ⁇ is preferably equal to ⁇ ′, that is to say 135 ° for all the connection zones of the large segments S i .
  • the segments S i and s i can be produced by known techniques of photolithography and electroplating. They can also, and preferably be produced by the "bumping" technique consisting of depositing an additional layer of gold on the surface of the integrated circuit, in particular above the areas of the contact pads, possibly above the last layer. insulation. This technique allows, thanks to the excellent conductivity of gold to obtain optimal interconnectivity, as well as extremely low resistance values for the structures produced on the insulation layer of the integrated circuit.
EP01204214A 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat Expired - Lifetime EP1308969B1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE60138388T DE60138388D1 (de) 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat
EP01204214A EP1308969B1 (de) 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat
US10/259,570 US20030085790A1 (en) 2001-11-06 2002-09-30 Inductive micro-sensor formed flat on an integrated circuit
JP2002313945A JP2003188015A (ja) 2001-11-06 2002-10-29 集積回路上に平形に形成された誘導マイクロセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01204214A EP1308969B1 (de) 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat

Publications (2)

Publication Number Publication Date
EP1308969A1 true EP1308969A1 (de) 2003-05-07
EP1308969B1 EP1308969B1 (de) 2009-04-15

Family

ID=8181186

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01204214A Expired - Lifetime EP1308969B1 (de) 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat

Country Status (4)

Country Link
US (1) US20030085790A1 (de)
EP (1) EP1308969B1 (de)
JP (1) JP2003188015A (de)
DE (1) DE60138388D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187179B1 (en) * 2005-10-19 2007-03-06 International Business Machines Corporation Wiring test structures for determining open and short circuits in semiconductor devices
US7907043B2 (en) * 2005-11-30 2011-03-15 Ryutaro Mori Planar inductor
JP4968588B2 (ja) * 2006-11-29 2012-07-04 隆太郎 森 コイル装置
JP4904503B2 (ja) * 2006-11-29 2012-03-28 隆太郎 森 コイル装置
WO2008069098A1 (ja) * 2006-11-29 2008-06-12 Holy Loyalty International Co., Ltd. コイル装置
CN109801769B (zh) * 2017-11-16 2021-06-11 世界先进积体电路股份有限公司 电感结构
US10600556B2 (en) * 2018-01-04 2020-03-24 Vanguard International Semiconductor Corporation Inductor structure
DE102021122810A1 (de) 2021-09-03 2023-03-09 Turck Holding Gmbh Miniaturisierter, induktiver Näherungssensor und Verfahren zur Detektion eines Erfassungskörpers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
DE4205084A1 (de) * 1992-02-17 1993-09-02 Karl Harms Handels Gmbh & Co K Vorrichtung zum empfangen elektromagnetischer wellen, insbesondere fuer diebstahlsicherungssysteme
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
DE4205084A1 (de) * 1992-02-17 1993-09-02 Karl Harms Handels Gmbh & Co K Vorrichtung zum empfangen elektromagnetischer wellen, insbesondere fuer diebstahlsicherungssysteme
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PASSERAUB P A ET AL: "First integrated inductive proximity sensor with on-chip CMOS readout circuit and electrodeposited 1 mm flat coil", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 76, no. 1-3, 30 August 1999 (1999-08-30), pages 273 - 278, XP004184448, ISSN: 0924-4247 *

Also Published As

Publication number Publication date
EP1308969B1 (de) 2009-04-15
JP2003188015A (ja) 2003-07-04
US20030085790A1 (en) 2003-05-08
DE60138388D1 (de) 2009-05-28

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