JP2003181636A - Solder feeding device and solder printing machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder feeding device, in which a fluid-state solder can surely be fed from a flexible container housing the solder to a feed object side, which can be miniaturized, and whose cost can be reduced, and to provide a solder printing machine. <P>SOLUTION: The solder feeding device 10 for feeding a fluid-state solder H housed in a flexible container 300 to a feed object side is provided with following sections: a container winding section 74 for winding the container 300 by freely detachably holding a base member 70 and the container 300, which is held by the member 70 and houses the solder H, and by rotating; a pressure exerting section 76 which makes the solder H in the container 300 discharged from an opening part 305 by rotating in such a state that it clamps the container and by exerting pressure to the container, when winding the container 300 by operating the container winding section 74 held by the base member 70; and a mounting section 78 for freely detachably mounting the base member onto the feed object side. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supply device and a solder printer for supplying a fluid-like solder contained in a container to a supply target side.

[0002]

2. Description of the Related Art When a fluid solder, for example, cream solder is automatically supplied to a circuit board, cream solder contained in a syringe may be used. The cream solder that has entered the syringe gradually comes out from the tip of the syringe due to air pressure, and the cream solder that comes out is supplied to the circuit board side by squeezing. However, such a cream solder contained in a syringe has a problem that the syringe container itself is expensive and a part of the cream solder contained in the syringe, for example, the last 50 g of the cream solder remains in the syringe. The disadvantage is that it does.

Therefore, the cream solder contained in the laminate pack is used. The cream solder in the laminate pack is used as a mask of a solder printer by using a solder supply device for automatically supplying the solder. It can be supplied to the plate.

A conventional solder supply device 1000 shown in FIG.
Has an inclined base 1011 and rollers 1131 and 1132 that move on the inclined surface and a motor 1141. When the motor 1141 is operated by the control of the computer, the rollers 1131 and 1132 move the container 1300.
Press the cream solder H in the inside, and the cream solder H is hole 1
The structure is automatically supplied onto the mask plate 1211 of the solder printer 1200 through 203. The squeegees 1215 and 1216 apply the cream solder H to the mask plate 1211 by moving in the directions T2 and D2. As a result, cream solder H
Can print the cream solder H at a predetermined position on the substrate 1206 side through the needle 1212 of the mask plate 1211. It can also be used for a general screen printing machine without a needle.

[0005]

However, the use of the above-described conventional solder supply device 1000 has the following problems. Since the solder supply device 1000 has a configuration capable of automatically supplying the cream solder H, it is computer-controlled as the solder supply timing. In this computer, it is necessary to set the supply timing of the cream solder and the supply timing for supplying the substrate 1206 under the mask plate 1211, and the cost is high, for example, about several hundred thousand yen to several million yen or more. turn into. Further, due to the demand for downsizing of the solder printing machine 1200, there is a limitation in mounting such a relatively large solder supply device 1000 on the solder printing machine 1200, and the solder supply device itself is installed in the solder printing machine 1200. Cannot be incorporated.

Therefore, the present invention solves the above-mentioned problems, and can reliably supply the solder to the supply target side from a container having a flexibility for accommodating the fluid-like solder, thereby reducing the size and cost. It is an object of the present invention to provide a solder supply device and a solder printing machine capable of achieving the above.

[0007]

The invention according to claim 1 is a solder supply device for supplying fluid-like solder contained in a flexible container to a supply target side, and a base member and the base member. And a container winding section for winding the container by detachably holding and rotating the container containing the solder, and a container winding section held by the base member. When the container is wound by operation, the base member is supplied with a pressure applying unit that rotates in a sandwiched state to apply pressure to the container to discharge the solder in the container from the opening of the container. And a mounting portion for detachably mounting on a target side.

In the invention of claim 1, the container winding portion is
It is held by the base member, and this container winding part is
The container containing the solder is detachably held and rotated to wind the container. The pressure applying part is held by the base member.When the container is wound by the operation of the container winding part, the pressure applying part is rotated in a sandwiched state to apply pressure to the container to apply the solder in the container. Is discharged through the opening of the container. The attachment portion detachably attaches the base member to the supply target side. Thus, the solder in the container can be reliably discharged from the opening of the container by applying a pressure to the container with a simple structure.
The base member can be detachably attached to the supply target side by the attachment portion.

Since the inclined surface on which the container of cream solder is placed is not required unlike the conventional case, the container is wound up by the container winding section while holding the container in a vertical state, and as a result, the container is sandwiched by applying pressure. This allows the solder to be discharged and the size and cost of the solder supply device can be reduced.

According to a second aspect of the present invention, in the solder supply apparatus according to the first aspect, the supply target is a solder printing machine for printing the solder on a circuit board, and the base member is the solder printing machine. In the machine, the squeegee holding portion holding the squeegee for applying the solder to the screen is detachably attached using the attaching portion. In the second aspect, the supply target is a solder printer for printing solder on the circuit board. The base member is attached to the squeegee holding portion of the solder printing machine and can be detachably attached, and the solder supply device can be incorporated in the solder printing machine.

According to a third aspect of the present invention, in the solder supply apparatus according to the first aspect, the container winding section includes a winding roller and a motor for rotating the winding roller.
A hook that is provided on the winding roller and detachably holds a part of the container. In claim 3,
A part of the container is detachably held by the hook of the container winding portion, and the winding roller is rotated by the operation of the motor. As a result, the container can be wound around the winding roller.

According to a fourth aspect of the present invention, in the solder supply apparatus according to the first aspect, the pressure applying section applies a pressure to the container while sandwiching the container, and a second pressure roller that faces the first pressure roller. It has a pressure roller. According to the fourth aspect, the container can be sandwiched by the first pressure roller and the second pressure roller of the pressure applying section to apply the pressure.

According to a fifth aspect of the present invention, in the solder supply apparatus according to the fourth aspect, the pressure applying unit is configured to hold the first container when the container is sandwiched between the first pressure roller and the second pressure roller. It has an interval setting canceling section for expanding the setting interval between the pressure roller and the second pressure roller. According to a fifth aspect of the present invention, the interval setting canceling portion widens the set interval between the first pressure roller and the second pressure roller, thereby sandwiching the solder-containing solder vessel between the first pressure roller and the second pressure roller. It can be done easily. Also, the used container can be easily removed from between the first pressure roller and the second pressure roller.

According to a sixth aspect of the present invention, there is provided a solder supply device for supplying the fluid-like solder contained in a flexible container to a supply target side, and solder printing for printing the solder on a print target. And a container for winding the container by holding a base member and the container, which is held by the base member and contains the solder, in a vertically detachable manner and rotating the container. When the container is wound by the winding unit and the base member and the container is wound by the operation of the container winding unit, the solder in the container is rotated by pressing in a pinched state to apply pressure to the container. And a mounting portion for detachably mounting the base member to the solder printing machine. In the sixth aspect, the container winding section is held by the base member, and the container winding section winds the container by detachably holding the container containing the solder and rotating the container. The pressure applying part is held by the base member.When the container is wound by the operation of the container winding part, the pressure applying part is rotated in a sandwiched state to apply pressure to the container to apply the solder in the container. Is discharged through the opening of the container. The attachment portion detachably attaches the base member to the supply target side. Thus, the solder in the container can be reliably discharged from the opening of the container by applying a pressure to the container with a simple structure. The base member can be detachably attached to the supply target side by the attachment portion.

Since there is no need for an inclined surface on which the container of cream solder is placed as in the conventional case, the container is wound up by the container winding section while holding the container in a vertical state, and as a result, pressure is applied to the container to sandwich the container. This allows the solder to be discharged and the size and cost of the solder supply device can be reduced.

According to a seventh aspect of the present invention, in the solder printing machine according to the sixth aspect, there is provided a solder printing machine for printing the solder on a circuit board, wherein the base member is provided on the screen of the solder printing machine. For the squeegee holding part that holds the squeegee for applying solder,
It is detachably attached using the attachment portion. In claim 7, the supply target is a solder printer for printing solder on a circuit board. The base member is attached to the squeegee holding portion of the solder printing machine and can be detachably attached, and the solder supply device can be incorporated in the solder printing machine.

According to an eighth aspect of the present invention, in the solder printer according to the sixth aspect, the container winding section is provided on the winding roller, a motor for rotating the winding roller, and the winding roller. And a hook that detachably holds a part of the container. According to the eighth aspect, a part of the container is detachably held by the hook of the container winding portion, and the winding roller is rotated by the operation of the motor. As a result, the container can be wound around the winding roller. According to a ninth aspect of the invention, in the solder printing machine according to the sixth aspect, the pressure applying unit includes a first pressure roller that applies pressure with the container sandwiched between the first pressure roller and a second pressure roller that faces the first pressure roller. Have.

In the ninth aspect, the pressure can be applied by sandwiching the container by the first pressure roller and the second pressure roller of the pressure applying section. According to a tenth aspect of the present invention, in the solder printing machine according to the ninth aspect, the pressure applying section is provided with the first pressure roller and the first pressure roller when sandwiching the container between the first pressure roller and the second pressure roller. The solder printing machine according to claim 9, further comprising an interval setting canceling portion that expands a setting interval of the second pressure roller. According to the tenth aspect, the interval setting canceling section widens the set interval between the first pressure roller and the second pressure roller, thereby facilitating the work of sandwiching the solution containing the solder between the first pressure roller and the second pressure roller. Can be done. Also, the used container can be easily removed from between the first pressure roller and the second pressure roller.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiment described below is a preferred specific example of the present invention,
Although various technically preferable limitations are given, the scope of the present invention is not limited to these forms unless otherwise specified in the description below.

FIG. 1 shows a preferred embodiment of a solder printer having the solder supply device of the present invention. Figure 1
The solder supply device 10 shown in is a small solder supply device that can be detachably attached to the squeegee holding portion 24 of the solder printing machine 20 and can be incorporated into the inside of the solder printing machine 20.

The structure of the solder printer 20 will be described first. The solder printer 20 includes a main body 26, a squeegee holding portion 24, a squeegee guide portion 28, a board holding portion 30, and the like. The squeegee holder 24 is the first squeegee 3
4 and a second squeegee 36 and cylinders 35 and 37. The cylinder 35 of the squeegee holder 24 is the controller 1
When activated by the command 00, the first squeegee 34 can move up and down in the Z direction. When the cylinder 37 operates according to a command from the control unit 100, the second squeegee 3
6 can move up and down in the Z direction.

The cylinder 35 and the cylinder 37 are provided with stoppers 39 and 41 for restricting the descending amounts of the first squeegee 34 and the second squeegee 36 in the Z direction, respectively. The squeegee guide unit 28 holds the squeegee holding unit 24 at X1.
It is a device for making a linear movement in the X-direction and the X2 direction. The squeegee guide portion 28 has a motor 44 and a guide rail 46. By operating the motor 44, the squeegee holding unit 24 can move along the guide rail 46 in the X1 direction and the opposite X2 direction. The X1 direction and the X2 direction are horizontal directions. The guide 46 is the main body 2
It is located in the upper part of the inside of 6. The operation of the motor 44 is performed by the control unit 100. The board holding unit 30 is a device for holding the circuit board P by vacuum suction and holding it horizontally.
The backup base 48 of the board holding unit 30 holds the circuit board P in the set position shown in FIG. 1 by raising the circuit board P in the Z direction. The backup base 48 can detachably vacuum-adsorb the circuit board P by the operation of the vacuum machine rear portion 50.

The backup base 48 moves up and down in the Z direction by the operation of the motor 54. The motor 54 is controlled by a command from the control unit 100. Screen 60
Is for printing the cream solder H at a predetermined position on the circuit board P. The screen 60 is horizontally positioned above the circuit board P which is set at a predetermined position. The cream solder H is placed on the top of the screen 60. The cream solder H is also called a solder solder paste.

As shown in FIG. 1, the cream solder H is supplied onto the screen 60 from the solder supply device 10 side, and the squeegee holding portion 24 has the X1 direction and the X direction.
By moving in two directions, the first squeegee 34 and the second squeegee 36 move while closely contacting each other on the screen 60, and the cream solder H is applied onto the screen 60. For example, in the example of FIG. 1, the first squeegee 3
4 reaches the surface of the circuit board P through the screen 60. In this state, the squeegee holder 24 moves in the X1 direction, so that the cream solder H is applied onto the circuit board P. After that, the first squeegee 34 rises and the second squeegee 36 descends, and after the first squeegee 36 reaches the top of the screen 60, the squeegee holder 2
When 4 moves in the direction of X2, the second squeegee 36 will apply the cream solder H onto the circuit board P.

The solder supply device 10 shown in FIG. 1 is a small device for supplying the cream solder H onto the screen 60. The solder supply device 10 has a small structure as shown in FIG. 2, and is detachably attached to the squeegee holding portion 24 of the solder printing machine 20. Solder supply device 10
1 shows the cream solder H (at the position of the fluid-like solder) contained in the laminate pack 300 as the container shown in FIG. 3 while applying pressure as shown in FIGS. 1 and 4. It is a device for supplying on the screen 60. Before explaining the structure of the solder supply device 10, FIG.
An example of the structure of the laminate pack 300 will be described with reference to FIG. FIG. 3 is a perspective view showing an example of the container 300 of the cream solder H. The container 300 is a flexible, hermetically sealed, flat-plate, transparent or translucent container. That is, the container 300 is a bag-shaped container in which a plurality of resin films are laminated, for example, a laminated pack in which a transparent bag made of polyethylene is thermocompression bonded. At least four corners of the container 300, in this example, the upper portion of the container 300, the ears 3 are provided.
01 and two holes 302 are formed, and an ear portion 303 is formed in the lower portion of the container 300. At the bottom of the container 300, for example, a substantially V-shaped sealing portion 304 is provided. The solder supply port 305 for the cream solder H can be formed by cutting the sealed portion 304 along the cut line AA, for example.

The structure of the solder supply apparatus 10 will be described with reference to FIGS. 2, 4, and 5. As shown in FIG. 2, the solder supply device 10 is generally provided with a base member 7
0, a container winding portion 74, a pressure applying portion 76, and a mounting portion 78. One base member 70 is provided on each of the left and right sides in order to hold the container winding unit 74, the pressure applying unit 76, and the mounting unit 78 between them. The base member 70 and the mounting portion 78 are made of metal, for example, iron. The base members 70 are flat plate members and are located facing each other with a space.

The container winding section 74 shown in FIG. 2 includes a winding roller 80, a motor 82 and a power switch box 84.
have. The take-up roller 80 is a columnar or cylindrical member, and is made of metal, plastic other than metal, or rubber material. The rotary shafts 86, 86 of the winding roller 80 are rotatably attached to the base members 70, 70. Take-up roller 8
For example, two hooks 90 and 92 are provided on the outer peripheral surface of 0. These hooks 90 and 92 are shown in FIGS.
As shown in FIG. 3, the laminate pack 300 shown in FIG. 3 is detachably fitted into the holes 302, 302.

The output shaft of the motor 82 shown in FIG. 2 is attached to the rotary shaft 86 of the winding roller 80. The motor 82 is electrically connected to the power switch box 84. Forward switch 85 of power switch box 84
When the operator presses, the motor 82 rotates in the normal direction. When the motor 82 rotates in the normal direction, the winding roller 80 rotates in the R direction for winding the laminate pack 300. On the other hand, when the operator presses the reverse switch 87 of the power switch box 84, the motor 82
Is reversed. When the output shaft of the motor 82 rotates in the reverse direction, the winding roller 80 rotates in the R1 direction around the center axis CL of the winding roller 80, and the wound laminate pack 300 can be rewound.

As described above, the power switch box 84 is connected to the motor 82, and the operator simply presses the forward rotation switch or the reverse rotation switch to easily wind and rewind the laminate pack 300. You can The control of the motor 82 is performed by the control unit 100 of FIG.
Regardless of this, the operator can perform the operation only by manually operating the switch of the power switch box 84.

Next, the pressure applying section 76 will be described.
The pressure applying unit 76 of FIG. 2 includes a first pressure roller 110 and a second pressure roller 110.
It has a pressure roller 114 and an interval setting canceling section 116.

First pressure roller 110 and second pressure roller 1
14 is rotatably arranged in parallel between the base members 70, 70. The first pressure roller 110 and the second pressure roller 114 are made of an elastic material such as rubber or plastic. First pressure roller 110 and second
When the pressure rollers 114 are parallel to each other, they are in close contact with each other. The first pressure roller 110 can freely rotate about the shafts 120 and 122. Axis 120,1
22 are attached to the corresponding base members 70. Similarly, the second pressure roller 114 has a shaft 124,
It is rotatable with respect to 126. The shafts 124 and 126 are attached to the corresponding base members 70 and 70.

As shown in FIGS. 2 and 5, the first pressure roller 110 and the second pressure roller 114 are the winding roller 80.
It is located almost at the bottom of. And the first pressure roller 11
The central axis CL1 of 0 and the central axis CL of the second pressure roller 114
2 are parallel with respect to the X direction, but their central axes C
L1 and CL2 are slightly displaced in the X1 direction with respect to the central axis CL of the winding roller 80 as viewed in FIG. The X1 direction and the X2 direction are directions orthogonal to the central axes CL, CL1, CL2. The interval setting canceling unit 116 cancels the condition in which the first pressure roller 110 and the second pressure roller 114 are in close contact with each other, that is, the setting of the interval between the central axes CL1 and CL2.

Specifically, the first line shown by the solid line in FIG.
The pressure roller 110 and the second pressure roller 114 shown by the solid line are fixed in parallel so as to be in close contact with each other. However, the laminate pack 300 may be loaded with these first pressure rollers 110.
When setting work between the first pressure roller 110 and the second pressure roller 114 is performed or when the laminate pack 300 is removed from between these rollers, the first pressure roller 110 is changed from a solid line state to a two-dot chain line as It is desirable to open it by rotating in the direction. Therefore, the interval setting canceling unit 116
In order to be able to open the pressure roller 110 in the T direction, it has a rotation support portion 130 and a stop member 134. The rotation support part 130 supports the shaft 122 so as to be rotatable about the central axis CL3. Central axis CL3 is X
1, the direction of X2 and the direction perpendicular to the central axis CL. Therefore, the rotation support part 130 is provided with the member 136 of the shaft 122.
It has upper and lower bearings 138 and 140 for rotatably supporting the. These bearings 138 and 140 are fixed to the base member 70.

The stop member 134 is the first pressure roller 110.
The second pressure roller 114 has a function of holding the second pressure roller 114 in a parallel state as shown in FIG. This stopping member 134 resists the force of the spring 144 to prevent the base member 7 from moving.
Since the shaft 120 of the first pressure roller 110 is released from the base member 70 by removing it from 0, as shown in FIG. Center axis CL in T direction
It is possible to open with respect to the second pressure roller 114 centering on 3. When again holding the first pressure roller 110 and the second pressure roller 114 in close contact with each other, the stopper material 1
By pulling 34 from the base 135 against the force of the spring 144, it is possible to fix the shaft 120 and the shaft 124 in parallel to each other with the base member 70 by one touch. The base 135 is fixed to the outside of the base member 70.

Next, the structure and function of the mounting portion 78 will be described with reference to FIGS. The mounting portion 78 is a mounting member made of metal, for example, and has a U-shaped cross section in this example. The mounting portion 78 is formed with a plurality of holes 160 into which the screws 150 are fitted.

The width W of the accommodation space 155 of the mounting portion 78 shown in FIG.
Is the width W1 of the body portion 24A of the squeegee holding portion 24 of FIG.
It is almost the same as or slightly larger. Therefore, as shown in FIG. 4, by fitting the mounting portion 78 into the end portion of the main body portion 24A and screwing in the plurality of screws 150,
The solder supply device 10 can be detachably fixed to the main body portion 24A of the squeegee holding portion 24 by using the attachment portion 78.

Next, the operations of the solder supply device 10 and the solder printer 20 will be described. When the solder supply device 10 is mounted inside the solder printing machine 20 as shown in FIG. 1, the operation of the solder printing machine 20 is in a standby state.
The solder supply device 10 shown in FIG.
The squeegee holding portion 24 is fitted into the end portion of the main body portion 24A and then a plurality of screws 150 are screwed into the squeegee holding portion 24 to attach and fix the squeegee holding portion 24.
In this way, the small solder supply device 10 can be easily mounted inside the solder printing machine 20.

A laminate pack 300 having the structure shown in FIG.
Are attached in the following manner as shown in FIGS. 4 and 5. Sealed portion 304 of the laminate pack 300 of FIG.
By cutting along the cut line A-A,
A solder supply port (corresponding to an opening) 305 is formed. Then, by removing the stopper member 134 shown in FIG. 2 from the base member 70 against the base portion 135 against the force of the spring 144, the first pressure roller 110 can be opened in the T direction with respect to the second pressure roller 114. it can. After the setting of the distance between the first pressure roller 110 and the second pressure roller 114 is released in this manner, the supply port (corresponding to the opening) 305 of the laminate pack 300 is directed downward as shown in FIG. One end 311 of the laminate pack 300 shown in FIG.
The hooks 90 and 92 of FIG. 4 are inserted into the holes 302 and 302 of FIG. As a result, the one end 311 of the laminate pack 300 is detachably held by the hooks 90 and 92 of the winding roller 80.

The laminate pack 300 is positioned so as to be sandwiched between the first pressure roller 110 and the second pressure roller 114 as shown in FIG. After that, the first shown in FIG.
By binding the pressure roller 110 in the direction opposite to the T direction, the laminate pack 300 is sandwiched between the first pressure roller 110 and the second pressure roller 114 as shown in FIG. Since the first pressure roller 110 and the second pressure roller 114 are made of, for example, relatively soft rubber, the cream solder H in the laminate pack 300 is pressed by elastically pressing the front surface and the back surface of the laminate pack 300. It has a function of pushing out from the supply port 305.

As described above, after the solder supply device 10 is mounted on the solder printer 20, the screen 60
When supplying the solder paste H onto the top of the solder paste, the operator presses the forward rotation switch 85 shown in FIG. 2 in a state where the operation of the solder printing machine 20 is in a standby state. As a result, the take-up roller 80 normally rotates in the R direction, so that the laminate pack 300 is gradually taken up by the take-up roller 80. As the laminate pack 300 is wound up, the first pressure roller 110 and the second pressure roller 11
No. 4 supplies the cream solder H onto the screen 60 from the supply port 305 while pressing the laminate pack 300.

While the laminate pack 300 is being wound up, the cream solder H in the laminate pack 300 is pushed out, and a predetermined amount of cream solder H is applied to the screen 60.
When it is supplied to the above position, the operator pushes the forward rotation switch 85 shown in the figure again to stop the forward rotation operation of the motor 82.

The solder printer 20 shown in FIG. 1 is operated.
That is, when the control unit 100 of FIG. 1 operates the motor 44, the first squeegee 34, which is in close contact with the screen 60 as shown in FIGS. 1 and 4, moves the cream solder H onto the screen 60 in the X1 direction. Spread along. When the squeegee holder 24 moves from the PT1 position to the PT2 position, the control unit 100 operates the cylinder 35 and the cylinder 37. This makes the first squeegee 3
4 goes up, and instead the second squeegee 36 goes down.
When the control unit 100 or the motor 44 is operated, the squeegee holding unit 24 moves in the X2 direction and the squeegee holding unit 24 is moved.
Moves from the PT2 position to the PT1 position. As a result, the cream solder H is spread evenly on the screen 60. The screen 60 can print the spread cream solder H on a predetermined position of the substrate P. By waiting for the operation of the solder printing machine 20, the laminate pack 300 of the solder supply apparatus 10 is again activated.
From here, the cream solder H can be supplied onto the screen 60.

When the cream solder H in the laminate pack 300 shown in FIG. 4 has been completely supplied, the used laminate pack 300 can be removed from the solder supply device 10 in the following manner. In this case, the cream solder H may slightly remain in the laminate pack 300. In this case, the operator squeezes out the remaining cream solder H toward the screen 60 side with a spatula or the like. Then, the operator again removes the stopper member 134 of the interval setting canceling unit 116 of FIG. 2 and unfolds it in the T direction of the first pressure roller 110, and then the operator pushes the reverse switch 87 of FIG. The take-up roller 80 is reversed in the R1 direction. This allows the laminate pack wound on the winding roller 80 to be unwound. Laminate pack 3
One end 311 of 00 is removed from the hooks 90 and 92,
The laminate pack 300 is removed from the solder supply device 10.

By using the solder supply device 10 and the solder printer 20 provided with the solder supply device 10 as described above, the following merits are obtained. The solder supply device 10 has a simple structure, can be attached to and detached from the solder printing machine 20 afterwards, and can be mounted inside the solder printing machine 20. The solder supply device 10 is small, simple, and lightweight. Since this solder supply device 10 does not require a computer control unit or the like for controlling the operation, the cost can be reduced and the structure is simple.

Since the solder supply device 10 can be detachably set above the screen 60 to which the solder is to be supplied, even if the cream solder H drips onto the screen 60, there is no particular problem. Absent. Therefore, a device such as a shutter mechanism for closing the supply port 305 of the laminate pack 300 is unnecessary. By using a laminate pack, empty plastic containers such as syringes and pots are not required, and the weight and weight are small, which is advantageous in transportation and management. By using the laminate pack, the amount of the cream solder remaining in the laminate pack can be reduced as compared with the cream solder contained in the syringe and the cream solder contained in the pot, so that the cream solder can be effectively used.

In the solder supply device 10 described above, a motor 82 is used as shown in FIG. Instead of using this motor, of course, a manually rotatable handle may be used to allow the operator to manually rotate the take-up roller 80. In this case, the power switch box is unnecessary. As the supply target of the cream solder supplied from the solder supply device, the screen of the solder printing machine is given as an example, but in this regard, other than the screen of the solder printing machine as the supply target, other types may be used. Of course it doesn't matter.

[0047]

As described above, according to the present invention,
Therefore, the present invention solves the above-described problems, and can reliably supply the solder to the supply target side from a container having flexibility that accommodates the fluid-like solder, thereby achieving size reduction and cost reduction.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a solder printer having a preferred embodiment of a solder supply apparatus of the present invention.

FIG. 2 is a perspective view showing the structure of the solder supply device of FIG.

FIG. 3 is a perspective view showing a shape amount of a laminate pack used in the solder supply device.

FIG. 4 is a diagram showing an example in which a solder supply device is attached to a squeegee holding portion.

FIG. 5 is a side view showing a state in which a laminate pack is attached to the solder supply device.

FIG. 6 is a diagram showing an example of a solder printer equipped with a conventional solder supply device.

[Explanation of symbols]

10 ... Solder supply device, 20 ... Solder printer,
24 ... Squeegee holding part, 28 ... Squeegee guiding part, 30 ... Substrate holding part, 60 ... Screen, 7
0 ... Base member, 74 ... Container winding portion, 76
... Pressure applying part, 78 ... Mounting part, 80 ... Winding roller, 82 ... Motor, 84 ... Power switch box, 90, 92 ... Hook, 110 ... First Pressure roller 114 114 second pressure roller 300
..Laminate pack 300 (one type of container), P ...
Circuit board, H ... Cream solder (one example of fluid solder)

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Claims (10)

[Claims] 1. A solder supply device for supplying fluid-like solder contained in a flexible container to a supply target side, the base member and a solder held by the base member to accommodate the solder. When the container is removably held and rotated, the container winding unit for winding the container, and being held by the base member, when the container is wound by the operation of the container winding unit, A pressure applying portion that rotates in a sandwiched state and applies pressure to the container to discharge the solder in the container from an opening of the container, and an attachment for detachably attaching the base member to the supply target side. And a solder supply device. 2. The supply target is a solder printer for printing the solder on a circuit board, and the base member holds a squeegee for applying the solder to a screen in the solder printer. The solder supply device according to claim 1, wherein the solder supply device is detachably attached to the existing squeegee holding portion using the attachment portion. 3. The container winding section has a winding roller, a motor for rotating the winding roller, and a hook provided on the winding roller for detachably holding a part of the container. The solder supply device according to claim 1. 4. The solder supply device according to claim 1, wherein the pressure applying unit includes a first pressure roller that applies pressure while sandwiching the container, and a second pressure roller that faces the first pressure roller. 5. The interval setting release for expanding the interval between the first pressure roller and the second pressure roller when the pressure applying unit sandwiches the container between the first pressure roller and the second pressure roller. The solder supply device according to claim 4, which has a portion. 6. A solder printer that has a solder supply device for supplying a fluid-like solder contained in a flexible container to a supply target side, and prints the solder on a print target, The solder supply device includes a base member, and a container winding unit that is held by the base member and vertically holds the container that contains the solder in a detachable manner and winds the container by rotating the container. When the container is held by the base member and the container is wound by the operation of the container winding portion, the container is rotated to apply pressure to the container to open the solder in the container to the opening of the container. A solder printing machine, comprising: a pressure applying section to be discharged from the section; and a mounting section for detachably mounting the base member to the solder printing machine. 7. A solder printing machine for printing the solder on a circuit board, wherein the base member is a squeegee holding portion holding a squeegee for applying the solder to a screen in the solder printing machine. On the other hand, it is detachably attached using the attachment portion.
Solder printer described in. 8. The container winding section has a winding roller, a motor for rotating the winding roller, and a hook provided on the winding roller for detachably holding a part of the container. The solder printing machine according to claim 6. 9. The solder printing machine according to claim 6, wherein the pressure applying unit includes a first pressure roller that applies pressure while sandwiching the container, and a second pressure roller that faces the first pressure roller. 10. The interval setting canceling section, wherein the pressure applying section widens a set interval between the first pressure roller and the second pressure roller when the container is sandwiched between the first pressure roller and the second pressure roller. The solder printing machine according to claim 9, further comprising: