JP2002326338A - Solder printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder printer capable of printing a solder of a fluidized- state on an object to be surely printed while preventing the degradation oxidation of its cream solder even when a lead-free cream solder is used. SOLUTION: The solder printer comprises a solder container 460 which has a body 461 for housing the solder of the fluidized-state; a first squeegee member 470 and a second squeegee member 274 provided in the body 461 in such a manner that the first end 490 of the first squeegee member and the second end 494 of the second squeegee member form a solder supply port 463; and a rotary part generator 700 of the solder of the fluidized-state for generating the rotary part of the solder of the fluidized-stage at a space formed by the first end 490, the second end 494, and a mask member of the first end 490 and the second end 494, when the container 460 is moved in a first direction and a second direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder printing machine for printing solder in a fluid state on an object to be printed.

[0002]

2. Description of the Related Art When a liquid solder, for example, a cream solder is supplied to a substrate, the cream solder is supplied to a predetermined position on the substrate through a screen mask. Conventionally, lead solder is used as this kind of cream solder, and although the lead content is large, for example, about 35%, there is an advantage that deterioration oxidation is difficult. However, from the viewpoint of global environmental problems, it is required to use lead-free cream solder instead of leaded solder.

[0003]

However, this lead-free cream solder tends to deteriorate and oxidize in terms of alloy composition.
Particularly, the Zn-based composition is easily deteriorated and oxidized. In order to prevent the deteriorated oxidation, for example, in a reflow furnace, nitrogen is supplied to prevent the deteriorated oxidation. This Zn-based lead-free cream solder is necessary for lowering the melting point of the solder. Deterioration oxidation of lead-free cream solder may cause changes in the viscosity of the cream solder and poor soldering quality such as solder balls and solder bridges. If it is used, it is necessary to correct soldering due to poor soldering quality in a line for soldering to the board, which deteriorates the soldering quality of the board and the productivity of soldering to the board. Therefore, the present invention solves the above-mentioned problems, and even if a lead-free cream solder is used, it is possible to reliably print a fluid solder on a printing object while preventing the cream solder from being oxidized. It is an object of the present invention to provide a solder printer capable of preventing deterioration of cream solder when using lead solder in a shield mask printer.

[0004]

According to a first aspect of the present invention, there is provided a solder printing machine for printing a solder in a fluid state on an object to be printed, and a mask member arranged corresponding to the object to be printed. A solder supply port for supplying the fluid solder by receiving the fluid solder and moving along the mask member in a first direction and a second direction opposite to the first direction; And a solder container for supplying the fluid solder to a desired position of the printing object through the mask member, wherein the solder container is configured to accommodate the fluid solder. And a first squeegee member and a second squeegee member provided in the main body. A first end of the first squeegee member and a second end of the second squeegee member are connected to the solder supply port. Formed, containing the solder When moving in the first direction and the second direction, the first end and the second end form a formation space between the first end, the second end, and the mask member. Wherein the rotating part of the fluid-like solder for generating the rotating part of the fluid-like solder is constituted.

According to the first aspect, the mask member is arranged corresponding to the printing target. The solder receiving section receives the solder in the fluid state and moves in the first direction and the second direction along the mask member, so that a desired position of the printing object is passed through the mask member from the solder supply port for supplying the solder. Is supplied with a liquid solder. The main body of the solder storage section stores the solder in a fluid state. The first end of the first squeegee member and the second end of the second squeegee member form a solder supply port. When the solder accommodating part moves in the first direction or the second direction along the mask member, the first squeegee member and the second squeegee member come into close contact with the mask member,
The first end and the second end can prevent the fluid-state solder in the main body from being oxidized by the outside air. The fluid solder in the main body can be quickly and reliably supplied to a desired position on the printing object from the solder supply port through the mask member.

According to a second aspect of the present invention, in the solder printing machine according to the first aspect, the first end of the first squeegee member and the second end of the second squeegee member are on a surface of the mask member. The formation space has a trapezoidal shape when viewed in cross section. According to the second aspect, the first end and the second end are each inclined at an acute angle with respect to the surface of the mask member, and the formation space is trapezoidal in cross section. In the trapezoidal forming space, a rotating portion of the fluid solder is generated.

According to a third aspect of the present invention, there is provided the solder printing machine according to the first aspect, further comprising a solder supply device for supplying the fluid-like solder into the main body of the solder storage section. According to the third aspect, the solder in a fluid state can be supplied to the inside of the main body of the solder storage portion by the solder supply device.

According to a fourth aspect of the present invention, in the solder printing machine according to the first aspect, the fluid-like solder in the main body is circulated by rotating above the forming space in the main body. A solder circulation member is provided. According to the fourth aspect, since the solder circulating member can circulate the solder in the fluid state above the forming space in the main body, for example, the solder contained in the main body can be circulated between the first end and the second end. Supply can be ensured in time.

According to a fifth aspect of the present invention, in the solder printing machine according to the fourth aspect, in the solder circulation member, the solder accommodating portion moves in the first direction and the second direction with respect to the mask member. A rotating body that rotates by friction on the mask member that relatively moves. According to the fifth aspect, the rotating body rotates by friction with respect to the mask member. Therefore, by rotating the solder circulating member along with the rotation of the rotating body, the fluid-like solder in the main body is circulated. .

According to a sixth aspect of the present invention, in the solder printing machine according to the first aspect, the object to be printed is a circuit board,
The liquid solder is a lead-free cream solder. According to claim 6, even if lead-free cream solder is used as the fluid-like solder, the first squeegee member and the second
The close contact of the squeegee member with the mask member prevents contact between the fluid solder in the main body and the outside air, thereby preventing the oxidation phenomenon of lead-free cream solder, changes in solder viscosity and changes in solder balls. Alternatively, it is possible to prevent the occurrence of poor quality such as a solder bridge.

According to a seventh aspect of the present invention, there is provided the solder printing machine according to the first aspect, further comprising a cover member for closing the solder supply port when the solder accommodating portion is not used.
According to the present invention, when the solder accommodating portion is not used due to the end of the work, the solder located in the first end and the second end leaks from the solder inlet by closing the solder inlet with the cover member. In addition, it is possible to prevent the solder from being exposed to the outside air and being oxidized.

[0012]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 shows a preferred embodiment of a solder printing machine according to the present invention. The solder printing machine 200 has a main body 201, and the solder supply device 10 is positioned and mounted on an upper cover 202 of the main body 201. The upper cover 202 has a hole 203 and opens and closes an opening of the main body 201.

FIG. 2 shows an internal structure of the solder printing machine 200 and a structural example of the solder supply device 10. The solder supply device 10 has a base 12, a pressing portion 13, and a solder guide member 16, and the solder supply device 10
Extrude the cream solder H contained in the
The solder is supplied to the solder storage section 460 in the main body 201 via the solder guide member 16. The solder accommodating portion 460 is provided with a cream solder H in a fluid state contained in a container.
Is supplied to a predetermined portion of the substrate 206 via a needle 212 of a mask plate (one type of mask member) 211.
The cream solder H is a lead-free liquid solder contained in the container 30, but other types of lead-free solder may be used in addition to the cream solder.
The screen plate as a mask member used for the chip components on the substrate has no needles, and the substrate 20 is provided through the opening holes 211P of the mask plate 211 shown in FIG.
Print on 6.

The base 12 shown in FIG. 1 and FIG.
Although it is preferably detachably attached to 02 with a plurality of attachment screws, it may not necessarily be detachable and may be fixed. The base 12 in FIG.
It has a mounting portion 24 inclined with 2A. This mounting part 2
4 can be set at a predetermined angle θ with respect to the upper surface of the upper cover 202, for example, an angle smaller than 45 degrees.
At the time of automatic supply, the pressing portion 13 is operated by microcomputer control. A container 30 containing a fluid solder, for example, a lead-free cream solder (also referred to as solder paste) can be removably mounted on the mounting portion 24. This container 30 will be described later.

The pressing portion 13 shown in FIGS. 1 and 2 has a first roller 14, a second roller 16, and a motor 40. The pressing portion 13 is a device for pressing the cream solder H in the container 30 placed on the mounting portion 24 of the base 12 and moving while applying pressure in the T direction. The first roller 14 and the second roller 16 are parallel and almost in close contact. The first roller 14 is rotatably and horizontally held by a support arm 32. Second roller 16
Is also horizontally rotatably held by a support 34.

FIGS. 3 and 4 show examples of the structure of the pressing portion 13. FIG. In FIG. 3, the support arm 32 indicated by a solid line can move in the R direction about the center 17 of the member 15 as indicated by a two-dot chain line. The support arm 32 shown by a solid line is configured to connect the first roller 14 to the second roller 16.
However, in the state of the support arm 32 shown by the two-dot chain line, the second roller 16
Is held apart. Thus, the support arm 32
Is moved to separate the first roller 14 from the second roller 16, the one end 31 of the container 30 shown in FIGS. 1 and 2 can be easily placed on the second roller 16. Thereafter, the support arm 32 is closed in the direction opposite to the R direction and the spring 35 is set, so that the first roller 14 and the second roller 16 tightly sandwich the one end 31 of the container 30 by the force of the spring 35.

The motor 40 serving as a driving means includes a feed screw 4
2 is a motor that rotates. The feed screw 42 can position the member 15 by moving the member 15 in the T direction. The feed screw 42 is arranged in the frame 50. When the motor 40 operates, the first roller 14 and the second roller 16 together with the member 15 can move by the stroke SK. This frame 50 is a base 1 shown in FIGS.
2 is installed.

Next, an example of the structure of the cream solder container 30 will be described with reference to FIGS. 5 and 6
The container 30 shown in FIG. 1 is a flexible, closed and flat, transparent or translucent container. This container 30
For example, it is a laminate container in which various layers are laminated. The container 30 is formed into a laminate pack by, for example, thermocompression bonding with a transparent bag made of a polyethylene material, and has mounting holes 60, 60. These holes 60, 60
Are formed at one end 31 of the container 30, and holes 60, 6
By passing 0 through the metal fittings 26K, 26K of the mounting portion 24 shown in FIG. 1, the container 30 can be detachably held on the mounting portion 24 without slipping.

The container 30 contains a fluid solder, for example, a cream solder H in a sealed state. The container 30 has a tight seal line 69. The close sealing line 69 has a substantially V-shaped sealing portion 66 near the other end 64 of the container 30. This sealed part 6
6, a solder discharge portion (discharge port of container) 73 is provided. A substantially V-shaped cut line 71 is formed in the vicinity of the sealing portion 66 so that the solder discharge portion 73 is formed.
Is cut off. Thereby, the cream solder H can be discharged from the solder discharge portion 73.

FIG. 7 shows an example of a cutting jig 81 for forming the cut line 71. The cutting jig 81 has a slit hole 83 having a shape corresponding to the cut line 71. A corner of the cutting jig 81 has a corner positioning portion 85, and the corners 64A, 64A of the other end portion 64 of the container 30 in FIG. The other end 64 is positioned with respect to the cutting jig 81. And
The operator inserts a knife such as a cutter knife into the slit hole 83.
The other end 64 of the container 30 can be cut along the cut line 71. In this case, the tip portion 73A of the solder discharge portion 73 is cut. After holding the solder discharge portion 73 with the mounting hole 60 side down and the cutout jig 81 at the cut line 71 in advance, the internal cream solder H leaks out of the solder discharge portion 73 at the time of cutting. Such a thing disappears.

Next, the solder guide member 1 shown in FIGS.
6 will be described. The solder guide member 16 is connected to the solder container 4 shown in FIG.
A member for reliably and quickly guiding the cream solder H in the container 30 to the inside of the container 60. The cream solder H in the container 30 can be reliably and quickly and smoothly guided to a predetermined position on the substrate 206 via the solder guide member 16 and the solder storage section 460. The solder guide member 16 enters the main body through the hole 203 of the upper cover 202 as shown in FIG. 2, and is a tube-shaped member having a flexible structure. For example, a vinyl tube can be used. However, the solder guide member 16 is not limited to a vinyl tube, but may be a silicon tube or a poly tube.

The solder guide member 16 is also called a flexible tube. One end 16 A of the solder guide member 16 is detachably attached to and connected to a solder discharge portion 73 of the container 30. As shown in FIG. 2, the other end 16 </ b> B of the solder guide member 16 is located in the solder receiving section 460. The length of the solder guide member 16 is long enough to cover the range in which the solder containing portion 460 moves in the directions D1 and D2 from the position P1 to the position P2.

FIG. 8 shows one end 16 of the solder guide member 16.
A and solder discharge part 73 of container 30 and adjuster A
D is shown. FIG. 9 shows one end 16A, adjuster A
FIG. 9 is a cross-sectional view showing a vicinity of D and a solder discharge section 73.
One end 16A of the solder guide member 16 is
3 is removably connected via an adjuster AD. The cylindrical adjuster AD is made of, for example, plastic and has a plurality of convex portions 99T. As shown in FIG. 9, the end 99 of the adjuster AD
S is removably inserted into one end 16A of the solder guide member 16 by press-fitting, and has another end 99U.
Are detachably fitted into the solder discharge portion 73 by press-fitting. The protrusion 99T is provided for further strengthening the connection with the solder discharger 73. As a result, the cream solder H in the container 30 becomes HT shown in FIG.
Can exhale in any direction.

FIG. 10 shows an example of the cross-sectional structure viewed from the vicinity of arrow F in FIG. The adjuster AD is fixed by press-fitting into the solder ejection portion 73, and a fixing spring member 129S also shown in FIGS. 10 and 8 is detachably attached to the outside of the solder ejection portion 73. I have. The spring member 129S is a substantially ring-shaped member. When the operator presses the operating portion 129V of the spring member 129S in the J direction using the finger FG, the spring member 129S can be removed from the solder discharge portion 73. . Move the finger FG to the spring member 129S.
Release from the operation unit 129V, the spring member 129S
Is moved in the K direction, and the spring member 129S can tighten and fix the solder discharge portion 73 to the adjuster AD. The spring member 129S is made of an elastically deformable material, for example, iron or phosphor bronze if it is metal.
It can be made of piano wire, silicon chrome steel, etc., and can be made of plastic.

Next, referring to FIG.
An example of the internal structure of the main body 201 will be described. A transport belt 204 is disposed inside the upper cover 202. The transport belt 204 is driven by a drive unit 205 to operate a substrate (eg, a circuit board on which electronic components are mounted) 206.
Is transported to a position substantially below the mask plate 211 as a mask member. By lifting the substrate backup 207 by the operation of the driving unit 208, the transported substrate 206 is held at a position raised from the transport belt 204. Various mount components (for example, electronic components and other components) 213 are mounted on the substrate 206. The substrate stopper 210 stops the transfer of the substrate 206.

Above the transport belt 204, a mask plate 211 is disposed. This mask plate 21
1 includes a plurality of needles 212 protruding downward, and a cream solder H
06 to a plurality of predetermined positions. On the mask plate 211, the solder container 4
Reference numeral 60 is disposed so as to be movable along the first direction D1 or the second direction D2. The solder accommodation section 460 is movable from the position P1 to the position P2 by the operation of the driving section 299. When the solder accommodation section 460 reaches the position P1, the sensor 220 detects and supplies a detection signal to the control section 180. The control unit 180 gives a command to the driving unit 299 to stop the movement of the solder storage unit 460 in the first direction D1. Conversely, when the solder container 460 reaches the position P2, the sensor 219 turns the solder container 460 into position P2.
Is detected. The detection signal from the sensor 219 is transmitted to the control unit 18
0, the control unit 180 stops the operation of the driving unit 299 so that the solder accommodation unit 460 moves in the second direction D.
Stop moving any further to 2. The control unit 180
The operation of the driving units 205, 299, 208, the motor 40, and the substrate stopper 210 is controlled.

FIGS. 11 and 12 show preferred examples of the structure of the solder receiving portion 460 and its peripheral portion. FIG. 11 shows a solder receiving section 460 and a moving section 600 for the solder receiving section 460. FIG. 12 shows the solder receiving section 460. In FIGS. 11 and 12, the solder accommodating portion 460 roughly includes the main body 461, the first squeegee member 470, the second squeegee member 474,
2. It has a lock portion 465 and the like.

As shown in FIGS. 14 and 15, the main body 461 has packages 480, 480, two side covers 483, and two mounting portions 485. The package 480 has a rectangular shape when viewed from above as shown in FIG. A cover 462 is provided inside the packages 480 and 480 and slightly above the middle. In the middle position of this cover 462, FIG.
As shown in (B), a solder supply port 464 is provided. Each of the packages 480 and 480 includes FIG.
As shown in FIGS. 15A and 15A, a mounting portion 485 is provided. As shown in FIG. 11, the mounting portion 485 is connected to the rods 61 of the two cylinders 610 of the moving portion 600.
4 is a portion that is detachably fixed to the unit 4. Thus, the solder containing section 460 can be removed from the moving section 600 and cleaned, for example.

A first squeegee member 470 and a second squeegee member 4 are provided at the lower end of each package 480 of the main body 461.
74 is detachably attached. 12 and 14
As shown in FIG. 7, the first squeegee member 470 and the second squeegee member 474 are flat members,
One end 490 of 70 and the second end 494 of the second squeegee member 474 form an elongated solder supply port 463. The solder supply port 463 is a groove formed long in the direction E as shown in FIG. The package 480 of the main body 461 can be made of, for example, brass as a metal. The first squeegee member 470 and the second
The squeegee member 474 can be made of, for example, metal or another material such as silicon or Delrin.

Part 470A of first squeegee member 470
Can be detachably fixed to the lower end of the package 480 with, for example, screws. The portion 474A of the second squeegee member 474 is connected to another package 4
It can be detachably attached to the lower end of the connector 80 by, for example, screws. However, the first squeegee member 470
The mounting structure of the second squeegee member 474 and the second squeegee member 474 is not limited to the screw, and it is of course possible to mount the second squeegee member 474 detachably by another structure, for example, a fitting structure. The cream solder H is accommodated in the package 480 of the main body 461, the side cover 483, and the space surrounded by the first squeegee member 470 and the second squeegee member 474 as shown in FIGS.

FIG. 13 shows the first end 4 of the first squeegee member 470 and the second squeegee member 474 shown in FIGS.
90 and a shape example of the second end portion 494 are shown. The first end 490 of the first squeegee member 470 has an inclined surface 498 having an angle θ, and the second end 494 of the second squeegee member 474 similarly has an inclined surface 499 having an angle θ. have. Angle θ is an acute angle with respect to surface 211A of mask plate (also called a screen mask) 211, and is, for example, 60 °. Between the inclined surface 498 of the first end portion 490, the inclined surface 499 of the second end portion 494, and the surface 211A of the mask plate 211, for example, a trapezoidal fluid-like solder rotating portion generating portion 700 is formed. ing.

As shown in FIG. 11, when the solder accommodating section 460 is sent in the first direction D1, the cream solder H located in the rotating portion generating section 700 of the solder becomes R
Rolled in one direction. When the solder containing section 460 is moved in the second direction D2, the cream solder H in the rotating portion generating section 700 of the solder is rolled in the direction of R2. Since the first squeegee member 470 and the second squeegee member 474 are in close contact with the mask plate 211 when the solder containing section 460 moves in the D1 direction and the D2 direction in this way, air outside the solder containing section 460 is removed. Contact can be cut off. Therefore, the solder container 46
Accordingly, it is possible to reliably prevent the cream solder H contained in the main body of the No. 0 from being oxidized by the outside air.

As shown in FIG.
Can be moved up and down in the Z direction by the moving unit 600, and can be moved in the first direction D1 and the second direction D2. The moving unit 600 includes a guide member 750 and two cylinders 61.
0, a main body 751 and an actuator 219. The actuator 219 and the two cylinders 610 operate according to a command from the control unit 180. The main body 751 is movable along the guide member 750 along the first direction D1 or the second direction D2 by the operation of the actuator 219. The main body 751 fixes two cylinders 610. The mounting portion 485 of the solder storage portion 460 is detachably mounted on the rod 614 of each cylinder 610 as described above. Thereby, the cylinder 610
When the is operated, the solder receiving section 460 can be lifted in the Z1 direction from the state where the first end 490 and the second end 494 are in contact with the mask plate 211.

FIGS. 16 and 17 show an example of the cover member 760 of the solder accommodating portion 460. FIG. Cover member 760
Is a member for closing the solder supply port 463 of the solder storage section 460 when the solder storage section 460 is not used. As a result, when the solder housing portion 460 is not used, even if the cream solder H is housed in the solder housing portion 460, the cream solder H is applied to the cover 4.
70 closes the solder supply port 463,
The cream solder H in the solder storage section 460 does not come into contact with the outside air. Therefore, it is possible to prevent the cream solder H from being oxidized.

The cover member 760 is connected to the solder supply port 463.
A closing portion 765, an intermediate portion 766, and a clip portion 767 for closing the opening. Two clip parts 767 are provided. The cover member 760 can be detachably attached to the solder containing portion 460 by the spring force of the clip portion 767 and the closing portion 765. The intermediate portion 766 of the cover member 760 has a shape along the package 480 and, for example, the outer peripheral surface of the second squeegee member 474.
The cover member 760 can be made of a metal having a spring force, for example, aluminum, brass, or a plastic having a spring force, for example, acrylic or polyethylene.

In this example, as shown in FIG. 18, in order to automatically supply the cream solder H in the main body 461,
A sensor 1500 is provided. This sensor 1500
Is for detecting the position of the float 1501 that moves up and down in the Z direction. The float 1501 moves up and down in the Z direction according to the position of the liquid level 1502 of the cream solder H. When the liquid level 1502 falls below a certain position P3, the sensor 1500 is turned on. This sensor 150
The ON signal of 0 is given to the control unit 180, and the control unit 18
0 supplies a signal to the motor 40 shown in FIG. 2 based on this ON signal. Thereby, the motor 40 operates the first roller 14 and the second roller 16 and feeds them in the T direction, so that the cream solder H in the container 30 is additionally supplied to the solder storage portion 460 via the solder guide member 16.
In FIG. 18, when the amount of the cream solder H supplied from the other end 16B of the solder guide member 16 increases, the float 1501 rises, so that the ON signal of the sensor 1500 is not output, and the additional supply of the cream solder H is stopped. I do.

Next, an operation example of the above-described solder printing machine 200 and the solder supply device 10 will be described. First, as shown in FIG. 5, the container 30 is cut along a cut line 71, and a tip portion 73 </ b> A of the solder discharge portion 73 is cut. Then, as shown in FIG. 8, the solder discharge portion 73 and one end 16A of the solder guide member 16 are adjusted by using an adjuster AD.
Is connected. In this state, the spring member 129S shown in FIG. 10 can reliably stop the vicinity of the solder discharge portion 73 by the spring force, and there is no leakage of the solder in the solder discharge portion 73.

The container 30 is set on the mounting portion 24 of the base 12, as shown in FIGS. In this case,
The mounting brackets 26K, 26K of the base 12 are passed through the holes 60, 60 of the container 30 shown in FIG. . When the container is set on the receiver 24, the support arm 32 is lifted in the R direction to separate the first roller 14 from the second roller 16 as shown in FIG. By returning the support arm 32 again with the container 30 resting on the second roller 16, the one end 31 of the container 30 can be easily sandwiched between the first roller and the second roller. it can.

One end 16 A of the solder guide member 16 is connected to the solder discharge section 73, and the other end 16 B of the solder guide member 16 is connected to the main body 4 of the solder storage section 460.
Guided inside 61. Solder container 4 shown in FIG.
60 is positioned at the position P1, which is the origin position, and when the switch 12A shown in FIG. 1 is turned on, the control unit 180 operates the motor 40 to cause the first roller 14 and the second roller 16 shown in FIG. Container 3 while sending in T direction
By pressing 0, the cream solder H is pushed out to the solder discharge portion 73 side. When the amount of the cream solder H in the solder accommodating portion 460 has reached a predetermined amount, the motor 40 does not operate, so that the cream solder H is not supplied to the squeegee 460 side via the solder guide member 16 any more. .

Next, when the solder container 460 shown in FIG. 2 moves from the position P1 to the position P2, the cream solder H is transferred from the solder container 460 to the mask plate 211.
And the cream solder H is supplied to a predetermined position of the substrate 206 through the needle 212. As described above, the solder receiving portion 460 is in the first direction D1.
When moving in the second direction D2, the solder guide member 16
Is a flexible structure or a flexible tube, the other end portion 16B of the solder guide member 16 can move reliably and smoothly following the movement of the solder accommodating portion 460. Therefore, regardless of the position of the solder container 460, the cream solder H is reliably and smoothly placed in the solder container 460 via the container 30 and the solder guide member 16 by operating the motor 40 as necessary. Can be supplied to

Incidentally, in FIG. 11, when the solder accommodating portion 460 moves in the first direction D1, in FIG.
Then, the rotating portion of the cream solder H is generated in the R1 direction in the rotating portion generating portion 700 of the solder. That is, in FIG. 13, the so-called rolling phenomenon of the cream solder H can be generated while squeezing in the clockwise direction, so that the cream solder H can be surely inserted into the opening 211P of the mask plate 211 which is also called a screen mask. Can be filled. This opening 2
11P is a hole in the case of a screen mask, and a hole of the needle 212 in the case of a squeegee plate. Since the solder containing portion 460 is in close contact with the mask plate 211, the cream solder H in the main body can be squeezed without touching the outside, thereby preventing the cream solder H from being oxidized.

In FIG. 11, when the solder accommodating portion 460 is squeezed in the second direction D2, as shown in FIG. Squeezing can be performed while rolling. Therefore, the cream solder H can be reliably filled in the opening 211P of the mask plate 211. Moreover, since the cream solder H in the main body does not come into contact with the outside air, the deterioration and oxidation of the cream solder H in the main body can be prevented. As described above, the cream solder H can be reliably supplied to a desired position of the substrate 206 through the opening 211P of the mask plate 211 and printing can be performed.

In FIGS. 11 and 12, the first squeegee member 470 and the second squeegee member 474 are
Can be adjusted in the V direction, and the rolling phenomenon of the cream solder can be adjusted to an optimum state. When squeegeeing the cream solder, the first squeegee member 470 and the second squeegee member 474 are used.
Then, after adjusting the parallelism between the mask plates 211, the first end portion 490 and the second end portion 494 are placed on the upper surface of the mask plate 211 by lowering the solder accommodation portion 460 to the upper surface side of the mask plate 211. On the other hand, it can be maintained in a state of being in contact with the entire length.

In the example of FIG. 13, the rotating part 700 of the fluid solder is formed by the inclined surface 498 of the first end 490, the inclined surface 499 of the second end 494, and the mask plate 21.
The first upper surface 211A is formed in a trapezoidal shape when viewed in cross section, but may have a Δ shape when viewed in cross section.
When the above-mentioned solder accommodating section 460 is used, the cream solder H in the main body does not come into contact with the outside air, so that the cream solder H
Can reliably be prevented from being oxidized.

When the substrate 206 is loaded, the substrate 2
06 is the substrate backup 2 by the substrate stopper 210.
07, the substrate backup 207 rises to bring the substrate 206 closer to the mask plate 211 side. When a screen mask without needles is used instead of the mask plate 211 having the needles 212, the substrate 206 is in close contact with the lower surface of the screen mask.

When the solder container 460 moves in the first direction D1 and reaches the position P1, the solder container 460 is moved to the position P1.
Moves from the position P1 in the second direction D2 to the position P2, the solder printing operation for the substrate 206 is completed by one reciprocating operation of the solder accommodating portion 460. When the solder printing operation on a predetermined number of substrates 206 is completed, the solder supply port 463 is closed by attaching a cover member 760 to the solder storage section 460 as shown in FIGS. Thus, even if the cream solder H is housed in the solder housing section 460, the cream solder H does not come into contact with the outside air, so that the deterioration and oxidation of the cream solder H can be prevented.

FIG. 19 shows another embodiment of the solder printing machine of the present invention, and FIG. 19 is shown corresponding to FIG. The embodiment of FIG. 19 is different from the embodiment of FIG. 11 in that the main body 461 of the solder accommodation portion 460 and the first
This is the shape of the squeegee member 470 and the second squeegee member 474. The first squeegee member 470 and the second squeegee member 474 are formed integrally with the package 480 of the main body 461 and have a curved shape. For this purpose, as shown in FIG.
0 has a substantially U-shaped shape having a solder supply port 463. The other points in the embodiment of FIG. 19 are the same as those of the corresponding parts of the embodiment of FIG. FIG.
Is the first squeegee member 47 in the embodiment of FIG.
This is a modification of the first end 490 of the first squeegee member 490 and the second end 494 of the second squeegee member 474. First end 49 in FIG.
The zero and second end 494 have a substantially semi-circular cross section rather than an edge.

FIG. 20 shows still another embodiment of the present invention. Body part 4 of solder storage part 460 in FIG.
Inside 61, a solder circulation member 800 is provided. The solder circulation member 800 is rotatably provided through a side cover 483 of the main body 461. The solder circulation member 800 is a rod-shaped member, and rotating bodies 810 are attached to both ends thereof. The rotating body 810 is a rotating body for rotating by friction on the upper surface 211A of the mask plate or the screen mask 211 as the main body 461 moves in the D1 or D2 direction. Therefore, when the solder containing section 460 moves in the first direction D1 or the second direction D2, the rotation of the rotating body 810 causes the solder circulating member 800 to move to the main body section 4.
It rotates in 61. FIG. 21 shows how the solder circulation member 800 rotates in the S1 direction or the S2 direction in the main body 461.

When the solder accommodating section 460 moves in the first direction D1, the solder circulating member 800 rotates in the S1 direction. Conversely, when the solder containing section 460 moves in the second direction D2, the solder circulation member 800 rotates in the direction of S2. Accordingly, the cream solder H in the main body 461 is circulated by the solder circulating member 800, so that the cream solder H in the main body 461 can be reliably sent to the solder supply port 463. Therefore, the cream solder H in a fluid state in the main body can be reliably fed into the solder supply port 463, and the opening 211 of the screen mask or the mask plate 211 as shown in FIG.
The supply efficiency at the time of supplying the solder to P is increased, and the solder supply printing operation can be reliably performed.

FIG. 22 shows an example in which the solder circulating member 800 is disposed in the vicinity of the solder supply port 463, that is, in the vicinity of the rotating portion generating portion 700 of the fluid solder, and at the upper position thereof. This solder circulation member 800
Preferably, small blades 890 are provided around the periphery, and the blades 890 can further efficiently lubricate the solder.

FIGS. 24A and 24B show examples of the structure of a conventional squeegee as a comparative example. In the conventional squeegee of FIG. 24A, when moving in the first direction D1, the actuator 2000 is extended to squeegee the cream solder H along the mask plate 211. When moving in the second direction D2, the actuator 200
Extend the solder paste H to the mask plate 211
Squeegee on top. In the example of the roller method shown in FIG. 24B, when squeezing the cream solder H in the first direction D1, the actuator 2003 is extended downward. When squeegeeing in the second direction D2, the actuator 2004 is extended downward to squeegee the cream solder H.

As shown in FIGS. 24A and 24B, when the cream solder H is completely constantly exposed to the outside air, the cream solder H is oxidized. Therefore, the soldering quality such as the change in viscosity, the generation of solder balls, and the generation of solder bridges due to the oxidation of the cream solder becomes poor, and a repair process in the solder printing process is required in the production line, and the productivity is deteriorated. As described above, in the squeegee system conventionally used, especially when a lead-free cream solder is used, the oxidation phenomenon of the lead-free cream solder cannot be avoided.

The above-described solder printer according to the embodiment of the present invention has the following advantages. For example, it is possible to prevent oxidation of a used lead-free cream solder and prevent deterioration of a leaded solder, thereby improving soldering quality. By improving the quality of soldering, the number of man-hours for repairing solder balls, solder bridges and the like can be reduced. While attempts are being made to introduce lead-free cream solder as a solution to global environmental problems, the problem of oxidation of the alloy composition of cream solder has become an issue. By using the solder printing machine according to the embodiment of the present invention, the exposure of the cream solder to the outside air can be minimized, and the effect of preventing the deterioration and oxidation of the cream solder is enhanced.

The solder supply device according to the embodiment of the present invention
Cost reduction can be achieved with a small and lightweight simple type, and the cost can be reduced, for example, by 70 to 80% as compared with the conventional machine. Since the cream solder in the container is set obliquely on the mounting table, the size of the solder supply device in the vertical direction can be reduced as compared with the conventional type in which the cream solder is set vertically, and the cream solder can be stably supplied. The solder supply device of the present invention can be easily attached and used simply by additionally setting the base 12 and providing the holes 203 with respect to the upper cover of a conventionally used printing press. The shape of the tight seal of the container is not limited to the V-shape in the illustrated example, but may be a U-shape, a Y-shape, or another shape. The roller of the pressing portion is not limited to the roller having the first roller and the second roller, and a type in which the cream solder in the container is extruded by one roller may be employed.

The adoption of a structure for accommodating solder in a laminate type container has the following features. (1) Significant cost reduction can be achieved. For example, the cost can be reduced, for example, by about 25% as compared with a conventional solder containing a syringe. (2) When the container is of a laminate type, it is not necessary to collect the syringe used in the related art, and the problem of the global environment such as disposal of the container is improved. Since the container is of a laminate type, both weight and volume are reduced, which is advantageous in terms of transportation and storage.

In the case of a solder containing a syringe, the solder cannot be stirred therein, but the solder contained in a container having a laminated structure can be pseudo-stirred by being pressed by a roller of a pressing portion. By storing the solder in the container, almost all of the solder in the container can be discharged from the solder discharge portion and used. By supplying the solder between the container and the squeegee using the solder guide member, the solder can be reliably and smoothly supplied from the container to the squeegee side. The solder guide member 16 is not limited to a tube-shaped or hose-shaped member, but may have other cross-sectional shapes.

[0058]

As described above, according to the present invention,
Even if a lead-free cream solder is used, the solder in a fluid state can be reliably printed on the printing object while preventing the deterioration and oxidation of the cream solder.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a preferred embodiment of a solder printing machine according to the present invention.

FIG. 2 is a sectional view showing a structural example of the solder printing machine of FIG. 1;

FIG. 3 is a front view showing an example of the structure of a pressing portion on the solder supply device side.

FIG. 4 is a side view of the structural example of FIG. 3;

FIG. 5 is a perspective view showing an example of a container structure used in the solder supply device.

FIG. 6 is a plan view of the container.

FIG. 7 is a view showing a cutting jig for forming a cut line in a container.

FIG. 8 is a perspective view showing an example of a structural connection between one end of a solder guide member, a solder discharge portion of a container, and an adjuster.

FIG. 9 is a cross-sectional view showing an example of a connection between one end of a solder guide member, a solder discharge portion, and an adjuster.

FIG. 10 is a sectional view showing a state in which the solder discharge section and the adjuster are connected by a spring member.

FIG. 11 is a view showing a solder storage part, a moving part of the solder storage part, and a peripheral part thereof;

FIG. 12 is a view showing a solder accommodating portion.

FIG. 13 is an enlarged view showing a first squeegee member and a second squeegee member of the solder accommodating portion, and a rotating portion generating portion of a fluid solder.

FIGS. 14A and 14B are a side view and a cross-sectional view illustrating a structural example of a storage unit.

FIG. 15 is a plan view and a bottom view showing a structural example of a storage unit.

FIG. 16 is a diagram illustrating a state in which a solder supply port is closed by a cover member of the solder storage unit.

FIG. 17 is a perspective view showing a solder storage section and a cover member.

FIG. 18 is a diagram showing a sensor and the like for detecting the surface of the solder in the solder containing section.

FIG. 19 is a diagram showing another embodiment of the present invention.

FIG. 20 is a perspective view showing still another embodiment of the present invention.

FIG. 21 is a diagram showing the embodiment of FIG. 20;

FIG. 22 is an enlarged view showing a first squeegee member, a second squeegee member, a solder circulation member and the like in the embodiment of FIG. 21;

FIG. 23 is a view showing still another embodiment of the present invention.

FIG. 24 is a view showing a structure of a conventional squeegee.

[Description of Signs] 200: Solder printing machine, 211: Mask plate (a type of mask member), 460: Solder container,
461: main body part of the solder storage part; 463: solder supply port; 470: first squeegee member;
A second squeegee member, 490: a first end of the first squeegee member, 494: a second end of the second squeegee member,
700: rotating part generating portion of fluid solder, 76
0: cover member, 800: solder circulation member, 8
10 ... rotating body of solder circulation member

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // B23K 101: 42 B23K 101: 42

Claims (7)

[Claims] 1. A solder printing machine for printing a solder in a fluid state on an object to be printed, comprising: a mask member arranged corresponding to the object to be printed; By moving in the first direction and the second direction opposite to the first direction along the mask member, the soldering port for supplying the fluid-like solder passes through the mask member through the mask member so that the desired printing target is A solder accommodating section for supplying the fluid solder to a position of the main body, wherein the solder accommodating section includes a main body for accommodating the fluid solder, and a first squeegee provided in the main body. A first end of the first squeegee member and a second end of the second squeegee member form the solder supply port; and A first direction and the second direction The first end portion and the second end portion form a rotating portion of the fluid-like solder in a forming space between the first end portion, the second end portion, and the mask member. A solder printing machine, comprising a rotating part generating part of a fluid-like solder for generating the solder. 2. A first end of the first squeegee member and a second end of the second squeegee member are inclined at an acute angle with respect to a surface of the mask member, and the forming space is viewed in cross section. The solder printing machine according to claim 1, wherein the solder printing machine has a trapezoidal shape. 3. The solder printing machine according to claim 1, further comprising a solder supply device for supplying the solder in a fluid state into the main body of the solder storage unit. 4. The solder printing according to claim 1, wherein a solder circulating member that circulates the fluid-like solder in the main body by rotating is disposed above the formation space in the main body. Machine. 5. The solder circulation member rotates by friction on the mask member, which moves relatively when the solder accommodating portion moves in the first direction and the second direction with respect to the mask member. The solder printing machine according to claim 4, further comprising a rotating body. 6. The solder printing machine according to claim 1, wherein the object to be printed is a circuit board, and the fluid-like solder is a lead-free cream solder. 7. The solder printing machine according to claim 1, further comprising a cover member for closing the solder supply port when the solder accommodating portion is not used.