JP2003177088A - Micro junction strength evaluating testing tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform a test by using a tensile-testing apparatus that is universally used for a fine test piece regarding a tool for testing the strength of micro junction such as the solder junction section of electronic components and a conductive pattern junction section formed on a printed circuit board and a bond section. <P>SOLUTION: The micro junction strength evaluating testing tool that is fitted to a universal tensile-testing apparatus 5 and is used when performing a junction strength evaluation test to a test piece 10 comprises a tool upper-half body 50A having a nib 21A connected to an upper mount flange 3 of the universal tensile-testing apparatus 5 and at the same time an upper hand 25X for gripping the upper section of the test piece 10, and a tool lower-half body 50B that is connected to the lower mount flange 4 of the universal tensile-testing apparatus 10 and at the same time has a lower hand 24X for gripping the lower section of the test piece 10. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro-joint strength evaluation test jig, and more particularly, to the strength of a micro-joint and an adhesive portion such as a solder joint portion of an electronic component or a conductor pattern adhesive portion formed on a printed circuit board. The present invention relates to a micro-bonding strength evaluation test jig for testing.

In recent years, high reliability, high efficiency, and cost reduction have been required for electronic devices such as semiconductor devices and their mounting technology. Therefore, a test (tensile test, which evaluates the micro strength of a micro joint such as a solder joint of an electronic component).
High reliability, high efficiency, and cost reduction are also required in shear tests, peeling tests, etc.).

2. Description of the Related Art Conventionally, a test using a tensile tester has been conducted as a kind of metal material test. The tensile tester for this metallic material is widely used (hereinafter,
A tensile test device for a metal material is referred to as a general-purpose tensile test device. By using this general-purpose tensile test device, not only a tensile test but also a shear test can be performed.

By the way, in recent years, with the improvement of electronic technology, when an electronic element such as a semiconductor device is mounted on a substrate, high reliability is required for the mounting. Therefore, after mounting the electronic element on the substrate, a test for evaluating the bonding strength thereof (micro bonding strength evaluation test) has been performed.

As the micro-bonding strength evaluation test,
There are a tensile test, a shear test, an impact test and the like, and these tests can be carried out by using the tensile test device as described above. However, since the general-purpose tensile testing device has a large chuck portion for gripping a metal material as a test piece, it is not possible to directly grip a small electronic element such as a semiconductor element. For this reason, in the past, a dedicated tensile testing device (hereinafter referred to as a dedicated tensile testing device), which was configured to be able to directly grip a small electronic element, was manufactured, and this dedicated tensile testing device was used to perform micro-bonding strength on the electronic element. An evaluation test was conducted.

[Problems to be Solved by the Invention]

However, a large amount of development cost is required to manufacture a dedicated tensile test device capable of directly gripping a small electronic element, and this development cost is reflected in the product cost of the small electronic element, thus There is a problem in that the cost of the element increases.

Also, there are various types and structures of small electronic devices, and conventional dedicated tensile testing devices have not been able to support all of these small electronic devices. Therefore, it is necessary to individually manufacture a dedicated tensile test device corresponding to the type and structure of the small electronic element, which is not realistic.

The present invention has been made in view of the above points, and provides a micro-bonding strength evaluation test jig capable of performing a micro-bonding strength evaluation test on a small electronic device using a general-purpose tensile tester. The purpose is to provide.

[0008]

In order to solve the above problems, the present invention is characterized by the following means.

According to the first aspect of the invention, in a micro-bonding strength evaluation test jig which is mounted on a general-purpose tensile tester and is used when performing a bonding strength evaluation test on a test piece, an upper part of the general-purpose tensile tester is used. A jig upper half having a claw connected to a mounting flange and having an upper hand for gripping the upper part of the test piece, and a lower mounting flange of the general-purpose tensile testing device, and And a jig lower half body having a lower hand for gripping the lower portion.

Further, in the invention of claim 2, in the micro-bonding strength evaluation test jig of claim 1, a positioning member for positioning the jig upper half body and the jig lower half body is provided. It is characterized by that.

Further, in the invention according to claim 3, in the micro-bonding strength evaluation test jig according to claim 1, the claws are arranged so as to extend in a horizontal direction with respect to a mounting surface of the test piece. It is characterized by that.

Further, in the invention according to claim 4, in the micro-bonding strength evaluation test jig according to claim 1, the claw is perpendicular to the mounting surface of the test piece and at the center of the test piece. It is characterized in that they are arranged with respect to each other.

The above means operates as follows.

According to the invention of claim 1, the jig upper half is connected to the general-purpose tensile testing device by fixing the claw provided on the jig upper half to the upper mounting flange, and By fixing the lower jig half to the lower mounting flange, the lower jig half is connected to a general-purpose tensile tester. The upper part of the test piece is gripped by the upper hand provided in the jig upper half body, and the lower part of the test piece is gripped by the lower hand provided in the jig lower half body.

Therefore, when the general-purpose tensile tester is driven to vertically move the upper mounting flange with respect to the lower mounting flange, the upper jig half moves vertically with respect to the lower jig half. This makes it possible to apply the driving force of the general-purpose tensile testing device to the test piece via the upper hand and the lower hand.

Therefore, even a test piece which cannot be directly connected to the general-purpose tensile test device can be connected to the general-purpose tensile test device through the micro-joint strength evaluation test jig, and thus the general-purpose tensile test device can be connected. A microbonding strength evaluation test can be performed on a test piece using a test apparatus.

According to the second aspect of the present invention, by providing the positioning member for positioning the jig upper half and the jig lower half, the jig upper half with respect to the jig lower half is provided. The movement can be uniquely positioned, so that only the load in the direction necessary for the microbonding strength evaluation test can be applied to the test piece, and the reliability of the test can be improved.

According to the third aspect of the present invention, the shear test can be performed on the test piece by disposing the claw so as to extend in the horizontal direction with respect to the mounting surface of the test piece. .

Further, according to the invention as set forth in claim 4, the claws are arranged vertically with respect to the mounting surface of the test piece and offset from the center of the test piece, so that the test piece can be peeled off. The load in the direction is applied, and the peeling test can be performed.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a micro-bonding strength evaluation test jig 1A (hereinafter simply referred to as test jig 1A) which is a first embodiment of the present invention. 1A is a sectional view of the test jig 1A, and FIG. 1B is a plan view of the test jig 1A.

The test jig 1A is generally composed of a lower table 7, a cylindrical sleeve 8, an upper table 12, and the like.

The lower table 7 is composed of a large-diameter portion 7A and a small-diameter portion 7B, so that the small-diameter portion 7B is configured to project upward with respect to the large-diameter portion 7A. The large-diameter portion 7A is provided with a fixing screw hole 36 for fixing to a lower mounting flange 4 provided in a tensile test device 5 described later. Further, a fitting hole into which a locking pin 38 for fixing the cylindrical sleeve 8 is fitted is provided on the side surface of the small diameter portion 7B, and the plate 11b is fixed to the upper surface by a mounting screw 38b.

The cylindrical sleeve 8 has a cylindrical shape, and its lower end portion is configured to be inserted into the small diameter portion 7B of the lower table 7. Then, by mounting the locking pin 38 in the stepped hole formed on the side surface, the cylindrical sleeve 8
Is configured to be detachably fixed to the lower table 7.

The upper base 12 is a substantially cylindrical member, and is configured to be movable (sliding) up and down in the cylindrical sleeve 8. A plate 11b is fixed to the lower surface of the upper base 12 by a mounting screw 39a, and a connecting portion 33 for fixing to an upper mounting flange 3 provided in a tensile tester 5 described later is provided on the upper surface. .

Further, a guide key 9 is formed on the side surface of the upper table 12 so as to project, and a cylindrical groove 8 is formed with a key groove 13 for engaging with the guide key 9. Therefore, when the upper table 12 moves up and down in the cylindrical sleeve 8, the guide key 9 engages with the key groove 13 to restrict the moving position, whereby the upper table 12 rotates in the cylindrical sleeve 8. Is restricted (that is, it moves only in the vertical direction).

FIG. 2 shows a state in which the test jig 1A having the above structure is mounted on the tensile tester 5. The tensile test device 5 is widely used as a device for performing various tests on metal materials.

This tensile testing device 5 is provided with an upper mounting flange 3 and a lower mounting flange 4, and the upper mounting flange 3 is moved upward with respect to the lower mounting flange 4 by utilizing, for example, hydraulic pressure so that each flange 3, It is configured so that a load can be applied to the test piece fixed between the four.
Further, the tensile tester 5 is configured to measure the load applied to the test piece, the elongation of the test piece, etc., and the tensile strength, shear strength, etc. of the test piece can be obtained based on these data. .

To mount the test jig 1A on the tensile tester 5, the lower base 7 is fixed to the lower mounting flange 4 using the fixing screw 37. Further, the cylindrical sleeve 8 is inserted into the lower base 7, and the cylindrical sleeve 8 is fixed to the lower base 7 by the locking pin 38. On the other hand, the upper end of the rigid connecting jig 6 is connected to the upper mounting flange 3 in advance, and the upper base 12 is connected to the lower end of the rigid connecting jig 6.

Next, as a type of micro-bonding strength evaluation test, a method of performing a tensile test on a test piece using the above-described test jig 1A and tensile test apparatus 5 will be described.

In the following description, a method of performing a tensile test on the test piece 10 shown in FIG. 3 will be described as an example. The test piece 10 shown in FIG. 3 is one in which a semiconductor device 40, which is a miniaturized electronic element, is mounted on a board 42 (for example, a printed board). That is, the semiconductor device 40 has a so-called BGA (Ball Grid Array) structure, and the bump 4
1 is bonded to the substrate 42.

In the micro-bonding strength evaluation test, the bonding strength between the semiconductor device 40 and the substrate 42, specifically, the tensile strength, the shearing strength, the peeling strength, the impact strength, etc. between the semiconductor device 40 and the substrate 42, are evaluated. Test and evaluate. This example corresponds to the tensile strength test of various micro-bonding strength evaluation tests. Hereinafter, details of the tensile strength test will be described.

To perform the tensile strength test, first, the test piece 1
The lower surface of 0 (that is, the substrate 42) is fixed to the plate 11b provided on the lower table 7 with an adhesive. At this time, the adhesive is also applied to the upper surface of the test piece 10 (that is, the semiconductor device 40). Next, the cylindrical sleeve 8 is fixed to the lower base 7 using the locking pin 38 as described above.

Subsequently, the guide key 9 is positioned so as to engage with the key groove 13, and then the upper base 12 is inserted into the cylindrical sleeve 8. Then, the upper base 12 and the test piece 10 are bonded and fixed by the adhesive applied to the upper surface of the test piece 10 by moving the upper base 12 downward to a position where the upper base 12 contacts the test piece 10.

After the adhesive is hardened, the tensile tester 5 is driven to move the upper table 12 in a direction in which it is relatively separated from the lower table 7. Thus, a load in the tensile direction is applied to the micro-joint portion of the test piece 10 (that is, the joint portion between the semiconductor device 40 and the substrate 42), and the tensile strength of the micro-joint portion can be obtained by breaking the load.

As described above, in this embodiment, the lower table 7 is connected to the tensile test device 5 by being fixed to the lower mounting flange 4. Further, the upper base 12 is connected to the upper mounting flange 3 via the rigid connecting jig 6 so as to be connected to the tensile test device 5. Further, the cylindrical sleeve 8 is fixed to the lower end of the lower table 7 and thus connected to the tensile test device 5 through the lower table 7. Further, the above-mentioned upper base 12 is configured to be movable in the vertical direction while maintaining the state of facing the lower base 7 within the cylindrical sleeve 8.

Therefore, when the tension test device 5 is driven to move the upper mounting flange 3 up and down relative to the lower mounting flange 4, the upper base 12 moves up and down in the cylindrical sleeve 8 relative to the lower base 7 accordingly. Move (slide) in the direction. As a result, the upper surface (semiconductor device 40) of the test piece 10 is fixed to the upper table 12 and the lower surface (the substrate 42) is fixed to the lower table 7 as described above.
It becomes possible to carry out a tensile test.

That is, by using a general-purpose tensile tester 5 used for a metal material test, a test piece 1 having a small electronic element is used.
It is possible to perform a micro-bonding strength evaluation test on 0. As a result, it is not necessary to manufacture a dedicated tensile test device corresponding to only the test piece 10, and thus the cost increase of the semiconductor device 40 can be suppressed.

In this embodiment, the cylindrical sleeve 8 is
By forming the key groove 13 so as to be parallel to the central axis of the cylinder and providing the upper base 12 with the guide key 9 for guiding the movement of the upper base 12 along the key groove 13, when the upper base 12 moves. It is possible to prevent the upper base 12 from rotating. As a result, it is possible to prevent the load in the twisting direction from being applied to the test piece 10 during the tensile test, and thus the accuracy of the tensile test can be improved.

Next, a second embodiment of the present invention will be described.

FIG. 4 shows a micro-bonding strength evaluation test jig 1B of the second embodiment (hereinafter simply referred to as test jig 1B).
Is shown. 4A is a sectional view of the test jig 1A, and FIG. 4B is a sectional view taken along the line AA in FIG. 4A.

The test jig 1B is also roughly composed of a lower table 18, a cylindrical sleeve 15, an upper table 17 and the like.

The lower table 18 is composed of a large-diameter portion 18A and a small-diameter portion 18B. Therefore, the small-diameter portion 18B is the large-diameter portion 1
It is configured to project upward with respect to 8A. A fixing screw hole 36 for fixing to the lower mounting flange 4 provided in the tensile test device 5 is formed in the large diameter portion 18A. Further, a fitting hole into which a locking pin 38 for fixing the cylindrical sleeve 8 is fitted is provided on the side surface of the small diameter portion 18B. Further, in this embodiment, a vertical plane is formed on the upper surface of the small diameter portion 18B, and the mounting screw 39 is formed on this vertical plane.
The plate 16b is fixed by b.

The cylindrical sleeve 15 has a cylindrical shape, and its lower end portion is configured to be inserted into the small diameter portion 18B of the lower table 18. By mounting the locking pin 38 in the stepped hole formed in the side surface, the cylindrical sleeve 15 is detachably fixed to the lower base 18.

The upper table 17 is constructed so as to be movable (sliding) up and down in the cylindrical sleeve 15, and a vertical surface is formed on the lower part thereof. A fixing member 14 is arranged on the upper table 17. The fixing member 14 extends in a direction orthogonal to the central axis of the cylindrical sleeve 15 (FIG. 4A).
In the left and right direction). That is, a hole extending in the direction orthogonal to the central axis of the cylindrical sleeve 15 is formed in the upper base 17, and the fixing member 14 is movable in the hole in the left-right direction in FIG. 4A. It is installed in.

At a position of the fixing member 14 facing the plate 16b, the plate 16a on which the test piece 10 is mounted is mounted.
Are fixed by mounting screws 39. Therefore, the surface of the plate 16a is also vertical. Further, a tapered surface 43 is formed at an end portion of the fixing member 14 different from the end portion on which the test piece 10 is mounted. This tapered surface 43
Is a surface having an inclination so as to project downward to the right side in the drawing.

Further, the upper base 17 is provided with a fixing member operating hole 19 penetrating in the vertical direction in the figure. The above-mentioned tapered surface 43 is configured to project into the fixing member operating hole 19, and therefore, as shown in FIG. 4B, when the fixing member operating hole 19 is removed from above, the tapered surface 43 is formed. Is configured to be viewed through.

Therefore, by inserting a rod-shaped operating member (not shown) into the fixing member operating hole 19, the fixing member 14 is inserted.
Can be moved toward the plate 16b. At this time, since the fixing member operating hole 19 has the tapered surface 43, the fixing member 14 can be moved by simply inserting the operating member into the fixing member operating hole 19.

In the above structure, the test piece 10 is mounted on the upper table 17
And a pair of plates 16a formed on the lower table 18,
16 b, a test piece monitoring hole 29 is formed in the cylindrical sleeve 15 at a position facing the test piece 10. Therefore, as will be described later, when the test piece 10 is mounted between the pair of plates 16a and 16b, the test piece 1
This is the test piece monitoring hole 2
It is possible to confirm the value via the No. 9, and thus the reliability of the micro-bonding strength evaluation test can be improved.

In this embodiment as well, although not shown, a guide key is formed on the side surface of the upper table 17 so as to project, and a key groove for engaging with the guide key is formed on the cylindrical sleeve 15. Therefore, when the upper table 17 moves up and down in the cylindrical sleeve 15, the upper table 17 does not rotate in the cylindrical sleeve 15. Further, the test jig 1B according to this example is also mounted on the tensile test device 5 described above with reference to FIG. 2, so that the microbonding strength evaluation test is performed on the test piece 10.

Next, as a type of micro-bonding strength evaluation test, a method of performing a shear test on the test piece 10 using the above-described test jig 1B and tensile test apparatus 5 will be described.

To conduct the shear strength test, first, the test piece 1
One of the substrate 42 and the semiconductor device 40 forming 0 is fixed to the plate 16b provided on the lower table 18 with an adhesive (in this embodiment, the base 42 is assumed to be fixed). At this time, the adhesive is also applied to the surface of the semiconductor device 40 forming the test piece 10 facing the fixing member 14. Next, the cylindrical sleeve 15 is fixed to the lower table 18 by using the locking pin 38.

Subsequently, the upper base 1 connected to the rigid connection jig 6 is positioned after the guide key is engaged with the key groove.
7 is inserted into the cylindrical sleeve 15. And upper stand 1
7 is moved down to the position where it abuts on the lower table 18. In this state, the pair of plates 16a and 16b face each other (the test piece 10 is fixed to the plate 16b as described above).

As described above, the upper base 17 is the cylindrical sleeve 1.
When mounted in 5, the operating member is inserted into the fixing member operating hole 19 and the fixing member 14 is moved in the direction approaching the plate 16B (leftward in FIG. 4A). As a result, the plate 16a provided on the fixing member 14 comes into contact with the test piece 10 (semiconductor device 40), and the semiconductor device 4 in advance.
The plate 16 a is fixed to the test piece 10 by the adhesive applied to the plate 0.

At this time, as described above, the cylindrical sleeve 1
Since the test piece monitoring hole 29 is formed at a position facing the test piece 10 of No. 5, the plate 16a can be securely fixed to the test piece 10, and it is possible to prevent the test from being performed with the adhesion failure. Therefore, the reliability of the test can be improved.

Next, after waiting for the adhesive to harden, the tensile tester 5 is driven to move the upper table 17 in a direction in which it is relatively separated from the lower table 18. As a result, the test piece 1
0 micro junction (ie semiconductor device 40 and substrate 42
A load in the shearing direction is applied to the (joint portion with) and the shearing force can be obtained by breaking the load.

Therefore, also in this embodiment, the micro-joint strength evaluation test (shear strength evaluation) is performed on the test piece 10 having the small electronic element by using the general-purpose tensile tester 5 used for the metal material test. It becomes possible. As a result, it is not necessary to manufacture a dedicated tensile test device corresponding to only the test piece 10, and thus the cost increase of the semiconductor device 40 can be suppressed.

Next, a third embodiment of the present invention will be described.

5 to 7 show a micro-bonding strength evaluation test jig 1C according to the third embodiment (hereinafter simply referred to as the test jig 1C.
It means that). FIG. 5 is a partially cutaway view of the test jig 1C, FIG. 6 is a view showing a jig upper half body 50A which constitutes the test jig 1C, and FIG. 7 shows the test jig 1C. It is a figure which shows the jig lower half body 50B.

The test jig 1C is roughly composed of a jig upper half body 50A and a jig lower half body 50B.
As shown in FIGS. 5 and 6, the jig upper half 50A
In general, the upper frame 44 has an upper positioning block 20, a tensile test claw 21A, a positioning pin 23, upper hands 25X and 25Y, and upper pressing screws 48X and 48.
It is configured to have Y and the like.

The upper frame 44 has a rectangular shape,
The upper positioning block 20 is fixed to one of the corners. The semiconductor device 40 that constitutes the test piece 10 is mounted on the upper positioning block 20, and an upper fixing recess 46 is formed at a predetermined position where the semiconductor device 40 is mounted. The upper fixing recess 46 is formed so as to correspond to the shape of the semiconductor device 40.

The tensile test claws 21A are provided so as to extend in the vertical direction (upward in FIGS. 5 and 6B) with respect to the mounting surface of the test piece 10 fixed to the upper positioning block 20. Further, the arrangement position thereof is configured to substantially coincide with the center position of the test piece 10. The tensile test claw 21A is used in the tensile test device 5 as described later.
It is fixed to the upper mounting flange 3 of. still,
The tensile test claw 21A is configured to be attachable to and detachable from the upper frame 44.

In the present embodiment, the positioning pins 23 are arranged at the outer peripheral position of the upper frame 44 and in a substantially diagonal shape. Specifically, a positioning hole for inserting the positioning pin 23 is formed in the upper frame 44, and the lower end portion of the deciding pin 23 projects below the upper frame 44 by communicating with the positioning hole 23. (See FIG. 6B).

The upper hands 25X and 25Y are respectively supported by the upper hand guides 27 that are planted in the upper frame 44. Therefore, the upper hand 25X is configured to be guided by the upper hand guide 27 so as to be movable in the arrow X direction in the figure, and the upper hand 25Y is guided by the upper hand guide 27 to be movable in the arrow Y direction in the figure. It is said that. Also, each upper hand 25X, 2
The tip portion of 5Y is the upper positioning block 20 described above.
It is configured to be movable in the upper fixing recess 46 formed in the.

Further, the upper pressing screws 48X and 48Y are screwed into the upper frame 44, and can be screwed in the directions of arrows X and Y in the drawing by rotating them.
In addition, the upper hand 25 is attached to the tip of the upper pressing screw 48X.
X is in contact, and the upper hand 25Y is in contact with the tip of the upper pressing screw 48Y. Therefore, the upper pressing screw 4
By operating 8X and 48Y, the upper hand 25
X and 25Y move in the X and Y directions in the figure.

As a result, the test piece 1 is placed in the upper fixing recess 46.
No. 0 semiconductor device 40 is placed on the upper pressing screw 48
By screwing X and 48Y, the upper hand 25
X and 25Y press the semiconductor device 40 toward the upper fixed recessed portion 46, whereby the semiconductor device 4 constituting the test piece 10 is formed.
0 to the upper positioning block 20 (that is, the jig upper half 5
0A) can be fixed.

On the other hand, the jig lower half 50B is, as shown in FIGS. 5 and 7, roughly, the lower positioning block 28, the lower hands 24X, 24Y, and the lower frame 45.
The lower pressing screws 49X, 49Y, the positioning hole 51, and the like are provided.

The lower frame 45 has a rectangular shape,
A lower positioning block 28 is fixed to one of the corners. The lower positioning block 28 is for mounting the substrate 42 constituting the test piece 10, and a lower fixing recess 47 is formed at a predetermined position where the substrate 42 is mounted. The lower fixing recess 47 is formed so as to correspond to the shape of the substrate 42.

A fixing screw hole 36 is formed on the lower surface of the lower frame 45. This fixing screw hole 36 is
The fixing screw 37 is screwed when fixing the jig lower half 50B to the lower mounting flange 4 of the tensile tester 5.

The positioning hole 51 is a hole through which the positioning pin 23 provided in the jig upper half body 50A is inserted. Therefore, the position of forming the positioning hole 51 is such that when the jig upper half body 50A is combined with the jig lower half body 50B and the positioning pin 23 is inserted into the positioning hole 51, the respective half bodies 50A and 50B are at predetermined positions. It is set to be positioned at.

The lower hands 24X and 24Y are respectively supported by the lower hand guides 26 planted in the lower frame 45. Therefore, the lower hand 24X is configured to be guided by the lower hand guide 26 so as to be movable in the arrow X direction in the figure, and the lower hand 24Y is guided by the lower hand guide 26 to be movable in the arrow Y direction in the figure. It is said that. Also, each lower hand 24X, 2
The tip portion of 4Y is the lower positioning block 28 described above.
It is configured to be movable in the lower fixed concave portion 47 formed in.

Further, the lower pressing screws 49X and 49Y are screwed into the lower frame 45, and can be screwed in the directions of arrows X and Y in the drawing by rotating them.
Further, the lower hand 24 is attached to the tip of the lower pressing screw 48X.
X is in contact, and the lower hand 24Y is in contact with the tip of the lower pressing screw 49Y. Therefore, the lower pressing screw 4
By operating 9X and 49Y, the lower hand 24
X and 24Y move in the X and Y directions in the figure.

As a result, the test piece 1 is placed in the lower fixing recess 47.
0 of the substrate 42 is placed on the lower pressing screws 49X, 4
By screwing 9Y, lower hands 24X, 24
Y presses the substrate 42 toward the lower fixing recess 47, whereby the substrate 42 forming the test piece 10 can be fixed to the lower positioning block 28 (that is, the jig lower half 50B).

Next, a method of performing a tensile test on the test piece 10 using the test jig 1C having the above structure will be described.

To carry out the tensile test, first, the test piece 10
The semiconductor device 40 located on the upper part of the jig is fixed to the jig upper half body 50A by operating the upper pressing screws 48X and 48Y as described above. Subsequently, the jig upper half body 50A is placed on the jig lower half body 50B, and the positioning pin 2
The jig upper half body 50A and the jig lower half body 50B are positioned by inserting the jig 3.

In this state, the substrate 42 located under the test piece 10 is placed in the lower fixing recess 47 of the lower positioning block 28 arranged in the jig lower half 50B. Therefore, the lower pressing screws 49X, 49
By operating Y, the substrate 42 is fixed to the jig lower half 50B as described above.

Next, the jig lower half 50B is fixed to the lower mounting flange 4 of the tensile testing device 5 using the fixing screws 37, and the tensile test claws 21A are provided on the upper mounting flange 3 of the tensile testing device 5. Gripping mechanism (not shown)
To grip (chuck).

In this state, the tensile tester 5 is driven to move the jig upper half body 50A and the jig lower half body 50B in the direction of separating the jig upper half body 50A from the jig lower half body 50B. A load is applied, and the tensile strength of the micro joint can be obtained by breaking.

Next, a method of performing a shear test on the test piece 10 using the test jig 1C will be described.

As described above, the tensile test claw 21A is configured to be attachable to and detachable from the upper frame 44.
When carrying out the shear test, the tensile test claw 21A is removed from the position shown by the solid line in FIG. 5, and the shear test claw 21B is replaced by the upper frame 4 as shown by the alternate long and short dash line in FIG.
Attach to the side of 4. That is, the shear test claw 21B is arranged so as to extend in the horizontal direction with respect to the mounting surface of the test piece 10.

Since the method of fixing the test piece 10 to the test jig 1C is the same as that in the above-mentioned tensile test, the description thereof will be omitted. However, when the shear test is performed as in this example, the positioning pin 23 is not provided.

To perform the shear test, first, the test jig 1C is used.
Is attached to the tensile tester 5. At this time, in the case of the above-mentioned tensile test, the test jig 1 is placed so that the test piece 10 becomes horizontal.
Although C was attached to the tensile test device 5, in the case of the shear test, the test jig 1C is attached to the tensile test device 5 so that the test piece 10 is vertical. That is, with respect to the state shown in FIG. 5, the test jig 1C is mounted on the tensile test apparatus 5 in a state of being rotated 90 degrees counterclockwise.

Specifically, the shear test claw 21B is gripped by the gripping mechanism provided on the upper mounting flange 3 of the tensile test device 5, and the lower end of the test jig 1C is fixed to the lower mounting flange of the tensile test device 5. The gripping mechanism (not shown) provided on the No. 4 grips it.

In this state, the tensile tester 5 is driven to move the jig upper half body 50A and the jig lower half body 50B in the direction of separating the jig upper half body 50A from the jig lower half body 50B. Since a load is applied, the shear strength of the micro joint can be obtained by breaking.

Next, a fourth embodiment of the present invention will be described.

FIG. 8 shows a micro-bonding strength evaluation test jig 1D (hereinafter, simply referred to as test jig 1D) which is a fourth embodiment. The test jig 1D has a peeling claw 22 at the position where the tensile test claw 21A shown by the solid line in FIG.
The arrangement position of is shifted by a dimension indicated by an arrow L in the figure. That is, the test jig 1D is configured such that the peeling claws 22 are arranged in a direction perpendicular to the mounting surface of the test piece 10 and offset from the center of the test piece 10.

Next, a method of performing a peeling test using the test jig 1D having the above-mentioned structure will be described. still,
The method for fixing the test piece 10 to the test jig 1D is the same as that in the above-described tensile test, and therefore its description is omitted. Further, the positioning pin 23 is not provided even when the peeling test is performed as in this embodiment.

In order to carry out the peeling test, the peeling claws 22 provided on the jig upper half 50A are fixed to the upper mounting flange 3 of the tensile test device 5 by a gripping mechanism (not shown), and the jig lower part is used. The half 50B is fixed to the lower mounting flange 4. In this state, the tensile tester 5 is driven to move the jig upper half body 50A and the jig lower half body 50B in the direction of separating them.

At this time, in the test jig 1D according to the present embodiment, since the peeling claw 22 is arranged so as to be displaced from the center of the test piece 10, the test piece 10 is indicated by an arrow in FIG. A moment force indicated by M is generated. The moment force M acts as a force for peeling the semiconductor device 40 from the substrate 42. Therefore, a load in the peeling direction is applied to the micro-joint portion of the test piece 10, and the peeling strength of the micro-joint portion can be obtained by breaking.

Next, a fifth embodiment of the present invention will be described.

FIGS. 9 and 10 show a micro-bonding strength evaluation test jig 1E (hereinafter simply referred to as test jig 1) which is a fifth embodiment.
(Referred to as E). 9 and 10, the same components as those of the test jig 1A according to the first embodiment described above with reference to FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

The test jig 1E is characterized in that, in addition to the test jig 1A according to the first embodiment, a sleeve holding guide 30 is provided and an elastic member 55 is provided below the lower table 7. . The sleeve holding guide 30 has a substantially L shape, and is fixed to a groove 53 formed in the lower table 7. A sleeve stop pin 31 for holding a sleeve stop fitting 32 is arranged at a substantially central position of the sleeve holding guide 30.

The sleeve stopper 32 has a substantially L-shape, and its tip is fixed to the cylindrical sleeve 8. Therefore, the cylindrical sleeve 8
Is moved upward (in the direction of the arrow Z2 in the figure), and the sleeve stopper pin 31 is engaged with the sleeve stopper 32 so that the cylindrical sleeve 8 is maintained at the upper position with respect to the lower base 7. It will be.

The sleeve stopper pin 31 can be attached to and detached from the sleeve holding guide 30 and the sleeve stopper 32. Therefore, sleeve stop pin 3
By pulling 1 out in the direction indicated by the arrow X1 in the figure, the cylindrical sleeve 8 drops downward and collides with the large diameter portion 7B of the lower table 7. As a result, by mounting the test piece 10 on the test jig 1E, it becomes possible to apply an impact to the micro-joint portion of the test piece 10. Therefore, the impact strength and the like of the micro joint can be obtained by breaking the micro joint of the test piece 10 by the drop impact.

In each of the above-described embodiments, the semiconductor device 40 is used as the test piece 10 with the bumps 41 to form the substrate 4.
Although the test piece applicable to the present invention is not limited to this, the test piece applicable in the present invention is not limited to this, and it is needless to say that the test piece can be applied to various test pieces having a micro junction. is there.

As described above, according to the present invention, various effects described below can be realized.

According to the invention described in claim 1, when the general-purpose tensile tester is driven to move the upper mounting flange up and down with respect to the lower mounting flange, the upper half of the jig is moved to the lower half of the jig. Since it moves vertically with respect to the body, it becomes possible to apply the driving force of the general-purpose tensile testing device to the test piece via the upper hand and the lower hand.

Therefore, even a test piece that cannot be directly connected to the general-purpose tensile test device can be connected to the general-purpose tensile test device through the micro-bonding strength evaluation test jig, and thus the general-purpose tensile test device can be connected. A microbonding strength evaluation test can be performed on a test piece using a test apparatus.

According to the second aspect of the present invention, the movement of the jig upper half body relative to the jig lower half body can be uniquely positioned, so that the load in the direction necessary for the microbonding strength evaluation test can be determined. Can only be applied to the test piece,
The reliability of the test can be increased.

According to the third aspect of the present invention, the shear test can be performed on the test piece by disposing the claw so as to extend in the horizontal direction with respect to the mounting surface of the test piece. .

Further, according to the invention described in claim 4, the claws are arranged vertically with respect to the mounting surface of the test piece and offset from the center of the test piece, so that the test piece can be peeled off. The load in the direction is applied, and the peeling test can be performed.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a test jig that is a first embodiment of the present invention.

FIG. 2 is a diagram for explaining a tensile test device to which the test jig according to the first embodiment of the present invention is mounted.

FIG. 3 is a diagram for explaining an example of a test piece.

FIG. 4 is a diagram for explaining a test jig that is a second embodiment of the present invention.

FIG. 5 is a diagram for explaining a test jig that is a third embodiment of the present invention.

FIG. 6 is a view for explaining a jig upper half body that constitutes a test jig that is a third embodiment of the present invention.

FIG. 7 is a view for explaining a jig lower half that constitutes a test jig that is a third embodiment of the present invention.

FIG. 8 is a diagram for explaining a test jig that is a fourth embodiment of the present invention.

FIG. 9 is a view (No. 1) for explaining a test jig that is a fifth embodiment of the present invention.

FIG. 10 is a view (No. 2) for explaining the test jig that is the fifth embodiment of the present invention.

[Explanation of symbols]

1A-1E test jig 3 Upper mounting flange 4 Lower mounting flange 5 Tensile test equipment 6 Rigid connection jig 7,18 Shimodai 8,15 Cylindrical sleeve 9 Guide key 10 test pieces 11a, 11b, 16a, 16b plates 12, 17 Upper stand 13 keyway 14 Fixed member 19 Fixing member operation hole 20 Upper positioning block 21A Tensile test nail 21B Shear Test Nail 22 Peel test nail 23 Positioning pin 24X, 24Y Lower hand 25X, 25Y upper hand 26 Lower hand guide 27 Upper hand guide 28 Lower positioning block 29 Test piece monitoring hole 30 Sleeve air holding guide 31 Sleeve stop pin 32 Sleeve stopper 36 fixing screw hole 38 Locking pin 40 Semiconductor device 41 bump 42 board 43 Tapered surface 44 Upper frame 45 Lower frame 46 Upper fixed recess 47 Lower fixed recess 48X, 48Y bottom push screw 49X, 49Y Top pressing screw 51 Positioning hole 50A jig upper half 50B jig lower half

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Mami Nagatake             4-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa             No. 1 within Fujitsu Limited F-term (reference) 2G061 AA01 AA11 AB01 AB03 BA01                       CB16 CB18 DA16 EA01 EA02                 5F044 LL01 RR00

Claims (4)

[Claims] 1. A micro-bonding strength evaluation test jig, which is mounted on a general-purpose tensile tester and used when performing a bonding strength evaluation test on a test piece, wherein a claw connected to an upper mounting flange of the general-purpose tensile tester is used. A jig upper half that has an upper hand that holds the upper portion of the test piece and a lower hand that is connected to the lower mounting flange of the general-purpose tensile testing device and that holds the lower portion of the test piece. A jig for micro-bonding strength evaluation, comprising: 2. The micro-bonding strength evaluation test jig according to claim 1, further comprising a positioning member for positioning the jig upper half body and the jig lower half body. Jig. 3. The micro-bonding strength evaluation test jig according to claim 1, wherein the claw is arranged so as to extend in a horizontal direction with respect to a mounting surface of the test piece. Jig. 4. The micro-bonding strength evaluation test jig according to claim 1, wherein the claw is perpendicular to a mounting surface of the test piece,
A jig for evaluating micro-bonding strength, which is arranged so as to be displaced from the center of the test piece.