JP2013072847A - Testing holder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost testing holder capable of efficiently testing an object to be tested in accordance with the fine pitch and fine region of electrodes while suppressing the influence of the object to be tested on the electrodes.SOLUTION: The testing holder includes a testing probe 31 in which a plurality of contact shoes 33 having conductivity to be brought into contact with electrodes 22 of an object to be tested 21 are formed on a base plate 32 by a small electromechanical system technique, and a probe block 12 for supporting the testing probe 31, the testing probe 31 is arranged perpendicularly to the object to be tested 21, tip sides of the contact shoes 33 of the testing probe 31 are bent with respect to the surface of the base plate 32 at a predetermined angle, the probe block 12 and the object to be tested 21 are brought into close contact with each other, to thereby be brought into close contact with the object to be tested 21 from a perpendicular direction, and contact points 35 composed of tips of the contact shoes 33 are brought into contact with the electrodes 22 of the object to be tested 21.

Description

  The present invention relates to an inspection jig used when inspecting an electronic device, a semiconductor device, a display device, or the like.

  An electronic device, a semiconductor device, a display device, or the like is subjected to an energization test or the like using an inspection jig. As such an inspection jig, a large number of cantilever-type probe needles are provided on the substrate, and the intermediate portion of each probe needle covered with an insulating tube is embedded in an integrated conductive material connected to the ground wiring on the substrate. A cantilever type inspection jig is known (for example, see Patent Document 1).

  In addition, a plurality of probes that contact the electrode pad of the measurement object, a probe head to which the probes are attached, a substrate on which a signal line connected to the probe is formed, and a conductive wire that connects the signal line and the probe And a vertical probe in which the signal line is exposed in each layer. It is known (see, for example, Patent Document 2).

JP 2006-71358 A JP 2000-162239 A

  In recent years, miniaturization and high integration of electronic devices, semiconductor devices, and display devices, which are inspected objects mounted on electronic equipment, have been actively performed. Fine pitch and fine area.

  In such a situation, the cantilever type probe shown in Patent Document 1 requires a certain needle diameter to maintain the durability. It is difficult to apply. In addition, large needle marks are formed on the electrodes of the object to be inspected, which causes a defect in the mounting process after the inspection process. Further, in order to inspect the stepped shape of the inspected object such that the electrode is disposed at a position recessed inward from the surface of the inspected object, the length of the needle tip must be increased, Ensuring the positional accuracy of the contact point of the needle tip and controlling the pressing load on the electrode becomes difficult, and the durability is lowered.

  In addition, in the vertical probe disclosed in Patent Document 2, it is difficult to form holes for supporting the probe with respect to the ceramic plate that supports the probe with a fine pitch of, for example, 100 μm or less. For this reason, it has been difficult to cope with the fine pitching of the electrodes of the object to be inspected. Also, the ceramic plate supporting the probe interferes, making it difficult to confirm the contact location of the probe contact to the electrode. For this reason, an expensive alignment device is required, which increases the inspection cost.

  An object of the present invention is to provide a low-cost inspection jig capable of efficiently inspecting an object to be inspected in response to a fine pitch and a fine area of the electrode while suppressing an influence on the electrode of the object to be inspected. Is to provide.

The inspection jig of the present invention that can solve the above problems is an inspection jig that inspects an object to be inspected having a plurality of electrodes,
A plurality of contacts having conductivity to be brought into contact with the electrodes of the object to be inspected, comprising a probe for inspection formed on a substrate by a microelectromechanical system technology, and a probe block that supports the probe for inspection;
The inspection probe is disposed perpendicular to the object to be inspected, and the tip end side of the contact of the inspection probe is bent at a predetermined angle with respect to the surface of the substrate;
When the probe block and the object to be inspected are brought close to each other, the contact made of the tip of the contact is brought into contact with the electrode of the object to be inspected by being brought close to the object to be inspected from the vertical direction. Features.

  In the inspection jig of the present invention, when the probe block is in proximity to the object to be inspected, the amount of displacement in the proximity direction from the point in time when the contactor contacts the electrode of the object to be inspected is made constant. It is preferable that a stopper to be regulated is provided.

  In the inspection jig according to the present invention, when the load in the proximity direction between the probe block and the object to be inspected reaches a predetermined amount, the probe block is slid to move the probe block and the object to be inspected. It is preferable to provide a slide mechanism that makes the load in the proximity direction constant.

  According to the present invention, the plurality of conductive contacts that are in contact with the electrodes of the object to be inspected include the inspection probe formed on the substrate by the microelectromechanical system technology. Even an integrated electronic device, semiconductor device, or display device can be inspected with good response. In addition, by using a highly durable inspection probe manufactured by a microelectromechanical system technology, it is possible to suppress the occurrence of defects even when repeatedly used, and to extend the service life.

  Further, since the contact is bent, the contact is favorably elastically deformed when the contact contacts the electrode of the object to be inspected. As a result, the contact can be brought into contact with the electrode of the object to be inspected while ensuring a stable contact, eliminating the problem of leaving a contact mark on the electrode and preventing the electrode from being damaged as much as possible. Therefore, the yield of the inspection object after the inspection process can be improved, and the manufacturing cost of the inspection object can be reduced.

  In addition, since the inspection can be performed close to the object to be inspected from the vertical direction, it is easy to position the contact of the inspection probe and the electrode of the object to be inspected without using an expensive positioning device. Can be planned. Further, since the inspection is performed close to the object to be inspected from the vertical direction, even if the electrode has a stepped shape such that it is disposed at a position recessed inward from the surface of the object to be inspected, the contactor Can be easily inspected by bringing the contact points into contact with the electrodes.

It is a perspective view showing one embodiment of the inspection jig concerning the present invention. It is a figure which shows one Embodiment of the jig | tool for an inspection which concerns on this invention, Comprising: (a) is a top view, (b) is a side view, (c) is a front view, (d) is a rear view, (e) Is a back view. It is a disassembled perspective view which shows the structure of the jig | tool for an inspection. It is a top view of the inspection probe provided in the inspection jig. It is a side view in the front-end | tip of the contact of the probe for a test | inspection contacted to a to-be-inspected object. It is a figure which shows the contact method of the contact of the probe for a test | inspection to a to-be-inspected object, Comprising: (a) And (b) is a side view in the front-end | tip of a contactor, respectively. It is a perspective view which concerns on other embodiment of the jig | tool for an inspection. It is a figure which shows other embodiment of the jig | tool for a test | inspection, Comprising: (a) is a top view, (b) is a side view, (c) is a front view, (d) is a back view. It is a figure which shows an example of the manufacturing process of a test probe, Comprising: (a)-(i) is sectional drawing of the test probe in the middle of manufacture, respectively.

Hereinafter, an example of an embodiment of an inspection jig according to the present invention will be described with reference to the drawings.
As shown in FIG. 1, the inspection jig 11 according to the present embodiment includes a probe block 12 and is disposed above the object to be inspected 21. The inspection jig 11 is used with a probe block 12 fixed to a base plate 15 of an inspection apparatus. The inspection object 21 is held on the upper surface of the inspection object block 13 which is a stage. The inspected object block 13 is vertically contacted and separated from the probe block 12. When the inspection object 21 is inspected, the inspection object block 13 rises and approaches the probe block 12. The inspection jig 11 and the inspection object block 13 are separate bodies, and the inspection object block 13 may not include the inspection object block 13.

  This inspection jig 11 is used when conducting an energization test of an inspected object 21 such as a high-density wiring board, a stepped wiring board, an electronic device, a semiconductor device, or a display device. Incorporated and used. Examples of the display device to be inspected 21 include a flat panel display (FPD) and an organic EL display.

  As shown in FIGS. 2 and 3, the probe block 12 has a support block 23 that protrudes toward the object block 13, and a fixed block 24 is fixed to one side of the support block 23. Has been. A positioning pin 25 and a screw hole 26 are formed in the support block portion 23. Further, the fixing block 24 is formed with a positioning hole 27 into which the positioning pin 25 is inserted and a bolt insertion hole 29 into which the bolt 28 is inserted. The fixing block 24 is inserted into the positioning hole 27 through the positioning pin 25 of the support block portion 23, and the bolt 28 inserted into the bolt insertion hole 29 is screwed into the screw hole 26 of the support block portion 23. It is positioned and fixed to the portion 23.

  The fixed block 24 fixed to the support block portion 23 has a probe mounting portion 30, and inspection probes 31 are fixed to both side surfaces of the probe mounting portion 30. As a method of fixing the inspection probe 31 to the probe mounting portion 30 of the fixing block 24, adhesive fixing, screwing fixing, clamping, or the like is preferable.

  As shown in FIG. 4, the inspection probe 31 includes a substrate 32 made of an insulating material, and a plurality of contacts 33 that extend outward from the edge of the substrate 32 and are arranged in parallel. The tip of the contactor 33 is a contact 35. The contact 33 is made of a conductive material, and the base end side thereof is disposed on the substrate 32. In addition, a wiring pattern 34 is formed on the substrate 32 so as to be connected to the contact 33 to be conductive.

  The wiring pattern 34 of each inspection probe 31 has a vertical portion 34 a along the extending direction of the contact 33 and a horizontal portion 34 b along the direction orthogonal to the extending direction of the contact 33. Each vertical portion 34 a is arranged at substantially the same pitch as the contact 33 having a narrow pitch, and the horizontal portion 34 b is arranged to be enlarged to a pitch larger than the pitch of the contact 33. Thus, the wiring 51 can be easily formed by converting and enlarging the pitch of the horizontal portion 34b to which the wiring 51 is connected to the vertical portion 34a having a narrow pitch because it is connected to the contact 33. Can be connected.

  The probe 31 for inspection collectively forms a wiring pattern 34 and a contactor 33 to be a fine contact 35 on a substrate 32 by using a micro electro mechanical systems (MEMS) technique which is a micro electro mechanical system technique such as photolithography. It is a thing.

  As shown in FIG. 5, the inspection probe 31 is arranged perpendicular to the inspection object 21 in which the substrate 32 is held by the inspection object block 13, and the contact 33 is formed from the lower edge of the substrate 32. It extends to the inspected object 21 side.

  Further, in each inspection probe 31, the vicinity of the tip of the contact 33 is bent toward the substrate 32. Thus, the contactor 33 has a proximal end side portion 33a extending along the substrate 32 with the bent portion 36 as a boundary, and a distal end side portion 33b extending inclined from the bent portion 36 at a predetermined angle. doing.

  In order to bend the vicinity of the tip of the contactor 33, for example, it is preferable to perform mechanical bending such as press working. According to such mechanical bending, various angles can be obtained at low cost. The contact 33 can be bent.

  The probe mounting portion 30 of the fixed block 24 to which the inspection probe 31 is fixed is provided with a stopper 50 that protrudes toward the inspection object block 13 during the arrangement of the contacts 33 between the inspection probes 31. Is formed. The stopper 50 protrudes slightly toward the inspected object block 13 from the contact 33 of each inspection probe 31.

  In the inspection probe 31, the wiring 51 is conductively connected to the end of the horizontal portion 34 b of the wiring pattern 34 by soldering or the like. These wires 51 are guided to the rear side through the upper surface of the probe block 12 and connected to the wire connector 52. The wiring connector 52 is connected to a counterpart connector (not shown) provided in the inspection apparatus, and a signal from the inspection probe 31 is guided to the inspection apparatus.

  The probe block 12 has a support portion 60 that projects upward from the fixed block 24, and the upper end portion of the fixed block 24 is in contact with the lower surface of the support portion 60.

Further, the probe block 12 has positioning holes 61, and positioning pins 62 formed on the base plate 15 are inserted into these positioning holes 61 to be positioned on the base plate 15. The probe block 12 has bolt insertion holes 63, and the bolts 64 inserted into these bolt insertion holes 63 are fixed to the base plate 15 by screwing them into the screw holes 65 of the base plate 15.
The base plate 15 is formed with a notch 67, and the support block 23 and the fixed block 24 of the probe block 12 are disposed in the notch 67.

Next, a case where the inspection object 21 such as a high-density wiring board, a stepped wiring board, an electronic device, a semiconductor device, or a display device is inspected with the inspection jig 11 having the above configuration will be described.
In a state where the inspection object block 21 holds the inspection object 21, the inspection object block 13 is raised, and the inspection object block 13 is brought close to the probe block 12.
Then, as shown in FIG. 6A, the contact point 35 of the contact 33 of the inspection probe 31 comes into contact with the electrode 22 of the inspection object 21.

  When the inspection object block 13 is further brought closer to the probe block 12 from this state, the contact point 35 of the contact 33 is pressed against the electrode 22 of the inspection object 21 as shown in FIG. As a result, the contact 33 is pressed against the electrode 22 of the device under test 21, whereby the tip side portion 33 b is elastically deformed, and the contact point 35 is pressed against the electrode 22 of the device under test 21 by the elastic force of the contact 33. The electrode 22 and the contact 33 are brought into conductive contact.

  Further, the lower end of the stopper 50 formed on the fixed block 24 of the probe block 12 comes into contact with the object to be inspected 21, and at this time, the pressing of the contactor 33 to the electrode 22 of the object to be inspected 21 is restricted.

  Therefore, even if the inspection object block 13 is further brought closer to the probe block 12 from this state, the stopper 50 of the fixed block 24 is brought into contact with the inspection object 21 and the contactor 33 to the electrode 22 of the inspection object 21 is Since the pressing is restricted and the displacement of the contactor 33 is stopped, an overload to the contactor 33 can be prevented. Thereby, the burden of the contactor 33 by prevention of the overload to the contactor 33 can be reduced.

  Then, in the state where the probe block 12 and the inspection object block 13 are brought close to each other and the contact 35 of the contact 33 of the inspection probe 31 is brought into contact with the electrode 22 of the inspection object 21 as described above, the inspection object 21. Can be satisfactorily performed.

  Thus, according to the inspection jig according to the above-described embodiment, the inspection probe in which the plurality of conductive contacts 33 that are in contact with the electrode 22 of the object to be inspected 21 are formed on the substrate 32 by the MEMS technique. Therefore, even if the device under test 21 is a miniaturized and highly integrated electronic device, semiconductor device, display device, or the like, it can be inspected with good response. Further, by using the highly durable inspection probe 31 manufactured by the MEMS technology, it is possible to suppress the occurrence of defects even when repeatedly used, and to extend the life.

  Further, since the contact 33 is bent, the contact 33 is elastically deformed satisfactorily when the contact point 35 contacts the electrode 22 of the device under test 21. As a result, the contact 33 can be brought into contact with the electrode 22 of the object to be inspected 21 while ensuring stable contact, eliminating the problem of leaving a contact mark on the electrode 22, and damaging the electrode 22 as much as possible. Can be prevented. Therefore, the yield of the inspection object 21 after the inspection process can be improved, and the manufacturing cost of the inspection object 21 can be reduced.

  In addition, since the inspection can be performed close to the inspection object 21 from the vertical direction, the contact 33 of the inspection probe 31 and the electrode 22 of the inspection object 21 can be connected without using an expensive positioning device. Positioning can be facilitated, and the number of work steps for positioning can be greatly reduced (about 1/10). Further, since the inspection is performed close to the inspected object 21 from the vertical direction, even if the stepped shape is such that the electrode 22 is disposed at a position recessed inward from the surface of the inspected object 21. The contact 35 of the contactor 33 can be brought into contact with the electrode 22 for easy inspection.

Next, another embodiment (modification) of the inspection jig according to the present invention will be described.
As shown in FIGS. 7 and 8, the inspection jig 11 </ b> A is provided with a slide mechanism 70.
The slide mechanism 70 has a support portion 71 fixed to the upper portion of the probe block 12. The support portion 71 has a support piece 72 projecting forward at the upper end thereof, and a movable portion 73 is fixed to the lower surface of the support piece 72. The movable portion 73 can be expanded and contracted in the axial direction. A movable block 74 is fixed to the lower end portion of the movable portion 73, and a fixed block 24 to which the inspection probe 31 is attached is integrally provided on the movable block 74. The movable portion 73 accommodates a spring (not shown) therein, and the movable block 74 is urged downward by this spring.

Even when the inspection object 21 such as an electronic device, a semiconductor device, or a display device is inspected with the inspection jig 11A having the above configuration, the inspection object block is held in the state where the inspection object block 21 is held by the inspection object block 13. 13 is raised, and the inspection object block 13 is brought close to the probe block 12.
Then, as shown in FIG. 6A, the contact point 35 of the contact 33 of the inspection probe 31 comes into contact with the electrode 22 of the inspection object 21.

  When the inspection object block 13 is further brought closer to the probe block 12 from this state, the contact point 35 of the contact 33 is pressed against the electrode 22 of the inspection object 21 as shown in FIG. As a result, the contact 33 is pressed against the electrode 22 of the device under test 21, whereby the tip side portion 33 b is elastically deformed, and the contact point 35 is pressed against the electrode 22 of the device under test 21 by the elastic force of the contact 33. The electrode 22 and the contact 33 are brought into conductive contact.

Further, the lower end of the stopper 50 formed on the fixed block 24 of the probe block 12 abuts on the inspection object 21, and at this time, the pressing of the contact 33 of the inspection probe 31 against the inspection object 21 is restricted. .
When the inspection object block 13 is further brought closer to the probe block 12 from this state, the movable portion 73 in which the spring of the slide mechanism 70 is accommodated contracts. As a result, the movable block 74 slides upward, and the inspection probe 31 of the fixed block 24 moves upward together with the inspection object 21.

  Therefore, the lower end of the stopper 50 abuts on the inspection object 21 and the pressing of the contact 33 of the inspection probe 31 against the inspection object 21 is restricted, and the load in the proximity direction between the probe block 12 and the inspection object 21 is reduced. Even if the inspection object block 13 is further brought closer to the probe block 12 from the time when the predetermined amount is reached, the movement of the inspection object block 13 is absorbed by the movable portion 73. Thereby, the load of the proximity | contact direction of the probe block 12 and the to-be-inspected object 21 is maintained constant, and the overload to the contactor 33 can be prevented reliably. Therefore, the burden on the contact 33 due to prevention of overload on the contact 33 can be further reduced, and damage due to the load on the device under test 21 can be suppressed.

Note that the slide mechanism 70 may include, for example, a movable portion 73 that detects a load acting on the fixed block 24 and electromagnetically contracts based on the detection result.
In the above-described embodiment, the case where the inspection object block 13 is inspected from the lower side with respect to the probe block 12 is described as an example. However, the probe block 12 is in proximity to the inspection object block 13. You may inspect.

Next, a method for manufacturing the inspection probe 31 provided in the inspection jigs 11 and 11A will be described.
To manufacture the inspection probe 31, first, as shown in FIG. 9A, a desired thickness (for example, 0.1 to 5.0 microns) is obtained by a printing method, a spin coating method, or the like. A photoresist 43 is applied on the substrate 32. Thereafter, pre-bake processing is performed to remove the solvent, and exposure and development are performed. If post-baking is necessary, carry out under appropriate conditions.

As shown in FIG. 9B, a sacrificial layer 44 made of a metal film is formed on the substrate 32 with a desired material and thickness. For example, the sacrificial layer 34 made of Ti and Cu is processed by sputtering using Ti / Cu = (100 to 500%) / (100 to 5000%).
Next, as shown in FIG. 9C, the unnecessary photoresist 43 and sacrificial layer 44 are removed by, for example, a lift-off method.

  As shown in FIG. 9D, a seed layer 45 of a desired material to be a plating power feeding layer is formed on the substrate 32 so as to obtain a desired thickness. For example, the seed layer 45 made of Ti and Ni alloy is formed by sputtering using Ti / Ni alloy = (100 to 2000%) / (500 to 5000%).

  A photoresist 46 for forming the contactor 33 and the wiring pattern 34 is applied by a printing method, a spin coating method or the like so as to have a desired thickness (for example, 10 to 50 microns), and then the solvent is removed. Therefore, pre-baking is performed, and exposure and development are performed. When a chemically amplified resist is used as the photoresist 46, a post-exposure heat treatment (Post Exposure Bake) is performed after exposure under appropriate conditions to promote the reaction.

As shown in FIG. 9E, the wiring layer 48 is formed by performing a plating process. The wiring layer 48 is formed from, for example, a Ni alloy (NiCo, NiMn, NiFe, NiPd, etc.) and formed to a thickness that can ensure a desired spring performance.
After the formation of the wiring layer 48, the photoresist 46 and the seed layer 45 are removed as shown in FIG.
Here, when the substrate 32 is thicker than the final desired thickness, the back surface of the substrate 32 is ground or polished to reduce the thickness of the substrate 32 to a desired thickness.

  Next, as shown in FIG. 9G, the individual outer shape is cut by dicing to form individual inspection probes 31, and grooves 47 are formed on the back surface of the substrate 32. At this time, the board | substrate 32 is affixed on a glass substrate with a heating foam type adhesive sheet. When peeling from the glass substrate after the processing is completed, the chip that is made by heating and foaming the adhesive sheet and taking it into pieces is taken out from the tape.

Thereafter, as shown in FIG. 9H, the sacrificial layer 44 is removed by selective etching. In this selective etching, for example, the copper (Cu) component is removed by immersing in a copper (Cu) removal solution for a certain period of time, and then immersed in ammonium perhydration to remove the titanium (Ti), thereby removing the titanium (Ti) component. Remove.
Thereafter, as shown in FIG. 9I, the substrate 32 is cut at the position of the groove 47, and the substrate 32 in the portion where the sacrificial layer 44 is removed is removed.
Finally, the contactor 33 is bent toward the substrate 32 by performing a mechanical bending process such as a press process on the vicinity of the tip of the contactor 33.

  As described above, by performing the manufacturing process using the MEMS technology, the inspection probe 31 on which the contactor 33 is formed can be manufactured in a short lead time, and the manufacturing cost of the inspection probe 31 is greatly reduced. Can be made.

11, 11A: Inspection jig, 12: Probe block, 13: Inspection object block, 21: Inspection object, 22: Electrode, 31: Inspection probe, 32: Substrate, 33: Contact, 35: Contact, 50: Stopper, 70: Slide mechanism

Claims (3)

An inspection jig for inspecting an object to be inspected having a plurality of electrodes,
A plurality of contacts having conductivity to be brought into contact with the electrodes of the object to be inspected, comprising a probe for inspection formed on a substrate by a microelectromechanical system technology, and a probe block that supports the probe for inspection;
The inspection probe is disposed perpendicular to the object to be inspected, and the tip end side of the contact of the inspection probe is bent at a predetermined angle with respect to the surface of the substrate;
When the probe block and the object to be inspected are brought close to each other, the contact made of the tip of the contact is brought into contact with the electrode of the object to be inspected by being brought close to the object to be inspected from the vertical direction. Characteristic inspection jig. The inspection jig according to claim 1,
The probe block is provided with a stopper for restricting the amount of displacement in the proximity direction from the point of contact of the contact to the electrode of the object to be inspected when the probe block is in proximity to the object to be inspected. Inspection jig characterized by The inspection jig according to claim 2,
When the load in the proximity direction between the probe block and the object to be inspected reaches a predetermined amount, the probe block is slid to make the load in the proximity direction between the probe block and the object to be inspected constant. An inspection jig comprising a slide mechanism.

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