JP2003174043A - Apparatus and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component-mounting apparatus and an electronic component-mounting method that can secure correct mounting position accuracy even when misalignment occurs in the relative position between the appearance of electronic components and an active surface. <P>SOLUTION: In the electronic component-mounting apparatus for taking out a chip 5 that is put to a wafer sheet 4 by a transfer head 16 for mounting onto a substrate 11, the chip 5 on the wafer sheet 4 is imaged by a component- recognizing camera 18 for detecting the appearance and active surface positions of the chip 5. In a path where a transfer head 16 that retains the chip 5 is moved to the substrate 11, the chip 5 is imaged from a rear side by a line camera 13 for detecting the appearance position of the chip 5. Then, when the chip 5 is to be mounted by the transfer head 16, a transfer head drive mechanism 42 is controlled based on a position detection result detected by the component recognition and line cameras 18 and 13, and the active surface of the chip 5 is alined to the substrate 11. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component such as a semiconductor chip attached to a wafer sheet on a substrate.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, a semiconductor chip is cut out from a wafer composed of a large number of individual chips, and the cut individual semiconductor chips are peeled off from a wafer sheet and picked up. In this pick-up process, the position of each semiconductor is detected by recognizing each semiconductor element by the camera arranged above the wafer sheet. Then, when the semiconductor element is taken out by the transfer head and mounted on the substrate, the position of the transfer head is adjusted based on the position detection result.

By the way, the center of the outer shape of the semiconductor chip and the center of the active surface such as a circuit pattern do not always coincide with each other due to factors such as a position error at the time of dicing for cutting the semiconductor wafer into pieces, and a position shift occurs. There is a case. Since the active surface is the standard for the mounting position accuracy of the semiconductor element on the board, when recognizing the position of the semiconductor element described above, the position of the active surface is detected to obtain the functional element center position. It is desirable to align the suction nozzle of the transfer head aiming at this.

[0004]

However, during the pickup operation in which the upper surface of the semiconductor element is vacuum-sucked by the suction nozzle and is taken out, the semiconductor element is apt to be displaced with respect to the suction nozzle, and the detected element center position is aimed at. Even if the suction nozzle is aligned, the semiconductor element is often in a misaligned state after pickup.
After the pickup, since the active surface of the semiconductor element is hidden by the suction nozzle, the center position of the element cannot be detected again. Therefore, in the conventional electronic component mounting apparatus, when the relative position between the outer shape of the electronic component such as a semiconductor element and the active surface such as the circuit pattern is misaligned, this misalignment directly affects the mounting position accuracy. It was a factor that caused the decrease.

Therefore, according to the present invention, even when the relative position between the outer shape of the electronic component and the active surface is displaced,
An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can ensure correct mounting position accuracy.

[0006]

An electronic component mounting apparatus according to claim 1, wherein the electronic component adhered to a wafer sheet is taken out by a transfer head and mounted on a substrate. A wafer holder that holds the component together with the wafer sheet, a first camera that images the electronic component held by the wafer holder from the active surface side of the electronic component, and the first camera moves on the wafer holder. A camera moving means, a first recognizing section for recognizing an image pickup result of the first camera to detect an outer shape position of the electronic component and an active surface position of the electronic component, and a transfer head for moving the transfer head. A drive mechanism, a second camera for picking up an image of an electronic component taken out by the transfer head and having the active surface held by the transfer head, and a second camera for recognizing an image pickup result of the second camera. The transfer head drive mechanism is controlled based on the second recognition unit that detects the outer shape position of the electronic component, and the position detection result by the first recognition unit and the position detection result by the second recognition unit. And a control unit.

An electronic component mounting method according to a second aspect is an electronic component mounting method in which an electronic component attached to a wafer sheet is taken out by a transfer head and mounted on a substrate, and the electronic component is held by a wafer holder. A first imaging step of imaging the component from the active surface side of the electronic component by the first camera, and detecting the external result position of the electronic component and the active surface position of the electronic component by recognizing the imaging result of the first imaging step First to do
Recognizing the image pickup result of the second image pickup step, and the second image pickup step of picking up the electronic component whose active surface side is held by the transfer head from the back side by the second camera. A second recognition step of detecting the outer shape position of the electronic component by means of a transfer head that drives the transfer head based on the position detection result of the first recognition step and the position detection result of the second recognition step. And a mounting step of mounting an active part of the electronic component held by the transfer head on the substrate by controlling the driving mechanism after aligning the active surface with the substrate.

According to the present invention, the external position of the electronic component and the position of the active surface of the electronic component are detected in the first recognition step in which the electronic component is picked up and recognized by the wafer holder, and the transfer head is used to detect the electronic component. The external position of the electronic component is detected again in the second recognition process in which the electronic component in the state of being picked up from and held by the transfer head is imaged and recognized from below, and the position detection result of the first recognition process and the second position are detected. By controlling the transfer head drive mechanism on the basis of the position detection result of the recognition step, the active surface of the electronic component held by the transfer head can be aligned with the substrate and then mounted on the substrate.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic diagram of an embodiment of the present invention. Sectional views of the unit transfer head of the component mounting apparatus, and FIGS. 4 and 5 are process explanatory diagrams of the electronic component mounting method according to the embodiment of the present invention.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a component supply unit 2 is arranged on a base 1. The component supply unit 2 includes a holding table 3, and a wafer sheet 4 to which a large number of semiconductor chips 5 (hereinafter simply referred to as “chips 5”), which are electronic components, are attached to the holding table 3. Holding The holding table 3 serves as a wafer holding unit that holds the chip 5 together with the wafer sheet 4.

As shown in FIG. 2, an ejector mechanism 6 is arranged below the holding table 3. The ejector mechanism 6 is provided with a movable table 6a.
A pin elevating mechanism 7 for elevating the ejector pin for pushing up the semiconductor chip is attached to a. By driving the movable table 6a, the pin lifting mechanism 7 moves in the XY directions below the wafer sheet 4.

A board carry-in conveyor 8A, a board distributing section 9, a board positioning section 10, a board take-out section 12 and a board carry-out conveyor 8B are arranged in series in the X direction on the side of the component supply section 2. The board carry-in conveyor 8A receives the board 11 on which the chip 5 is mounted from the upstream side and carries it in. The board allocating section 9 has a structure in which the transfer conveyor 9a is slidable in the Y direction by a slide mechanism 9b, and the board 11 received from the board carry-in conveyor 8A is mounted on two board positioning sections to be described below. Selectively distribute to the stage.

The board positioning unit 10 includes two mounting stages 10A and 10B, and positions the board 11 sorted by the board sorting unit 9 at the mounting position. The board take-out section 12 has a structure in which a transfer conveyor 12a is slidable in the Y direction by a slide mechanism 12b, similarly to the board sorting section 9, and the mounted board 11 can be mounted from two mounting stages 10A and 10B. It is selectively received and delivered to the substrate unloading conveyor 8B. The board unloading conveyer 8B carries out the mounted board 11 that has been mounted to the downstream side.

A first Y-axis table 14A and a second Y-axis table 14B are arranged at both ends of the upper surface of the base 1 in a direction orthogonal to the substrate transport direction (X direction). In the first Y-axis table 14A and the second Y-axis table 14B,
First X-axis table 15A, second X-axis table 15B
Has been erected. On the first X-axis table 15A, a multiple-type transfer head 16 including a plurality of unit transfer heads described later is mounted, and a substrate recognition camera 17 is transferred adjacent to the transfer head 16. It is arranged so as to be movable integrally with the head 16.

The transfer head 16 is driven by driving the first Y-axis table 14A and the first X-axis table 15A.
And the board recognition camera 17 moves integrally. The first Y-axis table 14A and the first X-axis table 15A are
A transfer head drive mechanism 42 that moves the transfer head 16 is configured. The transfer head drive mechanism 42 is controlled by the controller 40. Above the transfer head 16, an electropneumatic regulator 19 for controlling the pressure of pneumatic pressure supplied to the unit transfer head, which will be described later, is arranged. Electro-pneumatic regulator 1
9 is adjusted by the control unit 40 to adjust the pressure of the pneumatic pressure supplied from the pneumatic pressure supply unit as described later.

A component recognition camera 18 is mounted on the second X-axis table 15B.
The imaging data of is sent to the first recognition unit 41. Second Y
By driving the axis table 14B and the second X-axis table 15B, the component recognition camera 18 horizontally moves in the XY directions. The chip 5 attached to the wafer sheet 4 is imaged by imaging the lower side by the component recognition camera 18 located above the component supply unit 2. Then, the first recognition unit 41 performs recognition processing on the image data obtained by this imaging to detect the active surface position and the outer shape position of the arbitrary chip 5, and the position detection result is the control unit 4
Transmitted to 0.

The component recognition camera 18 is a first camera for taking an image of the chip 5 held on the holding table 3 from the active surface side, and the second Y-axis table 14B and the second X-axis table 15B are , Which is a camera moving means for moving the component recognition camera 18 on the holding table 3.

Based on this position recognition result, the transfer head 16 is aligned with the chip 5 to be taken out,
The chip 5 is picked up by the unit transfer head.
At the time of this pickup, the movable table 6a of the ejector mechanism 6 is driven to align the pin elevating mechanism 7 with the chip 5 in the same manner, and the pin elevating mechanism 7 raises the ejector pin to push up the chip 5 from below. As a result, the chip 5 is separated from the wafer sheet 4.

At this time, by picking up the plurality of chips 5 by the plurality of unit transfer heads of the transfer head 16, the transfer head 16 makes one reciprocation between the substrate 11 and the component supply unit 2 in one mounting turn. , Multiple chips 5
Can be taken out and transferred to and mounted on the substrate 11 of the substrate positioning unit 10.

A line camera 13 is arranged between the board positioning unit 10 and the component supply unit 2, and the component supply unit 2 is provided.
The transfer head 16 holding the chip taken out from the device moves in the X direction above the line camera 13 and performs a scanning operation, so that the chip 5 whose active surface side is held by the transfer head 16 is imaged from the back side. It The line camera 13 is a second camera that captures an image of the chip 5 whose active surface side is held by the transfer head 16 from the back surface side. The image data of the line camera 13 is sent to the second recognition unit 43,
By recognizing the imaged data by the recognition unit 43, the outer shape positions of the chips 5 are detected, and the position detection result is transmitted to the control unit 40.

The transfer head 16 moved above the substrate 11.
However, when performing the mounting operation of moving up and down with respect to the substrate 11 to mount the chip 5, the recognition result of the outer shape position by the second recognition unit 43 and the active surface position by the first recognition unit 41 described above. And the mounting position is corrected based on the outer shape position.

The control unit 40 uses the first X-axis table 15A,
The first Y-axis table 14A, the ejector mechanism 6, and the substrate positioning unit 10 are controlled, and the control unit 40 is transferred based on the position detection result of the chip 5 by the first recognition unit 41 and the second recognition unit 43. By controlling the head drive mechanism 42, the ejector mechanism 6, and the substrate positioning unit 10, the chip 5 is mounted in the electronic component mounting operation as described later.
Align the.

Next, the structure of the unit transfer head 20 mounted on the transfer head 16 will be described with reference to FIG.
In FIG. 3, a plurality of unit transfer heads 20 are arranged in parallel on a horizontal common base portion 16a. Here, only two adjacent unit transfer heads 20 are shown. A shaft holding portion 22 is fixed to the lower surface of the base portion 16a, and a slide bearing 25 is attached to the shaft holding portion 22.

A nut member 24 is coupled to an elevating shaft 26 which is fitted in a slide bearing 25 so as to be vertically slidable. A feed screw 23, which is rotationally driven by a motor 21 arranged perpendicularly to the upper surface of the base portion 16a, is screwed into the nut member 24. By rotating the motor 21, the elevating shaft 26 moves up and down.

At the lower end of the lifting shaft 26, the connecting block 2
The nozzle holding unit 30 is connected via 7. A slide bearing 31 is attached to the nozzle holding portion 30,
A nozzle shaft 32 is slidably fitted in the slide bearing 31. On the upper surface of the head 32a of the nozzle shaft 32,
Diaphragm valve 2 mounted on the top of the nozzle holder 30
9 is in contact.

The air chamber 29a of the diaphragm valve 29 is connected to the joint 2 through an inner hole 27a provided in the connecting block 27.
8 and the joint 28 is an electropneumatic regulator 19
Is connected to the air pressure supply unit 37 via. By supplying air pressure into the air chamber 29a by the air pressure supply unit 37, the diaphragm valve 29 exerts a downward load on the head portion 32a according to the air pressure supplied.

At this time, like the right unit transfer head 20 shown in FIG. 3, in the state where the lower end of the nozzle shaft 32 is in contact with the upper surface of the tip 5, the lower surface of the head portion 32a and the upper surface of the slide bearing 31. The downward load generated by the diaphragm valve 29 is transmitted to the nozzle shaft 32 as it is, and the chip 5 is pressed against the substrate 11 by lowering the nozzle holding portion 30 so that a slight gap C is generated between the nozzle 5 and the substrate 11. .

Below the nozzle shaft 32 is a suction nozzle 32b, and inside the suction nozzle 32b is a suction hole 32c.
Are formed. The suction hole 32c is connected to a vacuum pump 35 via a joint 33 and a vacuum valve 34, and the lower end of the suction nozzle 32b is brought into contact with the chip 5 and the vacuum pump 35 sucks vacuum from the suction hole 32c. The suction nozzle 32b holds the chip 5 by suction. The vacuum valve 34 switches between vacuum suction and suction release by the suction nozzle 32b by connecting and disconnecting the vacuum suction circuit.

In the above structure, the motor 21, the feed screw 23 and the nut member 24 serve as an elevating means for elevating and lowering the nozzle holding portion 30 holding the nozzle shaft 32 provided with the suction nozzle 32b. Further, the diaphragm valve 29 provided in the nozzle holding unit 30 applies a downward load due to air pressure to the suction nozzle 32b, so that the chip 5 is attached to the substrate 11 via the suction nozzle 32b when the chip 5 is mounted. It is a pressing means for pressing.

A common pneumatic pressure supply unit 37 supplies pneumatic pressure to each pressing means of the plurality of unit transfer heads 20. Here, the chip 5 is mounted on the substrate 11 by controlling the pressure of the pneumatic pressure supplied from the pneumatic pressure supply unit 37 to each unit transfer head 20 by the electropneumatic regulator 19 controlled by the control unit 40. It is possible to change the mounting load when doing.

The electronic component mounting apparatus is configured as described above, and the electronic component mounting method will be described below.
In FIG. 4A, the chip 5 attached to the wafer sheet 4 is imaged by the upper part recognition camera 18. Then, the image recognition result is subjected to recognition processing by the first recognition unit 41 to detect the outer shape position of the chip 5 and the position of the active surface 5a as shown in FIG. 4B (first recognition step). .

As a result, the outer shape center C1 of the chip 5 and the active surface center C2 of the chip 5 are detected, and based on this detection result, the positional deviation amount (Δx, Δy) between the outer shape center C1 and the active surface center C2. Is required. These detection results are transmitted to the control unit. Here, the positional deviation amount (Δx,
Δy) is caused by an alignment error in dicing the semiconductor wafer.

Then, the control unit 40 controls the transfer head drive mechanism 42 and the ejector mechanism 6 based on the position detection result, and the chips are picked up by the suction nozzles 32b provided in each unit transfer head 20 of the transfer head 16. Adsorb and take out 5. At this time, as shown in FIG. 4C, the control unit 40 controls so that the nozzle center of the transfer head 16 is aligned with the active surface center C2 of the chip 5.

Then, the chip 5 is sucked by the suction nozzle 32b.
After the upper surface of the wafer is sucked, as shown in FIG. 4D, the suction nozzle 32b is raised to move the chip 5 onto the wafer sheet 4.
Peel from. In this take-out operation, the chip 5
Is likely to be displaced with respect to the suction nozzle 32b,
In the state after raising the suction nozzle 32b, the center C2 of the active surface and the nozzle center of the suction nozzle 32b do not necessarily coincide.

Then, the chip 5 is picked up by the suction nozzle 32b.
The transfer head 16 holding the above moves to above the substrate positioning unit 10. In this movement path, as shown in FIG. 5A, the chip 5 held by the suction nozzle 32b is imaged from the back side by the line camera 13. The outer shape position of the chip 5 is detected by performing recognition processing on this imaging result by the second recognition unit 43 (second recognition step).

After that, the chip 5 is mounted on the substrate 11. That is, as shown in FIG. 5B, the suction nozzle 32b is lowered to the substrate 11 on which the resin adhesive 44 is applied in advance at the mounting position, and the chip 5 is attached to the resin adhesive 4 on the substrate 11.
Mounted on 4. In this mounting operation, based on the outer shape position detection result by the second recognition unit 43 and the positional deviation amount (Δx, Δy) between the outer shape center C1 and the active surface center C2 detected in FIG. 4B. That is, based on the position detection result of the first recognition process and the position detection result of the second recognition process, the chip 5 held by the suction nozzle 32b.
The control unit calculates the accurate position of the active surface of the transfer head and controls the transfer head drive mechanism 42.

As a result, even if the nozzle center of the suction nozzle 32b and the center C2 of the active surface of the chip 5 are displaced, as shown in FIG. It is possible to mount the chip 5 by correcting the position deviation error of (1) and then correctly aligning the center position of the active surface 5a with the mounting position of the substrate 11.

[0038]

According to the present invention, the outer shape position of the electronic component and the active surface position of the electronic component are detected in the first recognition step in which the electronic component is imaged and recognized in the component supply unit.
In the second recognition step of recognizing the electronic component in a state of being taken out from the component supply section by the transfer head and held by the transfer head from below, the external position of the electronic component is detected again, and the first recognition step is performed. By controlling the transfer head drive mechanism that drives the transfer head based on the position detection result of step 2 and the position detection result of the second recognition step, the active surface of the electronic component held by the transfer head is transferred to the substrate. It can be mounted on a substrate after being aligned with the mounting position.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a sectional view of a unit transfer head of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.

FIG. 5 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.

[Explanation of symbols]

2 parts supply department 5 chips 10 Board positioning part 10A, 10B mounting stage 11 board 13 line camera 16 Transfer head 18 Parts recognition camera 20 unit transfer head 40 control unit 41 First Recognition Unit 42 Transfer head drive mechanism 43 Second recognition unit

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Claims (2)

[Claims] 1. An electronic component mounting apparatus for picking up an electronic component attached to a wafer sheet by a transfer head and mounting the electronic component on a substrate, and a wafer holding section for holding the electronic component together with the wafer sheet, and the wafer holding unit. A first camera for picking up an image of the electronic component held by the electronic part from the side of the active surface of the electronic part, a camera moving means for moving the first camera on the wafer holding part, and recognizing an image pickup result of the first camera By doing so, a first recognizing unit that detects the outer shape position of the electronic component and the active surface position of the electronic component, a transfer head drive mechanism that moves the transfer head, and the transfer head that is taken out by the transfer head A second camera that takes an image of the electronic component whose active surface side is held from the back side, and a second recognition that detects the external position of the electronic component by recognizing the imaging result of the second camera And an electronic component mounting apparatus that controls the transfer head drive mechanism based on a position detection result of the first recognition unit and a position detection result of the second recognition unit. . 2. An electronic component mounting method for picking up an electronic component attached to a wafer sheet by a transfer head and mounting the electronic component on a substrate, wherein the electronic component held by a wafer holding portion is placed from an active surface side of the electronic component. First imaged by the first camera
Image pickup step, a first recognition step of detecting the outer shape position of the electronic component and the active surface position of the electronic component by recognizing the image pickup result of the first image pickup step, and the active surface side by the transfer head. A second imaging step of imaging the held electronic component from the back side by a second camera, and a second recognition step of recognizing the external result position of the electronic component by recognizing the imaging result of the second imaging step. , An electron held by the transfer head by controlling a transfer head drive mechanism that drives the transfer head based on the position detection result of the first recognition step and the position detection result of the second recognition step. And a mounting step of mounting an active surface of a component on the substrate after aligning the active surface of the component with the substrate.