JP2003152341A - Multilayer composite material used for forming conductor of printed wiring board, method of manufacturing it and printed wiring board using multilayer composite material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer composite material that does not require an etching barrier layer removing process and a re-roughening treatment process that are essential for a conventional multilayer composite material manufacturing process for manufacturing a printed wiring board by directly forming bumps on a surface. SOLUTION: This multilayer material has a four-layer structure having a first bulk copper layer 8 for forming a circuit pattern, an etching barrier metal layer 7, a roughening treatment layer 6 and a second bulk copper layer 2 used for forming a bump shape for obtaining the interlayer conduction of a multilayer printed wiring board, and a multilayer composite material or the like used for the formation of the conductor of the printed wiring board with each layer formed by using an electrochemical technique or an etching method is used. A manufacturing method or the like mainly adopting these electrochemical techniques are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer composite material used for forming an interlayer conductive conductor having the same function as a circuit shape and a through hole of a printed wiring board.

[0002]

2. Description of the Related Art In recent years, due to intensifying international competition in printed wiring board manufacturing, how to reduce manufacturing costs and supply inexpensive and high-quality products is very important for increasing profitability of companies. ing.

Therefore, in order to reduce the manufacturing cost, the technique of omitting the interlayer conductive plating process of the through holes of the double-sided or multi-layered printed wiring board having three or more layers and significantly reducing the production cost of the printed wiring board has become widespread. It was For example, a typical manufacturing method is the B ² it method adopted by Toshiba Corporation. If this B ² it method is simply expressed, it functions like a through hole by using a metal paste such as a copper paste or a silver paste in advance on the bonding surface of the copper foil used for manufacturing the printed wiring board with the insulating resin. The bump shape that will form the interlayer conductive conductor is manufactured by the screen printing method and cured, and in this state, FR-4
When the prepreg such as a base material is overlaid and pressure-laminated, the bump-shaped hardened metal paste breaks through the prepreg and hits the copper foil surface disposed on the opposite surface to form a conductive path between the layers.

Then, as a multilayer composite material used for forming a conductor of a printed wiring board used in such a manufacturing method,
4 in order of the first bulk copper layer for forming the circuit pattern / roughening layer / etching barrier metal layer / second bulk copper layer used for forming the bump shape for obtaining interlayer conduction of the multilayer printed wiring board 4 A material in which a layer structure is pressure-laminated by using a rolling method has been proposed.

[0005]

However, the multilayer composite material used for forming the conductor of the printed wiring board manufactured by this rolling method has the following drawbacks. In order to manufacture the multilayer composite material using the rolling method,
A thick film rolled copper foil having a thickness of 0 μm or more and a copper foil having a thickness of 18 μm or more having a roughening surface roughened with copper grains on one side are sandwiched by a nickel layer and rolled. By doing so, it is manufactured as having a layer structure schematically shown in FIG.

At the time of carrying out this rolling process, even if hot rolling is adopted, in order to apply pressure to the two copper foils through the nickel layer to form a clad state, a considerable rolling pressure is required. Will be loaded. As a result, 120μ
The thickness of a thick film rolled copper foil having a thickness of m or more is 10
It becomes thin in the range of 0 μm to 120 μm, and the other 1
Copper foil with a thickness of 8 μm or more Even the copper particles attached to the surface of the copper foil are crushed and deformed during rolling.

In the first place, in the multilayer composite material A, first, only the thick film rolled copper foil WC having a thickness of 100 μm to 120 μm is etched, and as shown in FIG. It is processed into the shape of the bump 3 which becomes a conductor for obtaining interlayer conduction of the plate. And in FIG.
As shown in (c), the nickel layer 7 exposed between the bumps 3 is removed by using an etching method.

When the removal of the nickel layer 7 by etching is completed, the copper grains which are the flattened roughened layer 6 crushed by rolling are exposed. At this stage, the surface of the flattened copper particles is further
As shown in FIG. 8 (d), the re-roughening treatment for depositing and forming the copper particles R is performed. The importance of this re-roughening treatment will be described below.

When the re-roughening process is completed, the prepreg and the laminating process are performed by using the re-roughening process. This stacking process is shown in FIG. At the stage where this lamination is completed, the other thin copper foil 8 is etched to manufacture the shape of the conductor circuit. In consideration of later applications, as shown in FIG. 29 (F-2). In some cases, it may be manufactured as a double-sided plate, or as a single-sided plate as shown in FIG. 29 (F-1). At this time, unless the above-described re-roughening treatment of the copper grains R is performed, the original copper grains R are flattened, so that the anchor effect cannot be obtained, and the gap between the bumps 3 is not formed. Therefore, the adhesion between the circuit 11 located at and the insulating layer 4 cannot be secured, and the peeling strength, which is a basic characteristic required for the printed wiring board, cannot be satisfied. If the re-roughening process is not performed, the case of less than 1.0 kgf / cm may occur.

Then, the double-sided plate manufactured as shown in FIG. 29 (F-2) and the single-sided plate manufactured as shown in FIG. 29 (F-1) are combined to obtain the structure shown in FIG. By laminating as shown, a multilayer printed wiring board is manufactured. In addition, in the present specification, the production of a multilayer printed wiring board described below is also described by exemplifying the production of a four-layer board. Therefore, it is obvious that it is possible to easily increase the number of layers to four or more.

The above-mentioned steps certainly omit complicated steps such as drilling step, desmear step, catalyzing step, electroless plating step and electrolytic plating step for forming through-hole plating, which involves solution management. It will be possible, but in the market, omitting the number of steps more,
A method for further reducing the production cost has been desired.

[0012]

As a result of earnest research, the inventors of the present invention have the following inventions, and can significantly reduce the manufacturing cost of a printed wiring board and supply a cheaper printed wiring board. The present invention has been made possible. The present invention will be described below.

The first multilayer composite material according to the present invention comprises a first bulk copper layer (hereinafter, simply referred to as "first bulk copper layer") / etching barrier metal layer / roughening for forming a circuit pattern. In a multilayer material having a four-layer structure of a second bulk copper layer (hereinafter, simply referred to as "second bulk copper layer") used for forming a bump shape for obtaining interlayer conduction of a treatment layer / multilayer printed wiring board The first bulk copper layer or the second bulk copper layer is used as a reference layer, and another layer is formed thereon by using an electrochemical method. A schematic cross-sectional view of the multilayer composite material 1a according to the present invention is shown in FIG. This multilayer composite material 1
a is the first bulk copper layer 8 / etching barrier metal layer 7 /
It has a layer structure of roughening treatment layer 6 / second bulk copper layer 2. On the other hand, in the multilayer composite material manufactured by the conventional rolling method, the first bulk copper layer 8 /
It has a layer structure of roughening treatment layer 6 / etching barrier metal layer 7 / second bulk copper layer 2, and the order of etching barrier metal layer 7 and roughening treatment layer 6 is reversed.

In the case of the multilayer composite material manufactured by the conventional rolling method, as described with reference to FIGS. 28 to 29,
After the second bulk copper layer 2 is etched into the bump shape 3, the fine copper particles are flattened by rolling, and at the same time, the etching barrier metal layer 7 on the roughened roughened layer 6 is removed. When the multilayer composite material manufactured by the conventional rolling method is used, the re-roughening treatment is indispensable in order to maintain the peeling strength, and therefore the removal of the etching barrier metal layer 7 is also indispensable.

On the other hand, the multilayer composite material 1a according to the present invention is manufactured by using the electrochemical method and the etching method, and the layer structure at this time is the first bulk copper layer 8 / Etching barrier metal layer 7 / roughening layer 6
/ It has been found that the use of the second bulk copper layer 2 exhibits a very useful effect. In addition, the electrochemical method in the present specification refers to a manufacturing method that employs an electrochemical process such as an electrolysis method and an electroless plating method. Hereinafter, this newly produced effect will be described.

First, a definite difference from the multi-layer composite material produced by using the conventional rolling method is that all the layer structures are produced by using the electrochemical method, so that the roughening treatment layer 6 is roughened. The shape of the treated layer (fine copper particles) is not crushed and flattened, and the original shape of the fine copper particles deposited and formed electrolytically can be maintained all the time. Then, the etching barrier metal layer 7 of the multilayer composite material according to the present invention
Can have a shape in which surface irregularities created by the fine copper particles of the roughening treatment layer 6 are transferred.

Therefore, as shown in FIG. 1B, it is necessary to remove the etching barrier metal layer 7 and perform re-roughening treatment after etching the second copper layer 2 into a bump shape. It is possible to lose it. That is, when the multilayer composite material 1a according to the present invention is used, as shown in FIG. 1B, the second copper layer 2 is formed on the bump 3 by etching and the roughening treatment layer 6 at the position where the bump 3 is not formed is formed. Fine copper grains disappear. However, the etching barrier layer 7
Is in a state in which the uneven shape of the fine copper particles of the roughening treatment layer 6 has been transferred, so that even if prepregs are laminated as shown in FIG. 2C, the prepreg 4 and the first copper layer 8 Thus, the anchor effect at the adhesive interface is obtained, and the peeling strength is not impaired. And FIG.
As is clear from (d-1) and (d-2), the excess etching barrier layer 7 can be removed simultaneously with copper etching when the first copper layer 8 is etched to form a circuit shape. It will be possible.

The roughening treatment layer 6 in the present invention, which is formed by depositing fine copper particles, may be formed by chemically etching the surface of the copper foil which will form the second bulk copper layer. Any of the direct roughening methods may be adopted. However, in the case of forming fine copper particles by adhesion, the smaller the size of the fine copper particles to be adhered, the more stable the adhesion with the prepreg and the higher the peeling strength tend to be secured. The same tendency is the same when chemically etching the surface of the copper foil that will form the second bulk copper layer. Just to make sure, I'll put it here,
The roughening treatment layer 6 in the drawing is described as being extremely schematic and large so that the explanation can be more clearly understood, and the thickness of the other layers is shown so that the fine copper particles are adhered and formed. The dimensions such as the size and the like do not correspond to the actual products, but are merely schematic representations.

As is clear from the above, the etching barrier layer removing step and the re-roughening step which are essential steps in the multilayer composite material manufactured by the conventional rolling method are performed.
The process can be omitted, the manufacturing process of the printed wiring board can be shortened, and the manufacturing cost of the printed wiring board can be significantly reduced.

The etching barrier metal layer 7 according to the present invention is preferably composed of nickel, nickel alloy, tin, tin alloy. By using the alkaline copper etching solution, it is possible to dissolve only the copper component and easily leave it. The nickel alloy mentioned here is nickel-tin, nickel-zinc, nickel-copper, nickel-phosphorus, nickel-cobalt, etc., and the tin alloy is tin-nickel, tin-zinc, tin-copper, tin- Lead, etc. The thickness of the etching barrier layer 7 needs to be 4000 mg / m ² or more in terms of converted weight when converted as a plane. That is, it is an indispensable amount for transferring the uneven shape of the roughening treatment layer 6, and is necessary for exhibiting the anchor effect for securing the adhesion of the first bulk copper layer 8 to the insulating material. The minimum amount.

Next, the second bulk copper layer 2 has a thickness of 50 to 150.
It is desirable to configure it as a copper layer with a thickness of μm.
Since the second bulk copper layer 2 is used to form the bump shape, the thickness of the second bulk copper layer 2 is the height of the bump 3 as it is. Therefore, it is considered that the thickness of the second bulk copper layer 2 may be arbitrarily selected and used according to the thickness of the prepreg used to form the insulating layer.
If the height of the bumps 3 is too low, the bumps 3 cannot break through the prepreg and the interlayer conductors cannot be formed even if the bumps 3 are pressed and pressed. Therefore, when considering that the thickness of the prepreg used is 25 to 100 μm and the formability, for example, when using a prepreg having a nominal thickness of 100 μm, the height of the bump 3 is 100 to 150 μm. Therefore, it can be judged that the best product processing is possible. The upper limit of 150 μm is
This is determined in consideration of the protrusion distance from the prepreg of the crown of the bump 3 when the bump 3 penetrates the prepreg having a nominal thickness of 100 μm. The lower limit value of 50 μm is set in consideration of the case of using a prepreg having a nominal thickness of 25 μm.

Since the first bulk copper layer 8 is used for manufacturing a signal transmission circuit, a power supply circuit, etc. of a printed wiring board, its thickness is arbitrarily determined in consideration of the wiring density of the circuit to be manufactured. It would be nice. Therefore, it is not necessary to particularly limit the thickness of the first bulk copper layer 8. However, in the case of the multilayer composite material manufactured by using the conventional rolling method, it was impossible to manufacture it unless the first copper layer had a thickness of 18 μm or more. It was a limit that occurred when the manufacturing method called rolling was adopted. On the other hand, if the electrolysis method is used as in the present invention,
It is also easy to manufacture the first bulk copper layer 8 having a thickness of less than m.

The multilayer composite material 1a described above is subjected to circuit etching as shown in FIG. 2 (d-1) to be a printed wiring board for build-up. On the other hand, as shown in FIG.
2 (d) after the copper foils are bonded together as shown in FIG.
The inner layer circuit etching is performed as in (-2-) to form the inner layer material of the multilayer printed wiring board. Further, by stacking them as shown in FIG. 3 and press-working, so-called 4
A layered substrate is obtained.

The above-mentioned four-layer multi-layer composite material 1a is
The second bulk copper layer 2 is used as a reference layer, and the electrolytic method is used.
It can be manufactured by the flow shown in. The starting material is
A copper foil is used for the second bulk copper layer 2 shown in FIG. 4 (1). As shown in FIG. 4B, the second bulk copper layer 2
The roughening treatment layer 6 is formed by depositing fine copper particles on one surface of the substrate by an electrolytic method. And FIG.
As shown in (3), the etching barrier layer 7 which is not corroded by the copper etching solution is formed on the roughening treatment layer 6. Furthermore, as shown in FIG.
It is obtained by adopting a manufacturing method in which the first bulk copper layer 8 is formed on the etching barrier layer 7 using an electrochemical method. Further, when the first bulk copper layer 8 is used as the reference layer, the flow shown in FIG. 5 may be simply adopted, and other individual process conditions and the like are the same as those in FIG. , Omitted to avoid duplicate description. Less than,
Details regarding this step will be described.

Here, the second bulk copper layer 2 has a thickness of 50 μm.
There is no problem with using either rolled copper foil or electrolytic copper foil having a thickness of up to 150 μm and smooth on both sides. However, in the case of rolled copper foil, it is preferable to use oxygen-free copper having higher mechanical strength than tough pitch copper. This is because softening does not easily occur at high temperatures, and it becomes easy to penetrate when breaking through the prepreg.

The electrolysis conditions used when fine copper particles are adhered and formed on one surface of the rolled copper foil or electrolytic copper foil forming the second bulk copper layer 2 by the electrolysis method are so-called burn plating conditions. . Therefore, in general, a solution having a low copper concentration is used so that the burnt plating condition can be easily created as compared with the case of performing uniform plating. The burn plating conditions are not particularly limited, and are determined in consideration of the characteristics of the production line. For example, if a copper sulfate-based solution is used, the concentration is 5 to 20 g / l of copper and 5% of sulfuric acid.
0-200 g / l, other optional additives (α-naphthoquinoline, dextrin, glue, thiourea, etc.),
The conditions are such that the liquid temperature is 15 to 40 ° C. and the current density is 10 to 50 A / dm ² .

In the manufacturing method used in the present specification, since the etching barrier layer 7 is formed later, it is not essential, but after forming the fine copper particles, the fine copper particles are prevented from falling off and the fine copper particles are not removed. It is also possible to perform overcoating for the purpose of grain size growth. This cover plating is for uniformly depositing copper so as to coat fine copper particles under smooth plating conditions, and a solution that can be used as a copper ion supply source such as a copper sulfate-based solution or a copper pyrophosphate-based solution is used. There is no particular limitation on the use, and electrolysis is carried out for a short time using a solution similar to that used for forming the first bulk copper layer 8 described below. Therefore, in the manufacturing method according to the present invention, the roughening treatment layer 6 is described as a concept including both the case of including the covering plating and the case of not including the covering plating. The roughening treatment layer 6 is formed as described above.

A case where the roughening treatment layer 6 is directly formed on the surface of the second bulk copper layer 2 by a chemical etching method will be described. Although referred to as a chemical etching method here, it is described as a concept including a case where roughening etching is simply performed using an etching solution and a case where electrolytic etching is performed using PR electrolysis in the etching solution. Therefore, the etching solution used here is not particularly limited, and a commercially available roughening etching solution or the like can be used.

When the formation of the roughening treatment layer 6 is completed, the etching barrier layer 7 which is not corroded by the copper etching solution is formed on the roughening treatment layer 6. The etching barrier layer 7 is made of nickel, nickel alloy, tin,
It is intended to be formed of any of the tin alloys. When the above-mentioned cover plating is not performed, the etching barrier layer 7 has the same effect as the cover plating, and contributes to the prevention of the fine copper particles from falling off. The etching barrier layer 7 can be formed by either an electrolytic method or an electroless method. Hereinafter, the electrolytic solution and the electrolytic conditions when the electrolysis method is adopted will be shown as an example.

When forming a nickel layer, it is possible to widely use the solution and conditions generally used as a nickel plating solution. For example, a) nickel sulfate is used, the nickel concentration is 5 to 30 g / l, the liquid temperature is 20 to 50 ° C.,
pH ^{2 to} 4, current density of 0.3 to 10 A / dm2,
b) Nickel sulfate is used and the nickel concentration is 5 to 30 g /
1, potassium pyrophosphate 50-500 g / l, liquid temperature 20
~ 50 ° C, pH 8-11, current density 0.3-10A / d
m ² condition, c) nickel sulfate is used and the nickel concentration is 1
0-70 g / l, boric acid 20-60 g / l, liquid temperature 20-
The conditions are 50 ° C., pH ^{2 to} 4, current density 1 to 50 A / dm ² , and other general watt bath conditions.

When forming a tin layer, sparrows are generally used.
It is possible to use the solution and conditions used as a cleaning solution.
It is possible. For example, a) stannous sulfate and tin concentration
5 to 30 g / l, liquid temperature 20 to 50 ° C., pH 2 to 4, electric
Flow density 0.3 to 10 A / dm ^TwoConditions, b) sulfuric acid first
And tin concentration of 20-40g / l, sulfuric acid concentration of 70-
150 g / l, liquid temperature 20-35 ° C, cresol sulfone
Acid 70-120g / l, gelatin 1-5g / l, beta
Naphthol 0.5-2g / l, current density 0.3-3A /
dm^TwoConditions and the like.

When forming a nickel-cobalt alloy layer, which is an example of a nickel alloy, for example, cobalt sulfate 8
0-180 g / l, nickel sulfate 80-120 g / l,
Boric acid 20-40 g / l, potassium chloride 10-15 g /
1, sodium dihydrogen phosphate 0.1 to 15 g / l, liquid temperature 30 to 50 ° C., pH 3.5 to 4.5, current density 1 to 10
The conditions include A / dm ² .

It is also possible to use a nickel-phosphorus alloy layer as the nickel alloy. In this case, nickel sulfate 120-180g / l, nickel chloride 35-55g
_{/ L, H 3 PO 4 30~50g} / l, H 3 PO 3 20~
40 g / l, liquid temperature 70 to 95 ° C., pH 0.5 to 1.5,
The conditions are such that the current density is 5 to 50 A / dm ² .

When forming a tin-lead alloy foil layer which is an example of a tin alloy, for example, 20-40 g of stannous sulfate /
1, lead acetate 10-20 g / l, sodium pyrophosphate 1
00-200g / l, EDTA ・ 2 sodium 15-2
5 g / l, PEG-3000 0.8-1.5 g / l, formalin 37% aqueous solution 0.3-1 ml / l, liquid temperature 45-
The conditions are 55 ° C., pH 8 to 10 and current density 5 to 20 A / dm ² .

When the formation of the etching barrier layer 7 is completed as described above, the first bulk copper layer 8 is formed on the etching barrier layer 7 using an electrochemical method. Usually, the first bulk copper layer 8 is formed using a solution that can be used as a copper ion supply source, such as a copper sulfate-based solution and a copper pyrophosphate-based solution, and smooth plating conditions are adopted.

For example, in the case of a copper sulfate type solution, the concentration is 30 to 100 g / l of copper, 50 to 200 g / l of sulfuric acid, and the liquid temperature is 3.
The conditions are 0 to 80 ° C. and a current density of 1 to 100 A / dm ² . If it is a copper pyrophosphate solution, the concentration is 10 to 50 g of copper.
/ L, potassium pyrophosphate 100-700g / l, liquid temperature 3
0 to 60 ° C, pH 8 to 12, current density 1 to 10 A / dm
The condition ² is set. However, in order to obtain the first bulk copper layer 8 having a thickness of 3 μm or less, it is also useful to use the electroless copper plating method.

As described above, the multilayer composite material 1a used for forming the conductor of the printed wiring board, which is characterized by having the laminated state of the four-layer structure according to the present invention, is obtained. In addition, in the case of the four-layered multilayer composite material 1a obtained here, copper is exposed on both surfaces, and it is very easy to oxidize in the state as it is. Therefore, it is optional to carry out a rust preventive treatment for the purpose of preventing oxidation if necessary. In the case of performing anticorrosion treatment, there is no problem in adopting either organic anticorrosion using benzotriazole, imidazole or the like, or inorganic anticorrosion using zinc, chromate, zinc alloy or the like.

A schematic cross-sectional view of the second multilayer composite material 1b
It is shown in FIG. This is carrier layer 9 / junction interface layer 10 / first bulk copper layer 8 for forming a circuit pattern / roughening layer 6 / etching barrier metal layer 7 / bump for obtaining interlayer conduction of a multilayer printed wiring board. A multi-layer composite material 1b used for forming a conductor of a printed wiring board, which has a laminated state of a six-layer structure of a second bulk copper layer 2 used for forming a shape.

The multilayer composite material 1b has the same four-layer structure except for the carrier layer 9 and the bonding interface layer 10 as the conventional multilayer composite material, but the electrolytic method is used. For example, it is possible to reliably flatten the uneven shape such as fine copper particles of the roughening treatment layer 6 and to make the first bulk copper layer 8 thinner than 9 μm.

In the multilayer composite material 1b, the bumps 3 are formed and etched as shown in FIG. 6 (b), and the prepreg is laminated as shown in FIG. 7 (c).
), The carrier foil is removed, and FIG.
Circuit etching is performed as in 1-) to form a printed wiring board for build-up. On the other hand, as shown in FIG.
7 (d-) after the copper foils are bonded together as shown in FIG.
The carrier foil is removed as shown in 2-), and the result shown in FIG.
Inner layer circuit etching is performed as in 1-) to form the inner layer material of the multilayer printed wiring board. Further, by stacking these materials as shown in FIG. 8 and press-working them, a so-called four-layer substrate can be obtained.

The manufacturing method using the electrolytic method for the multilayer composite material 1b is, as described in the claims, that the bonding interface layer 10 is formed on one surface of the carrier layer 9 and the electrolytic method is applied on the bonding interface layer 10. Is used to deposit and form a first bulk copper layer 8, a roughening treatment layer 6 is formed on the first bulk copper layer 8, and the roughening treatment layer 6 is eroded with a copper etching solution. A printed wiring having a six-layer structure is formed by adopting a manufacturing method in which an etching barrier layer 7 that does not exist is formed, and the second bulk copper layer 2 is formed on the etching barrier layer 7 by an electrolytic method. Thus, the multilayer composite material 1b used for forming the conductor of the plate is obtained.

The multilayer composite material 1b is manufactured by the flow shown in FIG. That is, FIG. 9 (1)
As described above, the metal foil forming the carrier layer 9 is used as the starting material. The carrier layer 9 here is intended to use a metal foil of any one of aluminum, aluminum alloy, copper, and copper alloy. Which material is used will be determined in consideration of which method of removing the carrier layer 9. This will be described in the description of the formation of the bonding interface layer 10 below.

Then, as shown in FIG. 9B, the bonding interface layer 10 is formed on one side of the metal foil on which the carrier layer 9 is first formed.
To form. When the carrier layer 9 is made of aluminum or aluminum alloy, the bonding interface layer 10 is
It is desirable to use zinc or chromium. In such a case, if the metal amount of the bonding interface layer 10 is reduced, it becomes an etchable type that is removed by etching when the carrier layer is removed, whereas if the metal amount of the bonding interface layer is increased, it becomes a carrier layer. It becomes a peelable type that is peeled off when 9 is removed.

When the carrier layer 9 is formed of copper, chromium is thickened, or one or more selected from nitrogen-containing organic compounds, sulfur-containing organic compounds and carboxylic acids. It is preferable to form the bonding interface layer 10 using an organic agent. Each of these is a peelable type that is peeled off and removed when the carrier layer 9 is removed.

The organic agent used for forming the bonding interface layer 10 is
Among the nitrogen-containing organic compounds, the sulfur-containing organic compounds and the carboxylic acids, the nitrogen-containing organic compounds include nitrogen-containing organic compounds having a substituent. Specifically, as the nitrogen-containing organic compound, 1,2,3-benzotriazole which is a triazole compound having a substituent (hereinafter, referred to as "B
TA ". ), Carboxybenzotriazole (hereinafter referred to as “CBTA”), N ′, N′-bis (benzotriazolylmethyl) urea (hereinafter referred to as “BTD”).
-U ". ) 1H-1,2,4-triazole (hereinafter referred to as "TA") and 3-amino-1H-.
It is preferable to use 1,2,4-triazole (hereinafter referred to as “ATA”) or the like.

The sulfur-containing organic compounds include mercaptobenzothiazole (hereinafter referred to as "MBT"), thiocyanuric acid (hereinafter referred to as "TCA") and 2-benzimidazole thiol (hereinafter referred to as "BIT"). )
And the like are preferably used.

As the carboxylic acid, it is particularly preferable to use a monocarboxylic acid, and it is particularly preferable to use oleic acid, linoleic acid, linoleic acid, or the like.

The method for forming the bonding interface layer 10 on the carrier layer 9 using the above-mentioned organic agent is to dissolve the above-mentioned organic agent in a solvent and immerse the carrier foil in the solvent, or to bond the carrier foil. It can be performed by using a showering method, a spraying method, a dropping method, an electrodeposition method, or the like on the surface on which the interface layer 10 is to be formed, and it is not necessary to adopt a particularly limited method. The concentration of the organic agent in the solvent at this time is 0.01 g / l to 10 g / l in all the above-mentioned organic agents.
1, and the liquid temperature is preferably in the range of 20 to 60 ° C. The concentration of the organic agent is not particularly limited, and it does not matter whether the concentration is originally high or low.

The joining interface layer 10 can be formed with an organic agent by appropriately combining the above-mentioned organic agents, and the above-described forming method can be repeated. Thereby, it is possible to control the thickness of the bonding interface layer 10 with higher accuracy. Bonding interface layer 1 described so far
0 is removed simultaneously with the removal of the carrier layer 9. Further, even if the bonding interface layer 10 remains after the carrier layer 9 is removed, it can be easily completely removed by performing pickling treatment.

When the formation of the bonding interface layer 10 is completed as described above, FIG. 9C for forming a circuit pattern is formed.
As shown in FIG. 9 (6), the first bulk copper layer 8, the roughening treatment layer 6, the etching barrier metal layer 7, and the bump shape for obtaining the interlayer conduction of the multilayer printed wiring board are used. The two bulk copper layers 2 are formed in this order by electrolysis to form a six-layer laminated structure. The manufacturing method used in these steps is the same as the manufacturing method and conditions used for manufacturing the above-mentioned four-layer multilayer composite material 1a, and the description thereof is omitted here to avoid redundant description.

In the multilayer composite material 1b provided with the carrier foil manufactured by using the electrolytic method according to the present invention, the etching barrier layer 7 itself is formed on the roughening treatment layer 6 by using an electrochemical method. Therefore, it is deposited along the uneven shape of the roughening treatment layer 6 and becomes a replica shape of the unevenness shape of the roughening treatment layer 6. Therefore, even if the process of removing the etching barrier layer 7 and performing the re-roughening treatment as in the conventional multilayer composite material 1 is omitted, the peeling strength when the prepregs are bonded together can be stabilized.

Further, in the case of the multilayer composite material 1b having the carrier layer 9, the carrier layer 9 itself functions as a cushioning material that absorbs rolling stress during rolling even when manufactured by using the rolling method. The flattening or flattening of the roughening treatment layer 6 unlike the conventional multilayer composite material 1 is not caused. Therefore, unlike the conventional multilayer composite material 1, it is not necessary to remove the etching barrier layer 7 and perform the re-roughening treatment. A manufacturing method when the rolling method is adopted will be described.

One of the cases where the rolling method is adopted is, as described in the claims, that the bonding interface layer 1 is formed on one surface of the carrier layer 9.
0 is formed, the first bulk copper layer 8 is deposited and formed on the bonding interface layer 10 by an electrolytic method, and the roughening treatment layer 6 is formed on the first bulk copper layer 8. Using two materials, an electrolytic copper foil with a carrier foil and a copper foil which becomes a second bulk copper layer 2 having an etching barrier layer 7 that does not corrode with a copper etching solution on one surface, and A surface of the electrolytic copper foil with carrier foil on which the roughening treatment layer 6 is formed,
By rolling and clad the second bulk copper layer so as to face the surface on which the etching barrier layer 7 is formed, a multilayer composite material used for forming a conductor of a printed wiring board having a six-layer structure is manufactured. . FIG. 10 shows an image of this rolling process.

As another rolling method, the bonding interface layer 10 is formed on one surface of the carrier foil 9, and the first bulk copper layer 8 is deposited and formed on the bonding interface layer 10 by electrolysis. An etching barrier layer obtained by forming a roughening treatment layer 6 on the first bulk copper layer 8 and forming an etching barrier layer 7 on the roughening treatment layer 6 which is not corroded by a copper etching solution. An electrolytic copper foil with a carrier foil including 7
With the copper foil to be the second bulk copper layer 2, and the surface of the electrolytic copper foil with carrier foil on which the etching barrier layer 7 is formed using two materials, and the second bulk copper layer 2
It is possible to manufacture the multilayer composite material 1b used for forming a conductor of a printed wiring board having a six-layer structure by rolling and clad so as to face one side of the above. FIG. 11 shows an image of this rolling process.

The third multilayer composite material 1c is shown in FIG. That is, carrier layer 9 / junction interface layer 10 / first bulk copper layer 8 for forming a circuit pattern / etching barrier metal layer 7 / roughening treatment layer 6 / bump shape for obtaining interlayer conduction of a multilayer printed wiring board The second bulk copper layer 2 used for forming the layer has a six-layer structure in a stacked state.

In this multilayer composite material 1c, the remaining four layers except the carrier layer 9 and the bonding interface layer 10 have the first layer structure.
Although it is similar to the multilayer composite material 1a, the electrolytic method can be used to ensure that the roughened layer 6 does not have a flat uneven shape, and the first bulk copper layer 8 can be easily thinned to less than 9 μm. It becomes.

In the multilayer composite material 1c, the bumps 3 are formed and etched as shown in FIG. 12 (b), and the prepreg is laminated as shown in FIG. 13 (c).
The carrier foil is removed as shown in -1-), and
Circuit etching is performed as shown in 3 (d-1-) to form a built-up printed wiring board. On the other hand, FIG.
After the copper foils are stuck together like (d-2-),
The carrier foil is removed as shown in FIG. 13 (d-2-), and the inner layer circuit is etched as shown in FIG. 13 (d-1-) to form the inner layer material of the multilayer printed wiring board. Furthermore,
A so-called four-layer substrate can be obtained by using these and laminating in the same manner as shown in FIG. 3 and pressing.

The third multilayer composite material 1c is manufactured by an electrolytic method according to the flow shown in FIG. This manufacturing method can be employed as it is, basically only by changing the order of the manufacturing method of the second multilayer composite material 1b using the electrolysis method. However, the bonding interface layer 1 shown in FIG.
When the formation of 0 is completed, the first bulk copper layer 8 for forming the circuit pattern shown in FIG. 14 (3), FIG. 14 (4)
Used to form the etching barrier metal layer 7 shown in FIG. 14, the roughening treatment layer 6 shown in FIG. 14 (5), and the bump shape for obtaining interlayer conduction of the multilayer printed wiring board shown in FIG. 14 (6). The stacked state of the six-layer structure is formed by using the electrolytic method in the order of the second bulk copper layer 2, and the formation order of the etching barrier metal layer 7 and the roughening treatment layer 6 is merely reversed. Therefore, the duplicate description here is omitted.

The third multilayer composite material 1c can also be manufactured by using a rolling method. When the rolling method is used, the following method can be adopted. A bonding interface layer 10 is formed on one surface of the carrier layer 9, a first bulk copper layer 8 is deposited and formed on the bonding interface layer 10 by an electrolytic method, and a copper etching solution is formed on the first bulk copper layer 8. The following two materials are used: an electrolytic copper foil with a carrier foil obtained by forming an etching barrier layer 7 that does not corrode with the copper foil, a copper foil that becomes the second bulk copper layer 2 on which the roughening treatment layer 6 is formed, and hand,
By rolling and clad so that the surface of the electrolytic copper foil with carrier foil on which the etching barrier layer 7 is formed and the surface of the second bulk copper layer 2 on which the roughening treatment layer 6 is formed face each other, The multilayer composite material 1c used for forming a conductor of a printed wiring board having a layered structure is manufactured. FIG. 15 shows this rolling image.

Further, a bonding interface layer 10 is formed on one surface of the carrier foil 9, and a first bulk copper layer 8 is deposited and formed on the bonding interface layer 10 by an electrolytic method. 2 It was obtained by forming a roughening treatment layer 6 on one surface of a copper foil to be the bulk copper layer 2 and forming an etching barrier layer 7 on the roughening treatment layer 6 which is not corroded by a copper etching solution. A copper foil provided with an etching barrier layer 7 and a surface of the electrolytic copper foil with carrier foil, on which the first bulk copper layer 8 is formed, and an etching barrier layer 7 of the copper foil are formed using the two materials. It is possible to manufacture the multilayer composite material 1c used for forming a conductor of a printed wiring board having a six-layer structure by rolling and clad so as to face the above surface. This rolling image is represented
It is FIG.

Multilayer composite material 1 obtained as described above
b, 1c are the first due to the presence of the carrier layer 9.
The bulk copper layer 8 can be made thin, and the uneven shape of the roughening treatment layer 6 does not flatten, and the flattening degree of the roughening treatment layer 6 is small even if a rolling method is used. It is not necessary to remove the barrier layer 7 and perform re-roughening treatment, and the roughening treatment remains in a healthy state between the portion of the circuit 11 formed by the first bulk copper layer 8 and the insulating material 4 and peeling strength. It will not be damaged.

Since the carrier layer 9 is present, the first bulk copper layer 8 is not removed until the carrier layer 9 is removed.
Functioning as a preventive measure against surface contamination of
It is highly desirable from the viewpoint of pollution prevention. Furthermore,
When the carrier layer 9 is made of aluminum, the shrinkage behavior during press working is larger than that of copper and approaches the shrinkage behavior of the prepreg, which also contributes to improvement in dimensional stability of the printed wiring board to be manufactured. Of.

FIG. 17A shows the fourth multilayer composite material 1d. This is based on the same technical idea as that of the multilayer composite materials 1a and 1b having the carrier layer 9 described above, except that the bonding interface layers 7 are provided on both sides of the carrier layer 9 and the bonding interfaces on the both sides are the same. A first bulk copper layer 8 for forming a circuit pattern is provided on the layer 7, and a roughening treatment layer 6 is provided on each of the first bulk copper layers 8 on both sides, and each of the roughening layers is provided on both sides. Etching barrier metal layer 7 on treatment layer 6
A second bulk copper layer 2 used to form the shape of the bump 3 for obtaining interlayer conduction of the multilayer printed wiring board on each of the etching barrier metal layers 7 on both sides using an electrolytic method. Fourth multilayer composite material 1 used for forming a conductor of a printed wiring board having a laminated state of 11 layers
d.

This fourth multilayer composite material is shown in FIG.
As can be seen from the above, in short, with the carrier layer 9 as the center, the bonding interface layer 10, the first bulk copper layer 8, the roughening treatment layer 6, and the etching similar to the second multilayer composite material 1b are formed on both surfaces thereof. The barrier metal layer 7 and the second bulk copper layer 2 are provided in the order of a stacked state of a five-layer structure.

Further, FIG. 19A shows the fourth multilayer composite material 1e. Bonding interface layer 1 on both sides of carrier layer 9
0, a first bulk copper layer 8 for forming a circuit pattern on each of the bonding interface layers 10 on both sides, and an etching barrier metal on each of the first bulk copper layers 8 on both sides. A layer 7 is provided, and a roughening treatment layer 6 is provided on each of the etching barrier metal layers 7 on both sides, and for obtaining the interlayer conduction of the multilayer printed wiring board on each of the roughening treatment layers 6 on both sides. Second used to form bump shape
Fifth Use for Forming Conductor of Printed Wiring Board with Laminated State of 11 Layer Structure in which Bulk Copper Layer 2 is Formed by Electrolysis
The multilayer composite material 1e can also be used.

Therefore, according to the method of manufacturing the fourth multilayer composite material 1d, the bonding interface layer 10, the first bulk copper layer 8 of the second multilayer composite material 1b shown in FIG. Applying each manufacturing method using the electrolytic method of the roughening treatment layer 6, the etching barrier metal layer 7, and the second bulk copper layer 10,
It is sufficient to form each layer. The manufacturing method used in these steps is the same as the manufacturing method and conditions used for manufacturing the above-described multilayer composite material 1b, and the description thereof is omitted here to avoid redundant description.

In addition, according to the fifth manufacturing method of the multilayer composite material 1e, the bonding interface layer 10, the first bulk copper layer 8 of the third multilayer composite material 1c shown in FIG. By applying each manufacturing method using the electrolytic method of the etching barrier metal layer 7, the roughening treatment layer 6, and the second bulk copper layer 10,
It is sufficient to form each layer. The manufacturing method used in these steps is the same as the manufacturing method and conditions used for manufacturing the above-described multilayer composite material 1c, and the description thereof is omitted here to avoid redundant description.

However, the bonding interface layer 10 used here must have a peelable type layer structure depending on the type of the carrier layer 9. The reason is due to the method of use of this fourth and fifth multilayer composite material.
Further, in the case of the third multilayer composite material, it is preferable that the carrier layer is made of a metal foil or a metal plate of aluminum, aluminum alloy, or copper having a thickness of 100 μm or more.

That is, the fourth multilayer composite material 1d is shown in FIG.
The bump 3 is formed and etched as shown in FIG. 18B, and the prepreg is laminated as shown in FIG. Similarly, the fifth multilayer composite material 1e is also shown in FIG.
The bump 3 is formed and etched as shown in FIG. 20B, and the prepreg is bonded as shown in FIG.

At the time of press working for laminating the prepreg, the multilayer composite material having such a structure is used.
It is possible to omit the end plate at the time of stacking, and it is possible to completely prevent foreign matter from entering the first bulk copper layer 8 during press molding. As shown in FIG. 21, the prepreg is laminated to the multilayer composite material. Generally, as shown in FIG. 21, a mirror plate M made of a heat-resistant material such as stainless steel is mirror-finished between the upper and lower press plates W, and a multilayer composite material 1 having a bump shape is formed.
a, the prepreg 4, and the end plate M are repeatedly laminated (commonly referred to as a layup), the press plate W is heated at a high temperature, and the resin component of the prepreg 4 is melted by sandwiching the press plate W, and the prepreg 4 penetrates the bump. Then, high temperature pressure bonding is performed.

At this time, when the above-mentioned fourth or fifth multilayer composite material is used, as shown in FIG. 22, an end plate M made of a heat-resistant material such as stainless steel is mirror-finished between the upper and lower press plates W, The prepreg 4, the fourth or fifth multilayer composite material 1d, 1e having a bump shape, the prepreg 4, and the end plate M are repeatedly laminated in this order, the press plate is heated at a high temperature, and sandwiched to melt the resin component of the prepreg. Let
The bumps can be penetrated through the prepreg and bonded under high temperature and pressure. In this way, two processed bodies can be obtained from one multilayer composite material, and the intermediate end plate M
By omitting, the productivity can be improved. That is, the carrier layer 9 itself plays the role of the end plate M.

As a result, the number of end plates M to be used can be reduced, and the number of steps to be accommodated between the daylights of the press plate W can be increased by the thickness corresponding to the omitted end plates, and one press can be performed. It is possible to increase the number of processed bodies manufactured in. Further, the heat transfer property is improved, and the productivity can be improved.

After the prepregs 4 are bonded to each other as described above, they are disassembled and removed from the carrier layer 9 as shown in FIGS. 18 (d) and 20 (d).
Therefore, the bonding interface layer 10 must be a peelable type that can be peeled off and removed. After dismantling, the carrier foil is removed in the same manner as shown in FIG. 13 (d-1-), circuit etching is performed as shown in FIG. 13 (d-1-), and a printed wiring board for build-up is formed. Become. On the other hand, as shown in FIG. 13 (d-2-), after the copper foils are adhered to each other, carrier foil is removed as shown in FIG. 13 (d-2-), and then as shown in FIG. 13 (d-1-). Inner layer circuit etching is performed on the inner layer to form an inner layer material for the multilayer printed wiring board. Further, by using these and laminating in the same manner as shown in FIG. 3 and pressing, a so-called four-layer substrate can be obtained.

By using the multilayer composite material according to the present invention, various manufacturing methods can be adopted in addition to the above-described manufacturing method of the printed wiring board. For example, FIGS. 23 to 26 show other printed wiring board manufacturing flows that can be adopted when the above-described multilayer composite material 1a is used.

That is, the multilayer composite material 1a is prepared as shown in FIG.
As shown in 1), the second bulk copper layer 2 is etched to form the shape of the bump 3, and the prepreg 4 is attached as shown in FIG. 23 (b-2). Fabricate the circuit etched material as shown. Then, on the other hand, as shown in FIG. 23C, the first bulk copper layer 8 of the multilayer composite material 1a is etched to produce a material having a circuit shape. And these materials,
As described in FIG. 24 (d), the lamination process is performed once. When this stacking process is completed, the second bulk copper layer 8 on which the bumps 3 have not been formed is etched to form the bumps 3. At this time, the etching barrier layer 7 remains on the surface of the insulating layer 4.

After that, the exposed etching barrier layer 7 is removed as shown in FIG. At this time, it is preferable to use a solution in which the metal forming the etching barrier layer 7 is preferentially dissolved and copper is not dissolved. For example, if the etching barrier layer 7 is made of nickel, the circuit portion made of copper will not be damaged if a nickel selective etching solution that does not dissolve copper is used. When the removal of the etching barrier layer 7 is completed, the outer layer copper foil is attached as described in FIG. The outer layer copper foil is attached using the electrolytic copper foil 12 and the prepreg 4 as shown in FIG. Then, the printed wiring board described as FIG. 26 (h) is obtained by circuit-etching the outer layer copper foil of the multilayer board obtained here. As described above, various etching processing methods can be adopted.

[0077]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail by manufacturing a multilayer composite material according to the present invention and laminating a prepreg.

First Embodiment: In this embodiment, the above-mentioned four-layer multilayer composite material 1a is manufactured, the bumps 3 are formed by using the second bulk copper layer 2, and the prepreg 4 having a thickness of 100 μm is used. Press molding was performed, the bumps 3 were penetrated through the prepreg 4, a copper clad laminate 5 was manufactured, and further a multilayer printed wiring board MLB having 4 layers was manufactured. The following description will be given with reference to FIGS. Although the outer layer surface of the multilayer composite material 1a is subjected to zinc anticorrosion treatment, the illustration of the anticorrosion layer is omitted in the drawings.

In the present embodiment, the second bulk copper layer 2
In order to use as a reference layer, a rolled copper foil having a thickness of 120 μm and made of oxygen-free copper whose both surfaces are smooth was used as a starting material. The manufacturing procedure follows the flow shown in FIG. 4, and as the first step, this rolled copper foil was pickled. The inside of the pickling tank for the treatment is filled with a dilute sulfuric acid solution having a concentration of 150 g / l and a liquid temperature of 30 ° C., and the adhering oil and fat components are removed by dipping for 30 seconds to remove excess surface oxide film. It was removed and washed with water.

In the second step, the roughened layer 6 was formed by depositing fine copper particles on one surface of the rolled copper foil used as the second bulk copper layer 2 by an electrolytic method. In the solution using a copper electrolytic solution, a stainless plate is used as a counter electrode, and the stainless plate is placed in parallel with the surface of the rolled copper foil on which the roughening treatment layer 6 is formed,
The rolled copper foil itself was subjected to cathodic polarization. The electrolytic solution and the electrolytic conditions used at this time were 10 g / copper sulfate-based solution.
l copper, 150g / l sulfuric acid, liquid temperature 25 ° C, electrolysis time 10
Second, the current density was 20 A / dm ² .

In the present embodiment, after forming the fine copper particles, overcoating is performed for the purpose of preventing the fine copper particles from falling off and growing the fine copper particles. This cover plating is
As a copper sulfate-based solution, 50 g / l copper, 150 g / l sulfuric acid, liquid temperature 45 ° C., current density 80 A / dm ² , electrolysis time 1
Copper was uniformly deposited under the smooth plating condition for 5 seconds so as to cover the fine copper particles. The roughening treatment layer 6 was formed as described above and washed with water.

When the formation of the roughening treatment layer 6 is completed, as a third step, the etching barrier layer 7 which is not corroded by the copper etching solution is formed on the roughening treatment layer 6. The etching barrier layer 7 in this embodiment was formed as a nickel layer having a plane conversion of 8.9 g / m ² . In the solution using a nickel electrolytic solution, a stainless plate was used as a counter electrode, and the stainless plate was placed in parallel with the surface of the rolled copper foil on which the roughening treatment layer 6 was formed to form a roughening treatment layer 6. The copper foil itself was cathode-polarized. The nickel electrolytic solution and electrolysis conditions used here are nickel sulfate, nickel concentration 20 g / l, liquid temperature 35 ° C., pH 3, current density 5
The condition was A / dm ² . As described above, the etching barrier layer 7 was formed and washed with water.

After the formation of the etching barrier layer 7, as a fourth step, a 3 μm-thick first bulk copper layer 8 was formed on the etching barrier layer 7 by an electrolytic method. The formation of the first bulk copper layer 8 was performed using a copper sulfate solution and employing smooth plating conditions. The composition and conditions of the copper sulfate solution used here are such that the concentration is 80 g / l copper,
150g / l sulfuric acid, liquid temperature 50 ℃, current density 50A / dm
² and the electrolysis time was 30 seconds.

As described above, the multi-layer composite material 1a used for forming the conductor of the printed wiring board, which has the laminated state of the four-layer structure according to the present invention, was obtained. In addition, in the present embodiment, rust prevention treatment is further performed using zinc.
Here, a soluble anode using a zinc plate was used as the anode electrode to maintain the concentration balance of zinc in the solution. The electrolysis conditions here are: zinc sulfate bath, concentration of 70 g / l sulfuric acid, 20 g / l zinc,
The liquid temperature was 40 ° C. and the current density was 15 A / dm ² .

Then, as shown in FIG. 1B, the second
A bump 3 was formed by sticking a dry film as an etching resist on the surface of the bulk copper layer 2, exposing, developing and etching. Subsequently, the multilayer composite material 1 and the prepreg 4 were laminated and pressure-pressed to form a copper clad laminate 5. The first bulk copper layer 8 located on the outer layer of the copper clad laminate 5 is coated with a dry film as an etching resist, exposed, developed, and etched to form a copper foil circuit 11, as shown in FIG. A built-up substrate BB shown in 1) was manufactured. On the other hand, in the copper clad laminate 5, as shown in FIG. 2 (d-2-), an electrolytic copper foil 12 having a thickness of 18 μm is further adhered to the other surface side, and the first bulk copper layer 8 and the electrolytic copper located on the outer layers are formed. By attaching a dry film as an etching resist to the foil 12, exposing, developing, and etching the copper foil circuits 11 were formed on both surfaces, and the inner layer substrate IB shown in FIG. 2 (d-2-) was manufactured. Then, these printed wiring board manufacturing materials BB, I
Using B, the four-layer printed wiring board MLB was manufactured by laminating and molding as shown in FIG.

In order to confirm the adhesion of the first bulk copper layer 8 to the insulating layer, the circuit T at a position where the bump 3 does not exist directly below
The peel strength was measured using L. As a result, the peeling strength was 1.8 kgf / cm, and it was confirmed that good adhesion could be maintained. The first
The thickness of the bulk copper layer 8 itself is 3 μm, and it is difficult to measure the peeling strength with the thickness as it is. Therefore, using the same copper electrolytic solution as that used for forming the first bulk copper layer 8,
The plating strength was increased to about 18 μm and the peel strength was measured.

Second Embodiment: In this embodiment, the above-mentioned 6-layer multilayer composite material 1b is manufactured, the bumps 3 are formed by using the second bulk copper layer 2, and the prepreg 4 having a thickness of 100 μm is used. Press molding was performed, the bumps 3 were penetrated through the prepreg 4, a copper clad laminate 5 was manufactured, and further a multilayer printed wiring board MLB having 4 layers was manufactured. The following description will be made with reference to FIGS. 6 to 9. Although the outer layer surface of the multilayer composite material 1b is subjected to zinc anticorrosion treatment, the illustration of the anticorrosion layer is omitted in the drawings.

In this embodiment, the carrier layer / bonding interface layer / first bulk copper layer for forming a circuit pattern / roughening layer / etching barrier metal layer / multilayer printed wiring board inter-layer conduction is obtained. A 6-layer structure product of the second bulk copper layer 2 used for forming the bump shape was manufactured. Therefore, the manufacture of this multilayer composite material 1b is
It was manufactured by the flow shown in FIG.

As shown in FIG. 9 (1), an electrolytic copper foil having a thickness of 35 μm to be the carrier layer 9 was used as a starting material. This electrolytic copper foil was subjected to pickling treatment in the same manner as in the first embodiment to remove the attached oil and fat components, remove excess surface oxide film, and then wash with water.

Next, as shown in FIG. 9B, a peelable joining interface layer 10 was formed on the glossy side of the copper foil used as the carrier layer 9 after the pickling treatment.
The bonding interface layer 10 at this time was formed as an organic bonding interface using carboxybenzotriazole (CBTA). The bonding interface layer 10 is formed by the carrier layer 9
The glossy side of contains CBTA with a concentration of 5 g / l and the liquid temperature is 4
It was carried out by showering an aqueous solution of 0 ° C. and pH 5 for 30 seconds.

When the formation of the bonding interface layer 10 was completed, subsequently, as shown in FIG. 9C, the first bulk copper layer 8 was formed on the bonding interface layer 10. First bulk copper layer 8
Is a concentration of 150 g / l sulfuric acid, 65 g / l copper, liquid temperature 45 ° C
The carrier layer 9 itself is subjected to cathodic polarization using the copper sulfate solution described above, and a flat stainless steel electrode is used as a counter electrode parallel to the surface on which the bonding interface layer 10 is formed, and the current density is 15 A /
It was electrolyzed at dm ² to a thickness of 3 μm.

When the formation of the first bulk copper layer 8 is completed, as shown in FIG. 9 (4), fine copper particles are attached and formed on the first bulk copper layer 8 by using an electrolytic method, and then covered. The roughening treatment layer 6 was formed by plating. The conditions for forming the roughening treatment layer are the same as those in the first embodiment, and thus the description thereof is omitted here. The roughening treatment layer 6 was formed as described above and washed with water.

After the formation of the roughening treatment layer 6, the etching barrier layer 7 which is not corroded by the copper etching solution was formed on the roughening treatment layer 6. The etching barrier layer 7 in the present embodiment was formed as a nickel layer of 9.3 g / m ^{2 in} plane conversion by the same method as in the first embodiment, and washed with water.

After the formation of the etching barrier layer 7, as the fourth step, the second bulk copper layer 2 having a thickness of 120 μm was formed on the etching barrier layer 7 by using the electrolytic method. The second bulk copper layer 2 was formed by using a copper sulfate-based solution and employing smooth plating conditions. The composition and conditions of the copper sulfate solution used here were such that the concentration was 80 g / l.
Copper, 150g / l sulfuric acid, liquid temperature 50 ° C, current density 50A /
The condition was dm ² .

As described above, the multi-layer composite material 1b used for forming the conductor of the printed wiring board, which has the laminated state of the six-layer structure according to the present invention, was obtained. In addition, in the present embodiment, the rust prevention treatment is further performed using zinc by using the same method as that of the first embodiment.

Then, as shown in FIG. 6B, the second
A bump 3 was formed by sticking a dry film as an etching resist on the surface of the bulk copper layer 2, exposing, developing and etching. Subsequently, as shown in FIG. 7C, the multilayer composite material 1b and the prepreg 4 were laminated and press-molded to obtain a copper clad laminate 5. Then, as shown in FIG. 7 (d-1-), the carrier layer 9 is peeled off and removed, and a dry film as an etching resist is attached to the first bulk copper layer 8 exposed after the removal of the carrier layer 9 and exposed. , Copper foil circuit 11 is formed by developing and etching, as shown in FIG.
The build-up substrate BB shown in FIG. On the other hand, in the copper clad laminate 5, as shown in FIG. 7 (d-2-), an electrolytic copper foil 12 having a thickness of 18 μm is further attached to the other surface side, as shown in FIG. 7 (d-2-). By removing the carrier layer 9 by peeling it off, and attaching a dry film as an etching resist to the first bulk copper layer 8 and the electrolytic copper foil 12 exposed after the removal of the carrier layer 9, exposing, developing, and etching A copper foil circuit 11 is formed on the
The inner layer substrate IB shown in (d-2-) was manufactured. Then, using these printed wiring board manufacturing materials BB and IB, lamination molding was performed as shown in FIG. 8 to manufacture a four-layer printed wiring board MLB.

In order to confirm the adhesion of the first bulk copper layer 8 to the insulating layer, the circuit T at a position where the bump 3 does not exist immediately below it.
The peel strength was measured using L. As a result, the peeling strength was 1.7 kgf / cm, and it was confirmed that good adhesion could be maintained. The first
The thickness of the bulk copper layer 8 itself is 3 μm, and it is difficult to measure the peeling strength with the thickness as it is. Therefore, using the same copper electrolytic solution as that used for forming the first bulk copper layer 8,
The plating strength was increased to about 18 μm and the peel strength was measured.

Third Embodiment: In this embodiment, the above-mentioned 6-layer multilayer composite material 1c is manufactured, the bumps 3 are formed by using the second bulk copper layer 2, and the prepreg 4 having a thickness of 100 μm is used. Press molding was performed, the bumps 3 were penetrated through the prepreg 4, a copper clad laminate 5 was manufactured, and further a multilayer printed wiring board MLB having 4 layers was manufactured. The following description will be made with reference to FIGS. 12 to 14. Although the outer layer surface of the multilayer composite material 1c is subjected to zinc anticorrosion treatment, the illustration of the anticorrosion layer is omitted in the drawings.

In this embodiment, the carrier layer / bonding interface layer / first bulk copper layer for forming a circuit pattern / etching barrier metal layer / roughening layer / multilayer printed wiring board is used to obtain interlayer conduction. A 6-layer structure product of the second bulk copper layer 2 used for forming the bump shape was manufactured. Therefore, the manufacture of this multilayer composite material 1c is
It was manufactured by the flow shown in FIG.

As shown in FIG. 14 (1), an electrolytic copper foil having a thickness of 35 μm to be the carrier layer 9 was used as a starting material. This electrolytic copper foil is pickled by the same method as in the first embodiment,
The adhered oil and fat component was removed, the excess surface oxide film was removed, and the product was washed with water.

Then, as shown in FIG.
A peelable joining interface layer 10 was formed on the glossy side of the copper foil used as the carrier layer 9 after the pickling treatment. The bonding interface layer 10 at this time was formed using the same method as in the second embodiment. Therefore, the duplicate description here is omitted.

When the formation of the bonding interface layer 10 is completed, subsequently, as shown in FIG. 14C, the first bulk copper layer 8 having a thickness of 3 μm is formed on the bonding interface layer 10. .
Since the first bulk copper layer 8 was formed by the same method as in the second embodiment, the duplicated description here is omitted.

When the formation of the first bulk copper layer 8 is completed, as shown in FIG. 14 (4), on the first bulk copper layer 8,
An etching barrier layer 7 was formed which was not eroded by the copper etching solution. The etching barrier layer 7 in the present embodiment is the same as that in the first embodiment, and is 9.
It was formed as a nickel layer of 3 g / m ² and washed with water.

When the formation of the etching barrier layer 7 is completed, next, fine copper particles are attached and formed on the etching barrier layer 7 by an electrolysis method, and a roughening treatment layer 6 is formed by performing cover plating. did. The conditions for forming the roughening treatment layer 6 are the same as those in the first embodiment, and thus the description thereof is omitted here. The roughening treatment layer 6 is formed as described above,
Washed with water.

When the formation of the roughening treatment layer 6 is completed, a second layer having a thickness of 120 μm is formed on the roughening treatment layer 6 by an electrolytic method.
The bulk copper layer 2 was formed. The second bulk copper layer 2 was formed by using a copper sulfate-based solution and employing smooth plating conditions. The composition and conditions of the copper sulfate solution used here were such that the concentration was 80 g / l copper, 150 g / l sulfuric acid, the liquid temperature was 50 ° C., and the current density was 50 A / dm ² .

As described above, the multi-layer composite material 1c used for forming the conductor of the printed wiring board, which is characterized by having the laminated state of the six-layer structure according to the present invention, was obtained. In addition, in the present embodiment, the rust prevention treatment is further performed using zinc by using the same method as that of the first embodiment.

Then, as shown in FIG. 12B, a bump 3 was formed by sticking a dry film as an etching resist on the surface of the second bulk copper layer 2, exposing, developing and etching. Subsequently, as shown in FIG. 13C, the multilayer composite material 1c and the prepreg 4 were laminated and press-molded to obtain a copper clad laminate 5. Then, as shown in FIG. 13 (d-1-), the carrier layer 9 is peeled off and removed, and a dry film as an etching resist is attached to the first bulk copper layer 8 exposed after the removal of the carrier layer 9 and exposed. , Copper foil circuit 11 is formed by developing and etching, as shown in FIG.
The built-up substrate BB shown in -1-) was manufactured.
On the other hand, in the copper clad laminate 5, as shown in FIG. 13 (d-2-), an electrolytic copper foil 12 having a thickness of 18 μm is further attached to the other surface side, and as shown in FIG. 13 (d-2-). Carrier layer 9
Is removed by peeling, and a dry film is attached as an etching resist to the first bulk copper layer 8 and the electrolytic copper foil 12 exposed after the removal of the carrier layer 9, and the copper foil is exposed, developed and etched to form copper foil on both sides. The circuit 11 was formed, and the inner layer substrate IB shown in FIG. 13D-2- was manufactured. Then, these printed wiring board manufacturing materials BB,
Using IB, lamination molding was performed as shown in FIG. 14 to manufacture a four-layer printed wiring board MLB.

In order to confirm the adhesion of the first bulk copper layer 8 to the insulating layer, the circuit T at a position where the bump 3 does not exist directly below it.
The peel strength was measured using L. As a result, the peeling strength was 1.7 kgf / cm, and it was confirmed that good adhesion could be maintained. The first
The thickness of the bulk copper layer 8 itself is 3 μm, and it is difficult to measure the peeling strength with the thickness as it is. Therefore, using the same copper electrolytic solution as that used for forming the first bulk copper layer 8,
The plating strength was increased to about 18 μm and the peel strength was measured.

Fourth Embodiment: In this embodiment, the above-mentioned 11-layer multi-layer composite material 1d is manufactured, and the second
Bumps 3 are formed using the bulk copper layer 2, and press molding is performed using a prepreg 4 having a thickness of 100 μm, the bumps 3 are penetrated through the prepreg 4, and a copper clad laminate 5 is manufactured.
A multi-layer printed wiring board MLB was produced. The following description will be given with reference to FIGS. 17 and 18.
Although the outer layer surface of the multilayer composite material 1d is subjected to zinc anticorrosion treatment, the illustration of the anticorrosion layer is omitted in the drawings.

In this embodiment, the bump shape for obtaining the interlayer conduction of the junction interface layer / first bulk copper layer for forming the circuit pattern / roughening treatment layer / etching barrier metal layer / multilayer printed wiring board is used. A product was manufactured in which the five-layer structure of the second bulk copper layer 2 used for forming was formed on both surfaces of the carrier layer 9. Therefore, the multilayer composite material 1d was manufactured by forming each layer on both sides in the manufacturing flow of the multilayer composite material 1b shown in FIG.

Therefore, the only difference from the second embodiment is that each layer is formed on both sides, and the actual conditions for forming each layer are the same solution and conditions. Therefore, detailed description of each step will be omitted because it is redundant. However, a rolled copper foil having a thickness of 100 μm was used for the carrier layer. The formation of the bonding interface layer 10 is
Although the organic bonding interface described in the second embodiment was formed, it was performed by immersing in the solution instead of showering.

As described above, the multi-layer composite material 1d used for forming the conductor of the printed wiring board, which is characterized by having the laminated state of the 11-layer structure according to the present invention, was obtained. Then, as shown in FIG. 17B, a bump 3 was formed by sticking a dry film as an etching resist on the surfaces of the second bulk copper layer 2 on both sides, exposing, developing and etching. Then, as shown in FIG. 18C, the multilayer composite material 1c and the prepreg 4 are attached to
As shown in FIG. 2, the copper-clad laminate 5 was laid up and laminated, and press-molded to obtain the copper-clad laminate 5. And in FIG.
As shown in (d), the pressed substrate was disassembled so as to be separated from the carrier layer 9. As a result,
As shown in (c), the same state as the copper clad laminate 5 obtained by laminating the multilayer composite material 1b having the bumps 3 and the prepreg 4 and press-molding them was obtained. Therefore, as described in the second embodiment, FIG.
A built-up substrate BB was manufactured through the steps shown in 1-). On the other hand, the copper clad laminate 5 is shown in FIG.
And the inner layer substrate I through the steps shown in FIG.
B was produced. Then, using these printed wiring board manufacturing materials BB and IB, lamination molding was performed in the same manner as shown in FIG. 8 to manufacture a four-layer printed wiring board MLB.

In order to confirm the adhesion of the first bulk copper layer 8 to the insulating layer, the circuit T at a position where the bump 3 does not exist directly below it.
The peel strength was measured using L. As a result, the peeling strength was 1.8 kgf / cm, and it was confirmed that good adhesion could be maintained. The first
The thickness of the bulk copper layer 8 itself is 3 μm, and it is difficult to measure the peeling strength with the thickness as it is. Therefore, using the same copper electrolytic solution as that used for forming the first bulk copper layer 8,
The plating strength was increased to about 18 μm and the peel strength was measured.

Fifth Embodiment: In this embodiment, the above-mentioned eleven-layer multilayer composite material 1e is manufactured, and the second
Bumps 3 are formed using the bulk copper layer 2, and press molding is performed using a prepreg 4 having a thickness of 100 μm, the bumps 3 are penetrated through the prepreg 4, and a copper clad laminate 5 is manufactured.
A multi-layer printed wiring board MLB was produced. The following description will be given with reference to FIGS. 19 and 20.
Although the outer layer surface of the multilayer composite material 1d is subjected to zinc anticorrosion treatment, the illustration of the anticorrosion layer is omitted in the drawings.

In this embodiment, the bump shape for obtaining the interlayer conduction of the junction interface layer / first bulk copper layer for forming the circuit pattern / etching barrier metal layer / roughening layer / multilayer printed wiring board is used. A product was manufactured in which the five-layer structure of the second bulk copper layer 2 used for forming was formed on both surfaces of the carrier layer 9.

Here, a rolled copper foil having a thickness of 100 μm to be the carrier layer 9 was used as the starting material. This rolled copper foil first
The pickling treatment was performed in the same manner as in the embodiment to remove the attached oil and fat component, remove the excess surface oxide film, and wash with water.

Next, peelable joint interface layers 10 were formed on both surfaces after the pickling treatment of the rolling, which was used as the carrier layer 9. The bonding interface layer 10 at this time was formed as an organic bonding interface using carboxybenzotriazole (CBTA). The bonding interface layer 10 is formed on the glossy side of the carrier layer 9 with a C concentration of 5 g / l.
Using an aqueous solution containing BTA and having a liquid temperature of 40 ° C. and a pH of 5,
The carrier layer 9 was immersed therein for 30 seconds.

After the formation of the bonding interface layer 10, the first bulk copper layer 8 having a thickness of 3 μm was formed on each of the bonding interface layers 10 on both sides thereof. The conditions for forming the first bulk copper layer 8 were the same as in the second embodiment.

When the formation of the first bulk copper layer 8 is completed, the etching barrier layer 7 which is not corroded by the copper etching solution is 8.6 g / planar on the first bulk copper layer 8.
It was formed as a nickel layer of m ² . Since the conditions for forming the etching barrier layer 7 are the same as those in the first embodiment,
The description here is omitted. The etching barrier layer 7 was formed as described above and washed with water.

After the formation of the etching barrier layer 7, fine copper particles are attached and formed on the etching barrier layer 7 by an electrolysis method, and a roughening treatment layer 6 is formed by performing plating by plating. . Roughening layer 6 in the present embodiment
Was performed in the same manner as in the first embodiment.

After the formation of the roughening treatment layer 6, as a fourth step, an electrolytic method is used on the roughening treatment layer 6,
The second bulk copper layer 2 having a thickness of 120 μm was formed. Second
For forming the bulk copper layer 2, the same electrolytic solution and conditions as in the second embodiment were adopted.

As described above, the multi-layer composite material 1e used for forming the conductor of the printed wiring board, which has the laminated state of the 11-layer structure according to the present invention, was obtained. In addition,
In this embodiment, the rust prevention treatment is further performed using zinc by using the same method as that of the first embodiment.

As described above, the multi-layer composite material 1e used for forming the conductor of the printed wiring board, which is characterized by having the laminated state of the 11-layer structure according to the present invention, was obtained. Then, as shown in FIG. 19B, a bump 3 was formed by sticking a dry film as an etching resist on the surfaces of the second bulk copper layer 2 on both sides, exposing, developing and etching. Then, as shown in FIG. 20 (c), the multilayer composite material 1c and the prepreg 4 are removed as shown in FIG.
As shown in FIG. 2, the copper-clad laminate 5 was laid up and laminated, and press-molded to obtain the copper-clad laminate 5. And FIG.
As shown in (d), the pressed substrate was disassembled so as to be separated from the carrier layer 9. As a result,
As shown in (c), the copper-clad laminate 5 obtained by laminating the multilayer composite material 1a having the bumps 3 and the prepreg 4 and press-molding the laminate was in the same state. Therefore, hereinafter, as shown in FIG. 2 (d-
A built-up substrate BB was manufactured through the steps shown in 1). On the other hand, for the copper-clad laminate 5, the inner layer substrate IB was manufactured through the steps shown in FIGS. 2 (d-2-) and 2 (d-2-). Then, these printed wiring board manufacturing materials B
Using B and IB, laminate molding was performed in the same manner as shown in FIG.
A 4-layer printed wiring board MLB was manufactured.

In order to confirm the adhesion of the first bulk copper layer 8 to the insulating layer, the circuit T at a position where the bump 3 does not exist directly below it.
The peel strength was measured using L. As a result, the peeling strength was 1.8 kgf / cm, and it was confirmed that good adhesion could be maintained. The first
The thickness of the bulk copper layer 8 itself is 3 μm, and it is difficult to measure the peeling strength with the thickness as it is. Therefore, using the same copper electrolytic solution as that used for forming the first bulk copper layer 8,
The plating strength was increased to about 18 μm and the peel strength was measured.

[0125]

EFFECT OF THE INVENTION By using the multilayer composite material according to the present invention, the "etching barrier layer removing step" and the "re-roughening" which are indispensable when the multilayer composite material manufactured by the conventional rolling method is used. It is possible to omit the "chemical treatment step", and it is possible to significantly reduce the manufacturing cost of the printed wiring board. Moreover, according to the method for producing a multilayer composite material according to the present invention, the copper layer for forming a circuit can be formed to a thickness of less than 18 μm, which is impossible with the conventional multilayer composite material. The formation yield and etching reliability of the fine pitch circuit can be dramatically improved.

[Brief description of drawings]

FIG. 1 is a schematic view showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 2 is a schematic view showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 3 is a schematic diagram showing a process of processing a multilayered composite material into a printed wiring board.

FIG. 4 is a schematic diagram showing a manufacturing process of a multilayer composite material.

FIG. 5 is a schematic diagram showing a manufacturing process of a multilayer composite material.

FIG. 6 is a schematic view showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 7 is a schematic view showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 8 is a schematic diagram illustrating a process of processing a multilayer composite material into a printed wiring board.

FIG. 9 is a schematic diagram showing a manufacturing process of a multilayer composite material.

FIG. 10 is a conceptual diagram showing a method for producing a multilayer composite material by a rolling method.

FIG. 11 is a conceptual diagram showing a method for producing a multilayer composite material by a rolling method.

FIG. 12 is a schematic diagram showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 13 is a schematic diagram showing a process of processing a multilayered composite material into a printed wiring board.

FIG. 14 is a schematic diagram showing a manufacturing process of a multilayer composite material.

FIG. 15 is a conceptual diagram showing a method for producing a multilayer composite material by a rolling method.

FIG. 16 is a conceptual diagram showing a method for producing a multilayer composite material by a rolling method.

FIG. 17 is a schematic diagram showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 18 is a schematic diagram showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 19 is a schematic view showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 20 is a schematic diagram showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 21 is a conceptual diagram showing a layup state during press working.

FIG. 22 is a conceptual diagram showing a layup state during press working.

FIG. 23 is a schematic diagram showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 24 is a schematic diagram showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 25 is a schematic diagram showing the process of processing a multilayer composite material into a printed wiring board.

FIG. 26 is a schematic diagram showing a process of processing a multilayer composite material into a printed wiring board.

FIG. 27 is a conceptual diagram showing a conventional multilayer composite material.

FIG. 28 is a schematic diagram showing a process of processing a printed wiring board using a conventional multilayer composite material.

FIG. 29 is a schematic diagram showing a process of processing a printed wiring board using a conventional multilayer composite material.

FIG. 30 is a schematic diagram showing a process of processing a printed wiring board using a conventional multilayer composite material.

[Explanation of symbols]

1a, 1b, 1c Multilayer composite material 1d, 1e 2 Second bulk copper layer 3 bumps 4 Prepreg (insulating layer) 5 Copper clad laminate 6 Roughening layer 7 Etching barrier layer 8 First bulk copper layer 9 Carrier layer 10 Bonding interface layer 11 circuits 12 Electrolytic copper foil BB built-up substrate IB inner layer substrate MLB Multilayer printed wiring board TL peeling strength measurement circuit W press plate M End plate

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4E351 AA01 BB01 BB30 BB38 CC06                       DD04 DD54 GG20                 4K044 AA01 AA16 AB02 AB09 BA06                       BA10 BB02 BB10 BC14 CA15                       CA18                 5E317 AA24 BB12 CC52 CD21 CD25                       GG14                 5E346 AA15 AA43 CC08 CC32 CC55                       CC57 CC58 DD02 DD12 DD32                       DD44 EE04 EE09 FF35 GG17                       GG18 GG22 GG28 HH26

Claims (20)

[Claims] 1. A first bulk copper layer for forming a circuit pattern / an etching barrier metal layer / a roughening layer / a second bulk used for forming a bump shape for obtaining interlayer conduction of a multilayer printed wiring board. A first bulk copper layer or a second bulk copper layer constituting a multilayer composite material having a four-layer structure of copper layers is used as a reference layer, and other layers are formed on the reference layer by an electrochemical method or an etching method. A multilayer composite material used for forming a conductor of a printed wiring board, which is characterized by the above. 2. A carrier layer / bonding interface layer / first bulk copper layer for forming a circuit pattern / roughening layer / etching barrier metal layer / bump shape for obtaining interlayer conduction of a multilayer printed wiring board. A multi-layer composite material used for forming a conductor of a printed wiring board, which has a laminated state of a 6-layer structure of a second bulk copper layer used for the purpose. 3. A bump shape for obtaining interlayer conduction of carrier layer / bonding interface layer / first bulk copper layer for forming a circuit pattern / etching barrier metal layer / roughening layer / multilayer printed wiring board. A multi-layer composite material used for forming a conductor of a printed wiring board, which has a laminated state of a 6-layer structure of a second bulk copper layer used for the purpose. 4. A bonding interface layer is provided on both sides of the carrier layer,
A first bulk copper layer for forming a circuit pattern is provided on each of the bonding interface layers on both sides, and a roughening layer is provided on each of the first bulk copper layers on both sides. A second bulk provided with an etching barrier metal layer on each roughening treatment layer and used to form bump shapes for obtaining interlayer conduction of a multilayer printed wiring board on each etching barrier metal layer on both sides. A multilayer composite material used for forming a conductor of a printed wiring board having a laminated state of an 11-layer structure in which a copper layer is formed by an electrolytic method. 5. A bonding interface layer is provided on both surfaces of the carrier layer,
A first bulk copper layer for forming a circuit pattern is provided on each of the bonding interface layers on both sides, and an etching barrier metal layer is provided on each of the first bulk copper layers on both sides. A second bulk provided with a roughening treatment layer on each etching barrier metal layer and used for forming bump shapes for obtaining interlayer conduction of a multilayer printed wiring board on each roughening treatment layer on both sides A multilayer composite material used for forming a conductor of a printed wiring board having a laminated state of an 11-layer structure in which a copper layer is formed by an electrolytic method. 6. The multilayer used for forming a conductor of a printed wiring board according to claim 2, wherein the carrier layer is a metal foil made of any one of aluminum, aluminum alloy, copper and copper alloy. Composite material. 7. The conductor of a printed wiring board according to claim 4, wherein the carrier layer is a metal foil or a metal plate having a thickness of 100 μm or more made of any material of aluminum, aluminum alloy, copper, and copper alloy. Multilayer composite material used for forming. 8. The etching barrier metal layer is nickel,
A multilayer composite material used for forming a conductor of a printed wiring board according to any one of claims 1 to 7, which is composed of a nickel alloy, tin, or a tin alloy. 9. The multilayer composite material used for forming a conductor of a printed wiring board according to claim 1, wherein the second bulk copper layer is a copper layer having a thickness of 50 to 150 μm. 10. The multilayer composite material used for forming a conductor of a printed wiring board according to claim 1, wherein the first bulk copper layer is a copper layer having a thickness of less than 25 μm. 11. A roughening treatment layer is formed on one surface of a second bulk copper layer, and an etching barrier layer that is not corroded by a copper etching solution is formed on the roughening treatment layer. A method for producing a multi-layer composite material used for forming a conductor of a printed wiring board having a four-layer structure, characterized in that a first bulk copper layer is formed on the above using an electrochemical method. 12. A bonding interface layer is formed on one surface of a carrier foil, a first bulk copper layer is deposited and formed on the bonding interface layer by an electrolytic method, and a roughening treatment is performed on the first bulk copper layer. Layer is formed, an etching barrier layer that is not corroded by a copper etching solution is formed on the roughening treatment layer, and a second bulk copper layer is formed on the etching barrier layer by an electrolytic method. A method for producing a multilayer composite material used for forming a conductor of a printed wiring board having a six-layer structure, wherein 13. A bonding interface layer is formed on one surface of a carrier foil, a first bulk copper layer is deposited and formed on the bonding interface layer by an electrolytic method, and a roughening treatment is performed on the first bulk copper layer. An electrolytic copper foil with a carrier foil obtained by forming a layer, and a copper foil to be a second bulk copper layer having an etching barrier layer that does not corrode with a copper etching solution on one surface are used. A six-layer structure is provided in which the surface of the electrolytic copper foil with a roughening treatment formed thereon and the surface of the second bulk copper layer on which the etching barrier layer is formed are rolled and clad so as to face each other. A method for producing a multilayer composite material used for forming a conductor of a printed wiring board. 14. A bonding interface layer is formed on one surface of a carrier foil, a first bulk copper layer is deposited and formed on the bonding interface layer by an electrolytic method, and a roughening treatment is performed on the first bulk copper layer. An electrolytic copper foil with a carrier foil, which comprises an etching barrier layer obtained by forming a layer on the roughening-treated layer and forming an etching barrier layer that does not corrode with a copper etching solution, and a second bulk copper A layer of copper foil is used, and the surface of the electrolytic copper foil with carrier foil on which the etching barrier layer is formed and one surface of the second bulk copper layer are rolled so as to face each other and clad. A method for producing a multilayer composite material used for forming a conductor of a printed wiring board having a 6-layer structure. 15. A bonding interface layer is formed on one surface of a carrier foil, a first bulk copper layer is deposited and formed on the bonding interface layer by an electrolytic method, and copper etching is performed on the first bulk copper layer. An etching barrier layer that does not corrode with a liquid is formed, a roughening treatment layer is formed on the etching barrier layer, and a second bulk copper layer is formed on the roughening treatment layer by an electrolytic method. A method for producing a multilayer composite material used for forming a conductor of a printed wiring board having a six-layer structure, wherein 16. A bonding interface layer is formed on one surface of a carrier foil, a first bulk copper layer is deposited and formed on the bonding interface layer by an electrolysis method, and a copper etching solution is formed on the first bulk copper layer. Etching of the electrolytic copper foil with a carrier foil, using an electrolytic copper foil with a carrier foil formed with an etching barrier layer that does not corrode with a copper foil and a copper foil serving as a second bulk copper layer formed with a roughening treatment layer Conductor formation of a printed wiring board having a six-layer structure, characterized in that the surface on which the barrier layer is formed and the surface on which the roughening treatment layer of the second bulk copper layer is formed are opposed and rolled to clad. A method for producing a multilayer composite material used in. 17. An electrolytic copper foil with a carrier foil, wherein a bonding interface layer is formed on one surface of a carrier foil, and a first bulk copper layer is deposited and formed on the bonding interface layer by an electrolytic method, and a second bulk copper layer. A roughening treatment layer is formed on one surface of a copper foil to be, and an etching barrier layer obtained by forming an etching barrier layer that is not eroded by a copper etching solution on the roughening treatment layer is provided. Using, the surface of the electrolytic copper foil with carrier foil on which the first bulk copper layer is formed and the surface of the second bulk copper layer on which the etching barrier layer is formed are rolled and clad so as to face each other. And a method for manufacturing a multilayer composite material used for forming a conductor of a printed wiring board having a six-layer structure. 18. A bonding interface layer is formed on both sides of a carrier foil, and a first bulk copper layer is deposited and formed on the bonding interface layers on both sides using an electrolysis method. To form a roughening treatment layer on, on the roughening treatment layer on both sides, to form an etching barrier layer that does not erode with a copper etching solution, on the etching barrier layer on both sides, A method for producing a multilayer composite material used for forming a conductor of a printed wiring board having an 11-layer structure, which comprises forming a second bulk copper layer by using an electrolysis method. 19. A bonding interface layer is formed on both sides of a carrier foil, and a first bulk copper layer is deposited and formed on the bonding interface layers on both sides using an electrolysis method. On top of it, form an etching barrier layer that does not corrode with a copper etching solution, form a roughening treatment layer on both sides of the etching barrier layer, and then apply an electrolytic solution on the roughening treatment layer on both sides. Second using the method
A method for producing a multilayer composite material used for forming a conductor of a printed wiring board having an 11-layer structure, which comprises forming a bulk copper layer. 20. A printed wiring board obtained by using the multilayer composite material according to claim 1.