JP2003142832A - Module with built-in part, package, and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a functional module which is equipped with parts that are built in an electric insulating layer and three-dimensionally connected together, reduced in size, improved in density, reduced in resistivity, decreased in part temperature, and increased in current capacity. SOLUTION: A functional module is composed of, at least, a semiconductor 104, a capacitor 102, and an inductor 103 which are electrically connected together. The capacitor 102 and/or the inductor 103 is built in an electric insulating material 101 formed of a mixture containing, at least, thermosetting resin and inorganic filler. A through-hole is provided to the module so as to penetrate through, at least, one of the electrodes of the capacitor 102 or the inductor 103, and the above through-hole functions as a plated through-hole 107 which is connected to an external electrode 109.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a functional module used in electric and electronic equipment, and particularly suitable for a portable information terminal which is required to be small in size, high in density and high in efficiency, a high frequency function, a logic function. The present invention relates to a component built-in module having a circuit function, a package component, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, with the miniaturization and high density of electric and electronic devices, a plurality of parts are provided for each functional block as compared with the conventional method of mounting individual parts on a substrate to form an electric circuit. The method of modularizing as a package is often used. This module is generally formed by mounting necessary components on a daughter board on one side or both sides. However, in the method of mounting the mounted components on the surface of the substrate, it is impossible to make the module area smaller than the area of the mounted components, and there is a limit to increase the density. Further, since the components are arranged on a plane, the connection distance between the components must be long depending on the configuration, which causes a problem of increased loss and impedance matching with respect to high frequency.

For this reason, a module has been proposed in which the components are not only mounted two-dimensionally on the surface of the substrate, but also the components are placed three-dimensionally by placing the components inside the substrate. As a module or substrate of such a form, for example, a method of providing a void in a ceramic substrate and arranging components in the void, or a method of providing a void in the multilayer printed wiring board and arranging components therein and so on.

However, according to the example using the above-mentioned ceramic substrate, since the ceramic substrate includes the firing step, it is not possible to incorporate a passive component containing a semiconductor or an organic substance. Therefore, it is not possible to mount a component on the upper part of the portion where the built-in void is provided, and although it is possible to reduce the height, in reality, three-dimensional connection is not possible, and there is a limit to high density.
Also, when a ceramic substrate is used, the connection between layers is via a via made of a sintered high-resistance metal such as tungsten or molybdenum, so the connection resistance becomes relatively large, especially in circuits such as power supplies where loss is a problem. It was a big problem.

According to an example in which a printed wiring board is provided with a void portion and parts are arranged therein, low-resistance connection is possible by through-hole connection, but since the printed wiring board has a low thermal conductivity, The heat generated from the components inside the board is difficult to transfer to the outside, and the heat dissipation becomes difficult. For this reason, in the actual design, there is a problem that it becomes impossible to increase the density of the components in consideration of the temperature rise. Further, the thermal expansion coefficient of the printed wiring board in the thickness direction is about 60 ppm / ° C., and the thermal expansion coefficient of the plating material copper (17 ppm /
There was a problem with the connection reliability.

In contrast to these examples, Japanese Patent Laid-Open No. 11-220262 discloses an example in which high density and high reliability are improved, and at least 70 to 95% by weight of inorganic filler and 5 to 100% of thermosetting resin composition. At least one active component and / or passive component is built in an electrically insulating substrate made of a mixture containing 30% by weight, and a plurality of wiring patterns and a conductive resin composition are provided between the wiring patterns. It is electrically connected by a via. According to this example, it is possible to increase the density by three-dimensional connection, and it is possible to expect the reliability to be improved by matching the thermal expansion coefficients.

[0007]

However, in the via connection using the conductive resin composition, since the conduction is obtained by the contact of the metal powder, the resistance value becomes higher than that of the connection using only the metal, and the resistance is several hundred milliamperes. When a relatively large current of about several amperes is used, there is a problem in that the amount of heat generated increases and the efficiency decreases due to loss. In particular, when the amount of current is large, the amount of heat generated is large and the temperature of the module itself rises, which may lead to component failure, or damage to the via connection or the substrate itself due to heat. It was

The present invention has been made in order to solve the above-mentioned problems, and a plated through hole enables a low resistance connection, and a through hole is directly formed in a component electrode to further reduce the resistance. It is an object of the present invention to provide a component built-in module that enables various connections. Also,
A component built-in module that can be filled with a high concentration of inorganic filler and that is made by embedding passive components such as semiconductors, capacitors, and inductors inside with a simple construction method, and a component built-in module The object is to provide a package component that can By selecting the inorganic filler, a module having desired performance can be manufactured. That is, it is possible to realize a module having an ultrahigh-density mounting configuration in which the coefficient of thermal expansion in the plane direction of the module is close to that of the metal and semiconductor of the wiring pattern and each component, and the heat dissipation is excellent, and the magnetic characteristics and the dielectric characteristics are excellent. Further, by using the through hole and the inner via together, a component built-in module having high density, low resistance, and large current capacity can be realized.

[0009]

A component built-in module according to the present invention is a module in which at least a semiconductor, a capacitor and an inductor are electrically connected, and at least one of the capacitor and the inductor is a thermosetting resin. A through hole formed in the module so as to penetrate through at least one of the electrodes of the built-in capacitor and / or inductor, which is embedded in an electrical insulating material made of a mixture containing at least an inorganic filler. Is connected to the external electrode by a plated through hole.

Further, in the above structure, the semiconductor device is a component built-in module in which the semiconductor is built in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler.

Further, in the above structure, the semiconductor and / or the capacitor and / or the inductor contained in the electrical insulating material are formed in a wiring pattern formed on the same surface as the semiconductor and / or the capacitor and / or the inductor. The component built-in module is connected and the wiring pattern is connected to an external electrode through a plated through hole.

Further, the component built-in module according to the present invention is a module in which at least a semiconductor, a capacitor and an inductor are electrically connected, and at least one of the capacitor and the inductor contains a thermosetting resin and an inorganic filler. Embedded in an electrical insulating material made of a mixture containing at least, and at least one of the electrodes of the incorporated capacitor and / or inductor is connected to an end face electrode formed on the end face of the module.

Further, in the above structure, the semiconductor module is a component built-in module in which the semiconductor is built in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler.

Further, in the above structure, the wiring in which the semiconductor and / or the capacitor and / or the inductor embedded in the electric insulating material is formed on the same surface as the semiconductor and / or the capacitor and / or the inductor. The component built-in module is connected to a pattern, and at least a part of the wiring pattern is connected to an end face electrode formed on an end face of the module.

Further, in each of the above-mentioned constitutions, it is a component built-in module in which the end face electrode is formed in a groove shape penetrating in a vertical direction of the module. Further, in the above configuration, the end face electrode is a component-embedded module formed by plating metal.

In each of the above constructions, a component built-in module including a plurality of wiring patterns and a plurality of inner vias made of a conductive resin composition for electrically connecting the wiring patterns is provided.

Further, in each of the above-mentioned constitutions, at least two kinds of parts among the semiconductor, the capacitor and the inductor have different surfaces in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler. It is a module with built-in components built in.

Further, in each of the above-mentioned configurations, at least two types of components of the semiconductor, the capacitor, and the inductor overlap each other when the shapes of the components are projected in a direction perpendicular to the main surface of the module. It is a component built-in module arranged so as to have a part.

In each of the above configurations, the module is a component built-in module having a DC-DC converter function.

Further, in each of the above-mentioned structures, the semiconductor device is a bare chip, and the component built-in module is mounted on the wiring pattern and the flip chip.

Further, in the package component of the present invention, the capacitor or the inductor is embedded in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler, and at least one of the electrodes of the incorporated capacitor or inductor is included. A through hole is formed so as to pass through one of them, and the through hole is connected to the external electrode by a plated through hole.

Further, in the package component of the present invention, the capacitor or the inductor is embedded in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler, and at least one of the electrodes of the incorporated capacitor or inductor is incorporated. One is connected to an end face electrode formed on the end face of the module.

Further, in each of the above-mentioned constitutions, the capacitor is a component built-in module and a package component which are film-like solid electrolytic capacitors. Further, in the above configuration, the capacitor is a component built-in module and a package component in which the capacitor has a three-terminal structure having two anodes or a four-terminal structure having two anodes and two cathodes.

In each of the above constructions, the inductor is a component built-in module and a package component, each of which is composed of a sheet coil having one or two layers of flat windings.

Further, in each of the above-mentioned constitutions, a component built-in module and a package component in which at least one electrode of the capacitor and the inductor is made of a metal foil.

Further, in each of the above constitutions, the inorganic filler in the thermosetting resin composition is Al ₂ O ₃ , SiO ₂ , MgO,
It is at least one type of component built-in module and package component selected from the group consisting of BeO, Si ₃ N ₄ , SiC, AlN and BN. In each of the above configurations, the inorganic filler in the thermosetting resin composition containing the inductor is at least one selected from the group consisting of iron, nickel, ferrite, permalloy and sendust, and a component built-in module and package. It is a part.

Further, in each of the above-mentioned configurations,
The thermal expansion coefficient of the edge material is 5 to 30 × 10 ^-6In parts that are / ° C
It is a storage module and package parts. Also, the above
In each configuration, the electrical conductivity of the electrical insulating material is 1 to 1
0W / mK module built-in module and package
It is a part.

The method of manufacturing a component built-in module according to the present invention comprises a step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet, and at least one sheet. A step of superimposing the sheet-shaped material and a copper foil on each other by heating and pressurizing them, a step of processing the copper foil to form a wiring pattern, and mounting a capacitor or an inductor on the wiring pattern A step, a step of further stacking the sheet-shaped material and a copper foil on the component mounting surface on the wiring pattern, burying the capacitor or inductor in the sheet-shaped material, and incorporating the capacitor or inductor. Step of curing the thermosetting resin of the sheet-like material, and positioning and penetrating the electrode of the capacitor or the inductor. A step of forming a through-hole by copper plating, a step of processing the copper foil to form an external electrode and a wiring pattern, and a step of mounting at least a semiconductor and an inductor or a capacitor on the wiring pattern. It is characterized by including at least and.

Further, the method of manufacturing a component built-in module according to the present invention comprises a step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet, and a copper foil. A step of mounting a capacitor or an inductor on the component, a step of superimposing the sheet-shaped material and a copper foil on the component mounting surface of the copper foil, and embedding the capacitor or the inductor in the sheet-shaped material. A step of hardening the thermosetting resin of the sheet-like material by heating and pressurizing, a step of forming a through hole by positioning so as to penetrate the electrode of the capacitor or the inductor, and a through through hole by copper plating A step of forming an external electrode and a wiring pattern by processing the copper foil and at least the wiring pattern. Characterized in that it comprises at least a step of mounting a conductor and an inductor or a capacitor.

Further, the method for manufacturing a component built-in module according to the present invention comprises a step of processing a thermosetting resin composition, in which at least an uncured thermosetting resin and an inorganic filler are mixed, into a sheet, and a mold release. A step of forming a wiring pattern on one surface of the carrier; a step of mounting a capacitor or an inductor on the wiring pattern of the release carrier; and a sheet-shaped object and a copper foil on the component mounting surface of the release carrier. A step of burying and embedding the capacitor or the inductor in the sheet-shaped object by superimposing them, and a step of further hardening the thermosetting resin of the sheet-shaped object by heating and pressurizing; A step of forming a through hole by positioning so as to penetrate the electrode, a step of forming a through through hole by copper plating, Forming an external electrode and the wiring patterns by processing the Kidohaku, characterized in that it comprises at least a step of mounting at least a semiconductor and an inductor or capacitor to the wiring pattern.

Further, the method for manufacturing a component built-in module according to the present invention comprises a step of processing a thermosetting resin composition in which at least an uncured thermosetting resin and an inorganic filler are mixed into a sheet-like material, and at least 2 A step of sandwiching a capacitor or an inductor between the sheet-shaped objects and incorporating it, and a step of further sandwiching with a copper foil to heat and pressurize the thermosetting resin of the sheet-shaped object and to bond the copper foil A step of forming a through hole by positioning so as to penetrate the electrode of the capacitor or the inductor, a step of forming a through through hole by copper plating, and a step of processing the copper foil to form an external electrode and a wiring pattern. The process of forming and the process of mounting at least a semiconductor and an inductor or a capacitor on the wiring pattern are reduced. Characterized in that it also includes a.

In the method of manufacturing a component built-in module described above, after the step of sandwiching a capacitor or inductor between at least two sheet-like objects to incorporate them, in addition to sandwiching with a copper foil, the sheet-like object is further added. And the copper foil are superposed on one side or both sides and heated and pressed to cure the thermosetting resin of the sheet-like material and replace the step of adhering the copper foil with the component built-in module. Is a manufacturing method.

In the method of manufacturing a component built-in module, the step of positioning the electrode of the capacitor or the inductor to form a through hole and processing the copper foil to form a wiring pattern. A step, a step of mounting a semiconductor on the wiring pattern, and the sheet-shaped material and the copper foil are further stacked in this order on the mounting surface of the semiconductor to embed the semiconductor in the sheet-shaped material. A step of hardening the thermosetting resin of the sheet-like material by further heating and pressurizing, positioning and penetrating so as to penetrate the electrode of the capacitor or the inductor and the wiring pattern connected to the semiconductor. The method for manufacturing a component built-in module is characterized in that the step of forming a hole is replaced.

In the method of manufacturing a component built-in module described above, the step of forming a through hole by positioning the electrode of the capacitor or the inductor so as to penetrate the electrode is performed by forming a wiring pattern on which the capacitor or the inductor is mounted. In the method of manufacturing a component built-in module, the step of positioning so as to penetrate and forming a through hole is replaced.

In the method of manufacturing a component built-in module described above, in the step of processing a thermosetting resin composition obtained by mixing at least the uncured thermosetting resin and an inorganic filler into a sheet, the sheet is further added. A method of manufacturing a component built-in module, which further comprises a step of forming a through hole at a desired position of the shaped article and a step of filling the through hole with a conductive resin composition.

The method for manufacturing a package component according to the present invention comprises a step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet, and at least one of the above-mentioned materials. A step of superimposing a sheet-shaped material and a copper foil and heating and pressurizing them to integrate them,
A step of processing the copper foil to form a wiring pattern, a step of mounting a capacitor or an inductor on the wiring pattern, and further stacking the sheet-shaped material and the copper foil on a component mounting surface on the wiring pattern. In addition, a step of embedding the capacitor or the inductor by embedding it in the sheet-shaped object, a step of further curing the thermosetting resin of the sheet-shaped object by heating and pressurizing, an electrode of the capacitor or the inductor At least so as to form a through hole, a step of forming a through hole by copper plating, and a step of processing the copper foil to form an external electrode. .

Further, the method for manufacturing a package component according to the present invention comprises a step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet, and at least two sheets. And a step of sandwiching a capacitor or an inductor between the sheet-like materials and incorporating them, and a step of further sandwiching with a copper foil to heat and pressurize the thermosetting resin of the sheet-like material and to bond the copper foil together. A step of forming a through hole by positioning so as to penetrate the electrode of the capacitor or the inductor, a step of forming a through through hole by copper plating, and a step of processing the copper foil to form an external electrode Is included at least.

Further, in the method of manufacturing a component built-in module and a package component, the component built-in module and the package component are cut so as to pass through a central portion of the through-hole, and the through-hole is an end face electrode. And a method of manufacturing a component built-in module and a package component.

In the method of manufacturing a component built-in module, the step of mounting the semiconductor may include a method of providing a gold bump on the semiconductor and connecting the wiring pattern with a conductive adhesive, or a method of connecting the wiring pattern to the wiring pattern. It is a method of manufacturing a component built-in module, which is a method of bonding with a sound wave.

[0040]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. The embodiment of the present invention is based on a step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet, and the sheet. This sheet-like material has flexibility at room temperature and is suitable for a process such as embedding a component. In addition, after thermosetting, it becomes rigid and can retain its shape. Further, by changing the type and amount of the inorganic filler, it is possible to change the thermal expansion coefficient, the thermal conductivity, the dielectric constant and the magnetic permeability of the electrical insulating material, and obtain the desired electrical and mechanical properties. is there.

(Embodiment 1) In the first embodiment of the present invention, at least one sheet-shaped material and a copper foil are superposed and heated / pressurized to be integrated, and then the copper foil is used as a wiring pattern. And then mount a capacitor or inductor on it, and further lay the sheet-shaped material and copper foil on the capacitor or inductor and bury them in the sheet-shaped material to integrate and integrate them, and then the electrodes of the inductor or capacitor. To form a through hole by forming a through hole by copper plating, then form a through through hole by copper plating, then process the copper foil to form an external electrode and a wiring pattern, and mount at least a semiconductor and an inductor or a capacitor. To do.

In this module, a capacitor or an inductor is built in a substrate and components can be mounted three-dimensionally, so that a compact and high-density form can be realized. Therefore, the wiring length can be shortened, and a high-speed circuit with low loss can be realized. Also, because it includes interlayer connection by copper plated through holes,
A low loss connection can be realized.

(Embodiment 2) In the second embodiment of the present invention, a capacitor or inductor is mounted on a copper foil, and then the sheet-like material and the copper foil are superposed on each other and heated and pressed to heat the capacitor or the capacitor. The inductor is embedded in the sheet-shaped material and embedded, and the thermosetting resin of the sheet-shaped material is cured, and then a through hole is formed by positioning so as to penetrate the electrode of the capacitor or the inductor, and copper plating is performed. Forming through-holes, processing the copper foil to form external electrodes and wiring patterns,
At least a semiconductor and an inductor or a capacitor are mounted on the wiring pattern.

According to this embodiment, since the components can be mounted on both sides of the copper foil pattern, it is possible to reduce the height of the module.

(Embodiment 3) In the third embodiment of the present invention, a wiring pattern is formed on one surface of a release carrier, and a capacitor or inductor is mounted on the wiring pattern of the release carrier, and its parts are formed. The sheet-shaped material and the copper foil are superposed on the mounting surface, and the capacitor or inductor is embedded in the sheet-shaped material by heating and pressurizing it and the thermosetting resin of the sheet-shaped material is cured. A through hole is formed by positioning so as to penetrate the electrode of the inductor, a through through hole is formed by copper plating, the copper foil is processed to form an external electrode and a wiring pattern, and at least a semiconductor and a wiring pattern are formed on the wiring pattern. It mounts an inductor or a capacitor.

According to the present embodiment, since the wiring pattern is formed in advance, it is not necessary to align the pattern formation, and the module can be easily manufactured. Further, since the wiring pattern is not plated during through-hole plating, the wiring pattern thickness can be kept thinner than the plating thickness. Therefore, it becomes possible to form a fine wiring pattern.

(Embodiment 4) In the fourth embodiment of the present invention, at least two sheet-like objects sandwich a capacitor or an inductor therein, and the capacitors or inductors are further sandwiched by copper foil to heat and pressurize the sheet. After curing the thermosetting resin of the shaped material and adhering the copper foil, a through hole is formed by positioning so as to penetrate the electrode of the capacitor or the inductor, and a through through hole is formed by copper plating, The copper foil is processed to form an external electrode and a wiring pattern, and at least a semiconductor and an inductor or a capacitor are mounted on the wiring pattern.

According to the present embodiment, it becomes possible to form a component built-in module without providing a wiring layer inside, and it is possible to realize a small size and a low profile. In addition to this embodiment, it is possible to add a wiring layer to one side or both sides through a sheet-shaped material. Further, when the wiring layer is added, it is also possible to mount a semiconductor and embed this semiconductor in a sheet-shaped article. In this case, the height can be reduced, and the extraction electrode can be re-wired.

(Embodiment 5) In the fifth embodiment of the present invention, a through hole is preliminarily formed in the sheet material used in the module produced in each of the above embodiments, and the conductive resin composition is formed in the through hole. After filling with an object, it is superposed on a copper foil and heated and pressed to form a wiring layer, or a capacitor or an inductor is embedded and incorporated.

According to the present embodiment, the plated through hole is used in the wiring layer through which a large current flows, and the inner via connected by the above conductive resin composition is used in the case where the current amount such as a control signal is low. Therefore, it is possible to realize high efficiency due to low resistance, decrease in temperature rise, and high density due to inner vias.

(Embodiment 6) In the sixth embodiment of the present invention, after the capacitor or the inductor in each of the above embodiments is embedded in a sheet-like material and built in, the outermost copper foil is further processed. To form a wiring pattern, mount a semiconductor on the wiring pattern, stack the sheet-shaped material and copper foil on the semiconductor again, heat and pressurize to embed the semiconductor, and integrate it with the copper foil. Forming a through hole by positioning so as to penetrate the electrode and the wiring pattern connected to the semiconductor;
The copper foil is processed to form an external electrode and a wiring pattern, and at least an inductor or a capacitor is mounted on the wiring pattern.

According to the present embodiment, a plurality of parts can be three-dimensionally built in and a high-density module can be obtained.

(Embodiment 7) In a seventh embodiment of the present invention, at least one sheet-like material and a copper foil are superposed and integrated by heating and pressing, and the copper foil is processed. The capacitor or inductor is formed by forming a wiring pattern, mounting a capacitor or an inductor on the wiring pattern, and further stacking the sheet-shaped material and a copper foil on the component mounting surface of the wiring pattern and heating and pressing. Embedded in the sheet-like material, then positioned so as to penetrate the electrode of the capacitor or inductor to form a through hole, form a through through hole by copper plating, and process the copper foil. And a step of forming an external electrode.

According to this embodiment, it is possible to easily obtain a highly reliable package component suitable for a component built-in module. Similarly, in the above-described respective embodiments, by forming the external electrode in the state where the capacitor or the inductor is built in, a highly reliable package component having a small connection resistance can be obtained.

(Embodiment 8) In the eighth embodiment of the present invention, in each of the above embodiments, the component built-in module and the package component produced are cut so as to pass through the plated through-holes, and the plating is performed. The through holes are used as end face electrodes.

According to the present embodiment, since the cutting is performed by the through hole, the outer shape can be downsized. Further, since it is not necessary to form an external electrode, it is not necessary to arrange a copper foil on the outermost surface, which is advantageous in the process.

[0057]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component built-in module and a package component according to an embodiment of the present invention and a method of manufacturing the same will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view of a component built-in module according to an embodiment of the present invention. In FIG. 1, 101 is a sheet-like material which is an electrical insulating material, 102 is a capacitor embedded in the sheet-like material, 103 is an inductor, 104 is a semiconductor embedded in the sheet-like material, 105 is a chip part, 106 is an inner via, 107 is a through-hole copper plated through hole, 1
Reference numeral 08 is a wiring pattern formed in layers in the sheet-like material, and 109 is an external electrode.

The sheet material which is an electric insulating material is a mixture containing at least an inorganic filler and a thermosetting resin.
As the inorganic filler, any electrically insulating one may be used, but in terms of thermal expansion coefficient and thermal conductivity, Al ₂ O ₃ , SiO ₂ , M
It is preferably at least one selected from the group consisting of gO, BeO, Si ₃ N ₄ , SiC, AlN and BN. In particular, Al
_{When 2} O ₃ or SiO ₂ is used, it can be easily kneaded with a thermosetting resin and has excellent sheet processability. Further, when AlN is used, the thermal conductivity becomes particularly high.

The ratio of the inorganic filler is 60 to 9
5% by weight is preferable, and 70 to 95% by weight is more preferable. If it is lower than this, the coefficient of thermal expansion of the sheet-like material becomes large, and the difference in the coefficient of thermal expansion from the semiconductor, each component, or the copper foil which is the wiring becomes large. On the other hand, if it is higher than this, the fluidity of the sheet is lowered and it becomes difficult to embed the capacitor and the inductor.

As the thermosetting resin, for example, epoxy resin, phenol resin, isocyanate resin can be used,
It is preferable to use at least one selected from these resins. This is because these resins each have excellent heat resistance, mechanical strength, and electrical insulation.

As an electrical insulating material, its coefficient of thermal expansion is 5
It is preferably x10 ^-6 to 30 x 10 ^-6 / ° C. Within this range, the difference in the coefficient of thermal expansion between the built-in capacitor or inductor, the semiconductor, the wiring pattern and the copper, which is the plating material, becomes small, and high reliability can be obtained. Further, it is preferable that the thermal expansion coefficient of the electrical insulating material is substantially the same in the plane direction and the thickness direction. This is because reliability is improved. Further, the thermal conductivity of the electric insulating material is preferably 1 to 10 W / m · K. This is because the heat dissipation becomes good and the allowable current value can be increased. Further, it is possible to quickly dissipate the heat generated by the built-in components to the outside and reduce the temperature rise of the components.

Any capacitor can be used as long as its electrode terminals can be taken out, but at least one electrode is preferably a metal foil. This is because the element can be penetrated without being destroyed when the through hole is formed, and the element can be electrically connected to the external electrode by plating. Further, the capacitor is preferably a film-shaped solid electrolytic capacitor. With this capacitor, it is possible to reduce the height of a chip capacitor having almost the same capacity, and it is possible to downsize the module. Further, since the anode is a metal foil, it is easy to form a through hole as in the above preferred example. As the anode metal of the above solid electrolytic capacitor, for example, aluminum or tantalum can be used.

The capacitor preferably has a three-terminal structure having two anodes or a four-terminal structure having two anodes and two cathodes. In this case, the equivalent series inductance due to the wiring is reduced, which is advantageous in that the noise resistance is improved. Moreover, the influence of the stray capacitance due to the wiring distance can be suppressed, which is advantageous in that the degree of freedom in the module configuration is improved.

As the inductor, for example, a wire-wound inductor or a chip inductor can be used, but at least one electrode is preferably a metal foil like the capacitor. As the metal foil, for example, copper, silver or aluminum can be used. Further, it is particularly preferable that the inductor is composed of a sheet-shaped coil having one or two layers of flat-plate windings. According to this preferable example, the thickness of the inductor can be reduced, and the height of the module can be reduced.

The semiconductor is preferably a bare chip. This is because the volume used for the package is removed and the module can be downsized. Further, the semiconductor is preferably flip-chip mounted on the wiring pattern. This is because in the case of flip chip, the mounting area and height can be reduced as compared with wire bonding, and since wire flow due to the sheet-like material does not occur, highly reliable mounting is possible.

At least two kinds of components of the semiconductor, the capacitor, and the inductor are projected in a direction perpendicular to the main surface of the module as shown in FIG.
It is preferable that the shapes are arranged at overlapping positions.
This arrangement improves the mounting density of each component and reduces the volume. Further, it is possible to shorten the wiring length by the three-dimensional wiring, and it is possible to improve the performance such as lowering the resistance and speed of the wiring and improving the noise resistance.

Since this module has an effect of enabling interlayer connection with low resistance, it is particularly preferable to use it as a power source for handling electric power. For example, it can have a function as a DC-DC converter or a regulator, and in particular has a DC-DC converter function. It is preferable to have

In the embodiment shown in FIG. 1, the capacitor 102 is built in the electric insulating material 101 and the inductor 103 is connected to the outside, but the inductor 103 may be built in conversely. Both the inductor 103 and the inductor 103 may be incorporated in the electrical insulating material 101. Also,
The semiconductor 104 is built in the electric insulating material 101, but it is not always necessary to build it in, and may be mounted on the electrode surface. Further, although the chip component 105 is built in the electric insulating material 101, the chip component 105 is not always necessary and may be deleted or added as appropriate.

(Embodiment 2) FIGS. 2A to 2C are cross-sectional views by step showing a method of manufacturing a component built-in module according to an embodiment of the present invention. As shown in FIG. 2 (a), a sheet-like material 201 is prepared which is made into a sheet of a mixture containing at least a thermosetting resin and an inorganic filler. Copper foil 202 on both sides of this sheet 201
By stacking and heating and pressing, the copper-clad double-sided plate in which the copper foil 202 is laminated on the sheet 201 as shown in FIG. 2B is manufactured. Next, as shown in FIG. 2C, one side of the copper foil 202 is processed to form a wiring pattern 203. After that, Figure 2
As shown in (d), the capacitor 204 is placed on the wiring pattern 203.
Implement. In this figure, 205 is an electrode of the capacitor 204, and 206 is an adhesive. Further, by stacking the sheet-like material 201 on top of this, and further stacking and heating the copper foil 202, the capacitor 204 is embedded and embedded in the sheet-like material 201 as shown in FIG. 2 (e). At the same time, the thermosetting resin in the sheet material 201 is cured. After that, as shown in FIG. 2F, a through hole is formed so as to penetrate the electrode 205 of the built-in capacitor 204, and copper plating is performed to form a through hole 207. After that, as shown in FIG. 2G, the copper foil 202 is processed to form a wiring pattern 203, and the semiconductor 208, the inductor 209, the chip component 210, and the external electrode 211 are mounted on the copper foil 202 to form a component built-in module. Finalize.

For the production of the sheet 201, a thermosetting resin and an inorganic filler in a desired ratio may be weighed and mixed to form a sheet. As a mixing method,
For example, a method using a ball mill, a method using a planetary mixer, or a method using a stirrer can be used. The method for forming the above mixture into a sheet is not particularly limited, and a doctor blade method, a coater method, an extrusion method or the like can be used. Further, the heat conductive resin composition is mixed with a solvent to adjust its viscosity to form a film, and then the solvent is dried at a temperature lower than the curing temperature of the thermosetting resin in the heat conductive resin composition to form a film. However, in this case, the doctor blade method is preferably used. This is because film formation is easy. Examples of the solvent include methyl ethyl ketone (ME
K), toluene, isopropanol can be used.

As the copper foil 202, for example, an industrial electrolytic copper foil can be used. The copper foil is preferably roughened on one side or both sides. This is because the adhesive strength with the sheet-like material is enhanced. As a method of processing the copper foil into a wiring pattern, for example, a method using chemical etching can be used.

The adhesive 206 is not particularly limited as long as it can be used for fixing the capacitor 204, but for example, solder, a conductive resin composition, a thermosetting adhesive or the like can be used. In addition, the inductor placed on the module surface
When the 209, the chip component 210, and the external electrode 211 are mounted, it is sufficient that the components are fixed and electrical connection is possible, and for example, a method using solder or a conductive adhesive can be used.

The chip component 210 may be appropriately selected according to the necessity of circuit formation and is not particularly limited, but, for example, a resistor, a capacitor or an inductor can be used. Alternatively, a semiconductor package may be used. The external electrode 211 is not particularly limited as long as it is a terminal that can be electrically connected to another substrate or the like, and for example, a metal ball or a metal block can be used. Further, the outermost wiring pattern of the module may be used as an external electrode.

The method of forming the through hole to be the through hole 207 is not particularly limited, and for example, drilling or punching can be used. Also, the copper plating method for the through hole is
For example, electroless plating can be used. The plating thickness may be appropriately determined according to the wiring pattern thickness and the amount of current used.

The method of mounting the semiconductor 208 is not particularly limited, but flip chip mounting is preferable.
This is because the wiring length is shortened, which is advantageous for lowering resistance and speeding up, and because the mounting area is small, the module can be downsized. Flip-chip mounting methods include, for example, a method in which bumps prepared by a gold wire bonding method are provided on a semiconductor and connected to a wiring pattern with a conductive adhesive, a method in which the gold bumps are ultrasonically bonded to a wiring pattern, and solder bumps are used. Although a joining method by forming and heat melting can be used, an ultrasonic joining method through a gold bump or a joining method by a solder bump is particularly preferable. This is because these mounting methods have low connection resistance. Further, in each of the above flip-chip mounting methods, it is preferable that the gap between the semiconductor and the wiring pattern or the sheet-like material be resin-sealed. This is because the connection reliability is improved.

In the present embodiment, the capacitor is built in the sheet material and the inductor is mounted on the surface, but conversely, the inductor is built in the sheet material and the capacitor is mounted externally. It goes without saying that it is good.

(Embodiment 3) FIGS. 3A to 3C are cross-sectional views by process showing a method of manufacturing a component built-in module according to another embodiment of the present invention. As shown in FIG. 3A, a capacitor 302 is mounted on a copper foil 301 with an adhesive 303. After that, FIG.
As shown in (b), the sheet material 304 and the copper foil 301 are overlaid on the capacitor 302 and heated and pressed to embed and embed the capacitor 302 in the sheet material 304, and at the same time to apply a thermosetting resin. It is cured and integrated with the copper foil 301. After that, FIG.
As shown in (c), a through hole is formed so as to penetrate the electrode 306 of the capacitor 302, and copper plating is applied to form a through hole.
305 is formed. Then, as shown in FIG. 3 (d), the copper foil 30
1 is processed to form a wiring pattern 307, on which the semiconductor
308, chip component 310 and inductor 309, external electrode 311
To complete the module with built-in components.

(Embodiment 4) FIGS. 4A to 4C are cross-sectional views by process showing a method of manufacturing a component built-in module according to another embodiment of the present invention. As shown in FIG. 4A, the wiring pattern 402 formed on the release carrier 401 is prepared. Next, FIG.
As shown in (b), the inductor 403 is
Are mounted via the adhesive 404. Next, as shown in FIG. 4 (c), a sheet-like material 4 which is an electrical insulating material is placed on the inductor 402.
05 and a wiring pattern 402 with a release carrier 401 similar to that shown in FIG. 4 (a) in this order.
The inductor 403 is embedded in the sheet-like material 405 by being superposed so as to be in contact with 05, heated and pressed, and at the same time, the thermosetting resin is cured to be integrated with the wiring pattern. Then, as shown in FIG. 4 (d), the electrodes of the inductor 403 are
A through hole is formed so as to penetrate through 406, and copper plating is performed to form a through hole 407. After that, the release carrier 401 is peeled off to expose the wiring pattern on the module surface as shown in FIG. 4 (e), and the semiconductor 408, as shown in FIG. 4 (f),
The capacitor 409 and the external electrode 411 are mounted to complete the component built-in module. In addition, 410 is a chip component.

As the release carrier, for example, an organic film such as polyethylene or polyethylene terephthalate or a metal foil such as copper or aluminum can be used. As the method of forming the wiring pattern, for example, a method of processing a copper foil adhered on a release carrier with an adhesive or a method of forming a plating on the release carrier can be used.

(Embodiment 5) FIGS. 5A to 5C are cross-sectional views by process showing a method of manufacturing a component built-in module according to another embodiment of the present invention. As shown in FIG. 5 (a), the sheet 501 502 and the copper foil 503, which are electrically insulating materials, are superposed on each other from both sides of the coil 501, and heated and pressed, so that the coil 501 shown in FIG. 5 (b). Is embedded in the sheet-like material 502 and embedded therein, and at the same time, the thermosetting resin is cured to be integrated. After that, as shown in FIG. 5C, a through hole is formed so as to penetrate the electrode 505 of the inductor, and copper plating is performed to form the through hole 50.
Forming 4 Then, as shown in FIG. 5 (d), the copper foil 503
Is processed to form a wiring pattern 506, on which the semiconductor 5
The component built-in module is completed by mounting 07, the capacitor 508, and the external electrode 509. In addition, 510 is a chip component.

In the present embodiment, the coil 501
Is preferably a sheet-like coil composed of one-layer or two-layer flat-shaped windings from the viewpoint of reducing the height. Further, the sheet-shaped material 502 containing the above-mentioned inductor preferably contains a soft magnetic material in addition to the inorganic filler described in the above examples, and is particularly selected from the group consisting of iron, nickel, ferrite, permalloy and sendust. It is preferable to include at least one selected from the above. This is because the use of these fillers improves the magnetic permeability around the coil, reduces the leakage flux, and obtains a larger inductance.
For the same reason, it is preferable that the sheet-shaped material containing the inductor also contains the above-mentioned soft magnetic material in another embodiment.

Further, in FIG. 5C, a package part can be obtained by processing the copper foil 503 to form a wiring pattern and using it as an external electrode. According to this embodiment, It is possible to provide extraction electrodes at desired positions on the upper surface and the lower surface, and it is possible to manufacture a package component having low resistance, high design flexibility, and low profile.

(Embodiment 6) FIGS. 6A to 6C are cross-sectional views by process showing a method of manufacturing a component built-in module according to another embodiment of the present invention. As shown in FIG. 6 (a), a through hole 602 is formed in the sheet-shaped material 601, and the conductive resin composition 603 is formed in the through hole 60.
Fill 2 After that, as shown in FIG. 6B, both sides are sandwiched by copper foils 604 and heated and pressed to cure the thermosetting resin in the sheet 601 and the conductive resin composition 603, and at the same time the copper foils 604. To be integrated with. Then, as shown in FIG. 6C, the copper foil is processed to form a wiring pattern 605. Further, a sheet-like material and copper foil similar to those in FIG. 6 (a) are overlaid on both sides, heated and pressed, and further the copper foil is processed into a wiring pattern to form a multilayer wiring board as shown in FIG. 6 (d). Form. After that, as shown in FIG. 6E, the capacitor 606 is mounted on the wiring pattern via the conductive adhesive 607. Next, FIG.
As shown in (f), the sheet-shaped material 601 and the copper foil 604 are further stacked on the capacitor 606, and the capacitor 606 is embedded and embedded in the sheet-shaped material 601 by heating and pressurizing. The resin is hardened to be integrated with the copper foil 604, a through hole is further opened so as to penetrate the electrode 608 of the capacitor 606, and copper plating is performed to form a through hole 609. After that, as shown in FIG.
1. Mount the external electrode 612 to complete the component built-in module. 613 is a chip component.

As a method of forming the through hole 602 in the sheet-shaped material 601, a laser processing method, a punching processing method, or a punching processing method using a die can be used. Especially in the laser processing method, carbon dioxide gas laser and excimer laser can be used,
It is preferable in terms of processing speed. As the conductive resin composition 603, a material in which gold, silver, copper or an alloy powder thereof is used as a conductive material and which is mixed with a thermosetting resin can be used. As the conductive material, copper is particularly preferable because it has good conductivity and little migration.

(Embodiment 7) FIGS. 7A to 7C are cross-sectional views by process showing a method of manufacturing a component built-in module according to another embodiment of the present invention. As shown in FIG. 7 (a), a copper foil 702 is integrated with a sheet material 701 by the same manufacturing method as in FIG. 6, and a substrate having a built-in multilayer wiring pattern 703 connected by inner vias is manufactured. A capacitor 704 is mounted on the upper surface of the capacitor via a conductive adhesive 705. Next, as shown in FIG.
Sheet-shaped material 701 and copper foil 702 are further stacked on 04, heated and pressed to embed the capacitor 704 in the sheet-shaped material 701 and harden the thermosetting resin to be integrated with the copper foil. The foil is processed into the wiring pattern 703, and the semiconductor 706 is mounted thereon. 707 is a chip component. Next, as shown in FIG. 7C, the sheet 701 and the copper foil 702 are further stacked on the semiconductor 706 and heated and pressed so that the semiconductor 706 is embedded in the sheet 701 and a thermosetting resin. Is cured and integrated with copper foil, and
Wiring pattern 70 with electrodes 704 and semiconductor 706 mounted
A through hole is formed so as to pass through 3, and copper plating is performed to form a through hole 708. Then, as shown in FIG. 7D, the copper foil 702 is processed to form the wiring pattern 703 and the external electrodes.
709 is formed, and the inductor 710 is mounted thereon to complete the component built-in module.

Although the semiconductor 706 is incorporated after the capacitor 704 is incorporated in this embodiment, the order of mounting and incorporating can be appropriately determined according to the circuit design. Further, in addition to the present embodiment, it is possible to further incorporate the uppermost inductor in the same manner to incorporate all the components, which has a high resistance to external impacts and drops, and the module as a module. It is preferable because it is easy to handle.

(Embodiment 8) FIGS. 8A to 8C are cross-sectional views by process showing a method of manufacturing a package component according to another embodiment of the present invention. As shown in FIG. 8 (a), copper foil 802 is arranged on both sides of the sheet-shaped material 801, and the thermosetting resin is cured by heating and pressurizing the copper foil and the copper foil 802 is processed to process the copper foil 802. A wiring pattern 803 is formed, and a capacitor 804 is mounted on it by a conductive adhesive 805. Next, as shown in FIG. 8B, the sheet 801 and the copper foil 802 are superposed on the capacitor 804 and heated and pressed to form the capacitor 804 in the sheet 801.
It is embedded inside and embedded, and the thermosetting resin is hardened and integrated. Next, as shown in FIG. 8C, a through hole is opened so as to penetrate the electrode 806 of the capacitor 804 and the wiring pattern 803 connected to the electrode 806, and copper plating is performed to form a through hole 807. Next, as shown in FIG. 8D, the copper foil 802 is processed to form the external electrodes 808 to complete the package component.

According to this embodiment, it is possible to provide extraction electrodes at desired positions on the upper surface and the lower surface of the component, and it is possible to manufacture a package component having a low resistance and a high degree of design freedom.

(Embodiment 9) FIGS. 9A to 9C are cross-sectional views by process showing a method of manufacturing a component built-in module having an end face electrode according to another embodiment of the present invention. FIG. 9A shows a component built-in module manufactured by the same method as that shown in FIG. Here, 901 is a sheet-like object made of an electrical insulating material, 902
Is a wiring pattern, 903 is a capacitor, 904 is an inductor,
905 is a semiconductor, 906 is a chip component, 907 is a through hole, 9
08 is an inner via, and 909 is an external electrode. Next, FIG.
As shown in (b), by cutting substantially the central portion of the through hole 907, a component built-in module having the inner wall of the through hole as the end surface electrode 910 is completed.

According to the present embodiment, a plurality of component built-in modules are manufactured and cut at the through holes, so that a component built-in module having a large number of end face electrodes can be easily manufactured. Further, also in each of the above-mentioned embodiments, the end face electrodes can be formed by the same method.

In each of the above embodiments, the copper foil may be replaced with a wiring pattern formed on the release carrier as shown in FIG. 4 (a). In this case, the wiring is formed by a series of module manufacturing. It is preferable because it can be collectively performed in a separate process.

Further, in each of the above-mentioned embodiments, the capacitor is shown as having a shape in which the electrode is exposed to the outside of the capacitor and a through hole can be formed, but a through hole is formed so as to penetrate the wiring pattern on which the capacitor is mounted. However, in this case, even when it is difficult to form a through hole like a chip capacitor, it becomes possible to incorporate the through hole and connect to the external electrode with low resistance.

Further, in each of the above-mentioned embodiments, the through hole is formed so as to penetrate the component electrode or the wiring pattern on which the component is mounted. In this case, the through hole is defined by the component electrode and the wiring pattern. You only have to go through a part,
It is not always necessary that the electrodes and the wiring pattern exist all around the through hole.

[0095]

EFFECTS OF THE INVENTION According to the present invention, a plated through hole allows low resistance to handle a large current, and a through hole can be formed directly on a component electrode to achieve a connection with lower resistance. It is possible to obtain a component built-in module having components mounted therein. Further, according to the present invention,
Since the characteristics of the electrical insulating material can be selected by selecting an inorganic filler, the coefficient of thermal expansion in the plane direction is close to that of the wiring pattern, semiconductors and other parts, and it has excellent heat dissipation and excellent magnetic and dielectric characteristics. It is possible to realize a module having an extremely high-density mounting form. Further, according to the present invention, by using the through hole and the inner via together, a component built-in module having high density, low resistance, and large current capacity can be realized.

[Brief description of drawings]

FIG. 1 is a sectional view showing a component built-in module according to an embodiment of the present invention.

2A to 2D are cross-sectional views for each process showing a method of manufacturing a component built-in module according to an embodiment of the present invention.

FIG. 3 is a sectional view for each step showing a method for manufacturing a component built-in module according to another embodiment of the present invention.

FIG. 4 is a sectional view for each step showing a method for manufacturing a component built-in module according to another embodiment of the present invention.

5A to 5D are cross-sectional views for each process showing a method for manufacturing a component built-in module according to another embodiment of the present invention.

FIG. 6 is a cross-sectional view of steps showing a method of manufacturing a component built-in module according to another embodiment of the present invention.

FIG. 7 is a cross-sectional view of individual steps showing a method of manufacturing a component built-in module according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view for each step showing a method of manufacturing a package component according to another embodiment of the present invention.

FIG. 9 is a cross-sectional view of individual steps showing a method for manufacturing a component built-in module according to an embodiment of the present invention.

[Explanation of symbols]

101 electrical insulating material 102, 204, 302, 409, 508, 606, 704, 804, 903 capacitor 103, 209, 309, 403, 611, 710, 904 inductor 104, 208, 308, 408, 507, 610, 706, 905 Semiconductor 105, 210, 310, 410, 510, 613, 707, 906 Chip component 106, 908 Inner via 107, 207, 306, 407, 504, 609, 708, 807, 907 Through hole 108, 203, 307, 402 , 506, 605, 703, 803, 902 Wiring patterns 109, 211, 311, 411, 509, 612, 709, 808, 909 External electrodes 201, 304, 405, 502, 601, 701, 801, 901 Sheet-like material 202 , 301, 503, 604, 702, 802 Copper foil 205, 305, 406, 505, 608, 806 Electrode 206, 303, 404 Adhesive 401 Release carrier 501 Coil 602 Through hole 603 Conductive resin composition 607, 705, 805 Conductive adhesive 910 Edge electrode

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hiroyuki Ishitomi             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Yoshihisa Yamashita             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Hiroyuki Handa             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5E044 AC01 AC06                 5E082 AA01 AB01 AB03 BB10 BC33                       BC39 FF05 FG04 FG46 HH47                       MM13 MM22 PP03 PP06 PP07                 5E346 AA02 AA12 AA15 AA25 AA43                       AA60 BB01 BB16 BB20 CC02                       CC08 CC21 CC32 DD02 DD12                       EE02 EE06 FF07 FF18 FF42                       FF45 GG28 GG40 HH01 HH22                       HH25

Claims (44)

[Claims] 1. In a module in which at least a semiconductor, a capacitor and an inductor are electrically connected, at least one kind of the capacitor and the inductor is an electrical insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler. A through hole is formed in the module so as to penetrate at least one of the electrodes of the capacitor and / or the inductor which are built in, and the through hole is connected to an external electrode by a plated through hole. Module with built-in components. 2. The component built-in module according to claim 1, wherein the semiconductor is embedded in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler. 3. A semiconductor and / or a capacitor and / or an inductor embedded in the electrical insulation material,
The component according to claim 1 or 2, which is connected to a wiring pattern formed on the same surface as the semiconductor and / or the capacitor and / or the inductor, and the wiring pattern is connected to an external electrode by a plated through hole. Built-in module. 4. A module in which at least a semiconductor, a capacitor and an inductor are electrically connected, and at least one kind of the capacitor and the inductor is an electrical insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler. A module with a built-in component, characterized in that at least one electrode of the built-in capacitor and / or inductor is connected to an end surface electrode formed on an end surface of the module. 5. The component built-in module according to claim 4, wherein the semiconductor is embedded in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler. 6. A semiconductor and / or capacitor and / or inductor embedded in the electrical insulation material,
Connected to a wiring pattern formed on the same surface as the semiconductor and / or the capacitor and / or the inductor, and at least a part of the wiring pattern is connected to an end surface electrode formed on an end surface of the module. Item 4. The component built-in module according to Item 4 or 5. 7. The component built-in module according to claim 4, wherein the end face electrode is formed in a groove shape that penetrates in a vertical direction of the module. 8. The component built-in module according to claim 4, wherein the end surface electrode is formed by plating metal. 9. The component built-in module according to claim 1, further comprising a plurality of inner vias including a plurality of wiring patterns and made of a conductive resin composition for electrically connecting the wiring patterns. . 10. At least two types of components of the semiconductor, the capacitor, and the inductor are embedded in different surfaces in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler. Item 10. The component built-in module according to any one of items 1 to 9. 11. At least two types of components of the semiconductor, the capacitor, and the inductor are arranged so as to have overlapping portions when the shapes of the components are projected in a direction perpendicular to the main surface of the module. The component built-in module according to any one of claims 1 to 10. 12. The component built-in module according to claim 1, wherein the module has a DC-DC converter function. 13. A semiconductor device comprising a bare chip, which is flip-chip mounted on a wiring pattern.
13. The component built-in module according to any one of 12. 14. The component built-in module according to claim 1, wherein the capacitor is a film-shaped solid electrolytic capacitor. 15. The capacitor has a three-terminal structure having two anodes, or a four-terminal having two anodes and two cathodes.
The component built-in module according to any one of claims 1 to 14, which has a terminal structure. 16. The component built-in module according to claim 1, wherein the inductor comprises a sheet-shaped coil having one-layer or two-layer flat-plate windings. 17. The electrode according to claim 1, wherein at least one electrode of the capacitor and the inductor is made of a metal foil.
16. The component built-in module according to any one of 16. 18. The inorganic filler in the thermosetting resin composition.
Killer is Al₂O₃, SiO ₂, MgO, BeO, Si₃N_Four, SiC, AlN
And at least one selected from the group consisting of
The module with a built-in component according to claim 1.
Le. 19. The inorganic filler in the thermosetting resin composition containing the inductor is at least one selected from the group consisting of iron, nickel, ferrite, permalloy and sendust. The module with built-in components described in. 20. The thermal expansion coefficient of the electrical insulating material is 5 to
The component built-in module according to any one of claims 1 to 19, which has a temperature of 30 x 10 ^-6 / ° C. 21. The thermal conductivity of the electrical insulating material is 1 to 1
The component built-in module according to any one of claims 1 to 20, which has a power consumption of 0 W / m · K. 22. A capacitor or inductor is embedded in an electric insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler, and penetrates at least one electrode of the embedded capacitor or inductor. A package component, wherein a through hole is formed, and the through hole is connected to an external electrode by a plated through hole. 23. A capacitor or inductor is embedded in an electrical insulating material made of a mixture containing at least a thermosetting resin and an inorganic filler, and at least one electrode of the incorporated capacitor or inductor is formed on an end face of a module. Package parts connected to the end face electrodes. 24. The package component according to claim 22, wherein the capacitor is a film-shaped solid electrolytic capacitor. 25. The capacitor has a three-terminal structure having two anodes, or a four-terminal having two anodes and two cathodes.
The package component according to any one of claims 22 to 24, which has a terminal structure. 26. The package component according to any one of claims 22 to 25, wherein the inductor comprises a sheet-shaped coil having one-layer or two-layer flat-plate windings. 27. At least one electrode of the capacitor and the inductor comprises a metal foil.
28. The package component according to any one of to 26. 28. The inorganic filler in the thermosetting resin composition
Killer is Al₂O₃, SiO ₂, MgO, BeO, Si₃N_Four, SiC, AlN
And at least one selected from the group consisting of
The package part according to any one of claims 22 to 27
Goods. 29. The inorganic filler in the thermosetting resin composition containing the inductor is at least one selected from the group consisting of iron, nickel, ferrite, permalloy and sendust. Package parts described in Crab. 30. The thermal expansion coefficient of the electrical insulating material is 5 to
30. The package component according to any one of claims 22 to 29, which has a density of 30 × 10 ⁻⁶ / ° C. 31. The thermal conductivity of the electrical insulating material is 1 to 1
It is 0 W / m * K, The package component in any one of Claims 22-30. 32. A step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet, and at least one sheet and the copper foil are superposed. A step of integrating by heating and pressurizing together, a step of processing the copper foil to form a wiring pattern, a step of mounting a capacitor or an inductor on the wiring pattern, and a component mounting on the wiring pattern A step of further superimposing the sheet-shaped material and a copper foil on the surface and burying and embedding the capacitor or inductor in the sheet-shaped material; and by further heating and pressing the thermosetting resin of the sheet-shaped material. Curing step,
Positioning the electrode of the capacitor or the inductor so as to penetrate the electrode to form a through hole, forming a through hole by copper plating, and processing the copper foil to form an external electrode and a wiring pattern. A method of manufacturing a component built-in module comprising at least a step and a step of mounting at least a semiconductor and an inductor or a capacitor on the wiring pattern. 33. A step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet-like material; a step of mounting a capacitor or an inductor on a copper foil; A step of stacking the sheet-shaped material and a copper foil on the component mounting surface of the foil and burying the capacitor or the inductor in the sheet-shaped material to be embedded; and heating and pressing the sheet-shaped material to heat the sheet-shaped material. A step of curing a curable resin, a step of forming a through hole by positioning so as to penetrate the electrode of the capacitor or the inductor, a step of forming a through through hole by copper plating, and a step of processing the copper foil. And forming an external electrode and a wiring pattern by mounting the semiconductor pattern and at least a semiconductor and an inductor or a capacitor on the wiring pattern. A method of manufacturing a component built-in module, comprising at least a step. 34. A step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet, and a step of forming a wiring pattern on one surface of a release carrier. A step of mounting a capacitor or an inductor on a wiring pattern of the release carrier, and a step of mounting the sheet-shaped object and a copper foil on a component mounting surface of the release carrier to form the capacitor or the inductor in the sheet shape. A step of burying it in an object and incorporating it, a step of curing the thermosetting resin of the sheet-like material by further heating and pressurizing, a positioning so as to penetrate the electrode of the capacitor or the inductor, and a through hole. Forming step, forming through-holes by copper plating, and processing the copper foil to form external electrodes and wiring patterns And a step of mounting at least a semiconductor and an inductor or a capacitor on the wiring pattern. 35. A step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet-like material, and sandwiching a capacitor or an inductor with at least two of the sheet-like materials. And the step of hardening the thermosetting resin of the sheet-like material by further sandwiching and heating with copper foil and adhering the copper foil, and penetrating the electrode of the capacitor or the inductor. So as to form a through hole, a step of forming a through through hole by copper plating, a step of processing the copper foil to form an external electrode and a wiring pattern, and at least a semiconductor and a wiring pattern in the wiring pattern. Manufacture of a component built-in module including at least a step of mounting an inductor or a capacitor Method. 36. After the step of sandwiching a capacitor or inductor between at least two sheet-shaped materials and incorporating them, in addition to sandwiching them with copper foil, the sheet-shaped material and the copper foil are further stacked on one side or both sides. Heating together
36. The method for manufacturing a component built-in module according to claim 35, wherein the step of curing the thermosetting resin of the sheet-like material and adhering the copper foil by pressing is replaced. 37. A step of forming a through hole by positioning so as to penetrate an electrode of the capacitor or the inductor, a step of processing the copper foil to form a wiring pattern, and mounting a semiconductor on the wiring pattern. And the process of
A step of further stacking the sheet-shaped material and the copper foil on the mounting surface of the semiconductor in this order and burying the semiconductor in the sheet-shaped material, and further incorporating the semiconductor into the sheet-shaped material; 37. The method according to claim 32, wherein the step of curing the thermosetting resin is replaced with the step of forming a through hole by positioning so as to penetrate the electrode of the capacitor or the inductor and the wiring pattern connected to the semiconductor. A method of manufacturing a component built-in module according to any one of the above. 38. The step of positioning to penetrate the electrode of the capacitor or the inductor to form the through hole, the positioning to penetrate the wiring pattern on which the capacitor or the inductor is mounted to form the through hole. The method for manufacturing a component built-in module according to any one of claims 32 to 36, which is replaced with a step of forming. 39. In the step of processing a thermosetting resin composition in which at least the uncured thermosetting resin and an inorganic filler are mixed into a sheet-like material, a through hole is formed at a desired position of the sheet-like material. 33. The step of forming and the step of filling the through hole with a conductive resin composition are added.
39. A method of manufacturing a component built-in module according to any one of 38. 40. A step of cutting the component built-in module so as to pass through a central portion of the through-hole, and using the through-hole as an end face electrode.
39. A method of manufacturing a component built-in module according to any one of 39 to 39. 41. The step of mounting the semiconductor is a method of providing a gold bump on the semiconductor and connecting to the wiring pattern with a conductive adhesive, or a method of ultrasonically bonding to the wiring pattern. 40. A method of manufacturing a component built-in module according to any one of 40 to 40. 42. A step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet, and at least one sheet and the copper foil are superposed. A step of integrating by heating and pressurizing together, a step of processing the copper foil to form a wiring pattern, a step of mounting a capacitor or an inductor on the wiring pattern, and a component mounting on the wiring pattern A step of further stacking the sheet-shaped material and the copper foil on a surface and burying the capacitor or the inductor in the sheet-shaped material to be embedded therein; and further thermosetting the sheet-shaped material by heating and pressing. The step of hardening the resin, the step of forming a through hole by positioning so as to penetrate the electrode of the capacitor or the inductor, and the step of copper plating A method of manufacturing a package component, comprising at least a step of forming a through hole and a step of processing the copper foil to form an external electrode. 43. A step of processing a thermosetting resin composition obtained by mixing at least an uncured thermosetting resin and an inorganic filler into a sheet-like material, and sandwiching a capacitor or an inductor with at least two of the sheet-like materials. And the step of hardening the thermosetting resin of the sheet-like material by further sandwiching and heating with copper foil and adhering the copper foil, and penetrating the electrode of the capacitor or the inductor. So as to form a through hole by positioning as described above, a step of forming a through through hole by copper plating, and a step of processing the copper foil to form an external electrode. Production method. 44. The method of manufacturing a package component according to claim 42 or 43, including the step of cutting the package component so as to pass through a central portion of the through-hole, and using the through-hole as an end face electrode. .