JP2003124380A - Module with incorporated electronic component and production method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a satisfactory inner via hole connection in a module with incorporated electronic components. SOLUTION: In this module with an incorporated electronic component, fine holes are formed on the bottoms of blind via holes with respect to the inner via hole connection of the module with incorporated electronic components. Therefore, even in a via form of a high aspect ratio, the via hole can be satisfactorily filled with conductive past without air bubbles caught in. Further, by making a second insulating layer into a component group of the same type as a first insulating layer, a second wire can be easily connected and moreover, characteristics can be stabilized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module with a built-in electronic component in which passive components such as resistors, capacitors and inductors, or active components such as semiconductor elements are arranged inside an electrically insulating substrate and a method for manufacturing the same. Is.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter,
The demands for higher density of printed wiring boards and miniaturization of mounted parts are becoming stricter. For printed wiring boards,
By reducing the wiring rule, the density is increased in the direction parallel to the surface of the wiring board. Furthermore, by using the build-up method to stack wiring and forming via holes between arbitrary layers, it has become possible to increase the density in the direction perpendicular to the wiring board surface.

Due to high-density mounting, the number of chip parts is 1005
A size or a further downsized 0603 size is used. On the other hand, as a semiconductor package, an S having a multi-pin lead on the outer periphery of a conventional package.
OP (Small Outlet Package)
Surface mount devices such as QFP (Quad Flat Package) and the like were often used. recent years,
In order to further reduce the size of the semiconductor package, flip chip connection in which the active element surface of the IC chip is directed to the substrate side has been made into a CSP (Chip Size Package). Bare IC according to flip chip connection
Is normally directly mounted on the substrate through solder bumps or Au stud bumps without using leads.

According to the above flip-chip mounting, the IC
Since the area where the chips can be mounted is the surface of the substrate and the mounting density is limited by the substrate size, it is difficult to further dramatically improve the mounting density. Therefore, means for mounting the IC chip inside the substrate to increase the mounting density and downsize the electronic device are disclosed in Japanese Patent Application Laid-Open Nos. 5-212156 and 6-45763.

However, the above-mentioned Japanese Laid-Open Patent Publication No. 5-21125.
No. 6 semiconductor device, or JP-A-6-457.
According to the printed wiring board described in Japanese Patent Laid-Open No. 63, a cavity or the like has to be formed for mounting an IC, which requires a great number of steps and makes it difficult to make the printed wiring board thin.

As means for solving the above problems, Japanese Patent Laid-Open No.
A module with a built-in electronic component using a blind via is proposed in JP-A-01-77536.

A conventional method of manufacturing an electronic component built-in module will be described below with reference to the drawings.

As shown in FIG. 5A, a Cu wiring (not shown) printed on the base material 101 is plated with Au to form a Cu electrode 106 for connecting the base material 101 to the IC chip 103. The via hole connection land 108 is formed.
The diameter of the via hole connection land 108 is, for example, 0.2 to
0.5 mm. After that, the IC chip 103 is mounted on the Cu electrode 106.

Next, as shown in FIG. 5B, a high-purity thermosetting epoxy ink having a low internal stress is applied to the entire surface. After that, the resin is preliminarily cured by heating at 100 to 120 ° C. for 1 to 2 hours, and further, the resin is cured by heating at 150 ° C. for 30 minutes to 1 hour. This allows
An insulating resin layer 102 having a thickness of 30 to 100 μm is formed on the IC chip 103.

Next, as shown in FIG. 5C, a Cu foil 110a having a thickness of 12 μm is pressed onto the upper layer of the insulating resin layer 102 with an adhesive layer 109 interposed therebetween. Then, vacuum press forming is performed.

Next, as shown in FIG. 5D, the Cu foil 110a on the via-hole connection land 108 is etched to form a window 110b having a diameter of 0.1 to 0.4 mm. The diameter of the window 110b is set to be slightly smaller than the diameter of the via hole connection land 108.

Next, as shown in FIG. 5 (e), the window 110b
The insulating resin layer 10 is irradiated with laser light (not shown).
A via hole 115 is formed in 2.

Next, as shown in FIG. 5F, after filling the via hole 115 with a conductive paste, for example, 150
The conductive paste is cured by heating at about 170 ° C. for about 20 to 40 minutes. The filling of the conductive paste is performed, for example, by screen printing, a dispenser or the like, and after filling, the surface is smoothed by brushing or buffing. This allows
A conductive layer 116 is formed in the via hole 115.

Next, as shown in FIG. 5 (g), the Cu foil 11 is formed.
0a and the upper layer of the conductive layer 116 are plated with Cu to form the conductive layer 111a.

Next, as shown in FIG. 5H, the conductive layer 11
1a and Cu foil 110a are etched to form conductive layers 110 and 111.

[0016]

However, in the above conventional structure, since the via hole is a blind via, the conductive paste is completely filled up to the via hole connection land portion in the step of filling the via hole with the conductive paste. Is difficult. Further, in the above-mentioned conventional example, 30 to 1 is formed on the upper part of the IC chip by the insulating resin layer.
The thickness of the insulating resin layer is 400 μm or more when the thickness of the IC chip and the bump height for mounting the IC chip are taken into consideration because the thickness of the insulating resin layer is 400 μm or more. The formed via hole has an aspect ratio of 1 or more. At this time, for example, when processing the via hole with a diameter of 100 μm, it becomes a very elongated tubular via hole, so that it is extremely difficult to fill the conductive paste, and a space is formed between the via hole connection land and the conductive paste.
If the via hole shape is increased to 400 μm or more in order to reduce the aspect ratio, the wiring pattern density becomes low, and the effect of incorporating the IC chip is lost.

The present invention is intended to solve the above problems, and it is possible to surely fill a conductive paste in a blind via having a high aspect ratio and to perform good electrical connection. It is intended. Further, by using an inorganic filler-containing material for the insulating layer, it is possible to efficiently dissipate the heat generated during the operation of the electronic circuit through the insulating layer, and by using the insulating layer having a two-layer structure, Since the second wiring can be connected with the inorganic filler-containing material without using the adhesive layer, the first and second insulating layers can be formed with the inorganic filler-containing material, so that a stable electron can be obtained. It also has the purpose of obtaining circuit characteristics.

[0018]

In order to achieve the above-mentioned object, an electronic component built-in module of the present invention includes a first wiring, an electronic component connected to the first wiring, and the first wiring.
Wiring and an insulating layer covering the electronic component, a second wiring formed on the insulating layer, and a conductive resin cured product that electrically connects the first wiring and the second wiring. In the electronic component built-in module having an inner via hole filled with, a recess having a diameter equal to or smaller than the diameter of the inner via hole is formed in a portion of the first wiring connected to the inner via hole.

In the method of manufacturing an electronic component built-in module according to the present invention, a step of mounting the electronic component at a desired position on the first wiring formed on the carrier, the first wiring and the electronic component. Forming a first insulating layer covering
A step of processing a blind via at a desired position of the first insulating layer by laser irradiation, a step of filling the blind via with a conductive resin, and a step of forming a through hole in a separate step, and then conducting the through hole A second insulating layer filled with a conductive resin at a desired position on the first insulating layer, and forming a second wiring formed on a carrier with the second wiring on the second insulating side. A step of stacking so as to overlap at a desired position on a layer, a step of hot pressing the laminate, a step of peeling the carrier from the first wiring and the second wiring after the hot pressing, In the step of processing the blind via at a desired position of the first insulating layer by laser irradiation, it is said that a recess having a diameter equal to or smaller than the blind via is simultaneously processed in the first wiring board portion below the blind via. Than it is.

According to this method, after incorporating the electronic parts,
With respect to the via hole formed in the portion requiring electrical connection, the conductive paste can be surely filled in the via hole even when the via hole is reduced in diameter to realize high-density wiring.

By using an inorganic filler-containing material for the insulating layer, it is possible to efficiently dissipate the heat generated during the operation of the electronic circuit through the insulating layer, and to use the insulating layer of 2
With the layered structure, the second wiring can be connected with the inorganic filler-containing material without using a special adhesive layer, so that the first and second insulating layers are formed with the inorganic filler-containing material. Therefore, stable electronic circuit characteristics can be obtained.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention covers a first wiring, an electronic component connected to the first wiring, the first wiring and the electronic component. An insulating layer,
A module with a built-in electronic component, comprising: a second wiring formed on the insulating layer; and an inner via hole filled with a conductive paste that electrically connects the first wiring and the second wiring. And a recess having a diameter equal to or less than the diameter of the inner via hole is formed in a portion of the first wiring that is connected to the inner via hole. It is filled in the inner via hole, and has an effect of being able to make good electrical connection with the first wiring and the second wiring.

The invention according to claim 2 of the present invention is the electronic component built-in module according to claim 1, characterized in that the recess is a through hole. It has the function of being able to fill the inside of the via hole.

The invention according to claim 3 of the present invention is the electronic component according to claim 1, wherein the insulating layer has a two-layer structure of a first insulating layer and a second insulating layer. This is a built-in module, and the second insulating layer has an effect that the conductive paste in the first insulating layer and the inner via hole can be satisfactorily connected to the second wiring.

The invention according to claim 4 of the present invention is characterized in that the first insulating layer is a mixture containing 30% by weight to 95% by weight of an inorganic filler and a thermosetting resin. It is a module with built-in electronic components,
It is possible to satisfactorily dissipate heat generated during the operation of electronic circuits, and it is also possible to secure a good via shape because there is little thermal damage to the peripheral area of the processed hole because the heat dissipation is good even during blind via processing with a laser. It has the effect of being able to.

The invention according to claim 5 of the present invention is characterized in that the second insulating layer is a mixture containing 70% by weight to 95% by weight of an inorganic filler and a thermosetting resin. It is a module with built-in electronic components,
Since the second wiring can be connected with the same material system as that of the first insulating layer, it has an effect of stabilizing the electrical characteristics.

According to a sixth aspect of the present invention, the inner via hole formed in the first insulating layer is formed by blind via processing. This is a module, and since the inner via hole can be formed after the electronic component is mounted and covered with the first insulating layer, the inner via hole can be stably formed.

The invention according to claim 7 of the present invention is the electronic component according to claim 3, wherein the inner via hole formed in the second insulating layer is formed by through-via processing. It is a built-in module, and the second insulating layer is made of the same material as the first insulating layer.
This has the effect that it is possible to transfer the wiring.

The invention according to claim 8 of the present invention is the electronic component built-in module according to claim 6, wherein the blind via processing is performed by laser irradiation. It has an effect that it can be favorably processed at a desired position.

In the invention according to claim 9 of the present invention, the through-via processing is performed by any one of drilling, punching, and laser irradiation, and the electronic component built-in module according to claim 7. And has an effect that a good through via can be formed.

According to a tenth aspect of the present invention, the step of mounting an electronic component at a desired position on the first wiring formed on the carrier, and the first wiring and the electronic component are covered. A step of forming a first insulating layer, a step of processing a blind via at a desired position of the first insulating layer by laser irradiation, a step of filling the blind via with a conductive paste, and a separate step Forming a through hole in the above step and then laminating a second insulating layer having a conductive paste filled in the through hole at a desired position on the first insulating layer; and a second wiring formed on the carrier. Laminating the second wiring side so as to overlap with a desired position on the second insulating layer,
A method for manufacturing an electronic component built-in module, comprising: a step of hot-pressing the laminated body; and a step of peeling the carrier from the first wiring and the second wiring after the hot-pressing. After forming the hole, by laminating the second insulating layer having the conductive paste filled in the through hole and the second wiring at a desired position on the first insulating layer,
The second wiring can be arranged on the insulating layer, and the electrical connection can be performed well.

According to an eleventh aspect of the present invention, in the step of processing a blind via at a desired position of the first insulating layer by laser irradiation, the blind wiring via is formed on the first wiring portion below the blind via. 11. A recess having a diameter equal to or smaller than the diameter of the blind via is simultaneously processed.
This is a method for manufacturing the electronic component built-in module described above, and has an effect of being able to satisfactorily fill the conductive paste in the blind via.

According to a twelfth aspect of the present invention, the step of mounting an electronic component at a desired position on the first wiring formed on the carrier, and the first wiring and the electronic component are covered. A step of forming a first insulating layer, a step of peeling the first wiring from the carrier, a step of processing a blind via at a desired position of the first insulating layer by laser irradiation, and the blind A step of filling a conductive paste in the via and a step of forming a through hole in a separate step and then laminating a second insulating layer in which the conductive paste is filled in the through hole at a desired position on the first insulating layer. A step of stacking the second wiring formed on the carrier so that the second wiring side overlaps a desired position on the second insulating layer, and a step of hot pressing the stacked body. , From the second wiring after the heating press In the method for manufacturing a module with built-in electronic component, which comprises a step of peeling the carrier, a recess having a diameter equal to or smaller than that of the blind via is simultaneously formed in the first wiring portion below the blind via. This is a method for manufacturing a built-in module, and has an effect of being able to satisfactorily fill the conductive paste in the blind via.

According to a thirteenth aspect of the present invention, the step of mounting an electronic component at a desired position on the multilayer wiring board and the surface of the multilayer wiring board including the electronic component on which the electronic component is mounted are mounted. Forming a first insulating layer to cover;
A step of processing a blind via at a desired position of the insulating layer by laser irradiation, a step of filling a conductive paste into the blind via, and a step of forming a through hole in another step and then forming a conductive paste in the through hole. Stacking the filled second insulating layer at a desired position on the first insulating layer, and wiring the wiring formed on a carrier so that the wiring side overlaps a desired position on the second insulating layer. In the method for manufacturing an electronic component built-in module, comprising: a step of laminating the multilayer body, a step of hot pressing the laminated body, and a step of peeling the carrier from the wiring after the hot pressing. It is a method for manufacturing an electronic component built-in module, which is characterized by simultaneously processing a recess having a diameter equal to or smaller than that of the blind via in the plate portion. An effect that can be filled with a conductive paste favorable.

The invention according to claim 14 of the present invention is characterized in that the depression is a through hole.
The method for manufacturing the module with a built-in electronic component has an effect that the conductive paste can be filled in the blind via more favorably.

The embodiment of the present invention will be described below with reference to FIG.
4 to FIG.

(First Embodiment) FIG. 1 is a sectional view of an electronic component built-in module according to a first embodiment of the present invention.

Reference numeral 1 denotes a first wiring, and a bare chip IC 3 is mounted as an electronic component at a desired position on the first wiring 1. The IC 3 is electrically connected to the first wiring 1 via the bump 4, and is fixed by the underfill 5. Reference numeral 6 is a first insulating layer, which is formed so as to cover the first wiring 1 and the IC 3. Reference numeral 7 denotes an inner via hole that passes through the first insulating layer 6 and is connected to the first wiring 1.
A conductive paste 9 is filled in the inner via hole 7. Reference numeral 8 denotes a minute hole processed in the first wiring 1, which becomes an air escape hole when the conductive paste 9 is filled in the inner via hole 7 by the minute hole 8.
It can be filled well. 10 is the second insulating layer, 1
Reference numeral 1 is a second wiring, and 19 is a conductive paste. The second insulating layer 10 fixes the second wiring 11 and the first insulating layer 6, and the conductive pastes 9 and 19 form the first wiring 1. Second
The wiring 11 is electrically connected.

Next, a manufacturing method according to the first embodiment of the present invention will be described.

2 (a) to 2 (g) are sectional views showing the steps of manufacturing the electronic component built-in module according to the first embodiment of the present invention.

First, as shown in FIG. 2A, the first wiring 1 is formed on the carrier 2. First on carrier 2
As a method of manufacturing the wiring 1, a metal foil such as Cu or Al is used as the carrier 2, and the first wiring 1 is formed on the carrier 2 by Cu plating, or the entire surface of the carrier 2 is Cu plated. After forming the metal film by, the first wiring 1 may be formed by etching. As another method, the first wiring 1 may be formed by bonding a Cu foil on the carrier 2 and then etching the Cu foil. The film thickness of the first wiring 1 is preferably about 5 to 35 μm.

Next, as shown in FIG. 2B, the IC 3 is mounted as an electronic component at a desired position on the first wiring 1.
The IC 3 is electrically connected to the first wiring 1 via the bump 4, and is fixed at a desired position by the underfill 5. At this time, it is desirable that the thickness of the IC 3 is as thin as possible. For example, the IC 3 may be previously ground to a thickness of about 50 μm and then mounted on the first wiring 1. First
The IC 3 may be polished after being mounted on the wiring 1. In any case, since the height of the IC 3 from the first wiring 1 is about 10 to 50 μm for the bump, it is preferable to process the IC 3 to a total thickness of about 60 to 200 μm. However, it is possible to use the IC 3 without making it thin at all.

Next, as shown in FIG. 2C, a first insulating layer 6 is formed so as to cover the first wiring 1 and the IC 3. The first insulating layer 6 is composed of 30 to 95% by weight of an inorganic filler and a thermosetting resin. Regarding the characteristics required for the first insulating layer 6, the surface must be kept flat while completely covering the IC 3, and it is desired that the first insulating layer 6 has good fluidity. It is also desired to efficiently dissipate the heat generated from the IC3. Furthermore, for high frequency applications, low dielectric constant materials are desired. Therefore, the first insulating layer 6 can satisfy the above requirements by using a mixture of an inorganic filler and a thermosetting resin. Also, the first
As a method of forming the insulating layer 6, a method such as a printing method, a dispensing method, a pressing method, a laminating method or the like can be used. After covering the first wiring 1 and the IC 3, the first insulating layer 6 may be heated and completely cured, or may be in a temporarily cured state and not completely cured. However, it must be hardened to such an extent that the resin does not melt by the laser processing performed later. The film thickness of the first insulating layer 6 covers the upper surface of the IC 3 to a height of about 20 to 100 μm, and therefore can be about 150 to 200 μm when the IC3 is thinly polished.
If the IC3 is not polished, it is 400 to 500.
The film thickness is about μm. Further, as described above, it is important to flatten the surface of the first insulating layer 6.

Next, as shown in FIG. 2D, blind vias 100 to 4 which will later become inner via holes 7 are formed at predetermined positions on the first insulating layer 6 covered by laser processing.
It is processed with a dimension of 00 μm. It goes without saying that the smaller the size of the inner via hole 7, the higher the density of the wiring pattern can be made. At this time, it is important to machine also the minute hole 8 smaller than the bottom surface of the blind via in the first wiring 1 on the bottom surface of the blind via.
The minute holes 8 can be easily processed by adjusting the irradiation energy during laser processing. The minute holes 8 may be formed to have a recess in the first wiring 1, but the first wiring 1 may be penetrated in order to obtain a larger effect.

Next, as shown in FIG. 2E, the inner via hole 7 is filled with a conductive paste 9. As a method for filling the conductive paste 9, a printing method or a dispensing method can be used. When the conductive paste 9 is filled, the bubbles in the inner via holes 7 escape into the minute holes 8, so that the inner via holes 7 can be filled efficiently. Further, when the aspect ratio, which is the ratio of the opening diameter to the depth of the inner via hole 7, is usually high, the inner via hole 7 must be filled with the conductive paste 9 without fail.
It may happen that air bubbles are caught in the bottom surface of the conductive paste 9 and the connection between the conductive paste 9 and the first wiring 1 cannot be made. Therefore, the conductive paste 9 and the first wiring 1 can be satisfactorily electrically connected to each other. Further, as a method of filling the conductive paste 9, a vacuum printing machine can be used for more efficient filling.

Next, as shown in FIG. 2F, a through hole is formed in the second insulating layer 10 in another step (not shown), and the conductive paste 19 is filled in the through hole. The first insulating layer 6 is laminated at a desired position, and the second wiring 11 with the carrier 12 formed by the same method as the first wiring 1 is further laminated at a desired position. The second insulating layer 10 is 70 to 95% by weight
In the mixture of the inorganic filler and the thermosetting resin, the second thermosetting resin is in the B stage state before curing, after laminating each layer,
The second wiring 11 is formed by hot pressing to harden the thermosetting resin.
And the first insulating layer 6 are fixed, and the first wiring 1 and the second wiring 11 are electrically connected via the conductive pastes 9 and 19. Further, the second insulating layer 10 is 70 to 95% by weight of the inorganic filler and is distributed in a larger amount than the content of the inorganic filler with respect to the first insulating layer 6, but the second insulating layer 10 has the first filler. It is desirable that the fluidity of the insulating layer 6 is not required and that the fluidity of the conductive paste 19 is low when the second insulating layer 10 is cured so that the conductive paste 19 is not washed away.
Further, by making the second insulating layer 10 the same kind of component system as the first insulating layer 6, it is possible to stabilize the characteristics such as heat dissipation and dielectric constant.

Next, as shown in FIG.
The first insulating layer 6, the second insulating layer 10 and the conductive pastes 9 and 19 are cured by hot pressing at 15 MPa, 150 to 200 ° C. for about 1 to 2 hours, and then the carriers 2 and 1 are cured.
2 can be peeled off to form an electronic component built-in module.

The present embodiment has the following effects.

With respect to the inner via hole connection of the module with a built-in electronic component, by forming a minute hole at the bottom of the blind via hole, even if the via shape has a high aspect ratio, good conduction is achieved without trapping bubbles. It can be filled with a conductive paste. Further, by using the same type of component system as the first insulating layer for the second insulating layer, the second wiring can be easily connected and the characteristics can be stabilized.

(Second Embodiment) A second embodiment of the present invention will be described below. The same contents as in Embodiment 1 are assigned the same reference numerals and explanations thereof are omitted.

FIG. 3 is a sectional view of a manufacturing process of the electronic component built-in module according to the second embodiment of the present invention.

3A to 3C have the same contents as in the first embodiment.

Next, as shown in FIG. 3D, after forming the first insulating layer 6, the carrier 2 is peeled off.

Next, as shown in FIG. 3E, blind via processing is performed in the same manner as in Embodiment 1, and at the same time, minute holes 8 are formed.

Next, as shown in FIG. 3F, the conductive paste 9 is filled into the inner via holes 7. This time,
Due to the effect of the minute holes 8, the inner via hole 7 apparently changes from a blind via to a through via, so that the conductive paste 9 can be satisfactorily filled even in a via having a high aspect ratio without trapping bubbles. .

Next, as shown in FIGS. 3 (g) to 3 (h),
The electronic component built-in module can be obtained by stacking and hot pressing as in the first embodiment.

The present embodiment has the following effects.

As a basic effect, the same effect as that of the first embodiment can be obtained, and the carrier is separated from the first wiring before the laser via processing, so that the minute processing is performed at the same time when the blind via is formed. The hole can be a through hole, and therefore the blind via becomes an apparent through via, so that the conductive paste can be filled even better.

(Third Embodiment) The third embodiment of the present invention will be described below. The same contents as those in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted.

FIG. 4 is a sectional view of a manufacturing process of the electronic component built-in module according to the third embodiment of the present invention.

FIG. 4A is a sectional view of the multilayer wiring board.

FIGS. 4 (b) to 4 (g) shown below show that the electronic component built-in module can be formed by the same steps as those in the first and second embodiments even if a multilayer wiring board is used. .

The present embodiment has the following effects.

As a basic effect, the same effect as that of the first embodiment can be obtained, and an electronic component built-in module can be formed by using a multilayer wiring board.

[0065]

As described above, according to the present invention, a via hole having a high aspect ratio is formed by forming a minute hole at the bottom of a blind via hole in connection with an inner via hole of an electronic component built-in module. However, the conductive paste can be satisfactorily filled without trapping air bubbles. Further, by using the same type of component system as the first insulating layer for the second insulating layer, the second wiring can be easily connected and the characteristics can be stabilized.

[Brief description of drawings]

FIG. 1 is a sectional view of an electronic component built-in module according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a manufacturing process of the electronic component built-in module according to the first embodiment of the present invention.

FIG. 3 is a sectional view of a manufacturing process of the electronic component built-in module according to the second embodiment of the present invention.

FIG. 4 is a sectional view of the manufacturing process of the electronic component built-in module according to the third embodiment of the present invention.

FIG. 5 is a cross-sectional view of a manufacturing process of a conventional electronic component built-in module.

[Explanation of symbols]

1st wiring 2 career 3 IC 4 bumps 5 Underfill 6 First insulating layer 7 Inner beer hall 8 micro holes 9 Conductive paste 10 Second insulating layer 11 Second wiring 12 career 19 Conductive paste 21 First wiring 22 Multilayer wiring board 23 Conductive paste 101 substrate 102 Insulating resin layer 103 IC chip 106 Cu electrode 108 Beer hole connection land 109 Adhesive layer 110 conductive layer 110a Cu foil 110b window 111 conductive layer 111a conductive layer 115 beer hall 116 conductive layer

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H05K 3/46 Q X H01L 23/12 Q (72) Inventor Seiichi Nakatani Kadoma City, Osaka Kadoma 1006 Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E317 AA24 BB01 BB12 CC22 CC25 CD32 CD34 GG11 5E343 AA02 AA07 AA12 AA39 BB03 BB24 BB28 BB66 DD56 DD63 ER52 CC33 A02 CC03 CC02 CC33 CC02 CD33 EE06 EE08 FF18 FF45 GG15 GG28 GG40 HH07

Claims (14)

[Claims] 1. A first wiring, an electronic component connected to the first wiring, an insulating layer covering the first wiring and the electronic component, and a second portion formed on the insulating layer. And an inner via hole filled with a conductive paste for electrically connecting the first wiring and the second wiring, wherein the inner part of the first wiring is provided. A module with a built-in electronic component, wherein a recess having a diameter equal to or smaller than the diameter of the inner via hole is formed in a portion connected to the via hole. 2. The electronic component built-in module according to claim 1, wherein the recess is a through hole. 3. The electronic component built-in module according to claim 1, wherein the insulating layer has a two-layer structure of a first insulating layer and a second insulating layer. 4. The electronic component built-in module according to claim 3, wherein the first insulating layer is a mixture containing 30% by weight to 95% by weight of an inorganic filler and a thermosetting resin. 5. The electronic component built-in module according to claim 3, wherein the second insulating layer is a mixture containing 70% by weight to 95% by weight of an inorganic filler and a thermosetting resin. 6. The electronic component built-in module according to claim 3, wherein the inner via hole formed in the first insulating layer is formed by blind via processing. 7. The electronic component built-in module according to claim 3, wherein the inner via hole formed in the second insulating layer is formed by through via processing. 8. The electronic component built-in module according to claim 6, wherein the blind via processing is performed by laser irradiation. 9. The electronic component built-in module according to claim 7, wherein the through via processing is performed by any one of drill processing, punching processing, and laser irradiation. 10. A step of mounting an electronic component at a desired position on a first wiring formed on a carrier, and a step of forming a first insulating layer covering the first wiring and the electronic component. And a step of processing a blind via at a desired position of the first insulating layer by laser irradiation, a step of filling the blind via with a conductive paste, and a step of forming a through hole in another step and then a through hole Second with conductive paste filled in
The step of laminating the second insulating layer at a desired position on the first insulating layer and the second wiring formed on the carrier by the second wiring.
Laminating so that the wiring side thereof overlaps a desired position on the second insulating layer, a step of hot pressing the laminated body, and a step of hot pressing the laminated body from the first wiring and the second wiring. A method of manufacturing a module with a built-in electronic component, comprising the step of peeling a carrier. 11. In the step of processing a blind via at a desired position of the first insulating layer by laser irradiation,
11. The method for manufacturing an electronic component built-in module according to claim 10, wherein a recess having a diameter equal to or smaller than the blind via is simultaneously formed in the first wiring portion below the blind via. 12. A step of mounting an electronic component at a desired position on a first wiring formed on a carrier, and a step of forming a first insulating layer covering the first wiring and the electronic component. And a step of peeling the first wiring from the carrier, a step of processing a blind via at a desired position of the first insulating layer by laser irradiation, and a step of filling the blind via with a conductive paste. And a second step of forming a through hole in a separate step and then filling the through hole with a conductive paste.
The step of laminating the second insulating layer at a desired position on the first insulating layer and the second wiring formed on the carrier by the second wiring.
Laminating so that the wiring side thereof overlaps a desired position on the second insulating layer, a step of hot pressing the laminated body, and a step of peeling the carrier from the second wiring after the hot pressing. A method of manufacturing a module with a built-in electronic component, comprising:
A method for manufacturing an electronic component built-in module, wherein a recess having a diameter equal to or smaller than that of the blind via is simultaneously processed in the wiring part. 13. A step of mounting an electronic component at a desired position on a multilayer wiring board, and forming a first insulating layer covering a surface of the multilayer wiring board including the electronic component on which the electronic component is mounted. A step, a step of processing a blind via at a desired position of the first insulating layer by laser irradiation, a step of filling a conductive paste into the blind via, and a through hole after forming a through hole in another step. Stacking a second insulating layer filled with a conductive paste in a desired position on the first insulating layer, and wiring formed on a carrier with the wiring side on the second insulating layer. A step of stacking so as to overlap at a desired position, a step of hot-pressing the stacked body,
In the method for manufacturing an electronic component built-in module, which comprises a step of peeling the carrier from the wiring after the hot pressing, simultaneously processing a recess having a diameter equal to or smaller than the blind via in the multilayer wiring board portion below the blind via. And a method of manufacturing a module with a built-in electronic component. 14. The method for manufacturing an electronic component built-in module according to claim 11, wherein the recess is a through hole.