JP2003127399A - Ink jet recording head and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an ink jet recording head by which a movable member is formed in a nozzle channel between an ink inlet and an outlet to thereby provide a high-density, high-accuracy, and high- reliability ink recording head which can improve a frequency response while maintaining proper discharge performance, and to provide the ink recoding head. SOLUTION: The method for manufacturing the ink jet recording head utilizing ink bubbling by heating of a heating resistor to thereby eject ink includes the steps of: preparing a substrate provided with the resistor; applying such first resin on the substrate as to provide a first mold shape for forming the nozzle channel and movable member; forming the first mold shape using the first resin; applying, on the substrate, second resin over the first mold shape for forming the nozzle channel and the movable member; and removing the first mold shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head manufacturing method and an ink jet recording head for ejecting liquid from an orifice (ejection port) to form droplets.

[0002]

2. Description of the Related Art An ink jet recording head of this type in which a liquid is ejected from an orifice to form droplets is disclosed in, for example, Japanese Patent Laid-Open No. 54-51837, wherein an ink jet recording method applies thermal energy to the liquid. Thus, it has a feature different from other ink jet recording methods in that the driving force for droplet ejection is obtained.

That is, in the recording method disclosed in the above-mentioned publication, the liquid which has been subjected to the action of thermal energy is overheated to generate bubbles, and the action force based on the generation of the bubbles causes an orifice at the tip of the recording head portion. A feature is that droplets are formed and the droplets adhere to the recording member to record information.

A recording head applied to this recording method is an orifice which is generally provided for ejecting a liquid, and a portion which is in communication with this orifice and which has thermal energy for ejecting a droplet to act on the liquid. In order to store heat with a liquid discharge part having a liquid flow path having a heat acting part as a part, and a heat generating resistance layer as a heat converter which is means for generating heat energy and an upper protective layer for protecting it from ink Of the lower layer.

[0005]

In the ink jet recording head which obtains the driving force for droplet ejection by applying the above thermal energy to the liquid, the performance required for the ink jet recording head is to improve the printing speed. There is an improvement in frequency characteristics. In order to improve this frequency characteristic, it is necessary to improve the refill performance of the ink after ejecting the droplet. In order to improve the ink refill performance, it is necessary to reduce the flow resistance from the ink supply port to the ejection port.

However, when the flow resistance is reduced, the bubbling pressure escapes to the ink supply port side, the ejection speed is lowered and the stability is lost, the ejection performance is deteriorated, and the printing is deteriorated. Therefore, it is very difficult to maintain the ejection performance and improve the frequency characteristic.

Further, in order to meet the market demand for high image quality in recent years, in order to achieve a printed matter with high resolution and small droplets, an ink jet print head is
It is necessary that the droplets are arranged at a high density and that minute droplets are ejected from the ejection port.

On the other hand, it has been proposed to improve the frequency characteristic while maintaining the ejection performance by providing a movable member, which is a so-called fluid diode, in the nozzle channel between the ink supply port and the ejection port. However, in such a conventional inkjet recording head, the movable member may be peeled off or destroyed.

Therefore, the present invention solves the above problems and forms a movable member in a nozzle flow path between an ink supply port and an ejection port to maintain ejection performance and improve frequency characteristics. An object of the present invention is to provide a method for producing an inkjet recording head having high density, high accuracy, and high reliability, and an inkjet recording head.

[0010]

In order to solve the above problems, the present invention provides a method for producing an ink jet recording head and an ink jet recording head having the following constitutions (1) to (12). is there. (1) A heat generating resistor, an ink discharge port provided corresponding to the heat generating resistor, and a nozzle flow path communicating with the ink discharge port, and the heat generating resistance in the nozzle flow path. Body and
A movable member is formed between the ink supply port for supplying ink into the nozzle channel, and the bubbles generated in the ink in the nozzle channel by the heat generation of the heating resistor are used. In a method for producing an ink jet recording head that ejects ink from the ink ejection port, a step of preparing a substrate provided with the heating resistor, and forming the nozzle channel and the movable member on the substrate A step of applying a first resin as a first mold material, a step of forming the first mold material with the first resin, and a nozzle flow on the substrate so as to cover the first mold material. A method for producing an inkjet recording head, comprising: a step of applying a second resin for forming a path and the movable member; and a step of removing the first mold material. (2) The first resin is a photoresist, and in the step of forming the first mold material, a mask pattern having a width equal to or less than a resolution limit of the photoresist is used to form the first mold material The method for producing an ink jet recording head according to (1) above, which includes a step of forming a portion for forming a movable member. (3) Prior to the step of applying the first resin, the method further includes the step of applying a third resin, which serves as a second mold material for forming the nozzle channel, on the substrate. The first
Item (1) is characterized in that the step of applying the resin is a step of applying the first resin on the substrate so as to cover the second mold material with the first resin. Method of making inkjet recording head. (4) Before applying the first resin on the substrate,
The method for producing an inkjet recording head according to (1) above, further comprising the step of forming a projecting barrier at a position corresponding to between the movable member and the supply port on the substrate. (5) In an inkjet recording head that ejects ink from an ink ejection port by utilizing bubbles generated in ink in a nozzle flow path by heat generation of a heating resistor, a substrate provided with the heating resistor, and the substrate. The nozzle flow path provided above, and movable in the nozzle flow path between the heating resistor and an ink supply port for supplying ink into the nozzle flow path. A member is formed, and the movable member has a fulcrum on a wall of the nozzle channel facing the substrate and has a free end on the substrate side, and is integrally formed with the wall facing the substrate. Inkjet recording head characterized by being provided. (6) The ink jet recording head according to the above (5), wherein the wall and the movable member are made of resin. (7) A limiter is provided between the movable member and the ink supply port in the nozzle flow path to limit the displacement of the movable member toward the ink supply port. ) Inkjet recording head as described in 1). (8) The inkjet recording head according to the above (5), wherein the limiting portion is a protrusion-shaped barrier provided on the substrate. (9) The inkjet recording head according to the above (5), wherein the limiting portion is a part of a member forming a side wall in the nozzle flow path. (10) The heating resistor includes a heating resistor, an ink ejection port provided corresponding to the heating resistor, and a nozzle flow path communicating with the ink ejection port. A movable member is formed between the body and an ink supply port for supplying ink into the nozzle channel, and bubbles generated in the ink in the nozzle channel due to heat generation of the heating resistor. In the ink jet recording head that ejects ink from the ink ejection port by using the movable member, the movable member is arranged in a direction perpendicular to a surface of the substrate having the heating resistor on the nozzle channel side, and An inkjet recording head having a fulcrum of the movable member on a surface of the nozzle channel facing the substrate, and a free end of the movable member on a substrate side of the nozzle channel. . (11) The above-mentioned (10), characterized in that a limiting portion is provided between the movable member and the ink supply port in the nozzle flow path for limiting the displacement of the movable member toward the ink supply port. ) Inkjet recording head as described in 1). (12) The ink jet recording head according to (11), wherein the movable member has a larger displacement amount toward the ink ejection port side than a displacement amount toward the ink supply port side.

[0011]

According to the method of manufacturing an ink jet recording head to which the above-mentioned structure is applied, since the movable member can form a mold at the time of patterning the nozzle mold material, the movable member and the nozzle channel can be densely formed by photolithography. The ink jet recording head can be formed with high accuracy and high density and high accuracy can be produced. Further, as a method of forming the movable member, a mask pattern having a width equal to or less than the resolution limit of the first resin is used to form the first mold member,
By forming a portion for forming the movable member and forming the movable member with a resin to be applied later on the portion, it is possible to form the nozzle flow path and the mold material of the movable member forming portion with the same mask. Become. Therefore, the nozzle flow path and the movable member can be formed with the mask forming accuracy. Further, one patterning step can be omitted, and the cost can be reduced. Further, according to the inkjet recording head to which the above configuration is applied, the movable member can be formed of the same material as the material forming the ink flow path, and since the movable member and the ink flow path are integrally formed, It is possible to provide an inkjet head having high reliability, in which peeling or breakage of the movable member is less likely to occur as compared with the method of attaching the member as a separate component.

[0012]

EXAMPLES Examples of the present invention will be described below.
22 shows a schematic perspective view of the ink jet recording head in the embodiment of the present invention. Heating resistor 3
A member 12 forming an ink flow path and a discharge port 7 are formed on the substrate 1 having the ink supply port 5. In addition,
1 to 5 (Embodiment 1), FIGS. 6 to 9 (Embodiment 2), and FIGS. 12 to 14 (Embodiment 3) for explaining a method for producing an ink jet recording head in each embodiment of the present invention. The cross-sectional views shown in FIGS. 15 to 17 (Example 4) correspond to the cross-sectional view taken along the line AA ′ in FIG.

[Embodiment 1] A method of manufacturing an ink jet recording head in Embodiment 1 of the present invention will be described with reference to FIGS. First, the heat storage layer 1 is formed on the silicon substrate 101.
02 to form a 25 μm square heater (heating resistor) 10
3 are arranged at 600 dpi, and the protective layer 104 is formed thereon (FIGS. 1A and 1B). Next, a first mold resist 108 is applied in a thickness of 3 μm (FIG. 1C and FIG. 1).
(D)). Next, the first type resist 108 is exposed in the shape of the nozzle flow path and patterned by development (FIG. 2).
(A) and FIG.2 (b)).

Next, a second resist 109 having a thickness of 12 μm is applied on the patterned layer (FIGS. 2C and 2D). Next, the second mold resist 109 is formed on the nozzle flow path shape and the movable member shape 111 (5 μm × 25 μm).
Then, patterning is performed by exposure and development (FIGS. 3 (a) and 3 (b)). Next, a photosensitive epoxy material 112 for forming the nozzle flow path, the discharge port, and the movable member is applied (FIGS. 3C and 3D).

Next, the ejection port 107 is formed by patterning into a shape having a diameter of 18 μm by exposure and development (FIGS. 4A and 4B). Next, the ink supply port 105 is formed from the back surface of the substrate by the dry etching method (FIGS. 4C and 4D).

Finally, the resist used as the mold material is removed by using a stripping solution, and the nozzle 1 having the movable member 110 is formed.
A head chip with 06 is completed (FIGS. 5 (a) and 5 (b)). The movable member thus formed in the nozzle channel has a fulcrum on the wall surface of the nozzle channel facing the substrate surface on the side where the heating resistor is provided, and has a free end on the substrate surface side. . Then, an ink jet recording head is completed by electrically mounting a tube for supplying ink and electricity for supplying heat to the heater.

The head thus completed has high frequency response and good ejection performance. Therefore, good printing can be performed at high speed. Further, since the patterning for forming the movable member is the photolithography method, the movable member can be formed with high accuracy, and the movable member can be arranged with high accuracy with respect to the heater, the nozzle, and the ejection port. . Therefore, it is possible to sufficiently cope with the future trend toward smaller droplets and higher densities.

Further, since it can be formed integrally with the epoxy material for forming the nozzle and the discharge port, peeling damage or the like is unlikely to occur during long-term use, and a solute from the epoxy material is selected by selecting an epoxy material having ink resistance. And swelling does not occur. Therefore, a highly reliable head can be provided.

[Embodiment 2] A method for manufacturing an ink jet recording head in Embodiment 2 of the present invention will be described with reference to FIGS. First, a substrate 201 with a heater 203 in which heaters of 25 μm square are arranged at 600 dpi is prepared in the same manner as in Example 1 (FIGS. 6A and 6B).

Next, a photoresist 208 serving as a mold material is applied to a thickness of 20 μm (FIGS. 6 (c) and 6 (d)). Next, a pattern having a nozzle flow path shape and a movable member shape (2 μm × 25 μm) mask pattern as shown in FIG. 10 is used for exposure and development to form a pattern. Since the photoresist 208 used in this embodiment has a resolution of 4 μm at a thickness of 20 μm, the width W of the portion of the mask pattern corresponding to the thickness of the movable member is 2 or less than the resolution limit.
Patterning was performed using a mask having a thickness of μm.

When the mask is formed with the resolution below the limit, the resist is patterned halfway as shown in FIGS. 7 (a) and 7 (b). Therefore, since the pattern does not reach the substrate, it can function as a mold member for a movable member that is movable. Next, the nozzle channel 20
6, a discharge port 207, and a photosensitive epoxy for forming the movable member 210 are applied (FIGS. 7C and 7C).
(D)). Next, the discharge port is exposed and developed to have a diameter of 18
It is formed by patterning in the shape of μm (FIG. 8).
(A) and FIG.8 (b)).

Next, the ink supply port 205 is formed from the back surface of the substrate by the dry etching method (FIGS. 8C and 8).
(D)). Finally, the resist used as the mold material is removed using a stripping solution to complete the substrate with nozzles (FIG. 9).
(A) and FIG.9 (b)). Then, an ink jet recording head is completed by connecting a tube (not shown) for supplying ink and an electric wiring board (not shown) for supplying electricity for heating the heater 203. The head thus completed has high frequency response and good ejection performance. Therefore, good printing can be performed at high speed.

In addition to the effects of the first embodiment, one step of coating, exposing and developing the mold resist can be omitted, so that the cost can be reduced. Moreover, since the nozzle flow path 206 and the movable member 210 can be formed by the same mask, the alignment accuracy can be further improved. Further, the movable member 210 thus formed in the nozzle flow passage 206 is formed integrally with the wall forming the nozzle flow passage 206 as in the case of the first embodiment, and the fulcrum of the movable member 210 is formed. Side thickness t ₁
Is thicker than the thickness t ₂ on the free end side of the movable member, so that peeling breakage is less likely to occur. Because of this
A more reliable ink jet recording head can be provided.

Further, as shown in FIG. 11, the movable member 21
The nozzle pattern is formed such that a part of the nozzle flow path 206 between the nozzle 0 and the supply port 205 has a narrower width than the width of the movable member 210, and the nozzle flow path is formed. By making it possible to limit displacement to the supply port side, it is possible to further suppress the bubbling pressure from escaping to the supply port side, and manufacture a head with further improved ejection performance without increasing the number of manufacturing processes. be able to.

[Embodiment 3] Another example of a method for producing an ink jet recording head (ink jet print head) in Embodiment 3 of the present invention will be described with reference to FIGS. First, as shown in FIG.
A plurality of heaters 3 are formed on the i-chip by patterning or the like.
03 and these heaters 303 are provided with a predetermined wiring (not shown) for applying a voltage to the element substrate 30.
1 is formed. Next, as shown in FIG. 12B, the movable member 310 is attached to the supply port 3 on the element substrate 301.
05-shaped barrier 31 for limiting the displacement
In order to form 3 ', a transparent negative resin layer 313 having the same composition as the orifice substrate 312 is applied by about 5.0 μm.

After that, as shown in FIG.
A pattern (projection-like barrier) 313 ′ having a projection shape is formed by using light. Next, FIG. 12D and FIG.
As shown in FIG. 2E, a lower resin layer 308 and an upper resin layer 309 are successively applied on the substrate 301 by spin coating. The lower resin layer 308 and the upper resin layer 309 are UV light having a wavelength of 330 nm or less.
A resin that is soluble by irradiating eep-UV light (hereinafter, referred to as DUV light) is used because the bond in the molecule is broken.

Further, as the lower resin layer 308, by using a heat-crosslinking type resin material by a dehydration condensation reaction, the upper resin layer 3
It is prevented that the resin layers of the lower resin layer 308 and the upper resin layer 309 are mutually melted when 09 is applied by the spin coating method. As the lower resin layer 308, for example, methyl methacrylate (MMA) and methacrylic acid (MA
A solution obtained by dissolving a binary copolymer (P (MMA-MAA) = 90: 10) polymerized by radical polymerization of A) in a cyclohexanone solvent was used.

As the upper resin layer 309, for example, a liquid obtained by dissolving polymethylisopropenyl ketone (PMIPK) in a cyclohexanone solvent was used. The binary copolymer (P (MMA-MAA)) used as the lower resin layer is heated at 180 to 200 ° C. for 30 minutes to 2 hours in the dehydration condensation reaction, so that the dehydration condensation reaction causes stronger crosslinking. A film can be formed. Although this crosslinked film is of a solvent insoluble type, when it is irradiated with an electron beam such as DUV light, a decomposition reaction occurs, the molecular weight is reduced, and only the portion irradiated with the electron beam becomes soluble in the solvent. Become.

After that, as shown in FIG.
By using an exposure device that irradiates V light and mounting a filter that blocks DUV light having a wavelength of less than 260 nm on the exposure device, a wavelength selection means that transmits only 260 nm or more is used, and a wavelength of around 260 to 330 nm is used. Nea
By irradiating r-UV light (hereinafter referred to as NUV light) to expose and develop the upper resin layer 309, the desired nozzle pattern 30 is formed by the upper resin layer 309.
To form 9 '. When forming the nozzle pattern 309 ′ by the upper resin layer 309, the upper resin layer 309 and the lower resin layer 30
8 has a sensitivity ratio of about 40: 1 or more with respect to NUV light having a wavelength of about 260 to 330 nm, and therefore the lower resin layer 3
08 is not exposed to light, and the lower resin layer 309: P (MM
A-MAA) is not decomposed. Also, the lower resin layer 3
Since 08 is a thermally crosslinked film, the upper resin layer is not dissolved in the developing solution at the time of development.

After that, as shown in FIG. 13B, the lower resin layer 308 is exposed and developed by irradiating the above-mentioned exposure device with DUV light having a wavelength of 210 to 330 nm, so that the lower resin layer 308 has a desired shape. Nozzle pattern 30
Forming 8 '. P (MMA used for lower resin layer 308
The -MAA) material has a high resolving power, and even if the material has a thickness of about 5 to 20 m, it is possible to form a trench structure having a sidewall inclination angle of about 0 to 5 °. After that, nozzle patterns 308 ′ and 309 ′ are formed, and the DUV light destroys the cross-linking bond in the molecule to dissolve the upper resin layer 309 and the lower resin layer 308, as shown in FIG. 13 (c). And a transparent coating resin layer 312 that becomes an orifice substrate.
Apply.

Thereafter, as shown in FIG. 13D, the coating resin layer 312 is irradiated with UV light by an exposure device,
The orifice substrate is formed by exposing, developing, and removing the portion corresponding to the ejection port 307. The side wall of the discharge port formed on the orifice substrate has an inclination of 0 ° with respect to a plane orthogonal to the main surface of the element substrate.
It is desirable to form it in the vicinity. Further, when it is about 0 to 10 °, no major problem occurs in the droplet ejection characteristics.

Thereafter, as shown in FIG. 14A, an organic resin film 314 is applied to protect the orifice plate surface side during chemical etching. Then, as shown in FIG. 14B, a chemical etching process or the like is performed on the back surface of the element substrate 301 to remove the element substrate 3
The supply port 305 is formed at 01. Examples of the chemical etching treatment include a strong alkaline solution (KOH, NaO).
H, TMAH) is applied.

Thereafter, as shown in FIG. 14C, DUV light having a wavelength of 330 nm or less is irradiated from the main surface side of the element substrate 301 through the coating resin layer 312 to irradiate it.
The upper resin layer 309 and the lower resin layer 308, which are nozzle mold materials, located between the element substrate 301 and the orifice substrate 312 are eluted.

Therefore, the discharge port 307 and the supply port 3
05 and a supply path (nozzle flow path) 306 that connects them to each other
The movable member 3 between the heater 303 and the supply port 305
10 is formed, and a chip including a nozzle channel 306 in which a protruding barrier that limits the displacement of the movable member toward the supply port is formed between the movable member 310 and the supply port 305 is obtained. A recording head can be obtained by electrically connecting this chip and a wiring substrate (not shown) for driving the heater 303.

According to the above-described method of manufacturing the recording head, the upper resin layer 309 and the lower resin layer 308, which can be dissolved by breaking the crosslinking bond in the molecule by the DUV light, are formed in the thickness direction of the element substrate. Further, by adopting a hierarchical structure, it is possible to provide a control unit formed in a stepped shape with three or more steps in the nozzle. For example, a multi-stage nozzle structure can be formed on the upper layer side of the upper resin layer by using a resin material sensitive to light having a wavelength of 400 nm or more.

[Embodiment 4] Another example of a method for manufacturing an ink jet print head according to the present invention will be described below with reference to FIGS.
Details will be described with reference to FIG. First, as shown in FIG. 15A, a substrate 401 on which a plurality of electrothermal conversion elements (heaters) 403 and necessary wirings (not shown) for driving them are provided on a Si chip by patterning or the like.
To prepare.

Then, as shown in FIGS. 15 (b) and 15 (c), the deep-UV light (ultraviolet light of 300 nm or less) destroys the cross-linking bond in the molecule and the soluble resin layer 408 and , 409 are continuously applied by spin coating. At this time, by using a heat-crosslinking resin for the lower resin layer 408, it is possible to prevent the lower resin and the upper resin from melting each other when the upper resin 409 is applied by spin coating. Prevented. At this time, as the lower layer resin 408, P (MMA-MAC = 90: 1)
A solution obtained by dissolving 0) in a cyclohexanone solvent was used.
A liquid obtained by dissolving PMIPK in a cyclohexanone solvent was used as the upper layer resin. After that, Deep-UV
A CM290 is mounted by an exposure device (PLA521 manufactured by Canon Inc.) using light, and a Deep-
By exposing and developing the upper layer resin 409 only with UV light, a nozzle pattern 409 ′ as shown in FIG.
Was formed. At that time, the lower layer resin 408 and the upper layer resin 409
In and, since the sensitivity ratio to Deep-UV light near 290 nm has a difference of about 50: 1 or more, the lower layer resin is not exposed and is not patterned.

Next, CM250 was mounted in the same exposure apparatus, and the lower layer resin was exposed and developed only with Deep-UV light near 250 nm to form a nozzle pattern as shown in FIG. 16 (a). . Further, such a nozzle pattern is formed, and the deep-UV light destroys the cross-linking bond in the molecule, and the soluble resin layer 408 and
A coating resin layer 412 is formed on 409 (see FIG.
(B)), a portion corresponding to the discharge port 407 is exposed by an exposure device using UV light (manufactured by Canon: MPA-600).
It was exposed, developed and removed (FIG. 16 (c)). Next, as shown in FIG. 17A, an organic resin film 414 was applied in order to protect the ejection port side during chemical etching. Then, as shown in FIG.
Then, the supply port was formed by chemically etching the back surface. More specifically, a strong alkaline solution (KOH,
The supply port 405 was formed by anisotropic etching using NaOH, TMAH).

Finally, from the surface of the substrate 401, the coating resin layer 412 is transmitted, and the Deep-UV light (300 nm) is transmitted.
The resin layers 408 ′ and 409 ′, which are nozzle patterns, were eluted by irradiation with the following ultraviolet light). As a result, the discharge port 407, the supply port 405, and the nozzle 406 having a step shape communicating with them are provided, and the movable member 410 and the supply of the movable member are provided between the electrothermal conversion element 403 and the supply port 405 in the nozzle 406. It is possible to obtain the inkjet head chip including the limiting portion 412 ′ for limiting the displacement toward the mouth side. The ink jet recording head of the present invention can be obtained by electrically connecting this chip to a wiring board for driving the electrothermal conversion element.

FIG. 18 is a plan view of the nozzle portion of the ink jet recording head (FIG. 17 (c) corresponds to the sectional view taken along the line AA 'in FIG. 18). The movable member 410, when bubbles are generated on the heater surface,
In order to make the portion from the movable member 410 to the ejection port a substantially sealed state, a stopper (barrier) that can restrict the displacement of the movable member 410 to the ink supply port 405 side when bubbles are generated is the nozzle flow path 406. It is formed by protruding a part 412 'of the side wall. This barrier is preferably small in dimension so as not to disturb the flow of ink from the supply port to the ejection port side as much as possible during refilling. Further, there is a minute gap between the movable member and the nozzle wall that can be created by the photolithography process method. It is desirable that this gap be as small as possible if it is possible to displace the movable member.

Further, like the ink jet recording head shown in FIG. 19, as in the present embodiment, a part 512 ′ of the side wall of the nozzle channel 506 between the movable member 510 and the ink supply port 505 is projected. Not only that, when the protrusion-type barrier 513 ′ is formed on the substrate as in the third embodiment, the flow of the ink to the ink supply port 505 side can be more effectively suppressed by the movable member 510 when the bubbles grow. The discharge performance can be further improved.

Regarding the operation of the ink jet recording head (liquid ejection head) of the present invention produced as described above,
A brief description will be given with reference to FIG. First, FIG.
As shown in (a), in the initial state, the heater 403 is arranged below the ejection port 607, and the ejection port flow path from the heater to the ejection port and the nozzle 60 connected from the heater to the ink supply port.
6 is L-shaped. A movable member is arranged in the nozzle in a direction perpendicular to the nozzle-side surface of the substrate having the heater. Then, as shown in FIG. 20B, when the bubble 615 is generated in the heater portion, the movable member 6 is generated at the same time as the generated pressure wave and the flow of ink.
10 is slightly inclined toward the ink supply port 605, and by the movable member, the protrusion-type barrier 613 ′ formed on the HB (substrate), and the stopper-shaped structure 612 ′ formed behind the movable member, The inside of the nozzle from the discharge port to the movable member is maintained in a substantially sealed state.

As a result, the pressure on the heater surface is mostly concentrated on the ejection port side, and the ejected ink droplet 616 can be efficiently ejected. The movable member and the protrusion-type barrier 61
Although there is a minute gap between 3'and 3 ', it is desirable that the gap be as small as possible in order to achieve the above-mentioned substantially sealed state. Also, a minute gap exists between the movable member 610 and the side wall of the nozzle 606.

Next, as shown in FIG. 21 (a), since the inside of the nozzle is substantially sealed by the movable member 610, the protruding barrier 613 'and the stopper-shaped structure 612', air bubbles are not generated. Most of the growth is large on the ejection port side, and the ink droplets 616 are more stable and more efficient.
Can be ejected from the ejection port. And FIG.
As shown in (b), when bubbles start to disappear on the heater surface, the movable member 610 starts to be displaced toward the ejection port 607. Then, the movable member 610 is largely displaced toward the ejection port. At this time, the amount of displacement of the movable member toward the discharge port is
It is larger than the amount of displacement of the movable member to the ink supply port side during bubble growth.

As a result, high-speed refill is performed from the ink supply port 605 into the plurality of ink nozzles. The flow of ink to the ink supply port 605 side when bubbles are generated is such that the movable member 610, the protruding barrier 613 'formed on the HB (substrate) 601 and the stopper shape formed behind the movable member. Since it is hindered by the structure 612 ′, the amount of ink refilled in the nozzle 606 can be set to the minimum amount of ink close to the ejected ink volume.

[0046]

According to the present invention, a movable member is formed in a nozzle flow path between an ink supply port and an ejection port to maintain ejection performance and improve frequency characteristics. It is possible to realize a highly reliable inkjet recording head manufacturing method and an inkjet recording head.

[Brief description of drawings]

FIG. 1A is a schematic cross-sectional view for explaining a method of manufacturing an inkjet recording head according to a first embodiment of the present invention. FIG. 1B is AA ′ of FIG.
It is sectional drawing in a line. FIG. 1C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 1A of the method for manufacturing an inkjet recording head according to the first embodiment of the present invention. FIG. 1D is a sectional view taken along the line AA ′ of FIG.

FIG. 2A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 1C of the method for manufacturing the inkjet recording head according to the first embodiment of the present invention. Figure 2
2B is a sectional view taken along the line AA ′ of FIG. FIG. 2C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 2A of the method for manufacturing the inkjet recording head according to the first embodiment of the present invention. Figure 2
2D is a cross-sectional view taken along the line AA ′ of FIG.

FIG. 3A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 2C of the method for manufacturing an inkjet recording head according to the first embodiment of the present invention. Figure 3
3B is a sectional view taken along the line AA ′ of FIG. FIG. 3C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 3A of the method for manufacturing the inkjet recording head according to the first embodiment of the present invention. Figure 3
3D is a sectional view taken along the line AA ′ of FIG.

FIG. 4A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 3C of the method for manufacturing the inkjet recording head in the first embodiment of the present invention. Figure 4
4B is a sectional view taken along the line AA ′ of FIG. FIG. 4C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 4A of the method for manufacturing the inkjet recording head in the first embodiment of the present invention. Figure 4
4D is a sectional view taken along the line AA ′ of FIG.

FIG. 5A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 4C of the method for manufacturing the inkjet recording head in the first embodiment of the present invention. Figure 5
5B is a sectional view taken along the line AA ′ of FIG.

FIG. 6A is a schematic cross-sectional view for explaining a method for manufacturing an inkjet recording head according to a second embodiment of the present invention. FIG. 6B shows AA ′ of FIG.
It is sectional drawing in a line. FIG. 6C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 6A of the method for manufacturing the inkjet recording head in the second embodiment of the present invention. FIG. 6D is a sectional view taken along the line AA ′ of FIG.

FIG. 7A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 6C of the method for manufacturing the inkjet recording head in the second embodiment of the present invention. Figure 7
7B is a sectional view taken along the line AA ′ of FIG. FIG. 7C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 7A of the method for manufacturing the inkjet recording head in the first embodiment of the present invention. Figure 7
7D is a sectional view taken along the line AA ′ of FIG.

FIG. 8A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 7C of the method for manufacturing the inkjet recording head in the second embodiment of the present invention. Figure 8
8B is a sectional view taken along the line AA ′ of FIG. FIG. 8C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 8A of the method for manufacturing the inkjet recording head in the first embodiment of the present invention. Figure 8
8D is a sectional view taken along the line AA ′ of FIG.

FIG. 9A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 8C of the method for manufacturing the inkjet recording head in the second embodiment of the present invention. Figure 9
9B is a sectional view taken along the line AA ′ of FIG.

FIG. 10 is a plan view showing a mask pattern used in the step of FIG. 7A in the second embodiment of the present invention.

FIG. 11 is a plan view of an ink jet recording head showing a modified example of the second embodiment of the present invention.

FIG. 12A is a schematic cross-sectional view for explaining a method for manufacturing an inkjet recording head according to a third embodiment of the present invention. FIG. 12B is a schematic cross-sectional view for explaining a step that follows the step of FIG. 12A of the method for manufacturing the inkjet recording head in the third embodiment of the present invention. FIG. 12C is a diagram illustrating a method of manufacturing an ink jet recording head according to the third embodiment of the present invention.
It is a typical sectional view for explaining the process following the process of (b). FIG. 12D is a schematic cross-sectional view for explaining a step that follows the step of FIG. 12C of the method for manufacturing the inkjet recording head in the third embodiment of the present invention. FIG. 12E is a schematic cross-sectional view for explaining a step that follows the step of FIG. 12D of the method for manufacturing the inkjet recording head in the third embodiment of the present invention.

FIG. 13A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 12E of the method for manufacturing the inkjet recording head in the third embodiment of the present invention. FIG. 13B is a schematic cross-sectional view for explaining a step that follows the step of FIG. 13A of the method for manufacturing the inkjet recording head in the third embodiment of the present invention. Figure 1
3C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 13B of the method for manufacturing the inkjet recording head in the third embodiment of the present invention. FIG. 13 (d)
FIG. 13A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 13C of the method for manufacturing an inkjet recording head in Example 3 of the present invention.

FIG. 14A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 13D of the method for manufacturing an inkjet recording head according to the third embodiment of the present invention. FIG. 14B is a schematic cross-sectional view for explaining a step that follows the step of FIG. 14A of the method for manufacturing the inkjet recording head in the third embodiment of the present invention. Figure 1
4C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 14B of the method for manufacturing the inkjet recording head in the third embodiment of the present invention.

FIG. 15A is a schematic cross-sectional view for explaining a method for manufacturing an inkjet recording head according to a fourth embodiment of the present invention. FIG. 15B is a schematic cross-sectional view for explaining a step that follows the step of FIG. 15A of the method for manufacturing the inkjet recording head in the third embodiment of the present invention. FIG. 15C shows a method of manufacturing an inkjet recording head according to the third embodiment of the present invention.
It is a typical sectional view for explaining the process following the process of (b). FIG. 15D is a schematic cross-sectional view for explaining a step that follows the step of FIG. 15C of the method for manufacturing the inkjet recording head in the third embodiment of the present invention.

FIG. 16A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 15D of the method for manufacturing the inkjet recording head in the fourth embodiment of the present invention. FIG. 16B is a schematic cross-sectional view for explaining a step that follows the step of FIG. 16A of the method for manufacturing the inkjet recording head according to the third embodiment of the present invention. Figure 1
6C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 16B of the method for manufacturing the inkjet recording head in the third embodiment of the present invention.

FIG. 17A is a schematic cross-sectional view for explaining a step that follows the step of FIG. 16C of the method for manufacturing the inkjet recording head according to the fourth embodiment of the present invention. FIG. 17B is a schematic cross-sectional view for explaining a step that follows the step of FIG. 17A of the method for manufacturing the inkjet recording head in the third embodiment of the present invention. Figure 1
7C is a schematic cross-sectional view for explaining a step that follows the step of FIG. 17B of the method for manufacturing the inkjet recording head in the third embodiment of the present invention.

FIG. 18 is a plan view showing a nozzle portion of an inkjet recording head according to a fourth embodiment of the present invention.

FIG. 19A is a schematic cross-sectional view of an inkjet recording head according to a modified example of the fourth embodiment of the present invention. FIG. 19B is a schematic sectional view of a head chip obtained by a modification of the fourth embodiment of the present invention.

FIG. 20 is a schematic cross-sectional view for explaining an ejection operation for ejecting ink droplets using the inkjet recording head of the present invention.

FIG. 21 is a schematic cross-sectional view for explaining the ejection operation for ejecting ink droplets using the inkjet recording head of the present invention, following FIG. 20.

FIG. 22 is a schematic perspective view showing an inkjet recording head of the present invention.

[Explanation of symbols]

1: substrate 3: Heating resistor 5: Ink supply port 7: Discharge port 12: member forming ink flow path 101: substrate 102: heat storage layer 103: Heater (heat generating resistance part) 104: protective layer 105: Ink supply port 106: nozzle 107: discharge port 108: First type resist 109: Second type resist 110: valve 111: Valve shape forming part by mold resist 112: Photosensitive epoxy material 201: substrate 202: heat storage layer 203: Heater (heat generating resistance part) 204: protective layer 205: Ink supply port 206: Nozzle 207: Discharge port 208: Photoresist 210: movable member 301: Element substrate 303: Heater 305: Supply port 306: Supply path 307: Discharge port 308: Lower resin layer 308 ': Nozzle pattern 309: Upper resin layer 309 ': Nozzle pattern 310: movable member 312: Orifice substrate 313: Negative resin layer 313 ': protruding barrier 401: substrate 403: Electrothermal conversion element (heater) 405: Supply port 406: Nozzle 408: Lower resin layer 409: Upper resin layer 410: movable member 505: Ink supply port 506: Nozzle flow path 605: Ink supply port 606: Nozzle 610: movable member 612 ': stopper-shaped structure 613 ': Protrusion-type barrier 615: bubbles

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hiroyuki Sugiyama             3-30-2 Shimomaruko, Ota-ku, Tokyo             Non non corporation (72) Inventor Ryoji Inoue             3-30-2 Shimomaruko, Ota-ku, Tokyo             Non non corporation (72) Inventor Yoshinori Misumi             3-30-2 Shimomaruko, Ota-ku, Tokyo             Non non corporation (72) Inventor Masakawa Miyakawa             3-30-2 Shimomaruko, Ota-ku, Tokyo             Non non corporation F-term (reference) 2C057 AF37 AF93 AG30 AP32 AP34                       AP47 AP57 AQ02 BA04 BA13

Claims (12)

[Claims] 1. A heating resistor, an ink discharge port provided corresponding to the heating resistor, and a nozzle flow path communicating with the ink discharge port, wherein the nozzle flow path includes: A movable member is formed between the heat generating resistor and an ink supply port for supplying ink into the nozzle channel, and is generated in the ink in the nozzle channel by the heat generated by the heat generating resistor. In a method for producing an ink jet recording head that ejects ink from the ink ejection port by using bubbles, a step of preparing a substrate provided with the heating resistor, the nozzle flow path and the movable member on the substrate. A step of applying a first resin which is a first mold material for forming the first mold material, and a step of forming the first mold material with the first resin,
A step of applying a second resin for forming the nozzle flow path and the movable member on the substrate so as to cover the first mold material; and a step of removing the first mold material. A method for producing an ink jet recording head, which is characterized by the above. 2. The first resin is a photoresist, and in the step of forming the first mold material, a mask pattern having a width equal to or less than a resolution limit of the photoresist is used to form the first mold material. And a step of forming a portion for forming the movable member.
The method for producing an ink jet recording head according to 1. 3. Before the step of applying the first resin, the method further comprises the step of applying a third resin, which serves as a second mold material for forming the nozzle flow path, on the substrate. Then, the step of applying the first resin is a step of applying the first resin on the substrate so as to cover the second mold material with the first resin. 1. The method for producing an inkjet recording head described in 1. 4. A step of forming a projecting barrier at a position corresponding to between the movable member and the supply port on the substrate before applying the first resin on the substrate. The method for producing an inkjet recording head according to claim 1, further comprising: 5. An ink jet recording head for ejecting ink from an ink ejection port by utilizing bubbles generated in ink in a nozzle flow path by heat generation of a heating resistor, a substrate provided with the heating resistor, The nozzle flow path provided on the substrate, and in the nozzle flow path, between the heating resistor and an ink supply port for supplying ink into the nozzle flow path. A movable member is formed on the wall of the nozzle channel that has a fulcrum on the wall facing the substrate and has a free end on the substrate side, and is integral with the wall facing the substrate. An ink jet recording head, characterized in that it is formed on. 6. The ink jet recording head according to claim 5, wherein the wall and the movable member are made of resin. 7. A limiting portion is provided between the movable member and the ink supply port in the nozzle flow path to limit the displacement of the movable member toward the ink supply port. Item 5. The inkjet recording head according to item 5. 8. The ink jet recording head according to claim 5, wherein the limiting portion is a protrusion-shaped barrier provided on the substrate. 9. The ink jet recording head according to claim 5, wherein the limiting portion is a part of a member forming a side wall in the nozzle flow path. 10. A heating resistor, an ink discharge port provided corresponding to the heating resistor, and a nozzle flow path communicating with the ink discharge port, wherein the nozzle flow path is provided with the nozzle flow path. A movable member is formed between the heat generating resistor and an ink supply port for supplying ink into the nozzle channel, and is generated in the ink in the nozzle channel by the heat generated by the heat generating resistor. In the ink jet recording head that ejects ink from the ink ejection port by using bubbles, the movable member is arranged in a direction perpendicular to a surface of the substrate having the heating resistor on the nozzle channel side. And an fulcrum of the movable member on the surface of the nozzle channel facing the substrate, and a free end of the movable member on the substrate side of the nozzle channel. Recording head. 11. A restricting portion for restricting displacement of the movable member toward the ink supply port is provided between the movable member and the ink supply port in the nozzle flow path. Item 10. The inkjet recording head according to Item 10. 12. The ink jet recording head according to claim 11, wherein the movable member has a larger displacement amount toward the ink ejection port side than a displacement amount toward the ink supply port side.