JP2005125619A - Liquid jetting recording head and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid jetting recording head which has a good dimensional accuracy and can be produced stably, and to provide its manufacturing method. <P>SOLUTION: The manufacturing method for the liquid jetting recording head includes a process in which nozzles are formed by coating a nozzle formation material to be hardened by a photoacid generation catalyst onto a substrate where an ink discharge pressure generating element and a solid layer that occupies at least a part to be a liquid passage are set, forming discharge openings in a nozzle formation member, and removing the solid layer. The solid layer is made two layers, and an ultraviolet ray absorber is included in the most front face layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a liquid jet recording head for generating recording liquid (ink) droplets used in a liquid jet (hereinafter referred to as “inkjet”) recording method and a method for manufacturing the same.

  An ink jet recording head applied to the ink jet recording system generally includes a plurality of fine ink discharge ports (orifices), a liquid flow path, and a plurality of liquid discharge energy generating portions provided in a part of the liquid flow path. In order to obtain a high-quality image with such an ink jet recording head, it is desirable that the ink droplets ejected from the ejection ports are always ejected from the ejection ports at the same volume and ejection speed.

  In order to achieve this, for example, in Patent Documents 1 to 3, a drive signal is applied to the ink discharge pressure generating element (electrothermal conversion element) in accordance with the recording information, and the nucleate boiling of the ink is applied to the electrothermal conversion element. There is disclosed a method of generating thermal energy that gives a rapid temperature rise exceeding, forming bubbles in the ink, and ejecting ink droplets by the pressure of the bubbles.

  As an ink jet recording head for realizing such a method, the distance between the electrothermal transducer and the orifice (hereinafter referred to as “OH distance”) needs to be set accurately and with good reproducibility.

  Conventionally, as a method of manufacturing this type of ink jet recording head, for example, the method described in Patent Documents 4 and 5, that is, a nozzle comprising an ink flow path and an orifice portion on a substrate on which an ink discharge pressure generating element is formed. A pattern is formed using a photosensitive resin material, and a lid such as a glass plate is joined thereto, or a method described in Patent Document 6, for example, an ink flow path pattern with a soluble resin The pattern is coated with an epoxy resin, the resin is cured, and the soluble resin pattern is eluted and removed after the substrate is cut.

  However, any of these methods is a method of manufacturing an ink jet recording head of an (almost vertical) type (edge shooter) in which the bubble growth direction and the ejection direction are different. In this type of head, since the distance between the ink discharge pressure generating element and the orifice is set by cutting the substrate, the cutting accuracy is extremely high in controlling the distance between the ink discharge pressure generating element and the orifice. It becomes an important factor. However, cutting is generally performed by mechanical means such as a dicing saw, and it is difficult to achieve high accuracy.

  In addition, as a method of manufacturing an ink jet recording head of a type (side shooter) in which the bubble growth direction and the discharge direction are substantially the same, for example, a method described in Patent Document 7, that is, a dry film serving as a substrate and an orifice plate, Are bonded through another patterned dry film and an orifice is formed by photolithography, for example, a method described in Patent Document 8, that is, a substrate on which an ink discharge pressure generating element is formed. There is a method of joining an orifice plate manufactured by electroforming via a patterned dry film.

  However, in any of these methods, it is difficult to make the orifice plate thin (for example, 20 μm or less) and uniformly, and even if it can be made, it is difficult to produce the orifice plate with the substrate on which the ink discharge pressure generating element is formed. The joining process becomes extremely difficult due to the fragility of the orifice plate. Therefore, a manufacturing method described below is disclosed in Patent Document 9 by the present applicant.

  That is, as shown in FIGS. 1 to 6, the distance between the ink discharge pressure generating element and the orifice can be set with a very high accuracy, short and with good reproducibility, and the ink discharge pressure generating element can be recorded with high quality. A step of forming an ink flow path pattern with a resin that can be dissolved on a substrate on which a resin is formed, and a resin layer in which a coating resin containing a solid epoxy resin at room temperature is dissolved in a solvent, and the resin layer can be dissolved Forming a coating resin layer serving as an ink flow path wall on the dissolvable resin layer by performing solvent coating thereon; forming an ink discharge port in the coating resin layer above the ink discharge pressure generating element; And a step of eluting a soluble resin layer.

  However, when patterning is performed by irradiating the coating resin layer with ultraviolet rays, a slight scum (development residue) may be generated at the boundary with the flow path pattern even though the discharge port portion is not irradiated. It has been confirmed. This scum is because when the coating resin layer is irradiated with ultraviolet rays, light is reflected at the interface between the ink flow path pattern layer and the coating resin layer, and light wraps around the original unexposed portion and the coating resin layer is slightly cured. It is considered. The eaves-like scum formed at the boundary between the ink discharge port and the ink flow path has been determined to be no problem because it is extremely small.

  However, in recent printers, there is a trend toward higher image quality and higher definition, and since the amount of ink discharged is reduced, the size of the discharge port is becoming increasingly finer, so the size of these scums is the same as before. Even the size has a relatively large effect on the ejection characteristics and, in particular, the ink droplet direction, and has become a problem.

  For this reason, these scums need to be eliminated or made smaller. As a method for solving this problem, Patent Document 10 discloses a manufacturing method in which a basic substance is added to a solid layer that occupies a portion that becomes an ink flow path. According to this method, since the basic substance contained in the solid layer is mixed into the compatible layer composed of the solid layer and the nozzle forming material, and the curing reaction by the acid generation catalyst is inhibited, the nozzle forming material is removed. At this time, the compatible layer is removed, and scum is eliminated.

  However, since a substance that inhibits the curing reaction of the nozzle forming material is handled, there is a possibility that a problem that curing does not proceed or difficult to proceed unless care is taken at the production site. If the progress of the curing reaction is changed, the dimensional accuracy of the discharge port, which greatly affects the discharge characteristics, is deteriorated. Further, the nozzle forming material is peeled off from the substrate due to long-term use, which causes a problem of deterioration in ink discharge performance.

  Further, in Patent Document 11 by the present applicant, when a nozzle material is subjected to pattern exposure by including a component that absorbs or scatters ultraviolet rays, a liquid discharge port with respect to the incident direction of irradiation energy is included in the nozzle forming material. A method of manufacturing an ink jet recording head is described in which a latent image having a gradually increasing cross-sectional area is formed, and an ejection port having a large cross-sectional area is formed toward an ink ejection energy generating portion.

  In this manufacturing method, the ultraviolet rays reflected at the interface between the nozzle forming material and the solid layer are attenuated in the nozzle forming material, so that no scum is generated or very small.

  However, an object of the present invention is to provide a tapered shape in which the cross-sectional area of the ink discharge port gradually increases in order to increase the discharge frequency of the ink droplets. Therefore, in the embodiment, inorganic pigment particles that scatter light are used. What is added is a heterogeneous system, and the amount added is as large as 10 to 35%.

  Since the invention has a tapered shape in which the discharge port cross section gradually increases, it is difficult to control the shape and to produce stably. Further, when ejecting minute ink, the nozzle density increases, so that the shape of the splay spread is disadvantageous because the nozzle density cannot be increased.

Japanese Patent Laid-Open No. 4-10940 JP-A-4-10941 JP-A-4-10942 JP-A-57-208255 JP-A-57-208256 JP 61-154947 A Japanese Patent Laid-Open No. 58-8658 JP 62-264975 A JP-A-6-286149 JP 2001-179990 A JP 2001-179799 A

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a liquid jet recording head having stable ink ejection characteristics and high reliability, and a method for manufacturing the same. There is.

The present invention intends to achieve the above object by providing a method of manufacturing a liquid jet recording head according to any one of the following items (1) to (4).
(1) A substrate on which an ink discharge pressure generating element and a solid layer that occupies at least a portion serving as a liquid path are coated with a nozzle forming material that is cured by a photoacid generating catalyst, and discharged onto a nozzle forming member. In a method of manufacturing a liquid jet recording head including a step of forming a nozzle by forming an outlet and removing the solid layer, the solid layer is divided into two layers, and is in contact with an epoxy resin that is a nozzle forming material. A method for manufacturing a liquid jet recording head, wherein a portion where a nozzle is formed in the future is a layer containing an ultraviolet absorber, unlike a conventional layer used for forming a flow path.
(2) A method for producing a liquid jet recording head, characterized in that the addition amount of the ultraviolet absorber is 0.01 to 10% by weight relative to the other solid content of the solid layer. (3) Ultraviolet absorption of the outermost surface layer A method of manufacturing a liquid jet recording head, wherein the layer containing the agent has a thickness of 0.1 μm to 10 μm.
(4) The amount of the ultraviolet absorber added is 0.01 to 10% by weight with respect to the other solid content of the solid layer, and the film thickness of the outermost layer containing the ultraviolet absorber of the two solid layers. Is 0.1 μm to 10 μm. A method of manufacturing a liquid jet recording head.

  According to the present invention, the discharge pressure generating element, the solid layer exclusively occupied by at least a portion serving as the flow path, and the nozzle forming member cured by the photoacid generating catalyst are coated on the provided substrate, and discharged by exposure and development. In a method of manufacturing an ink jet recording head including a step of forming an ink flow path by forming an outlet and removing a solid layer, a resist containing an ultraviolet absorber in the outermost layer with two solid layers is used. Thus, the scum generated in a part of the ink flow path can be suppressed to a very small level or not at all. Therefore, even in an inkjet recording head that ejects minute ink droplets, ejection disturbance does not become a problem.

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

  In the present embodiment, the ink jet recording head was manufactured according to the procedure shown in FIGS. 1 to 6 also illustrate part of the basic manufacturing method shown in the conventional example (Japanese Patent Laid-Open No. 6-286149).

  In the conventional example, a substrate 1 made of glass, ceramics, plastic, metal, or the like as shown in a schematic perspective view of FIG. 1 is used.

  If such a substrate 1 functions as a part of a liquid flow path component, and can function as a support for a material layer that forms an ink flow path and an ink discharge port (orifice) described later, The shape, material, etc. can be used without any particular limitation. A desired number of ink discharge energy generating elements 2 such as electrothermal conversion elements or piezoelectric elements are arranged on the substrate 1. By such an ink ejection energy generating element 2, ejection energy for ejecting ink droplets as ink is given to the ink, and recording is performed.

  For example, when an electrothermal conversion element is used as the ink discharge energy generating element 2, the element heats nearby ink, thereby causing a change in state of the ink and generating discharge energy. For example, when a piezoelectric element is used, ejection energy is generated by mechanical vibration of the element.

  These elements 2 are connected to control signal input electrodes (not shown) for operating these elements. In general, various functional layers such as a protective layer are provided for the purpose of improving the durability of the ejection energy generating element 2, but it is of course possible to provide such a functional layer.

  In FIG. 1, an example in which an opening 3 for supplying ink is provided in advance on the substrate 1 and ink is supplied from the rear of the substrate 1 is illustrated. Any method can be used for forming the opening 3 as long as it is a means capable of forming a hole in the substrate 1. For example, it may be formed by a mechanical means such as a drill, or light energy such as a laser may be used. Further, a resist pattern or the like may be formed on the substrate 1 and chemically etched. Of course, the ink supply port 3 may not be formed in the substrate 1 but may be formed in a resin pattern and provided on the same surface as the ink discharge port 8 with respect to the substrate 1.

  Next, as shown in the “dissolvable flow path pattern formation diagram” in FIG. 2 (AA ′ cross-sectional view in FIG. 1), the dissolvable resin is formed on the substrate 1 including the ink discharge energy generating element 2. Thus, the ink flow path pattern 4 (solid layer) is formed. As the most general means, there is a means of forming with a photosensitive material, but it can also be formed by means of a screen printing method or the like. In the case of using a photosensitive material, the ink flow path pattern can be dissolved, so that it is possible to use a positive resist or a solubility-changing negative resist.

  Here, in the present invention, the outermost layer of the nozzle flow path pattern (solid layer) is a layer containing an ultraviolet absorber. This is because when a resin solution of a coating resin layer is applied onto a solid layer in a later step, a layer (compatible layer) that is mutually melted between only two layers is formed. In addition, when a discharge port is formed in the coating resin layer by irradiating an ultraviolet pattern, the reflection of light generated at the interface between the ink flow path pattern layer and the coating resin layer is attenuated to suppress scum. It is. Further, since the use of the ultraviolet absorber-containing resist alone requires a lot of exposure energy as compared with the conventional resist, it is possible to avoid an increase in exposure time and a problem in productivity.

  Here, the following are mentioned as an example of the ultraviolet absorber which can be added.

  2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-n-dodecyloxybenzophenone, 2-hydroxy-4-benzyloxy Benzophenone, 2,2′-hydroxy-4-methoxybenzophenone, phenyl salicylate, 4-t-butylphenyl salicylate, 2-hydroxy-4-methoxybenzophenone, 2,4-di-t-butylphenyl-3 ′, 5 ′ -Di-t-butyl-4-hydroxybenzoate and the like. Other than this can be used as long as it does not depart from the gist of the present invention.

  The addition amount of the ultraviolet absorber is preferably 0.01 to 10%. More preferably, it is 0.03% to 5%. If the addition amount is too small, the effect of adding the ultraviolet absorber cannot be obtained. If the added amount is larger than this, the problem of scum disappears, but the ultraviolet rays reaching the substrate are attenuated too much, and the exposure time of the mold material becomes longer, resulting in poor productivity. In addition, the side surface shape of the pattern is also different from the one intended by the design, which is a problem. In forming the two layers, the outermost layer of the ultraviolet absorber addition layer preferably has a resist of 0.1 μm to 10 μm. More preferably, it is 0.5 μm to 2 μm. When the thickness is 0.1 μm or less, the effect of adding an ultraviolet absorber cannot be obtained. On the other hand, if the added amount exceeds 10 μm, the problem of scum is eliminated, but the ultraviolet rays reaching the substrate are attenuated too much, and the exposure time of the mold material becomes longer, resulting in poor productivity. In addition, the side surface shape of the pattern is also different from the one intended by the design, which is a problem.

  As a method of forming the solid layer as the ink flow path pattern, when using the substrate 1 provided with the ink supply port 3 on the substrate 1, this photosensitive material is dissolved in an appropriate solvent and PET (polyethylene) is used. It is preferable to form a dry film by applying and drying on a film such as terectrate) and then laminating. As the above-mentioned dry film, vinyl ketone photodegradable polymer compounds such as polymethyl isopropyltone and polyvinyl ketone can be suitably used. The reason is that these compounds maintain characteristics (film properties) as a polymer compound before light irradiation and can be easily laminated on the ink supply port 3. Similarly, a positive resist to which a second-layer ultraviolet absorber is added is also formed on a dry film and transferred to a substrate.

  In addition, it is possible to arrange a filling material that can be removed in a subsequent process at the ink supply port 3 and form a multilayer coating by a normal spin coating method, a roll coating method, or the like.

  In this way, on the ink flow path pattern 4 formed of a dissolvable solid layer, as shown in “Coating resin layer formation diagram” of FIG. It is formed by a method such as a roll coating method.

  Here, in the process of forming the resin layer 5, characteristics such as not causing deformation of the dissolvable resin pattern as much as possible are required. That is, when the coating resin layer 5 is dissolved in a solvent and formed on the resin pattern 4 that can be dissolved by spin coating, roll coating, or the like, it is necessary to select the solvent so as not to dissolve the soluble resin pattern 4 as much as possible. There is. In the case of the present invention, an ultraviolet absorber is contained in a dissolvable resin pattern, and an ultraviolet absorber is contained in a compatible layer portion formed between the coating resin layer and the coating resin layer is formed. If the resin pattern that is sometimes soluble is not dissolved at all, the present invention becomes ineffective, but actually there is no compatible layer, and it is formed of an extremely thin layer. A sufficient effect is obtained.

  Next, the coating resin layer 5 will be described.

  The coating resin layer 5 is preferably photosensitive because the ink discharge ports 3 can be easily and accurately formed by photolithography. Such a photosensitive coating resin layer 5 is required to have high mechanical strength as a structural material, adhesion to the substrate 1, ink resistance, and resolution for patterning a fine pattern of ink discharge ports at the same time. Is done. Here, as a result of intensive studies, the cationic polymerization cured product of an epoxy resin has excellent strength, adhesion, and ink resistance as a structural material, and is excellent if the epoxy resin is solid at room temperature. It has been found that it has patterning properties.

  A cationic polymerization cured product of an epoxy resin has a high crosslink density (high Tg) as compared with a cured product of an ordinary acid anhydride or amine, and thus exhibits excellent characteristics as a structural material. In addition, by using a solid epoxy resin at room temperature, diffusion of polymerization initiating species generated from the cationic polymerization initiator by light irradiation into the epoxy resin can be suppressed, and excellent patterning accuracy and shape can be obtained. .

  However, when patterning is performed by irradiating the coating resin layer with ultraviolet rays, a slight scum (development residue) is generated at the boundary with the nozzle flow path pattern even though the discharge port portion is not irradiated. Has been confirmed.

  This scum is because when the coating resin layer is irradiated with ultraviolet rays, light is reflected at the interface between the ink flow path pattern layer and the coating resin layer, the light wraps around the original unexposed portion, and the coating resin layer is slightly cured. It is believed that.

  The eaves-like scum formed at the boundary between the ink discharge port and the ink flow path has been determined to be no problem because it is extremely small. However, in recent printers, there is a trend toward higher image quality and higher definition, and since the amount of ink discharged is reduced, the size of the discharge port is becoming increasingly finer, so the size of these scums is the same as before. Even the size has a relatively large effect on the ejection characteristics and, in particular, the ink droplet direction, and has become a problem.

  The solid epoxy resin includes a reaction product of bisphenol A and epichlorohydrin having a molecular weight of about 900 or more, a reaction product of bromosphenol A and epichlorohydrin, a reaction product of phenol novolac or cresol novolak and epichlorohydrin. For example, polyfunctional epoxy resins having an oxycyclohexane skeleton described in JP-A-60-161973, JP-A-63-221121, JP-A-64-9216, JP-A-2-140219, etc. Is mentioned.

  In the above-described epoxy compound, a compound having an epoxy equivalent of 2000 or less, more preferably 1000 or less, is preferably used. This is because if the epoxy equivalent exceeds 2000, the crosslinking density decreases during the curing reaction, and the Tg or thermal deformation temperature of the cured product may decrease, or problems may occur in adhesion and ink resistance. is there.

  Examples of the photocationic polymerization initiator for curing the epoxy resin include aromatic iodonium salts, aromatic sulfonium salts [J. POLYMER SCI: Symposium No. 56 383-395 (1976)] and commercial products SP-150, SP-170, SP-172 and the like marketed by Asahi Denka Kogyo Co., Ltd. are listed.

  Moreover, the above-mentioned photocationic polymerization initiator can promote cationic polymerization (a crosslink density improves compared with single photocationic polymerization) by heating together with a reducing agent. However, when a photocationic polymerization initiator and a reducing agent are used in combination, the reducing agent is selected so that it becomes a so-called redox type initiator system that does not react at room temperature and reacts at a certain temperature or higher (preferably 60 ° C. or higher). There is a need.

  As such a reducing agent, copper triflate (copper trifluoromethanesulfonate (II)) is most suitable in consideration of the copper compound, particularly reactivity and solubility in the epoxy resin. A reducing agent such as ascorbic acid is also useful.

  In addition, when a higher crosslink density (high Tg) is required, such as an increase in the number of nozzles (high-speed printability), use of non-neutral ink (improvement of water resistance of the colorant), the above-described reducing agent is described later As described above, the crosslinking density can be increased by a post-process in which the coating resin layer is dipped and heated using the solution after the development process of the coating resin layer.

  Furthermore, the following additives can be added to the composition as necessary. For example, a flexibility-imparting agent may be added for the purpose of lowering the elastic modulus of the epoxy resin, or a silane coupling agent may be added to obtain further adhesion to the substrate 1.

  Next, the photosensitive coating resin layer 5 made of the above compound is subjected to pattern exposure through a mask 6 as shown in “pattern exposure diagram of ink discharge port” in FIG. The photosensitive coating resin layer 5 is a negative type, and a portion where an ink discharge port is formed is shielded with a mask (of course, a portion where electrical connection is made is also shielded, not shown).

  The pattern exposure can be appropriately selected from ultraviolet rays, deep-UV light, electron beams, X-rays and the like according to the photosensitive region of the photocationic polymerization initiator to be used.

  Here, all of the steps so far can be aligned using conventional photolithography technology, and the accuracy can be significantly improved as compared with a method in which an orifice plate is separately manufactured and bonded to a substrate. The photosensitive coating resin layer 5 subjected to pattern exposure in this manner may be subjected to a heat treatment in order to accelerate the reaction as necessary. Here, as described above, since the photosensitive coating resin layer 5 is composed of an epoxy resin that is solid at room temperature, the diffusion of the cationic polymerization initiating species is not limited by pattern exposure, and has excellent patterning accuracy. The shape can be realized.

  Next, the pattern-exposed photosensitive coating resin layer 5 is developed using an appropriate solvent to form an ink discharge port 8 as shown in the “patterned coating resin layer development diagram” of FIG. Here, it is also possible to develop the dissolvable resin pattern 4 that forms the ink flow path simultaneously with the development of the unexposed photosensitive coating resin layer. However, in general, a plurality of recording heads having the same or different forms are disposed on the substrate 1 and used as an ink jet recording head through a cutting process. Therefore, as shown in FIG. By selectively developing only the photosensitive coating resin layer 5, the resin pattern 4 forming the ink flow path is left (the resin pattern 4 remains in the liquid chamber, so that dust generated during cutting does not enter) and is cut. It is also possible to develop the resin pattern 4 after the process (FIG. 6 flow path pattern elution diagram). At this time, since the scum (development residue) generated when developing the photosensitive coating resin layer 5 is eluted together with the soluble resin layer 4, almost no residue remains in the nozzle.

  An electrical connection (not shown) for driving the ink supply member 7 and the ink discharge pressure generating element 2 is formed on the substrate 1 formed with the ink flow path and the ink discharge port thus formed. As a result, an ink jet recording head is formed (a substrate diagram on which the ink supply unit of FIG. 7 is arranged).

  The ink jet recording head manufacturing method according to the present invention is effective as a full-line type recording head capable of recording simultaneously over the entire width of the recording paper, and also for a color recording head in which a plurality of recording heads are integrated or combined. It is.

  The above has described mainly the basic aspects to which the present invention can be applied. Next, embodiments of the present invention will be described in detail.

  The resists containing the ultraviolet absorber used in the examples were as follows.

(Resin composition)
Name parts by weight ODUR-1010 100 parts by weight KEMISORB 12 0.5 parts by weight (UV absorber)
KEMISORB 12 is referred to as 2-hydroxy-4-n-octoxybenzophenone (trade name, manufactured by Chemipro Kasei Co., Ltd.), hereinafter referred to as an ultraviolet absorber-containing resist A.

  First, in FIG. 1, a blast mask is placed on a silicon substrate 1 on which an electrothermal conversion element 2 (heater made of material HfB2) as an ejection energy generating element is formed, and a through-hole 3 for supplying ink is formed by sandblasting. Formed.

  Next, the following was used as the soluble resin layer 4 on the substrate 1.

(Resin composition 1)
Name Film thickness Lower layer ODUR-1010 12.5μm
Upper layer UV absorber containing resist A 1.5μm
ODUR-1010 is polymethyl isopropenyl ketone (trade name, manufactured by Tokyo Ohka Kogyo Co., Ltd.). This was formed into a dry film on PET and transferred to the substrate 1 by lamination. ODUR-1010 was concentrated and used because it has a low viscosity and cannot form a thick film.

  Next, after prebaking the above at 120 ° C. for 30 minutes, pattern exposure of the ink flow path 4 was performed with a mask aligner PLA520 (trade name cold mirror CM290) manufactured by Canon Inc. The exposure was 1.8 minutes, the development was methyl isobutyl ketone / xylene = 2/1, and the rinse was xylene. The pattern 4 formed of this dissolvable resin is for securing an ink flow path between the ink supply port 3 and the electrothermal conversion element 2 (FIG. 2). The resist film thickness after development was 14.0 μm.

  Next, the following resin composition was dissolved in a methyl isobutyl ketone / xylene mixed solvent at a concentration of 50 wt%, and a photosensitive coating resin layer 5 was formed by spin coating (film thickness on the flow path pattern 4 of 10 μm, FIG. 3). .

(Resin composition)
Name part by weight EHPE-3158 Daicel Chemical Co., Ltd. 100 parts by weight A-187 Nippon Unicar Co., Ltd. 5 parts by weight SP-170 Asahi Denka Kogyo Co., Ltd. 1.5 parts by weight Next, the mask aligner PLA520 (CM250) ), Pattern exposure for forming the ink discharge ports 8 was performed (FIG. 4). The exposure was performed for 15 seconds, and the after baking was performed at 60 ° C. for 30 minutes.

  Next, development was performed with methyl isobutyl ketone to form ink discharge ports. In the present embodiment, a discharge port pattern of φ10 μm was formed.

  Next, in order to enhance the removability of the dissolvable resin layer 4 (polymethylisopropenyl ketone), after exposing again with the PLA520 (CM290) for 2 minutes, it is immersed while applying ultrasonic waves to methyl lactate. The remaining ink flow path pattern 4 was eluted (FIG. 6).

  Next, the inkjet recording head is heated at 180 ° C. for 1 hour to completely cure the photosensitive coating material layer 5.

  Finally, as shown in the substrate diagram in FIG. 7 where the ink supply member is arranged, the ink supply member 7 is bonded to the ink supply port 3 to complete the ink jet recording head of the embodiment of the present invention.

  The following resin composition 2 was used for the soluble resin layer, and the exposure was performed for 2 minutes. Otherwise, an ink jet recording head was produced in the same manner as in Example 1 (the film thickness on the flow path pattern 4 was 14.0 μm, FIG. 3).

(Resin composition 2)
Name Film thickness ODUR-1010 13.0μm
UV absorber-containing resist A 1.0 μm
<Comparison example>
As a comparative conventional example, ODUR-1010 was used alone as a soluble resin layer, and exposure was performed for 1.5 minutes. Otherwise, an ink jet recording head was prepared in the same manner as in Example 1.

  The ink jet recording heads of Examples 1 and 2 thus prepared and the conventional comparative example were mounted on the recording apparatus, and pure water / diethylene glycol / isopropyl alcohol / lithium acetate / black dye hood black 2 = 79.4 / 15/3. When recording was performed using an ink having a ratio of 0.1 / 2.5, stable printing was possible in all of the examples, and the obtained printed matter was of high quality.

  However, in the comparative conventional example, disorder of printing was recognized. When each head was disassembled and observed, a scum of about several nanometers was observed in a part of the ink flow path at the entrance of the ink discharge port in the conventional example. In the head of this example, the occurrence of scum was minimal.

  The present invention is applied to a liquid jet recording head for generating recording liquid droplets used in a liquid jet recording method and a method for manufacturing the same, and a liquid jet recording head with stable ink ejection characteristics and high reliability is provided. It can be manufactured easily.

It is a typical perspective view of the board | substrate applicable to the inkjet recording head which concerns on this invention. It is a typical sectional view showing the basic manufacturing process of the ink jet recording head concerning the present invention. It is a typical sectional view showing the basic manufacturing process of the ink jet recording head concerning the present invention. It is a typical sectional view showing the basic manufacturing process of the ink jet recording head concerning the present invention. It is a typical sectional view showing the basic manufacturing process of the ink jet recording head concerning the present invention. It is a typical sectional view showing the basic manufacturing process of the ink jet recording head concerning the present invention. 1 is a schematic cross-sectional view illustrating an example of an ink jet recording head according to the present invention.

Explanation of symbols

1 Substrate 2 Electrothermal conversion element (ink discharge pressure generating element)
3 Ink supply port 4a Ink flow path pattern (ODUR)
4b Ink flow path pattern (UV absorbing material-containing resist A)
5 Photosensitive coating resin layer 6 Negative mask 7 Ink supply member 8 Ink discharge port

Claims (5)

A substrate on which an ink discharge pressure generating element and a solid layer that occupies at least a portion that becomes a liquid path are coated with a nozzle forming material that is cured by a photoacid generating catalyst, and a discharge port is formed in the nozzle forming member. In a method for manufacturing a liquid jet recording head, including a step of forming a nozzle by removing the solid layer,
2. A method of manufacturing a liquid jet recording head, wherein the solid layer has two layers and the outermost surface layer contains an ultraviolet absorber.   2. The method of manufacturing a liquid jet recording head according to claim 1, wherein the addition amount of the ultraviolet absorber is 0.01 to 10% by weight with respect to the other solid content of the solid layer.   2. The method of manufacturing a liquid jet recording head according to claim 1, wherein the film thickness of the outermost surface layer containing the ultraviolet absorber is 0.1 to 10 [mu] m.   The addition amount of the ultraviolet absorber is 0.01 to 10% by weight with respect to the other solid content of the solid layer, and the thickness of the outermost layer containing the ultraviolet absorber of the two solid layers is 0.00. The method of manufacturing a liquid jet recording head according to claim 1, wherein the manufacturing method is 1 μm to 10 μm.   A liquid jet recording head manufactured by the manufacturing method according to claim 1.

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