JP2003115666A - Multilayer wiring board and wiring method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer wiring board where the error of electric lengths can be made minimum. SOLUTION: In the multilayer printed circuit wiring board of a high frequency transmission circuit wiring such as a bus wiring circuit and a synchronizing signal transmission circuit, where a skew brings a problem, not only the electric lengths of wiring layers arranged in the respective wiring boards but also those of through holes are equally wired in respective wirings.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board on which high-frequency transmission circuit wiring such as a bus wiring circuit and a synchronous signal transmission circuit is formed.

[0002]

2. Description of the Related Art Conventionally, a multilayer printed circuit wiring board on which high-frequency transmission circuit wiring such as a bus wiring circuit or a synchronous signal transmission circuit is formed, which has a problem of skew, is formed by laminating a plurality of wiring boards having wiring layers. In addition, the wiring is formed by connecting the wiring layers by the through holes provided between the wiring boards.

When transmitting at least two signals from the first position side to the second position side on this multilayer printed circuit wiring board, avoid the wiring prohibited area, and in each signal transmission, the electric power of the wiring layer portion is changed. Wiring length (hereinafter referred to as electrical length)
Only, or the electrical length of the through-hole portion is virtually included in the electrical length of the wiring layer portion so that the electrical length is equal in each signal transmission.

FIG. 5 is a perspective view showing the structure of a conventional multilayer printed circuit wiring board example.

The first wiring from the first connection point P1 to the second connection point P2 is the wiring layer 2 on the first wiring board 1a.
a, 2b, 2c, 3a, 3b on the second wiring board 1b,
And through the through holes 5a, 5b, 5c and 5d. The second wiring from the first connection point P3 to the second connection point P4 includes wiring layers 2d and 2e on the first wiring board 1a, 3c on the second wiring board 1b, and through holes. Wiring is provided through 5e and 5f. 8
Reference character a is a wiring prohibited area on the wiring board.

Here, the wiring length (L1 + L3 + L5) of the first wiring from the first connection point P1 to the second connection point P2 on the first wiring board 1a and on the second wiring board 1b. The total length with the wiring length (L2 + L4) is (L1 + L2 + L3
+ L4 + L5). In addition, the first wiring board 1 of the second wiring from the first connection point P3 to the second connection point P4
The total length of the wiring length on (a) (L6 + L8) and the wiring length on the second wiring board 1b (L7) is (L6 + L7 + L8).

The total length of the first wiring (L1 +
L2 + L3 + L4 + L5) and the total length of the second wiring (L
6 + L7 + L8) are equal to each other.

[0008]

However, in the above-mentioned conventional wiring method for a multilayer printed circuit wiring board, the electrical lengths of the respective wiring layers are not equal, and as a result, the electrical variation of the wiring layers results in the electrical wiring of all wirings. There is an error in the length.

Further, the length of the through hole used for each wiring is not taken into consideration in the electric length, and as a result, an error in the electric length occurs in the through hole portion, and this error is caused by the bus wiring circuit and the synchronization. In the wiring of a high frequency transmission circuit such as a signal transmission circuit, there is a drawback that it becomes a problem of skew.

In view of the above-mentioned conventional problems, it is an object of the present invention to provide a multilayer wiring board or the like which can minimize the error in electrical length.

[0011]

In order to achieve the above object, according to the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission wiring such as bus wiring and synchronous signal transmission are laminated, and Wiring is formed by connecting the wiring layers by through holes installed between the wiring boards,
In the multilayer wiring board having the first wiring from the first connection point to the second connection point and the second wiring from the corresponding third connection point to the fourth connection point as the wiring The wiring layer is formed so that the electric wiring lengths of the first and second wirings on the wiring boards are equal to each other, and the number of the through holes is the first wiring board for each wiring board. And the second wirings are formed so as to be equal to each other.

According to the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission wiring such as bus wiring and synchronous signal transmission are stacked, and the wiring layers are provided by through holes provided between the wiring boards. To form a wiring, and as the wiring, a first wiring from the first connection point to the second connection point and a corresponding third wiring from the third connection point to the fourth connection point In a multilayer wiring board having two wirings, a total length of electric wiring lengths on all wiring boards in the first wiring and a total length of electric wiring lengths on all wiring boards in the second wiring, and And the wiring layer is formed so that the number of through holes is the same, and the number of the through holes is equal in the first and second wirings between the wiring boards.

According to the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission wiring such as bus wiring and synchronous signal transmission are laminated, and the wiring layers are provided by through holes provided between the wiring boards. To form a wiring, and as the wiring, a first wiring from the first connection point to the second connection point and a corresponding third wiring from the third connection point to the fourth connection point In a multilayer wiring board having two wirings, a total length of electric wiring lengths on all wiring boards in the first wiring and a total length of electric wiring lengths on all wiring boards in the second wiring, and And the wiring layer is formed such that the total length of the through holes in the first wiring and the total length of the through holes in the second wiring are equal to each other.

According to the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wiring such as bus wiring and synchronous signal transmission circuit are laminated, and the through-holes are provided between the wiring boards to form the wiring board. A circuit wiring is formed by connecting wiring layers, and as the circuit wiring, in a multilayer wiring board having a plurality of circuit wirings of two circuit wirings or more,
The wiring layers are formed such that the electric wiring lengths of the circuit wirings on the wiring boards are equal to each other, and the number of the through holes installed is equal on each of the wiring boards between the wiring boards. It is characterized in that it is formed as described above.

In the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wiring, such as bus wiring and synchronous signal transmission circuit, are stacked, and the through holes are provided between the wiring boards. A circuit wiring is formed by connecting wiring layers, and as the circuit wiring, in a multilayer wiring board having a plurality of circuit wirings of two circuit wirings or more,
The wiring layers are formed so that the total electrical wiring lengths on all the wiring boards in each of the circuit wirings are equal to each other, and the number of the through holes is set in each of the circuit wirings between the wiring boards. The feature is that they are formed to be equal to each other.

In the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wirings such as bus wirings and synchronous signal transmission circuits are laminated, and the through-holes are provided between the wiring boards to form the wiring board. A circuit wiring is formed by connecting wiring layers, and as the circuit wiring, in a multilayer wiring board having a plurality of circuit wirings of two circuit wirings or more,
The wiring layer was formed so that the total length of the electric wirings on all the wiring boards in each of the circuit wirings was equal, and the total length of the through holes in each of the circuit wirings was also equal. It is characterized by

In the method for wiring a multilayer wiring board according to the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission wiring for bus wiring, synchronous signal transmission, etc. are laminated and placed between the wiring boards. In a multi-layer wiring substrate in which wiring is formed by connecting the wiring layers by through holes, as the wiring, a first wiring from a first connection point to a second connection point and a third wiring corresponding thereto When wiring the second wiring from the connection point to the fourth connection point, the electrical wiring lengths of the first and second wirings on each wiring board are equalized, and the through wiring is provided. The number of holes to be installed is made equal in the first and second wirings between the wiring boards, and the electrical wiring lengths of the through holes in the first and second wirings are made equal. And

In the method for wiring a multilayer wiring board according to the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission wiring for bus wiring, synchronous signal transmission, etc. are laminated and placed between the wiring boards. In a multi-layer wiring substrate in which wiring is formed by connecting the wiring layers by through holes, as the wiring, a first wiring from a first connection point to a second connection point and a third wiring corresponding thereto When wiring the second wiring from the connection point to the fourth connection point, the total length of the electrical wiring length on all the wiring boards in the first wiring and all of the second wiring The total length of the electrical wiring on the wiring board is made equal, and the number of the through holes is set to be equal in the first wiring and the second wiring for each wiring board. And the wiring in the second wiring Characterized in that the equal electrical wiring length Horu.

In the method for wiring a multilayer wiring board of the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission wiring such as bus wiring and synchronous signal transmission are laminated and placed between the wiring boards. In a multi-layer wiring substrate in which wiring is formed by connecting the wiring layers by through holes, as the wiring, a first wiring from a first connection point to a second connection point and a third wiring corresponding thereto When wiring the second wiring from the connection point to the fourth connection point, the total length of the electrical wiring length on all the wiring boards in the first wiring and all of the second wiring The total length of the electrical wiring on the wiring board is made equal, and the total length of the through holes in the first wiring is made equal to the total length of the through holes in the second wiring, First and above Characterized in that the equal electrical wiring length of the through hole in the second wiring.

In the method for wiring a multilayer wiring board of the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wiring such as bus wiring and synchronous signal transmission circuit are laminated, and between the wiring boards. In a multilayer wiring board in which circuit wiring is formed by connecting the wiring layers by installed through holes, when wiring a plurality of circuit wirings of two circuit wirings or more as the circuit wiring, The electrical wiring lengths of the circuit wirings are made equal to each other, and the number of the through holes installed is made equal to each of the circuit wirings between the wiring boards. It is characterized in that the target wiring lengths are made equal.

In the multi-layer wiring board wiring method of the present invention, a plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wiring such as bus wiring and synchronous signal transmission circuit are laminated, and between the wiring boards. In a multilayer wiring board in which circuit wirings are formed by connecting the wiring layers by installed through holes, when wiring a plurality of circuit wirings of two circuit wirings or more as the circuit wirings, in each of the circuit wirings The total length of electrical wiring on all wiring boards is made equal, and the number of the through holes installed is made equal in each circuit wiring between the wiring boards. It is characterized in that the electrical wiring lengths of the holes are made equal.

In the method for wiring a multilayer wiring board according to the present invention, a plurality of wiring boards having a wiring layer provided with high-frequency transmission circuit wiring such as bus wiring and synchronous signal transmission circuit are laminated, and between the wiring boards. In a multilayer wiring board in which circuit wirings are formed by connecting the wiring layers by installed through holes, when wiring a plurality of circuit wirings of two circuit wirings or more as the circuit wirings, in each of the circuit wirings The total length of the electrical wiring on all the wiring boards is made equal, the total length of the through holes in each of the circuit wirings is made equal, and the electrical wiring length of the through hole in each of the circuit wirings is made equal. Characterized by equalization.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

[First Embodiment] FIG. 1 is a perspective view showing the structure of a multilayer printed circuit wiring board according to a first embodiment of the present invention.

In the multilayer printed circuit wiring board of this embodiment, the first wiring from the first connection point P1 to the second connection point P2 is the wiring layers 2a, 2b on the first wiring board 1a.
2c, the wiring layers 3a and 3b on the second wiring board 1b,
Wiring is performed through the through holes 5a, 5b, 5c and 5d. Also, from the first connection point P3 to the second connection point P
The second wirings up to 4 are the wiring layers 2d, 2e, 2f on the first wiring board 1a and the wiring layer 3 on the second wiring board 1b.
c, 3d and through holes 5e, 5f, 5g, 5h. Note that 8a and 8b are wiring prohibited areas on each wiring board.

At this time, the wiring length (L1 + L3 + L5) of the first wiring from the first connection point P1 to the second connection point P2 on the first wiring board 1a and the first connection point P3 to The second wirings reaching the second connection point P4 are arranged such that the wiring length (L6 + L8 + L10) on the first wiring board 1a is equal. Similarly, the wiring length of the first wiring on the second wiring board 1b (L2 + L4) and the wiring length of the second wiring on the second wiring board 1b (L7 + L9) are equalized. ing.

Further, considering the length of the through hole,
Through holes 5a, 5b, 5 used for the first wiring
Corresponding to c and 5d, through holes 5e, 5f, 5g and 5h are also arranged in the second wiring.

Further, it is assumed that the wirings are made of the same material, the same thickness and the same width, and the through holes are also made of the same material and the same diameter.

As described above, in this embodiment, the first wiring from the first connection point P1 to the second connection point P2 and the second wiring from the first connection point P3 to the second connection point P4. Wiring,
Equalize the electrical wiring length on each wiring board,
Furthermore, since the number of through holes is equalized, the skew in the high-frequency transmission circuit wiring such as the bus wiring circuit and the synchronous signal transmission circuit can be reduced.

[Second Embodiment] FIG. 2 is a perspective view showing the structure of a multilayer printed circuit wiring board according to a second embodiment of the present invention.

The multilayer printed circuit wiring board of this embodiment has three layers of wiring, and the first wiring from the first connection point P1 to the second connection point P2 is the first wiring board 1.
wiring layer 2a, 2b, 2c on a and the second wiring substrate 1b
The upper wiring layers 3a and 3b and the wiring layer 4 on the third wiring substrate 1c
Through hole 5 between a and 4b and the first and second wiring boards
Through holes 6 between a and 5b and the second and third wiring boards
a, 6b and through hole 7 between the first and third wiring boards
It is wired through a and 7b.

The second wiring from the first connection point P3 to the second connection point P4 is the wiring layer 2 on the first wiring board 1a.
d, 2e, 2f and 3c, 3d on the second wiring board 1b
Wiring layers 4c and 4d on the third wiring board 1c, through holes 5c and 5d between the first and second wiring boards, and through holes 6c and 6d between the second and third wiring boards. , Through the through holes 7c and 7d between the first and third wiring boards. Note that 8a, 8b, and 8c are wiring prohibited areas on each wiring board.

Similar to the first embodiment, the wiring length (L1 + L5 + L7) of the first wiring from the first connection point P1 to the second connection point P2 on the first wiring board 1a, and the first wiring Wiring length (L8 + L10 + L) of the second wiring from the connection point P3 to the second connection point P4 on the first wiring board 1a.
14) are wired so as to be equal to.

Similarly, the first wiring, the second wiring substrate 1
The wiring length (L2 + L4) on b and the wiring length (L11 + L13) on the second wiring board 1b of the second wiring are equal, and the wiring length of the first wiring on the third wiring board 1c is the same. The wiring length (L3 + L6) of the second wiring is also equal to the wiring length (L9 + L12) of the second wiring on the third wiring board 1c. Further, in consideration of the length of the through hole and the installation location, the through hole 5 of the first wiring, which is used between the first wiring board 1a and the second wiring board 1b.
Corresponding to a and 5b, the first wiring board 1 of the second wiring
Through holes 5c and 5d are arranged between a and the second wiring board 1b. Similarly, corresponding to the through holes 6a and 6b used between the second wiring board 1b and the third wiring board 1c of the first wiring, the second wiring board 1b of the second wiring is provided. Through hole 6 between the third wiring board 1c and
c, 6d are arranged, and the first wiring substrate 1 of the first wiring
a corresponding to the through holes 7a and 7b used between the third wiring board 1c and the third wiring board 1c, the through holes 7c and 7 between the first wiring board 1a and the third wiring board 1c of the second wiring are provided.
d is arranged.

Further, it is assumed that the wirings are made of the same material, the same thickness and the same width, and the through holes are also made of the same material and the same diameter.

As described above, in this embodiment, the first wiring from the first connection point P1 to the second connection point P2 and the second wiring from the first connection point P3 to the second connection point P4. Wiring,
Equalize the electrical wiring length on each wiring board,
Further, since the number of through-holes installed between the wiring boards is made equal, the skew in the high frequency transmission circuit wiring such as the bus wiring circuit and the synchronous signal transmission circuit can be reduced as in the first embodiment. .

[Third Embodiment] FIG. 3 is a perspective view showing the structure of a multilayer printed circuit wiring board according to a third embodiment of the present invention.

The multilayer printed circuit wiring board of this embodiment has three layers of wiring, and the first wiring from the first connection point P1 to the second connection point P2 is the first wiring board 1
wiring layer 2a, 2b, 2c on a and the second wiring substrate 1b
The upper wiring layers 3a and 3b and the wiring layer 4 on the third wiring substrate 1c
a, 4b and the through hole 5 between the first and second wiring boards
a, 5b and through hole 6 between the second and third wiring boards
a, 6b and through hole 7 between the first and third wiring boards
It is wired through a and 7b.

The second wiring from the first connection point P3 to the second connection point P4 is the wiring layer 2 on the first wiring board 1a.
d, 2e, 2f and the wiring layer 4 on the third wiring board 1c
c, 4d and through hole 7 between the first and third wiring boards
It is wired through c, 7d, and 7e. 8
Reference numerals a, 8b and 8c are wiring prohibited areas on each wiring board.

Here, the wiring length (L1 + L5 + L7) of the first wiring from the first connection point P1 to the second connection point P2 on the first wiring board 1a and on the second wiring board 1b. The total length (L1 + L2 + L3 + L4 +) of the wiring length (L2 + L4) and the wiring length (L3 + L6) on the third wiring board 1b.
L5 + L6 + L7) is the second wiring from the first connection point P3 to the second connection point P4, the wiring length (L8 + L10 + L12) on the first wiring board 1a, and the third wiring board 1
Total length (L8 + L10) of the wiring length (L9 + L11) on c
+ L12 + L9 + L11).

Regarding the through hole, the through hole 5a used between the first wiring board 1a and the second wiring board 1b of the first wiring is taken into consideration in consideration of the length of the through hole and the installation place. Corresponding to the through hole 6a used between the second wiring board 1b and the third wiring board 1c, the second wiring is passed between the first wiring board 1a and the third wiring board 1c. The hole 7c is arranged.

Further, the first wiring board 1 of the first wiring
a corresponding to the through hole 5b used between the second wiring board 1b and the second wiring board 1b and the through hole 6b used between the second wiring board 1b and the third wiring board 1c. A through hole 7d is arranged between the first wiring board 1a and the third wiring board 1c.

Also, the first wiring board 1a of the first wiring
Corresponding to the through holes 7a and 7b used between the third wiring board 1c and the third wiring board 1c, the through holes 7e and 7f of the second wiring are provided between the first wiring board 1a and the third wiring board 1c.
Are arranged.

Of course, each wiring is made of the same material, the same thickness and the same width, and the through holes are also made of the same material and the same diameter.

As described above, in this embodiment, the first wiring from the first connection point P1 to the second connection point P2 and the second wiring from the first connection point P3 to the second connection point P4. Wiring,
The total length of electrical wiring on each wiring board is set equal to each other, and further used for the first wiring and the second wiring.
Since the total length of the through holes is made equal, the skew in the high frequency transmission circuit wiring such as the bus wiring circuit and the synchronous signal transmission circuit can be reduced.

[Fourth Embodiment] FIG. 4 is a perspective view showing the structure of a multilayer printed circuit wiring board according to a fourth embodiment of the present invention.

The multilayer printed circuit wiring board of this embodiment has three layers of wiring, and the first wiring from the first connection point P1 to the second connection point P2 is the first wiring board 1
wiring layer 2a, 2b, 2c on a and the second wiring substrate 1b
The upper wiring layers 3a and 3b and the wiring layer 4 on the third wiring substrate 1c
a, 4b and the through hole 5 between the first and second wiring boards
a, 5b and through hole 6 between the second and third wiring boards
a, 6b and through hole 7 between the first and third wiring boards
It is wired through a and 7b.

The second wiring from the first connection point P3 to the second connection point P4 is the wiring layer 2 on the first wiring board 1a.
d, 2e, 2f, 2g, 2h, wiring layers 3c, 3d, 3e, 3f on the second wiring board 1b, and through holes 5c, 5d, 5e, 5f, 5g between the first and second wiring boards. 5,
It is wired through h, 5i, and 5j. In addition, 8a,
Wiring prohibited areas 8b and 8c are provided on the respective wiring boards.

Here, the wiring length (L1 + L5 + L7) of the first wiring from the first connection point P1 to the second connection point P2 on the first wiring board 1a and on the second wiring board 1b. The total length (L1 + L2 + L3 + L4 +) of the wiring length (L2 + L4) and the wiring length (L3 + L6) on the third wiring board 1b.
L5 + L6 + L7) is the wiring length (L8 + L10 + L12 + L14 + 16) on the first wiring board 1a and the wiring length on the second wiring board 1b of the second wiring from the first connection point P3 to the second connection point P4. (L9 + L11 + L13 +
L15) total length (L8 + L10 + L12 + L14 + 1
6 + L9 + L11 + L13 + L15).

Regarding the through holes, the through holes 5a and 5b used between the first wiring board 1a and the second wiring board 1b of the first wiring are taken into consideration in consideration of the length of the through holes. And through holes 6a and 6b used between the second wiring board 1b and the third wiring board 1c,
The first wiring board 1 of the second wiring is made to be equal to the total through hole length of the through holes 7a and 7b used between the first wiring board 1a and the third wiring board 1c.
through holes 5c, 5d between a and the second wiring board 1b,
5e, 5f, 5g, 5h, 5i, 5j are arranged.

At this time, the through hole used between the first wiring board 1a and the second wiring board 1b and the through hole used between the second wiring board 1b and the third wiring board 1c. The holes have the same material, the same diameter, and the same through hole length, and the through holes used between the first wiring board 1a and the third wiring board 1c have the same material and the same diameter.

Of course, each wiring is made of the same material, the same thickness and the same width.

As described above, in this embodiment, the first wiring from the first connection point P1 to the second connection point P2 and the second wiring from the first connection point P3 to the second connection point P4. Wiring,
The total length of electrical wiring on each wiring board is set equal to each other, and further used for the first wiring and the second wiring.
Since the total length of the through holes is made equal, the skew in the high frequency transmission circuit wiring such as the bus wiring circuit and the synchronous signal transmission circuit can be reduced.

In each of the above embodiments, only two circuit wirings (first wiring and second wiring) are described as the high frequency transmission line circuit wirings on the multilayer printed circuit wiring board. The same applies to a plurality of circuit wirings.

[0055]

As described in detail above, according to the multilayer wiring board of the present invention, not only the electrical length of each wiring layer but also the electrical length of each through hole is equalized in each wiring. It is possible to form the error of the electrical length in each wiring to the minimum without requiring special parts and without increasing the wiring area. For example, the skew in the high frequency transmission circuit wiring such as the bus wiring circuit or the synchronous signal transmission circuit can be reduced. It can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a structure of a multilayer printed circuit wiring board according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a structure of a multilayer printed circuit wiring board according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing a structure of a multilayer printed circuit wiring board according to a third embodiment of the present invention.

FIG. 4 is a perspective view showing a structure of a multilayer printed circuit wiring board according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view showing a structure of a conventional multilayer printed circuit wiring board example.

[Explanation of symbols]

1a, 1b, 1c wiring board 2a to 2h, 3a to 3f, 4a to 4d wiring layers 5a to 5j, 6a to 6d, 7a to 7f Through hole 8a, 8b, 8c Wiring prohibited area P1 to P4 connection points L1 to L16 wiring length

Claims (17)

[Claims] 1. A plurality of wiring boards having a wiring layer provided with high-frequency transmission wiring such as bus wiring and synchronous signal transmission are stacked, and the wiring layers are connected by through holes provided between the wiring boards. Wiring is constituted by, as the wiring, the first wiring from the first connection point to the second connection point, and the second wiring from the corresponding third connection point to the fourth connection point In a multilayer wiring board having wiring, the wiring layer is formed so that the electrical wiring lengths of the first and second wirings on each wiring board are equal, and the number of through holes installed is the wiring. A multilayer wiring board, wherein the first wiring and the second wiring are formed so as to be the same between the boards. 2. A plurality of wiring boards having wiring layers are laminated, and wirings are formed by connecting the wiring layers by through holes provided between the wiring boards, and the wirings are first connection points. From the first wiring to the second connection point, and a multilayer wiring board having a second wiring corresponding to this from the third connection point to the fourth connection point, all of the first wiring The wiring layer is formed such that the total length of the electrical wiring on the wiring board and the total length of the electrical wiring on all the wiring boards in the second wiring are equal, and the through hole is provided. A multi-layer wiring board, characterized in that the first wiring and the second wiring are equal in number between the wiring boards. 3. A plurality of wiring boards having wiring layers are laminated, and wiring is formed by connecting the wiring layers by through holes provided between the wiring boards, and the wiring is constituted by a first connection point. From the first wiring to the second connection point, and a multilayer wiring board having a second wiring corresponding to this from the third connection point to the fourth connection point, all of the first wiring The wiring layer is formed so that the total length of the electrical wiring on the wiring board and the total length of the electrical wiring on all the wiring boards in the second wiring are equal, and the first wiring The multilayer wiring board is formed so that the total length of the through holes in and the total length of the through holes in the second wiring are equal. 4. The multilayer wiring board according to claim 1, wherein the wiring layers of the first and second wirings are formed to have the same material, width and thickness. 5. The multilayer wiring board according to claim 1, wherein the through holes in each of the wiring layers in the first and second wirings are made of the same material and have the same shape. 6. A plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wiring, such as bus wiring and a synchronous signal transmission circuit, are stacked, and the wiring layers are provided by through holes provided between the wiring boards. In the multilayer wiring board having a plurality of circuit wirings of two circuit wirings or more as the circuit wirings, the electric wiring lengths of the respective circuit wirings on the respective wiring boards are equal to each other. The multilayer wiring board is characterized in that the wiring layer is formed in such a manner that the number of through holes is equalized in each of the circuit wirings between the wiring boards. 7. A plurality of wiring boards having wiring layers are laminated, and circuit wiring is configured by connecting the wiring layers by through holes provided between the wiring boards, and two circuit wirings are formed as the circuit wirings. In the multilayer wiring board having a plurality of circuit wirings described above, the wiring layer is formed so that the total length of the electrical wirings on all the wiring boards in each of the circuit wirings is equal, and the through hole is installed. A multilayer wiring board, wherein the number of wirings is formed so as to be equal in each of the circuit wirings between the wiring boards. 8. A plurality of wiring boards having wiring layers are stacked, and circuit wiring is configured by connecting the wiring layers by through holes provided between the wiring boards, and two circuit wirings are provided as the circuit wirings. In the multilayer wiring board having a plurality of circuit wirings described above, the wiring layers are formed so that the total electrical wiring lengths on all the wiring boards in the respective circuit wirings are equal, and the respective circuit wirings are formed. The multilayer wiring board is formed so that the total lengths of the through holes in are equal. 9. The multilayer wiring board according to claim 6, wherein the respective wiring layers of the respective circuit wirings are formed to have the same material, width and thickness. 10. The multilayer wiring board according to claim 6, wherein the through holes in each wiring layer in each of the circuit wirings are formed to have the same material and shape. 11. The multilayer wiring board according to claim 6, wherein the circuit wiring is a circuit wiring for a high frequency transmission circuit. 12. A plurality of wiring boards having a wiring layer provided with high-frequency transmission wiring such as bus wiring and synchronous signal transmission are stacked, and the wiring layers are connected by through holes provided between the wiring boards. In the multilayer wiring board in which the wiring is formed, as the wiring, the first wiring from the first connection point to the second connection point and the corresponding third connection point to the fourth connection point When the second wiring leading to the wiring board is wired, the electrical wiring lengths of the first wiring and the second wiring on each wiring board are equalized, and the number of the through holes is set between the wiring boards. A wiring method for a multilayer wiring board, characterized in that the electrical wiring lengths of the through holes in the first and second wirings are made equal to each other so that the first wiring and the second wiring become equal. 13. A plurality of wiring boards having a wiring layer provided with high-frequency transmission wiring such as bus wiring and synchronous signal transmission are stacked, and the wiring layers are connected by through holes provided between the wiring boards. In the multilayer wiring board in which the wiring is formed, as the wiring, the first wiring from the first connection point to the second connection point and the corresponding third connection point to the fourth connection point When wiring the second wiring leading to, the total length of the electrical wiring length on all the wiring boards in the first wiring and the electrical wiring length on all the wiring boards in the second wiring Through holes in the first and second wirings so that the total length is equal and the number of the through holes is equalized between the wiring boards in the first and second wirings. Equal electrical wiring length A wiring method for a multilayer wiring board, characterized in that. 14. A plurality of wiring boards having a wiring layer provided with high-frequency transmission wiring such as bus wiring and synchronous signal transmission are stacked, and the wiring layers are connected by through holes provided between the wiring boards. In the multilayer wiring board in which the wiring is formed, as the wiring, the first wiring from the first connection point to the second connection point and the corresponding third connection point to the fourth connection point When wiring the second wiring leading to, the total length of the electrical wiring length on all the wiring boards in the first wiring and the electrical wiring length on all the wiring boards in the second wiring The total length is equal to each other, the total length of the through holes in the first wiring and the total length of the through holes in the second wiring are equal to each other, and Through hole A wiring method for a multilayer wiring board, characterized in that electrical wiring lengths are made equal. 15. A bus wiring, a synchronous signal transmission circuit, etc.,
In a multi-layer wiring board in which a plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wiring are laminated, and circuit wiring is formed by connecting the wiring layers by through holes provided between the wiring boards, As the circuit wiring, when wiring a plurality of circuit wirings of two circuit wirings or more, the electrical wiring length of each of the circuit wirings on each of the wiring boards is equalized, the number of the through holes installed is the A wiring method for a multilayer wiring board, characterized in that the circuit wirings are made equal to each other between the wiring boards, and the electrical wiring lengths of the through holes in the circuit wirings are made equal. 16. A bus wiring and a synchronous signal transmission circuit,
In a multi-layer wiring board in which a plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wiring are laminated, and circuit wiring is formed by connecting the wiring layers by through holes provided between the wiring boards, As the circuit wiring, when wiring a plurality of circuit wirings of two circuit wirings or more, the total length of the electric wirings on all wiring boards in each circuit wiring is made equal, and the through hole is installed. A wiring method for a multilayer wiring board, characterized in that the number of wiring boards is made equal to each other in each of the wiring boards, and the electrical wiring lengths of the through holes in each of the circuit wirings are made equal. 17. A bus wiring and a synchronous signal transmission circuit,
In a multi-layer wiring board in which a plurality of wiring boards having wiring layers provided with high-frequency transmission circuit wiring are laminated, and circuit wiring is formed by connecting the wiring layers by through holes provided between the wiring boards, As the circuit wiring, when wiring a plurality of circuit wirings of two or more circuit wirings, the total length of the electric wirings on all wiring boards in each circuit wiring is made equal, The wiring method for a multilayer wiring board is characterized in that the total length of the through holes in each of the circuit wirings is made equal, and the electrical wiring lengths of the through holes in each of the circuit wirings are made equal.