JP2003115456A5 - - Google Patents
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- Publication number
- JP2003115456A5 JP2003115456A5 JP2001310766A JP2001310766A JP2003115456A5 JP 2003115456 A5 JP2003115456 A5 JP 2003115456A5 JP 2001310766 A JP2001310766 A JP 2001310766A JP 2001310766 A JP2001310766 A JP 2001310766A JP 2003115456 A5 JP2003115456 A5 JP 2003115456A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacturing
- laser
- film
- semiconductor film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 36
- 238000000034 method Methods 0.000 claims 22
- 238000004519 manufacturing process Methods 0.000 claims 17
- 238000010438 heat treatment Methods 0.000 claims 9
- 238000000137 annealing Methods 0.000 claims 3
- 230000004888 barrier function Effects 0.000 claims 3
- 239000010410 layer Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000012535 impurity Substances 0.000 claims 2
- 229910017109 AlON Inorganic materials 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 238000005224 laser annealing Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000010979 ruby Substances 0.000 claims 1
- 229910001750 ruby Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001310766A JP2003115456A (ja) | 2001-10-05 | 2001-10-05 | 半導体装置の作製方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001310766A JP2003115456A (ja) | 2001-10-05 | 2001-10-05 | 半導体装置の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003115456A JP2003115456A (ja) | 2003-04-18 |
| JP2003115456A5 true JP2003115456A5 (enExample) | 2005-06-23 |
Family
ID=19129692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001310766A Withdrawn JP2003115456A (ja) | 2001-10-05 | 2001-10-05 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003115456A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4529414B2 (ja) * | 2003-10-29 | 2010-08-25 | セイコーエプソン株式会社 | 電気光学装置用基板の製造方法 |
| WO2005066920A1 (ja) * | 2003-12-26 | 2005-07-21 | Matsushita Electric Industrial Co., Ltd. | 表示装置 |
| JP2008004666A (ja) * | 2006-06-21 | 2008-01-10 | Ftl:Kk | ３次元半導体デバイスの製造方法 |
-
2001
- 2001-10-05 JP JP2001310766A patent/JP2003115456A/ja not_active Withdrawn
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