JP2003112965A - Low temperature burned ceramic material, and low temperature burned ceramic substrate - Google Patents

Low temperature burned ceramic material, and low temperature burned ceramic substrate

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Publication number
JP2003112965A
JP2003112965A JP2001306733A JP2001306733A JP2003112965A JP 2003112965 A JP2003112965 A JP 2003112965A JP 2001306733 A JP2001306733 A JP 2001306733A JP 2001306733 A JP2001306733 A JP 2001306733A JP 2003112965 A JP2003112965 A JP 2003112965A
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JP
Japan
Prior art keywords
weight
low temperature
fired ceramic
temperature fired
glass powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001306733A
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Japanese (ja)
Other versions
JP4066631B2 (en
Inventor
Kazunori Akaho
和則 赤穂
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Sumitomo Metal SMI Electronics Device Inc
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Sumitomo Metal SMI Electronics Device Inc
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Abstract

PROBLEM TO BE SOLVED: To allow a low temperature burned ceramic substrate to deal with the increase of frequencies, and to impart substrate strength required for securing reliability thereto by increasing its Qf value. SOLUTION: The low temperature burned ceramic material forming green sheets 11a, 11b and 11c is obtained by mixing a 35 to 40 wt.% filler essentially cosisting of Al2 O3 (alumina) and 60 to 65 wt.% SiO2 -CaO-B2 O3 -Al2 O3 based glass powder. The filler contains 0.5 to 2.0 wt.% BaO and 33 to 39.5 wt.% Al2 O3 to the total weight of the low temperature burned ceramic material. The glass powder contains 45 to 55 wt.% SiO2 , 15 to 21 wt.% CaO, 6.5 to 7.7 wt.% B2 O3 , 4.2 to 5.1 wt.% Al2 O3 , 6.4 to 18 wt.% BaO, 1.5 to 2.5 wt.% ZnO, and 2 to 4 wt.% SnO2 with impurities of <=2 wt.%.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、SiO2 −CaO
−B2 3 −Al2 3 系のガラス粉末を含む低温焼成
セラミック材料及び低温焼成セラミック基板に関するも
のである。
TECHNICAL FIELD The present invention relates to SiO 2 -CaO.
It relates low-temperature fired ceramic material and the low-temperature fired ceramic substrate including a glass powder -B 2 O 3 -Al 2 O 3 system.

【0002】[0002]

【従来の技術】従来より、セラミック基板として最も多
く用いられているアルミナ基板は、誘電率が高く、しか
も、1500℃以上の高温で焼成する必要があるため、
同時焼成する配線導体としてMo,W等の抵抗値の高い
高融点金属を使用せざるを得ない。このため、近年の信
号処理の高速化・高周波化の要求に対して、アルミナ基
板ではパッケージ設計が困難になってきている。
2. Description of the Related Art Conventionally, the most widely used ceramic substrate is an alumina substrate, which has a high dielectric constant and needs to be fired at a high temperature of 1500 ° C. or higher.
It is unavoidable to use a refractory metal having a high resistance value such as Mo or W as a wiring conductor to be co-fired. For this reason, in response to the recent demand for high-speed and high-frequency signal processing, it has become difficult to design a package on an alumina substrate.

【0003】このような事情から、近年、800〜10
00℃で焼成可能な低温焼成セラミック基板の需要が急
速に拡大している。この低温焼成セラミック基板は、同
時焼成する配線導体として、Ag、Ag−Pd、Au、
Cu等の低抵抗導体の使用が可能で、且つ、セラミック
の誘電率が低く、信号処理の高速化・高周波化に対応で
きるという特長がある。
Under these circumstances, in recent years, 800 to 10
The demand for low-temperature fired ceramic substrates that can be fired at 00 ° C is rapidly expanding. This low-temperature fired ceramic substrate is used as a wiring conductor that is fired at the same time as Ag, Ag-Pd, Au,
It is possible to use low resistance conductors such as Cu, and has the characteristic that the dielectric constant of ceramics is low and that it can handle high-speed and high-frequency signal processing.

【0004】現在、開発又は実用化されている低温焼成
セラミック材料は、結晶化ガラス系や非ガラス系といっ
た単一組成のものもあるが、多くは、ガラスと骨材(結
晶質フィラー)との混合物からなるガラス複合系のもの
である。このガラス複合系の低温焼成セラミック材料と
しては、例えばSiO2 −CaO−B2 3 −Al2
3 系のガラス粉末とAl2 3 粉末(アルミナ粉末)と
の混合物がある。
At present, low-temperature fired ceramic materials which have been developed or put into practical use include those having a single composition such as crystallized glass type and non-glass type, but in many cases, glass and aggregate (crystalline filler) are used. It is a glass composite system composed of a mixture. Examples of the glass composite low-temperature fired ceramic material include SiO 2 —CaO—B 2 O 3 —Al 2 O.
There is a mixture of 3 type glass powder and Al 2 O 3 powder (alumina powder).

【0005】[0005]

【発明が解決しようとする課題】ところで、信号処理の
高速化・高周波化への適応性を表す指標としてQf値が
あり、このQf値が高いほど、高速化・高周波化への対
応が容易である。上述した従来のガラス複合系の低温焼
成セラミック材料は、Qf値が2000GHz程度であ
るが、最近の目覚ましく発展する高速化・高周波化に対
応するためには、3000GHz以上の高いQf値を持
つ低温焼成セラミック材料を新たに開発する必要があ
る。また、低温焼成セラミック基板とチップとの接続信
頼性等を確保するためには、低温焼成セラミック基板の
抗折強度等の機械的強度を確保する必要がある。
By the way, there is a Qf value as an index showing the adaptability to high speed / high frequency of signal processing. The higher this Qf value, the easier it is to cope with high speed / high frequency. is there. The above-mentioned conventional glass-composite low-temperature firing ceramic material has a Qf value of about 2000 GHz, but in order to cope with the recent remarkable development of high speed and high frequency, low temperature firing with a high Qf value of 3000 GHz or more. It is necessary to develop new ceramic materials. Further, in order to secure the connection reliability between the low temperature fired ceramic substrate and the chip, it is necessary to secure the mechanical strength such as the bending strength of the low temperature fired ceramic substrate.

【0006】本発明はこのような事情を考慮してなされ
たものであり、従ってその目的は、従来より高いQf値
と信頼性確保に必要な基板強度を兼ね備えた低温焼成セ
ラミック材料及び低温焼成セラミック基板を提供するこ
とにある。
The present invention has been made in view of the above circumstances, and an object thereof is to provide a low-temperature fired ceramic material and a low-temperature fired ceramic which have both a higher Qf value and a substrate strength required for ensuring reliability than ever before. To provide a substrate.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明の請求項1に記載の低温焼成セラミック材料
は、Al2 3 (アルミナ)を主成分とする骨材:35
〜40重量%と、SiO2 −CaO−B2 3 −Al2
3 系のガラス粉末:60〜65重量%とを混合した低
温焼成セラミック材料であり、その骨材は、低温焼成セ
ラミック材料総重量に対して、BaOを0.5〜2.0
重量%含有し、前記ガラス粉末は、該ガラス粉末総重量
に対して、BaOを6.4〜18重量%含有することを
特徴とするものである。つまり、骨材とガラス粉末との
両方に適量のBaOを添加したところに特徴がある。B
aOを添加して作製したBaO−SiO2 −CaO−B
23 −Al2 3 系のガラス粉末は、焼成工程で結晶
化すると、Qf値が高くなる特性がある。更に、骨材に
BaOを添加すると、焼成工程で、上記のBaO−Si
2 −CaO−B2 3 −Al2 3 系のガラスの結晶
が析出しやすくなり、そのガラス析出量が増加する傾向
がある。これにより、低温焼成セラミック材料のQf値
を3000GHz以上に高めることができる。
In order to achieve the above object, the low temperature fired ceramic material according to claim 1 of the present invention is an aggregate mainly composed of Al 2 O 3 (alumina): 35
And 40 wt%, SiO 2 -CaO-B 2 O 3 -Al 2
O 3 -based glass powder: a low-temperature fired ceramic material mixed with 60 to 65% by weight, and its aggregate is 0.5 to 2.0 BaO based on the total weight of the low-temperature fired ceramic material.
% By weight, and the glass powder contains 6.4 to 18% by weight of BaO with respect to the total weight of the glass powder. That is, it is characterized in that an appropriate amount of BaO is added to both the aggregate and the glass powder. B
It was prepared by adding the aO BaO-SiO 2 -CaO-B
The 2 O 3 —Al 2 O 3 -based glass powder has a characteristic that the Qf value increases when crystallized in the firing process. Furthermore, when BaO is added to the aggregate, the above-mentioned BaO-Si is added in the firing step.
Crystals of O 2 —CaO—B 2 O 3 —Al 2 O 3 type glass are likely to be deposited, and the glass deposition amount tends to increase. As a result, the Qf value of the low temperature fired ceramic material can be increased to 3000 GHz or higher.

【0008】この場合、骨材のBaO添加量が0.5重
量%よりも少ないと、添加効果が少なく、ガラス析出量
が少ない。反対に、骨材のBaO添加量が2.0重量%
よりも多いと、後述する試験結果から、抗折強度が低下
することが判明している。従って、骨材のBaO添加量
の適正範囲は、0.5〜2.0重量%と考えられる。
In this case, if the amount of BaO added to the aggregate is less than 0.5% by weight, the effect of addition is small and the amount of glass deposited is small. On the contrary, the added amount of BaO in the aggregate is 2.0% by weight.
It has been found from the test results described below that the bending strength decreases when the amount is larger than the above. Therefore, the appropriate range of the amount of BaO added to the aggregate is considered to be 0.5 to 2.0% by weight.

【0009】また、ガラス粉末のBaO添加量が6.4
重量%よりも少ないと、BaOの添加効果が少なく、Q
f値の向上幅が少ない。反対に、ガラス粉末のBaO添
加量が18重量%よりも多いと、ガラス化しにくくな
る。従って、ガラス粉末のBaO添加量の適正範囲は、
6.4〜18重量%と考えられる。
Further, the amount of BaO added to the glass powder is 6.4.
If it is less than wt%, the effect of adding BaO is small and Q
Little improvement in f value. On the contrary, if the amount of BaO added to the glass powder is more than 18% by weight, vitrification becomes difficult. Therefore, the proper range of the amount of BaO added to the glass powder is
It is considered to be 6.4 to 18% by weight.

【0010】また、低温焼成セラミック材料中の骨材が
35重量%よりも少ないと(ガラス粉末が65重量%よ
りも多いと)、骨材が不足して、抗折強度が弱くなり、
反対に、骨材が40重量%よりも多いと(ガラス粉末が
60重量%よりも少ないと)、ガラスが不足して、焼結
不良が発生する可能性がある。従って、骨材を35〜4
0重量%とし、BaO−SiO2 −CaO−B2 3
Al2 3 系のガラス粉末を60〜65重量%とすれ
ば、実用に耐え得る抗折強度と焼結性とを確保すること
ができる。
Further, when the amount of aggregate in the low temperature fired ceramic material is less than 35% by weight (when the glass powder is more than 65% by weight), the aggregate is insufficient and the transverse strength is weakened.
On the other hand, if the amount of aggregate is more than 40% by weight (the amount of glass powder is less than 60% by weight), there is a possibility of insufficient glass and sintering failure. Therefore, the aggregate is
And 0 wt%, BaO-SiO 2 -CaO- B 2 O 3 -
By setting the Al 2 O 3 -based glass powder to 60 to 65% by weight, it is possible to secure the bending strength and sinterability that can be practically used.

【0011】この場合、請求項2のように、ガラス粉末
は、該ガラス粉末総重量に対して、SiO2 :45〜5
5重量%、CaO:15〜21重量%、B2 3 :6.
5〜7.7重量%、Al2 3 :4.2〜5.1重量
%、BaO:6.4〜18重量%、ZnO:1.5〜
2.5重量%、SnO2 :2〜4重量%、不純物:2重
量%以下を含有する組成とするとすると良い。つまり、
ガラス原料に、BaOの他に、適量のZnOとSnO2
を添加して作ったBaO−SiO2 −CaO−B23
−Al2 3 −ZnO−SnO2 系のガラスは、ZnO
を添加しないガラスと比較して、Qf値が高くなると共
に、ZnOがガラスの融点を低下させる役割を果たす。
また、ガラス粉末を製造する際に、SnO2 を添加する
と、SnO2を添加し無い場合と比較して、ガラスの融
点を30〜50℃低下させることができ、ガラス粉末の
製造が容易となる。
In this case, as in claim 2, the glass powder contains SiO 2 : 45 to 5 relative to the total weight of the glass powder.
5 wt%, CaO: 15 to 21 wt%, B 2 O 3: 6 .
5 to 7.7 wt%, Al 2 O 3: 4.2~5.1 wt%, BaO: 6.4~18 wt%, ZnO: 1.5 to
A composition containing 2.5 wt%, SnO 2 : 2 to 4 wt%, and impurities: 2 wt% or less is preferable. That is,
As a glass raw material, in addition to BaO, an appropriate amount of ZnO and SnO 2
The added made the BaO-SiO 2 -CaO-B 2 O 3
-Al 2 O 3 -ZnO-SnO 2 glass of, ZnO
As compared with the glass to which is not added, the Qf value becomes higher and ZnO plays a role of lowering the melting point of the glass.
In addition, when SnO 2 is added during the production of glass powder, the melting point of glass can be lowered by 30 to 50 ° C. as compared with the case where SnO 2 is not added, and the production of glass powder is facilitated. .

【0012】この場合、ガラス粉末中のZnOが1.5
重量%よりも少ないと、ガラスの融点が1400℃以上
となってしまう。反対に、ZnOが2.5重量%よりも
多いと、ガラス化しにくくなる。従って、ZnOを1.
5〜2.5重量%とすれば、ガラス融点を適度に下げて
ガラス化を容易にすることができる。
In this case, ZnO in the glass powder is 1.5
If it is less than wt%, the melting point of the glass will be 1400 ° C or higher. On the other hand, if ZnO is more than 2.5% by weight, vitrification becomes difficult. Therefore, ZnO
If it is 5 to 2.5% by weight, the glass melting point can be appropriately lowered to facilitate vitrification.

【0013】また、ガラス粉末中のSnO2 が2重量%
よりも少ないと、電気的特性が悪くなり、また、SnO
2 が4重量%よりも多いと、熱膨張が大きくなる。従っ
て、SnO2 を2〜4重量%とすれば、電気的特性、熱
膨張特性が良くなる。
Further, SnO 2 in the glass powder is 2% by weight.
If the amount is less than the above, the electrical characteristics deteriorate, and SnO
When 2 is more than 4% by weight, thermal expansion becomes large. Therefore, when SnO 2 is 2 to 4% by weight, the electrical characteristics and thermal expansion characteristics are improved.

【0014】また、ガラス粉末中のCaOが15重量%
よりも少ないと、nSiO2 ・CaO・Al2 3 系の
結晶の析出が少なくなり、必要な強度が得られない。反
対に、CaOが21重量%よりも多いと、ガラス融点が
低くなり過ぎる。従って、CaOを15〜21重量%と
すれば、高強度で適度に低いガラス融点とすることがで
きる。
Further, CaO in the glass powder is 15% by weight.
If the amount is less than the above, precipitation of nSiO 2 · CaO · Al 2 O 3 -based crystals is reduced, and the required strength cannot be obtained. On the other hand, when CaO is more than 21% by weight, the glass melting point becomes too low. Therefore, if CaO is 15 to 21% by weight, it is possible to obtain a glass having a high strength and an appropriately low glass melting point.

【0015】また、ガラス粉末中のSiO2 が45重量
%よりも少ないと、nSiO2 ・CaO系又はBaO・
SiO2 系の結晶の析出が少なくなり、必要な強度が得
られない。反対に、SiO2 が55重量%よりも多い
と、ガラス化しにくくなる。従って、SiO2 を45〜
55重量%とすれば、強度を確保しながら、ガラス化を
容易にすることができる。
If the SiO 2 content in the glass powder is less than 45% by weight, nSiO 2 .CaO system or BaO.
Precipitation of SiO 2 type crystals is reduced, and required strength cannot be obtained. On the contrary, if the SiO 2 content is more than 55% by weight, vitrification becomes difficult. Therefore, if SiO 2 is 45-
When it is 55% by weight, vitrification can be facilitated while ensuring strength.

【0016】一般に、SiO2 とCaOとBaOだけで
は、融点の高いガラスになるため、融点を低下させる添
加剤としてB2 3 を添加する必要がある。ガラス粉末
中のB2 3 が6.5重量%よりも少ないと、1400
℃以下ではガラス化しにくくなる。反対に、B2 3
7.7重量%よりも多いと、必要な強度が得られない。
従って、B2 3 が6.5〜7.7重量%とすれば、ガ
ラス融点を適度に下げながら、必要な強度を確保するこ
とができる。
In general, SiO 2 , CaO and BaO alone form a glass having a high melting point, so that it is necessary to add B 2 O 3 as an additive for lowering the melting point. If the B 2 O 3 content in the glass powder is less than 6.5% by weight, it will be 1400.
It becomes difficult to vitrify below ℃. On the contrary, if the B 2 O 3 content is more than 7.7% by weight, the required strength cannot be obtained.
Therefore, if the B 2 O 3 content is 6.5 to 7.7% by weight, it is possible to secure the required strength while appropriately lowering the glass melting point.

【0017】また、ガラス粉末中のAl2 3 は、ガラ
スの融点を下げる役割を果たすため、Al2 3 が4.
2重量%よりも少ないと、ガラスの融点が1400℃以
上となってしまう。反対に、Al2 3 が5.1重量%
よりも多いと、ガラス化しにくくなる。従って、Al2
3 が4.2〜5.1重量%とすれば、ガラス融点を適
度に下げてガラス化を容易にすることができる。
Further, Al 2 O 3 in the glass powder plays a role of lowering the melting point of the glass, so Al 2 O 3 is 4.
If it is less than 2% by weight, the melting point of glass will be 1400 ° C. or higher. On the contrary, Al 2 O 3 is 5.1% by weight
If it is more than that, vitrification becomes difficult. Therefore, Al 2
When O 3 is 4.2 to 5.1% by weight, the glass melting point can be appropriately lowered to facilitate vitrification.

【0018】また、請求項3のように、低温焼成セラミ
ック材料の骨材は、低温焼成セラミック材料総重量に対
してAl2 3 を33〜39.5重量%含有するように
すると良い。つまり、Al2 3 が33重量%よりも少
ないと、抗折強度が弱くなり、反対に、Al2 3 が3
9.5重量%よりも多いと、焼結不良が発生する。従っ
て、Al2 3 を33〜39.5重量%とすれば、実用
に耐え得る抗折強度と焼結性を確保することができる。
Further, as described in claim 3, the aggregate of the low temperature fired ceramic material preferably contains 33 to 39.5% by weight of Al 2 O 3 with respect to the total weight of the low temperature fired ceramic material. That is, if the Al 2 O 3 content is less than 33% by weight, the bending strength becomes weak, and conversely, the Al 2 O 3 content is 3 % or less.
If it is more than 9.5% by weight, sintering failure will occur. Therefore, if the Al 2 O 3 content is 33 to 39.5% by weight, it is possible to secure the bending strength and sinterability that can withstand practical use.

【0019】また、請求項4のように、上述した組成の
低温焼成セラミック材料を用いて形成したセラミック生
基板を800〜1000℃で焼成して低温焼成セラミッ
ク基板を製造するようにすると良い。これにより、最近
の高速化・高周波化に対応できる高いQf値と信頼性確
保に必要な基板強度を兼ね備えた高品質の低温焼成セラ
ミック基板を製造することができる。
Further, as described in claim 4, it is preferable that the low temperature fired ceramic substrate is manufactured by firing the ceramic raw substrate formed by using the low temperature fired ceramic material having the above composition at 800 to 1000 ° C. As a result, it is possible to manufacture a high-quality low-temperature fired ceramic substrate having both a high Qf value capable of coping with the recent increase in speed and frequency and a substrate strength necessary for ensuring reliability.

【0020】この場合、請求項5のように、低温焼成セ
ラミック基板の組成は、SiO2 :27〜35.8重量
%、CaO:9〜13.7重量%、B2 3 :3.9〜
5重量%、Al2 3 :36〜42.8重量%、Ba
O:4.3〜13.7重量%とすると良い。この低温焼
成セラミック基板の組成は、請求項1に記載の低温焼成
セラミック材料を用いて低温焼成セラミック基板を形成
した場合の低温焼成セラミック基板の組成の具体例であ
り、BaOの添加量(4.3〜13.7重量%)は、請
求項1の骨材とガラス粉末の両方に添加されたBaOを
合計した添加量に相当する。このBaOの添加により、
低温焼成セラミック基板のQf値を3000GHz以上
に高めることができる。
In this case, as in claim 5, the composition of the low temperature fired ceramic substrate is as follows: SiO 2 : 27 to 35.8 wt%, CaO: 9 to 13.7 wt%, B 2 O 3 : 3.9. ~
5 wt%, Al 2 O 3: 36~42.8 wt%, Ba
O: It is good to set it as 4.3-13.7 weight%. The composition of the low temperature fired ceramic substrate is a specific example of the composition of the low temperature fired ceramic substrate when the low temperature fired ceramic substrate is formed by using the low temperature fired ceramic material according to claim 1, and the addition amount of BaO (4. 3 to 13.7% by weight) corresponds to the total addition amount of BaO added to both the aggregate and the glass powder of claim 1. By adding this BaO,
The Qf value of the low temperature fired ceramic substrate can be increased to 3000 GHz or more.

【0021】更に、請求項6のように、上記組成の低温
焼成セラミック基板に、ZnO:0.9〜1.6重量
%、SnO2 :1.2〜2.6重量%を含有させるよう
にすると良い。この低温焼成セラミック基板の組成は、
請求項2に記載の低温焼成セラミック材料を用いて低温
焼成セラミック基板を形成した場合の低温焼成セラミッ
ク基板の組成に相当する。このように、低温焼成セラミ
ック基板に適量のZnOとSnO2 を添加することで、
低温焼成セラミック基板のQf値を更に高めることがで
きると共に、基板強度を高めることができる。
Further, according to claim 6, the low temperature fired ceramic substrate having the above composition contains ZnO: 0.9 to 1.6 wt% and SnO 2 : 1.2 to 2.6 wt%. Good to do. The composition of this low temperature fired ceramic substrate is
It corresponds to the composition of the low temperature fired ceramic substrate when the low temperature fired ceramic substrate is formed using the low temperature fired ceramic material according to claim 2. Thus, by adding an appropriate amount of ZnO and SnO 2 to the low temperature fired ceramic substrate,
The Qf value of the low temperature fired ceramic substrate can be further increased and the substrate strength can be increased.

【0022】また、請求項7のように、上記組成の低温
焼成セラミック基板と低融点金属の配線導体を同時焼成
するようにしても良い。これにより、基板内層又は表層
に低抵抗の電気的特性に優れた配線導体を有する高Qf
値の低温焼成セラミック基板を1回の焼成工程で製造す
ることができる。
Further, as in claim 7, the low temperature fired ceramic substrate of the above composition and the wiring conductor of the low melting point metal may be fired at the same time. As a result, a high Qf having a wiring conductor with low resistance and excellent electrical characteristics in the inner layer or surface layer of the substrate
Value low temperature fired ceramic substrates can be manufactured in a single firing step.

【0023】以上説明した請求項1〜7では、低温焼成
セラミック材料の骨材とガラス粉末との両方に適量のB
aOを添加したが、請求項8のように、低温焼成セラミ
ック材料の骨材のみにBaOを添加し、ガラス粉末に
は、BaOの代わりにSrOを添加しても良い。
In the above-described claims 1 to 7, a suitable amount of B is added to both the aggregate of the low temperature fired ceramic material and the glass powder.
Although aO is added, as in claim 8, BaO may be added only to the aggregate of the low temperature fired ceramic material, and SrO may be added to the glass powder instead of BaO.

【0024】請求項8に記載の低温焼成セラミック材料
は、Al2 3 (アルミナ)を主成分とする骨材:35
〜40重量%と、SiO2 −CaO−B2 3 −Al2
3系のガラス粉末:60〜65重量%とを混合した低
温焼成セラミック材料であり、その骨材は、低温焼成セ
ラミック材料総重量に対して、BaOを0.5〜2.0
重量%含有し、前記ガラス粉末は、該ガラス粉末総重量
に対して、SrOを11〜18.8重量%含有すること
を特徴とするものである。このようにSrOを添加して
作製したSrO−SiO2 −CaO−B2 3 −Al2
3 系のガラス粉末は、焼成工程で結晶化すると、抗折
強度が高くなる特性がある。更に、骨材にBaOを添加
すると、焼成工程で、BaO−SrO−SiO2 系のガ
ラスの結晶が析出しやすくなり、そのガラス析出量が増
加する傾向がある。これにより、低温焼成セラミック材
料のQf値を3000GHz以上に高めることができ
る。
The low temperature fired ceramic material according to claim 8 is an aggregate mainly composed of Al 2 O 3 (alumina): 35
And 40 wt%, SiO 2 -CaO-B 2 O 3 -Al 2
O 3 -based glass powder: a low-temperature fired ceramic material mixed with 60 to 65% by weight, and its aggregate is 0.5 to 2.0 BaO based on the total weight of the low-temperature fired ceramic material.
% By weight, and the glass powder contains 11 to 18.8% by weight of SrO with respect to the total weight of the glass powder. SrO—SiO 2 —CaO—B 2 O 3 —Al 2 produced by adding SrO in this way
The O 3 -based glass powder has a characteristic that when it is crystallized in the firing step, the bending strength is increased. Further, when BaO is added to the aggregate, crystals of BaO—SrO—SiO 2 type glass are likely to precipitate in the firing step, and the amount of glass deposition tends to increase. As a result, the Qf value of the low temperature fired ceramic material can be increased to 3000 GHz or higher.

【0025】この場合、骨材のBaO添加量が0.5重
量%よりも少ないと、添加効果が少なく、ガラス析出量
が少ない。反対に、骨材のBaO添加量が2.0重量%
よりも多いと、後述する試験結果から、抗折強度が低下
することが判明している。従って、骨材のBaO添加量
の適正範囲は、0.5〜2.0重量%と考えられる。
In this case, if the amount of BaO added to the aggregate is less than 0.5% by weight, the effect of addition is small and the amount of glass deposited is small. On the contrary, the added amount of BaO in the aggregate is 2.0% by weight.
It has been found from the test results described below that the bending strength decreases when the amount is larger than the above. Therefore, the appropriate range of the amount of BaO added to the aggregate is considered to be 0.5 to 2.0% by weight.

【0026】また、ガラス粉末のSrO添加量が11重
量%よりも少ないと、SrOの添加効果が少なく、抗折
強度の向上幅が少ない。反対に、ガラス粉末のSrO添
加量が18.8重量%よりも多いと、ガラス化しにくく
なる。従って、ガラス粉末のSrO添加量の適正範囲
は、11〜18.8重量%と考えられる。
When the amount of SrO added to the glass powder is less than 11% by weight, the effect of adding SrO is small and the bending strength is not improved so much. On the contrary, if the amount of SrO added to the glass powder is more than 18.8% by weight, vitrification becomes difficult. Therefore, the proper range of the SrO addition amount of the glass powder is considered to be 11 to 18.8 wt%.

【0027】また、低温焼成セラミック材料中の骨材が
35重量%よりも少ないと(ガラス粉末が65重量%よ
りも多いと)、骨材が不足して、抗折強度が弱くなり、
反対に、骨材が40重量%よりも多いと(ガラス粉末が
60重量%よりも少ないと)、ガラスが不足して、焼結
不良が発生する可能性がある。従って、骨材を35〜4
0重量%とし、SrO−SiO2 −CaO−B2 3
Al2 3 系のガラス粉末を60〜65重量%とすれ
ば、実用に耐え得る抗折強度と焼結性とを確保すること
ができる。
If the amount of the aggregate in the low temperature fired ceramic material is less than 35% by weight (the amount of glass powder is more than 65% by weight), the aggregate is insufficient and the flexural strength becomes weak.
On the other hand, if the amount of aggregate is more than 40% by weight (the amount of glass powder is less than 60% by weight), there is a possibility of insufficient glass and sintering failure. Therefore, the aggregate is
And 0 wt%, SrO-SiO 2 -CaO- B 2 O 3 -
By setting the Al 2 O 3 -based glass powder to 60 to 65% by weight, it is possible to secure the bending strength and sinterability that can be practically used.

【0028】この場合、請求項9のように、ガラス粉末
は、該ガラス粉末総重量に対して、SiO2 :47〜5
5重量%、CaO:10〜14.4重量%、B2 3
6.5〜7.2重量%、Al2 3 :4.2〜5.0重
量%、SrO:11〜18.8重量%、ZnO:4.5
〜5.5重量%、SnO2 :2.0〜4.3重量%、不
純物:2重量%以下を含有する組成とするとすると良
い。つまり、ガラス原料に、SrOの他に、適量のZn
OとSnO2 を添加して作ったSrO−SiO2−Ca
O−B2 3 −Al2 3 −ZnO−SnO2 系のガラ
スは、ZnOを添加しないガラスと比較して、Qf値が
高くなると共に、ZnOがガラスの融点を低下させる役
割を果たす。また、ガラス粉末を製造する際に、SnO
2 を添加すると、SnO2 を添加し無い場合と比較し
て、ガラスの融点を30〜50℃低下させることがで
き、ガラス粉末の製造が容易となる。
In this case, as in claim 9, the glass powder contains SiO 2 : 47 to 5 relative to the total weight of the glass powder.
5% by weight, CaO: 10 to 14.4% by weight, B 2 O 3 :
6.5-7.2 wt%, Al 2 O 3 : 4.2-5.0 wt%, SrO: 11-18.8 wt%, ZnO: 4.5
˜5.5 wt%, SnO 2 : 2.0 to 4.3 wt%, and impurities: 2 wt% or less is preferable. That is, in addition to SrO, an appropriate amount of Zn is used as the glass raw material.
O and SrO-SiO 2 -Ca the SnO 2 was prepared by adding
The O—B 2 O 3 —Al 2 O 3 —ZnO—SnO 2 based glass has a higher Qf value and ZnO serves to lower the melting point of the glass, as compared with glass to which ZnO is not added. In addition, when manufacturing glass powder, SnO
When 2 is added, the melting point of glass can be lowered by 30 to 50 ° C. as compared with the case where SnO 2 is not added, and the production of glass powder becomes easy.

【0029】この場合、ガラス粉末中のZnOが4.5
重量%よりも少ないと、ガラスの融点が1400℃以上
となってしまう。反対に、ZnOが5.5重量%よりも
多いと、ガラス化しにくくなる。従って、ZnOを4.
5〜5.5重量%とすれば、ガラス融点を適度に下げて
ガラス化を容易にすることができる。
In this case, the ZnO content in the glass powder is 4.5.
If it is less than wt%, the melting point of the glass will be 1400 ° C or higher. On the contrary, when ZnO is more than 5.5% by weight, it becomes difficult to vitrify. Therefore, ZnO is 4.
When it is 5 to 5.5% by weight, the glass melting point can be appropriately lowered to facilitate vitrification.

【0030】また、ガラス粉末中のSnO2 が2重量%
よりも少ないと、電気的特性が悪くなり、また、SnO
2 が4.3重量%よりも多いと、熱膨張が大きくなる。
従って、SnO2 を2〜4.3重量%とすれば、電気的
特性及び熱膨張特性が良くなる。
Further, SnO 2 in the glass powder is 2% by weight.
If the amount is less than the above, the electrical characteristics deteriorate, and SnO
When 2 is more than 4.3% by weight, thermal expansion becomes large.
Therefore, when SnO 2 is 2 to 4.3% by weight, the electrical characteristics and the thermal expansion characteristics are improved.

【0031】また、ガラス粉末中のCaOが10重量%
よりも少ないと、nSiO2 ・CaO・Al2 3 系の
結晶の析出が少なくなり、必要な強度が得られない。反
対に、CaOが14.4重量%よりも多いと、ガラス融
点が低くなり過ぎる。従って、CaOを10〜14.4
重量%とすれば、高強度で適度に低いガラス融点とする
ことができる。
Further, CaO in the glass powder is 10% by weight.
If the amount is less than the above, precipitation of nSiO 2 · CaO · Al 2 O 3 -based crystals is reduced, and the required strength cannot be obtained. On the contrary, when CaO is more than 14.4% by weight, the glass melting point becomes too low. Therefore, CaO is 10 to 14.4.
When the content is wt%, it is possible to obtain a glass having a high strength and an appropriately low melting point.

【0032】また、ガラス粉末中のSiO2 が47重量
%よりも少ないと、nSiO2 ・CaO系又はSrO・
SiO2 系の結晶の析出が少なくなり、必要な強度が得
られない。反対に、SiO2 が55重量%よりも多い
と、ガラス化しにくくなる。従って、SiO2 を47〜
55重量%とすれば、強度を確保しながら、ガラス化を
容易にすることができる。
When the SiO 2 content in the glass powder is less than 47% by weight, nSiO 2 .CaO system or SrO.
Precipitation of SiO 2 type crystals is reduced, and required strength cannot be obtained. On the contrary, if the SiO 2 content is more than 55% by weight, vitrification becomes difficult. Therefore, the SiO 2 is 47-
When it is 55% by weight, vitrification can be facilitated while ensuring strength.

【0033】一般に、SiO2 とCaOとSrOだけで
は、融点の高いガラスになるため、融点を低下させる添
加剤としてB2 3 を添加する必要がある。ガラス粉末
中のB2 3 が6.5重量%よりも少ないと、1400
℃以下ではガラス化しにくくなる。反対に、B2 3
7.2重量%よりも多いと、必要な強度が得られない。
従って、B2 3 が6.5〜7.2重量%とすれば、ガ
ラス融点を適度に下げながら、必要な強度を確保するこ
とができる。
Generally, only SiO 2 , CaO and SrO form a glass having a high melting point, so that it is necessary to add B 2 O 3 as an additive for lowering the melting point. If the B 2 O 3 content in the glass powder is less than 6.5% by weight, it will be 1400.
It becomes difficult to vitrify below ℃. On the contrary, if the B 2 O 3 content is more than 7.2% by weight, the required strength cannot be obtained.
Therefore, if the B 2 O 3 content is 6.5 to 7.2% by weight, it is possible to secure the necessary strength while appropriately lowering the glass melting point.

【0034】また、ガラス粉末中のAl2 3 は、ガラ
スの融点を下げる役割を果たすため、Al2 3 が4.
2重量%よりも少ないと、ガラスの融点が1400℃以
上となってしまう。反対に、Al2 3 が5.0重量%
よりも多いと、ガラス化しにくくなる。従って、Al2
3 が4.2〜5.0重量%とすれば、ガラス融点を適
度に下げてガラス化を容易にすることができる。
Further, Al 2 O 3 in the glass powder plays a role of lowering the melting point of glass, so Al 2 O 3 is 4.
If it is less than 2% by weight, the melting point of glass will be 1400 ° C. or higher. On the contrary, Al 2 O 3 is 5.0% by weight
If it is more than that, vitrification becomes difficult. Therefore, Al 2
When O 3 is 4.2 to 5.0% by weight, the glass melting point can be appropriately lowered to facilitate vitrification.

【0035】また、請求項10のように、低温焼成セラ
ミック材料の骨材は、低温焼成セラミック材料総重量に
対してAl2 3 を33〜39.5重量%含有するよう
にすると良い。つまり、Al2 3 が33重量%よりも
少ないと、抗折強度が弱くなり、反対に、Al2 3
39.5重量%よりも多いと、焼結不良が発生する。従
って、Al2 3 を33〜39.5重量%とすれば、実
用に耐え得る抗折強度と焼結性を確保することができ
る。
In the tenth aspect, the aggregate of the low temperature fired ceramic material may contain 33 to 39.5 wt% of Al 2 O 3 with respect to the total weight of the low temperature fired ceramic material. That is, if the Al 2 O 3 content is less than 33% by weight, the bending strength becomes weak, and conversely, if the Al 2 O 3 content is more than 39.5% by weight, defective sintering occurs. Therefore, if the Al 2 O 3 content is 33 to 39.5% by weight, it is possible to secure the bending strength and sinterability that can withstand practical use.

【0036】また、請求項11のように、上述した組成
の低温焼成セラミック材料を用いて形成したセラミック
生基板を800〜1000℃で焼成して低温焼成セラミ
ック基板を製造するようにすると良い。これにより、最
近の高速化・高周波化に対応できる高いQf値と信頼性
確保に必要な基板強度を兼ね備えた高品質の低温焼成セ
ラミック基板を製造することができる。
Further, as described in claim 11, it is preferable to manufacture a low temperature fired ceramic substrate by firing a ceramic raw substrate formed by using the low temperature fired ceramic material having the above composition at 800 to 1000 ° C. As a result, it is possible to manufacture a high-quality low-temperature fired ceramic substrate having both a high Qf value capable of coping with the recent increase in speed and frequency and a substrate strength necessary for ensuring reliability.

【0037】この場合、請求項12のように、低温焼成
セラミック基板の組成は、SiO2:28.2〜35.
8重量%、CaO:6.0〜9.4重量%、BaO:
0.5〜2.0重量%、B2 3 :3.9〜4.7重量
%、Al2 3 :32.5〜42.8重量%、SrO:
6.6〜12.2重量%とすると良い。この低温焼成セ
ラミック基板の組成は、請求項8に記載の低温焼成セラ
ミック材料を用いて低温焼成セラミック基板を形成した
場合の低温焼成セラミック基板の組成の具体例であり、
BaOの添加により低温焼成セラミック基板のQf値を
3000GHz以上に高めることができると共に、Sr
Oの添加により低温焼成セラミック基板の抗折強度を高
めることができる。
In this case, as in claim 12, the composition of the low temperature fired ceramic substrate is SiO 2 : 28.2 to 35.
8% by weight, CaO: 6.0 to 9.4% by weight, BaO:
0.5-2.0 wt%, B 2 O 3: 3.9~4.7 wt%, Al 2 O 3: 32.5~42.8 wt%, SrO:
It is good to set it as 6.6 to 12.2% by weight. The composition of the low temperature fired ceramic substrate is a specific example of the composition of the low temperature fired ceramic substrate when the low temperature fired ceramic substrate is formed using the low temperature fired ceramic substrate according to claim 8.
By adding BaO, the Qf value of the low temperature fired ceramic substrate can be increased to 3000 GHz or more, and Sr
The addition of O can increase the bending strength of the low temperature fired ceramic substrate.

【0038】更に、請求項13のように、上記組成の低
温焼成セラミック基板に、ZnO:2.7〜3.6重量
%、SnO2 :1.2〜2.8重量%を含有させるよう
にすると良い。この低温焼成セラミック基板の組成は、
請求項9に記載の低温焼成セラミック材料を用いて低温
焼成セラミック基板を形成した場合の低温焼成セラミッ
ク基板の組成に相当する。このように、低温焼成セラミ
ック基板に適量のZnOとSnO2 を添加することで、
低温焼成セラミック基板のQf値を更に高めることがで
きると共に、基板強度を高めることができる。
Further, as in claim 13, the low temperature fired ceramic substrate having the above composition contains ZnO: 2.7 to 3.6% by weight and SnO 2 : 1.2 to 2.8% by weight. Good to do. The composition of this low temperature fired ceramic substrate is
It corresponds to the composition of the low temperature fired ceramic substrate when the low temperature fired ceramic substrate is formed using the low temperature fired ceramic material according to claim 9. Thus, by adding an appropriate amount of ZnO and SnO 2 to the low temperature fired ceramic substrate,
The Qf value of the low temperature fired ceramic substrate can be further increased and the substrate strength can be increased.

【0039】また、請求項14のように、上記組成の低
温焼成セラミック基板と低融点金属の配線導体を同時焼
成するようにしても良い。これにより、基板内層又は表
層に低抵抗の電気的特性に優れた配線導体を有する高Q
f値の低温焼成セラミック基板を1回の焼成工程で製造
することができる。
Further, as in claim 14, the low temperature fired ceramic substrate having the above composition and the wiring conductor of the low melting point metal may be fired simultaneously. As a result, a high Q having a wiring conductor with low resistance and excellent electrical characteristics in the inner layer or surface layer of the substrate
A low-temperature fired ceramic substrate having an f value can be manufactured in a single firing process.

【0040】[0040]

【発明の実施の形態】[実施形態(1)]以下、本発明
の実施形態(1)を図1に基づいて説明する。低温焼成
セラミック多層基板は、低温焼成セラミック材料で形成
した複数枚のグリーンシート11a,11b,11cを
積層して800〜1000℃で焼成したものである。こ
の場合、低温焼成セラミック材料は、Al2 3 (アル
ミナ)を主成分とする骨材:35〜40重量%とSiO
2 −CaO−B2 3 −Al23 系のガラス粉末:6
0〜65重量%とを混合したものを使用する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS [Embodiment (1)] An embodiment (1) of the present invention will be described below with reference to FIG. The low temperature fired ceramic multilayer substrate is formed by laminating a plurality of green sheets 11a, 11b and 11c formed of a low temperature fired ceramic material and firing them at 800 to 1000 ° C. In this case, the low temperature fired ceramic material is an aggregate containing Al 2 O 3 (alumina) as a main component: 35 to 40 wt% and SiO 2.
2 -CaO-B 2 O 3 -Al 2 O 3 based glass powder: 6
A mixture of 0 to 65% by weight is used.

【0041】低温焼成セラミック材料の骨材は、低温焼
成セラミック材料総重量に対して、BaO:0.5〜
2.0重量%とAl2 3 :33〜39.5重量%を含
有している。
The aggregate of the low temperature fired ceramic material has a BaO: 0.5 to 0.5 based on the total weight of the low temperature fired ceramic material.
2.0 wt% and Al 2 O 3: 33~39.5 contains a weight%.

【0042】ガラス粉末は、該ガラス粉末総重量に対し
て、SiO2 :45〜55重量%、CaO:15〜21
重量%、B2 3 :6.5〜7.7重量%、Al
2 3 :4.2〜5.1重量%、BaO:6.4〜18
重量%、ZnO:1.5〜2.5重量%、SnO2 :2
〜4重量%、不純物:2重量%以下を含有するBaO−
SiO2 −CaO−B2 3 −Al2 3 −ZnO−S
nO2 系のガラス粉末を用いる。
The glass powder contains SiO 2 : 45 to 55% by weight and CaO: 15 to 21 with respect to the total weight of the glass powder.
Wt%, B 2 O 3: 6.5~7.7 wt%, Al
2 O 3 : 4.2 to 5.1% by weight, BaO: 6.4 to 18
% By weight, ZnO: 1.5 to 2.5% by weight, SnO 2 : 2
~ 4 wt%, impurities: BaO-containing less than 2 wt%
SiO 2 -CaO-B 2 O 3 -Al 2 O 3 -ZnO-S
nO 2 type glass powder is used.

【0043】グリーンシート11a,11b,11c
は、上記組成の低温焼成セラミック材料に、バインダー
(例えばアクリル系樹脂、ブチラール樹脂)、溶剤(例
えばトルエン、キシレン、ブタノール等)及び可塑剤を
配合して、十分に撹拌混合してスラリーを作製し、この
スラリーを用いてドクターブレード法等でテープ成形し
たものである。
Green sheets 11a, 11b, 11c
Is prepared by mixing a low temperature fired ceramic material having the above composition with a binder (eg acrylic resin, butyral resin), a solvent (eg toluene, xylene, butanol) and a plasticizer and thoroughly stirring and mixing to prepare a slurry. The slurry is tape-formed by a doctor blade method or the like.

【0044】各層のグリーンシート11a,11b,1
1cを積層する前に、各層のグリーンシート11a,1
1bにパンチング加工されたビアホール12に、ビア導
体13を充填する。各層のビア導体13は、例えば、A
g、Ag/Pd、Ag/Pt、Ag/Au等を主に含む
Ag系導体ペーストの印刷により形成されている。尚、
各層のビア導体13は、Ag系導体ペーストに代えて、
Au系、Cu系等の低融点金属のペーストを用いても良
い。更に、2層目以下のグリーンシート11b,11c
には、ビア導体13と同種の低融点金属の導体ペースト
を使用して内層配線導体14をスクリーン印刷する。
Green sheets 11a, 11b, 1 of each layer
Before stacking 1c, the green sheets 11a, 1 of each layer are stacked.
A via conductor 13 is filled in the via hole 12 punched in 1b. The via conductor 13 of each layer is, for example, A
It is formed by printing an Ag-based conductor paste mainly containing g, Ag / Pd, Ag / Pt, Ag / Au and the like. still,
The via conductor 13 of each layer is replaced with Ag-based conductor paste,
A paste of a low melting point metal such as Au or Cu may be used. Further, the green sheets 11b and 11c of the second layer and below
The inner layer wiring conductor 14 is screen-printed using a conductor paste of the same low melting point metal as that of the via conductor 13.

【0045】また、1層目(最上層)のグリーンシート
11aには、パッドや配線パターン等の表層配線導体1
5を上述したAg系、Au系、Cu系等の低融点金属の
導体ペーストを使用してスクリーン印刷する。尚、表層
配線導体15は、基板焼成後に、後付けで印刷・焼成す
るようにしても良い。
On the first layer (top layer) of the green sheet 11a, the surface wiring conductors 1 such as pads and wiring patterns are provided.
5 is screen-printed using the above-mentioned low-melting-point metal conductor paste such as Ag-based, Au-based, and Cu-based. The surface wiring conductor 15 may be printed and fired after the substrate is fired.

【0046】印刷工程後に、各層のグリーンシート11
a,11b,11cを積層して加熱圧着して一体化して
低温焼成セラミック生基板を作製する。そして、この低
温焼成セラミック生基板を800〜1000℃(好まし
くは900℃以下)で焼成して、各層のグリーンシート
11a,11b,11cとビア導体13、内層配線導体
14及び表層配線導体15を同時焼成して、低温焼成セ
ラミック多層基板を製造する。
After the printing process, the green sheet 11 of each layer
A, 11b, and 11c are laminated, thermocompression-bonded, and integrated to produce a low temperature fired ceramic green substrate. Then, this low-temperature fired ceramic green substrate is fired at 800 to 1000 ° C. (preferably 900 ° C. or less) to simultaneously form the green sheets 11a, 11b and 11c of each layer, the via conductor 13, the inner layer wiring conductor 14 and the surface layer wiring conductor 15. Firing is performed to manufacture a low temperature firing ceramic multilayer substrate.

【0047】焼成後の低温焼成セラミック多層基板の組
成は、SiO2 :27〜35.8重量%、CaO:9〜
13.7重量%、B2 3 :3.9〜5重量%、Al2
3:36〜42.8重量%、BaO:4.3〜13.
7重量%、ZnO:0.9〜1.6重量%、SnO2
1.2〜2.6重量%である。
The composition of the low temperature fired ceramic multilayer substrate after firing is as follows: SiO 2 : 27-35.8 wt%, CaO: 9-
13.7 wt%, B 2 O 3 : 3.9-5 wt%, Al 2
O 3: 36~42.8 weight%, BaO: 4.3~13.
7% by weight, ZnO: 0.9 to 1.6% by weight, SnO 2 :
It is 1.2 to 2.6% by weight.

【0048】以上説明した本実施形態(1)では、グリ
ーンシート11a,11b,11cを形成する低温焼成
セラミック材料のガラス粉末と骨材の両方に適量のBa
Oを添加したところに特徴があり、更に、ガラス粉末に
適量のZnOとSnO2 を添加したところにも特徴があ
る。
In this embodiment (1) described above, an appropriate amount of Ba is used for both the glass powder and the aggregate of the low temperature fired ceramic material forming the green sheets 11a, 11b, 11c.
It is characterized by the addition of O, and further characterized by the addition of appropriate amounts of ZnO and SnO 2 to the glass powder.

【0049】BaOを添加したガラス粉末は、焼成工程
で結晶化すると、Qf値が高くなる特性がある。更に、
骨材に適量のBaOを添加すると、焼成工程で、BaO
−SiO2 −CaO−B2 3 −Al2 3 系のガラス
の結晶が析出しやくなり、そのガラス析出量が増加する
傾向がある。これにより、低温焼成セラミック材料のQ
f値を3000GHz以上に高めることが可能となる。
The glass powder to which BaO is added has a characteristic of increasing the Qf value when crystallized in the firing process. Furthermore,
If an appropriate amount of BaO is added to the aggregate, BaO
Crystals of the —SiO 2 —CaO—B 2 O 3 —Al 2 O 3 type glass tend to precipitate, and the amount of glass precipitation tends to increase. As a result, the Q of the low temperature fired ceramic material is
It is possible to increase the f value to 3000 GHz or higher.

【0050】また、ガラス原料に、BaOの他に、適量
のZnOとSnO2 を添加して作ったBaO−SiO2
−CaO−B2 3 −Al2 3 −ZnO−SnO2
のガラスは、ZnOを添加しないガラスと比較して、Q
f値が高くなると共に、ZnOがガラスの融点を低下さ
せる役割を果たす。また、ガラス粉末を製造する際に、
SnO2 を添加すると、SnO2 を添加し無い場合と比
較して、ガラスの融点を30〜50℃低下させることが
でき、ガラス粉末の製造が容易となる。
In addition to BaO, an appropriate amount of ZnO and SnO 2 was added to the glass raw material to form BaO-SiO 2
-CaO-B 2 O 3 -Al 2 O 3 -ZnO-SnO 2 system glass, as compared to glass without the addition of ZnO, Q
As the f value increases, ZnO plays a role of lowering the melting point of glass. Also, when manufacturing glass powder,
When SnO 2 is added, the melting point of glass can be lowered by 30 to 50 ° C. as compared with the case where SnO 2 is not added, and the production of glass powder becomes easy.

【0051】[0051]

【実施例】本発明者は、ガラス粉末の組成と、骨材のB
aO添加量、ガラス粉末と骨材の配合比の適正範囲を評
価する試験を行ったので、その試験結果を次の表1、表
2に示す。
EXAMPLES The present inventor has found that the composition of the glass powder and the B of the aggregate
A test was conducted to evaluate the appropriate range of the amount of aO added and the compounding ratio of the glass powder and the aggregate. The test results are shown in Tables 1 and 2 below.

【0052】[0052]

【表1】 [Table 1]

【0053】[0053]

【表2】 [Table 2]

【0054】この評価試験では、表1に示す4種類の組
成〜のガラス粉末を作製した。このガラス粉末の製
造方法は、表1の組成の混合物を溶融してガラス化して
急冷し、これを粉砕して平均粒径が10μm程度のガラ
ス粉末を作製した。
In this evaluation test, glass powders having four compositions shown in Table 1 were prepared. In the method for producing this glass powder, the mixture having the composition shown in Table 1 was melted, vitrified and rapidly cooled, and this was crushed to produce glass powder having an average particle size of about 10 μm.

【0055】この試験に用いた骨材は、BaOを添加し
ないAl2 3 のみの骨材と、低温焼成セラミック材料
総重量に対するBaO添加量が0.5重量%、1.0重
量%、1.5重量%、2.0重量%、3.0重量%の骨
材を使用した。
The aggregates used in this test were aggregates containing only Al 2 O 3 with no addition of BaO, and 0.5% by weight, 1.0% by weight, and 1% by weight of BaO with respect to the total weight of the low temperature fired ceramic material. Aggregates of 0.5% by weight, 2.0% by weight and 3.0% by weight were used.

【0056】そして、これらのガラス粉末と骨材とを表
2に示す配合比で混合して低温焼成セラミック材料を作
製し、この低温焼成セラミック材料に溶剤とアクリル系
樹脂(バインダー)と可塑剤を配合して、十分に撹拌混
合してスラリーを作製し、このスラリーをドクターブレ
ード法でテープ成形して乾燥させ、厚さ0.1mmのグ
リーンシートを作製した。
Then, the glass powder and the aggregate were mixed at the compounding ratio shown in Table 2 to prepare a low temperature fired ceramic material, and a solvent, an acrylic resin (binder) and a plasticizer were added to the low temperature fired ceramic material. The mixture was blended and sufficiently stirred and mixed to prepare a slurry, which was tape-formed by a doctor blade method and dried to prepare a green sheet having a thickness of 0.1 mm.

【0057】その後、このグリーンシートを12枚積層
して熱圧着した後、これを10.0mm×50.0mm
のサイズに切断してサンプル基板を作製した。そして、
このサンプル基板を大気中で900℃、30分ホールド
の条件で焼成し、焼結の良否を評価した。更に、焼結し
たサンプル基板については、曲げ試験によりサンプル基
板の抗折強度を測定した。その結果、表2に示すよう
に、17種類のサンプル#1〜#17の焼結性と抗折強
度の測定値が得られた。
After that, 12 green sheets were laminated and thermocompression bonded, and then this was 10.0 mm × 50.0 mm.
A sample substrate was prepared by cutting into a size of. And
This sample substrate was fired in the air under the conditions of 900 ° C. and hold for 30 minutes, and the quality of sintering was evaluated. Further, with respect to the sintered sample substrate, the bending strength of the sample substrate was measured by a bending test. As a result, as shown in Table 2, measured values of sinterability and bending strength of 17 types of samples # 1 to # 17 were obtained.

【0058】一方、各サンプル#1〜#17のQf値の
測定は、次のようにして行った。各サンプル#1〜#1
7の組成の低温焼成セラミック材料を金型プレスにより
直径15mmの円柱状に成形してサンプルを作製し、こ
のサンプルを大気中で930℃、30分ホールドの条件
で焼成した。そして、焼結したサンプルを用いて、誘電
体共振法により、Q値と共振周波数fを測定し、Qf値
を算出した。このQf値は、信号処理の高速化・高周波
化への適応性を表す指標となり、Qf値が高いほど、高
速化・高周波化への対応が容易である。従来のガラス複
合系の低温焼成セラミック材料は、Qf値が2000G
Hz程度であるが、最近の目覚ましく発展する高速化・
高周波化に対応するためには、3000GHz以上の高
いQf値を持つことが好ましい。
On the other hand, the Qf value of each of the samples # 1 to # 17 was measured as follows. Each sample # 1 to # 1
A low-temperature fired ceramic material having the composition of 7 was molded into a cylindrical shape having a diameter of 15 mm by a die press to prepare a sample, and the sample was fired in the air at 930 ° C. for 30 minutes hold. Then, using the sintered sample, the Q value and the resonance frequency f were measured by the dielectric resonance method, and the Qf value was calculated. This Qf value is an index showing the adaptability to speeding up / frequency increasing the signal processing, and the higher the Qf value, the easier it is to cope with speeding up / frequency increasing. The conventional glass composite low temperature firing ceramic material has a Qf value of 2000G.
Although it is in the order of Hz, the recent speeding up that has made remarkable progress
In order to handle higher frequencies, it is preferable to have a high Qf value of 3000 GHz or higher.

【0059】この評価試験における合格基準は、焼結性
が良で、且つ、抗折強度が170MPa以上で、且つ、
Qf値が3000GHz以上であることであり、これら
3つの条件が全て満たされた場合に合格(○)と評価
し、いずれか1つでも満たさない条件があれば不合格
(×)と評価した。
The acceptance criteria in this evaluation test are good sinterability, flexural strength of 170 MPa or more, and
The Qf value was 3000 GHz or more, and when all of these three conditions were satisfied, it was evaluated as pass (◯), and when any one of them was not satisfied, it was evaluated as fail (x).

【0060】表1の組成のガラス粉末を用いたサンプ
ル#1、#2は、いずれも、不合格(×)となった。ま
た、組成〜のガラス粉末を用いたサンプル#3〜#
17は、骨材のBaO添加量、ガラス粉末と骨材の配合
比によって合格(○)と不合格(×)とに評価が分かれ
た。
Samples # 1 and # 2 using the glass powder having the composition shown in Table 1 both failed (x). In addition, samples # 3 to # using the glass powder of composition
In No. 17, the evaluation was divided into pass (◯) and fail (x) depending on the amount of BaO added to the aggregate and the compounding ratio of the glass powder and the aggregate.

【0061】この事から、ガラス粉末の組成について
は、表1の〜の範囲内が適正であることが判明し
た。表1の〜のガラス粉末の組成は、該ガラス粉末
総重量に対して、SiO2 :45〜55重量%、Ca
O:15〜21重量%、B2 3 :6.5〜7.7重量
%、Al2 3 :4.2〜5.1重量%、BaO:6.
4〜18重量%、ZnO:1.5〜2.5重量%、Sn
2 :2〜4重量%の範囲内である。
From this fact, it was found that the composition of the glass powder is appropriate within the range of to in Table 1. The composition of the glass powder - in Table 1, with respect to the glass powder to the total weight, SiO 2: 45 to 55 wt%, Ca
O: 15 to 21 wt%, B 2 O 3: 6.5~7.7 wt%, Al 2 O 3: 4.2~5.1 wt%, BaO: 6.
4-18 wt%, ZnO: 1.5-2.5 wt%, Sn
O 2 : Within the range of 2 to 4% by weight.

【0062】この場合、ガラス粉末のBaO添加量が
6.4重量%よりも少ないと、BaOの添加効果が少な
く、Qf値の向上幅が少ない。反対に、ガラス粉末のB
aO添加量が18重量%よりも多いと、ガラス化しにく
くなる。従って、ガラス粉末のBaO添加量の適正範囲
は、6.4〜18重量%と考えられる。
In this case, if the amount of BaO added to the glass powder is less than 6.4% by weight, the effect of adding BaO is small and the improvement of the Qf value is small. On the contrary, B of glass powder
If the amount of aO added is more than 18% by weight, vitrification becomes difficult. Therefore, the appropriate range of the amount of BaO added to the glass powder is considered to be 6.4 to 18% by weight.

【0063】また、ガラス粉末中のZnOは、Qf値を
高くすると共に、ガラスの融点を低下させる役割を果た
す。ガラス粉末中のZnOが1.5重量%よりも少ない
と、ガラスの融点が1400℃以上となってしまう。反
対に、ZnOが2.5重量%よりも多いと、ガラス化し
にくくなる。従って、ZnOを1.5〜2.5重量%と
すれば、ガラス融点を適度に下げてガラス化を容易にす
ることができる。
ZnO in the glass powder plays a role of raising the Qf value and lowering the melting point of the glass. If the ZnO content in the glass powder is less than 1.5% by weight, the melting point of the glass will be 1400 ° C. or higher. On the other hand, if ZnO is more than 2.5% by weight, vitrification becomes difficult. Therefore, if ZnO is 1.5 to 2.5% by weight, the glass melting point can be appropriately lowered to facilitate vitrification.

【0064】また、ガラス粉末中のSnO2 が2重量%
よりも少ないと、電気的特性が悪くなり、また、SnO
2 が4重量%よりも多いと、熱膨張が大きくなる。従っ
て、SnO2 を2〜4重量%とすれば、電気的特性、熱
膨張特性が良くなる。
Further, SnO 2 in the glass powder is 2% by weight.
If the amount is less than the above, the electrical characteristics deteriorate, and SnO
When 2 is more than 4% by weight, thermal expansion becomes large. Therefore, when SnO 2 is 2 to 4% by weight, the electrical characteristics and thermal expansion characteristics are improved.

【0065】また、ガラス粉末中のCaOが15重量%
よりも少ないと、nSiO2 ・CaO・Al2 3 系の
結晶の析出が少なくなり、必要な強度が得られない。反
対に、CaOが21重量%よりも多いと、ガラス融点が
低くなり過ぎる。従って、CaOを15〜21重量%と
すれば、高強度で適度に低いガラス融点とすることがで
きる。
Further, CaO in the glass powder is 15% by weight.
If the amount is less than the above, precipitation of nSiO 2 · CaO · Al 2 O 3 -based crystals is reduced, and the required strength cannot be obtained. On the other hand, when CaO is more than 21% by weight, the glass melting point becomes too low. Therefore, if CaO is 15 to 21% by weight, it is possible to obtain a glass having a high strength and an appropriately low glass melting point.

【0066】また、ガラス粉末中のSiO2 が45重量
%よりも少ないと、nSiO2 ・CaO系又はBaO・
SiO2 系の結晶の析出が少なくなり、必要な強度が得
られない。反対に、SiO2 が55重量%よりも多い
と、ガラス化しにくくなる。従って、SiO2 を45〜
55重量%とすれば、強度を確保しながら、ガラス化を
容易にすることができる。
If the SiO 2 content in the glass powder is less than 45% by weight, nSiO 2 .CaO system or BaO.
Precipitation of SiO 2 type crystals is reduced, and required strength cannot be obtained. On the contrary, if the SiO 2 content is more than 55% by weight, vitrification becomes difficult. Therefore, if SiO 2 is 45-
When it is 55% by weight, vitrification can be facilitated while ensuring strength.

【0067】一般に、SiO2 とCaOとBaOだけで
は、融点の高いガラスになるため、融点を低下させる添
加剤としてB2 3 を添加する必要がある。ガラス粉末
中のB2 3 が6.5重量%よりも少ないと、1400
℃以下ではガラス化しにくくなる。反対に、B2 3
7.7重量%よりも多いと、必要な強度が得られない。
従って、B2 3 が6.5〜7.7重量%とすれば、ガ
ラス融点を適度に下げながら、必要な強度を確保するこ
とができる。
In general, SiO 2 , CaO and BaO alone form a glass having a high melting point, so that B 2 O 3 must be added as an additive for lowering the melting point. If the B 2 O 3 content in the glass powder is less than 6.5% by weight, it will be 1400.
It becomes difficult to vitrify below ℃. On the contrary, if the B 2 O 3 content is more than 7.7% by weight, the required strength cannot be obtained.
Therefore, if the B 2 O 3 content is 6.5 to 7.7% by weight, it is possible to secure the required strength while appropriately lowering the glass melting point.

【0068】また、ガラス粉末中のAl2 3 は、ガラ
スの融点を下げる役割を果たすため、Al2 3 が4.
2重量%よりも少ないと、ガラスの融点が1400℃以
上となってしまう。反対に、Al2 3 が5.1重量%
よりも多いと、ガラス化しにくくなる。従って、Al2
3 が4.2〜5.1重量%とすれば、ガラス融点を適
度に下げてガラス化を容易にすることができる。
Further, Al 2 O 3 in the glass powder plays a role of lowering the melting point of glass, so Al 2 O 3 is 4.
If it is less than 2% by weight, the melting point of glass will be 1400 ° C. or higher. On the contrary, Al 2 O 3 is 5.1% by weight
If it is more than that, vitrification becomes difficult. Therefore, Al 2
When O 3 is 4.2 to 5.1% by weight, the glass melting point can be appropriately lowered to facilitate vitrification.

【0069】次に、骨材のBaO添加量の適正範囲を考
察する。BaOを添加しないAl23 のみの骨材を用
いたサンプルは、Qf値が3000GHz未満又は焼結
不良となり、不合格(×)と評価された。また、骨材の
BaO添加量が0.5重量%、1.0重量%、2.0重
量%のサンプルは、いずれも、Qf値が3000GHz
以上、焼結性良好、抗折強度が170MPa以上とな
り、合格(○)と評価された。しかし、骨材のBaO添
加量が3.0重量%のサンプル#7は、抗折強度が16
5MPaに低下して合格基準(170MPa以上)を満
たさず、不合格(×)と評価された。この事から、骨材
のBaO添加量の適正範囲は、0.5〜2.0重量%と
考えられる。
Next, an appropriate range of the amount of BaO added to the aggregate will be considered. The sample using the aggregate of Al 2 O 3 only, which did not contain BaO, had a Qf value of less than 3000 GHz or had poor sintering, and was evaluated as rejected (x). In addition, the samples with 0.5% by weight, 1.0% by weight, and 2.0% by weight of BaO added to the aggregate all have a Qf value of 3000 GHz.
As described above, the sinterability was good, and the transverse rupture strength was 170 MPa or more, and it was evaluated as acceptable (◯). However, sample # 7 having an added amount of BaO in the aggregate of 3.0% by weight had a flexural strength of 16%.
It decreased to 5 MPa and did not satisfy the acceptance criteria (170 MPa or more), and was evaluated as a failure (x). From this, it is considered that the appropriate range of the amount of BaO added to the aggregate is 0.5 to 2.0% by weight.

【0070】次に、ガラス粉末と骨材の配合比の適正範
囲を考察する。この試験では、ガラス粉末の配合比を5
5〜70重量%、骨材を30〜45重量%に設定した。
ガラス粉末:55重量%、骨材:45重量%のサンプル
は、いずれも、ガラスが不足して、焼結不良となり、不
合格(×)と評価された。また、ガラス粉末:70重量
%、骨材:30重量%のサンプルは、いずれも、骨材が
不足して、抗折強度が150MPa以下に低下して合格
基準(170MPa以上)を満たさず、不合格(×)と
評価された。
Next, an appropriate range of the compounding ratio of glass powder and aggregate will be considered. In this test, the compounding ratio of glass powder was 5
The content was set to 5 to 70% by weight and the aggregate to 30 to 45% by weight.
The samples of glass powder: 55% by weight and aggregate: 45% by weight were all evaluated to be unacceptable (x) because of insufficient glass and poor sintering. Further, the samples of glass powder: 70% by weight and aggregate: 30% by weight did not satisfy the acceptance criteria (170 MPa or more) because the aggregate strength was insufficient and the flexural strength decreased to 150 MPa or less. It was evaluated as passing (x).

【0071】これに対し、ガラス粉末:60〜65重量
%、骨材:35〜40重量%の場合は、骨材のBaO添
加量が適正範囲(0.5〜2.0重量%)のサンプルに
ついては、合格基準(焼結性:良、抗折強度>170M
Pa、Qf値>3000GHz)の条件を満たし、合格
(○)と評価された。この事から、ガラス粉末と骨材の
配合比の適正範囲は、ガラス粉末:60〜65重量%、
骨材:35〜40重量%と考えられる。
On the other hand, when the glass powder is 60 to 65% by weight and the aggregate is 35 to 40% by weight, the sample in which the amount of BaO added to the aggregate is in the proper range (0.5 to 2.0% by weight) About the acceptance criteria (sinterability: good, bending strength> 170M
The condition of Pa, Qf value> 3000 GHz) was satisfied, and it was evaluated as pass (◯). From this, the appropriate range of the mixing ratio of the glass powder and the aggregate is as follows: glass powder: 60 to 65% by weight,
Aggregate: considered to be 35-40% by weight.

【0072】[実施形態(2)]前記実施形態(1)で
は、低温焼成セラミック材料の骨材とガラス粉末との両
方に適量のBaOを添加したが、以下に説明する実施形
態(2)では、低温焼成セラミック材料の骨材のみにB
aOを添加し、ガラス粉末には、BaOの代わりにSr
Oを添加し、それに伴い、ガラス粉末の各成分の配合比
を調整している。
[Embodiment (2)] In the embodiment (1), an appropriate amount of BaO is added to both the aggregate of the low temperature fired ceramic material and the glass powder, but in the embodiment (2) described below , B only for aggregate of low temperature fired ceramic material
aO was added, and the glass powder contained Sr instead of BaO.
O was added, and the compounding ratio of each component of the glass powder was adjusted accordingly.

【0073】本実施形態(2)においても、グリーンシ
ートを成形する低温焼成セラミック材料は、Al2 3
(アルミナ)を主成分とする骨材:35〜40重量%と
SiO2 −CaO−B2 3 −Al2 3 系のガラス粉
末:60〜65重量%とを混合したものを使用する。
Also in this embodiment (2), the low temperature fired ceramic material for forming the green sheet is Al 2 O 3
An aggregate containing (alumina) as a main component: 35 to 40 wt% and a mixture of SiO 2 —CaO—B 2 O 3 —Al 2 O 3 -based glass powder: 60 to 65 wt% are used.

【0074】低温焼成セラミック材料の骨材は、低温焼
成セラミック材料総重量に対して、BaO:0.5〜
2.0重量%とAl2 3 :33〜39.5重量%を含
有している。
The aggregate of the low temperature fired ceramic material has a BaO: 0.5 to 0.5 based on the total weight of the low temperature fired ceramic material.
2.0 wt% and Al 2 O 3: 33~39.5 contains a weight%.

【0075】ガラス粉末は、該ガラス粉末総重量に対し
て、SiO2 :47〜55重量%、CaO:10〜1
4.4重量%、B2 3 :6.5〜7.2重量%、Al
2 3:4.2〜5.0重量%、SrO:11〜18.
8重量%、ZnO:4.5〜5.5重量%、SnO2
2.0〜4.3重量%、不純物:2重量%以下を含有す
るSrO−SiO2 −CaO−B2 3 −Al2 3
ZnO−SnO2 系のガラス粉末を用いる。
The glass powder contains SiO 2 : 47 to 55% by weight and CaO: 10 to 1 with respect to the total weight of the glass powder.
4.4 wt%, B 2 O 3: 6.5~7.2 wt%, Al
2 O 3 : 4.2 to 5.0% by weight, SrO: 11 to 18.
8% by weight, ZnO: 4.5 to 5.5% by weight, SnO 2 :
SrO—SiO 2 —CaO—B 2 O 3 —Al 2 O 3 — containing 2.0 to 4.3 wt% and impurities: 2 wt% or less
A glass powder of ZnO-SnO 2 system.

【0076】この組成の低温焼成セラミック材料のスラ
リーを用いて、前記実施形態(1)と同様の方法でグリ
ーンシートを成形し、導体パターン印刷、グリーンシー
ト積層、焼成工程を順番に実行して、低温焼成セラミッ
ク多層基板を製造する。
Using the slurry of the low-temperature fired ceramic material having this composition, a green sheet is formed by the same method as in the above embodiment (1), and the conductor pattern printing, green sheet lamination and firing steps are performed in this order. A low temperature fired ceramic multilayer substrate is manufactured.

【0077】焼成後の低温焼成セラミック多層基板の組
成は、SiO2 :28.2〜35.8重量%、CaO:
6.0〜9.4重量%、BaO:0.5〜2.0重量
%、B2 3 :3.9〜4.7重量%、Al2 3 :3
2.5〜42.8重量%、SrO:6.6〜12.2重
量%、ZnO:2.7〜3.6重量%、SnO2 :1.
2〜2.8重量%である。
The composition of the low temperature fired ceramic multilayer substrate after firing was SiO 2 : 28.2 to 35.8% by weight, CaO:
6.0 to 9.4 wt%, BaO: 0.5 to 2.0 wt%, B 2 O 3: 3.9~4.7 wt%, Al 2 O 3: 3
2.5 to 42.8 wt%, SrO: 6.6 to 12.2 wt%, ZnO: 2.7 to 3.6 wt%, SnO 2 : 1.
It is 2 to 2.8% by weight.

【0078】以上説明した本実施形態(2)では、グリ
ーンシートを形成する低温焼成セラミック材料の骨材の
みにBaOを添加し、ガラス粉末には、BaOの代わり
にSrOを添加したところに特徴があり、更にガラス粉
末に適量のZnOとSnO2を添加したところにも特徴
がある。
The present embodiment (2) described above is characterized in that BaO is added only to the aggregate of the low temperature fired ceramic material forming the green sheet, and SrO is added to the glass powder instead of BaO. It is also characterized in that appropriate amounts of ZnO and SnO 2 are added to the glass powder.

【0079】SrOを添加したガラス粉末は、焼成工程
で結晶化すると、抗折強度が高くなる特性がある。更
に、骨材に適量のBaOを添加すると、焼成工程で、B
aO−SrO−SiO2 系のガラスの結晶が析出しやく
なり、そのガラス析出量が増加する傾向がある。これに
より、低温焼成セラミック材料のQf値を3000GH
z以上に高めることが可能となる。
The glass powder to which SrO is added has the property of increasing the bending strength when crystallized in the firing process. Furthermore, if an appropriate amount of BaO is added to the aggregate, B
Crystals of aO—SrO—SiO 2 type glass tend to be deposited easily, and the amount of deposited glass tends to increase. As a result, the Qf value of the low temperature fired ceramic material is 3000 GH
It is possible to increase it to z or more.

【0080】また、ガラス原料に、SrOの他に、適量
のZnOとSnO2 を添加して作ったSrO−SiO2
−CaO−B2 3 −Al2 3 −ZnO−SnO2
のガラスは、ZnOを添加しないガラスと比較して、Q
f値が高くなると共に、ZnOがガラスの融点を低下さ
せる役割を果たす。また、ガラス粉末を製造する際に、
SnO2 を添加すると、SnO2 を添加し無い場合と比
較して、ガラスの融点を30〜50℃低下させることが
でき、ガラス粉末の製造が容易となる。
In addition to SrO, an appropriate amount of ZnO and SnO 2 was added to the glass raw material to prepare SrO-SiO 2
-CaO-B 2 O 3 -Al 2 O 3 -ZnO-SnO 2 system glass, as compared to glass without the addition of ZnO, Q
As the f value increases, ZnO plays a role of lowering the melting point of glass. Also, when manufacturing glass powder,
When SnO 2 is added, the melting point of glass can be lowered by 30 to 50 ° C. as compared with the case where SnO 2 is not added, and the production of glass powder becomes easy.

【0081】[0081]

【実施例】本実施形態(2)の組成の低温焼成セラミッ
ク材料に関しても、本発明者は、ガラス粉末の組成と、
骨材のBaO添加量、ガラス粉末と骨材の配合比の適正
範囲を評価する試験を行ったので、その試験結果を次の
表3、表4に示す。
EXAMPLE Regarding the low temperature fired ceramic material having the composition of the present embodiment (2), the present inventor also found that the composition of the glass powder was
A test was conducted to evaluate the proper range of the amount of BaO added to the aggregate and the mixing ratio of the glass powder and the aggregate. The test results are shown in Tables 3 and 4 below.

【0082】[0082]

【表3】 [Table 3]

【0083】[0083]

【表4】 [Table 4]

【0084】この評価試験では、表3に示す4種類の組
成〜のガラス粉末を作製した。このガラス粉末の製
造方法は、表3の組成の混合物を溶融してガラス化して
急冷し、これを粉砕して平均粒径が10μm程度のガラ
ス粉末を作製した。
In this evaluation test, glass powders having four compositions shown in Table 3 were prepared. In the method for producing the glass powder, the mixture having the composition shown in Table 3 was melted, vitrified, and rapidly cooled, and this was crushed to produce glass powder having an average particle diameter of about 10 μm.

【0085】この試験に用いた骨材は、BaOを添加し
ないAl2 3 のみの骨材と、低温焼成セラミック材料
総重量に対するBaO添加量が0.5重量%、1.0重
量%、1.5重量%、2.0重量%、3.0重量%の骨
材を使用した。
The aggregates used in this test were the aggregates containing only Al 2 O 3 with no BaO added, and the addition amounts of BaO to the total weight of the low temperature fired ceramic materials were 0.5% by weight, 1.0% by weight, and 1% by weight, respectively. Aggregates of 0.5% by weight, 2.0% by weight and 3.0% by weight were used.

【0086】そして、これらのガラス粉末と骨材とを表
4に示す配合比で混合して低温焼成セラミック材料を作
製し、この低温焼成セラミック材料に溶剤とアクリル系
樹脂(バインダー)と可塑剤を配合して、十分に撹拌混
合してスラリーを作製し、このスラリーをドクターブレ
ード法でテープ成形して乾燥させ、厚さ0.1mmのグ
リーンシートを作製した。
Then, these glass powders and aggregates were mixed at a compounding ratio shown in Table 4 to prepare a low temperature fired ceramic material, and a solvent, an acrylic resin (binder) and a plasticizer were added to the low temperature fired ceramic material. The mixture was blended and sufficiently stirred and mixed to prepare a slurry, which was tape-formed by a doctor blade method and dried to prepare a green sheet having a thickness of 0.1 mm.

【0087】その後、このグリーンシートを12枚積層
して熱圧着した後、これを10.0mm×50.0mm
のサイズに切断してサンプル基板を作製した。そして、
このサンプル基板を大気中で900℃、30分ホールド
の条件で焼成し、焼結の良否を評価した。更に、焼結し
たサンプル基板については、曲げ試験によりサンプル基
板の抗折強度を測定した。その結果、表4に示すよう
に、17種類のサンプル#21〜#37の焼結性と抗折
強度の測定値が得られた。尚、各サンプル#21〜#3
7のQf値の測定方法は前記実施形態(1)と同じであ
る。
After that, 12 sheets of this green sheet were laminated and thermocompression bonded, and then this was 10.0 mm × 50.0 mm.
A sample substrate was prepared by cutting into a size of. And
This sample substrate was fired in the air under the conditions of 900 ° C. and hold for 30 minutes, and the quality of sintering was evaluated. Further, with respect to the sintered sample substrate, the bending strength of the sample substrate was measured by a bending test. As a result, as shown in Table 4, measured values of sinterability and bending strength of 17 types of samples # 21 to # 37 were obtained. Each sample # 21 to # 3
The method of measuring the Qf value of No. 7 is the same as that of the above embodiment (1).

【0088】この評価試験における合格基準は、焼結性
が良で、且つ、抗折強度が200MPa以上で、且つ、
Qf値が3000GHz以上であることであり、これら
3つの条件が全て満たされた場合に合格(○)と評価
し、いずれか1つでも満たさない条件があれば不合格
(×)と評価した。
The acceptance criteria in this evaluation test are good sinterability, bending strength of 200 MPa or more, and
The Qf value was 3000 GHz or more, and when all of these three conditions were satisfied, it was evaluated as pass (◯), and when any one of them was not satisfied, it was evaluated as fail (x).

【0089】表3の組成のガラス粉末を用いたサンプ
ル#21、#22は、いずれも、不合格(×)となっ
た。また、組成〜のガラス粉末を用いたサンプル#
23〜#37は、骨材のBaO添加量、ガラス粉末と骨
材の配合比によって合格(○)と不合格(×)とに評価
が分かれた。
Samples # 21 and # 22 using the glass powder having the composition shown in Table 3 both failed (x). Sample # using glass powder of composition #
Nos. 23 to # 37 were evaluated as pass (◯) and fail (x) depending on the amount of BaO added to the aggregate and the compounding ratio of the glass powder and the aggregate.

【0090】この事から、ガラス粉末の組成について
は、表3の〜の範囲内が適正であることが判明し
た。表3の〜のガラス粉末の組成は、ガラス粉末総
重量に対して、SiO2 :47〜55重量%、CaO:
10〜14.4重量%、B2 3:6.5〜7.2重量
%、Al2 3 :4.2〜5.0重量%、SrO:11
〜18.8重量%、ZnO:4.5〜5.5重量%、S
nO2 :2〜4.3重量%の範囲内である。
From this fact, it was found that the composition of the glass powder within the range from to in Table 3 was appropriate. The composition of the glass powder in Table 3 is as follows: SiO 2 : 47 to 55% by weight, CaO: based on the total weight of the glass powder.
10 to 14.4 wt%, B 2 O 3: 6.5~7.2 wt%, Al 2 O 3: 4.2~5.0 wt%, SrO: 11
˜18.8% by weight, ZnO: 4.5 to 5.5% by weight, S
nO 2 : Within the range of 2 to 4.3% by weight.

【0091】この場合、ガラス粉末のSrO添加量が1
1重量%よりも少ないと、SrOの添加効果が少なく、
抗折強度の向上幅が少ない。反対に、ガラス粉末のSr
O添加量が18.8重量%よりも多いと、ガラス化しに
くくなる。従って、ガラス粉末のSrO添加量の適正範
囲は、11〜18.8重量%と考えられる。
In this case, the amount of SrO added to the glass powder was 1
If it is less than 1% by weight, the effect of adding SrO is small,
Little increase in bending strength. On the contrary, Sr of glass powder
If the amount of O added is more than 18.8% by weight, vitrification becomes difficult. Therefore, the proper range of the SrO addition amount of the glass powder is considered to be 11 to 18.8 wt%.

【0092】また、ガラス粉末中のZnOは、Qf値を
高くすると共に、ガラスの融点を低下させる役割を果た
す。ガラス粉末中のZnOが4.5重量%よりも少ない
と、ガラスの融点が1400℃以上となってしまう。反
対に、ZnOが5.5重量%よりも多いと、ガラス化し
にくくなる。従って、ZnOを4.5〜5.5重量%と
すれば、ガラス融点を適度に下げてガラス化を容易にす
ることができる。
Further, ZnO in the glass powder plays a role of raising the Qf value and lowering the melting point of the glass. If the ZnO content in the glass powder is less than 4.5% by weight, the melting point of the glass will be 1400 ° C. or higher. On the contrary, when ZnO is more than 5.5% by weight, it becomes difficult to vitrify. Therefore, if ZnO is 4.5 to 5.5% by weight, the glass melting point can be appropriately lowered to facilitate vitrification.

【0093】また、ガラス粉末中のSnO2 が2重量%
よりも少ないと、電気的特性が悪くなり、また、SnO
2 が4.3重量%よりも多いと、熱膨張が大きくなる。
従って、SnO2 を2〜4.3重量%とすれば、電気的
特性及び熱膨張特性が良くなる。
Further, SnO 2 in the glass powder is 2% by weight.
If the amount is less than the above, the electrical characteristics deteriorate, and SnO
When 2 is more than 4.3% by weight, thermal expansion becomes large.
Therefore, when SnO 2 is 2 to 4.3% by weight, the electrical characteristics and the thermal expansion characteristics are improved.

【0094】また、ガラス粉末中のCaOが10重量%
よりも少ないと、nSiO2 ・CaO・Al2 3 系の
結晶の析出が少なくなり、必要な強度が得られない。反
対に、CaOが14.4重量%よりも多いと、ガラス融
点が低くなり過ぎる。従って、CaOを10〜14.4
重量%とすれば、高強度で適度に低いガラス融点とする
ことができる。
Further, CaO in the glass powder is 10% by weight.
If the amount is less than the above, precipitation of nSiO 2 · CaO · Al 2 O 3 -based crystals is reduced, and the required strength cannot be obtained. On the contrary, when CaO is more than 14.4% by weight, the glass melting point becomes too low. Therefore, CaO is 10 to 14.4.
When the content is wt%, it is possible to obtain a glass having a high strength and an appropriately low melting point.

【0095】また、ガラス粉末中のSiO2 が47重量
%よりも少ないと、nSiO2 ・CaO系又はSrO・
SiO2 系の結晶の析出が少なくなり、必要な強度が得
られない。反対に、SiO2 が55重量%よりも多い
と、ガラス化しにくくなる。従って、SiO2 を47〜
55重量%とすれば、強度を確保しながら、ガラス化を
容易にすることができる。
When the SiO 2 content in the glass powder is less than 47% by weight, nSiO 2 .CaO system or SrO.
Precipitation of SiO 2 type crystals is reduced, and required strength cannot be obtained. On the contrary, if the SiO 2 content is more than 55% by weight, vitrification becomes difficult. Therefore, the SiO 2 is 47-
When it is 55% by weight, vitrification can be facilitated while ensuring strength.

【0096】一般に、SiO2 とCaOとSrOだけで
は、融点の高いガラスになるため、融点を低下させる添
加剤としてB2 3 を添加する必要がある。ガラス粉末
中のB2 3 が6.5重量%よりも少ないと、1400
℃以下ではガラス化しにくくなる。反対に、B2 3
7.2重量%よりも多いと、必要な強度が得られない。
従って、B2 3 が6.5〜7.2重量%とすれば、ガ
ラス融点を適度に下げながら、必要な強度を確保するこ
とができる。
Generally, only SiO 2 , CaO and SrO form a glass having a high melting point, so that it is necessary to add B 2 O 3 as an additive for lowering the melting point. If the B 2 O 3 content in the glass powder is less than 6.5% by weight, it will be 1400.
It becomes difficult to vitrify below ℃. On the contrary, if the B 2 O 3 content is more than 7.2% by weight, the required strength cannot be obtained.
Therefore, if the B 2 O 3 content is 6.5 to 7.2% by weight, it is possible to secure the necessary strength while appropriately lowering the glass melting point.

【0097】また、ガラス粉末中のAl2 3 は、ガラ
スの融点を下げる役割を果たすため、Al2 3 が4.
2重量%よりも少ないと、ガラスの融点が1400℃以
上となってしまう。反対に、Al2 3 が5.0重量%
よりも多いと、ガラス化しにくくなる。従って、Al2
3 が4.2〜5.0重量%とすれば、ガラス融点を適
度に下げてガラス化を容易にすることができる。
Further, since Al 2 O 3 in the glass powder plays a role of lowering the melting point of the glass, Al 2 O 3 is 4.
If it is less than 2% by weight, the melting point of glass will be 1400 ° C. or higher. On the contrary, Al 2 O 3 is 5.0% by weight
If it is more than that, vitrification becomes difficult. Therefore, Al 2
When O 3 is 4.2 to 5.0% by weight, the glass melting point can be appropriately lowered to facilitate vitrification.

【0098】次に、骨材のBaO添加量の適正範囲を考
察する。BaOを添加しないAl23 のみの骨材を用
いたサンプルは、Qf値が3000GHz未満又は焼結
不良となり、不合格(×)と評価された。また、骨材の
BaO添加量が0.5重量%、1.0重量%、2.0重
量%のサンプルは、いずれも、Qf値が3000GHz
以上、焼結性良好、抗折強度が200MPa以上とな
り、合格(○)と評価された。しかし、骨材のBaO添
加量が3.0重量%のサンプル#27は、抗折強度が1
70MPaに低下して合格基準(200MPa以上)を
満たさず、不合格(×)と評価された。この事から、骨
材のBaO添加量の適正範囲は、0.5〜2.0重量%
と考えられる。
Next, an appropriate range of the amount of BaO added to the aggregate will be considered. The sample using the aggregate of Al 2 O 3 only, which did not contain BaO, had a Qf value of less than 3000 GHz or had poor sintering, and was evaluated as rejected (x). In addition, the samples with 0.5% by weight, 1.0% by weight, and 2.0% by weight of BaO added to the aggregate all have a Qf value of 3000 GHz.
As described above, the sinterability was good, and the transverse rupture strength was 200 MPa or more, and it was evaluated as acceptable (◯). However, the bending strength of the sample # 27 containing 3.0% by weight of BaO in the aggregate is 1
It decreased to 70 MPa and did not satisfy the acceptance criteria (200 MPa or more), and was evaluated as unacceptable (x). From this, the proper range of the amount of BaO added to the aggregate is 0.5 to 2.0% by weight.
it is conceivable that.

【0099】次に、ガラス粉末と骨材の配合比の適正範
囲を考察する。この試験では、ガラス粉末の配合比を5
5〜70重量%、骨材を30〜45重量%に設定した。
ガラス粉末:55重量%、骨材:45重量%のサンプル
は、いずれも、ガラスが不足して、焼結不良となり、不
合格(×)と評価された。また、ガラス粉末:70重量
%、骨材:30重量%のサンプルは、いずれも、骨材が
不足して、抗折強度が150MPa以下に低下して合格
基準(200MPa以上)を満たさず、不合格(×)と
評価された。
Next, an appropriate range of the compounding ratio of glass powder and aggregate will be considered. In this test, the compounding ratio of glass powder was 5
The content was set to 5 to 70% by weight and the aggregate to 30 to 45% by weight.
The samples of glass powder: 55% by weight and aggregate: 45% by weight were all evaluated to be unacceptable (x) because of insufficient glass and poor sintering. Further, the samples of glass powder: 70% by weight and aggregate: 30% by weight did not satisfy the acceptance standard (200 MPa or more) because the aggregate strength was insufficient and the transverse strength decreased to 150 MPa or less. It was evaluated as passing (x).

【0100】これに対し、ガラス粉末:60〜65重量
%、骨材:35〜40重量%の場合は、骨材のBaO添
加量が適正範囲(0.5〜2.0重量%)のサンプルに
ついては、合格基準(焼結性:良、抗折強度>200M
Pa、Qf値>3000GHz)の条件を満たし、合格
(○)と評価された。この事から、ガラス粉末と骨材の
配合比の適正範囲は、ガラス粉末:60〜65重量%、
骨材:35〜40重量%と考えられる。
On the other hand, when the glass powder is 60 to 65% by weight and the aggregate is 35 to 40% by weight, the sample in which the amount of BaO added to the aggregate is in the proper range (0.5 to 2.0% by weight) About the acceptance criteria (sinterability: good, bending strength> 200M
The condition of Pa, Qf value> 3000 GHz) was satisfied, and it was evaluated as pass (◯). From this, the appropriate range of the mixing ratio of the glass powder and the aggregate is as follows: glass powder: 60 to 65% by weight,
Aggregate: considered to be 35-40% by weight.

【0101】[0101]

【発明の効果】以上の説明から明らかなように、本発明
の請求項1の低温焼成セラミック材料は、骨材とガラス
粉末との両方に適量のBaOを添加したので、低温焼成
セラミック材料のQf値を3000GHz以上に高める
ことができて、最近の目覚ましく発展する高速化・高周
波化に対応することができると共に、基板の信頼性確保
に必要な機械的な強度を持たせることができる。
As is apparent from the above description, since the low temperature fired ceramic material according to claim 1 of the present invention has an appropriate amount of BaO added to both the aggregate and the glass powder, the Qf of the low temperature fired ceramic material is The value can be increased to 3000 GHz or more, and it is possible to cope with the recent rapid development of high speed and high frequency, and also to provide the mechanical strength necessary for ensuring the reliability of the substrate.

【0102】更に、請求項2では、ガラス原料に、Ba
Oの他に、適量のZnOとSnO2を添加したので、Q
f値を更に高くできると共に、ガラスの融点を低下させ
ることができ、ガラス粉末の製造が容易となる。
Further, in claim 2, the glass raw material is Ba
In addition to O, appropriate amounts of ZnO and SnO 2 were added, so Q
The f value can be further increased and the melting point of glass can be lowered, which facilitates the production of glass powder.

【0103】また、請求項3では、骨材のAl2 3
有量を、低温焼成セラミック材料総重量に対して33〜
39.5重量%としたので、実用に耐え得る抗折強度と
焼結性を確保することができる。
Further, in claim 3, the content of Al 2 O 3 in the aggregate is 33 to 33% by weight based on the total weight of the low temperature fired ceramic material.
Since the content is 39.5% by weight, it is possible to secure the bending strength and sinterability that can be practically used.

【0104】また、請求項4では、上述した組成の低温
焼成セラミック材料を用いて形成したセラミック生基板
を800〜1000℃で焼成して低温焼成セラミック基
板を製造するようにしたので、最近の高速化・高周波化
に対応できる高いQf値と信頼性確保に必要な基板強度
を兼ね備えた高品質の低温焼成セラミック基板を製造す
ることができる。
Further, according to the present invention, the low temperature fired ceramic substrate is manufactured by firing the ceramic raw substrate formed by using the low temperature fired ceramic material having the above-mentioned composition at 800 to 1000 ° C. It is possible to manufacture a high-quality low-temperature fired ceramic substrate having both a high Qf value that can be applied to higher frequencies and higher frequencies and a substrate strength that is required to ensure reliability.

【0105】また、請求項5では、低温焼成セラミック
基板に適量のBaOが含まれているので、低温焼成セラ
ミック基板のQf値を3000GHz以上に高めること
ができる。
Further, in the present invention, since the low temperature fired ceramic substrate contains an appropriate amount of BaO, the Qf value of the low temperature fired ceramic substrate can be increased to 3000 GHz or more.

【0106】更に、請求項6では、低温焼成セラミック
基板に適量のZnOとSnO2 が含まれているので、低
温焼成セラミック基板のQf値を更に高めることができ
ると共に、焼成温度を低くすることができる。
Furthermore, in the present invention, since the low temperature fired ceramic substrate contains appropriate amounts of ZnO and SnO 2 , the Qf value of the low temperature fired ceramic substrate can be further increased and the firing temperature can be lowered. it can.

【0107】また、請求項7では、上記組成の低温焼成
セラミック基板と低融点金属の配線導体を同時焼成する
ようにしたので、基板内層又は表層に低抵抗の電気的特
性に優れた配線導体を有する高Qf値の低温焼成セラミ
ック基板を1回の焼成工程で製造することができる。
Further, in the present invention, since the low-temperature fired ceramic substrate having the above composition and the low-melting-point metal wiring conductor are fired at the same time, a wiring conductor having low resistance and excellent electrical characteristics is formed in the inner layer or surface layer of the substrate. It is possible to manufacture the high Qf-valued low temperature fired ceramic substrate having one firing step.

【0108】また、請求項8では、低温焼成セラミック
材料の骨材のみにBaOを添加し、ガラス粉末には、B
aOの代わりにSrOを添加したので基板の機械的な強
度を更に向上できると共に、低温焼成セラミック材料の
Qf値を3000GHz以上に高めることができて、最
近の目覚ましく発展する高速化・高周波化に対応するこ
とができる。
In the eighth aspect, BaO is added only to the aggregate of the low temperature fired ceramic material, and B is added to the glass powder.
Since SrO is added instead of aO, the mechanical strength of the substrate can be further improved, and the Qf value of the low temperature fired ceramic material can be increased to 3000 GHz or higher, which corresponds to the recent remarkable speeding up and high frequency. can do.

【0109】更に、請求項9では、ガラス原料に、適量
のZnOとSnO2 を添加したので、Qf値を更に高く
できると共に、ガラスの融点を低下させることができ、
ガラス粉末の製造が容易となる。
Further, according to claim 9, since appropriate amounts of ZnO and SnO 2 are added to the glass raw material, the Qf value can be further increased and the melting point of the glass can be lowered,
The glass powder can be easily manufactured.

【0110】また、請求項10では、骨材のAl2 3
含有量を、低温焼成セラミック材料総重量に対して33
〜39.5重量%としたので、実用に耐え得る抗折強度
と焼結性を確保することができる。
Further, in claim 10, the aggregate of Al 2 O 3 is used.
The content is 33 with respect to the total weight of the low temperature fired ceramic material.
Since the content is ˜39.5% by weight, it is possible to secure the bending strength and sinterability that can be practically used.

【0111】また、請求項11では、上述した組成の低
温焼成セラミック材料を用いて形成したセラミック生基
板を800〜1000℃で焼成して低温焼成セラミック
基板を製造するようにしたので、最近の高速化・高周波
化に対応できる高いQf値と信頼性確保に必要な基板強
度を兼ね備えた高品質の低温焼成セラミック基板を製造
することができる。
According to the eleventh aspect of the present invention, the low temperature fired ceramic substrate is manufactured by firing the ceramic raw substrate formed by using the low temperature fired ceramic material having the above composition at 800 to 1000 ° C. It is possible to manufacture a high-quality low-temperature fired ceramic substrate having both a high Qf value that can be applied to higher frequencies and higher frequencies and a substrate strength that is required to ensure reliability.

【0112】また、請求項12では、低温焼成セラミッ
ク基板に適量のBaOが含まれているので、低温焼成セ
ラミック基板のQf値を3000GHz以上に高めるこ
とができる。しかも、適量のSrOが含まれているの
で、基板の抗折強度を200MPa以上に高めることが
できる。
According to the twelfth aspect, since the low temperature fired ceramic substrate contains an appropriate amount of BaO, the Qf value of the low temperature fired ceramic substrate can be increased to 3000 GHz or more. Moreover, since the appropriate amount of SrO is contained, the bending strength of the substrate can be increased to 200 MPa or more.

【0113】更に、請求項13では、低温焼成セラミッ
ク基板に適量のZnOとSnO2 が含まれているので、
低温焼成セラミック基板のQf値を更に高めることがで
きると共に、焼成温度を低くすることができる。
Further, according to the thirteenth aspect, since the low temperature fired ceramic substrate contains appropriate amounts of ZnO and SnO 2 ,
The Qf value of the low temperature fired ceramic substrate can be further increased, and the firing temperature can be lowered.

【0114】また、請求項14では、上記組成の低温焼
成セラミック基板と低融点金属の配線導体を同時焼成す
るようにしたので、基板内層又は表層に低抵抗の電気的
特性に優れた配線導体を有する高Qf値の低温焼成セラ
ミック基板を1回の焼成工程で製造することができる。
Further, in claim 14, since the low temperature fired ceramic substrate having the above composition and the wiring conductor of the low melting point metal are fired at the same time, a wiring conductor having low resistance and excellent electrical characteristics is formed in the inner layer or the surface layer of the substrate. It is possible to manufacture the high Qf-valued low temperature fired ceramic substrate having one firing step.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施形態(1)を示す低温焼成セラミ
ック多層基板の縦断面図
FIG. 1 is a longitudinal sectional view of a low temperature fired ceramic multilayer substrate showing an embodiment (1) of the present invention.

【符号の説明】[Explanation of symbols]

11a,11b,11c…低温焼成セラミックのグリー
ンシート、12…ビアホール、13…ビア導体、14…
内層配線導体、15…表層配線導体。
11a, 11b, 11c ... Green sheets of low temperature fired ceramics, 12 ... Via holes, 13 ... Via conductors, 14 ...
Inner layer wiring conductor, 15 ... Surface layer wiring conductor.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4G030 AA08 AA09 AA10 AA32 AA35 AA36 AA37 AA39 BA12 CA08 GA14 GA15 GA17 GA20 GA27 5E346 AA12 CC18 CC32 CC38 CC39 DD02 DD34 DD45 EE24 EE27 EE29 FF18 GG04 GG05 GG06 GG09 HH06 HH11 HH32 5G303 AA05 AB08 AB12 AB15 BA12 CA03 CB01 CB02 CB03 CB06 CB30 CB31 CB32 CB38    ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4G030 AA08 AA09 AA10 AA32 AA35                       AA36 AA37 AA39 BA12 CA08                       GA14 GA15 GA17 GA20 GA27                 5E346 AA12 CC18 CC32 CC38 CC39                       DD02 DD34 DD45 EE24 EE27                       EE29 FF18 GG04 GG05 GG06                       GG09 HH06 HH11 HH32                 5G303 AA05 AB08 AB12 AB15 BA12                       CA03 CB01 CB02 CB03 CB06                       CB30 CB31 CB32 CB38

Claims (14)

【特許請求の範囲】[Claims] 【請求項1】 Al2 3 を主成分とする骨材:35〜
40重量%と、SiO2 −CaO−B2 3 −Al2
3 系のガラス粉末:60〜65重量%とを混合してなる
低温焼成セラミック材料において、 前記骨材は、低温焼成セラミック材料総重量に対してB
aOを0.5〜2.0重量%含有し、 前記ガラス粉末は、該ガラス粉末総重量に対してBaO
を6.4〜18重量%含有することを特徴とする低温焼
成セラミック材料。
1. An aggregate containing Al 2 O 3 as a main component: 35 to 35
And 40 wt%, SiO 2 -CaO-B 2 O 3 -Al 2 O
In a low temperature fired ceramic material obtained by mixing 3 type glass powder: 60 to 65% by weight, the aggregate is B based on the total weight of the low temperature fired ceramic material.
aO is included in an amount of 0.5 to 2.0% by weight, and the glass powder is BaO based on the total weight of the glass powder.
6.4-18% by weight of a low temperature fired ceramic material.
【請求項2】 前記ガラス粉末は、該ガラス粉末総重量
に対してSiO2 :45〜55重量%、CaO:15〜
21重量%、B2 3 :6.5〜7.7重量%、Al2
3 :4.2〜5.1重量%、BaO:6.4〜18重
量%、ZnO:1.5〜2.5重量%、SnO2 :2〜
4重量%、不純物:2重量%以下を含有することを特徴
とする請求項1に記載の低温焼成セラミック材料。
2. The glass powder comprises SiO 2 : 45 to 55% by weight and CaO: 15 to 15% by weight based on the total weight of the glass powder.
21 wt%, B 2 O 3: 6.5~7.7 wt%, Al 2
O 3: 4.2 to 5.1 wt%, BaO: 6.4 to 18 wt%, ZnO: 1.5 to 2.5 wt%, SnO 2: 2~
The low temperature fired ceramic material according to claim 1, which contains 4% by weight and impurities: 2% by weight or less.
【請求項3】 前記骨材は、低温焼成セラミック材料総
重量に対してAl23 を33〜39.5重量%含有す
ることを特徴とする請求項1又は2に記載の低温焼成セ
ラミック材料。
3. The low temperature fired ceramic material according to claim 1, wherein the aggregate contains 33 to 39.5% by weight of Al 2 O 3 with respect to the total weight of the low temperature fired ceramic material. .
【請求項4】 請求項1乃至3のいずれかに記載の低温
焼成セラミック材料を用いて形成したセラミック生基板
を800〜1000℃で焼成してなる低温焼成セラミッ
ク基板。
4. A low temperature fired ceramic substrate obtained by firing a ceramic raw substrate formed by using the low temperature fired ceramic material according to claim 1 at 800 to 1000 ° C.
【請求項5】 SiO2 :27〜35.8重量%、Ca
O:9〜13.7重量%、B2 3 :3.9〜5重量
%、Al2 3 :36〜42.8重量%、BaO:4.
3〜13.7重量%を含有することを特徴とする低温焼
成セラミック基板。
5. SiO 2 : 27-35.8 wt%, Ca
O: 9 to 13.7% by weight, B 2 O 3 : 3.9 to 5% by weight, Al 2 O 3 : 36 to 42.8% by weight, BaO: 4.
A low temperature fired ceramic substrate containing 3 to 13.7% by weight.
【請求項6】 ZnO:0.9〜1.6重量%、SnO
2 :1.2〜2.6重量%を含有することを特徴とする
請求項5に記載の低温焼成セラミック基板。
6. ZnO: 0.9-1.6% by weight, SnO
2 : The low-temperature-fired ceramic substrate according to claim 5, containing 1.2 to 2.6% by weight.
【請求項7】 セラミック基板と同時焼成した低融点金
属の配線導体を有することを特徴とする請求項4乃至6
のいずれかに記載の低温焼成セラミック基板。
7. A low-melting-point metal wiring conductor co-fired with a ceramic substrate is provided.
4. A low temperature fired ceramic substrate according to any one of 1.
【請求項8】 Al2 3 を主成分とする骨材:35〜
40重量%と、SiO2 −CaO−B2 3 −Al2
3 系のガラス粉末:60〜65重量%とを混合してなる
低温焼成セラミック材料において、 前記骨材は、低温焼成セラミック材料総重量に対してB
aOを0.5〜2.0重量%含有し、 前記ガラス粉末は、該ガラス粉末総重量に対してSrO
を11〜18.8重量%含有することを特徴とする低温
焼成セラミック材料。
8. An aggregate containing Al 2 O 3 as a main component: 35 to 35
And 40 wt%, SiO 2 -CaO-B 2 O 3 -Al 2 O
In a low temperature fired ceramic material obtained by mixing 3 type glass powder: 60 to 65% by weight, the aggregate is B based on the total weight of the low temperature fired ceramic material.
aO is contained in an amount of 0.5 to 2.0% by weight, and the glass powder contains SrO based on the total weight of the glass powder.
11 to 18.8% by weight of a low temperature fired ceramic material.
【請求項9】 前記ガラス粉末は、該ガラス粉末総重量
に対してSiO2 :47〜55重量%、CaO:10〜
14.4重量%、SrO:11〜18.8重量%、B2
3 :6.5〜7.2重量%、Al2 3 :4.2〜
5.0重量%、ZnO:4.5〜5.5重量%、SnO
2 :2.0〜4.3重量%、不純物:2重量%以下を含
有することを特徴とする請求項8に記載の低温焼成セラ
ミック材料。
9. The glass powder comprises SiO 2 : 47 to 55% by weight, CaO: 10 to 10 based on the total weight of the glass powder.
14.4 wt%, SrO: 11 to 18.8 wt%, B 2
O 3: 6.5 and 7.2 wt%, Al 2 O 3: 4.2~
5.0 wt%, ZnO: 4.5-5.5 wt%, SnO
The low temperature fired ceramic material according to claim 8, characterized in that it contains 2 : 2.0 to 4.3% by weight and impurities: 2% by weight or less.
【請求項10】 前記骨材は、低温焼成セラミック材料
総重量に対してAl2 3 を33〜39.5重量%含有
することを特徴とする請求項8又は9に記載の低温焼成
セラミック材料。
10. The low temperature fired ceramic material according to claim 8, wherein the aggregate contains 33 to 39.5% by weight of Al 2 O 3 with respect to the total weight of the low temperature fired ceramic material. .
【請求項11】 請求項8乃至10のいずれかに記載の
低温焼成セラミック材料を用いて形成したセラミック生
基板を800〜1000℃で焼成してなる低温焼成セラ
ミック基板。
11. A low temperature fired ceramic substrate obtained by firing a ceramic raw substrate formed by using the low temperature fired ceramic material according to claim 8 at 800 to 1000 ° C.
【請求項12】 SiO2 :28.2〜35.8重量
%、CaO:6.0〜9.4重量%、BaO:0.5〜
2.0重量%、B2 3 :3.9〜4.7重量%、Al
2 3 :32.5〜42.8重量%、SrO:6.6〜
12.2重量%を含有することを特徴とする低温焼成セ
ラミック基板。
12. SiO 2 : 28.2 to 35.8 wt%, CaO: 6.0 to 9.4 wt%, BaO: 0.5 to
2.0 wt%, B 2 O 3: 3.9~4.7 wt%, Al
2 O 3 : 32.5 to 42.8 wt%, SrO: 6.6 to
A low temperature fired ceramic substrate containing 12.2% by weight.
【請求項13】 ZnO:2.7〜3.6重量%、Sn
2 :1.2〜2.8重量%を含有することを特徴とす
る請求項12に記載の低温焼成セラミック基板。
13. ZnO: 2.7 to 3.6% by weight, Sn
The low temperature fired ceramic substrate according to claim 12, wherein O 2 is contained in an amount of 1.2 to 2.8% by weight.
【請求項14】 セラミック基板と同時焼成した低融点
金属の配線導体を有することを特徴とする請求項11乃
至13のいずれかに記載の低温焼成セラミック基板。
14. The low temperature fired ceramic substrate according to claim 11, which has a wiring conductor of a low melting point metal which is fired at the same time as the ceramic substrate.
JP2001306733A 2001-10-02 2001-10-02 Low temperature fired ceramic material and low temperature fired ceramic substrate Expired - Fee Related JP4066631B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111187062A (en) * 2020-01-13 2020-05-22 杭州电子科技大学 CaSnSiO5-K2MoO4Base composite ceramic microwave material and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111187062A (en) * 2020-01-13 2020-05-22 杭州电子科技大学 CaSnSiO5-K2MoO4Base composite ceramic microwave material and preparation method thereof
CN111187062B (en) * 2020-01-13 2022-03-01 杭州电子科技大学 CaSnSiO5-K2MoO4Base composite ceramic microwave material and preparation method thereof

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