JP2003101246A - Multilayer wiring board and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer wiring board whose peel strength is large, whose production costs can be reduced and whose insulating strength is large, and to provide a method of manufacturing the wiring board. SOLUTION: In the multilayer wiring board 20, insulating adhesive layers 26, 34 and copper foil layers 24, 38 are arranged alternately, and wiring patterns are installed on the layers 24, 38. In the wiring board 20, the adhesive layers 26, 34 contain glass component layers 28 comprising a bond to a coupling agent 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board and a method for manufacturing the same, and more particularly to a multilayer wiring board characterized by including a glass component layer having a bond with a coupling agent in an insulating adhesive layer and the same. The present invention relates to a manufacturing method.

[0002]

2. Description of the Related Art Generally, a multilayer wiring board is used in order to increase the packing density of electric / electronic parts. Conventionally, such a multilayer wiring board has a plurality of flexible boards, each having a predetermined wiring pattern formed thereon, superposed with an insulating adhesive (prepreg) sandwiched between the boards, crimped by a crimping press machine, and then a predetermined portion. I made a hole in it and gave copper plating,
It is created by electrically connecting a predetermined wiring pattern of each substrate.

However, when the manufacturing process of the multilayer wiring board includes a pressure-bonding press process using a pressure-bonding press machine, there is a problem that the substrate is shrunk due to the high temperature during the pressure-bonding press process, which causes warpage.

Therefore, the following method is available as a method for manufacturing a multilayer wiring board without using a press machine.

First, an insulating adhesive is applied on a substrate, glass powder is dispersed, and then the insulating adhesive is hardened. Further, an insulative adhesive layer is applied thereon, and metal powder is dispersed on the surface of the insulative adhesive layer to form an insulating layer made of an adhesive layer to which the metal powder adheres. Next, copper plating is performed on the insulating layer to form a copper foil layer, and a wiring pattern is formed on the copper foil layer. An insulating adhesive is applied again on this wiring pattern, and the above series of steps are repeated.

The multilayer wiring board thus obtained is
It is possible to prevent the board from shrinking and warping due to the high temperature during the crimping and pressing process, and strengthen the insulation strength by forming an insulating adhesive layer containing glass powder between the laminated wiring patterns. Can be made.

However, in order to further improve the board reliability and increase the density, a multilayer wiring board having higher peel strength is required.

Further, since the used multilayer wiring board uses glass fiber and epoxy resin for the board, it is difficult to dispose of it by burning. Therefore, usually, the used multilayer wiring board is forced to be buried in the soil and discarded, and is used for the construction of dikes.

However, even if it is used for the construction of a bank, etc., the area in which the used multilayer wiring board can be buried is limited, and it is necessary to take measures in view of the future.

Further, since such a disposable product requires a new raw material cost at the time of production, it is an obstacle in reducing the production cost.

Therefore, it can be said that a recyclable multilayer wiring board is ideal.

[0012]

SUMMARY OF THE INVENTION Therefore, the technical problems of the inventions according to claims 1 to 6 are to provide a multilayer wiring board having a large peel strength, a reduced manufacturing cost, and a large insulation strength. To do.

A technical object of the present invention is to provide a method of manufacturing a multilayer wiring board having a large peel strength, a reduced manufacturing cost, and a large insulation strength.

[0014]

In order to solve such a technical problem, in the invention described in claim 1, the insulating adhesive layers and the copper foil layers are alternately arranged, and each of the above-mentioned copper foils is arranged. A multilayer wiring board having a wiring pattern provided in a layer, wherein the insulating adhesive layer includes a glass component layer having a bond with a coupling agent.

Therefore, according to the first aspect of the invention, an insulating adhesive layer having a glass component layer as a coupling agent is provided between a plurality of copper foil layers on which a predetermined wiring pattern is formed. Are formed.

As a result, in the invention described in claim 1, each copper foil layer can be easily bonded by the chemical bonding force between the coupling agent and the glass component layer without applying high temperature and high pressure. It is possible to provide a high-performance and high-density multilayer wiring board in which a plurality of layers having extremely strong peeling strength are laminated.

According to a second aspect of the present invention, the insulating adhesive layers and the copper foil layers are alternately arranged on a substrate, and a wiring pattern is provided on each of the copper foil layers, and the insulating property is provided. The adhesive layer is a multilayer wiring board composed of a first insulating adhesive layer and a second insulating adhesive layer, respectively, and has a bond with a coupling agent at the interface between the first and second insulating adhesive layers. A glass component layer is provided.

Therefore, in the invention described in claim 2, between the plurality of copper foil layers provided with the wiring pattern,
A first insulating adhesive layer and a second insulating adhesive layer are sandwiched and formed, and the first insulating adhesive layer and the second insulating adhesive layer are glass component layers via a coupling agent. Are formed.

As a result, in the invention according to claim 2, an insulating adhesive comprising first and second insulating adhesive layers between each of the plurality of copper foil layers provided with the wiring patterns. Adhered by layers. At this time, the first insulating adhesive layer and the second insulating adhesive layer are easily bonded because the glass component layer and the coupling agent form a chemical bond at the interface between the first insulating adhesive layer and the second insulating adhesive layer. It is possible to provide a high-performance and high-density multilayer wiring board in which a plurality of layers having extremely strong peeling strength are laminated.

In the invention according to claim 3, the insulating adhesive layer is an epoxy resin, and the coupling agent is aminosilane.

Therefore, since the coupling agent is aminosilane, it forms a glass component layer in which glass and aminosilane are chemically bonded, and the amino group of aminosilane forming this glass component layer is the insulating adhesive layer. It can react with epoxy groups to form crosslinks.

As a result, in the invention described in claim 3, in addition to the effect of claim 1 or 2, the glass component layer and the insulating adhesive layer can be firmly adhered. As a result, since the insulating adhesive layer in which the glass component layer is firmly adhered is sandwiched between the copper foil layers provided with the wiring patterns, the insulating strength is improved and a plurality of layers having a strong peeling strength are easily formed. It is possible to provide a high-performance and high-density multilayer wiring board in which the above layers are laminated.

In the invention according to claim 4, the aminosilane has an epoxy group.

Therefore, in the invention described in claim 4, the epoxy resin of the insulating adhesive layer can be ring-opening polymerized to be crosslinked.

As a result, in the invention described in claim 4, in addition to the effect of claim 3, it is possible to provide a multi-layer wiring board having further improved insulation strength and high peeling strength.

In the invention of claim 5, the glass component layer having a bond with the coupling agent is formed by glass powder immersed in an aminosilane aqueous solution.

Therefore, in the invention described in claim 4, the coupling agent is hydrolyzed by forming the coupling agent, aminosilane, into an aqueous solution to form a silanol group. And this silanol group reacts with the silanol group on the surface of the glass powder to form a covalent bond.

As a result, according to the invention of claim 5, in addition to the effect of claim 1 or 2, it is possible to form a film of aminosilane in which the surface of the glass powder is easily and firmly bonded, and Since the glass component layer consisting of the glass powder and the aminosilane aqueous solution is liquid, it can be easily and uniformly applied to the surface of the insulating adhesive layer by a coating method such as spray coating, and then heated to remove water. This makes it possible to form a glass component layer made of glass powder having a strongly bonded aminosilane film on the insulating adhesive layer.

In the invention according to claim 6, the glass component layer is formed by crushing the used multilayer wiring board.

Therefore, in the sixth aspect of the present invention, the used multilayer wiring board is crushed and used as a glass component layer of a new multilayer wiring board without being buried and discarded.

As a result, in the invention described in claim 6, in addition to the effect of claim 1 or 2, it is possible to reduce the environmental waste and the raw material cost.

According to a seventh aspect of the present invention, a multi-layer wiring board in which insulating adhesive layers and copper foil layers are alternately arranged on a substrate and a wiring pattern is provided on each of the copper foil layers is manufactured. In the method, an insulating adhesive is applied onto the substrate on which a copper foil layer provided with a wiring pattern is formed, a first insulating adhesive layer is formed, and a glass powder immersed in an aminosilane aqueous solution is applied. After spraying on the first insulating adhesive layer to form a glass component layer, the first insulating adhesive layer is cured, and the second insulating adhesive is applied on the glass component layer. To form a second insulating adhesive layer, and after spraying copper powder on the second insulating adhesive layer, the second insulating adhesive is cured and the second insulating powder is sprayed on the second insulating adhesive layer. On the conductive adhesive layer to form a copper foil layer by copper plating,
A wiring pattern is formed on the copper foil layer, the insulating adhesive is applied on the wiring pattern, and the series of steps is repeated.

Therefore, in the invention according to claim 7, an insulating adhesive is applied on the substrate on which the copper foil layer having the wiring pattern is formed to form the first insulating adhesive layer. To form. Then, before the first insulating adhesive layer is cured, the glass powder immersed in the aminosilane aqueous solution is sprayed. When the glass powder is immersed in the aminosilane aqueous solution, it reacts with the silanol groups of the hydrolyzed aminosilane to form a covalent bond, so that the glass powder is covered with the film of the aminosilane firmly bonded to the powder surface. After forming a glass component layer of the glass powder having the aminosilane coating, heating is performed to cure the first insulating adhesive layer. By heating at this time, the excess water contained in the aminosilane aqueous solution and the alcohol component produced during hydrolysis are also volatilized. Next, a second insulating adhesive layer is applied on the glass component layer, copper powder is sprayed before curing, and then the second insulating adhesive layer is cured.
Next, copper plating is performed to form a copper foil layer, a wiring pattern is formed on the copper foil layer, and then an insulating adhesive layer is applied.

In this way, a copper foil layer having a wiring pattern formed on the substrate and a glass component layer formed of glass powder and aminosilane bonded by covalent bonds are laminated on the copper foil layer. It is possible to manufacture a multilayer wiring board in which the desired number of layers are alternately laminated with the first and second insulating adhesive layers.

As a result, in the invention described in claim 7, a high-performance / high-density multilayer wiring board in which a plurality of layers having improved insulation strength and high peeling strength are laminated is easily manufactured. be able to.

[0036]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A multilayer wiring board 20 according to the present invention will be described below based on the embodiments shown in the accompanying drawings.

As shown in FIG. 1 (G), in the present embodiment, a copper foil layer 24 having a predetermined wiring pattern provided on a copper-clad glass epoxy substrate 22 and the copper foil layer 24 provided thereon. 1 having a coating of a first insulating adhesive layer 26 and a coupling agent 32 made of aminosilane having an epoxy group
A glass component layer 28 having 00 mesh of glass powder 30 spread almost without gap, a second insulating adhesive layer 34, a layer of 200 mesh of copper powder 36 spread with almost no gap, and a predetermined wiring pattern provided thereon. The copper foil layer 38 thus formed is laminated.

In this embodiment, the first and second insulating adhesive layers 26 and 34 are 50 μm and 10 μm, respectively.
The copper foil layers 24 and 38 are both formed to have a thickness of 35 μm.

The surface of the copper-clad glass epoxy substrate 22 and the copper foil layer 24, and the copper powder 36 and the copper foil layer 38 are firmly bonded by metal bonding.

Coupling agent 32 for covering the surface of glass powder 30, that is, aminosilane 32 having an epoxy group.
Are covalently bonded to the surface of the glass powder 30 through the silanol group to form the glass component layer 28. Further, the glass component layer 28 and the upper and lower first and second insulating adhesive layers 26 and 34 are integrated by cross-linking with the epoxy group of the coupling agent 32 contained in the glass component layer 28. There is.

Next, the manufacturing process of the multilayer wiring board 20 according to the present invention will be described.

In the present embodiment, first, referring to FIG.
As shown in (A), a copper foil layer 24 provided with a wiring pattern is formed on the copper-clad glass epoxy substrate 22. The copper foil layer 24 is obtained by forming a film by copper plating using copper sulfate and then forming a desired wiring pattern by a photolithography method. By using the copper-clad glass epoxy substrate 22, the copper provided on the substrate 22 in advance and the copper foil layer 24 formed by copper plating are firmly bonded by metal bonding, and the copper foil layer is formed. 24 will be deposited on the copper-clad glass epoxy substrate 22.

Next, as shown in FIG.
An epoxy resin is applied onto the copper foil layer 24 by a screen printing method to form a first insulating adhesive layer 26.

In the present embodiment, the aminosilane 32 used as the coupling agent 32 is trimethoxysilane having an epoxy group and an amino group, which is used as an aqueous solution. Aminosilane 32 is hydrolyzed by having an aqueous solution and has a silanol group,
Methanol is produced as a by-product. Therefore, when the glass powder 30 is immersed in the aminosilane aqueous solution, the silanol groups of the hydrolyzed aminosilane 32 and the silanol groups present on the surface of the glass powder 30 react to cause a dehydration reaction to form a covalent bond. As a result, a film of aminosilane 32 that is firmly bonded is formed on the surface of the glass powder 30. Further, in this embodiment, 100-mesh glass powder 30 is used.

The first insulating adhesive layer 26 is
Before curing, as shown in FIG. 1 (C), a mixed solution of an aminosilane aqueous solution and glass powder 30 is spray gun-coated to cover the surface of the first insulating adhesive layer 26 with the glass powder 30 without any gap. Sprinkle as you see. Next, the first insulating adhesive layer 26 is cured by heating. During this heat curing, water in the aminosilane aqueous solution and aminosilane 32
Impurities such as methanol and aminosilane 32 produced when the water is hydrolyzed and water produced when the glass powder 30 is dehydrated are spontaneously volatilized and removed.

Further, in this embodiment, the aminosilane 32 used has an epoxy group. for that reason,
When used as an aqueous solution of aminosilane 32, the hydroxyl groups of water promote ring-opening polymerization of the epoxy groups contained in aminosilane 32 and the epoxy groups contained in first insulating adhesive layer 26. In addition, the amino group contained in the aminosilane 32 can function as an initiator of ring-opening polymerization of the epoxy resin, and thus the crosslinking of the epoxy resin is promoted.
Therefore, the first insulating adhesive layer 26 and the glass component layer 28
The bonding strength of the steel sheet is improved and the peeling strength is also increased.

Next, as shown in FIG.
An epoxy resin is applied on the glass component layer 28 by a screen printing method to form a second insulating adhesive layer 34. Then, as shown in FIG. 1E, while the second insulating adhesive layer 34 is in an uncured state, 200-mesh copper powder 36 is evenly dispersed so that there is almost no gap on the surface thereof. ,
Then, the second insulating adhesive layer 34 is cured by heating. Thereby, the copper powder 36 can be firmly fixed to the surface of the second insulating adhesive layer 34.

On the second insulating adhesive layer 34 to which the copper powder 36 is fixed, copper sulfate is further plated with copper sulfate to form a copper foil layer 38, as shown in FIG. 1 (F). To do.
At this time, since the copper powder 36 is fixed on the surface of the second insulating adhesive layer 34 for copper plating, the copper foil layer 38 forms a metal bond with the copper powder 36, and the copper foil layer 38 is firmly bonded to the first layer. The two insulating adhesive layers 34 are bonded and formed into a film.

In the present embodiment, the thickness of the formed copper foil layer 38 was 35 μm.

Then, as shown in FIG. 1G, a desired wiring pattern is formed on the copper foil layer 38 by a photolithography method to form a multilayer wiring board 20 having two kinds of wiring patterns. It can be manufactured.

By repeating the steps of FIGS. 1B to 1F, the multilayer wiring board 20 having a desired number of layers can be obtained.
Can be manufactured.

The multilayer wiring board 20 according to the present invention is mainly composed of a glass epoxy board as a board, and an epoxy resin and a glass powder 30 as an insulating layer between wiring patterns as main components. Therefore, the used multilayer wiring board 20 can be crushed to a desired particle size and recycled as the glass powder 30 used for the glass component layer 28.

In this embodiment, the epoxy resin is used as the insulating adhesive, but it is also possible to use a silicon adhesive. Also, instead of the copper powder 36,
It is also possible to use nickel powder or the like.

Further, in the present embodiment, 100
Although mesh glass powder 30 and 300 mesh copper powder 36 were used, it is also possible to use glass powder 30 and copper powder 36 of different particle sizes. However, the smaller the particle size of the glass powder 30 and the copper powder 36, the larger the contact area with the materials that come into contact with each other, so that they can bond more firmly and the peeling strength can be improved. In particular, with respect to the glass powder 30, the smaller the particle diameter, the more the coating amount of the coupling agent increases, which is more preferable.

Further, in the present embodiment, the glass powder 32 dipped in the aminosilane aqueous solution was sprayed on the first insulating adhesive layer 26 by using a spray gun. It is also possible to form the glass component layer 28 on the surface of the adhesive layer 26.

When the first and second insulating adhesive layers 26 and 34 are heat-cured after the moisture absorption treatment, the glass component layer 28 and the first and second insulating adhesive layers 26 and 34 adhere to each other. It is possible to improve power.

Table 1 shows the glass component layer 28 formed between the first and second insulating adhesive layers 26 and 34 according to the present invention.
And the copper foil layer 38 obtained by the conventional multilayer wiring board using only the glass powder 30 in the glass component layer 28 formed between the first and second insulating adhesive layers 26 and 34. Peel strength is shown. The peel strength shown in Table 1 is the copper foil layer 38.
Is a numerical value obtained when the film thickness is 18 μm.

[0058]

[Table 1]

As shown in Table 1, as compared with the conventional multi-layer wiring board formed by directly sandwiching the glass powder 30 between the first and second insulating adhesive layers 26 and 34, A multilayer wiring board 20 according to the present invention formed by sandwiching a glass component layer 28 having a coating of a coupling agent 32 on the surface of a glass powder 30 between first and second insulating adhesive layers 26, 34. Shows a large peel strength,
A significant improvement in peel strength can be seen.

[0060]

According to the first aspect of the invention, the copper foil layers can be easily bonded by the chemical bonding force between the coupling agent and the glass component layer without applying high temperature and high pressure. It is possible to provide a high-performance and high-density multilayer wiring board in which a plurality of layers having strong peeling strength are laminated.

According to the second aspect of the present invention, the respective layers of the plurality of copper foil layers provided with the wiring patterns are adhered by the insulating adhesive layer composed of the first and second insulating adhesive layers. Has been done. At this time, the first insulating adhesive layer and the second insulating adhesive layer are easily bonded because the glass component layer and the coupling agent form a chemical bond at the interface between the first insulating adhesive layer and the second insulating adhesive layer. It is possible to provide a high-performance and high-density multilayer wiring board in which a plurality of layers having extremely strong peeling strength are laminated.

According to the invention of claim 3, in addition to the effect of claim 1 or 2, it is possible to firmly bond the glass component layer and the insulating adhesive layer. As a result, an insulating adhesive layer that firmly adheres the glass component layer is sandwiched between the copper foil layers provided with the wiring pattern, and thus laminated,
It is possible to provide a high-performance / high-density multilayer wiring board in which a plurality of layers having improved insulation strength and high peeling strength are stacked easily.

According to the invention described in claim 4, in addition to the effect of claim 3, it is possible to provide a multi-layer wiring board having a further improved insulation strength and a high peeling strength.

According to the invention of claim 5, in addition to the effect of claim 1 or 2, it is possible to easily form a film of aminosilane in which the surface of the glass powder is firmly bonded.
In addition, since the glass component layer consisting of the glass powder and the aminosilane aqueous solution is liquid, it can be easily and uniformly applied to the surface of the insulating adhesive layer by a coating method such as spray coating, and then heated to remove water. By doing so, it is possible to form a glass component layer made of glass powder having a strongly bonded aminosilane film on the insulating adhesive layer.

According to the invention described in claim 6, in addition to the effect of claim 1 or 2, it is possible to reduce the environmental waste and the raw material cost.

According to the seventh aspect of the present invention, it is possible to improve the insulation strength and easily manufacture a high-performance / high-density multilayer wiring board in which a plurality of layers having a strong peeling strength are laminated. .

[Brief description of drawings]

FIG. 1 is a schematic view showing a manufacturing process of a multilayer wiring board according to the present invention.

[Explanation of symbols]

20 multilayer wiring board 22 Copper-clad glass epoxy board 24 Copper foil layer 26 First Insulating Adhesive Layer 28 Glass component layer 30 glass powder 32 Coupling agent (aminosilane) 34 Second insulating adhesive layer 36 Copper powder 38 Copper foil layer

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tadashi Shimizu             4-16-7 Tajiri, Ichikawa City, Chiba Prefecture (72) Inventor Masafumi Miyazaki             34-6 Hasunuma-cho, Itabashi-ku, Tokyo (72) Inventor Teruhisa Tanabe             1-18-8 Honta, Urawa City, Saitama Prefecture F-term (reference) 5E343 AA02 AA17 BB16 BB24 BB71                       BB78 CC03 CC06 DD43 GG01                 5E346 AA05 AA12 AA15 AA16 AA32                       AA35 AA38 BB01 CC09 CC16                       CC32 CC41 CC43 DD03 DD22                       DD32 EE31 GG17 GG22 GG28                       HH11 HH40

Claims (7)

[Claims] 1. A multilayer wiring board in which an insulating adhesive layer and copper foil layers are alternately arranged, and a wiring pattern is provided on each of the copper foil layers, wherein the insulating adhesive layer is a coupling. A multilayer wiring board comprising a glass component layer having a bond with an agent. 2. An insulating adhesive layer and copper foil layers are alternately arranged on a substrate, and a wiring pattern is provided on each of the copper foil layers.
The insulative adhesive layer is a multilayer wiring board composed of a first insulative adhesive layer and a second insulative adhesive layer, respectively. A multilayer wiring board, wherein a glass component layer having a bond is provided. 3. The multilayer wiring board according to claim 1 or 2, wherein the insulating adhesive layer is an epoxy resin and the coupling agent is aminosilane. 4. The multilayer wiring board according to claim 3, wherein the aminosilane has an epoxy group. 5. The multilayer wiring board according to claim 1, wherein the glass component layer having a bond with the coupling agent is formed by glass powder dipped in an aminosilane aqueous solution. 6. The glass component layer is formed by crushing a used multilayer wiring board.
Alternatively, the multilayer wiring board described in 2. 7. A method for manufacturing a multilayer wiring board, wherein an insulating adhesive layer and a copper foil layer are alternately arranged on a substrate, and a wiring pattern is provided on each of the copper foil layers, wherein the wiring pattern is provided. An insulating adhesive is applied to the substrate on which the copper foil layer has been formed to form a first insulating adhesive layer, and glass powder immersed in an aqueous solution of aminosilane is placed on the first insulating adhesive layer. After spraying to form a glass component layer, the first insulating adhesive layer is cured, and a second insulating adhesive is applied on the glass component layer to form a second insulating adhesive layer. Then, after spraying the copper powder on the second insulating adhesive layer, the second insulating adhesive is cured, on the second insulating adhesive layer sprinkled with the copper powder, copper plating. To form a copper foil layer, form a wiring pattern on the copper foil layer, On the turn, and applying the insulating adhesive,
A method for manufacturing a multilayer wiring board, characterized by repeating the above-mentioned series of steps.