JP4522560B2 - Multilayer wiring board and manufacturing method thereof - Google Patents

Multilayer wiring board and manufacturing method thereof Download PDF

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JP4522560B2
JP4522560B2 JP2000263635A JP2000263635A JP4522560B2 JP 4522560 B2 JP4522560 B2 JP 4522560B2 JP 2000263635 A JP2000263635 A JP 2000263635A JP 2000263635 A JP2000263635 A JP 2000263635A JP 4522560 B2 JP4522560 B2 JP 4522560B2
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insulating
copper foil
prepreg
insulating prepreg
core substrate
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JP2002076621A (en
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晋一 赤井
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Elna Co Ltd
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Elna Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、多層配線基板における銅箔と絶縁性プリプレグとの接着強度を向上させた多層配線基板とその製造方法に関するものである。
【０００２】
【従来の技術】
最近の多層配線基板は、益々の高密度化と製造工程の単純化が進んでいるが、それにも増して品質の向上が望まれている。
最近の高密度化された多層配線基板１８の一種として、図５に示すようなものが知られている（特開平１１−２８４３５０）。
これは、図３に示すように、中心部の絶縁性コア基板１０と、この絶縁性コア基板１０の両側に配置されている厚さが３０〜１００μｍ程度の絶縁性プリプレグ１２と、さらにこの絶縁性プリプレグ１２の外側に配置されている厚さが１０〜５０μｍ程度の銅箔１３とを主に具備して構成されている。
前記絶縁性コア基板１０には、少なくともいずれか一方の面に、この例では両面に、配線パターン１１が形成されている。この絶縁性コア基板１０は、スルーホールを具備したものであってもよい。前記配線パターン１１の一方の面には、対応する絶縁性コア基板１０の配線パターン１１に対応するように、導電性の銀ペーストの印刷と乾燥を行って円錐状に形成した導電性バンプ１４を設けてある。
【０００３】
このようにして形成された絶縁性コア基板１０の両面の配線パターン１１に、それぞれ絶縁性プリプレグ１２と銅箔１３を順次積層し、加熱しながらプレスする。すると、絶縁性プリプレグ１２は、基材に絶縁性樹脂を含浸させてあって半硬化状態にあるため、加熱されると一時的に軟化して図４に示すように銅箔１３の導電性バンプ１４がこの絶縁性プリプレグ１２を貫通して絶縁性コア基板１０の対応する位置の配線パターン１１に圧着して電気的に接続される。絶縁性プリプレグ１２は、加熱されることにより、絶縁性樹脂が一旦溶融した後に硬化するので、絶縁体層と接着層とを兼ね備えた状態で絶縁性コア基板１０に固着される。
積層接着された外表面の銅箔１３は、通常の露光処理やその他の電気化学的処理により図５に示すように配線パターン１５が形成される。
【０００４】
【発明が解決しようとする課題】
以上のような方法で形成された従来の多層配線基板１８では、銅箔１３と絶縁性プリプレグ１２との接着強度がやや不十分であったため、銅箔１３又はパターン化処理後の配線パターン１５が剥離する恐れがあった。
【０００５】
本発明は、銅箔１３と絶縁性プリプレグ１２との接着強度を高めて銅箔１３が剥離するのを防止した多層配線基板とその製造方法を提供することを目的とするものである。
【０００９】
【課題を解決するための手段】
請求項１に記載の発明によれば、配線パターン１１を形成した絶縁性コア基板１０に絶縁性プリプレグ１２を介して銅箔１３を積層し、この銅箔１３に一体に形成した導電性バンプ１４をもって前記絶縁性プリプレグ１２を嵌挿して絶縁性コア基板１０の配線パターン１１に圧着接合し、前記銅箔１３により配線パターン１５を形成してなる多層配線基板１８において、前記絶縁性プリプレグ１２における少なくとも銅箔１３との接合面に接着力を向上させるための表面処理として絶縁性プリプレグ１２に防錆処理剤を塗布して、銅箔１３との接着後の表面の腐食を防止する塗膜面１７を形成したことを特徴とする多層配線基板である。
【００１４】
請求項２に記載の発明によれば、絶縁性プリプレグ１２における少なくとも一方の接合面に、接着力を向上させるための塗膜面１７を絶縁性プリプレグ１２の表面に塗布することにより形成する工程と、絶縁性コア基板１０に配線パターン１１を形成する工程と、銅箔１３に導電性バンプ１４を一体に形成する工程と、前記絶縁性プリプレグ１２の塗膜面１７を塗布した側に銅箔１３の導電性バンプ１４を向けて積層し、絶縁性プリプレグ１２の他方の面に前記絶縁性コア基板１０を積層する工程と、前記絶縁性コア基板１０、絶縁性プリプレグ１２及び銅箔１３を加熱と加圧により、前記導電性バンプ１４をもって絶縁性プリプレグ１２を嵌挿して絶縁性コア基板１０の配線パターン１１に圧着接続するとともに、絶縁性コア基板１０、絶縁性プリプレグ１２及び銅箔１３を一体化する工程と、前記銅箔１３により配線パターン１５を形成する工程とからなり、前記絶縁性プリプレグ１２に接着力向上のための塗膜面１７を表面に塗布することにより形成する工程は、絶縁性プリプレグ１２に防錆処理剤を塗布して塗膜面１７を形成することにより、銅箔１３との接着後の表面の腐食を防止する防錆処理剤塗布方法からなることを特徴とする多層配線基板の製造方法である。
【００１６】
【発明の実施の形態】
本発明は、銅箔１３と絶縁性プリプレグ１２とを接合する際に、絶縁性プリプレグ１２の表面処理をして相互の接着強度を高めようとするものである。表面処理には、絶縁性プリプレグ１２の表面に凹凸面１６を形成する方法、絶縁性プリプレグ１２の表面を機械的、化学的方法等により改質する方法と、絶縁性プリプレグ１２の表面に接着力を高めるための表面処理剤を塗布する方法とがある。
【００１７】
表面に凹凸面１６を形成する方法には、コロナ放電処理方法、酸素又は窒素プラズマ処理方法等があり、表面を改質する方法には、フレーム（炎）であぶる方法等の機械的な処理を加える方法、溶剤処理方法等の化学的処理方法、その他、紫外線照射による方法等があり、表面に塗布する方法には、プライマー処理方法、防錆処理剤塗布方法等がある。
【００１８】
以下、本発明の具体的実施例を図１及び図２に基づき説明する。
１．表面に凹凸面を形成する方法（第１実施例）
図１は、銅箔１３と絶縁性プリプレグ１２とを接合する際に、絶縁性プリプレグ１２の表面を機械的、化学的方法等により凹凸面１６を形成する例を示すものである。
この図１において、絶縁性プリプレグ１２は、銅箔１３との接合面側に前記凹凸面１６を形成したものである。この凹凸面１６は、絶縁性コア基板１０との接合面側にも形成するようにしてもよい。
前記絶縁性プリプレグ１２は、ガラス繊維からなる基材にエポキシ樹脂を含浸させて半硬化状態にしたフィルム状物からなり、厚さが例えば１００μｍとすると、数μｍ程度のあまり大きくない凹凸であって、かつ、絶縁性プリプレグ１２と銅箔１３の接着面同士がぴったり合うような平らなものであることが望ましい。絶縁性プリプレグ１２以外の構成は、図３と同様である。
【００１９】
表面に凹凸面を形成する具体的方法には、つぎのようなものがある。
（１）コロナ放電処理方法
コロナ放電が生ずる電解内を絶縁性プリプレグ１２を通過させ、絶縁性プリプレグ１２の樹脂表面に凹凸面１６を形成することで、絶縁性プリプレグ１２の表面のぬれを良くして接着性を向上させる。
【００２０】
（２）酸素又は窒素プラズマ処理方法
絶縁性プリプレグ１２を酸素又は窒素プラズマ処理すると、絶縁性プリプレグ１２の表面は、経時変化を起し、接触角が大きくなり凹凸面１６が形成され、これにより、絶縁性プリプレグ１２の表面のぬれを良くして接着性を向上させる。
【００２１】
２．表面を改質する方法（第２実施例）
この第２実施例では、銅箔１３と絶縁性プリプレグ１２とを接合する際に、絶縁性プリプレグ１２の表面を機械的、化学的方法等により改質している。
絶縁性プリプレグ１２は、銅箔１３との接合面側の表面を改質したものである。しかし、一方の面だけでなく、絶縁性コア基板１０との接合面側も改質するようにしてもよい。
【００２２】
表面を改質する具体的方法には、つぎのようなものがある。
（１）フレーム（炎）であぶる方法
絶縁性プリプレグ１２を移動させながらその表面をガスのフレーム（炎）であぶることにより、絶縁性プリプレグ１２の表面の分子に酸素を結合又は二重結合を導入して表面を改質する。これにより、絶縁性プリプレグ１２の表面のぬれを良くして接着性を向上させる。
【００２３】
（２）溶剤処理方法
塩素系溶剤などで絶縁性プリプレグ１２の表面を洗浄すると、絶縁性プリプレグ１２の表面に付着した添加剤類や未反応モノマー等が除去され、表面が改質される。これにより、絶縁性プリプレグ１２の表面のぬれを良くして接着性を向上させる。
【００２４】
（３）紫外線照射処理（ＤＵＶ）による方法
低圧水銀ランプ等を使用して絶縁性プリプレグ１２に紫外線を照射することにより絶縁性プリプレグ１２の表面が改質される。これにより、絶縁性プリプレグ１２の表面のぬれを良くして接着性を向上させる。
【００２５】
３．表面に塗布する方法（第３実施例）
図２は、銅箔１３と絶縁性プリプレグ１２とを接合する際に、絶縁性プリプレグ１２の表面に接着強度を向上させるための塗膜面１７を塗布した第３実施例を示すものである。
この図２において、絶縁性プリプレグ１２は、銅箔１３との接合面側に塗膜面１７を形成したものである。この塗膜面１７は、絶縁性コア基板１０との接合面側にも形成するようにしてもよい。
前記絶縁性プリプレグ１２は、ガラス繊維からなる基材にエポキシ樹脂を含浸させて半硬化状態にしたフィルム状物からなり、厚さが例えば１００μｍとすると、塗膜面１７は、数μｍ程度であって、かつ、絶縁性プリプレグ１２と銅箔１３の接着面同士がぴったり合うような平らなものであることが望ましい。絶縁性プリプレグ１２以外の構成は、図３と同様である。
【００２６】
表面に塗布する具体的方法には、つぎのようなものがある。
（１）プライマー処理方法
銅箔１３に対して接着性の優れたコーティング材（プライマー）を塗布して塗膜面１７を形成しておく。この塗膜面１７は、接着性のみならず、絶縁性を有することが必須である。この塗膜面１７の具体例としては、ビニルアセタール・フェノール系接着剤、ニトリルゴム・フェノール系接着剤、ナイロン・エポキシ系接着剤、ニトリルゴム・エポキシ系接着剤、エポキシ・フェノール系接着剤、１液エポキシ系接着剤、ポリイミド系接着剤、ポリベンツイミダゾール系接着材等が上げられる。これにより、絶縁性プリプレグ１２と銅箔１３との接着性を向上させる。
【００２７】
（２）防錆処理剤塗布方法
絶縁性プリプレグ１２に防錆処理剤を塗布して塗膜面１７を形成することにより、絶縁性プリプレグ１２の表面の変質が防止され、銅箔１３との接着後の表面の腐食を防止し、結果として、接着力が向上する。防錆処理剤の具体的例としては、ベンゾトリアゾールが上げられる。
【００３１】
【発明の効果】
請求項１に記載の発明によれば、絶縁性プリプレグ１２における少なくとも銅箔１３との接合面に接着力向上のための塗膜面１７を形成したので、塗膜面１７によって銅箔１３と絶縁性プリプレグ１２間の接着力が塗膜面１７によってより一層高くなり、銅箔１３の剥離を防止し、高品質の多層配線基板を提供できる。
【００３６】
請求項２に記載の発明によれば、絶縁性プリプレグ１２における少なくとも一方の接合面に、接着力を向上させるための塗膜面１７を絶縁性プリプレグ１２の表面に塗布することにより形成し、塗膜面１７を表面に塗布することにより形成する工程は、絶縁性プリプレグ１２に防錆処理剤を塗布して塗膜面１７を形成することにより、絶縁性プリプレグ１２の表面の変質の防止と銅箔１３との接着後の表面の腐食を防止するので、高品質の多層配線基板を得るための製造方法を提供できる。
【図面の簡単な説明】
【図１】本発明による多層配線基板とその製造方法の第１実施例（絶縁性プリプレグ１２の表面に凹凸を形成する方法）を示す積層前の分解断面図である。
【図２】本発明による多層配線基板とその製造方法の第３実施例（絶縁性プリプレグ１２の表面に塗膜面を形成する方法）を示す積層前の分解断面図である。
【図３】従来の多層配線基板とその製造方法を示す積層前の分解断面図である。
【図４】図３の後で絶縁性コア基板１０、絶縁性プリプレグ１２、銅箔１３を積層した断面図である。
【図５】図４の後で銅箔１３により配線パターン１５を形成した断面図である。
【符号の説明】
１０…絶縁性コア基板、１１…配線パターン、１２…絶縁性プリプレグ、１３…銅箔、１４…導電性バンプ、１５…配線パターン、１６…凹凸面、１７…塗膜面、１８…多層配線基板。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer wiring board in which the adhesive strength between a copper foil and an insulating prepreg in the multilayer wiring board is improved, and a method for manufacturing the same.
[0002]
[Prior art]
In recent multilayer wiring boards, the density has been increased and the manufacturing process has been simplified. However, further improvement in quality is desired.
As a kind of recent high-density multilayer wiring board 18, one shown in FIG. 5 is known (Japanese Patent Laid-Open No. 11-284350).
As shown in FIG. 3, the insulating core substrate 10 in the central portion, the insulating prepreg 12 having a thickness of about 30 to 100 μm disposed on both sides of the insulating core substrate 10, and the insulation The copper foil 13 having a thickness of about 10 to 50 μm disposed mainly on the outer side of the conductive prepreg 12 is configured.
A wiring pattern 11 is formed on at least one surface of the insulating core substrate 10, in this example, on both surfaces. This insulating core substrate 10 may have a through hole. On one surface of the wiring pattern 11, conductive bumps 14 formed in a conical shape by printing and drying a conductive silver paste so as to correspond to the wiring pattern 11 of the corresponding insulating core substrate 10 are provided. It is provided.
[0003]
An insulating prepreg 12 and a copper foil 13 are sequentially laminated on the wiring patterns 11 on both surfaces of the insulating core substrate 10 thus formed, and pressed while heating. Then, since the insulating prepreg 12 is impregnated with an insulating resin and is in a semi-cured state, the insulating prepreg 12 is temporarily softened when heated and the conductive bumps of the copper foil 13 as shown in FIG. 14 penetrates the insulating prepreg 12 and is crimped and electrically connected to the wiring pattern 11 at a corresponding position of the insulating core substrate 10. The insulating prepreg 12 is heated and then cured after the insulating resin is once melted. Therefore, the insulating prepreg 12 is fixed to the insulating core substrate 10 in a state of having both an insulator layer and an adhesive layer.
As shown in FIG. 5, a wiring pattern 15 is formed on the copper foil 13 on the outer surface, which is laminated and bonded, by a normal exposure process or other electrochemical process.
[0004]
[Problems to be solved by the invention]
In the conventional multilayer wiring board 18 formed by the method as described above, the adhesive strength between the copper foil 13 and the insulating prepreg 12 is slightly insufficient, so that the copper foil 13 or the wiring pattern 15 after the patterning process is formed. There was a risk of peeling.
[0005]
An object of the present invention is to provide a multilayer wiring board in which the adhesive strength between the copper foil 13 and the insulating prepreg 12 is increased to prevent the copper foil 13 from peeling off and a method for manufacturing the same.
[0009]
[Means for Solving the Problems]
According to the invention described in claim 1 , the copper foil 13 is laminated on the insulating core substrate 10 on which the wiring pattern 11 is formed via the insulating prepreg 12, and the conductive bump 14 formed integrally with the copper foil 13. In the multilayer wiring board 18 in which the insulating prepreg 12 is inserted and pressure bonded to the wiring pattern 11 of the insulating core substrate 10 and the wiring pattern 15 is formed by the copper foil 13, at least in the insulating prepreg 12 As a surface treatment for improving the adhesive force on the joint surface with the copper foil 13, a rust preventive agent is applied to the insulating prepreg 12 to prevent corrosion of the surface after the adhesion with the copper foil 13. A multilayer wiring board characterized in that is formed.
[0014]
According to the second aspect of the present invention, the step of forming the coating surface 17 for improving the adhesive force on the surface of the insulating prepreg 12 is formed on at least one joint surface of the insulating prepreg 12. The step of forming the wiring pattern 11 on the insulating core substrate 10, the step of integrally forming the conductive bumps 14 on the copper foil 13, and the copper foil 13 on the side where the coating film surface 17 of the insulating prepreg 12 is applied. The conductive bumps 14 are laminated and the insulating core substrate 10 is laminated on the other surface of the insulating prepreg 12, and the insulating core substrate 10, the insulating prepreg 12 and the copper foil 13 are heated. By applying pressure, the insulating prepreg 12 is inserted with the conductive bumps 14 to be crimped and connected to the wiring pattern 11 of the insulating core substrate 10. A step of integrating the sex prepreg 12 and the copper foil 13, the copper foil 13 Ri Do and a step of forming a wiring pattern 15 by a coated surface 17 for adhesion improvement in the insulating prepreg 12 on the surface The step of forming by applying is to apply a rust preventive agent to the insulating prepreg 12 to form a coating film surface 17, thereby preventing corrosion of the surface after bonding with the copper foil 13. a method for manufacturing a multilayer wiring board, wherein Rukoto a from coating methods.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, when the copper foil 13 and the insulating prepreg 12 are bonded, the surface treatment of the insulating prepreg 12 is performed to increase the mutual adhesive strength. For the surface treatment, a method of forming an uneven surface 16 on the surface of the insulating prepreg 12, a method of modifying the surface of the insulating prepreg 12 by a mechanical or chemical method, and an adhesive force on the surface of the insulating prepreg 12. There is a method of applying a surface treatment agent for increasing the viscosity.
[0017]
The method for forming the uneven surface 16 on the surface includes a corona discharge treatment method, an oxygen or nitrogen plasma treatment method, and the method for modifying the surface includes mechanical treatment such as a flame (flame) method. There are a chemical treatment method such as an addition method, a solvent treatment method and the like, a method by ultraviolet irradiation, and a method of applying to the surface includes a primer treatment method and a rust preventive treatment method.
[0018]
A specific embodiment of the present invention will be described below with reference to FIGS.
1. Method for forming an uneven surface on the surface (first embodiment)
FIG. 1 shows an example in which an uneven surface 16 is formed on the surface of the insulating prepreg 12 by a mechanical or chemical method when the copper foil 13 and the insulating prepreg 12 are bonded.
In FIG. 1, the insulating prepreg 12 has the uneven surface 16 formed on the side of the bonding surface with the copper foil 13. The uneven surface 16 may also be formed on the side of the bonding surface with the insulating core substrate 10.
The insulating prepreg 12 is made of a film-like material in which a glass fiber base material is impregnated with an epoxy resin so as to be in a semi-cured state. In addition, it is desirable that the insulating prepreg 12 and the copper foil 13 be flat so that the bonding surfaces are closely matched. The configuration other than the insulating prepreg 12 is the same as that shown in FIG.
[0019]
Specific methods for forming an uneven surface on the surface include the following.
(1) Corona discharge treatment method By passing the insulating prepreg 12 through the electrolysis in which corona discharge occurs, and forming the irregular surface 16 on the resin surface of the insulating prepreg 12, the surface of the insulating prepreg 12 is improved in wettability. To improve adhesion.
[0020]
(2) Oxygen or nitrogen plasma treatment method When the insulating prepreg 12 is treated with oxygen or nitrogen plasma, the surface of the insulating prepreg 12 changes with time, the contact angle increases, and the irregular surface 16 is formed. The wettability of the surface of the insulating prepreg 12 is improved to improve the adhesion.
[0021]
2. Method for modifying the surface (second embodiment)
In the second embodiment, when the copper foil 13 and the insulating prepreg 12 are joined, the surface of the insulating prepreg 12 is modified by a mechanical or chemical method.
The insulating prepreg 12 is obtained by modifying the surface on the side of the joint surface with the copper foil 13. However, not only the one surface but also the side of the bonding surface with the insulating core substrate 10 may be modified.
[0022]
Specific methods for modifying the surface include the following.
(1) Method of blowing with flame (flame) By moving the insulating prepreg 12 while moving the surface with a gas flame (flame), oxygen is bonded to the molecules on the surface of the insulating prepreg 12 or double bonds are introduced. To modify the surface. This improves the wettability of the surface of the insulating prepreg 12 and improves the adhesion.
[0023]
(2) Solvent treatment method When the surface of the insulating prepreg 12 is washed with a chlorinated solvent or the like, additives, unreacted monomers and the like attached to the surface of the insulating prepreg 12 are removed, and the surface is modified. This improves the wettability of the surface of the insulating prepreg 12 and improves the adhesion.
[0024]
(3) Method by ultraviolet irradiation treatment (DUV) The surface of the insulating prepreg 12 is modified by irradiating the insulating prepreg 12 with ultraviolet rays using a low-pressure mercury lamp or the like. This improves the wettability of the surface of the insulating prepreg 12 and improves the adhesion.
[0025]
3. Method of applying to the surface (third embodiment)
FIG. 2 shows a third embodiment in which a coating film surface 17 for improving the adhesive strength is applied to the surface of the insulating prepreg 12 when the copper foil 13 and the insulating prepreg 12 are bonded.
In FIG. 2, the insulating prepreg 12 has a coating film surface 17 formed on the bonding surface side with the copper foil 13. The coating film surface 17 may also be formed on the bonding surface side with the insulating core substrate 10.
The insulating prepreg 12 is made of a film-like material in which a base material made of glass fiber is impregnated with an epoxy resin to be in a semi-cured state. When the thickness is, for example, 100 μm, the coating film surface 17 is about several μm. In addition, it is desirable that the insulating prepreg 12 and the copper foil 13 be flat so that the bonding surfaces of the copper foil 13 are closely fitted to each other. The configuration other than the insulating prepreg 12 is the same as that shown in FIG.
[0026]
Specific methods of applying to the surface include the following.
(1) Primer treatment method A coating material (primer) having excellent adhesion is applied to the copper foil 13 to form a coating film surface 17. It is essential that the coating surface 17 has not only adhesiveness but also insulation. Specific examples of the coating surface 17 include vinyl acetal / phenolic adhesive, nitrile rubber / phenolic adhesive, nylon / epoxy adhesive, nitrile rubber / epoxy adhesive, epoxy / phenolic adhesive, 1 Liquid epoxy adhesives, polyimide adhesives, polybenzimidazole adhesives, and the like are listed. Thereby, the adhesiveness of the insulating prepreg 12 and the copper foil 13 is improved.
[0027]
(2) Rust-proofing agent coating method By applying a rust-proofing agent to the insulating prepreg 12 to form the coating film surface 17, alteration of the surface of the insulating prepreg 12 is prevented and adhesion to the copper foil 13 is achieved. Prevents subsequent corrosion of the surface, resulting in improved adhesion. A specific example of the rust inhibitor is benzotriazole.
[0031]
【The invention's effect】
According to the invention described in claim 1 , since the coating film surface 17 for improving the adhesive force is formed on at least the bonding surface of the insulating prepreg 12 with the copper foil 13, the coating film surface 17 is insulated from the copper foil 13. The adhesive force between the conductive prepregs 12 is further increased by the coating film surface 17, the peeling of the copper foil 13 can be prevented, and a high-quality multilayer wiring board can be provided.
[0036]
According to the invention described in claim 2, at least one of the bonding surfaces of the base insulating prepreg 12, the coated surface 17 for improving the adhesion was formed by coating on the surface of an insulating prepreg 12, The step of forming the coating film surface 17 by applying the coating film surface 17 to the surface is to prevent the alteration of the surface of the insulating prepreg 12 by applying a rust preventive agent to the insulating prepreg 12 to form the coating film surface 17. Since corrosion of the surface after bonding with the copper foil 13 is prevented, a manufacturing method for obtaining a high-quality multilayer wiring board can be provided.
[Brief description of the drawings]
FIG. 1 is an exploded cross-sectional view before lamination showing a first embodiment (a method for forming irregularities on the surface of an insulating prepreg 12) of a multilayer wiring board and a method for manufacturing the same according to the present invention.
FIG. 2 is an exploded cross-sectional view before lamination showing a third embodiment (a method of forming a coating film surface on the surface of an insulating prepreg 12) of the multilayer wiring board and the manufacturing method thereof according to the present invention.
FIG. 3 is an exploded cross-sectional view showing a conventional multilayer wiring board and a manufacturing method thereof before lamination.
4 is a cross-sectional view in which an insulating core substrate 10, an insulating prepreg 12, and a copper foil 13 are laminated after FIG. 3;
5 is a cross-sectional view in which a wiring pattern 15 is formed from a copper foil 13 after FIG. 4;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Insulating core board | substrate, 11 ... Wiring pattern, 12 ... Insulating prepreg, 13 ... Copper foil, 14 ... Conductive bump, 15 ... Wiring pattern, 16 ... Uneven surface, 17 ... Coating film surface, 18 ... Multilayer wiring board .

Claims (2)

配線パターン１１を形成した絶縁性コア基板１０に絶縁性プリプレグ１２を介して銅箔１３を積層し、この銅箔１３に一体に形成した導電性バンプ１４をもって前記絶縁性プリプレグ１２を嵌挿して絶縁性コア基板１０の配線パターン１１に圧着接合し、前記銅箔１３により配線パターン１５を形成してなる多層配線基板１８において、前記絶縁性プリプレグ１２における少なくとも銅箔１３との接合面に接着力を向上させるための表面処理として、絶縁性プリプレグ１２に防錆処理剤を塗布して、銅箔１３との接着後の表面の腐食を防止する塗膜面１７を形成したことを特徴とする多層配線基板。A copper foil 13 is laminated on an insulating core substrate 10 on which a wiring pattern 11 is formed via an insulating prepreg 12, and the insulating prepreg 12 is inserted and insulated with conductive bumps 14 formed integrally with the copper foil 13. In the multilayer wiring board 18 formed by pressure bonding to the wiring pattern 11 of the conductive core substrate 10 and forming the wiring pattern 15 with the copper foil 13, an adhesive force is applied to at least the bonding surface of the insulating prepreg 12 with the copper foil 13. As a surface treatment for improving, a multilayer wiring characterized in that a coating surface 17 for preventing corrosion of the surface after adhesion to the copper foil 13 is formed by applying a rust preventive agent to the insulating prepreg 12 substrate. 絶縁性プリプレグ１２における少なくとも一方の接合面に、接着力を向上させるための塗膜面１７を絶縁性プリプレグ１２の表面に塗布することにより形成する工程と、絶縁性コア基板１０に配線パターン１１を形成する工程と、銅箔１３に導電性バンプ１４を一体に形成する工程と、前記絶縁性プリプレグ１２の塗膜面１７を塗布した側に銅箔１３の導電性バンプ１４を向けて積層し、絶縁性プリプレグ１２の他方の面に前記絶縁性コア基板１０を積層する工程と、前記絶縁性コア基板１０、絶縁性プリプレグ１２及び銅箔１３を加熱と加圧により、前記導電性バンプ１４をもって絶縁性プリプレグ１２を嵌挿して絶縁性コア基板１０の配線パターン１１に圧着接続するとともに、絶縁性コア基板１０、絶縁性プリプレグ１２及び銅箔１３を一体化する工程と、前記銅箔１３により配線パターン１５を形成する工程とからなり、前記絶縁性プリプレグ１２に接着力向上のための塗膜面１７を表面に塗布することにより形成する工程は、絶縁性プリプレグ１２に防錆処理剤を塗布して塗膜面１７を形成することにより、銅箔１３との接着後の表面の腐食を防止する防錆処理剤塗布方法からなることを特徴とする多層配線基板の製造方法。A step of forming a coating film surface 17 for improving the adhesive force on at least one joint surface of the insulating prepreg 12 by coating the surface of the insulating prepreg 12; and a wiring pattern 11 on the insulating core substrate 10. The step of forming, the step of integrally forming the conductive bumps 14 on the copper foil 13, and the conductive bumps 14 of the copper foil 13 facing the side on which the coating film surface 17 of the insulating prepreg 12 is applied ; The step of laminating the insulating core substrate 10 on the other surface of the insulating prepreg 12 and the insulating core substrate 10, the insulating prepreg 12 and the copper foil 13 are insulated from the conductive bumps 14 by heating and pressing. The insulating prepreg 12 is inserted and crimped to the wiring pattern 11 of the insulating core substrate 10, and the insulating core substrate 10, the insulating prepreg 12 and the copper foil 13 are connected. A step of integrating, the copper foil 13 Ri Do and a step of forming a wiring pattern 15, the step of forming by applying a coating surface 17 for adhesion improvement in the insulating prepreg 12 on the surface , by forming the coated surface 17 by applying the rust prevention agent to the insulating prepreg 12, characterized Rukoto such a rust prevention agent coating method to prevent corrosion of the surface after the adhesion to a copper foil 13 A method for manufacturing a multilayer wiring board.
JP2000263635A 2000-08-31 2000-08-31 Multilayer wiring board and manufacturing method thereof Expired - Fee Related JP4522560B2 (en)

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JP5471931B2 (en) * 2010-07-23 2014-04-16 住友ベークライト株式会社 Printed wiring board, metal-clad laminate, resin sheet and printed wiring board manufacturing method
JP5803404B2 (en) * 2011-08-09 2015-11-04 日立化成株式会社 Primer layer for plating process, laminated board with primer layer for plating process and manufacturing method thereof, multilayer wiring board with primer layer for plating process and manufacturing method thereof
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