JP2003086779A - Solid-state image pickup device and its manufacturing method, solid-state image pickup unit and its manufacturing method, and image pickup equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To center the optical axis of a lens and the center of an image pickup surface of a solid-image pickup element, and to position a plane perpendicular to the optical axis of the lens and the image pickup surface of the solid-state image pickup element in parallel both with high precision and small man-hours without using a position adjusting jig. SOLUTION: Projection areas (reference surfaces 223a, 223b) at the same height with a mount surface 222 where the solid-state image pickup element 21 is mounted are provided on both sides and on the reference surfaces 223a and 223b. Reference holes 22a to 22d for positioning and fixing a lens barrel 3 tapered for positioning are provided at four places. On the reverse surface of a rectangular-plate shaped member of the lens barrel 3, positioning pins 33a and 33c which project downward are formed as pin members which face the reference holes 22a and 22c in a diagonal direction of a package 22 and can freely be fitted in the reference holes 22a and 22c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device having a package base on which a solid-state image pickup device is mounted, a method for manufacturing the same, a solid-state image pickup unit having a lens barrel attached to the solid-state image pickup device, and a method for manufacturing the same. Related to the imaging device.

[0002]

2. Description of the Related Art Conventionally, a solid-state image sensor including a CCD is
It is used in various imaging devices such as digital cameras and video cameras. A lens barrel having an optical lens for focusing image light on the solid-state image sensor is combined with the solid-state image sensor.

What is important in this combination is to align the optical axis L of the optical lens 100A with the center C of the image pickup surface of the solid-state image pickup device 100B, as shown in FIG. This alignment is based on the X-axis, Y-axis and θ
It is done by adjusting the axis. Also, the optical lens 100A
It is necessary to perform alignment regarding the parallelism between the vertical surface of the solid-state image sensor 100B and the image pickup surface of the solid-state image sensor 100B. This alignment is performed by adjusting the Z-axis for focus adjustment and
The tilt adjustment (a-axis, b-axis) for adjustment for preventing one-sided blur (hereinafter, simply referred to as one-sided blur adjustment) is performed. For the above total 6 axes, micromilli-order (μ
Adjust the position precisely in m units.

The step of adjusting the position of each axis in units of μm has conventionally required a long time using an expensive position adjusting device. For example, the optical lens 100A and the solid-state image sensor 10
As shown in FIG. 5, the position adjustment with respect to 0B is started by first fixing the package 101 having the solid-state imaging device 100B mounted on the metal plate 102 made of an aluminum material or the like with an adhesive or the like in advance.

Next, the lens barrel 103 containing the optical lens 100A is fixed, and the axes of the solid-state image pickup device 100B are slightly moved together with the package 101 on the metal plate 102 with respect to the lens barrel 103. The optimum position of the optical lens 100A and the solid-state image sensor 100B is adjusted so that the output signal from the solid-state image sensor 100B becomes the best. In the optimal position, the package 101 on the metal plate 102 is sandwiched, and the solid-state imaging device 100B and the lens barrel 103 are integrally fixed with a fastening member such as a screw 104.

Therefore, conventionally, in order to simplify the process of aligning the lens barrel 103 and the solid-state image pickup device 100B, the following various position adjusting methods have been adopted.

That is, in Japanese Utility Model Laid-Open No. 5-46046 "Solid-state image pickup device", the solid-state image pickup device is mounted on a part of a flat substrate whose surface is polished and has a flatness of about 5 μm at maximum.
A technique has been adopted in which a package covering the solid-state image sensor is fixed so that the flat substrate is partially exposed, and the exposed portion is used as a reference surface to be a mounting surface for a lens barrel.

Further, in Japanese Patent Laid-Open No. 2000-125212, "Imaging Module", a reference plane for positioning is formed on one surface of a ceramic substrate and is used as a reference plane for a semiconductor chip and a lens barrel. The adopted technology is adopted.

Further, Japanese Patent Laid-Open No. 10-326886 “Solid-state image pickup device and method for mounting solid-state image pickup device” and Japanese Patent Laid-Open No. 2000-307092 “Solid-state image pickup device, camera using the same and manufacturing method thereof” describe The package is provided with an outwardly-opened pilot portion on the side surface portion and an outwardly-opened guide portion on the side surface portion (a side surface portion opposite to the pilot portion side) facing the pilot portion and the guide portion. A technique for positioning the solid-state imaging device, the lens barrel, and the wiring board by using a pin stand jig is adopted.

[0010]

However, the above-mentioned conventional techniques have the following problems.

That is, in the techniques described in Japanese Utility Model Laid-Open No. 5-46046 and Japanese Patent Laid-Open No. 2000-125212,
Positioning of the parallelism between the surface perpendicular to the optical axis of the optical lens and the imaging surface of the solid-state imaging device, that is, Z-axis adjustment for focus adjustment and tilt adjustment (a-axis, b-axis) for one-sided blur adjustment.
Since the mounting surface of the solid-state image sensor and the mounting surface of the lens barrel can be mounted on the same plane with respect to the three axes, the alignment can be performed accurately, but the optical axis of the lens barrel and the solid-state image sensor Positioning with the center of the image pickup surface, that is, X for angle of view adjustment in a direction parallel to the mounting surface (reference surface) of the solid-state image pickup element
It was difficult to ensure accuracy for the three axes, that is, the Y-axis, the Y-axis, and the θ-axis adjustment, because there were no reference points.

Further, in the techniques disclosed in Japanese Patent Laid-Open Nos. 10-326886 and 2000-307092, alignment of the optical axis of the lens barrel with the center of the image pickup surface of the solid-state image pickup element, that is, both angle adjustment is performed. X-axis, Y-axis, θ-axis adjustment 3
For the axis, the lens barrel and the solid-state image sensor can be accurately fixed by using the pilot section, the guide section, and the pin stand jig, but the surface perpendicular to the optical axis of the optical lens and the solid state can be fixed. Positioning of parallelism with the image pickup surface of the image pickup element, that is, Z axis adjustment for focus adjustment that is a direction parallel to the pilot portion and guide portion, and tilt adjustment (a axis, b axis) for one-sided blur adjustment. ), It was difficult to secure accuracy because there was no reference point. In this case, the alignment between the optical axis of the optical lens and the center of the image pickup surface of the solid-state image pickup element, that is,
In the position adjustment for the X-axis, Y-axis, and θ-axis adjustment of the angle of view adjustment, a pin stand jig as a position adjustment jig is newly required and the position adjustment jig is used for the position adjustment. There was a problem that it took man hours.

The present invention solves the above-mentioned problems of the prior art, and aligns the optical axis of the optical lens with the center of the image pickup surface of the solid-state image pickup element and uses the optical axis of the optical lens without using a position adjusting jig. A solid-state imaging device and a method for manufacturing the same, a solid-state imaging unit and a method for manufacturing the same, which are capable of accurately aligning the parallelism between a plane perpendicular to the plane and the imaging surface of the solid-state imaging device with a low man-hour. An object is to provide an imaging device.

[0014]

The solid-state image pickup device of the present invention is a solid-state image pickup device in which a solid-state image pickup device is mounted on a package base, and a mounting face for mounting the solid-state image pickup device is formed on the package base, and the mounting face is formed. Reference surfaces having the same height as the mounting surface are respectively formed on the package bases located on both sides of, and the respective reference surfaces are centrally distributed positions with respect to the center of the image pickup surface of the solid-state image pickup device. At least one positioning reference hole for the solid-state imaging device is provided, and the above-mentioned object is achieved thereby.

Further, preferably, among the positioning reference holes in the solid-state image pickup device of the present invention, at least one pair of reference holes provided at least one on each reference surface are opened to the mounting surface side on one side. It is formed in a tapered shape.

Further, preferably, a recess having a mounting surface formed at the bottom is provided on the package base in the solid-state imaging device of the present invention, and the solid-state imaging device is mounted on the mounting surface in the recess, and The inner lead inside the recess and the electrode of the solid-state image sensor are connected by a thin metal wire, the inner lead and the outer lead are connected, and a transparent cap member is attached so as to cover the upper surface of the recess.

Furthermore, the method of manufacturing a solid-state image pickup device according to the present invention is the method of manufacturing a solid-state image pickup device according to any one of claims 1 to 3, wherein the solid-state image pickup element is mounted on the mounting surface of the package base. At this time, the solid-state image sensor is fixed on the mounting surface by aligning the center of the imaginary line passing between the centers of the reference holes at the center distribution positions so that the center of the image-sensing surface of the solid-state image sensor coincides. There, the above object is achieved thereby.

The solid-state image pickup unit according to the present invention is defined in claims 1 to 1.
3. The solid-state imaging device according to any one of 3 above, each pin member that can be fitted respectively into at least a pair of reference holes at the center distribution position, and a lens for positioning with respect to each reference surface. The lens barrel side reference surface is formed,
A lens barrel in which an optical lens is disposed so that the lens optical axis is located at the central position between the pin members, and the reference holes and the pin members are fitted to each other, thereby the solid An image pickup device and the optical lens are positioned and the lens barrel is attached to the package base;
Thereby, the above object is achieved.

Further, preferably, each pin member in the solid-state image pickup unit of the present invention is formed in a tapered shape with a diameter reduced toward the tip, and each tapered pin member and each tapered reference hole are respectively formed. The lens barrel and the solid-state imaging device are fitted so that both reference planes are parallel to each other.

Furthermore, preferably, four reference holes in the solid-state image pickup unit of the present invention are provided on each of the reference surfaces at both ends, and a total of four reference holes are provided, and one diagonal position of a virtual quadrangle connecting the four positions. Through each reference hole provided in
The package base is sandwiched and attached between the lens barrel and the wiring board.

The method of manufacturing the solid-state image pickup unit of the present invention comprises:
It is a manufacturing method of the solid-state image pickup unit in any one of Claims 5-7, Comprising: Positioning of a solid-state image sensor and an optical lens by respectively fitting each pin member to each reference hole of a solid-state image sensor. While carrying out the above, the lens barrel is mounted on the package base body, thereby achieving the above object.

Further, preferably, in the method for manufacturing a solid-state image pickup unit of the present invention, each insertion hole of the wiring board is provided so as to face each of the four reference holes, and a pair of tapered shapes of the lens barrel is provided. Pin member and a pair of tapped pilot holes for screw fixing are provided respectively, and a pair of tapered pin members are sequentially fitted into the pair of tapered reference holes and the insertion holes, respectively, and left. From the side of each pair of insertion holes, through the remaining pair of respective reference holes, a screw member is fastened and fixed to a pilot hole for a screw fixing tap of the lens barrel.

Furthermore, the image pickup device of the present invention is defined by the following items.
The solid-state imaging device according to claim 3, or the solid-state imaging device according to claim 5.
The solid-state imaging unit according to any one of 1 to 3 is used, and the above-mentioned object is achieved thereby.

The operation of the present invention will be described below.

Conventionally, the solid-state image pickup device and the optical lens are manufactured with a predetermined accuracy in each manufacturing process. The positioning of both parts must be highly accurate. In the solid-state imaging device having the conventional structure, the optical lens is aligned with the imaging element chip after the mounting of the imaging element chip is completed. At this time, in order to obtain absolute positional accuracy between the optical lens and the image pickup device chip, adjustment of 6 axes in total, such as angle of view adjustment and tilt adjustment, is required. Therefore, an expensive position adjusting device and complicated mounting are required. A process is required, increasing man-hours.

In the package of the solid-state image pickup device having the conventional structure, basically, the package is attached to a substrate as a reference, and then the lens barrel is attached to the reference. For this reason, variation factors are accumulated, and alignment between the solid-state image sensor and the optical lens (center of optical axis, horizontal / vertical plane, tilt, rotation, etc.) is required for a total of 6 axes as described above. Met.

On the other hand, according to the present invention, the package base of the solid-state image pickup device itself has a reference hole for alignment with the mounting surface of the solid-state image pickup element, and the reference hole is used as the solid-state image pickup element and the lens barrel. It is also used for alignment with.
That is, by inserting the respective pin members into the respective reference holes of the solid-state imaging device, it becomes possible to position the solid-state imaging device and the optical lens and at the same time to mount the lens barrel on the package base. . As a result, the alignment between the optical axis of the optical lens and the center of the image pickup surface of the solid-state image pickup device and the surface of the solid-state image pickup device perpendicular to the optical axis of the optical lens can be obtained without using a high-level position adjusting device or a complicated mounting process. It becomes possible to perform the positioning of the parallelism with the image pickup surface of 1 with high accuracy and with a low man-hour.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the solid-state image pickup unit of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of each component for explaining the assembly of the solid-state image pickup unit showing one embodiment of the present invention.

In FIG. 1, the solid-state image pickup unit 1 includes a solid-state image pickup device 2 in which a solid-state image pickup device 21 described later with reference to FIG. 2 is mounted, and a lens 31 arranged on the solid-state image pickup device 21 so that a picked-up image is focused. The lens barrel 3 is provided and the wiring board 4 from which the output signal from the solid-state image pickup device 21 is taken out, and they are positioned and assembled so that the positional relationship between them is optimal.

The solid-state image pickup device 2 is shown in FIGS.
As shown in (B), the solid-state imaging device 21, the dual in-line package (DIP) 22 as a package base on which the solid-state imaging device 21 is mounted, and the solid-state imaging device 2
1 has a transparent cap 23 and an external lead 24 for outputting an image pickup signal from the solid-state image pickup device 21.

The solid-state image pickup device 21 has a plurality of CCD devices arranged in a matrix, and each CCD device converts image light into an electric signal on a pixel-by-pixel basis.

The package 22 has a recess 221 having a substantially rectangular shape in plan view formed in the center of the upper surface thereof, and a flat mounting surface 222 for the solid-state image pickup device 21 is formed in the recess 221. On both sides of the concave portion 221, both end edges of the package 22 are arranged in a brim-like shape so as to project outward. The mounting surface 222 is provided at each of these end edges.
Flat reference surfaces 223a and 223b, which have the same height as, are formed. Positioning reference holes 22a to 22d for positioning the solid-state image sensor 21 and the lens barrel 3 are formed on each of the reference surfaces 223a and 223b, two on each of the left and right so that a total of four holes are formed at the corners of the virtual rectangle in plan view. There is.

Of the positioning reference holes 22a to 22d,
For example, the reference holes 22a and 22c provided in the diagonal direction are
It is formed in a tapered shape (the diameter is reduced toward the back side) that opens to one side (the mounting side of the solid-state imaging device 21, the upper side).

Regarding the mounting position of the solid-state image pickup device 21 on the mounting surface 222 of the package 22, four reference holes 22 are provided.
Of the corners of the virtual rectangle in plan view where a to 22d are located,
For example, reference holes 22a, 22c located at diagonal corners
The solid-state imaging device 21 is fixed by an adhesive or the like so that the center position (center of the imaging surface) of the solid-state imaging device 21 is aligned with the center position of a virtual diagonal line connecting the centers of the circles. This solid-state image sensor 21
As a method of making the center position of the package 22 coincide with the center position of the diagonal line connecting the circle centers of the reference holes 22a and 22c, the reference position of the package 22 (the center of the circle of the reference hole) is optically recognized by the optical device. Then, the solid-state imaging device 21 is fixed in a predetermined direction and position (the center position of the diagonal line between the centers of the two circles) from there, and is generally used. As a matter of course, the diagonal reference holes 22a,
The reference holes 22b and 22d may be used instead of 22c.

The transparent cap 23 is formed in a transparent rectangular plate shape, and is bonded onto the recess 221 so as to cover the inside of the recess 221 of the package 22. The transparent cap 23 is
The inside of the recess 221 of the package 3 is sealed with the upper portion of the solid-state imaging device 21 being hollow.

A plurality of external leads 24 are erected so as to hang downward from central portions of both side surfaces corresponding to the long sides of the virtual rectangle in plan view. An internal lead portion (not shown) inside the recess 221 of the package 22 and an electrode (not shown) of the solid-state imaging device 21 are connected by a thin metal wire (not shown) made of aluminum wire or other gold wire, and each inside The lead portions are respectively connected to the plurality of external leads 24. Thereby, the solid-state imaging device 21
The electrodes and the external leads 24 are electrically connected to each other. Note that the package 22 is not limited to the pin insertion type package represented by the dual in-line package, and may be a surface mount type package in which the external leads 24 protrude laterally or a type without the external leads 24. .

Next, in the lens barrel 3, a lens holder 32 is formed in the central portion of the upper surface of the rectangular plate member, and the lens 31 is fitted into the lens holder 32 by rotation. In addition, on the lower surface of the rectangular plate-shaped member of the lens barrel 3, the reference holes 22a and 22c facing the reference holes 22a and 22c in the diagonal direction of the package 22 are provided.
Positioning pin 33 as each pin member that can be freely fitted to c
a and 33c are formed so as to protrude downward.
Further, on the lower surface of the rectangular plate member of the lens barrel 3, prepared holes for screws (for taps) are formed at positions facing the reference holes 22b and 22d of the package 22. Further, the lower surface of the rectangular plate member of the lens barrel 3 serves as a lens barrel side reference surface for positioning with respect to the reference surfaces 223a and 223b of the package 22.

Each of the positioning pins 33a and 33c is formed in a tapered shape whose diameter is reduced toward the tip. The taper has the same inclination as the taper of the reference holes 22a and 22c, and the solid-state imaging device 21 is mounted by fitting the reference holes 22a and 22c and the positioning pins 33a and 33c, respectively. The lens barrel 3 is positioned and attached to the package 22.

That is, the solid-state image pickup device 21 is packaged in the package 22.
Holes 22a and 22c used for positioning when mounted on
Is used as a positioning reference when the solid-state imaging device 2 is assembled to the lens barrel 3. The positioning pins 33a and 33c of the lens barrel 3 provided in advance so as to face the reference holes 22a and 22b of the package 22 are attached to the reference holes 22.
The lens optical axis L shown in FIG. 4 and the center C of the image pickup surface of the solid-state image pickup element are aligned and the plane perpendicular to the lens optical axis L is parallel to the image pickup surface of the solid-state image pickup element only by fitting them to a and 22c. Degree adjustment, that is, Z-axis adjustment for focus adjustment, X-axis, Y-axis, θ-axis adjustment for angle of view adjustment, and tilt adjustment (a-axis, b-axis) for one-sided blur adjustment. The position adjustment can be completed.

The wiring board 4 is formed in a rectangular plate shape, circular holes 41a to 41d are formed so as to face the reference holes 22a to 22d of the package 22, respectively, and the wiring board 4 is erected in two rows. A group of circular holes 42 is formed so as to face each of the plurality of outer leads 24. Of the circular holes 41a to 41d, the positioning holes 33a and 33c are inserted into the circular holes 41a and 41c from the upper side, and the screws 43 are penetrated from the lower side of the circular holes 41b and 41d to the reference hole 22b of the package 22. , 22d, respectively, and screwed into a prepared hole on the lower surface of the lens barrel 3. The wiring board 4 may be a glass epoxy board or a flexible board. In addition, the positioning hole 4 of the wiring board 4
The 1a and 41c and the fixing holes 41b and 41d do not have to require accuracy, and may have a large hole diameter.

An example of a method of assembling the solid-state image pickup device 2 shown in FIG. 1 to the lens barrel 3 having the above structure will be described below with reference to FIGS. 3A and 3B.

3A and 3B, as shown in FIG. 4, the alignment between the lens optical axis L and the center C of the image pickup surface of the solid-state image pickup device 21 is perpendicular to the lens optical axis L. Of the parallelism between the surface and the image pickup surface of the solid-state image pickup device 21, that is, Z axis adjustment for focus adjustment and X axis, Y for angle of view adjustment.
6A and 6B are schematic views for explaining a position adjustment method for a total of 6 axes including axis adjustment, θ axis adjustment, and tilt adjustment (a axis, b axis) for one-sided blur adjustment.

First, the positioning pin 33 of the lens barrel 3
a and 33c are inserted into the reference holes 22a and 22c of the solid-state imaging device 2. Positioning pins 33a and 33c of the lens barrel 3
Is longer than the thickness of the reference holes 22a and 22c of the solid-state imaging device 2 and is a circular hole 41 for positioning the wiring board 4.
Positioning is possible by inserting into a and 41c respectively.

Next, a circular hole 41b for fixing the wiring board 4
From the wiring board 4 side with the same torque strength, in the pilot holes (not shown) for taps, which are previously installed at the opposite lower surface positions of the lens barrel 3, with fixing screws 43, 43 from the 41d side. Tighten and fix the tube 3.

At this time, the solid-state imaging device 2 and the lens barrel 3 can be positioned with high accuracy by the method shown in FIGS. 3 (A) and 3 (B). That is, FIG. 3 (A) and FIG.
In (B), for example, the pitch dimension (Dp1) of the center distribution of the reference holes 22a and 22c provided in the package 22 (the center is the center C of the imaging surface of the solid-state imaging device 21)
+ Dp2), when the pitch dimension (Dhl + Dh2) of the centering of the positioning pins 33a and 33c provided on the lens barrel 3 (the center is the lens optical axis L) is narrow, it is shown in FIG. So that the reference holes 22a, 22c
Positioning is performed at the taper portion inside the. Further, with respect to the pitch dimension (Dp1 + Dp2) of the center holes of the reference holes 22a and 22c provided in the package 22, the positioning pins 33a and 33c provided in the lens barrel 3 are arranged.
When the pitch size (Dhl + Dh2) for center distribution is wide, positioning is performed by the taper portion outside the reference holes 22a and 22c. In any case, the reference holes 22a, 2
The center (Dpc) of 2c and the center (Dhc) of the positioning pins 33a and 33c coincide. In this way, the center alignment and the parallel plane alignment of the solid-state image sensor 21 and the optical lens 31 are performed accurately. That is, the position adjustment of a total of 5 axes including the X-axis, Y-axis, θ-axis adjustment for adjusting the angle of view and the tilt adjustment (a-axis, b-axis) for one-sided blur adjustment is completed.

Further, the positioning pins 33a and 33c are guided by the respective tapers with respect to the reference holes 22a and 22c and are fitted to each other at the same depth. That is, the reference hole 22
a and 22c are formed on the reference surfaces 223a and 223b and positioning pins 33a and 33c are formed on the reference surface 34, the left clearance CL and the right clearance CR have the same dimensions (CL1 = C).
R1 or CL2 = CR2) and the reference holes 22a, 2
The reference surfaces 223a and 223b on which the 2c is formed and the reference surface 34 on which the positioning pins 33a and 33c are formed are parallel to each other. That is, the Z-axis adjustment of focus adjustment is completed. In addition,
As the reference holes, reference holes 22b and 22d may be used instead of the reference holes 22a and 22c. In this case, the reference holes 22b, 2 are used as positioning reference holes when the solid-state imaging device 21 is mounted in the recess 221 of the package 22.
2d, and instead of the positioning pins 33a and 33c provided on the lens barrel 3, the positioning pin 33 is provided at a position facing the reference holes 22b and 22d of the package 22.
It is necessary to dispose b and 33d. Further, the prepared hole for fixing the screw on the lower surface of the lens barrel 3 is also the reference hole 22.
Instead of the positions facing b and 22d respectively, the reference hole 2
It is necessary to install them at positions facing 2a and 22c, respectively.

However, as it is, the focus adjustment in the Z direction cannot be performed with high precision. In this focus adjustment, since the optical lens 31 attached to the lens barrel 3 is a screw-in type after the above-described series of attachments are completed, the optical lens 31 is rotated so that the output signal becomes the best. This makes it possible to adjust the focus in the Z direction. As described above, the solid-state imaging device 2 and the lens barrel 3 can be positioned with high precision at the same time as they are assembled only by using the method shown in FIGS. 3 (A) and 3 (B).

As a matter of course, on the premise of this, the positioning accuracy between the chip of the solid-state image pickup device 21 and the package 22 and the positioning accuracy between the lens barrel 3 having the tapered pin members 33a and 33c and the optical lens 31 are required. , The current level of assembly technology is at a level without problems.

To repeat, the present invention will be further described. In order to achieve the object of the present invention, the package 2
The solid-state image sensor 21 is fixed to the mounting surface 222 in the recess 221 provided on the upper surface of the package 2 with an adhesive or the like, and the internal lead portion (not shown) inside the recess 221 of the package 22 and the electrode (terminal of the solid-state image sensor 21). ) Are sequentially connected to each other by a thin metal wire such as an aluminum wire or a gold wire to be electrically connected to the external lead. Furthermore, on the upper surface of the package 22,
The transparent cap 23 is adhered, and the solid-state imaging device 21 is sealed in the recess 221 of the package 22 in a hollow state above. In the solid-state imaging device 2 configured as above, the solid-state imaging device 21 of the package 22 is mounted on the mounting surface 222.
Protruding regions (flange regions) having reference surfaces 223a and 223b at the same height as that are provided on both sides (both edge portions), and reference holes 22a for positioning are provided on both sides (reference surface) of the projecting regions.
22d are provided at two places on each of the left and right sides, for a total of four places. Further, in the solid-state imaging device 2, the reference holes 22a to 22d of the projecting surfaces (reference surfaces 223a and 223b) provided on the same height as the mounting surface 222 of the solid-state imaging device 21 are formed in a tapered shape to form a lens. It is used for alignment with the lens barrel 3. Further, in the solid-state imaging device 2, the protrusion areas (reference surfaces 223a, 22a) having the same height as the mounting surfaces 222 on both sides.
Among the reference holes 22a to 22d for positioning provided in 3b), the two reference holes 22a and 22c in the diagonal direction are used as the references for mounting the solid-state imaging device 21. Further, by fitting the lens barrel 3 provided with the pair of tapered pin members 33a and 33c into the respective tapered reference holes 22a and 22c, the solid-state imaging device 2 and the lens barrel 3 are separated from each other. Align. Further, the pair of tapered pin members 33a and 33c of the lens barrel 3 are fitted into the tapered reference holes 22a and 22c of the solid-state imaging device 2, and the two pairs of insertions provided on the wiring board 4 are inserted. Holes 41a-41d
Among them, the screw 43 is inserted through the pair of insertion holes 41b and 41d facing the tapped hole of the lens barrel 3 to fasten the wiring board 4, the package 22 and the lens barrel 3.

As described above, according to the embodiment of the present invention, the protrusion regions (reference surfaces 223a and 223b) having the same height as the mounting surface 222 on which the solid-state image sensor 21 is mounted are provided on both sides, and further, A package in which the solid-state imaging device 21 is mounted by providing four reference holes 22a to 22d on the reference surfaces 223a and 223b for positioning and fixing in a tapered shape for alignment with the lens barrel 3. 22
The lens barrel 3 and the lens barrel 3 can be attached with high precision without adjustment. That is, the alignment of the optical axis L of the optical lens 31 and the center C of the imaging surface of the solid-state imaging device 21, and the position of the parallelism between the plane perpendicular to the optical axis L of the optical lens 31 and the imaging surface of the solid-state imaging device 21. Adjustment, that is, Z-axis adjustment for focus adjustment, X-axis, Y-axis, θ-axis adjustment for angle of view adjustment, and tilt adjustment (a-axis, b-axis) for one-sided blur adjustment for a total of 6 axes. Position adjustment can be performed easily in a short time and with high accuracy. Therefore, unlike the conventional case, a dedicated alignment device, a jig, etc. are not required, and the work of the position adjustment process can be greatly simplified.

In this embodiment, the positioning pin 33 is used.
Although no stepped portion is provided on a and 33c, the positioning pins 33a and 33c are formed as stepped pins, and the stepped portion (collar portion) acts as a stopper for the reference surfaces 223a and 223b, so that the reference holes are formed. The insertion depths of the positioning pins with respect to 22a and 22c may be surely fitted to the same depth on the left and right.

[0053]

As described above, according to the present invention, the solid-state image pickup element is formed by using the reference plane having the same height as the mounting surface of the solid-state image pickup element and the tapered reference hole provided in the reference plane. After positioning on the mounting surface, the optical axis of the lens barrel is aligned with the center of the imaging surface of the solid-state image sensor, that is, the X-axis, Y-axis, and θ-axis adjustment for angle of view adjustment and the optical axis of the optical lens. The parallelism between the plane perpendicular to the image pickup surface and the image pickup surface of the solid-state image sensor, that is, the Z-axis adjustment for focus adjustment and the tilt adjustment (a-axis, b-axis) for one-sided blur adjustment, Μ
In units of m, positioning can be performed easily in a short time and with high accuracy without using a dedicated alignment device or jig unlike the conventional case.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of each component for explaining an assembly of a solid-state imaging unit showing an embodiment of the present invention.

FIG. 2A is a plan view of a solid-state imaging device showing an embodiment of the present invention, and FIG. 2B is a sectional view taken along line AA ′ of FIG.

FIG. 3 is a schematic diagram illustrating a method of aligning the solid-state imaging device and the lens barrel of the present invention, and FIG. 3A is a fitting state of the pin member and the reference hole when the pitch dimension of the pin member is small. FIG. 4B is a diagram showing a fitted state of the pin member and the reference hole when the pitch dimension of the pin member is large.

FIG. 4 is an explanatory diagram schematically showing the principle of alignment between a solid-state image sensor and an optical lens.

FIG. 5 is an exploded perspective view showing position adjustment and assembly of a conventional solid-state imaging device and a lens barrel.

[Explanation of symbols]

1 Solid-state imaging unit 2 Solid-state imaging device 21 Solid-state image sensor 22 packages 22a to 22d Reference hole 23 Transparent cap 24 External lead 3 lens barrel 31 Optical lens 32 lens holder 33a, 33b Pin member 4 wiring board 42 External lead insertion hole 41a, 41c Positioning hole 41b, 41d fixing holes 43 fixing screw

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kimi Sasaki             22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka             Inside the company F-term (reference) 2H044 AC01                 4M118 AA10 AB01 BA10 GD03 GD07                       HA02 HA03 HA14 HA24                 5C024 CY47 EX22 EX23 GY01

Claims (10)

[Claims] 1. A solid-state imaging device in which a solid-state imaging device is mounted on a package base, wherein mounting surfaces for mounting the solid-state imaging device are formed on the package base, and the mounting surfaces are located on both sides of the mounting surface. Each of the reference surfaces having the same height as the mounting surface is formed, and each of the reference surfaces has a reference hole for positioning the solid-state image sensor, which is a center distribution position with respect to the center of the image-capturing surface of the solid-state image sensor. At least one solid-state imaging device is provided. 2. A pair of reference holes, at least one of which is provided in each of the reference surfaces, of the positioning reference holes are formed in a tapered shape that opens toward the mounting surface side. The solid-state imaging device described. 3. A recess having the mounting surface formed at the bottom is provided on the package base, the solid-state imaging device is mounted on the mounting surface in the recess, and internal leads inside the recess of the package are provided. 3. The solid according to claim 1, wherein the electrodes of the solid-state imaging device are connected by a thin metal wire, the inner leads and the outer leads are connected, and a transparent cap member is mounted so as to cover the upper surface of the recess. Imaging device. 4. The method of manufacturing a solid-state image pickup device according to claim 1, wherein each of the center distribution positions is set when the solid-state image pickup device is mounted on a mounting surface of the package base. At the center position of the virtual line that passes between the centers of the reference holes,
A method for manufacturing a solid-state imaging device, comprising positioning the solid-state imaging device so that the centers of the imaging surfaces thereof are aligned with each other, and fixing the solid-state imaging device on the mounting surface. 5. The solid-state imaging device according to any one of claims 1 to 3, and pin members that can be fitted in at least a pair of reference holes at the center distribution positions, respectively, and are formed. A lens barrel side reference surface for positioning with respect to the reference surface is formed, and has a lens barrel in which an optical lens is arranged so that the lens optical axis is located at the center position between the pin members, A solid-state imaging unit in which the solid-state imaging device and the optical lens are positioned by fitting the reference holes and the pin members, respectively, and the lens barrel is attached to the package base. 6. Each of the pin members is formed in a tapered shape with a diameter reduced toward the tip, and each of the tapered pin member and each of the tapered reference holes respectively includes the lens barrel and the solid-state imaging device. The solid-state imaging unit according to claim 5, wherein both reference surfaces of the device are fitted so as to be parallel to each other. 7. The reference holes are provided on the respective reference surfaces of the both edge portions, two in total, four in total, and each reference hole is provided at one diagonal position of a virtual quadrangle connecting the four positions. 7. The solid-state image pickup unit according to claim 5, wherein the package base body is sandwiched and mounted between the lens barrel and the wiring board via the. 8. The method for manufacturing a solid-state imaging unit according to claim 5, wherein the solid-state imaging is performed by fitting the pin members into the reference holes of the solid-state imaging device. A method for manufacturing a solid-state imaging unit, wherein the element is aligned with an optical lens, and the lens barrel is mounted on the package base. 9. The insertion holes of the wiring board are provided so as to face the four reference holes, respectively, and a pair of tapered pin members of the lens barrel and a pair of screws for fixing screws are provided. Holes are provided respectively, and the pair of tapered pin members are sequentially fitted into the pair of tapered reference holes and the insertion holes respectively, and the remaining pair of reference holes are inserted from the remaining pair of insertion hole sides. 9. The method for manufacturing a solid-state imaging unit according to claim 8, wherein the solid-state imaging unit is fastened and fixed to a screw fixing pilot hole of the lens barrel through a hole by a screw member. 10. An imaging device using the solid-state imaging device according to claim 1, or the solid-state imaging unit according to claim 5.