JPH07183993A - Lens holder and reader using the same - Google Patents

Abstract

PURPOSE:To improve workability by enabling attachment with high accuracy by mounting a package arranged with photoelectric conversion element array on the holder integrated directly with the lens. CONSTITUTION:A CCD chip 6 is directly mounted on a package 9. The light receiving part of the CCD chip 6 is arranged at a prescribed location by setting it to round hole/long holes 9a and 9b as the positioning means of the package 9. A holder 8 holding a lens 4, forming the image of reflected light from an original, in one body has positioning pins 8a and 8b. The center of the optical axis of the lens 4 is placed with the positioning pins 8a and 8b as references. Therefore, the round hole/long holes 9a and 9b as the positioning means of the package 9 are used to joint the positioning pins 8a and 8b of the holder 8. Since the center of the optical axis of the lens 4 mounted on the holder 8 and the positioning pins 8a and 8b are set with high accuracy, the location of the light receiving part of the CCD chip 6 4 is positioned with extremely high accuracy in X and Y directions with respect to the center of the optical axis of the lens.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reading device for reading an image and a lens holder constituting the reading device.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 5, an image reading apparatus includes a feed roller 2 for feeding a document 1, a light source 3 for irradiating a reading position A of the document 1, and a light source 3 for reading the document 1. A lens 4 for forming an image of reflected light, and a photoelectric conversion element array for photoelectrically converting the reflected light formed by the lens 4 such as a CCD
Photoelectric conversion unit 5 including chip 6 and substrate 7, and holder 8 for mounting lens 4 and photoelectric conversion unit 5
When the document 1 travels through the reading position A, the reflected light at the reading position A is photoelectrically converted by the photoelectric conversion unit 5 to perform reading.

As shown in FIGS. 6 and 7, the photoelectric conversion unit 5 used here has a CCD chip 6 fixed to a ceramic substrate 9, an upper surface thereof sealed with a cover glass 10, and a large number of connections. Package 12 with terminals 11 attached
The package 12 includes a board 7 having a circuit pattern for mounting the package 12, and peripheral circuit components 13 and the like mounted on the board 7. The package 12 has its terminals 11 soldered to the board 7. As a result, they were mechanically fixed and electrically wired. Also, FIG.
As shown in FIG. 3, the photoelectric conversion unit 5 was attached by fixing the substrate 7 to the holder 8.

[0004]

However, in such a conventional photoelectric conversion unit, the positional relationship between the CCD chip 6 and the lens 4 is indirectly fixed by fixing the substrate 7 to the holder 8. Therefore, there is a problem that the positional accuracy of the CCD chip 6 and the lens 4 is poor.

That is, the package 12 on which the CCD chip 6 is mounted uses the terminals 11 of the package 12 on the substrate 7
It is fixed to the substrate 7 by soldering.
Since it is extremely difficult to fix the package 12 to the substrate 7 by soldering the terminals 11 of the package 12, the package 12 and the substrate 7 can be fixed.
Not only the positional relationship in the X direction and the Y direction on the plane with, but the positional relationship in the Z direction perpendicular to the plane was also deteriorated. Therefore, when attaching the photoelectric conversion unit 5 to the holder 8, it is necessary to attach the substrate 7 to the holder 8 while adjusting the position so that the CCD chip 6 is accurately positioned at the image forming position of the lens 4. It was a big constraint on automation of assembly and maintenance of the device. In addition, the terminals 11 of the package 12 are soldered to the package 12
If was fixed to the substrate 7 while maintaining parallelism, it also caused a cost increase.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an inexpensive reading device which can easily perform the work of accurately positioning and fixing the photoelectric conversion element array at the image forming position of the lens. And

[0007]

In order to solve the above-mentioned problems, the present invention is characterized in that the surface of the holder on the image forming side of the reflected light is integrally held with a lens for condensing the reflected light of the document. This is provided with a configuration in which a package for mounting a photoelectric conversion element array for photoelectrically converting the reflected light reflected on the surface is directly attached.

[0008]

According to the present invention, when the photoelectric conversion element array is fixed according to the image forming position of the lens, the package having the photoelectric conversion element array is directly fixed to the holder integrally holding the lens. To do. Accordingly, the work of accurately positioning and fixing the photoelectric conversion element array at the image forming position of the lens in the X direction and the Y direction can be facilitated. In addition, since the package is directly fixed to the holder, it is not necessary to solder while maintaining parallelism as in the conventional case, so that the cost can be reduced.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing an embodiment of a package in which a photoelectric conversion element array according to the present invention is mounted. In FIG. 1, 6 is a CC that constitutes a photoelectric conversion element array.
A chip such as a D chip. 9 is a package for holding the CCD chip 6, which is made of an insulating material
A material is used that has strength and flatness for mounting a substrate and has a small characteristic change with respect to temperature / humidity change. For example, ceramic or epoxy resin is used. 9a, 9
Reference numeral b is a round hole or an elongated hole formed in the package 9, and constitutes a positioning means when the package 9 is attached to a holder described later. The positioning means 9a, 9
b is not limited to a round hole or an elongated hole, and may have a shape like a cutout as shown in FIG.
Reference numeral 10 is a glass for protecting the CCD chip 6, and 11 is a connection terminal for the package 9.

The CCD chip 6 is directly mounted on the package 9. Mounting of the CCD chip 6 is usually performed using an adhesive. At this time, the light receiving portion of the CCD chip 6 is replaced by the round holes / oblong holes 9a, 9 which are positioning means for the package 9.
Set to b. This operation can be performed by an automatic recognition and assembling apparatus using an industrial television camera. Thus C
The CD chip 6 has a round hole / oblong hole 9a with respect to the package 9,
It is arranged at a predetermined position with reference to 9b.

FIG. 2 is a schematic perspective view showing a photoelectric conversion unit of the present invention and a holder to which this photoelectric conversion unit is attached. In FIG. 2, 4 is a lens for forming an image of reflected light from a document, and 8 is a holder that holds the lens 4 as a unit. The holder 8 has positioning pins 8a and 8b. The center of the optical axis of the lens 4 is attached to a predetermined position with high accuracy with reference to the positioning pins 8a and 8b. A flexible P plate 12 is connected to the terminals 11 of the package 9 by soldering.

The operation of mounting the package 9 having the above-described structure on the holder 8 will be described.

First, the positioning means for the package 9 is a round hole /
Positioning pins 8a, 8b of the holder 8 in the long holes 9a, 9b
Combine. As described above, the CCD on the package 9
The positional relationship between the chip 6 and the positioning means round holes / oblong holes 9a, 9b is set with high accuracy, and the center of the optical axis of the lens 4 attached to the holder 8 and the positioning pin 8a,
Since the positional relationship with 8b is set with high accuracy, the position of the light receiving portion of the CCD chip 6 with respect to the optical axis center of the lens 4 is positioned with extremely high accuracy in the X and Y directions. .

Then, the focus is adjusted by the fine movement of the lens 4, and the assembling work is completed. In this way, the package 9 is not attached to the holder 8 as in the conventional case.
Since it is directly attached to the holder 8, the CCD
The positional relationship between the chip 6 and the lens 4 can be directly fixed, and the position of the learning section of the CCD chip 6 can be positioned with extremely high accuracy with respect to the optical axis center of the lens 4. Further, when the holder 8 and the package 9 are assembled, the surface of the CCD chip 6 is covered with the holder 8, so that the surface of the CCD chip 6 is not likely to be damaged.
Therefore, it is not necessary to attach the glass 10 that protects the surface of the CCD chip 6. In this way, CCD
If the glass 10 on the surface of the chip 6 is omitted, the number of parts can be reduced and the cost can be reduced accordingly.

As described above, in the reader according to the present embodiment, the package 9 holding the CCD chip 6 is directly positioned and fixed to the holder 8, so that
The position of the light receiving portion of the CCD chip 6 with respect to the optical axis center of the lens 4 can be positioned in the X direction and the Y direction with high accuracy without adjusting the X direction and the Y direction as in the conventional case. Therefore, the assembling work becomes extremely easy and automation can be achieved.

Next, another embodiment of the holder 8 to which the package 9 of the present invention is attached will be described with reference to FIG.

FIG. 3 is a top view showing the relationship between the package 9 and the holder 8 in another embodiment of the present invention. 3 is different from FIG. 2 in that the holder 8 is provided with fixing means 8c and 8d. The fixing means 8c and 8d are
The package 9 positioned and attached to the holder 8 is held and fixed at both ends. The same parts as those in FIG. 2 are designated by the same reference numerals and the description thereof will be omitted.

Hereinafter, the holder 8 configured as described above
The work of attaching the package 9 to the package will be described.

First, the positioning means for the package 9 is a round hole /
Positioning pins 8a, 8b of holder 8 with elongated holes 9a, 9b
Then, the package 9 is pushed into the holder 8.
The fixing means 8c and 8d spread outward as the package 9 is pushed. Positioning means for the package 9 Positioning pins 8 for the holder 8 in the round holes / oblong holes 9a, 9b
When a and 8b are inserted and the package 98 reaches the holder, the fixing means 8c and 8d return to their original positions. The package 9 is caught by the protrusions 8e and 8f of the fixing means 8c and 8d, cannot move backward, and is fixed.

Even in the above case, as in the conventional case, the X direction and the Y direction
The position of the learning section of the CCD chip 6 with respect to the optical axis center of the lens 4 can be positioned with high accuracy in the X and Y directions without adjusting the direction.

[0022]

As is apparent from the above description, according to the present invention, the package in which the photoelectric conversion element array is arranged is directly attached and fixed to the holder integrated with the lens.
Compared to the case of fixing the board on which the terminals of the package are fixed by soldering as in the past, the structure is extremely simple and it is difficult to solder while keeping the package parallel to the board. The position of the learning section of the photoelectric conversion element array with respect to the center of the optical axis of the lens can be accurately positioned in the X and Y directions without any work. This has the effect that manufacturing can be facilitated and the cost can be significantly reduced. Further, the arrangement position of the photoelectric conversion element on the package is set with reference to the position of the positioning means, and since the positioning means of the package is provided corresponding to the positioning means of the holder to which the package is attached, The accuracy of the positional relationship of the photoelectric conversion element with respect to the lens can be guaranteed.

Further, when the package is fixed to the holder, the surface of the photoelectric conversion element array is covered by the holder, so glass for protecting the surface of the photoelectric conversion element array can be omitted, and the number of parts to be filled can be reduced accordingly. , The cost can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of a package in which a photoelectric conversion element array according to the present invention is mounted.

FIG. 2 is a schematic perspective view showing the relationship between the package of the present invention and a holder to which the package is attached.

FIG. 3 is a top view showing a relationship between a package and a holder according to another embodiment of the present invention.

FIG. 4 is a schematic perspective view showing another embodiment of the package of the present invention.

FIG. 5 is a schematic cross-sectional view showing a main part of a reading device including a conventional photoelectric conversion unit.

FIG. 6 is a schematic perspective view of a conventional photoelectric conversion unit.

FIG. 7 is a schematic sectional view of a conventional photoelectric conversion unit.

[Explanation of symbols]

 4 Lens 6 CCD chip 8 Holder 9 Package

Claims (3)

[Claims] 1. A photoelectric conversion element for photoelectrically converting light imaged by a lens, a package on which the photoelectric conversion element is mounted, a substrate having a circuit pattern and fixed with connection terminals of the package, and the lens. And a main body in which the mounting surface of the photoelectric conversion element of the package is directly fixed to the image forming surface side of the lens. 2. A main body that holds a lens integrally, and a package that is directly fitted to the main body and that mounts a photoelectric conversion element that photoelectrically converts light collected by the lens. A lens holder characterized in that each of the packages has positioning means corresponding to each other, and the package has photoelectric conversion elements arranged at predetermined positions with reference to the position of the positioning means. 3. A light source for illuminating a document, a lens for collecting the reflected light of the document, a photoelectric conversion element for photoelectrically converting the reflected light collected by the lens, and the photoelectric conversion element mounted on one surface. The package, a substrate having a circuit pattern and fixed to the connection terminals of the package, and the lens are integrally held, and the mounting surface of the photoelectric conversion element of the package is directly fixed to the imaging surface side of the lens. A reading device including a lens holder.