JP3506962B2 - Imaging module - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup module, and more particularly to an image pickup module in which a lens and an image pickup semiconductor chip are housed in a single package.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for small image sensors for various multimedia fields such as notebook computers and mobile phones, and for devices such as information terminals such as surveillance cameras and tape recorders. . As a small-sized image sensor unit suitable for this kind of image input device, there is an integrated unit in which components such as a solid-state image sensor, a lens member, a filter and a diaphragm member are housed in one package.

A conventional sensor unit has a structure in which a solid-state image pickup device is mounted on a substrate and then the substrate is fixed to a package by screwing or bonding, while a supporting frame holding a lens member is mounted on the package. Met. Due to such a structure, it was not possible to sufficiently secure the positional relationship of the lens with respect to the solid-state image sensor.

As described above, in the conventional sensor unit, since the positioning accuracy of the lens with respect to the solid-state image pickup device is inferior, a movable focus adjusting mechanism for focusing is incorporated in the package, and the focus adjustment is performed after each component is assembled in the package. A mechanism is used to focus the lens member on the solid-state image sensor.

However, a separate focusing operation for operating the movable adjusting mechanism after assembling the respective parts is required. Further, after the focus adjustment, it is necessary to fix the lens frame member and the like. Also, since the movable focus adjustment mechanism is provided, their structure becomes complicated, and moreover,
The sensor unit tended to be large.

Further, during the focusing operation, dust easily enters the unit through the gap between the movable parts of the focus adjusting mechanism, and it is necessary to take measures against it. For example, the focus adjusting operation is performed in a clean room. Was inferior to In addition, the movable focus adjustment mechanism is liable to be out of focus if subjected to vibration or shock after the product is completed.
There was a drawback that the reliability of the product was poor.

Therefore, Japanese Patent Laid-Open No. 9-232548 proposes a solid-state imaging device having a structure in which the positional accuracy of the lens with respect to the solid-state imaging device in the optical axis direction can be easily ensured. In this solid-state imaging device, a plurality of positioning portions are formed in a step shape on one support member, and parts such as a solid-state imaging device, a lens member, a filter, and a diaphragm member are separately and separately provided for the respective different positioning portions. Since each member is attached and positioned and fixed, the dimensional error between each step directly and greatly affects the positioning accuracy of each member.

Moreover, if a plurality of positioning portions are formed in a stepped shape on the support member, it is difficult to control the dimensional accuracy, and errors are likely to occur. Further, forming a plurality of positioning portions in a step on one support member requires a high level production technology.
In particular, when the support member is made of ceramic, it is very difficult to manufacture and the product becomes expensive.

Therefore, in most cases, it is conceivable to manufacture the support member by injection molding using a synthetic resin or the like as a material.

However, even if the support member is formed by injection molding, the dimensional error between the positioning portions having steps is likely to be large, and the error may increase due to subsequent aging. It was inferior in sex.

[0011]

As described above, in the conventional solid-state image pickup device, a dimensional error between the steps between the positioning portions is apt to occur, and it is difficult to manage the dimensional difference. The positional accuracy of the lens in the optical axis direction cannot be secured sufficiently. Further, the structure is complicated, the productivity is poor, the manufacturing cost is high, and the product is expensive.

An object of the present invention is to improve the mounting accuracy of the lens member on the solid-state image pickup device in the optical axis direction, omit the focus adjusting mechanism, simplify the structure, reduce the number of parts, and improve the assemblability. The purpose is to provide an inexpensive imaging module that can be downsized and the reliability of the product can be improved.

[0013]

In order to achieve the above object, the invention according to claim 1 provides an image pickup lens member, a lens frame member for holding the lens member, and photoelectric conversions arranged two-dimensionally. A photoelectric conversion unit including an element group and a semiconductor circuit unit in which peripheral circuits are formed on the same semiconductor chip, a substrate that holds the semiconductor chip, and a cover with a hollow structure that is installed on the substrate and covers the semiconductor chip In an imaging module including a frame member and an optical member attached to the cover frame member, a positioning reference surface formed of the same flat surface is formed on one surface of the substrate, and the positioning reference surface is , A semiconductor chip positioning reference surface portion for bonding and positioning the semiconductor chip in a planar manner, and a frame member mounting member which is located around the semiconductor chip and is bonded and attached to the cover frame member. Position of the same flat surface formed on one surface of the substrate, including a contact surface portion and a lens frame positioning reference surface portion which is located outside the cover frame member and which is joined and positioned to attach the lens frame member. Depending on the starting reference plane,
It is characterized in that the reference surface for joining and positioning the semiconductor chip and the reference surface for joining and positioning the lens frame member are shared.

The invention according to claim 2 is the image pickup module according to claim 1, wherein the substrate is a bulk type ceramic substrate.

According to a third aspect of the present invention, the lens frame member is fitted on the outer periphery of the cover frame member, and the cover frame member and the cover frame member are fitted in the fitting portion of the cover frame member and the lens frame member. A protrusion is formed on one side of the lens frame member so as to be joined to the other, and the protrusion is used to position the cover frame member and the lens frame member, and the fitting portion between the cover frame member and the lens frame member. The image pickup module according to claim 1, wherein a gap is formed therebetween.

According to a fourth aspect of the present invention, the image pickup lens member, the lens frame member holding the lens member, the photoelectric conversion unit including a two-dimensionally arranged photoelectric conversion element group, and the peripheral circuit are the same. In an image pickup module including a semiconductor circuit portion formed on a semiconductor chip and a substrate holding the semiconductor chip, an optical member to be assembled to the lens frame member is provided in the lens frame member facing the semiconductor chip. It is retracted to a position farther from the semiconductor chip than the wall surface and is arranged within the thickness of the wall portion of the lens frame member in the optical axis direction, and a positioning reference surface formed of the same flat surface is formed on one surface of the substrate. The positioning reference surface is located around the semiconductor chip positioning reference surface portion on which the semiconductor chip is planarly joined, positioned and mounted, and the lens frame member. A reference surface for bonding and positioning the semiconductor chip by a positioning reference surface of the same flat surface formed on one surface of the substrate, including a lens frame positioning reference surface portion for bonding, positioning and mounting. The lens frame member is also used as a reference surface for joining and positioning
A transparent dust-proof member is placed at the foremost end of the
Seal the joint surface with the reference surface, and use the lens frame member to
It is characterized in that the semiconductor chip is sealed .

According to a fifth aspect of the present invention, there is provided an image pickup lens member, a lens frame member for holding the lens member, a photoelectric conversion section including a photoelectric conversion element group arranged two-dimensionally, and a peripheral circuit section. In an imaging module including a semiconductor circuit portion formed on the same semiconductor chip and a substrate holding the semiconductor chip, the substrate is pressed against a mold surface before firing a ceramic raw material to integrally form a bulk material. A bulk type ceramic substrate that has been shaped and fired, and a positioning reference surface formed of the same flat surface is formed on one surface of the substrate, and the positioning reference surface is positioned by bonding the semiconductor chips in a planar manner. A semiconductor frame positioning reference surface portion to be mounted; and a lens frame positioning reference surface portion that is located around the semiconductor chip and is joined and positioned to mount the lens frame member. It is characterized in that the reference plane for positioning and joining the semiconductor chip and the reference plane for joining and positioning the lens frame member are shared by the positioning reference plane of the same flat surface formed on one surface. It is what

According to a sixth aspect of the present invention, there is provided an image pickup lens member, a lens frame member for holding the lens member, a photoelectric conversion section including a photoelectric conversion element group arranged two-dimensionally, and a peripheral circuit section. In an imaging module including a semiconductor circuit section formed on the same semiconductor chip and a substrate holding the semiconductor chip, a lens frame member has a diaphragm hole at a front end thereof, and a periphery of the diaphragm hole portion. With a cylindrical wall on
A positioning reference surface formed of the same flat surface is formed on one surface of the substrate, and the positioning reference surface includes a semiconductor chip positioning reference surface portion for bonding and positioning the semiconductor chips in a planar manner, and the semiconductor. The semiconductor chip is positioned around the chip and includes a lens frame positioning reference surface portion for bonding and positioning the lens frame member to be mounted, and by the positioning reference surface of the same flat surface formed on one surface of the substrate, the semiconductor chip The reference surface for joining and positioning and the reference surface for joining and positioning the lens frame member are shared, and the lens frame member is an optical member.
A member is arranged, and the optical member is attached to the semiconductor chip.
The semiconductor chip is positioned closer than the inner wall surface of the lens frame member which faces the lens frame member.
Of the lens frame member wall
It is characterized in that it is arranged within the thickness in the optical axis direction .

The invention according to claim 7 is an image pickup lens member.
And a lens frame member that holds the above lens member and a two-dimensional arrangement.
A photoelectric conversion unit composed of a group of photoelectric conversion elements and a peripheral circuit
Semiconductor circuit part in which the path part and the same part are formed on the same semiconductor chip
And a substrate that holds the semiconductor chip
In the module, the substrate Ri bulk ceramic substrate der has a aperture stop to the distal end portion of the lens frame member, the narrowed
It has a cylindrical wall around the perforated part and
Form a positioning reference surface consisting of the same flat surface on one surface, and
Positioning reference surface is planarly bonded to the semiconductor chip
Positioning reference surface for semiconductor chip positioning and mounting
And a lens frame member located around the semiconductor chip and the semiconductor chip.
Reference plane for positioning the lens frame by joining and positioning
Part of the same flat surface formed on one surface of the substrate including
The semiconductor chip is bonded to the
Position the reference surface to be set and the lens frame member by joining
The imaging module described above, which is also used as a reference plane .

The invention according to claim 8 is characterized in that a diaphragm hole is provided at the tip of the lens frame member, and a cylindrical wall is provided around the portion of the diaphragm hole. The image pickup module according to any one of 3 above.

According to a ninth aspect of the invention, in the lens frame member,
Claim and characterized in that the optical member is disposed 5,7
The imaging module according to any one of 1.

According to a tenth aspect of the present invention, the optical member is retracted to a position farther from the semiconductor chip than an inner wall surface of the lens frame member facing the semiconductor chip, and a wall portion of the lens frame member. The image pickup module according to claim 9, wherein the image pickup module is arranged within a thickness of the optical axis direction.

According to an eleventh aspect of the present invention, the optical member is assembled to the lens frame member in an airtight state so that the lens frame member has an airtight structure, and a joint portion between the lens frame member and the reference surface is formed. 5. The semiconductor chip is sealed by the lens frame member according to claim 4,
The imaging module according to any one of 9 and 10.

The invention according to claim 12 is the image pickup module according to any one of claims 1, 2, 3, and 8, characterized in that the optical member is an infrared light blocking member, a lens, or an optical window. Is.

The invention according to claim 13 is the image pickup module according to any one of claims 4, 9, 10 and 11, wherein the optical member is an infrared light shielding member, a lens or an optical window. Is.

According to a fourteenth aspect of the present invention, a dustproof transparent member is arranged at the foremost end of the lens frame member to form an airtight structure, and a joint surface with the reference surface is sealed, and the lens frame member is used to The image pickup module according to any one of claims 4, 9, 10, and 11, characterized in that the semiconductor chip is sealed.

According to a fifteenth aspect of the present invention, a dustproof transparent member is arranged at the foremost end of the lens frame member to form an airtight structure, and a joint surface with the reference surface is sealed, and the lens frame member is used to The image pickup module according to any one of claims 5 to 7, wherein the semiconductor chip is sealed.

According to a sixteenth aspect of the present invention, a dustproof transparent member is arranged at the foremost end of the lens frame member to form an airtight structure, and a joint surface with the reference surface is sealed, and the lens frame member is used to 14. The image pickup module according to claim 13, wherein the semiconductor chip is sealed.

According to a seventeenth aspect of the present invention, the infrared light shielding optical member is a multilayer film type infrared removing filter. 11,
The image pickup module according to any one of 14 above.

The invention according to claim 18 is the image pickup module according to any one of claims 12, 13 and 16, wherein the infrared light shielding member is a multilayer film type infrared removing filter.

The invention according to claim 19 is the image pickup module according to any one of claims 1 to 18, characterized in that a fixed aperture is provided at the tip of the lens frame member.

The invention according to claim 20 is characterized in that the positioning reference surface is entirely formed up to the outer peripheral end of the substrate, and the electrode group is arranged at the outer end part thereof.
9. The image pickup module according to any one of 9 above.

The invention according to claim 21 is characterized in that the substrate has an electrode group which holds the semiconductor chip and is electrically connected to the semiconductor chip. It is the described imaging module.

The invention according to claim 22 is characterized in that the electrode group is coated with a protective film at least at a portion where other members are joined, and the image pickup module according to claim 20 or 21. Is.

According to a twenty-third aspect of the present invention, at one end of the lens frame member facing the positioning reference surface, an abutting projection that abuts the positioning reference surface while avoiding the electrode group of the substrate and faces the electrode group. The image pickup module according to any one of claims 20 to 22, characterized in that an escape portion is provided so as to straddle the electrode group at a position.

The invention according to claim 24 is characterized in that the electrode group is provided so as to avoid a region where the lens frame member is joined on the positioning reference plane of the substrate.
The imaging module according to any one of 0 to 23.

The invention according to claim 25 is the image pickup module according to claim 23, characterized in that the region of the electrode group corresponding to the relief portion is not coated with a protective coating.

According to a twenty-sixth aspect of the present invention, the peripheral circuit sequentially drives the photoelectric conversion element group of the photoelectric conversion section to obtain a signal charge, and an A / D conversion for converting the signal charge into a digital signal. Unit, a signal processing unit that outputs the digital signal as a video signal output, and an exposure control unit that electrically controls the exposure time based on the output level of the digital signal. Items 1 to 25
The imaging module according to any one of 1.

[0039]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a vertical cross-sectional view of the image pickup module according to the present embodiment, and FIG. 2 is a perspective view of the image pickup module seen from the front side.

1 and 2, reference numeral 1 is a one-chip semiconductor chip, and this semiconductor chip 1 is a substrate,
For example, it is bonded and mounted on the upper surface of a hard bulk type ceramic substrate 2. The ceramic substrate 2 is formed by firing an integral bulk material as shown in FIGS. 3 (A) and 3 (B).
Also, as shown in FIG. 3C, it is formed as a plate having a rectangular shape and a uniform thickness. The upper surface of the bulk type ceramic substrate 2 is formed so as to be uniformly the same flat surface. This same flat surface serves as a positioning reference plane P for other attachment parts (see FIG. 1).

The ceramic substrate 2 is manufactured as follows. That is, the ceramic substrate 2 is produced by pressing the material of the ceramic raw material against the mold surface having high flatness, shaping it into an integral bulk material, and firing it. Further, one surface of the ceramic substrate 2 shaped from an integral bulk material and manufactured by firing the bulk material is used as it is as the positioning reference plane P.

The central region of the positioning reference plane P is a semiconductor chip positioning reference plane portion on which the semiconductor chip 1 is bonded and arranged, and the semiconductor chip 1 is bonded to the semiconductor chip positioning reference plane portion. Etc. A peripheral region of the semiconductor chip 1 is vacant on the positioning reference plane P, and the remaining portion formed by the vacant region around the semiconductor chip 1 is a frame member and a lens frame member described later. It becomes a positioning area for joining and attaching.

Further, signal input / output electrode groups 3 electrically connected to the semiconductor chip 1 are attached to the outer peripheral ends of the four sides of the ceramic substrate 2. Electrode group 3
Are distributed to the outer peripheral end of each side of the ceramic substrate 2 except for the four corners of the ceramic substrate 2. As shown in FIG. 3C, the lead terminals 4 of the electrode group 3 are arranged so as to surround the lower surface of the ceramic substrate 2.

When this image pickup module is mounted on a device or the like, the lead wire of the device is connected to the lead terminal 4 of the electrode group 3 by soldering or the like.

The electrode group 3 may have another form or a mixture thereof depending on the mounting form of the semiconductor chip 1 and the like.

As shown in FIG. 1, the ceramic substrate 2
A ceramic hollow frame member (middle frame) 10 that covers the semiconductor chip 1 is installed on the upper surface of the. Frame member 1
Reference numeral 0 also serves as a cover for protecting the semiconductor chip 1 from dust and moisture.

As shown in FIGS. 4 (A) and 4 (B), the cover frame member 10 includes a flat plate-shaped top plate portion 12 having a through hole 11 in the center, and a rectangular cylindrical peripheral wall portion 13. And has a rectangular box shape as a whole. The through hole 11 is hermetically sealed by a transparent member. For example, the through hole 11 is closed by covering the through hole 11 with a multilayer film type infrared light shielding member 15. The cover frame member 10 having such a structure hermetically covers the semiconductor chip 1 on the ceramic substrate 2 to seal the semiconductor chip 1.

The lower end edge of the peripheral wall portion 13 of the cover frame member 10 is positioned in a state of abutting against the frame member mounting surface portion utilizing a part of the positioning reference plane P formed by the upper surface of the ceramic substrate 2. It is fixed by airtightly adhering to the surface. In this way, the peripheral wall 1
Since the edge of 3 is positioned by abutting against the upper surface of the ceramic substrate 2, the mounting accuracy of the ceramic substrate 2 with respect to the mounting reference plane P in the optical axis direction (z direction) is high.

In order to avoid the electrode group 3, the electrode group 3
The edge portion of the frame member 10 corresponding to the area may be cut out to form a recess extending over the area of the electrode group 3 (see FIG. 4B).

The frame member 10 is made by firing a bulk ceramic material. At this time, each outer surface of the peripheral wall portion 13 of the frame member 10 is formed as a flat outer surface 16. A lens frame member 21 described later is fitted on the outer surface of the frame member 10. Although the frame member 10 is formed of a ceramic bulk, it may be a molded plastic product.

On the other hand, the lens frame member 21 is made of, for example, a metal member, and the peripheral wall portion 22 has a rectangular shape having four flat inner surfaces 23 corresponding to the size and shape of the peripheral wall portion 13 of the frame member 10. It has a cylindrical shape. The lens frame member 21 may be formed of a resin member.

At each inner side surface portion of the peripheral wall portion 22 of the lens frame member 21 fitted to the outer periphery of the frame member 10, a slight depth is formed in an intermediate (center) portion which avoids an enlarged portion 17 described later. The recess 18 is formed as a notch (see FIGS. 5A and 5B). The recess 18 is formed in the frame member 10
The outer surface of the outer surface 16 faces the portion of the outer surface 16 that avoids the enlarged portion 17, and a gap 24 is formed in the portion therebetween.

As shown in FIGS. 1 and 2, the lens frame member 21 and the ceramic substrate 2 are formed in such a size that the four edges thereof coincide with each other.

Enlarged portions 17 are formed at the four corners of the outer periphery of the frame member 10, respectively. As shown in FIG. 4 (A), the bulged portions 17 project slightly higher than the two adjacent outer surfaces 16, and each bulged portion 17
Are evenly formed at a height of h. And the frame member 1
When the lens frame member 21 is fitted on the outer periphery of 0, the enlarged portion 1
Only 7 are joined and locked only to the four corners of the inner surface 23 of the lens frame member 21, respectively.
Position in the y direction. Therefore, x of the lens frame member 21
The positioning accuracy in the y direction is determined only by the accuracy of the enlarged portion 17. Therefore, only the enlarging portion 17 needs to be formed with high accuracy, and the other portions need not be formed with such high accuracy.

When the lens frame member 21 is fitted on the outer periphery of the frame member 10, the height of the enlarged portion 17 is provided between the flat outer surface 16 of the frame member 10 and the flat inner surface 23 of the lens frame member 21. A gap 24 corresponding to the height h is formed. An adhesive is poured into the gap 24, the lens frame member 21 is adhered to the frame member 10, and both are fixedly attached.

As a method of pouring the adhesive, it is common to pouring it through the recesses 27 between the projections 26 of the lens frame member 21, which will be described later. (Not shown) may be formed, and the adhesive may be poured into the gap 24 from this.

Instead of the enlarged portion 17, projections (not shown) may be individually formed on each outer surface 16 of the frame member 10.
It is desirable that the protrusions be integrally formed at the corners of both ends of each outer surface 16 corresponding to the enlarged portion 17. Further, the enlarged portion 17 and the protrusion may be formed on the lens frame member 21 instead of on the frame member 10 side, and in this case also, the same positioning function and gap forming function can be obtained. The enlarging portion 17 and the protrusion control the positioning means of the frame member 10 and the lens frame member 21 and the gap forming function.

To position the lens frame member 21 in the direction of the optical axis (z), the edge of the peripheral wall portion 22 of the lens frame member 21 is brought into contact with the positioning reference plane P formed on the upper surface of the ceramic substrate 2. Done by. As shown in FIG. 1, the region where the edge of the peripheral wall portion 22 of the lens frame member 21 abuts the upper surface of the ceramic substrate 2 is a portion that remains on the outer periphery of the frame member 10 on the positioning reference plane P, and This is the remaining area that is projected around the member after the member is placed.

Here, a peripheral portion of the positioning reference plane P of the ceramic substrate 2 serves as a mounting reference plane portion of the lens frame member 21. The mounting reference surface of the lens frame member 21 is a part of the positioning reference surface P which is the same flat surface as the mounting reference surfaces of the other mounting components such as the semiconductor chip 1 and the like, and both members have a common positioning reference surface. Positioning in the optical axis direction is performed by the surface P.

Here, in particular, in order to avoid the edge of the peripheral wall portion 22 from hitting the electrode group 3 arranged on each side of the ceramic substrate 2, the four edges of the peripheral wall portion 22 of the lens frame member 21 are prevented. A protrusion 26 for abutting is integrally formed at the corner,
Only one protrusion 26 is made to abut against the positioning reference plane P of the ceramic substrate 2. Therefore, on the upper surface of the ceramic substrate 2, the contact portions 28 with which the four protrusions 26 of the lens frame member 21 abut are limited to the spaces at the four corners of the positioning reference plane P, as shown in FIG. To be

Due to the projections 26 formed at both ends of each side, a middle portion of each edge of the peripheral wall portion 22 forms a recess 27 that straddles the electrode group 3 on each side of the ceramic substrate 2. This recess 27
Is retracted from the electrode group 3 on each side, so that the interference phenomenon that the lens frame member 21 directly contacts the electrode group 3 is avoided.

Further, since only the abutting protrusions 26 provided at the corners of the edge of the peripheral wall portion 22 are made to abut against the upper surface of the ceramic substrate 2, the portions of the protrusions 26 should be made with high precision. As a result, the accuracy with which the lens frame member 21 is attached to the positioning reference plane P can be improved. Further, when the lens frame member 21 is bonded and fixed to the frame member 10, the adhesive can be poured into the gap 24 through the recesses 27 between the protrusions 26.

On the upper surface of the ceramic substrate 2, a region where the electrode group 3 is arranged is provided with an electrically insulating protective coating 29 such as alumina. It is desirable that the protective coating 29 is provided so as to avoid the contact portion 28 where the four protrusions 26 of the lens frame member 21 come into contact. Further, the protective coating 29 may be provided at least in the region corresponding to the frame member 10, but may be provided in the region corresponding to the lens frame member 21.

The lens frame member 21 is provided with a support portion 32 for holding an optical member of an optical system, for example, a lens member 31. The lens member 31 is held by the support portion 32 at a predetermined distance from the tip of the protrusion 26. A fixed diaphragm hole 33 is formed in the center of the frontmost end wall of the lens frame member 21 located in front of the lens member 31. A hood 34 is provided on the forefront end surface of the lens frame member 21 so as to concentrically project around the diaphragm hole 33 in a brim shape to form a cylindrical wall. The hood 34 prevents something from accidentally hitting the aperture 33 and deforming it.

On the other hand, the sensor mounted on the upper surface of the ceramic substrate 2 (position reference plane P) is a single CMOS.
The semiconductor chip 1 is formed. A plurality of electronic circuits are configured on the CMOS type semiconductor chip 1.
FIG. 6 shows an example of the arrangement structure. A photoelectric conversion unit including a photoelectric conversion element group arranged two-dimensionally is arranged in a light receiving portion formed in the central portion of the semiconductor chip 1. The height of the light receiving surface of the photoelectric conversion portion from the lower surface joined to the positioning reference plane P of the ceramic substrate 2 is accurately specified.
Peripheral circuits around the photoelectric conversion unit are integrally provided with a drive circuit unit, an A / D conversion unit for converting an analog signal into a digital signal, a signal processing unit, and an exposure control unit. Power and clock are supplied to the semiconductor chip 1 from an external circuit (not shown). As the clock, there are cases where a clock dedicated to the imaging system is used and where the system clock is diverted. Further, the semiconductor chip 1 outputs a digital or analog video signal.

The drive circuit section sequentially drives the photoelectric conversion element group of the photoelectric conversion section in the horizontal and vertical directions, and supplies the read signal charges to the A / D conversion section as a time series signal.
The A / D conversion unit converts the signal charge into an 8-bit or 10-bit digital signal and outputs the digital signal to the signal processing unit. Also, the signal processing unit converts the digital signal into a general video signal and outputs it to the outside.

As a general video signal, for example, if it is a digital signal, component signals of Y, C _B and C _R are output in a 4: 2: 2 format. If it is an analog signal, it is digitally encoded into the NTSC system or the PAL system, and is output as an analog video signal to the outside through a D / A conversion circuit provided in the signal processing unit. On the other hand, a digital signal is supplied from the A / D converter to the exposure controller as the exposure controller. The exposure control unit calculates the optimum electric shutter speed by a digital integrating circuit and a calculating means (not shown), and controls the exposure amount at the time of imaging by changing the set value of the electric shutter speed. Electrical shutter speed is 1 / tens of thousands
Since it is possible to set up to (seconds), a mechanism for changing the aperture value for controlling the light amount is unnecessary, and the imaging function is completed without incorporating a mechanical aperture mechanism for controlling the light amount. Further, the D / A conversion output may be directly output to the outside.

As described above, in this embodiment, the mounting reference surface of the light receiving surface of the semiconductor chip 1 in the optical axis direction and the mounting reference surface of the lens frame member 21 holding the lens member 31 in the optical axis direction are the same. Is a positioning reference plane P formed of the same flat surface formed on one surface of the ceramic substrate 2 and the positioning is performed by using the same positioning reference plane P. The positional accuracy of the light receiving surface of the chip 1 and the lens member 31 of the lens frame member 21 can be improved.

Since the distance between the light receiving surface of the semiconductor chip 1 and the lens member 31 can be accurately attached in this manner, the movable adjustment mechanism for focusing, which has been conventionally required, is unnecessary, and the number of parts can be reduced. Reduction in size, weight and size, and cost reduction can be achieved.

Further, by assembling the semiconductor chip 1 and the lens frame member 21 on the same ceramic substrate 2, the positioning is uniquely completed. Therefore, it is not necessary to adjust the focus after the assembly, and the assembly is simple and easy. I can do things.

Further, it is possible to prevent the occurrence of an error and the decrease in reliability due to the movable adjusting mechanism for focusing, which is conventionally required, and to improve the vibration resistance of the unit. In addition, an image pickup module with a simple and highly hermetically sealed structure can be obtained, and it can be used with confidence even in a severe operating environment.

The ceramic substrate 2 may be a laminate type, but here it is an integral bulk type, which is pressed against the die surface having high flatness before firing the ceramic raw material to integrally form the bulk material. It is shaped and baked to make it. Therefore, the accuracy after firing is high. Therefore, one surface can be used as the positioning reference plane P as it is without polishing after firing. Therefore, the structure can be simplified and the cost can be reduced. Usually, the accuracy after firing is higher than that of the laminate type in which ceramic sheets that are often used for semiconductor packages are formed, and the accuracy can be improved.

In general, even if a plastic has a complicated shape, a highly accurate one can be produced as a whole, but a ceramic having a complicated shape requires a higher manufacturing technique and becomes costly. Since only one surface of the ceramic substrate 2 needs to be manufactured with high precision here, there is an advantage that it can be manufactured at low cost. This also applies to the frame member, and it is sufficient to accurately form only the enlarged portion 17 of the frame member.

Since the ceramic substrate 2 is formed by shaping an integral bulk material and firing it, the precision after firing is high, and the flat surface formed on one surface is positioned with high precision without polishing. It can be used as the reference plane P.

At least the frame member 10 and the lens frame member 2 in the region where the electrode group 3 of the ceramic substrate 2 is arranged.
Since the protective coating 29 is provided in the region corresponding to No. 1, it is possible to prevent the electrode group 3 from being electrically short-circuited by joining the frame member 10 and the lens frame member 21 or applying an adhesive agent.

Due to the projection 26 formed on the edge of the peripheral wall portion 22 of the lens frame member 21, the concave portion 2 is formed in the intermediate portion of the edge.
7 is formed. By this recess 27, it is possible to straddle the electrode group 3 of the ceramic substrate 2 and retract from the electrode group 3 so that the lens frame member 21 is not directly hit. Since the direct joining of the electrode group 3 and the lens frame member 21 can be avoided in this way, when soldering to the electrode group 3, heat is not directly transmitted to the lens frame member 21 through the electric conductor pattern. Therefore, deformation of the lens frame member 21 due to heat is prevented, and the mounting accuracy of the lens frame member 21 is ensured.

Since the electrically insulating protective coating 29 of alumina or the like is applied to the region where the electrode group 3 is arranged on the upper surface of the ceramic substrate 2, the frame member 10 is formed.
When the lens frame member 21 is joined and fixed, the electrode group 3 can be protected and an electrical short circuit between the electrodes can be prevented. If the concave portion 27 straddling the electrode group 3 is formed in the lens frame member 21, the protective coating 29 may not be provided, or even if the protective coating 29 is provided, the electrode group 3 may be provided.
The protection function of is enhanced.

The present invention is not limited to the above-mentioned embodiments, but various modifications can be made within the scope of the present invention. Semiconductor chip 1 in the above embodiment
Was a single CMOS type semiconductor chip, but it was a CCD image sensor chip, and in addition to its light receiving part, an analog output circuit,
It may be an optical sensor in which peripheral circuits such as a memory circuit, a clock circuit, and a dynamics expansion section are integrally formed.
Further, the projections 26 of the lens frame member 21 and the abutting portions 28 of the positioning reference plane P with which the projections abut are four sets and are arranged at the four corners of the ceramic substrate 2, but they may be located at other places. However, they may be arranged at three locations. Although the semiconductor chip 1 and the lens frame member 21 are arranged in alignment with the center of the ceramic substrate 2, they may be arranged close to one side of the ceramic substrate 2. Further, the image pickup module may be fitted into a terminal socket to connect the electrode group 3 to another device. Although the lens frame member 21 and the frame member 10 are adhered to the ceramic substrate 2 in the above embodiment, they may be fixed by other means such as a fastening means. If the positioning reference plane portion of the lens frame member 21 with respect to the positioning reference plane P of the ceramic substrate 2 is secured, the ceramic substrate 2 may be arranged and surrounded in the other outer wall portion of the lens frame member 21. Good.

Next, a modification of the image pickup module of the above-described embodiment will be described with reference to FIGS. 7 to 10.

In the first modification shown in FIG. 7, the cover frame member 10 in the configuration of the image pickup module is omitted,
On the other hand, a transparent dustproof protective member 41 made of an optical member such as a protective glass or an infrared cut filter (infrared light blocking member) is provided at the front end of the lens frame member 21, and the dustproof protective member 41 causes the aperture hole 33 to be closed. It had a closed and hermetically sealed structure. The protection member 41 is arranged in a hood 34 formed in a cylindrical shape so as to protrude from the frontmost end surface of the lens frame member 21, and is airtightly adhered and fixed by an adhesive. And
The protective member 41 hermetically seals the diaphragm hole 33 located in front of the lens member 31. The edge of the peripheral wall portion 22 of the lens frame member 21 is sealed to the upper surface of the ceramic substrate 2. The peripheral wall portion 2 of the lens frame member 21
A space between the edge of the second substrate 2 and the upper surface of the ceramic substrate 2 is sealed by using a sealing material such as an adhesive.

In the first modification, the lens frame member 21 is used.
The optical member is assembled in an airtight state onto the lens frame member 2
1 has an airtight structure, the joint (face) portion between the lens frame member 21 and the reference surface is sealed, and the lens frame member 21 seals the semiconductor chip 1. That is, the lens frame member 21 constitutes an airtight cover member, which covers the semiconductor chip 1, and the semiconductor chip 1
Seal. Therefore, it is possible to hermetically seal the semiconductor chip 1 and ensure its reliability with a smaller number of components and a simple structure. Further, by reducing the number of parts, it is possible to reduce the weight and size and the cost.

If an exposure control circuit, a photometric circuit, a system interface, or the like is formed on the same semiconductor chip as a sensor, the semiconductor chip becomes large, and the package must be made large accordingly.
However, in this first modified example, since the lens frame member 21 is used as the airtight sealing member, another member dedicated for sealing is unnecessary, and a larger semiconductor chip can be accommodated in the limited space. Therefore, the product can be downsized. Further, since the infrared cut filter or the like installed on the front end side of the optical system is also used as the sealing member, it can also have a waterproof function. In addition, the infrared cut filter installed on the tip side of the optical system also functions as a protective glass, so that dust and dirt will not enter the optical system and damage the lens and the like.

In the second modification shown in FIG. 8, like the first modification, the cover frame member 10 in the image pickup module in the above embodiment is omitted, but a transparent member such as an infrared cut filter is omitted. 42 is provided on the inner wall surface located inside the lens frame member 21 to hermetically seal. The peripheral portion of the lens frame member 21 is the same as in the first modification.
It is attached to the upper surface of the ceramic substrate 2 in a hermetically sealed state.

The third modified example shown in FIG. 9 has a structure in which both the hermetically sealed structure of the first modified example and the hermetically sealed structure of the second modified example are incorporated. According to this, not only the lens member 31 and the aperture 33,
The optical member 42 can also be protected.

In the fourth modified example shown in FIG. 10, the third
In the modified example, the inner member 42 is arranged and provided so as to be embedded in the wall portion of the lens frame member 21 so as not to project from the inner end surface of the lens frame member 21. That is, the inner member 42, which is an optical member assembled to the lens frame member 21, is retracted to a position farther from the semiconductor chip 1 than the inner wall surface of the lens frame member 21 facing the semiconductor chip 1, It is arranged within the thickness of the wall portion of the lens frame member 21 in the optical axis direction.

In the fourth modification, the lens frame member 2 is used.
Since the member 42 as an optical member is arranged within the thickness of the wall portion 1, the space between the semiconductor chip 1 and the member 42 can be sufficiently large.

Incidentally, in addition to the airtight sealing structure using the frame member 10 as described in the above-mentioned embodiment, a structure may be added in which an airtight sealing structure using the lens frame member 21 is added. .

[0088]

As described above, according to the image pickup module of the present invention, since the mounting positions of the semiconductor chip and the lens frame member are determined by the positioning reference plane of the same flat surface formed on one surface of the substrate, it is simple. Despite the configuration, it is possible to improve the positional accuracy of both. By assembling the semiconductor chip and the lens frame member on the same substrate, the positioning is uniquely completed,
There is no need to adjust the focus after assembly, and assembly can be done easily and easily. In addition, since the position accuracy of both the semiconductor chip and the lens frame member is improved, the movable adjustment mechanism for focusing that was required in the past is not required, and the number of parts can be reduced, the product can be reduced in weight and size, and the price can be reduced. Can be achieved. Further, it is possible to prevent the occurrence of an error caused by the movable adjusting mechanism and the deterioration of reliability, and to improve the vibration resistance. Furthermore, an image pickup module with a simple and highly sealed structure can be obtained, and it can be used even in a severe environment.

According to the image pickup module of claim 3,
The positioning accuracy of the lens frame member with respect to the cover frame member that covers the semiconductor chip is increased, and the fixing of both is ensured. Further, the heat of soldering does not affect the lens frame member as much as possible.
Further, for example, it is possible to bond the lens frame member to the frame member using the gap.

According to the image pickup module of the fourth, fifth, and sixth aspects, even when the cover frame member for covering the semiconductor chip is not provided, the number of parts is reduced and the semiconductor chip has a simple structure. It is possible to ensure airtight sealing and reliability. Further, by reducing the number of parts, the weight and size can be reduced and the manufacturing cost can be reduced. If a lens frame member is used as an airtight sealing member, a member dedicated for sealing is unnecessary, and a larger semiconductor chip can be stored in a limited space.
Can be miniaturized.

According to the imaging module of the second and seventh aspects, a highly accurate positioning reference plane can be obtained on the substrate, and
The imaging module can be manufactured at low cost.

According to the image pickup module of the sixth and eighth aspects, it is possible to prevent the diaphragm hole from being damaged.

The image pickup module according to claims 6 and 10 is
Since the optical member to be assembled to the lens frame member is arranged within the thickness of the wall portion of the lens frame member, it is possible to make the imaging module compact while securing the space in the height direction for providing the bonding wire.

In the image pickup module according to claims 4, 14, 15, and 16, since the transparent member is provided at the front end of the lens frame member, dustproof can be achieved.

According to the imaging module of the seventeenth aspect, the reliability of the optical function can be improved.

According to the imaging module of the nineteenth aspect, since the positional accuracy of the lens frame member with respect to the semiconductor chip is high, the diaphragm may be a fixed diaphragm hole, and the diaphragm structure can be simplified and downsized. In particular, by having a narrowed portion at the tip, the configuration of the lens frame can be simplified, and it can be simplified by, for example, a molding die, and the lens tip protecting function can be obtained.

According to the imaging module of the twentieth aspect, the electrode group can be rationally arranged on a single substrate.

According to the image pickup module of the twenty-second aspect, it is possible to avoid an inconvenience such as an electrical short circuit caused by joining the electrode group to another member.

According to the image pickup module of the twenty-third aspect, the lens frame member does not directly contact the electrode group provided on the substrate, so that the electrode group is protected and the positioning action of the lens frame member is secured. Further, the heat of soldering does not affect the lens frame member as much as possible.

According to the image pickup module of the twenty-fourth aspect, it is possible to avoid the inconvenience caused by joining the electrode group to the lens frame member and to secure the positioning accuracy of the lens frame member.

According to the image pickup module of the twenty-fifth aspect, since the area of the electrode group does not need to be coated, the structure can be simplified and the productivity can be improved.

According to the imaging module of the twenty-sixth aspect, the semiconductor circuit portion formed on the semiconductor chip converts the signal charge obtained from the photoelectric conversion portion into a digital signal A
The / D conversion unit is included, and the electrical imaging process is completed. In particular, the semiconductor circuit section formed on the semiconductor chip converts the signal charge obtained from the photoelectric conversion section into a digital signal A
Since the / D converter and the exposure control means for electrically controlling the exposure time based on the output level of the digital signal are included, the imaging function is completed without incorporating a mechanical aperture mechanism for controlling the light amount, The mirror body of the image pickup module can be simplified and downsized.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of an image pickup module according to an embodiment of the present invention.

FIG. 2 is a perspective view of the image pickup module seen from a front side oblique position.

3A is a top view of the ceramic substrate of the imaging module, FIG. 3B is a view of the ceramic substrate taken along the line IIIB-IIIB shown in FIG. 3A, and FIG. 3C is a bottom face of the ceramic substrate. Fig.

FIG. 4A is a top view of a combination of the frame member and the ceramic substrate of the image pickup module, and FIG. 4B shows the frame member and the ceramic substrate of the image pickup module along the line IVB-IVB shown in FIG. FIG.

5A is a vertical cross-sectional view of a lens frame member of the imaging module, and FIG. 5B is a bottom view of the lens frame member of the imaging module.

FIG. 6 is an explanatory diagram of an arrangement structure of a circuit portion of a MOS semiconductor chip of the image pickup module.

FIG. 7 is a vertical cross-sectional view of an image pickup module according to a first modification of the embodiment of the present invention.

FIG. 8 is a vertical cross-sectional view of an image pickup module according to a second modification of the embodiment of the present invention.

FIG. 9 is a vertical sectional view of an image pickup module according to a third modification of the embodiment of the present invention.

FIG. 10 is a vertical cross-sectional view of an image pickup module according to a fourth modification of the embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip, 2 ... Ceramic substrate, 3 ... Signal input / output electrode group, 10 ... Frame member, 11 ... Through hole, 21 ... Lens frame member, P ... Positioning reference plane.

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-6-177721 (JP, A) JP-A-10-41492 (JP, A) JP-A-9-238286 (JP, A) JP-A-9- 181287 (JP, A) JP 10-321825 (JP, A) JP 11-275407 (JP, A) Actual flat 4-28454 (JP, U) Actual flat 2-51469 (JP, U) Actual Kaihei 2-106847 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H04N 5/335 H01L 27/14 H04N 5/225

Claims (26)

(57) [Claims] 1. An image pickup lens member, a lens frame member for holding the lens member, a photoelectric conversion section including a photoelectric conversion element group arranged two-dimensionally, and a peripheral circuit are formed on the same semiconductor chip. A semiconductor circuit part, a substrate holding the semiconductor chip, a cover frame member having a hollow structure which is installed on the substrate and covers the semiconductor chip, and an optical member attached to the cover frame member. In the provided image pickup module, a positioning reference surface composed of the same flat surface is formed on one surface of the substrate, and the positioning reference surface is a semiconductor chip positioning for mounting the semiconductor chip by planarly bonding and positioning it. A reference surface portion, a frame member mounting surface portion that is located around the semiconductor chip and is joined and attached to the cover frame member, and a lens frame portion that is located outside the cover frame member. And a lens frame positioning reference surface portion that is bonded and positioned to be mounted, and a reference surface for bonding and positioning the semiconductor chip by the positioning reference surface of the same flat surface formed on one surface of the substrate, and An imaging module characterized in that it also serves as a reference plane for joining and positioning a lens frame member. 2. The image pickup module according to claim 1, wherein the substrate is a bulk type ceramic substrate. 3. The lens frame member is fitted around the outer periphery of the cover frame member, and one of the cover frame member and the lens frame member is fitted to a fitting portion of the cover frame member and the lens frame member. A protrusion is formed to be joined to the other, and the protrusion is used to position the cover frame member and the lens frame member, and a gap is formed between the cover frame member and the fitting portion of the lens frame member. The image pickup module according to claim 1, characterized in that. 4. An imaging lens member, a lens frame member that holds the lens member, a photoelectric conversion unit including a photoelectric conversion element group arranged two-dimensionally, and a peripheral circuit are formed on the same semiconductor chip. In the imaging module including the semiconductor circuit part and the substrate that holds the semiconductor chip, an optical member to be assembled to the lens frame member may be provided on the semiconductor substrate rather than an inner wall surface of the lens frame member facing the semiconductor chip. Retreat to a position away from the chip and place it within the thickness of the wall of the lens frame member in the optical axis direction, and form a positioning reference surface consisting of the same flat surface on one surface of the substrate. The surface is positioned around the semiconductor chip positioning reference surface portion on which the semiconductor chip is planarly bonded, positioned and mounted, and the lens frame member is bonded and positioned. Including a lens frame positioning reference surface portion to be attached, and a reference surface for bonding and positioning the semiconductor chip and the lens frame member by a positioning reference surface of the same flat surface formed on one surface of the substrate. A dust-proof transparent member is placed at the foremost end of the lens frame member in common with the reference surface for positioning and is airtight.
With the structure and sealing the joint surface with the reference plane,
An image pickup module characterized in that the semiconductor chip is sealed by a frame member . 5. An image pickup lens member, a lens frame member for holding the lens member, a photoelectric conversion unit composed of a photoelectric conversion element group arranged two-dimensionally, and a peripheral circuit unit on the same semiconductor chip. In an image pickup module comprising a formed semiconductor circuit portion and a substrate holding the semiconductor chip, the substrate is formed by pressing a ceramic raw material onto a mold surface to form a bulk material integrally and baking the bulk material. Is a type ceramic substrate, and a positioning reference surface composed of the same flat surface is formed on one surface of the substrate. The positioning reference surface is a semiconductor chip positioning for mounting and positioning the semiconductor chips in a planar manner. Formed on one surface of the substrate, including a reference surface portion and a lens frame positioning reference surface portion that is located around the semiconductor chip and that joins and positions the lens frame member for positioning. An image pickup module characterized in that a reference surface for joining and positioning the semiconductor chip and a reference surface for joining and positioning the lens frame member are shared by the positioning reference surface of the same flat surface. . 6. An image pickup lens member, a lens frame member for holding the lens member, a photoelectric conversion section including a photoelectric conversion element group arranged two-dimensionally, and a peripheral circuit section on the same semiconductor chip. An image pickup module comprising: the formed semiconductor circuit portion; and a substrate holding the semiconductor chip, wherein an end portion of the lens frame member has an aperture hole, and a cylindrical wall is provided around the aperture hole portion. A positioning reference surface formed of the same flat surface is formed on one surface of the substrate, and the positioning reference surface serves as a semiconductor chip positioning reference surface portion for bonding and positioning the semiconductor chips in a planar manner. , A lens frame positioning reference surface portion that is positioned around the semiconductor chip, is joined and positioned to mount the lens frame member, and by the positioning reference surface of the same flat surface formed on one surface of the substrate, The reference surface for joining and positioning the semiconductor chip and the reference surface for joining and positioning the lens frame member are shared, and the lens frame member is provided with an optical member, and the optical member is attached to the semiconductor chip. Opposite mirror frame
Position farther from the semiconductor chip than the inner wall surface of the member
The lens frame member within the thickness in the optical axis direction.
An imaging module characterized by being placed in 7. A photoelectric conversion unit comprising an image pickup lens member, a lens frame member holding the lens member, and a photoelectric conversion element group arranged two-dimensionally.
And the peripheral circuit part are formed on the same semiconductor chip.
And the conductor circuit portion, in the imaging module and a substrate for holding the semiconductor chip, the substrate Ri bulk ceramic substrate der has a aperture stop to the distal end portion of the lens frame member, of the narrowed hole part
It has a cylindrical wall around it and is the same on one side of the board
A positioning reference surface made of a flat surface is formed, and the positioning reference surface is mounted by planarly bonding and positioning the semiconductor chip.
The semiconductor chip positioning reference plane portion and the lens frame member that is located around the semiconductor chip
To position and mount the lens frame positioning reference surface
Including and positioning reference surface of the same flat surface formed on one surface of the substrate
The base for joining and positioning the semiconductor chips
A reference surface for joining and positioning the lens frame member
An imaging module characterized by sharing the same . 8. A diaphragm hole is provided at the tip of the lens frame member,
The image pickup module according to any one of claims 1 to 3, wherein a cylindrical wall is provided around the portion of the aperture hole. 9. The image pickup module according to claim 5, wherein the lens frame member is provided with an optical member. 10. The thickness of the wall of the lens frame member in the optical axis direction is retracted to a position farther from the semiconductor chip than the inner wall surface of the lens frame member facing the semiconductor chip. The image pickup module according to claim 9, wherein the image pickup module is arranged inside. 11. The optical member is assembled to the lens frame member in an airtight state to form the lens frame member in an airtight structure,
11. The bonding portion between the lens frame member and the reference surface is sealed, and the semiconductor chip is sealed by the lens frame member. Imaging module. 12. The optical member is an infrared light shielding member, a lens, or an optical window, and
The imaging module according to any one of 2, 3, and 8. 13. The optical member according to claim 4, which is an infrared light shielding member, a lens, or an optical window.
The imaging module according to any one of 9, 10, and 11. 14. A dustproof transparent member is arranged at the foremost end of the lens frame member to have an airtight structure, and a joint surface with the reference surface is sealed, and the semiconductor chip is sealed by the lens frame member. Claims 4, 9, 1 characterized in that
The imaging module according to any one of 0 and 11. 15. A dustproof transparent member is arranged at the foremost end of the lens frame member to have an airtight structure, and a joint surface with the reference surface is sealed, and the semiconductor chip is sealed by the lens frame member. The image pickup module according to any one of claims 5 to 7, characterized in that. 16. A dustproof transparent member is arranged at the foremost end of the lens frame member to have an airtight structure, a joint surface with the reference surface is sealed, and the semiconductor chip is sealed by the lens frame member. The image pickup module according to claim 13, wherein the image pickup module is configured as described above. 17. The infrared light blocking optical member is a multilayer film type infrared removal filter,
The imaging module according to any one of 2, 3, 4, 8, 9, 10, 11, and 14. 18. The infrared light shielding member is a multilayer film type infrared removing filter,
16. The imaging module according to any one of 16. 19. The image pickup module according to claim 1, wherein a fixed aperture is provided at a front end portion of the lens frame member. 20. The positioning reference surface is entirely formed up to the outer peripheral end of the substrate, and an electrode group is arranged at the outer end portion thereof. Imaging module. 21. The image pickup module according to claim 1, wherein the substrate has an electrode group which holds the semiconductor chip and is electrically connected to the semiconductor chip. 22. The image pickup module according to claim 20, wherein the electrode group is coated with a protective film at least at a portion where another member is joined. 23. At one end of the lens frame member facing the positioning reference surface, an abutting protrusion that abuts the positioning reference surface while avoiding the electrode group of the substrate, and the electrode group at a position facing the electrode group. The image pickup module according to any one of claims 20 to 22, characterized in that an escape portion is provided so as to avoid it. 24. The electrode group according to claim 20, wherein the electrode group is provided so as to avoid a region where the lens frame member is joined on a positioning reference plane of the substrate. Imaging module. 25. The image pickup module according to claim 23, wherein a protective coating is not applied to a region of the electrode group corresponding to the relief portion. 26. The peripheral circuit comprises a drive circuit section for sequentially driving the photoelectric conversion element group of the photoelectric conversion section to obtain a signal charge,
An A / D converter for converting the signal charge into a digital signal,
2. A signal processing unit that outputs the digital signal as a video signal output, and an exposure control unit that electrically controls the exposure time based on the output level of the digital signal. The imaging module according to any one of 1 to 25.