JP2003219227A - Solid-state image pickup device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To downsize a solid-state image pickup device as a whole by downsizing a substrate for a camera. <P>SOLUTION: A solid-state image pickup element (CCD, CMOS, etc.), 13 and a DSP (digital signal processor) 14 are stuck together on rear surfaces being mutual opposite sides from element-formed surfaces, the DSP 14 is provided on the substrate 14 for a camera by flip-chip mounting, and the solid-state image pickup element 13 on the rear surface of the DSP 14 is mounted over the substrate 14 for a camera by wire bonding. A TG 15 is provided on the rear surface side of the substrate 4 for a camera at the position where the solid-state image pickup element 13 is provided. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device mounted on a mobile phone, a notebook personal computer or the like.

[0002]

2. Description of the Related Art As a conventional solid-state image pickup device, for example,
There is one disclosed in Japanese Patent Laid-Open No. 9-252081.
In this solid-state imaging device, as shown in FIG.
The CCD 21 is connected to the C20 so that the so-called active area 23 in which the elements are formed faces each other.
Are electrically and mechanically connected via. And C
The vertical drive IC 24 for vertical drive of the CD 21 is also electrically and mechanically connected to the signal processing IC 20 via the connection portion 25. CCD 21 for the signal processing IC 20
A hole 20a is provided for imaging the
A lens barrel 28 provided with a lens 26 and an optical filter 27 is provided on the light receiving surface 21 a side of No. 1. The signal processing IC 20 is connected to the lead frame 30 by wire bonding 29, and the entire device is sealed with a resin 31 to form a camera module, which is mounted on a camera substrate (not shown). In addition, the signal processing IC is not provided with a hole, but the signal processing IC and the CCD are stacked and provided.
The printed circuit board on the side facing D may be provided with a hole.

[0003]

Since the signal processing IC 20 and the CCD 21 are in contact with each other with the active areas 23 facing each other, the signal processing IC is used for imaging.
The hole 20a is required in 20. Therefore, the signal processing IC 20 is increased in size by the area of the hole 20a,
Even if the ICs 20 are stacked to reduce the mounting area, there is a limit to miniaturization. Further, the signal processing IC 20 has a hole 20
Even when there is no a and the hole is provided on the printed circuit board side, there is a problem that the printed circuit board is similarly enlarged by the area of the hole.

[0004]

In a solid-state image pickup device according to the present invention, a solid-state image pickup element and a signal processing I of the solid-state image pickup element are used.
C, a camera substrate to which the solid-state image sensor is attached,
A solid-state image sensor, and a lens unit provided with a lens for forming a subject image. The solid-state image sensor and the signal processing IC are fixed to each other at their rear surfaces, and the image-capturing surface of the solid-state image sensor faces the lens side. The solid-state imaging device and the signal processing IC are mounted on the camera substrate with the element forming surface of the signal processing IC facing the camera substrate side. In addition, a solid-state image sensor, a signal processing IC, and a timing generator that generates drive timing of the solid-state image sensor are mounted on the optical axis on the camera substrate. Further, the solid-state image sensor or the signal processing IC may have a built-in circuit for generating drive timing of the solid-state image sensor.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION Regarding one embodiment of the present invention,
A description will be given with reference to the drawings. FIG. 1 shows the entire solid-state imaging device. A socket 2 is provided so as to be electrically connected to a mother board 1 on which a circuit for controlling a device body such as a mobile phone is mounted. The socket 2 is made of a plastic material. The socket 2 is internally provided with a locking portion 2a for locking the camera substrate 4, and the camera substrate 4 is locked by the claw portion 2a1 provided on the locking portion 2a so that it cannot be removed. There is. When the camera substrate 4 is locked in the socket 2, the connection terminal (not shown) provided in the socket 2 and the connection terminal (not shown) provided in the camera substrate 4 are electrically connected,
The imaging information can be sent to the motherboard 1.

On the surface of the camera substrate 4 (above the drawing),
A solid-state image sensor (CCD, CMOS, etc.) 13 and a DSP 14 which is a signal processing IC of the solid-state image sensor 13 are provided. The surface of the solid-state imaging device 13 is an imaging surface, and the surface of the DSP 14 is an element formation surface on which elements are formed. Then, the solid-state image sensor 13 and the DSP 1
4 is a back surface which is not an image pickup surface or an element formation surface and is adhered by an adhesive. The image pickup surface of the solid-state image pickup device 13 is arranged so that its center is located on the optical axis A. D
The SP 14 is provided on the camera substrate 4 by flip-chip mounting, and the solid-state image sensor 1 bonded to the back surface of the SP 14
3 is mounted on the camera substrate 4 by wire bonding. Further, a TG 15 which is a timing generator for generating various drive timings of the solid-state image pickup device 13 is provided on the back surface of the camera substrate 4 (downward in the drawing). The TG 15 is also arranged on the optical axis A.

The lens unit 3 includes a lens 7, a cylindrical lens holder 8, a cylindrical lens retainer 9 and a cylindrical holder 1.
It consists of zero. A female screw portion 8a is provided on the inner periphery of the lower portion of the lens holder 8, and a male screw portion 9a on the outer periphery of the lens retainer 9 is screwed into the female screw portion 8a to form the lens retainer 9a.
The lens 7 is fixedly held by the lens holder 8. A male screw portion 8b is provided on the outer periphery of the lower portion of the lens holder 8, and the female screw portion 10 of the holder 10 is attached to the male screw portion 8b.
a is screwed, so that the lens holder 8 is held by the holder 10.
It is fixed to. By adjusting the screwing amount of the lens holder 8 and the holder 10, the solid-state imaging device 13 and the lens 7 are adjusted.
The lens holder 8 is fixed to the holder 10 with an adhesive after the distance between and is finely adjusted to adjust the focus.

The holder 10 is formed of a plastic material in a cylindrical shape, and a metal film 10e is provided on the entire outer circumference by means of plating or vapor deposition for shielding electromagnetic waves. Further, on the camera substrate 4, there is provided a shield plate 11 formed of a metal material such as aluminum for shielding electromagnetic waves. The shield plate 11 is not shown in the drawing but on the camera substrate 4. It is connected to the ground terminal. The shield plate 11 is formed with a contact piece 11a that comes into contact with the metal film 10e on the outer periphery of the holder 10, and the metal film 10e is connected to the ground terminal on the camera substrate 4 via the shield plate 11.
It is supposed to conduct with. An IR cut filter 12 formed in a rectangular shape is fixed inside the holder 10 with an adhesive material to prevent unnecessary infrared rays from entering the solid-state image sensor 13. An adhesive 5 is applied to the lower portion of the inner periphery of the holder 10, and the holder 10 is fixed to the camera substrate 4 by the adhesive 5.

According to the above construction, the solid-state image pickup device 13 and D
Since the SP14 and the solid-state image sensor 13 are bonded on the rear surface so that the image-capturing surface of the solid-state image sensor 13 faces the lens 7 side and the element forming surface of the DSP 14 faces the camera substrate 4 side, the solid-state image sensor 13 and the DSP 14 It is not necessary to provide a conventional hole portion in the DSP 14 or the camera substrate 4 even if the DSP 14 and the camera substrate 4 are brought into close contact with each other.
Alternatively, the camera substrate 4 can be downsized. Further, since the solid-state image sensor 13, the DSP 14, and the TG 15 are provided on the optical axis A, main ICs are concentrated on the optical axis A, and the size of the camera substrate 4 can be further reduced. Further, since the size of the camera substrate 4 is reduced, it is not necessary to cover the wide area with the shield plate 11, and the restrictions on the place where the solid-state imaging device is incorporated in the device are reduced. In this embodiment, the TG
Although 15 is arranged on the optical axis A, the present invention is not limited to this, and the TG 15 may be arranged at a position deviated from the optical axis A. Further, the TG 15 may be omitted and the solid-state imaging device 13 or D may be omitted.
A circuit for generating the drive timing of the solid-state image sensor 13 may be incorporated in the SP14.

[0010]

As described above, according to the present invention, the camera substrate can be downsized, and thus the solid-state image pickup device as a whole can be downsized.

[Brief description of drawings]

FIG. 1 is a sectional view of a solid-state imaging device according to the present invention.

FIG. 2 is a sectional view of a conventional camera.

[Explanation of symbols]

3 lens unit 4 Camera substrate 7 lenses 13 Solid-state image sensor 14 Signal processing IC 15 Timing generator A optical axis

Continued front page    F-term (reference) 4M118 AA10 AB01 BA10 BA14 GC11                       GC20 GD02 HA20 HA22 HA24                       HA30 HA33                 5C022 AA12 AC42 AC54 AC55 AC70                       AC78

Claims (3)

[Claims] 1. A lens provided with a solid-state imaging device, a signal processing IC of the solid-state imaging device, a camera substrate to which the solid-state imaging device is attached, and a lens for forming a subject image on the solid-state imaging device. A unit, the solid-state imaging device and the signal processing IC are fixed to each other at their back surfaces, the imaging surface of the solid-state imaging device is directed to the lens side, and the element formation surface of the signal processing IC is described above. A solid-state image pickup device, wherein the solid-state image pickup device and the signal processing IC are mounted on the camera substrate facing toward the camera substrate. 2. The camera substrate according to claim 1, wherein the solid-state imaging device, the signal processing IC, and a timing generator that generates a driving timing of the solid-state imaging device are mounted on an optical axis. A solid-state image pickup device comprising: 3. The camera substrate according to claim 1, wherein the solid-state image sensor and the signal processing IC are mounted on an optical axis, and the solid-state image sensor or the signal processing IC has the above-mentioned structure. A solid-state imaging device having a built-in circuit for generating drive timing of a solid-state imaging device.