JP2003073898A - Method for manufacturing electronic parts - Google Patents
Method for manufacturing electronic partsInfo
- Publication number
- JP2003073898A JP2003073898A JP2001270768A JP2001270768A JP2003073898A JP 2003073898 A JP2003073898 A JP 2003073898A JP 2001270768 A JP2001270768 A JP 2001270768A JP 2001270768 A JP2001270768 A JP 2001270768A JP 2003073898 A JP2003073898 A JP 2003073898A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- electronic component
- insulating
- electronic parts
- vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電子部品のメッ
キ方法、外形寸法が１．０ｍｍ×０．５ｍｍ×０．５ｍ
ｍ、特にそれ以下のような小型の電子部品のメッキ方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating method for electronic parts and external dimensions of 1.0 mm × 0.5 mm × 0.5 m.
In particular, the present invention relates to a method for plating a small electronic component such as m or less.
【０００２】[0002]
【従来の技術】小型電子部品をメッキする方法として、
一般にバレルメッキと呼ばれる方法がある。2. Description of the Related Art As a method for plating small electronic parts,
Generally, there is a method called barrel plating.
【０００３】バレルメッキによれば、以下に示す方法で
電子部品にメッキを施す。絶縁性の網で外観を六角柱状
に形成したメッキ容器にメッキ用電極としての陰極棒を
貫通させ、この容器内にメッキされるべき小型電子部品
とメディアとしてのスチールボールを多数個投入する。
このメッキ容器をメッキ槽内に浸漬し、その状態で、メ
ッキ容器を六角柱の軸方向を回転軸として回転させなが
ら、陰極棒に電流を流すことによりメッキを行う。According to barrel plating, electronic parts are plated by the following method. A cathode rod as an electrode for plating is penetrated through a plating container whose appearance is formed into a hexagonal columnar shape with an insulating net, and a large number of small electronic components to be plated and steel balls as media are put into this container.
This plating container is immersed in a plating tank, and in that state, plating is performed by applying a current to the cathode rod while rotating the plating container about the axis of the hexagonal column.
【０００４】すなわち、容器を回転させることにより内
部の電子部品およびスチールボールを撹拌し、陰極棒に
電流を供給することにより、陰極棒と接触したスチール
ボールが電子部品にさらに接触して電解メッキが行われ
る。That is, by rotating the container to stir the internal electronic components and the steel balls and supplying an electric current to the cathode rod, the steel balls in contact with the cathode rod further contact with the electronic components for electrolytic plating. Done.
【０００５】しかし、このようなメッキ方法では、必ず
しも充分な撹拌が行われず、電子部品およびスチールボ
ールがそれぞれ凝集してしまったり、逆にメッキされな
い電子部品が発生することがあった。However, in such a plating method, sufficient agitation is not always performed, and the electronic parts and the steel balls may agglomerate, or conversely, electronic parts that are not plated may occur.
【０００６】このような問題を解決するメッキ方法を図
１に示す。図１はメッキ装置の外観図であり、１は積層
コンデンサ等の電子部品、２はメディアであるスチール
ボール、３は絶縁物粒体、１１はメッキ装置、１２は振
動発生部、１３は振動伝達部、１４は複数の電子部品
１、スチールボール２および絶縁物粒体を挿入するバス
ケット、１５はメッキ槽である。このメッキ装置は特許
第２７４５８９２号に開示されている。A plating method for solving such a problem is shown in FIG. FIG. 1 is an external view of a plating apparatus. 1 is an electronic component such as a multilayer capacitor, 2 is a steel ball which is a medium, 3 is an insulating granular material, 11 is a plating apparatus, 12 is a vibration generator, and 13 is vibration transmission. Reference numeral 14 is a basket into which a plurality of electronic components 1, steel balls 2 and insulating particles are inserted, and 15 is a plating tank. This plating apparatus is disclosed in Japanese Patent No. 2745892.
【０００７】メッキ装置１１は、メッキされるべき外部
電極を有した電子部品１、スチールボール２、および絶
縁物粒体３の混合体を挿入するバスケット１４と、バス
ケット１４に振動を与える振動発生部１２、振動発生部
１２で発生した振動をバスケット１４に伝達する振動伝
達部１３からなる。メッキ方法としては、前記混合体を
挿入したバスケット１４をメッキ槽１５に浸漬させ、振
動発生部部１２で発生した上下方法の振動をバスケット
１４与えながら、振動伝達部１３を中心にバスケット１
４を回転させる。バスケット１４に振動と回転と与える
ことにより、バスケット１４内に挿入された電子部品
１、スチールボール２、絶縁性粒体３が撹拌され、互い
に接触する。接触することにより、電子部品１に電流が
流れ、外部電極が電解メッキされる。ここで、絶縁性粒
体３は、電子部品１よりも大きいアルミナボールまたは
鉄球にシリコン樹脂を被膜形成したものであり、電子部
品などと同程度の表面硬度を有している。The plating apparatus 11 includes a basket 14 into which a mixture of an electronic component 1 having an external electrode to be plated, a steel ball 2 and an insulating granular material 3 is inserted, and a vibration generating unit for vibrating the basket 14. 12, a vibration transmission unit 13 that transmits the vibration generated by the vibration generation unit 12 to the basket 14. As a plating method, the basket 14 having the mixture inserted therein is dipped in the plating tank 15, and the vibration of the vertical direction generated in the vibration generating unit 12 is applied to the basket 14, while the basket 1 is centered around the vibration transmitting unit 13.
Rotate 4. By applying vibration and rotation to the basket 14, the electronic component 1, the steel balls 2, and the insulating particles 3 inserted in the basket 14 are agitated and come into contact with each other. By making contact, a current flows through the electronic component 1 and the external electrodes are electroplated. Here, the insulating particles 3 are alumina balls or iron balls, which are larger than the electronic component 1, and are coated with a silicon resin, and have the same surface hardness as that of the electronic component.
【０００８】この構成により、電子部品が凝集したり、
メッキされないといった現象を抑制することができる。With this structure, electronic parts are aggregated,
The phenomenon of not being plated can be suppressed.
【０００９】[0009]
【発明が解決しようとする課題】しかし、このような従
来のメッキ方法においては、解決すべき課題があった。
すなわち、電子部品よりも大きく、同程度の硬度を有す
る絶縁性粒体を混在させて撹拌する際に、電子部品と絶
縁性粒体とが衝突して、電子部品に欠けや割れが発生し
てしまう場合があった。一方、絶縁性粒体を入れなけれ
ば、電子部品同士および電子部品とスチールボールとの
凝集が発生したり、メッキされない電子部品が生じてし
まう。However, in such a conventional plating method, there are problems to be solved.
That is, when the insulating particles having a hardness similar to that of the electronic component and having a hardness similar to that of the electronic component are mixed and agitated, the electronic component and the insulating granular material collide with each other, and the electronic component is chipped or cracked. There were times when it ended up. On the other hand, if the insulating granules are not put in, agglomeration of electronic components, electronic components and steel balls will occur, and electronic components that are not plated will occur.
【００１０】この発明の目的は、凝集の発生を抑制し、
確実にメッキを行いながら、電子部品の欠けおよび割れ
の生じない小型電子部品のメッキ方法を提供することに
ある。The object of the present invention is to suppress the occurrence of aggregation,
An object of the present invention is to provide a plating method for a small electronic component that does not cause chipping or cracking of the electronic component while performing reliable plating.
【００１１】[0011]
【課題を解決するための手段】この発明は、電子部品の
表面硬度よりも低い表面硬度である絶縁性ゴムまたは樹
脂で表面を覆われた絶縁性粒体を電子部品およびスチー
ルボールとともにメッキ容器内に混在させて電子部品の
メッキを行う。According to the present invention, an insulating granule whose surface is covered with an insulating rubber or resin having a surface hardness lower than that of an electronic component is placed in a plating container together with the electronic component and a steel ball. And mix them to plate electronic components.
【００１２】また、この発明は、絶縁性ゴムまたは樹脂
で表面を覆われた絶縁性粒体の表面硬度を９０Ｈｓ以下
にして電子部品のメッキを行う。Further, according to the present invention, electronic parts are plated by setting the surface hardness of the insulating granules whose surface is covered with insulating rubber or resin to 90 Hs or less.
【００１３】また、この発明は、絶縁性粒体の直径を電
子部品の外形における最小寸法の５倍以上、最大寸法の
１０倍以下にして電子部品のメッキを行う。Further, according to the present invention, the diameter of the insulating granules is set to 5 times or more the minimum dimension in the outer shape of the electronic component and 10 times or less the maximum dimension of the electronic component for plating the electronic component.
【００１４】[0014]
【発明の実施の形態】本発明の一実施形態である電子部
品のメッキ方法を説明する。本実施形態における電子部
品のメッキ方法は以下の通りである。BEST MODE FOR CARRYING OUT THE INVENTION A method of plating an electronic component according to an embodiment of the present invention will be described. The plating method of the electronic component in this embodiment is as follows.
【００１５】メッキ用の容器にメッキされるべき外部電
極を有する小型の電子部品、メディアとしてのスチール
ボール、および絶縁性粒体を混在させて、このメッキ容
器をメッキ槽内に浸漬させる。浸漬させた状態で、メッ
キ容器を水平方向および垂直方向のそれぞれに旋回また
は振動させてメッキ容器内の各パーツを撹拌する。この
状態で、メッキ容器に備えられた陰極棒等の通電体に電
流を流す。A small electronic component having an external electrode to be plated, a steel ball as a medium, and insulating particles are mixed in a plating container, and the plating container is immersed in a plating tank. In the immersed state, the plating container is swung or vibrated in each of the horizontal direction and the vertical direction to stir each part in the plating container. In this state, an electric current is passed through an electric conductor such as a cathode rod provided in the plating container.
【００１６】撹拌されている各パーツは互いに衝突しな
がら運動を行っているが、電子部品が通電体に接触する
ことにより電荷を受け、表面に電解メッキが行われる。
また、スチールボールが通電体に接触し電荷を受けなが
ら、電子部品に衝突することでも、電子部品は間接的に
電荷を受け、表面に電解メッキが行われる。一方、絶縁
性粒体は、通電体に接触しても電荷を受けず、電子部品
およびスチールボールに衝突しても、電荷の授受を行わ
ないため、メッキ液内を常に他のパーツと衝突しなが
ら、運動を続けている。このため、常に、メッキ容器内
は大局的にも、詳細部でも撹拌されており、電子部品同
士および電子部品とスチールボールとによる凝集を抑制
することができる。The agitated parts move while colliding with each other, but when the electronic parts come into contact with the current-carrying body, they receive an electric charge, and the surface is electroplated.
Also, when the steel ball comes into contact with an electric conductor and receives an electric charge and collides with an electronic component, the electronic component indirectly receives the electric charge and electrolytic plating is performed on the surface. On the other hand, the insulating particles do not receive an electric charge when they come into contact with a current-carrying body, and do not exchange electric charges even when they collide with electronic parts and steel balls, so they always collide with other parts in the plating solution. While still exercising. For this reason, the inside of the plating container is always stirred both globally and in detail, and it is possible to suppress aggregation between electronic components and between electronic components and steel balls.
【００１７】ここで、絶縁性粒体の構成要素をパラメー
タとして、電子部品の凝集率、欠けおよび割れの発生率
の変化を測定した結果を表１に示す。Table 1 shows the results of measuring changes in the agglomeration rate and the occurrence rate of chipping and cracking of electronic components using the constituent elements of the insulating particles as parameters.
【００１８】この実験の固定条件として、電子部品は１
００５サイズ（外形寸法１．０ｍｍ×０．５ｍｍ×０．
５ｍｍ）の積層セラミックコンデンサ、スチールボール
は直径０．５ｍｍの鉄球、それぞれの投入個数は１００
０００個である。As a fixed condition for this experiment, 1
005 size (outer dimensions 1.0 mm x 0.5 mm x 0.
5mm) monolithic ceramic capacitors, steel balls are 0.5mm diameter iron balls, and the number of each is 100.
It is 000.
【００１９】この電子部品とスチールボールとの混合体
に各条件の絶縁性粒体を１００ｃｃ投入してメッキを行
った。100 cc of insulating particles under each condition were put into a mixture of this electronic component and a steel ball for plating.
【００２０】[0020]
【表１】 [Table 1]
【００２１】表１に示すように、絶縁性粒体がシリコン
樹脂被膜（表面硬度が１００Ｈｓ以上）したものである
場合には、欠けおよび割れが発生する。As shown in Table 1, when the insulating particles have a silicon resin coating (surface hardness of 100 Hs or more), chipping and cracking occur.
【００２２】一方、絶縁性粒体がシリコンゴムを表面被
膜（表面硬度が９０Ｈｓ以下）したものである場合に
は、欠けおよび割れの発生はない。これは、メッキ時の
撹拌において、電子部品と絶縁性粒体とが衝突する際
に、絶縁性粒体の表面硬度が低いため、弾性衝突とな
り、欠けおよび割れが発生しにくくなるからであると考
えられる。On the other hand, when the insulating granules are formed by coating silicon rubber on the surface (surface hardness is 90 Hs or less), no chipping or cracking occurs. This is because the surface hardness of the insulating granules is low when the electronic particles collide with the insulating granules during stirring during plating, which results in elastic collisions, which makes chips and cracks less likely to occur. Conceivable.
【００２３】次に、凝集率と各条件との関係を考察する
と、表面硬度の影響は受けず、絶縁粒体の直径に関係す
ることが分かる。すなわち、直径が１２ｍｍ以上または
２ｍｍ以下であった場合には凝集が発生する。一方、直
径が２．５ｍｍおよび１０ｍｍの場合には凝集が発生し
ない。Next, considering the relationship between the agglomeration rate and each condition, it is understood that the surface hardness is not affected and the relationship is related to the diameter of the insulating particles. That is, when the diameter is 12 mm or more or 2 mm or less, agglomeration occurs. On the other hand, when the diameters are 2.5 mm and 10 mm, no agglomeration occurs.
【００２４】これは、直径が１２ｍｍの場合には、絶縁
性粒体が電子部品の外形寸法よりも大きくなりすぎ絶縁
性粒体同士は衝突するが、電子部品がその隙間に入り込
んでしまい、衝突回数が減少するからであると考えられ
る。また、直径が２ｍｍの場合には、重さが足りないた
め、絶縁性粒体が電子部品に衝突しても、十分な運動エ
ネルギーを与えることができず、撹拌作用を及ぼすこと
ができないからである。さらに、直径が２ｍｍの場合に
は、大きさが電子部品の外形寸法よりも若干大きい程度
なので、電子部品と一緒に回転するため、絶縁物粒体が
電子部品に衝突しても十分な運動エネルギーを与えるこ
とができず、撹拌作用を及ぼすことができないからであ
る。This is because when the diameter is 12 mm, the insulating particles become larger than the outer dimensions of the electronic parts and the insulating particles collide with each other, but the electronic parts enter the gap and collide. It is considered that this is because the number of times decreases. In addition, when the diameter is 2 mm, the weight is not sufficient, and even if the insulating particles collide with the electronic component, sufficient kinetic energy cannot be given and the stirring action cannot be exerted. is there. Furthermore, when the diameter is 2 mm, the size is a little larger than the external dimensions of the electronic component, and therefore it rotates together with the electronic component, so even if the insulator granules collide with the electronic component, sufficient kinetic energy is obtained. This is because it is impossible to give a stirring effect.
【００２５】このように、絶縁性粒体の直径がメッキさ
れるべき電子部品の大きさと比較して、ある一定の範囲
内、すなわち、電子部品の外形最小寸法の５倍以上、最
大寸法の１０倍以下程度である場合に、凝集を抑制する
ことができる。As described above, the diameter of the insulating particles is within a certain range as compared with the size of the electronic component to be plated, that is, 5 times or more the minimum external dimension of the electronic component and 10 the maximum dimension. When it is about twice or less, aggregation can be suppressed.
【００２６】なお、絶縁性粒体の表面被覆を行う素材
は、表面硬度が９０Ｈｓ以下となるのであれば、ゴムに
限らず樹脂であってもよい。The material for the surface coating of the insulating particles is not limited to rubber and may be resin as long as the surface hardness is 90 Hs or less.
【００２７】[0027]
【発明の効果】この発明によれば、電子部品の表面硬度
よりも低い表面硬度である絶縁性ゴムまたは樹脂で表面
を覆われた絶縁性粒体を電子部品およびスチールボール
とともにメッキ容器内に混在させることにより、電子部
品同士および電子部品とスチールボールとの凝集を抑制
してメッキを行うことができる。According to the present invention, insulating particles whose surface is covered with insulating rubber or resin having a surface hardness lower than that of electronic parts are mixed in the plating container together with the electronic parts and steel balls. By doing so, it is possible to carry out plating while suppressing aggregation of the electronic components and between the electronic components and the steel balls.
【００２８】また、この発明によれば、絶縁性ゴムまた
は樹脂で表面を覆われた絶縁性粒体の表面硬度が９０Ｈ
ｓ以下にすることにより、衝突による電子部品の欠けや
割れの発生を防止してメッキを行うことができる。Further, according to the present invention, the surface hardness of the insulating particles covered with the insulating rubber or resin has a surface hardness of 90H.
By setting the thickness to s or less, it is possible to prevent the occurrence of chipping or cracking of electronic components due to collision and perform plating.
【００２９】また、この発明によれば、絶縁性粒体の直
径を電子部品の外形における最小寸法の５倍以上、最大
寸法の１０倍以下にすることにより、効果的に撹拌を行
うことができ、更に凝集を抑えてメッキを行うことがで
きる。Further, according to the present invention, by making the diameter of the insulating granular material 5 times or more the minimum dimension and 10 times or less the maximum dimension in the outer shape of the electronic component, the stirring can be effectively performed. Further, the plating can be performed while further suppressing the aggregation.
【図１】従来のメッキ装置の外観図FIG. 1 External view of a conventional plating apparatus
１−電子部品 ２−スチールボール ３−絶縁物粒体 １１−メッキ装置 １２−メッキ容器 １３−陰極棒 １４−メッキ容器１２の蓋 1-electronic components 2-steel ball 3-Insulator granules 11-plating equipment 12-plating container 13-cathode rod 14- Lid of plating container 12
Claims (3)
ア、および絶縁性粒体をそれぞれ複数収容し、前記容器
をメッキ槽に浸漬し、所定方向に旋回または振動させな
がら、前記電子部品に電解メッキを施す電子部品の製造
方法であって、 表面硬度が、前記電子部品の表面硬度よりも低い絶縁性
ゴムまたは樹脂で表面を覆われた前記絶縁性粒体を用い
た電子部品の製造方法。1. An electronic component to be plated, a medium, and a plurality of insulating particles are respectively housed in a container, the container is immersed in a plating tank, and the electronic component is electrolyzed while swirling or vibrating in a predetermined direction. A method of manufacturing an electronic component to be plated, wherein the surface hardness is lower than the surface hardness of the electronic component, and the insulating granular material whose surface is covered with an insulating rubber or resin is used.
れた絶縁性粒体の表面硬度が９０Ｈｓ以下である請求項
１に記載の電子部品の製造方法。2. The method of manufacturing an electronic component according to claim 1, wherein the surface hardness of the insulating granular material whose surface is covered with the insulating rubber or resin is 90 Hs or less.
外形における最小寸法の５倍以上、最大寸法の１０倍以
下である請求項１または請求項２に記載の電子部品の製
造方法。3. The method for manufacturing an electronic component according to claim 1, wherein the diameter of the insulating granular material is 5 times or more the minimum dimension and 10 times or less the maximum dimension in the outer shape of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001270768A JP3649174B2 (en) | 2001-09-06 | 2001-09-06 | Manufacturing method of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001270768A JP3649174B2 (en) | 2001-09-06 | 2001-09-06 | Manufacturing method of electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003073898A true JP2003073898A (en) | 2003-03-12 |
| JP3649174B2 JP3649174B2 (en) | 2005-05-18 |
Family
ID=19096380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001270768A Expired - Fee Related JP3649174B2 (en) | 2001-09-06 | 2001-09-06 | Manufacturing method of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3649174B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006045619A (en) * | 2004-08-04 | 2006-02-16 | Murata Mfg Co Ltd | Plating method |
-
2001
- 2001-09-06 JP JP2001270768A patent/JP3649174B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006045619A (en) * | 2004-08-04 | 2006-02-16 | Murata Mfg Co Ltd | Plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3649174B2 (en) | 2005-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7045050B2 (en) | Method for producing electroconductive particles | |
| CA2349156A1 (en) | Electroplating method using combination of vibrational flow in plating bath and plating current of pulse | |
| KR20100075938A (en) | Coated conductive powder and conductive adhesive using the same | |
| US7553401B2 (en) | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating | |
| EP1601822A1 (en) | Method of electroplating a workpiece having high-aspect ratio holes | |
| WO2012173245A1 (en) | Silver powder and method for producing same | |
| US7939171B2 (en) | Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit | |
| JP2003073898A (en) | Method for manufacturing electronic parts | |
| GB2259523A (en) | Electroplating miniature parts in bulk | |
| CN2441817Y (en) | Supersonic plating device | |
| JP6199145B2 (en) | Method for producing composite conductive particles | |
| JP4002638B2 (en) | Film forming method using powder coating material | |
| JPH0394078A (en) | Production of electrically conductive particles | |
| JP3966119B2 (en) | Manufacturing method of electronic parts | |
| Cobley et al. | The effect of ultrasound on the gold plating of silica nanoparticles for use in composite solders | |
| JP3694249B2 (en) | Fine particle plating method, conductive fine particles, and connection structure | |
| JP2003342621A (en) | Method for manufacturing copper powder and copper powder obtained thereby | |
| CN1210439C (en) | Method for mfg. electronic parts and said electronic parts | |
| JPH10147801A (en) | Surface treatment of dendritic copper powder | |
| JP4105633B2 (en) | Plating electrode and plating apparatus | |
| JP4725051B2 (en) | Plating method and plating apparatus | |
| JP3899722B2 (en) | Barrel plating method for electronic parts | |
| JP2010285663A (en) | Apparatus for producing metal-coated particle | |
| JPS5844758B2 (en) | Barrel plating method | |
| KR102339831B1 (en) | An apparatus of electrodeposition for manufacturing a multi-layer diamond electrodeposited wheel for grinding work and a method for manufacturing a multi-layer diamond electrodeposited wheel for grinding work using thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040119 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041022 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20041102 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041228 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20050125 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20050207 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 3649174 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090225 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090225 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100225 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110225 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110225 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120225 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130225 Year of fee payment: 8 |
|
| LAPS | Cancellation because of no payment of annual fees |