JP4105633B2 - Plating electrode and plating apparatus - Google Patents

Description

Technical field
The present invention relates to a plated electrode using a porous material. More specifically, the present invention relates to a plated electrode in which a porous material is formed using, for example, metal particles or resin particles, conductivity is imparted to at least the surface thereof, and electrode contact efficiency is improved by increasing a contact area with a plating solution. . The present invention also relates to a plating electrode using such a porous material as an electrode case.
Background art
For example, with respect to multilayer printed boards manufactured by plating, demands for higher multilayers, finer wire densities, smaller diameters, and lower costs have become particularly high in recent years. And in through hole plating (THP), which is one of the most important manufacturing processes, the following matters, for example, (1) plating thickness is uniform, and (2) high slinging power is required. (3) Pitless is required at a high level.
Further, even in general metal anti-corrosion plating, decorative plating, and the like, there is a strong demand for complicated shapes and cost reduction, and high-quality plating technology is required at low cost.
Conventionally, as a technique related to a plating electrode that has been used, for example, those shown in FIGS. 1 to 5 are known.
FIG. 1 is a view showing an outline of an insoluble net electrode. This electrode is obtained by suspending a net electrode 2 obtained by subjecting a metal net material to a touch-proof and conductive treatment to a support member 1 that also serves as a power supply. In electroplating, the larger the surface area of an electrode, the more current can flow at a lower voltage. That is, the larger the surface area that can come into contact with the plating solution, the more desirable the electrode that can supply electric current with high efficiency.
When the electrode is formed in a net shape as shown in FIG. 1, the contact area per unit volume with the plating solution is increased as compared with a plate-like electrode, so that it is used as one of highly efficient electrodes. In the plating apparatus using the net electrode 2 of FIG. 1, there is also a proposal for providing a circulating means for forcibly stirring the plating solution in order to further increase the electrode efficiency.
2 and 3 show a conventional example of a plating tank provided with the above circulating means. In the plating tank shown in FIG. 2, a material to be plated 4 to be plated is disposed between the net electrodes 5 and 5 in the plating solution, and the stirring flow of the plating solution is generated by the jet nozzle 7 while discharging air from the air nozzle 6. Wake up to do air bubbling. In the plating tank shown in FIG. 3, a stirring flow to the material to be plated 4 is caused by the jet nozzle 8 while discharging air from the air nozzle 6. As shown in FIG. 2 and FIG. 3, by forcibly stirring the plating solution, the chance of contact between the plating solution and the net electrode can be increased and the electrode efficiency can be improved.
FIG. 4 shows a plating electrode called a cell electrode with a built-in stirring nozzle. 4A shows a cross section in the longitudinal direction of the cell electrode, and FIG. 4B shows a cross section of this electrode. This cell electrode has a nozzle pipe 11 disposed in a housing 10, and a plating solution is jetted out from the nozzle pipe 11 to be stirred. The housing 10 has an arc shape, and has an electrode surface 12 formed so that the string portion allows the plating solution to pass therethrough. The electrode surface 12 is formed of the same net material as described above or a plate material on which a number of punch holes are formed. Even when this cell electrode is used, the plating solution can be forcibly stirred, so that the electrode efficiency can be improved. Although FIG. 4 shows the upper cell electrode, in an actual plating process, a pair of upper and lower cell electrodes are arranged so as to face the electrode surface, and a plating material is disposed between them to execute the plating process. Is done.
Further, FIG. 5 shows a conventional dissolution type electrode 15. The electrode 15 accommodates an anode ball 17 in which copper, gold, etc. are formed in a spherical shape in a non-dissolvable metal net 16, and the anode ball 17 is dissolved (ionized) to be plated on a material to be plated. Process.
However, the conventional plating electrodes described above have many problems as described below.
Since the net electrode shown in FIG. 1 is formed by subjecting a metal net material to corrosion resistance and conductive treatment, it is necessary to form the net material intervals (net eyes) large to some extent. Since each net surface functions as an electrode, the plating solution that does not contact the net surface and passes through the eyes of the net does not contribute to the plating process. As described above, although the net electrode has a larger contact area with the plating solution than the plate electrode, it is necessary to further improve the electrode efficiency as compared with the severe plating conditions required in recent years. However, since it is necessary to perform corrosion resistance and conductive processing as described above, there is a limit to reducing the interval between the nets, and there is also a limit to forming the net material itself narrowly. The surface area cannot be increased and there is a limit to improving the production efficiency. Further, there is a limit to improving the production efficiency even if a circulation means for circulating the plating solution is provided as described above.
For this reason, if a certain production amount is to be secured using the net electrode, the plating apparatus becomes larger and the lead time and plating time become longer. As a result, the problem that processing time becomes long arises.
Further, in the cell electrode in which the nozzle is provided in the housing shown in FIG. 4, the electrode itself is increased in size, and it is difficult to control the plating solution flow ejected from the nozzle, resulting in uneven stirring of the jet flow. The electrode surface 12 has the same problem as described above. Therefore, if it is intended to secure a certain production amount using the net electrode, the plating apparatus becomes large and the processing time becomes long.
Further, in the electrode using the electrode case shown in FIG. 5, a small anode ball or chip may protrude from the metal net eye. In this way, the small anode ball or the like that jumps out of the eyes of the net adheres to the material to be plated and induces the generation of pits or plating with a rough surface. Furthermore, there is a problem in that the movement of the plating solution inside the case is poor and the electrode efficiency is also deteriorated.
Therefore, the main object of the present invention is to provide an electrode with high electrode efficiency and capable of realizing uniform plating.
Disclosure of the invention
The present invention relates to a novel plating technique in which an electrode is configured using a porous member. As shown in FIGS. 1 and 4, the plating electrode itself is non-dissolvable, and is a non-dissolving type in which metal ions in the plating solution are plated on the material to be plated, and the electrode shown in FIG. 5. In addition, there is a melting type in which an anode ball housed in a case is melted and plated on a material to be plated.
As the non-dissolving type plating electrode, a plate-shaped one in which a non-dissolving material having conductivity at least on the surface is formed porous can be suitably used. Such a porous plate can be produced by heating and pressing a granular material. A desired porous material can be formed by appropriately adjusting the material used for the porous plate, heating conditions, pressurizing conditions, processing time, and the like.
As the granular material, for example, a corrosion-resistant metal material such as titanium, or a metal material having corrosion resistance and conductivity such as gold or platinum can be preferably used. A material produced by heating and pressing using such a metal material is generally called a sintered metal. Titanium is inferior in conductivity, but can be imparted with conductivity by applying a conductive plating such as copper, platinum or iridium on the surface thereof.
Resin particles can also be used as the granular material. In general, since a resin does not have conductivity, conductivity can be imparted by applying a conductive plating such as platinum or iridium to the surface of the resin.
When using titanium particles, resin particles, etc. that need to be plated on the surface to provide conductivity, apply a plating treatment after forming a porous material by heating and pressing. Alternatively, the particles may be plated in advance and then heated and pressurized to form a porous material.
As described above, the porous, non-dissolved and conductive plating electrode has a very large surface area per volume, so that the amount of current that can be flowed in proportion to the surface area can be increased, and the electrode has high electrode efficiency.
Further, by using materials having different particle diameters, it is possible to form a porous material having a relatively large gap and a porous material having a small gap. By adopting such a form, the plating process for the material to be plated can be adjusted. In particular, when irregularities or curved portions exist on the surface of the material to be plated, it is preferable to adjust the supply of the plating solution accordingly, so that this can be dealt with.
The non-soluble plating electrode may be used in the form of being immersed in the plating solution as it is. However, a plating solution pumping means for pumping the plating solution so as to pass through the porous portion of the electrode is added. As a result, the electrode efficiency can be further improved. For example, a hollow frame into which a plating solution is press-fitted is formed, and a form of a nozzle type plating electrode in which the porous electrode is disposed in a part of the frame can be used.
In the case of a dissolution type plating electrode, it is very effective to form the electrode case with the porous material. Since this electrode case has a very small gap compared to the conventional net material, the filtering ability is high. Therefore, it is possible to suppress a situation in which the anode ball that has been consumed and has become smaller jumps out. And if the plating solution which gave the pressure in such an electrode case is introduce | transduced, electrode efficiency can be improved further.
In addition, a form in which an outer case and an inner case are provided as an anode case for housing the anode ball, and the anode ball is disposed between them can be adopted. When at least one of the outer case and the inner case is formed of the aforementioned non-dissolving and conductive porous material, the chance of contact between the plating solution and the anode ball is improved while suppressing the situation where the anode ball jumps out. A soluble plating electrode can be formed. Also in such an anode case, the electrode efficiency can be further improved if the plating solution is pumped toward the inside.
Unlike the case of the conventional net material, the porous material has a small number of formed gaps (openings) and is uniform. Therefore, there is an unprecedented advantage that when the pressurized plating solution passes through the porous material, the plating solution can be ejected in a uniform state.
BEST MODE FOR CARRYING OUT THE INVENTION
The porous material used in the present invention can be produced, for example, by the process shown in FIG. 6 (I) to 6 (III) show an example in the case of producing a porous sintered metal. Metal particles having a desired particle diameter are prepared (I), and heated and pressurized (II). The metal particles soften when heated to a predetermined temperature, and have a property of adhering to each other when pressurized. Sintering is performed using this property. By sintering in this way, a porous metal plate as shown in (III) can be obtained. A metal porous plate having innumerable desired gaps can be produced by adjusting the metal particles to be used, the particle diameter, the heating temperature, the applied pressure, and the treatment time. In addition, when the particle diameter is selected from the range of 5 to 30 mm, a porous plate having a preferable gap for use as an electrode can be produced.
Since the metal particles generally have conductivity, the porous plate produced as shown in FIG. 6 can be used as an electrode as it is. As shown in FIG. 7, the metal porous plate is fixed under the conductive support member 11 which also serves as an electrode, whereby a plating electrode can be obtained. Since such an electrode has an extremely large area in contact with the plating solution, a high-efficiency electrode for plating can be obtained even if it is simply immersed in the plating solution. Innumerable gaps exist between the respective particle materials as shown in an enlarged view of a part of the porous plate 10 on the right side of FIG. Since the plating solution passes through this gap, it can be easily understood that the contact area is significantly widened.
Further, as shown in FIG. 8, when the metal porous plate 10 is employed on one side of a hollow frame, a nozzle-type plating electrode can be obtained. When the pressurized plating solution PL is poured into the frame, the plating solution is forced to pass through the gaps between the porous plates 10, so that the plating efficiency can be further improved.
Furthermore, the same material as the porous plate 10 can be processed into a nozzle for ejecting a plating solution as shown in FIG. The nozzle shown in FIG. 9 can be suitably used as a nozzle for plating solution stirring. The porous plate 10 can be formed into a desired shape such as a cylindrical shape as shown in FIG. 9A or a prism shape as shown in FIG. 9B. According to the nozzle formed in this way, as shown in FIGS. 9A and 9B, the plating solution PL introduced into the interior with pressure can be uniformly ejected outward.
The nozzle can be used as an electrode case that houses the anode ball. Unlike the conventional net-like electrode case, this case has a very small gap and thus has a high filtering function. Therefore, a situation in which the anode ball that has been consumed and reduced jumps out does not occur. Further, since the ions dissolved in the anode ball are uniformly ejected outward as shown in FIG. 9, plating on the material to be plated can be performed uniformly.
Hereinafter, a plurality of preferred embodiments of the electrode for plating of the present invention will be shown.
FIG. 10 is a view showing the nozzle type plating electrode of the first embodiment. FIG. 10A is an overall perspective view of the nozzle-type plating electrode 20, and FIG. 10B is a view showing a cross section at the center. The plating electrode 20 has the metal porous plate 10 described above fitted on one side surface of a frame 21 having a hollow rectangular parallelepiped shape. An upper portion of the frame 21 is provided with a conduit 22 for flowing the plating solution PL into the frame 21.
According to such a nozzle-type plating electrode 20, when a plating solution PL having a predetermined pressure is introduced into the frame 21, it can be ejected to the outside through the gap of the porous plate 10. At this time, since the porous plate 10 serving as an electrode has a large surface area per unit volume, the plating solution is guided outward while contacting a wide surface. Therefore, since sufficient electric power can be supplied to the plating solution, positive ions (+) can be reliably attached to the material to be plated. Further, at this time, stirring of the plating solution is performed simultaneously. Therefore, the deposition of plating can be accelerated, and a highly efficient plating electrode is obtained.
The depth HT and the width WT of the electrode shown in FIG. 10 may be appropriately designed so as to correspond to the material to be plated having a plate shape, a belt shape, or the like. Since such a plating electrode has a large surface area, the electrode efficiency is good, and a plating having a uniform thickness can be obtained even when the plating process is performed in the state of being close to the material to be plated. Furthermore, since the plating solution can be sprayed toward the entire surface of the material to be plated, the plating solution is sufficiently agitated to prevent adhesion to the plating surface even when there are floating substances in the plating tank. A plated surface without pits can be obtained.
FIG. 11 is a diagram showing a nozzle-type plating electrode of the second embodiment related to the first embodiment. 11A is an overall perspective view of the nozzle-type plating electrode 25, and FIG. 11B is a view showing a cross section at the center.
This embodiment is a modification of the electrode of the first embodiment, and is a plating electrode in which the metal porous plates 10-1 to 10-4 are fitted on all four side surfaces of a rectangular parallelepiped frame. In the electrode of the present embodiment, since the porous plate 10 is on all sides, the area in contact with the plating solution is further increased. Therefore, it becomes the electrode for plating which improved electrode efficiency more. Furthermore, since the plating solution is sprayed uniformly in all directions, stirring of the plating solution in the plating tank can be promoted. Here, although the example which employ | adopts the said metal porous plate 10 for all four side surfaces is shown, it is good also considering the 2 surfaces which oppose, 2 adjacent surfaces, or 3 surfaces as the porous plate 10 as needed. .
In addition, in FIG. 11 shown about this 2nd Example, and the figure of the Example further shown below, the same code | symbol is attached | subjected to the site | part similar to the said 1st Example, and the overlapping description is abbreviate | omitted.
FIG. 12 is also a view showing the nozzle type plating electrode of the third embodiment related to the first embodiment. 12A is an overall perspective view of the nozzle-type plating electrode 30, and FIG. 12B is a view showing a cross section at the center.
This embodiment is also a modification of the electrode of the first embodiment, and is a plated electrode in which the porous formation state of the metal porous plate 10 provided on one surface of the rectangular parallelepiped frame is made dense. The porous plate 10 of the present embodiment is formed in a state in which a porous material 10Lo that is sparse at the center and a porous material 10Hi that is dense at the periphery coexist. Such a porous plate 10 can be produced, for example, by the steps shown in FIGS. An example of manufacturing a porous plate having a density is described with reference to these drawings. As shown in FIG. 13, the frame mold 102 is set on the flat lower mold 101. Next, as shown in FIG. 14, an intermediate jig 103 for separating a metal material having a large particle diameter and a metal material having a small particle diameter is set in the frame mold 102. The middle jig 103 shown in FIG. 14 has a ring shape, but the shape may be changed as necessary.
Then, as shown in FIGS. 15 and 16, granular metals having different particle diameters are loaded inside and outside the middle jig 103. In the example shown here, corresponding to FIG. 12 described above, a metal material 105 having a small particle size is loaded on the outside of the inner jig 103 to form a dense porous material, Is loaded with a metal material 106 having a large particle size in order to form a sparse porous material. Of course, if necessary, the metal material 106 having a large particle diameter may be on the outside, and the metal material 105 having a small particle diameter may be on the inside. Thereafter, as shown in FIG. 17, when the middle jig 103 is taken out, the metal materials 105 and 106 can be brought into contact with each other.
Then, as shown in FIG. 18, the upper mold 104 for pushing the materials 105 and 106 into the frame mold 103 is placed. In this state, as shown in FIG. 19, a pressurizing process is performed while heating in the heating furnace 110. After that, as shown in FIG. 20, if the lower mold 101, the frame mold 102, and the upper frame 104 are removed, the porous material 10Lo that is in close contact with each other and sparse in the center, and the dense state around the periphery The metal porous plate 10 in which the porous material 10Hi coexists can be obtained.
The plating electrode of this embodiment can be adjusted according to the shape of the material to be plated and the like because the state of the plating solution sprayed toward the material to be plated can be adjusted. Therefore, uniform plating can be applied to a material to be plated having a complicated shape while improving electrode efficiency.
The plating electrode 30 shown in FIG. 12 corresponds to a modification of the first embodiment, and shows an example in which the porous plate 10 having only one surface is dense. However, the present invention is not limited to this, and a porous plate 10 having coarse and dense four side surfaces may be used as a modification of the second embodiment. Moreover, you may use the porous plate 10 which has a density only in the selected surface among four side surfaces.
Further, in the porous plate 10 shown in FIG. 12, the porous material 10Lo in a sparse state at the center and the porous material 10Hi in a dense state at the periphery are formed side by side. Not limited to this, the porous material 10Hi in a dense state in the central portion and the porous material 10Lo in a dense state in the peripheral portion may be formed side by side. In short, the sparse and dense arrangement of the porous material 10 may be appropriately changed in order to perform desired plating on the material to be plated.
Further, FIGS. 21 to 23 show a plurality of examples when the above-described porous plate 10 is formed on an actual plating electrode.
21A has the same configuration as the electrode shown in FIG. 10 of the first embodiment. The electrode frame 21 is conductive and is fixed to an electrode 23 that also serves as a support member. Therefore, it is used by being immersed in a plating bath while being supported by the member 23. In addition, although the plating electrode of FIG. 21 (A) has illustrated what provided the two pipe lines 22 into which the plating liquid PL of predetermined pressure was introduced, it is good also as three or more.
FIG. 21B shows a plating electrode in which the porous plate 10 is formed into a ring shape, and the whole is cylindrical. Although FIG. 11 in which the porous plate 10 is disposed on the four surfaces of the rectangular parallelepiped shape is shown previously, the plating solution can be ejected uniformly in almost all directions when the cylindrical plate is formed in this way. The electrode shown in FIG. 21B is also used by being immersed in a plating bath while being supported by the member 23.
FIG. 22 is a view showing a plated electrode improved by applying the present invention to the cell electrode shown in FIG. 22A is a front view of the cell electrode 50, and FIG. 22B is a diagram showing a cross section. The metal porous plate 10 described above is employed on the electrode surface in the ejection portion. According to this cell electrode, since the electrode surface is made of a porous material, the plating solution can be ejected more uniformly than the conventional cell electrode shown in FIG.
Further, the structure shown in FIG. 23A has a structure having a coarse and dense structure, like the electrode shown in FIG. 12 of the third embodiment. The electrode frame 21 is conductive and is fixed to an electrode 23 that also serves as a support member. Therefore, it is used by being immersed in a plating bath while being supported by the member 23. FIG. 23B illustrates a case where the porous plate 10 having a density is formed in a ring shape. These electrodes shown in FIG. 23 are also used by being immersed in a plating bath while being supported by the member 23.
FIG. 24 is a diagram showing an example of the arrangement of plating electrodes in the plating layer. In FIG. 24, reference symbol AP indicates an electrode for plating, and EP indicates a material to be plated. As is apparent from the above, the porous plate 10 functions as an electrode having a large area and also functions as a port for spraying the plating solution outward. And the number of ejection surfaces can also be adjusted as needed, for example like the structure shown in FIG.
Therefore, when the plating electrode of the above-described embodiment is used, when the plating electrode AP is arranged as shown in FIG. 24, the number and arrangement of the porous plates 10 provided on the electrode are adjusted to effectively agitate the plating solution. It can be configured to be able to. Moreover, each electrode can efficiently form a plating having a uniform thickness and no pits on the material EP to be plated.
The plating electrode according to the embodiment described above is insoluble. FIG. 25 shows an example of a plating apparatus provided with a nozzle-type non-dissolvable plating electrode that introduces a plating solution into the interior at a predetermined pressure and ejects the plating solution. In FIG. 25, in the plating apparatus 60, the plating tank 61 is filled with a plating solution containing cations. In the center of the plating tank 60, a material to be plated AP to be plated is disposed. Nozzle-type plating electrodes are disposed so as to face both surfaces of the material to be plated AP. As the plating electrode, the plating electrode 10 provided with a metal porous plate on one surface shown in FIG. 10 is adopted.
The plating solution overflowed from the upper part of the plating tank 61 enters the cation supply tank 65 through the return pipe 63, and for example, the copper ions are rich. The plating solution is pumped toward the inside of the plating electrode 10 by a pump 67 as a plating solution pumping means.
According to the above plating apparatus, a plating process can be performed with high efficiency, and a plating surface having a uniform thickness can be formed on the material to be plated AP.
Hereinafter, a dissolution type plating electrode using an electrode case will be described as a fourth embodiment of the present invention. In the first to third embodiments, the configuration examples shown in FIGS. 10 to 12 are shown as examples of insoluble electrodes. However, these electrodes can also be used as an electrode case. That is, in the previous embodiment, the cation was eluted in the plating solution. However, if these are treated as electrode cases and an anode ball such as copper or gold that elutes the cation is accommodated in this case, the plating solution is dissolved as it is. Electrode. The porous material used for the electrode case is preferably prepared using a material selected from a particle diameter range of 0.1 to 30 mm.
Further, FIGS. 26 and 27 show a soluble plating electrode using the improved electrode case according to the fifth embodiment. FIG. 26 shows a double structure in which an inner case is provided inside an outer case. 26A shows a schematic configuration of an electrode 70 having a cylindrical outer case 71 and FIG. 26B shows a schematic configuration of an electrode 80 having a rectangular parallelepiped shape.
Each of the electrodes shown in FIG. 26 includes inner cases 73 and 83, and an anode ball AN is accommodated in a space between the inner case and the outer case.
FIG. 27 is a view showing a cross section of the cylindrical electrode 70 shown in FIG. The cross section of the outer case 71 rectangular electrode 80 shown in FIG.
Both the outer case 71 and the inner case 73 are made of a material that can transmit the plating solution. Preferably, the outer case 71 and the inner case 73 are formed of the porous material described above.
And since either one of the outer case 71 and the inner case 73 has conductivity, it can function as an electrode case. Therefore, for example, if the outer case 71 is the metallic porous plate described above, the inner case 73 may be a porous material made of resin particles that do not have conductivity.
If the plating solution PL having a predetermined pressure is introduced into the inner case 73, the plating solution reaches deep inside and flows out uniformly in all directions. Therefore, since the plating solution that efficiently contacts the anode ball AN, such as copper (Cu), is ejected from the outer case 71, the plating solution sufficiently containing cations can be sent out.
When this electrode is used, the plating solution can be sent between the anode balls, which has been difficult in the prior art, so that the electrode efficiency can be improved. Moreover, the anode ball can be consumed to the end without causing a situation in which the anode ball that has become smaller as in the prior art is popped out, so that the cost can be reduced.
The melting type plating electrode using the electrode case shown in FIG. 26 can also be configured such that the plating solution is ejected toward the entire surface of the material to be plated, so that the plating solution is sufficiently agitated and floating matter is left in the plating tank. Even if it exists, it is possible to suppress the adhesion to the plating surface and obtain a plated surface without pits.
Although the case where the sintered metal porous plate 10 is used has been described in the above embodiment, a porous plate in which a porous material is formed using resin particles and the surface thereof is subjected to conductive treatment can be similarly employed. 13 to 20 described above show the steps of forming the porous plate 10 having a coarse and dense shape using metal particles having different particle diameters, but the porous plate having the same coarse and dense shape when using resin particles. Can be produced. However, in order to impart conductivity to the surface of the resin particles, it is necessary to heat and heat the resin particles that have been previously plated with metal, or to form a metal plate on the surface after forming into a porous plate.
Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. Is possible.
As is apparent from the above detailed description, according to the present invention, by using a porous material having conductivity as a non-dissolving type plating electrode, improvement in electrode efficiency and stirring of the plating solution can be realized at the same time. Uniform plating can be performed efficiently.
Further, when such a porous material is used as an electrode case, it is possible to constitute a dissolution type electrode capable of efficiently performing uniform plating while preventing the anode ball from jumping out.
[Brief description of the drawings]
FIG. 1 is a diagram showing an outline of a conventional insoluble net electrode.
FIG. 2 is a view showing a conventional example of a plating tank provided with a circulation means.
FIG. 3 is a view showing another conventional example of a plating tank provided with a circulation means.
FIG. 4 is a diagram showing a conventional cell electrode.
FIG. 5 is a view showing a conventional dissolution type electrode.
FIG. 6 is a diagram showing an example of manufacturing a porous sintered metal.
FIG. 7 is a diagram showing how a metal porous plate is formed on a plating electrode.
FIG. 8 is a diagram showing a state in which a metal porous plate is applied to a nozzle-type plating electrode.
FIG. 9 is a diagram showing a case in which a metal porous plate is configured as a nozzle for stirring a plating solution.
FIG. 10 is a view showing the nozzle-type plating electrode of the first embodiment.
FIG. 11 is a view showing a nozzle-type plating electrode of the second embodiment.
FIG. 12 is a view showing the nozzle-type plating electrode of the third embodiment.
13 to 20 are views showing an example of a process for producing a porous plate having a density according to the third embodiment.
FIG. 21 is a diagram showing an example in which a porous plate is formed on an actual plating electrode.
FIG. 22 is a diagram showing an example of a plating electrode improved by applying the present invention to a cell electrode.
FIG. 23 is a view showing an example in which a porous plate having coarse and dense is formed on an actual plating electrode.
FIG. 24 is a view showing an arrangement example of the plating electrode of the present invention in the plating layer.
FIG. 25 is a view showing an example of a plating apparatus provided with a nozzle-type insoluble plating electrode.
FIG. 26 is a diagram showing a soluble plating electrode using the double-structure electrode case of the fifth embodiment.
FIG. 27 is a view showing a cross section of the cylindrical electrode shown in FIG.

Claims (2)

At least the surface formed by heating and pressurizing so that a part with a sparse state and a part with a dense gap coexist using a granular material having a particle diameter of 5 to 30 mm. An electrode case formed of a porous material made of a sintered metal having conductivity;
A plating electrode including an anode ball housed in the electrode case; and a plating solution pressure feeding means for feeding a plating solution into the electrode case;
Plating equipment with A plating electrode having an anode case for housing an anode ball between an inner case and an outer case through which a plating solution can pass,
Using at least one of the inner case and the outer case as a granular material having a particle size of 5 to 30 mm and having a different particle size, so that a portion where the state of the gap is sparse and a portion where the gap is dense coexist, An electrode for plating formed of a porous material made of sintered metal having conductivity at least on the surface formed by heating and pressurizing; and a plating solution pumping means for pumping a plating solution into the inner case;
Plating equipment with

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