CN109898130B - Copper ion supplementing device and method for electroplating - Google Patents
Copper ion supplementing device and method for electroplating Download PDFInfo
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- CN109898130B CN109898130B CN201910351823.1A CN201910351823A CN109898130B CN 109898130 B CN109898130 B CN 109898130B CN 201910351823 A CN201910351823 A CN 201910351823A CN 109898130 B CN109898130 B CN 109898130B
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- Prior art keywords
- electroplating
- copper
- liquid
- filter layer
- shell
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- 238000009713 electroplating Methods 0.000 title claims abstract description 74
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910001431 copper ion Inorganic materials 0.000 title claims abstract description 46
- 230000001502 supplementing effect Effects 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052802 copper Inorganic materials 0.000 claims abstract description 58
- 239000010949 copper Substances 0.000 claims abstract description 58
- 239000002245 particle Substances 0.000 claims abstract description 56
- 238000001914 filtration Methods 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- -1 polypropylene Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 238000004090 dissolution Methods 0.000 abstract description 4
- 229910021645 metal ion Inorganic materials 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 6
- 239000013589 supplement Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000010953 base metal Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 241001424392 Lucia limbaria Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000009145 copper supplementation Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009469 supplementation Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention relates to a copper ion supplementing device and a copper ion supplementing method for electroplating, wherein the device comprises a shell, a filter layer is arranged in the shell, a placing cavity is arranged on one side of the filter layer in the shell, a liquid outlet pipeline is arranged on the other side of the filter layer in the shell, a liquid inlet pipe penetrates through the filter layer in the shell, and a liquid outlet of the liquid inlet pipe is arranged in the placing cavity. The device provided by the invention is provided with the filtering structure, so that fine copper particles can be prevented from flowing out along with the electroplating liquid, the interior of the device can be filled with the copper particles with small particle size for supplementing copper ions into the electroplating liquid, the specific surface area of the copper particles is greatly increased, the same copper dissolution rate can be realized by using a smaller amount of copper balls, and the cost of early wire opening can be greatly reduced. The device is also suitable for supplementing metal ions in other metal electroplating processes, and has good economic benefit and application prospect.
Description
Technical Field
The invention relates to the field of electroplating, in particular to a copper ion supplementing device and a copper ion supplementing method for electroplating.
Background
In the electroplating process, the plated base metal is taken as a cathode in the electroplating solution containing the pre-plated metal, and cations of the pre-plated metal in the electroplating solution are deposited on the surface of the base metal through the electrolysis, so that a plating layer is formed. The surface of the formed coating is beautiful, and the coating can also strengthen the corrosion resistance, increase the hardness, prevent abrasion and improve the conductivity, the smoothness and the heat resistance of the base metal, so that the coating has been widely used in recent years.
The main components of the electroplating solution are main salts (providing ions of electrodeposited metal), conductive salts (increasing the conductivity of the solution), anode active agents (promoting anodic dissolution and improving anodic current density), buffering agents (regulating and controlling the pH value of the solution) and partial additives (improving the performance of the plating layer and the effect of electroplating quality). As electroplating proceeds, ions in the main salt that provide the electrodeposited metal are continuously consumed, and the current density of the electroplating solution and the electroplating effect are reduced, thereby affecting the electroplating effect. Therefore, the plating solution needs to be timely supplemented with ions to be plated.
In the PCB copper electroplating process, copper ions are supplemented in various modes, for example, phosphor copper balls can be filled into a titanium basket to serve as a soluble anode, and along with the electroplating, the phosphor copper balls serving as the anode gradually dissolve out the copper ions, so that copper supplementation is realized. The method is the most traditional method for supplementing copper ions, has wide application, but the phosphorus content in the electroplating solution is increased due to the use of the phosphorus-containing copper balls, so that the pollution of the electroplating solution is easy to cause, and the electroplating effect is influenced. Phosphorus is harmful to human body and environment, so that higher requirements are put on the discharge of electroplating liquid, and the production should be avoided as much as possible. In addition, copper ions can be supplemented by adding copper oxide powder, but the copper oxide powder is difficult to dissolve, and when the copper oxide powder is insufficiently dissolved, solid particles can influence the electroplating effect, so that the method is also difficult to effectively popularize.
Another way to effectively replenish copper ions is: pure copper balls are added to the plating solution, and high-valence oxidative metal ions added to the plating solution are utilized. For example, ferric iron or high-valence vanadium is used for dissolving pure copper balls to realize the supplementation of copper ions, the defects of the ferric iron and the high-valence vanadium are avoided, and meanwhile, low-valence metal ions can be oxidized on an anode and become high-valence again. However, the copper ions are supplemented in the mode, a large amount of copper balls are needed in the initial stage of wire opening, the consumption can reach several tons, the value is hundreds of thousands yuan, the early-stage investment of wire opening is increased, and the cost control of enterprises is not facilitated.
Disclosure of Invention
In view of the problems existing in the prior art, the invention aims to provide a copper ion supplementing device and a copper ion supplementing method for electroplating, which are provided with a filtering structure, so that fine copper particles can be prevented from flowing out along with electroplating liquid, small-particle-size copper particles can be filled in the device for supplementing copper ions into the electroplating liquid, the specific surface area of the copper particles is greatly increased, the same copper dissolving rate can be realized by using a smaller amount of copper balls, the early-stage wire opening cost can be greatly reduced, and good economic benefits and application prospects are realized.
To achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a copper ion supplementing device for electroplating, which comprises a shell, wherein a filter layer is arranged in the shell, a placing cavity is arranged on one side of the filter layer in the shell, a liquid outlet pipeline is arranged on the other side of the filter layer, a liquid inlet pipe penetrates through the filter layer in the shell, and a liquid outlet of the liquid inlet pipe is arranged in the placing cavity.
Preferably, the liquid outlet pipeline is connected with a filter, and a filter column is arranged in the filter and is used for carrying out secondary filtration on the electroplating liquid.
Preferably, the filter layer is a fibrous filter layer, and more preferably polypropylene fibers (PP cotton) are entangled.
Preferably, the liquid inlet pipe is located on the central axis of the shell.
In a second aspect, the present invention provides a copper ion supplementing method for electroplating, which adopts the device in the first aspect to supplement copper ions, specifically comprising: and (3) stacking copper particles in the placing cavity, then injecting electroplating liquid into the placing cavity through a liquid inlet pipe, supplementing copper ions through the gap flow of the electroplating liquid among the copper particles, filtering by a filter layer, and flowing out of a liquid outlet pipeline.
Preferably, the plating solution flows out of the liquid outlet pipe and enters the filter, and is subjected to secondary filtration by using a filter column therein.
Preferably, the particle size of the copper particles piled in the placing cavity is less than or equal to 7mm, and preferably 3-5mm.
As an optimal technical scheme, the method for supplementing copper ions for electroplating can be as follows: copper particles with the particle size less than or equal to 7mm are piled up in the placing cavity, then electroplating liquid is injected into the placing cavity through the liquid inlet pipe, copper ions are supplemented by the flowing of gaps among the copper particles, the copper ions are filtered by the filter layer and then flow out of the liquid outlet pipe, the copper particles enter the filter for secondary filtration, and then enter the electroplating device for electroplating.
Compared with the prior art, the invention has at least the following beneficial effects:
(1) The device provided by the invention can be internally filled with copper particles with small particle size (less than or equal to 7 mm), and the specific surface area of the copper particles is greatly increased, so that the same copper dissolution rate can be realized by using less copper balls, and the early-stage wire opening cost can be greatly reduced. The device is internally provided with the filtering structure, so that the resource waste and the adverse effect on the subsequent electroplating process caused by the fact that small-particle-size copper particles are brought out of the electroplating solution can be effectively avoided in the process of supplementing copper ions.
(2) Besides copper electroplating, the device and the method provided by the invention are also suitable for supplementing metal ions in other metal electroplating processes, such as nickel electroplating and the like, and have good economic benefit and wide application prospect.
Drawings
FIG. 1 is a schematic view showing the structure of a copper ion replenishment apparatus for plating provided in embodiment 1 of the present invention;
in the figure: 1-shell, 2-liquid inlet pipe, 3-filter layer, 4-placing cavity, 5-filter and 6-filter column.
The present invention will be described in further detail below. The following examples are merely illustrative of the present invention and are not intended to represent or limit the scope of the invention as defined in the claims.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
The invention provides a copper ion supplementing device for electroplating in a specific embodiment part, which comprises a shell, wherein a filter layer is arranged in the shell, a placing cavity is arranged on one side of the filter layer in the shell, a liquid outlet pipeline is arranged on the other side of the filter layer in the shell, a liquid inlet pipe penetrates through the filter layer in the shell, and a liquid outlet of the liquid inlet pipe is arranged in the placing cavity.
The placing cavity is used for stacking copper particles so as to timely supplement copper ions into the electroplating solution.
The filter layer is used for filtering the electroplating liquid after supplementing copper ions, so that the full filtration of fine copper particles (the particle size is less than or equal to 7 mm) can be realized, and the copper particles are prevented from entering and being carried out by the electroplating liquid.
The feed liquor pipe runs through the filter layer setting, and the liquid outlet is located places the intracavity for to place the plating solution of copper ion to be supplemented in the chamber, wherein, the liquid outlet of feed liquor pipe is preferably close to the bottom of casing, is favorable to plating solution and the abundant contact of copper particle.
Preferably, a secondary filter device is arranged outside the supplementing device, and the secondary filter device is a filter and is connected with a liquid outlet pipeline of the supplementing device. The filter is internally provided with a filtering column which is used for carrying out secondary filtration on the electroplating liquid filtered by the filtering layer so as to completely remove copper particles in the electroplating liquid and prevent tiny copper particles from entering the electroplating bath.
Preferably, the filter layer is a fiber filter layer, preferably formed by winding polypropylene fibers, and can realize sufficient filtration of fine copper particles (the particle size is less than or equal to 7 mm) so as to prevent the copper particles from entering and being carried out by the electroplating solution.
Preferably, the liquid inlet pipe is positioned on the central axis of the shell, so that the flow of the electroplating liquid in the copper particles is more uniform, the excessive consumption of local copper particles is effectively avoided, and the utilization rate of the copper particles in the placing cavity and the supplementing rate of copper ions in the electroplating liquid are improved.
The invention does not limit the size of each component specifically, and the components are reasonably arranged according to actual production conditions. Illustratively, the diameter of the inlet tube may be 30-100mm, the outer diameter of the housing may be 100-300mm, and the height of the housing may be 800-1200mm, but is not limited thereto.
The invention also provides a copper ion supplementing method for electroplating, which adopts the device to supplement copper ions to the electroplating solution, and comprises the following specific operations: and (3) stacking copper particles in the placing cavity, then injecting electroplating liquid into the placing cavity through a liquid inlet pipe, supplementing copper ions through the gap flow of the electroplating liquid among the copper particles, filtering by a filter layer, and flowing out of a liquid outlet pipeline.
Preferably, the copper particles used have a particle size of 7mm or less, for example, 1mm, 2mm, 3mm, 4mm, 5mm, 6mm or 7mm, etc. Compared with copper balls with larger diameters, the copper particles with the particle size range have larger specific surface area, so that the same copper dissolution rate can be realized by using less copper particles, and the application cost is reduced.
In the process of supplementing copper ions to the electroplating solution, when copper particles are too large, the investment in the initial stage of opening is increased, so that the cost control is not facilitated; and too small copper particles increase the difficulty of filtration, the copper particles easily pass through the filter layer along with the electroplating liquid to enter the electroplating device, and the flowing resistance of the electroplating liquid is increased. Therefore, the particle diameter of the copper particles is preferably 3 to 5mm.
Preferably, the filling thickness of the copper particles in the placing cavity is 400-700mm, preferably 500-600mm, but is not limited to the above. The actual filling thickness of the copper ion filling material is specifically adjusted according to the height of a placing cavity in the device and the supplementing amount of the copper ion in the production process.
For a better illustration of the present invention, which is convenient for understanding the technical solution of the present invention, exemplary but non-limiting examples of the present invention are as follows:
example 1
The embodiment provides a copper ion supplementing device for electroplating, as shown in fig. 1, the device comprises a shell 1, a filter layer 3 is arranged in the shell 1, a placing cavity 4 is arranged on one side of the filter layer 3 in the shell 1, a liquid outlet pipeline is arranged on the other side of the filter layer 3, a liquid inlet pipe 2 is arranged in the shell in a penetrating way through the filter layer 3, the liquid inlet pipe 2 is arranged on the central axis of the shell 1 in a penetrating way through the filter layer 3, and the liquid outlet is arranged in the placing cavity 4.
The filter layer 3 is a fiber filter layer formed by winding polypropylene fibers.
The embodiment is also provided with a filter 5 connected with the liquid outlet pipeline, and a filter column 6 is arranged in the filter 5.
Example 2
The embodiment provides a copper ion supplementing method for electroplating, which adopts the device provided in the embodiment 1 to supplement copper ions, and specifically comprises the following steps: copper particles with the particle size less than or equal to 7mm are piled up in the placing cavity 4, then electroplating liquid is injected into the placing cavity 4 through the liquid inlet pipe 2, copper ions are supplemented by the flowing of gaps among the copper particles, and the electroplating liquid flows out of the liquid outlet pipe after being filtered by the filter layer 3.
The electroplating solution flows out of the liquid outlet pipeline, enters the filter 5, is subjected to secondary filtration by the filter column 6, and then enters the electroplating device for electroplating.
The applicant states that the detailed structural features of the present invention are described by the above embodiments, but the present invention is not limited to the above detailed structural features, i.e. it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be apparent to those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope of the present invention and the scope of the disclosure.
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the scope of the technical concept of the present invention, and all the simple modifications belong to the protection scope of the present invention.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Moreover, any combination of the various embodiments of the invention can be made without departing from the spirit of the invention, which should also be considered as disclosed herein.
Claims (7)
1. The copper ion supplementing device for electroplating is characterized by comprising a shell, wherein a filter layer is arranged in the shell, a placing cavity is arranged on one side of the filter layer in the shell, a liquid outlet pipeline is arranged on the other side of the filter layer, copper particles are piled in the placing cavity, a liquid inlet pipe penetrates through the filter layer in the shell, and a liquid outlet of the liquid inlet pipe is arranged in the placing cavity;
the liquid outlet of the liquid inlet pipe is close to the bottom of the shell;
the filter layer is a polypropylene fiber filter layer;
the grain diameter of the copper grains piled up in the placing cavity is 3-5mm.
2. The apparatus of claim 1, wherein the outlet conduit is connected to a filter.
3. The apparatus of claim 2, wherein a filter column is disposed within the filter.
4. The device of claim 1, wherein the inlet tube is located on a central axis of the housing.
5. A method for supplementing copper ions for electroplating, characterized in that the device according to any one of claims 1 to 4 is used for supplementing copper ions, in particular: and (3) stacking copper particles in the placing cavity, then injecting electroplating liquid into the placing cavity through a liquid inlet pipe, supplementing copper ions through the gap flow of the electroplating liquid among the copper particles, filtering by a filter layer, and flowing out of a liquid outlet pipeline.
6. The method of claim 5, wherein the plating solution flows out of the outlet pipe and then into the filter for secondary filtration.
7. The method according to claim 5, wherein the method is: copper particles with the particle size of 3-5mm are piled up in the placing cavity, then electroplating liquid is injected into the placing cavity through the liquid inlet pipe, copper ions are supplemented by the flowing of gaps among the copper particles, the electroplating liquid flows out of the liquid outlet pipe after being filtered by the filter layer, and the copper particles enter the filter for secondary filtration and then enter the electroplating device for electroplating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910351823.1A CN109898130B (en) | 2019-04-28 | 2019-04-28 | Copper ion supplementing device and method for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910351823.1A CN109898130B (en) | 2019-04-28 | 2019-04-28 | Copper ion supplementing device and method for electroplating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109898130A CN109898130A (en) | 2019-06-18 |
| CN109898130B true CN109898130B (en) | 2024-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910351823.1A Active CN109898130B (en) | 2019-04-28 | 2019-04-28 | Copper ion supplementing device and method for electroplating |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5997712A (en) * | 1998-03-30 | 1999-12-07 | Cutek Research, Inc. | Copper replenishment technique for precision copper plating system |
| JP2003166100A (en) * | 2001-09-21 | 2003-06-13 | Tsurumi Soda Co Ltd | Copper powder used for copper plating, and method for using copper powder |
| CN202028271U (en) * | 2011-04-20 | 2011-11-09 | 东强（连州）铜箔有限公司 | Electrolyte filtering device |
| JP2014173179A (en) * | 2013-03-12 | 2014-09-22 | Mitsubishi Materials Corp | Copper grains for plating |
| CN104846422A (en) * | 2015-05-22 | 2015-08-19 | 深圳崇达多层线路板有限公司 | Electro-coppering device |
| CN210104118U (en) * | 2019-04-28 | 2020-02-21 | 广东天承科技有限公司 | Copper ion supplementing device for electroplating |
-
2019
- 2019-04-28 CN CN201910351823.1A patent/CN109898130B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5997712A (en) * | 1998-03-30 | 1999-12-07 | Cutek Research, Inc. | Copper replenishment technique for precision copper plating system |
| JP2003166100A (en) * | 2001-09-21 | 2003-06-13 | Tsurumi Soda Co Ltd | Copper powder used for copper plating, and method for using copper powder |
| CN202028271U (en) * | 2011-04-20 | 2011-11-09 | 东强（连州）铜箔有限公司 | Electrolyte filtering device |
| JP2014173179A (en) * | 2013-03-12 | 2014-09-22 | Mitsubishi Materials Corp | Copper grains for plating |
| CN104846422A (en) * | 2015-05-22 | 2015-08-19 | 深圳崇达多层线路板有限公司 | Electro-coppering device |
| CN210104118U (en) * | 2019-04-28 | 2020-02-21 | 广东天承科技有限公司 | Copper ion supplementing device for electroplating |
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| Publication number | Publication date |
|---|---|
| CN109898130A (en) | 2019-06-18 |
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Address after: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Applicant after: Guangdong Tiancheng Technology Co.,Ltd. Address before: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Applicant before: GUANGZHOU SKYCHEM TECHNOLOGIES Ltd. |
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