JP2010285663A - Apparatus for producing metal-coated particle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for producing metal-coated particles each comprising a substrate particle having conductivity on the surface thereof and a metal-coated layer coating the surface of the substrate particle, which can produce metal-coated particles each having a metal-coated layer having a uniform thickness and few defects. <P>SOLUTION: The apparatus in used for producing metal-coated particles each comprising a substrate particle having conductivity on the surface thereof and a metal-coated layer coating the surface of the substrate particle, and includes a container for forming a path which can receive a particle group including many substrate particles and a plating solution for forming the metal-coated layer; a flow part for flowing the particle group through the path in one direction while maintaining the contact between the particles included in the particle group; a first electrode arranged so as to be conductive to the particle group flowing through the path; and a stirring member which is arranged in the state upwardly projected from the bottom of the path and crosses with the particle group flowing through the path. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an apparatus for producing metal-coated particles having substrate particles having conductivity on the surface and a metal coating layer coated on the surfaces of the substrate particles.

  An example of the metal-coated particles is a Cu core ball having a core ball mainly composed of Cu and a solder coating layer coated on the surface thereof. In order to clarify the problems of the prior art, a technique for producing metal-coated particles will be described using a Cu core ball as an example, but the present invention is not limited to a Cu core ball.

  In recent semiconductor packages such as BGA (Ball Grid Array) and CSP (Chip Scale Package) where high-density mounting is progressing due to multi-pitch and narrow pitch, small-diameter Cu core balls are applied as bumps for input / output terminals. . Since the Cu core ball does not melt during reflow, it can maintain a certain distance between the semiconductor element and the substrate, and ensure connection reliability against thermal cycle loads caused by starting and stopping of the semiconductor element. Can do.

  As a Cu core ball manufacturing technique, a barrel electroplating method is known in which a core ball is housed in a barrel having a large number of openings through which a plating solution can flow, and the barrel is placed in a plating bath and rotated to coat the solder. . However, particularly when manufacturing a small-diameter Cu core ball having a diameter of 500 μm or less, the core balls aggregate in the barrel, and the core ball is not sufficiently stirred by the rolling of the core ball as the barrel rotates. The distribution of the plating solution to the core ball surface becomes non-uniform. As a result, the thickness of the solder coating layer is partially non-uniform, resulting in a problem that the yield is reduced.

  An example of a technique for solving the problem of the barrel type electroplating method is described in Patent Document 1. In Patent Document 1, in order to obtain a sufficient and uniform plating layer in a short time, “the object to be plated is placed between the lower surface of the outer peripheral portion of the bottom-opened bowl-shaped resin dome with the upper end open and the upper surface of the outer peripheral portion of the resin bottom plate. A contact ring that is pressed during rotation and a porous ring through which the treatment liquid circulates are integrally joined to form a cell, and the cell is supported on the lower surface of the central portion of the conductive rotary plate that supports the cell so that it cannot rotate relative to the contact ring. `` Rotary plating device for small items, fixing the upper end of a vertical conductive drive shaft, pressing a contact brush on the shaft and connecting it to the negative pole, placing an anode basket in the dome, and covering the cell '' Is described. According to the rotary plating apparatus having such a configuration, the object to be plated accommodated in the cell is forcibly pressed against the contact ring by the action of the centrifugal force generated by the rotation of the cell, and the rotation and stop or deceleration of the cell. By repeating the above, it is described that the mixture is uniformly mixed, the plating solution on the surface of the object to be plated is renewed actively, and a plating layer having a uniform thickness can be formed.

  However, the rotary plating apparatus of Patent Document 1 has a problem in terms of efficiency in industrial production. That is, this rotary plating apparatus needs to repeatedly rotate, stop, or decelerate the cells in order to stir the object to be plated and sufficiently distribute the plating solution to the surface. And, the actual plating process to the object to be plated is performed only while the object is in contact with the contact ring by centrifugal force and centrifugal force, and is not performed while stopping or decelerating. There is a problem in terms of production efficiency that the entire manufacturing time becomes longer than the plating time. Further, in the case of a small-diameter Cu core ball having a diameter of 500 μm or less used for a semiconductor package, the core ball is likely to aggregate in the cell, and the cell is frequently rotated, stopped, or decelerated in order to solve this aggregation. It is necessary to repeat the process, and the plating efficiency may further decrease.

  Another example of a technique for solving the problem of the barrel electroplating method is described in Patent Document 2. To provide a uniform and completely coated particle base material, Patent Document 2 describes, “A device for coating particles, (a) for containing coated particles and electrolyte. An apparatus for coating particles, comprising: a non-porous container; and (b) a device for creating a fluidized bed in said container, the device coupled to said container for operation. “The container is circular and has a device for passing an electric current through the electrolyte, and the circular container further includes a particle passage having a concave annular portion, and the concave annular The part comprises a series of sloping and stepped segments ", the coating apparatus is described. Such a coating apparatus is described as having the following effects. That is, the device coupled to the circular vessel provides mechanical agitation to the circular vessel and imparts rotational motion about the central axis of the circular vessel to the contained particles, creating a fluidized bed. The fluidized bed moves along a concave annular passage, and the individual particles are coated by a device for passing an electric current through the electrolyte in the course of the movement. In addition, the fluidized bed continuously rises through a series of inclined stepped segments arranged in the annular passage, beyond the top edge that has risen on the inclined stepped segment, to the next adjacent segment. Fall to the lowest part of the. By the process of falling of the fluidized bed, the individual particles contained in the fluidized bed are agitated, the aggregation of the particles in the coating is suppressed, and the electrolytic solution sufficiently flows to the surface of the particles.

  However, the coating apparatus of Patent Document 2 is insufficient from the viewpoint of suppressing defects generated in the solder coating layer of the Cu core ball. That is, in order to prevent agglomeration by stirring the core balls contained in the fluidized bed, the fluidized bed that flows in the fluidized direction indicated by the arrow is inclined and stepped as shown in the vertical sectional view of the segment in FIG. When dropping in the direction of the arrow from the top edge of the segment 81a with 82 and causing it to collide with the next segment 81b, the core ball 91 that has been in contact in the fluidized bed until then is separated due to a sudden collision and is separated. . In the process of returning from the separated state to the contact state, a spark (abnormal discharge) D is generated between the core balls 91 loaded with a constant voltage for plating, but the solder coating layer is formed due to the spark D. Oxidation may cause discoloration or microvoids (voids) may occur. When the connection terminal bump is formed using the Cu core ball including such a defect in the solder coating layer, the durability against the heat cycle load as described above may be reduced or the defect may be corroded. If the height of the step 82 is lowered in order to prevent the separation, the agitation effect of the core balls is lowered, and the agglomerated core balls 91 cannot be separated from each other.

  Furthermore, in the above-described prior art, when plating a small core ball having a diameter of 500 μm or less, in order to avoid agglomeration of the core balls with sufficient agitation, the capacity of the container or passage for containing the core balls However, only about 10% or less of the core balls could be processed, which was not satisfactory in terms of production efficiency in industrial production.

JP-A-8-239799 Special Table 2000-509436

  The first object of the present invention is to solve the above-mentioned problems of the prior art, and a metal coating having conductive base material particles on the surface and a metal coating layer coated on the surface of the base material particles. An object of the present invention is to provide an apparatus for producing metal-coated particles, which can produce metal-coated particles having a metal coating layer having a uniform thickness and few defects. Furthermore, the second object of the present invention is to provide an apparatus for producing metal-coated particles capable of efficiently forming a metal coating layer on particularly fine substrate particles.

  One aspect of the apparatus for producing metal-coated particles of the present invention that solves the above problems is an apparatus for producing metal-coated particles having base material particles having conductivity on the surface and a metal coating layer coated on the surface of the base material particles. A container in which a passage capable of accommodating a group of particles including a plurality of the base particles and a plating solution for forming a metal coating layer is formed, and the particles included in the group of particles are kept in contact with each other. While the flow path is configured to flow the particle group in one direction in the passage, the first electrode is disposed so as to be able to energize the particle group flowing in the path, and the path is disposed in a state of protruding upward from the bottom surface of the path And a stirring member that intersects the particle group that flows through the metal-coated particles.

  According to such a metal-coated particle production apparatus, the following actions and effects can be achieved. That is, a group of particles including a large number of substrate particles is stored in a passage of the container together with a plating solution for forming a desired metal coating layer. In addition, a particle group is not comprised only with base material particle | grains, For example, in order to accelerate | stimulate stirring of base material particle | grains, it may contain the electroconductive or nonelectroconductive dummy particle | grains as an agitation promoter.

  The particle group accommodated in the passage of the container as described above flows in one direction in the passage while maintaining contact between the particles contained in the fluid portion. This fluidized part can be specifically formed by, for example, the flow of plating solution or mechanical extrusion, but means for mechanically flowing the particle group, specifically, applying vibration to the container to form the particle group. It is desirable from the viewpoint of simplification of the apparatus that the structure is made to flow.

  Then, the particles that have been caused to flow in the plating solution in one direction by the flow portion are plated between the first electrode that is a cathode electrode in contact with the first electrode and the anode electrode that is disposed to face the first electrode, for example. It is processed and the desired metal coating layer is coated on the surface of the substrate particles.

  Here, the stirring member is arranged so as to protrude upward from the bottom surface of the passage, and is configured to intersect with the particle group flowing through the passage. Stopped. As a result, the flow direction of the particle group touching the stirring member is changed, and at the same time, the particles contained in the part are stirred to prevent agglomeration, and the plating solution is sufficiently circulated on the surface of the particle, Uniform production is promoted. Furthermore, since the stirring member is arranged as described above, the particles included in the particle group are not rapidly stirred in the vertical direction, and mainly the width direction of the passage and the flow direction of the particle group, in other words, the bottom surface of the passage. The particles are gently stirred in a parallel horizontal plane. Accordingly, the particles flowing in the passage are agitated while maintaining the contact state between the particles, the occurrence of sparks (abnormal discharge) due to the separation and contact of the particles is reduced, and the occurrence of defects in the metal coating layer is suppressed. The As a result, it is possible to achieve the first object of the present invention to provide an apparatus for producing metal-coated particles capable of producing metal-coated particles having a metal coating layer with a uniform thickness and few defects.

  Even when the stirring member of the above aspect is replaced with a stirring member that protrudes downward from a support member disposed at a position facing the bottom surface of the passage and intersects with a part of the particle group that flows in the passage, Specifically, the same actions and effects as described above can be expected.

  As described above, according to the metal-coated particle manufacturing apparatus of the present invention, it is possible to solve the problems of the prior art and to manufacture metal-coated particles having a metal coating layer with a uniform thickness and few defects. The first object of the present invention to provide a simple metal-coated particle production apparatus can be achieved. A preferred embodiment of an embodiment of the metal-coated particle production apparatus and a configuration for achieving the second object of the present invention will be described in detail below.

It is a front view of the ball manufacturing apparatus of the 1st mode concerning the present invention. It is a top view of FIG. It is a figure explaining the flow state of the ball group by the conventional plating apparatus, and the flow state of the ball group by the ball manufacturing apparatus of this invention. It is a front view of the ball manufacturing apparatus of the 2nd mode concerning the present invention. FIG. 5 is a partial plan view of FIG. 4. It is a figure explaining the more preferable aspect of the ball manufacturing apparatus of FIG.

  Hereinafter, the metal-coated particle production apparatus according to the present invention will be described based on some embodiments with reference to the drawings. In the following embodiment, an example of a solder-coated Cu core ball manufacturing apparatus (hereinafter referred to as a ball manufacturing apparatus) that coats the surface of a spherical core ball mainly composed of Cu as metal-coated particles with a solder coating layer mainly composed of Sn. However, the present invention is not limited to this. For example, the surface of a resin or ceramic particle having a conductive metal layer such as nickel formed by electroless plating or the surface of a substrate particle having conductivity on the surface. It can be applied when the metal coating layer is formed by electroplating. Further, the present invention can be applied not only to spherical base particles such as a core ball, but also to, for example, needle-like base particles having a major axis and a minor axis, and amorphous base particles having no shape characteristics. Furthermore, each component of the manufacturing apparatus of the metal coating particle demonstrated below can be used individually or in combination suitably.

(First embodiment)
First, a first embodiment of the ball manufacturing apparatus according to the present invention will be described with reference to FIGS. 1 partially shows a cross-sectional view taken along line BB in FIG. 2, and in FIG. 2, a part shows a view taken along the line AA in FIG. In the ball manufacturing apparatus 1 according to the first aspect, reference numeral 11 denotes a bowl-shaped container having an upper opening. The container 11 is made of a resin or the like that is a non-conductive insulator having corrosion resistance to the plating solution, and is formed concentrically with a cylindrical protrusion 112 provided in the center and the protrusion 112. An annular concave passage 111 and an outer wall 113 provided in an annular shape on the outer periphery of the passage 111 are provided. The bottom surface of the passage 111 in this aspect is slightly inclined from the outer wall 113 to the projection 112, but there is no problem even if it is horizontal. The passage 111 accommodates a ball group (particle group) 9 including a large number of core balls 91 and a plating solution 8 for forming a solder coating layer on the core balls 91. The plating solution 8 is stored in the passage 111 in such an amount that the ball group 9 can be immersed, but the plating solution 8 in the passage 111 is circulated so that the fresh plating solution 8 always touches the core ball 91. A plating solution circulation system is incorporated in the ball manufacturing apparatus 1. That is, the plating solution circulation system (not shown) has a discharge system for discharging the plating solution 8 used in the plating process from the passage 111 and a supply system for supplying a certain amount of fresh plating solution to the passage 111.

  In the figure, reference numeral 12 denotes a flow section connected to the bottom surface of the container 11, and the flow section 12 of this embodiment is configured as a vibration means that applies a constant force to the container 11 at a predetermined cycle. The fluid part 12 constituted by this vibration means vibrates the ball group 9 accommodated in the passage 111 of the container 11 and keeps the mutual contact of the core balls 91 included in the ball group 9 constant. 2, the ball group 9 is caused to flow counterclockwise around the axis of the container 11 as indicated by an arrow C. The flow velocity / flowing shape and other flow forms of the ball group 9 can be set by appropriately controlling the shape and posture of the passage 111 and the vibration conditions of the flow portion 12. For example, the flow direction is also shown in FIG. The ball group 9 can also flow in the opposite direction, that is, clockwise. Although the same applies hereinafter, the ball manufacturing apparatus according to the present invention is configured to form a solder coating layer on the surface of the core ball 91 using an electroplating method. It is preferable that the contact state of the surface is maintained uniformly during the flow. Therefore, the size of the passage 111 is set so that the core ball 91 can maintain a constant contact state based on the amount of the ball group 9 to be accommodated.

  In the figure, reference numeral 14 denotes a stirring unit including the stirring member 146 that stirs the ball group 9 flowing in the circumferential direction 111 as described above. The agitating unit 14 includes four support columns 141 erected on the upper surface of the base plate 13, and a support plate 142 fixed to the upper end of the support column 141. As shown in a plan view of FIG. 2, the support plate 142 is sized to cover the container 11, and an opening 149 that is opened in a substantially circular shape along the outer wall 113 of the container 11 is formed at the center thereof. Further, three protrusions 148 that protrude from the edge of the opening 149 to the passage 111 toward the center of the opening 149 are indexed and arranged at an angular pitch of 120 degrees.

  The three protrusions 148 are provided with moving means 14a. The moving means 14a includes a pulley 143 having a rotation shaft provided at the center of the projecting portion 148, a support member 145 made of resin that is a non-conductive insulator connected to the lower end of the rotation shaft of the pulley 143, and a circle. And a motor 144 that rotates a pulley 143 via an annular drive belt 147. The support member 145 has a disc shape, and as shown in FIG. 1, the shaft core is disposed so as to be substantially parallel to the shaft core of the container 11, and the bottom surface thereof is disposed so as to face the bottom surface of the passage 111. ing. A plurality of cylindrical stirring members 146 made of resin, which is a non-conductive insulator, extending downward from the bottom surface of the supporting member 145 are arranged at an equiangular pitch. The length of the stirring member 146 is such a length that the tip can be inserted into the ball group 9 flowing in the passage 111. By disposing the stirring member 146 in this way, the stirring member 146 intersects with a part of the ball group 9 flowing in the passage 111. Further, as shown by an arrow D in FIG. 2, the stirring member 146 intersects with the ball group 9 in a horizontal plane substantially parallel to the bottom surface of the passage 111 when the support member 145 is driven by the motor 144 via the pulley 143. Rotates independently counterclockwise. The moving means 14a of the present embodiment is configured to rotationally drive the stirring member 146, but the stirring member 146 is translated and moved along an appropriate path in the width direction of the passage 111 or the flow direction of the ball group 9. It may be configured.

  In the figure, reference numeral 15 denotes energization means including a first electrode 154 that functions as a cathode electrode and a second electrode 152 that functions as an anode electrode. A part of the first electrode 154 connected to the negative electrode side of the DC power supply circuit 151 is in contact with a part of the ball group 9 flowing through the passage 111 so that the core ball 91 can be energized. Embedded to be exposed. When the first electrode 154 is disposed so as to be in contact with a part of the ball group 9, the potential of the core ball 91 at a position away from the first electrode 154 decreases due to the contact resistance between the core balls 91. Depending on the position of the core ball 91 in the ball group 9, the thickness of the solder coating layer may be non-uniform. Therefore, the first electrode 154 preferably has an area where the ball group 9 is sufficiently in contact when viewed in a plan view, and is preferably formed in a ring shape on the bottom surface of the passage 111, for example. For this purpose, for example, the container 11 itself may be formed of a conductive material such as stainless steel or titanium so as to function as the first electrode 154. In this case, a resin having corrosion resistance on the side surface of the passage 111 is used. Coating may be performed so that the bottom surface of the passage 111 acts as the first electrode 154.

  The three substantially fan-shaped second electrodes 152 connected to the positive electrode side of the DC power supply circuit 151 have an equiangular pitch between the protrusions 148 and 148 in the opening 149 as shown in FIG. Is arranged in. The second electrode 152 is supported by an electrode support member 153 formed of an insulator so as to be immersed in the plating solution 8 in a posture facing the flowing ball group 9. Note that the first electrode 152 and the second electrode 154 may be formed of a material that does not react with the plating solution 8, and may be formed of, for example, stainless steel, titanium, platinum-plated titanium, or the like.

  The operation of the ball manufacturing apparatus 1 having the above configuration will be described below. First, in order to form the ball group 9, a predetermined number of core balls 91 determined by the size of the passage 111 and other conditions and a plating solution are prepared and accommodated in the passage 111. The core ball 91 may be one that has been pickled prior to the plating step to clean the surface, and further may have a nickel plating layer formed as a base layer on the surface, if necessary. The plating solution for solder plating is, for example, an additive to the trade name “DAIN TINSIL SBB 2” manufactured by Daiwa Kasei Co., Ltd. having a Sn—Ag—Cu based liquid composition, the trade name “SOLDERON BP SAC5000” manufactured by Rohm & Haas, etc. Can be used by appropriately adjusting to a known plating bath such as a borofluoride bath. Further, the particles constituting the ball group 9 are not limited to the core ball 91. For example, as a stirring accelerator for promoting the stirring of the ball group 9, for example, conductive dummy balls mainly made of solder or steel, resin or ceramics. An appropriate amount of non-conductive dummy balls mainly composed of the above may be added. Further, as described below, the ball group 9 made up of a large number of core balls 91 is fluidized by the fluidizing section 12, so that the core balls 91 may be accommodated in a specific region of the passage 111. Thereafter, the manufacturing apparatus 1 is operated.

  The ball manufacturing apparatus 1 causes the container 11 to vibrate by the flow part 12 configured by the vibration means, and causes the ball group 9 accommodated in the passage 111 to flow in the direction of arrow C shown in FIG. As shown in FIG. 1, the ball group 9 flows on the bottom surface of the passage 111 while being immersed in the plating solution 8 while turning around the protrusion 112 in a form having a certain thickness and width. Here, since the stirring member 146 is disposed so as to intersect with a part of the ball group 9 flowing in the passage 111, as shown in an enlarged plan view around the stirring member 146 in FIG. A part of the flow of 9 is blocked by the plurality of stirring members 146, and the flow is disturbed at a plurality of locations of the flow of the ball group 9. Then, the core balls 91 included in the ball group 9 that has touched the stirring member 146 are stirred by the disturbance, and as indicated by an arrow R while maintaining the mutual contact state of the core balls 91 by contact with the stirring member 146. Rotate to cause a displacement. As a result, the agglomeration of the core balls 91 is avoided, and the plating solution 8 is sufficiently distributed between the core balls 91. The flowing ball group 9 touches the first electrode 154 connected to the negative electrode of the activated DC power supply circuit 151, and current is applied to the plating solution 8 from the second electrode 152 connected to the positive electrode. As a result, the metal ions in the plating solution 8 sufficiently flowing between the core balls 91 are deposited on the surface of the core balls 91, and a sound solder coating layer in which the generation of defects is suppressed has a uniform thickness. 91 is formed on the surface.

  Further, the ball manufacturing apparatus 1 operates the fluidizing section 12 to cause the ball group 9 to flow, and at the same time operates the moving means 14 a of the stirring section 14. The moving means 14a drives the motor 144 to rotate the three pulleys 143 via the drive belt 147, and rotates each of the three support members 145 in the direction of arrow D as shown in FIG. Then, the stirring member 146 extending downward from the support member 145 rotates counterclockwise around the axis of the support member 145 and turns while intersecting with the flowing ball group 9, so that the ball group 9 is held in the horizontal plane. Without stirring. As a result, even when a relatively large number of core balls 91 are processed with respect to the volume of the passage 111 with respect to the conventional plating apparatus, the plating solution 8 is sufficiently circulated between the core balls 91, thereby generating defects. Thus, a sound solder coating layer with reduced resistance can be formed on a relatively large amount of the core balls 91.

  It should be noted that in the process of plating, the vibration conditions of the flow section 12 constituted by the vibration means are appropriately controlled to switch the flow direction of the ball group 9 forward or reverse, or the flow velocity of the ball group 9 is changed, for example, stepwise It is effective from the viewpoint of effectively stirring the core ball 91. From the same viewpoint, it is also effective to change the rotation direction and rotation speed of the stirring member 146. Thereby, the plating solution 8 can be sufficiently circulated between the core balls 91 to suppress generation of defects in the solder coating layer, and a relatively large amount of the core balls 91 can be plated.

(Second embodiment)
A second embodiment of the apparatus for producing metal-coated particles according to the present invention will be described with reference to FIGS. The metal-coated particle production apparatus according to the second aspect is also a ball production apparatus that coats the surface of a spherical core ball mainly composed of Cu with a solder coating layer mainly composed of Sn. In FIGS. The same components as those of the metal-coated particle manufacturing apparatus of one aspect are denoted by the same reference numerals, and detailed description of the configuration and operation is omitted.

  In the ball manufacturing apparatus according to the second aspect, the difference from the first aspect is that the stirring member 246 is disposed so as to protrude upward from the bottom surface of the passage 111, and secondly, the stirring member 246 is disposed. This is a point having a vibrating means 26 for vibrating. Hereinafter, each configuration will be described.

  First, the stirring member 246 of the second aspect will be described. As shown in FIG. 4, a plurality of substantially cylindrical stirring members 246 are arranged in the container 11 so as to extend upward from the bottom surface of the passage 111 and project in the axial direction. This is a length exceeding the thickness of the ball group 9 flowing on the bottom surface. As shown in FIG. 5A, the plurality of stirring members 246 are staggered in a horizontal plane substantially parallel to the width direction of the passage 111 or the flow direction of the ball group (arrow C), that is, the bottom surface of the passage 111. Accordingly, the flowing ball group 91 is agitated as a whole.

  In addition, the 1st electrode 254 in the ball manufacturing apparatus 2 of a 2nd aspect is ring shape which is the preferable shape demonstrated above. Further, as indicated by a two-dot chain line in FIG. 5A, the second electrode 152 is disposed above the stirring member 246 where the ball group 9 is stirred. Thereby, since the stirring process and the plating process of the ball group 9 are performed simultaneously, a sound solder coating layer in which the generation of defects is suppressed is formed on the surface of the core ball 91 with a uniform thickness.

  The arrangement | positioning form of the stirring member 246 is not limited above, For example, it can arrange as shown in FIG.5 (b)-(d). That is, the arrangement form shown in FIG. 5B is a pattern in which a plurality of stirring members 246 are arranged in parallel in a horizontal plane. According to this arrangement, the ball group 9 that has been touched and stirred with the preceding stirring member 246 in the flow direction of the ball group 9 is further touched with the subsequent stirring member 246 and stirring of the core ball 91 is further promoted. Aggregation of the balls 91 is prevented and the rotation thereof is further promoted.

  The arrangement form shown in FIG. 5C is a pattern in which a plurality of stirring members 246 are irregularly arranged at random positions. According to this arrangement form, the advantages of both the arrangement forms shown in FIGS. 5A and 5B can be obtained.

  In the arrangement shown in FIG. 5D, the stirring member 246a having a cross-sectional area larger than that of the stirring member 246a and the stirring member 246c having a cross-sectional shape different from that of the stirring member 246a (for example, a rectangular cross-section) (Shape, cross-sectional triangle shape, cross-sectional elliptical shape), and a plate-like stirring member 246d instead of a columnar body. According to such an arrangement, different stirring states can be generated for each of the stirring members 246a to 246d, and the ball group 9 can be effectively and reliably stirred by their interaction. The stirring members 246a to 246d can be incorporated independently without being mixed, but from the viewpoint of preventing the ball group 9 from staying and causing the passage 111 to flow smoothly, the ball group flowing through the passage 111 of the stirring member 246. The cross-sectional view along the flow direction of the ball group 9 at the portion that intersects and contacts with the ball 9 is preferably a closed figure having no recess in the flow direction.

  Next, the vibration means 26 of the stirring member 246 will be described. The vibration means 26 incorporated as necessary is connected to the bottom of the stirring member 246 and applies vibrations to the core balls 91 included in the ball group 9 with a relatively small amplitude via the stirring member 246. In order to prevent vibration generated from the vibration means 26 of the stirring member 246 from being transmitted to the passage 111 and affecting the flow state of the ball group 9, the stirring member 246 is placed in the container 11 via a vibration-proof member such as a vibration-proof rubber. It is preferable to be fixed to. By providing the vibration means 26, vibration is applied to the core balls 91 included in the ball group 9 that touches the stirring member 246 to promote stirring of the core balls 91, and rotation of the core balls 91 is promoted. Misalignment between the balls 91 is promoted.

  A more preferable aspect of the ball manufacturing apparatus 2 of the second aspect will be described with reference to FIG. The mode shown in FIG. 6A is arranged such that the angle at which the ball group 9 flowing in the passage 111 and the surfaces of the stirring members 346a to 346c intersect with each other is different, and the posture of protruding the stirring members 346a to 346c is different. It is the aspect arranged so. Specifically, while the agitating member 346a is disposed substantially vertically upward, the agitating member 346b is disposed in an inclined state toward the outer wall 113 by an angle θ1 with respect to the bottom surface of the passage 111. The stirring member 346c is disposed in a state inclined with respect to the bottom surface of the passage 111 by the angle θ2 in the direction of the protrusion 112. According to the arrangement form of the stirring members 346a to 346c in this aspect, different stirring states can be generated for each of the stirring members 346a to 346c, and the ball group 9 is effectively and reliably stirred by their interaction. be able to.

  In the embodiment shown in FIG. 6B, a stirring surface 446 a having a larger unevenness than the core ball 91 included in the ball group 9 is provided in a portion that intersects and comes into contact with the ball group 9 flowing through the passage 111 of the stirring member 456. It is the aspect which is. For example, as shown on the right side of FIG. 6B, such a stirring surface 446 a is formed by forming one or more U-shaped grooves having a groove width t <b> 1 exceeding the diameter of the core ball 91 on the side surface of the stirring member 446. Alternatively, as shown on the left side of the figure, it can be realized by forming irregularities on the side surface of the stirring member 446 having a valley t2 having a width that does not allow the core ball 91 to be caught. By providing such a stirring surface 446 a on the stirring member 446, the rotation of the core balls 91 included in the ball group 9 touching the stirring surface 446 is promoted, and the misalignment between the core balls 91 is promoted.

1 (2) Ball manufacturing apparatus 11 Container 111 Passage 112 Projection 113 Outer wall 12 Flowing part 13 Base 14 Stirring part 14a Moving means 145 Support member 146 (246, 346, 446) Stirring member 15 Current supply means 151 DC power supply circuit 152 2nd Electrode 154 First electrode 26 Stirring member vibration means 8 Plating solution 9 Ball group 91 Core ball

Claims (14)

  An apparatus for producing metal-coated particles having conductive base material particles on the surface and a metal coating layer coated on the surface of the base material particles, the particle group including a large number of the base material particles and the metal A container in which a passage capable of containing a plating solution for forming a coating layer is formed, and a flow for causing the particles to flow in one direction in the passage while maintaining contact between the particles contained in the particles. A first electrode disposed so as to be able to energize a particle group flowing in the passage, and a stirring member that intersects with the particle group that flows in the state that protrudes upward from the bottom surface of the passage; An apparatus for producing metal-coated particles.   An apparatus for producing metal-coated particles having conductive base material particles on the surface and a metal coating layer coated on the surface of the base material particles, the particle group including a large number of the base material particles and the metal A container in which a passage capable of containing a plating solution for forming a coating layer is formed, and a flow for causing the particles to flow in one direction in the passage while maintaining contact between the particles contained in the particles. And a first electrode disposed so as to be able to energize a particle group flowing in the passage, and a support member disposed at a position facing the bottom surface of the passage, and is disposed in a state of projecting downward and flows in the passage An apparatus for producing metal-coated particles, comprising: a stirring member that intersects with the particle group.   The apparatus for producing metal-coated particles according to claim 1, wherein the stirring member is a columnar body.   The apparatus for producing metal-coated particles according to claim 1, wherein the stirring member is a plate-like body.   The apparatus for producing metal-coated particles according to any one of claims 1 to 4, comprising a plurality of stirring members arranged in parallel in a width direction of the passage or a flow direction of the particle group.   The apparatus for producing metal-coated particles according to any one of claims 1 to 4, further comprising a plurality of stirring members arranged in a staggered manner in the width direction of the passage or the flow direction of the particle group.   The apparatus for producing metal-coated particles according to any one of claims 1 to 4, further comprising a plurality of stirring members arranged randomly in a width direction of the passage or a flow direction of the particle group.   The apparatus for producing metal-coated particles according to any one of claims 1 to 7, wherein a cross-sectional area or a cross-sectional shape along the flow direction of the particle group is different between one stirring member and another stirring member.   The apparatus for producing metal-coated particles according to any one of claims 1 to 8, wherein the projecting posture differs between one stirring member and another stirring member.   10. The metal according to claim 1, wherein a portion of the stirring member that intersects and comes into contact with the particle group flowing in the passage is provided with a stirring surface having irregularities larger than the particles included in the particle group. Equipment for producing coated particles.   The cross-sectional view along the flow direction of the particle group at the portion of the stirring member that intersects and contacts the particle group flowing through the passage is a closed figure having no recess in the flow direction. The manufacturing apparatus of metal-coated particle of description.   The apparatus for producing metal-coated particles according to any one of claims 1 to 11, wherein the fluidizing section includes a vibration means connected to the container.   The apparatus for producing metal-coated particles according to any one of claims 1 to 12, further comprising a vibrating unit that vibrates the stirring member.   The apparatus for producing metal-coated particles according to any one of claims 1 to 13, further comprising moving means for independently moving the stirring member in a width direction of the passage or a flow direction of the particle group.

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