JP2003071365A - Liquid applying device and liquid applying method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid applying device and a liquid applying method which can apply prescribed liquid to the region to be coated of an article in a short time and with an excellent uniformity, and can reduce the quantity of usage thereof. SOLUTION: This liquid applying device 100 which applies a resist solution to the region to be coated of a semiconductor wafer 5 is provided with a storage tank 7 which has a plurality of opening parts and supplies the resist solution from the opening parts to a plurality of specified regions of the semiconductor wafer 5, a shutter mechanism 64 which is disposed on the storage tank 7 in order to open and close the opening parts selectively, a chuck holder 41 which has a spin chuck 4 beneath the storage tank 7 and rotates the semiconductor wafer 5 mounted on the spin chuck 4 and a controller 80 which opens the shutter mechanism 64, drops the resist solution, at the same time, operates the chuck holder 41, rotates the semiconductor wafer 5 by a prescribed angle and, then, controls the chuck holder 41 so as to rotate the semiconductor wafer 5 in the state of closing the shutter mechanism 64.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid coating device and a liquid coating method suitable for application to a resist spin coater used in a semiconductor device manufacturing process, a coater developer (developing device) and the like. More specifically, when a predetermined liquid is applied to the coated area of the article, a control means for controlling the rotating mechanism and the shutter mechanism is provided, and by this controlling means, the shutter mechanism is opened to drop the liquid and the rotating mechanism is operated. After operating the product to rotate it by a predetermined angle, etc., by rotating the product with the shutter mechanism closed, the dispersed liquid is distributed in a circumferential direction from a plurality of specific regions of the product all at once in a small amount. It is designed to be applied uniformly.

[0002]

2. Description of the Related Art In recent years, the demand for higher integration of semiconductor devices mounted in electronic equipment is increasing. Under such circumstances, in the photolithography process that influences the dimensional accuracy of the channel region of the semiconductor device, the wiring pattern, etc., the manufacturing process and manufacturing device are being improved every day.

The apparatus used in the photolithography process includes a resist spin coater for applying a resist solution to a semiconductor wafer to form a predetermined resist coating film on the semiconductor wafer, and a developer for pre-exposed resist coating film. There is a coater / developer (developing device) or the like for forming a predetermined resist pattern on a semiconductor wafer by applying the above.

FIG. 9 is a sectional view showing a structural example of a liquid coating device 50 according to a conventional example. The liquid coating device 50 forms a resist coating film on the coating target region of the semiconductor wafer 5.

The liquid coating device 50 is provided with a semiconductor wafer 5
And a chuck holder 51 for supporting and rotating the spin chuck 52 from below.
And a single nozzle 53 having a straw shape and provided above the central portion of the semiconductor wafer 5.

When a resist coating film is formed on the semiconductor wafer 5 by using the liquid coating apparatus 50, the semiconductor wafer 5 is first transferred onto the spin chuck 52. Next, the nozzle 53 is brought directly above the center of the semiconductor wafer 5. Then, while holding the semiconductor wafer 5 by the spin chuck 52, the resist solution is discharged from the nozzle 53 to the central portion of the semiconductor wafer 5. After that, the chuck holder 51
Is operated to rotate the semiconductor wafer 5 held by the spin chuck 52 at a high speed.

As a result, the resist solution discharged from the nozzle 53 to the central portion of the semiconductor wafer 5 spreads in the circumferential direction from the central portion of the semiconductor wafer 5, and a resist coating film is formed on the coated region of the semiconductor wafer 5. It

[0008]

By the way, according to the liquid coating apparatus 50 according to the conventional method, one nozzle 53 having a straw shape is provided above the central portion of the semiconductor wafer 5 held by the spin chuck 52. The resist solution was discharged from the nozzle 53 to the center of the semiconductor wafer 5, and then the semiconductor wafer 5 was rotated at high speed to spread the resist solution in the circumferential direction from the center of the semiconductor wafer 5.

Therefore, the amount of resist solution supplied to the peripheral portion of the semiconductor wafer 5 is smaller than that of the central portion of the semiconductor wafer 5, and it takes a long time to form a resist coating film and the thickness thereof becomes uneven. There was a problem of being lost.

Further, in order to sufficiently supply the resist solution to the circumferential portion of the semiconductor wafer 5, the surplus resist solution is supplied to the central portion of the semiconductor wafer 5, and the resist solution (hereinafter, also referred to as a predetermined liquid). ) Was wasted.

Therefore, the present invention solves such a problem and makes it possible to apply a predetermined liquid to a coated area of an article in a short time and with good uniformity. An object of the present invention is to provide a liquid application device and a liquid application method that can reduce the amount used.

[0012]

The above-mentioned problem is a liquid application device for applying a predetermined liquid to an application area of an article,
Liquid supply means having a plurality of openings and supplying liquid from the openings to a plurality of specific regions of the article, and a shutter provided in the liquid supply means for selectively opening and closing these openings. A rotation mechanism that has a mechanism and a placement section below the liquid supply means, and rotates an article placed on the placement section; a shutter mechanism is opened to drop liquid; and a rotation mechanism is operated. And a control means for controlling the article to rotate with the shutter mechanism closed after the article is rotated by a predetermined angle.

According to the liquid application device of the present invention, a predetermined amount of liquid can be simultaneously supplied while being dispersed in a plurality of specific regions of the article.

The liquid application method according to the present invention is a method of applying a predetermined liquid to an area to be coated of an article, in which a predetermined amount of liquid is simultaneously supplied in a state of being dispersed in a plurality of specific areas of the article, After that, the article supplied with the liquid is rotated.

According to the liquid application method of the present invention, the dispersed liquid can be diffused in the circumferential direction from a plurality of specific areas of the article, so that the liquid can be applied to the area to be coated of the article in a shorter time than the conventional method. It can be applied in time and with good uniformity.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor manufacturing apparatus and a semiconductor device manufacturing method according to embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a configuration example of a liquid coating apparatus 100 according to an embodiment of the present invention.

In this embodiment, a control means is provided for controlling the rotating mechanism and the shutter mechanism when a predetermined liquid is applied to the coated area of the article, and this control means opens the shutter mechanism to drop the liquid. At the same time, the rotating mechanism is operated to rotate the article by a predetermined angle, and then the article is rotated with the shutter mechanism closed, so that the dispersed liquid can be simultaneously applied in a circumferential direction from a plurality of specific regions of the article. In this way, the liquid can be applied to the coated area of the article in a short time and with good uniformity, and the usage amount can be reduced.

A liquid coating apparatus 100 shown in FIG. 1 forms a resist coating film by applying a resist solution, which is an example of a predetermined liquid, to a semiconductor wafer 5 (diameter of about 150 mm), which is an example of an article. .

In FIG. 1, the liquid coating apparatus 100 includes a housing 2. The housing 2 is an outer casing of the liquid coating apparatus 100 and is made of, for example, stainless metal.

The liquid coating apparatus 100 also has a drain cup 3 and a spin chuck 4 inside the housing 2. The drain cup 3 receives the excess resist solution and the like supplied to the semiconductor wafer 5 below the semiconductor wafer 5. The drain cup 3 is provided with a waste liquid pipe (not shown) for discharging the resist solution and the like received by the drain cup 3 to the outside of the apparatus.

The spin chuck 4 is provided inside the drain cup 3 and holds the semiconductor wafer 5 by vacuum suction. The surface of the spin chuck 4 holding the semiconductor wafer 5 has a plurality of pores (not shown).
Is provided and is adapted to be connected to a vacuum pump (not shown).

Further, the liquid coating apparatus 100 includes a chuck holder 41 which is an example of a rotating mechanism. The chuck holder 41 extends upward from below the center of the drain cup 3 to support the spin chuck 4, and rotates the fixed spin chuck 4 to move up and down. The semiconductor wafer 5 held by the spin chuck 4 is
The chuck holder 41 rotates or vibrates at a predetermined speed at a predetermined angle.

In addition, the liquid coating apparatus 100 includes the current plate 31 and 32 below the spin chuck 4 and the cleaning nozzle 33.
Is equipped with. Among these, the rectifying plates 31 and 32 are for rectifying the air flow from above. Further, the cleaning nozzle 33 is for cleaning the back surface of the semiconductor wafer 5.

The liquid coating apparatus 100 is provided with a splash guard 6 on the inner peripheral side of the drain cup 3 so as to be coaxial with the drain cup 3. The splash guard 6 can only move up and down without rotating on the inner peripheral side of the drain cup 3. In FIG. 1, the splash guard 6 is fixed to a lifting cylinder 61 so that it can be lifted and lowered. Semiconductor wafer 5
The splash solution 6 prevents the resist solution and the like supplied to the above from scattering.

The liquid coating apparatus 100 also includes a storage tank 7 which is an example of liquid supply means. This storage tank 7 stores the resist solution and
The resist solution is supplied to the semiconductor wafer 5 in the vicinity of immediately above the semiconductor wafer 5 placed on the spin chuck 4. The storage tank 7 has a cylindrical shape, and has a plurality of openings for dropping liquid drops at the bottom thereof.

The storage tank 7 is attached via a motor housing 9 to an arm 8 extending horizontally from the upper side. The arm 8 is fixed by the lifting cylinder 81. The storage tank 7 can be moved up and down by the vertical movement of the lifting cylinder 81.

2A to 2C are a plan view, a sectional view, and a bottom view showing an example of the structure of the storage tank 7. The housing of the storage tank 7 shown in FIG. 2B is made of a resin having good water repellency, for example, PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer).

The storage tank 7 is integrally provided with a liquid storage chamber 72 in which the resist solution is stored, and a temperature adjustment (temperature adjustment) jacket 73 for circulating constant temperature water or the like around the liquid storage chamber 72. ing. The temperature of the resist solution stored in the liquid storage chamber 72 is adjusted by constant temperature water or the like circulating in the temperature adjustment jacket 73. Further, a tank lid 71 is attached to the upper surface of the storage tank 7 for preventing volatilization of the resist solution stored in the liquid storage chamber 72 and mixing of foreign matter into the liquid storage chamber 72.

As shown in FIG. 2A, the storage tank 7
In the tank lid 71, a liquid introduction port 67A for flowing a fixed amount of resist solution into the liquid storage chamber 72, a connection port 67B for connecting an exhaust control valve, and a connection port for connecting a vacuum degassing system. 67C and an insertion port 67D for the tank liquid amount management sensor are provided.

These liquid inlet 67A and each connecting port 67B
Each functional component is connected to D through a resin tube (not shown). The resist solution is pressure-fed with nitrogen gas or the like from the liquid inlet 67A and is introduced. In addition, the nitrogen gas bubbles in the resist solution due to this pressure feeding are connected to the connection port 67C.
Is removed by a vacuum degassing system connected to. Further, the tank lid 71 has a temperature control liquid inlet 6 for feeding constant temperature water for temperature control to the temperature control jacket 73.
9A and a temperature control liquid outlet 69B are provided.

Returning to FIG. 2B, this storage tank 7
Has a first opening 78 at the center of its bottom surface. A plurality of second openings 74 are provided on the bottom surface of the liquid storage chamber 72 of the storage tank 7 so as to spread radially around the opening 78. The size of the opening 74 increases as the distance from the opening 78 increases.

For example, 32 openings 74 are provided. These opening portions 74 form a set every eight pieces, and a total of four sets of opening portions 74 are arranged so as to surround the opening portion 78 fourfold.

In the following, with the opening 78 as the center, the eight innermost openings 74 are arranged as the first set of openings 74.
Called. In addition, the 8 placed just outside of this first set
The openings 74 are referred to as a second set, the eight openings 74 arranged outside the second set are referred to as a third set, and the eight openings 74 arranged at the outermost side are referred to as a fourth set. Called.

The eight openings 74 of each set are arranged at equal intervals of about 45 ° around the opening 78. The first set of opening portions 74 and the second set of opening portions 74 are arranged so as to be offset by about 23 ° with respect to the opening portion 78, that is, about half the arrangement interval (about 45 °) of the opening portions 74. Has been done.

Similarly, the second set and the third set, and the third set and the fourth set.
The openings 74 of the set are also arranged to be offset by about 23 °. Further, the openings 74 of the third set and the fourth set are larger than the openings 74 of the first set and the second set.

In order to open and close the plurality of openings 74,
The liquid coating device 100 includes a shutter mechanism 64 attached to the storage tank 7.

In FIG. 2B, this shutter mechanism 64
Is a disk-shaped stopper member 75, a liquid introduction tube 63 for fixing the stopper member 75, a shutter rotation motor 91, a motor rotation shaft 92 extended from the shutter rotation motor 91, and a motor rotation. A pair of gears for engaging the shaft 92 and the liquid introduction pipe, and at least a shutter rotation motor 91.
And a motor housing 9 for fixing the motor.

Among these, the plug member 75 shown in FIG. 2C.
Has a plurality of openings 76 substantially corresponding to the openings 74 (see FIG. 2B) and an opening 62 substantially corresponding to the openings 78. The plug member 75 is made of water repellent PFA or the like. Alternatively, the plug member 75 may be made of polyvinyl chloride or the like, and its surface may be covered with a water-repellent resin or the like. The plug member 75 has a shape that can serve as packing.

Further, the shutter rotation motor 91 shown in FIG. 2B is used.
Is, for example, a pulse motor, and through a pair of gears attached to the motor rotating shaft 92 and the liquid introducing pipe 63,
The stopper member 75 is rotated by a predetermined angle.
Further, the liquid introducing pipe 63 has a hollow inside so that it can be inserted into the opening 62 at the center of the plug member 75.

Hereinafter, the opening 74, the opening 76, and the plug member 75 are collectively referred to as a nozzle 77. This nozzle 7
7 rotates the stopper member 75 to open the opening 74 and the opening 7
6 and 6 are overlapped with each other to open the opening 74 and the opening 7.
It is designed to close when 6 and 6 are shifted. Nozzle 7
By opening 7, the resist solution stored in the liquid storage chamber 72 can be discharged by spontaneous fall.

The resist solution can be discharged from the opening 62 by supplying the resist solution from the other end of the liquid introducing pipe 63 having one end fitted to the stopper member 75.

Furthermore, the inner wall surface of the liquid storage chamber 72 and the surfaces of the opening 74 and the plug member 75 are made of PFA having excellent water repellency.
Therefore, the resist solution does not adhere thereto. As a result, the resist solution can be prevented from remaining in the liquid storage chamber 72 or around the stopper member 75, so that the resist solution can be discharged in a fixed amount. Also,
A mechanism for sucking the residual liquid adhering to the inner wall surface of the liquid storage chamber 72, the opening 74 and the surface of the plug member 75 is also unnecessary.

The liquid coating / coating apparatus 100 is provided with a controller 80 for controlling both the shutter rotation motor 91 and the chuck holder 41 shown in FIG.
The controller 80 is an example of control means.

As shown in FIG. 3, the controller 80 causes the storage tank 7 to approach above the semiconductor wafer 5 sucked and held by the spin chuck 4, and then, as shown in FIG.
The nozzle 77 shown in B is opened to drop the resist solution, and the semiconductor wafer 5 mounted on the spin chuck 4 is also dropped.
Can be rotated by a predetermined angle, then the nozzle 77 can be closed and the semiconductor wafer 5 can be rotated at a high speed.

Next, the liquid application method according to the embodiment of the present invention will be described. 4 to 8 are process diagrams showing the liquid application method (Nos. 1 to 5) according to the embodiment of the present invention. Here, using the liquid coating apparatus 100 described above,
It is assumed that a semiconductor wafer 5 as an example of an article is subjected to a resist solution as an example of a predetermined liquid to form a resist coating film on the upper surface of the semiconductor wafer 5. Therefore, those having the same reference numeral have the same function, and the description thereof will be omitted.

First, the drain cup 3 of the liquid coating apparatus 100 shown in FIG.
The semiconductor wafer 5 is transferred onto the top. Next, the spin chuck 4 is moved upward to hold the semiconductor wafer 5 on the spin chuck 4. At this time, the storage tank 7
Stand by at the upper standby position by the lifting cylinder 81,
The opening 78 on the bottom surface of the storage tank 7 (see FIG.
(See B) is located on the rotation axis of the semiconductor wafer 5.

Then, the chuck holder 41 is driven to
The spin chuck 4 holding the semiconductor wafer 5 is moved into the drain cup 3 below. Further, the lifting cylinder 81 is driven to move the storage tank 7 to the semiconductor wafer 5
Down just above.

Before or after the lowering operation of the storage tank 7, the splash guard 6 is moved into the drain cup 3. Further, a fixed amount of resist solution is supplied and stored in the liquid storage chamber 72 of the storage tank 7.

At this time, the opening 76 of the stopper member 75 shown in FIG. 4A does not overlap the opening 74 of the storage tank 7, that is, the nozzle is closed. Further, since the nozzle is closed, the resist solution has not yet been dropped onto the semiconductor wafer 5 in FIG. 4B which stands by below the nozzle.

Next, as shown in FIG. 5A, the stopper member 75 is rotated, the opening portion of the stopper member and the opening portion 74 of the storage tank are overlapped, and the resist solution is dropped from the storage tank 7. This operation is performed by the controller 80
A predetermined control signal is transmitted from (see FIG. 1) to the shutter rotation motor 91 (see FIG. 2B) and executed. At this time, the resist solution is also discharged from the opening 78 at the center of the storage tank 7. This allows
As shown in FIG. 5B, the resist solution 59 is supplied to the central portion of the semiconductor wafer 5 and a plurality of regions deviated from the central portion.

Then, the openings 74 and 78 shown in FIG. 6A.
While the resist solution is being discharged from, the semiconductor wafer is rotated, for example, about 23 ° in the counterclockwise direction around the center of the semiconductor wafer as an axis. This is performed by transmitting a predetermined control signal from the controller to the chuck holder 41 (see FIG. 1). As a result, as shown in FIG. 6B, the resist solution 59 can be supplied to the specific region of the semiconductor wafer 5 in the shape of darts.

Next, a predetermined control signal is transmitted from the controller to the shutter rotation motor and the chuck holder, and the stopper member 75 is rotated to close the nozzle as shown in FIG. 7A. Further, the discharge of the resist solution from the opening 78 is also stopped. Then, the semiconductor wafer is rotated at high speed. By this rotation, as shown in FIG. 7B, the resist solution 59 dispersed in the specific region of the semiconductor wafer 5 is diffused in the circumferential direction of the semiconductor wafer 5 indicated by the solid arrow.

Further, as shown in FIG. 8A, the opening 76
And the opening 74 are displaced, that is, the shutter mechanism 64
With the (see FIG. 1) closed, the semiconductor wafer is rotated at high speed for several tens of seconds. As a result, as shown in FIG. 8B, the resist solution is applied to the entire surface of the semiconductor wafer 5 substantially uniformly, and the resist coating film 57 is formed on the semiconductor wafer 5. The rotation speed and rotation time of the semiconductor wafer 5 at this time are controlled by the controller.

Thereafter, the storage tank 7 of FIG. 1 is returned to the standby position, and the organic solvent is sprayed from the cleaning nozzle 33 near the spin chuck 4 to clean the back surface of the semiconductor wafer 5. After cleaning the back surface of the semiconductor wafer 5, the semiconductor wafer 5 is taken out of the liquid coating apparatus 100 by the transfer system and transferred to the next exposure step.

As described above, the liquid coating apparatus 1 according to the present invention
According to No. 00, when the resist solution is applied to the application area of the semiconductor wafer 5, the chuck holder 41 and the shutter mechanism 6 are used.
The controller 80 controls the shutter mechanism 6 by opening the shutter mechanism 64 to drop the resist solution and operating the chuck holder 41 to rotate the semiconductor wafer 5 by about 23 °.
The semiconductor wafer 5 is rotated in a state where 4 is closed.

Therefore, a predetermined amount of resist solution can be simultaneously supplied while being dispersed in a plurality of specific regions of the semiconductor wafer 5. As a result, the dispersed resist solution can be applied simultaneously from a plurality of specific areas in the circumferential direction, so that the resist solution can be applied to the applied area of the semiconductor wafer 5 in a short time and with good uniformity as compared with the conventional method. Can be given.
Therefore, the amount of resist solution used can be reduced and the coating cost can be reduced.

In this embodiment, the liquid coating device 10
0 is used to form a resist coating film 57 on the semiconductor wafer 5.
Although the case of forming the above has been described, the present invention is not limited to this. For example, a semiconductor wafer 5 provided with a resist coating film after exposure may be selected as an example of a predetermined article, and the semiconductor wafer 5 may be subjected to a developing solution which is an example of a predetermined liquid.

In this case, first, a fixed amount of developer is supplied and stored in the liquid storage chamber 72 of the liquid coating apparatus 100. Next, the nozzle 77 is opened to drop the developing solution, and the spindle chuck 4 is paddled (intermittently rotated) for several tens of seconds within a range of, for example, −23 ° to + 23 ° to vibrate the wafer 5 for development. Promote. Then, the storage tank 7 is returned to the standby position, the rinse liquid is discharged onto the wafer 5 from a nozzle (not shown), and the wafer 5 is rotated to shake off the developer, rinse liquid, and resist after exposure.

As a result, a predetermined resist pattern can be formed on the semiconductor wafer 5. Compared with the conventional method, a predetermined amount of developing solution can be supplied from a plurality of openings in a short time, so that damage to the resist can be reduced and the developing solution can be uniformly applied to the development target area of the semiconductor wafer 5. You can Therefore, a high quality resist pattern can be formed with good reproducibility.

[0060]

According to the liquid coating apparatus of the present invention, there is provided control means for controlling the rotating mechanism and the shutter mechanism when a predetermined liquid is applied to the coated area of the article, and the control means comprises the shutter. The mechanism is opened to drop the liquid, the rotating mechanism is operated to rotate the article by a predetermined angle, and then the article is rotated with the shutter mechanism closed.

With this structure, a predetermined amount of liquid can be simultaneously supplied in a state of being dispersed in a plurality of specific regions of the article. Therefore, since the dispersed liquid can be simultaneously applied in a circumferential direction from a plurality of specific areas, the liquid can be applied to the applied area of the article in a short time and with good uniformity, as compared with the conventional method. This reduces the amount of liquid used,
The liquid application cost can be reduced.

Further, according to the liquid application method of the present invention, a predetermined amount of liquid is simultaneously supplied in a state of being dispersed in a plurality of specific regions of the article, and then the article to which this liquid is supplied is rotated. Done

With this structure, the dispersed liquid can be diffused in the circumferential direction from a plurality of specific areas of the article, so that the liquid can be applied to the area to be coated of the article in a short time and in comparison with the conventional method. It can be applied well. Therefore, the amount of the liquid used can be reduced, and the liquid can be applied to the coated area of the article with good reproducibility.

The present invention is extremely suitable for application to a resist spin coater used in a semiconductor device manufacturing process, a coater developer (developing device), and the like.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration example of a liquid coating device 100 according to an embodiment of the present invention.

2A to 2C are a plan view, a cross-sectional view, and a bottom view showing a configuration example of a storage tank 7.

FIG. 3 is a perspective view showing a lifting operation of a storage tank 7.

4A and 4B are process diagrams showing a liquid application method (No. 1) according to the embodiment of the present invention.

5A and 5B are process drawings showing a liquid coating method (No. 2) according to the embodiment of the present invention.

6A and 6B are process diagrams showing a liquid applying method (No. 3) according to the embodiment of the present invention.

7A and 7B are process diagrams showing a liquid coating method (Part 4) according to the embodiment of the present invention.

8A and 8B are process diagrams showing a liquid coating method (Part 5) according to the embodiment of the present invention.

FIG. 9 is a cross-sectional view showing a configuration example of a liquid application device 50 according to a conventional example.

[Explanation of symbols]

4 ... Spin chuck, 5 ... Semiconductor wafer, 7 ...
..Storage tank, 41 ... Chuck holder (rotating mechanism), 57 ... Resist coating film, 59 ... Resist solution, 64 ... Shutter mechanism, 75 ... Shutter, 80 ... Controller ( Control means), 100 ...
・ Liquid coating device

Claims (7)

[Claims] 1. A liquid application device for applying a predetermined liquid to an application area of an article, the liquid application apparatus having a plurality of openings and supplying the liquid from the openings to a plurality of specific areas of the article. A supply unit, a shutter mechanism provided in the liquid supply unit for selectively opening and closing the opening, and a mounting unit below the liquid supply unit and mounted on the mounting unit. A rotation mechanism for rotating the formed article, and opening the shutter mechanism to drop the liquid,
A liquid applying apparatus comprising: a control unit that operates the rotating mechanism to rotate the article by a predetermined angle, and then controls the article to rotate with the shutter mechanism closed. 2. The liquid application apparatus according to claim 1, wherein the liquid supply unit has a plurality of openings at positions off the rotation axis of the object. 3. The shutter mechanism includes a disk-shaped stopper member having a plurality of openings substantially corresponding to the openings of the liquid supply means, and the stopper member is at a predetermined angle with respect to the liquid supply means. The liquid application device according to claim 1, wherein the opening of the liquid supply means is opened and closed by rotating. 4. The liquid application apparatus according to claim 1, wherein the liquid supply means is provided with a circulation tank for circulating a liquid having a predetermined temperature. 5. The liquid applying apparatus according to claim 1, wherein the predetermined portion that comes into contact with the liquid is covered with or formed of a water-repellent member. 6. The shutter mechanism is opened to drip the liquid, the rotating mechanism is operated to rotate the article by a predetermined angle to vibrate, and then the article is removed with the shutter mechanism closed. The liquid coating apparatus according to claim 1, further comprising a control unit that controls to rotate. 7. A method of applying a predetermined liquid to a coated area of an article, wherein a predetermined amount of the liquid is simultaneously supplied in a state of being dispersed in a plurality of specific areas of the article, and then the liquid is added. A liquid application method comprising rotating the supplied article.