JP2003063000A - Ink-jet recording head and ink-jet recording apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink-jet recording head capable of preferably connecting a driving circuit and an external wiring as well as preventing cracking of a substrate, and an ink-jet recording apparatus. SOLUTION: In an ink-jet recording head comprising a channel forming substrate 10 with a pressure generating chamber 12 communicating with a nozzle opening formed, and a piezoelectric element 300 provided on one surface side of the channel forming substrate 10 for generating the pressure change in the pressure generating chamber 12, an external wiring 120 with a driving circuit 110 for driving the piezoelectric element 300 mounted is fixed on a bonding substrate 30 to be bonded on the piezoelectric element 300 side of the channel forming substrate 10 as well as the driving circuit 110 and a lead wiring 90 led out from the piezoelectric element 300 are connected electrically via a connection wiring 130 provided by wire bonding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric element, in which a part of a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets is composed of a vibrating plate, and a piezoelectric element is formed on the surface of the vibrating plate. The present invention relates to an inkjet recording head and an inkjet recording device that eject ink droplets by displacement.

[0002]

2. Description of the Related Art A part of a pressure generating chamber that communicates with a nozzle opening for ejecting ink droplets is composed of a vibrating plate, and the vibrating plate is deformed by a piezoelectric element to pressurize ink in the pressure generating chamber to eject it from the nozzle opening. Two types of inkjet recording heads that eject ink droplets have been put into practical use: one that uses a longitudinal vibration mode piezoelectric actuator that expands and contracts in the axial direction of a piezoelectric element, and one that uses a flexural vibration mode piezoelectric actuator. ing.

The former allows the volume of the pressure generating chamber to be changed by bringing the end face of the piezoelectric element into contact with the vibrating plate, and a head suitable for high-density printing can be manufactured. There is a problem in that the manufacturing process is complicated because a difficult process of matching the array pitch of the openings and cutting into comb teeth or a work of positioning and fixing the cut piezoelectric element in the pressure generating chamber are required.

On the other hand, in the latter, the piezoelectric element can be formed on the vibration plate by a relatively simple process of sticking a green sheet of a piezoelectric material in conformity with the shape of the pressure generating chamber and firing it. However, due to the use of flexural vibration, a certain area is required, and there is a problem that high-density arrangement is difficult.

On the other hand, in order to eliminate the disadvantage of the latter recording head, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique as disclosed in Japanese Patent Laid-Open No. 5-286131. It has been proposed that the piezoelectric material layer is cut into a shape corresponding to the pressure generating chamber by a lithographic method and a piezoelectric element is formed so as to be independent for each pressure generating chamber.

Further, in such a piezoelectric element, for example, a bonding substrate bonded to a flow path forming substrate defining a pressure generating chamber, for example, a reservoir serving as a common ink chamber of each pressure generating chamber is formed. It is connected to external wiring on the reservoir forming substrate. That is, a drive circuit for driving the piezoelectric element is provided on the bonding substrate, and a flexible cable (FPC) is connected to the drive wiring extended from the drive circuit.
By connecting external wiring such as the above, the drive circuit and the external wiring are electrically connected via the drive wiring.

[0007]

However, in the ink jet type recording head having such a structure, since the drive wiring is formed on the joint substrate, the joint substrate is heated by the heat when the drive wiring and the external wiring are joined. However, there is a problem in that the joint substrate or the flow path forming substrate is cracked by being heated.

Further, this heat is radiated through the bonding substrate, and the bonding strength between the drive wiring and the external wiring is lowered,
There is also a problem that connection failure occurs between the drive circuit and the external wiring.

In view of such circumstances, it is an object of the present invention to provide an ink jet type recording head and an ink jet type recording apparatus capable of favorably connecting a drive circuit and an external wiring and preventing a substrate from cracking. To do.

[0010]

A first aspect of the present invention for solving the above-mentioned problems is to provide a flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening is defined, and one surface of the flow path forming substrate. An ink jet recording head having a piezoelectric element that is provided on a side thereof through a vibration plate to generate a pressure change in the pressure generating chamber, and has a bonding substrate that is bonded to the piezoelectric element side of the flow path forming substrate. At the same time, the external wiring on which the drive circuit for driving the piezoelectric element is mounted is fixed on the bonding substrate, and the drive circuit and the lead wiring drawn from the piezoelectric element are connected by wire bonding. An ink jet recording head is characterized in that it is electrically connected via wiring.

In the first aspect, since heating is not required when fixing the drive circuit and the external wiring on the bonding substrate, and the connection wiring is directly connected to the drive circuit, the flow path forming substrate and The heating of the reservoir forming substrates is suppressed, and the deformation and cracking of these substrates is prevented.

A second aspect of the present invention is the ink jet recording head according to the first aspect, characterized in that the drive circuit mounted on the external wiring is fixed to the bonding substrate.

According to the second aspect, the external wiring on which the drive circuit is mounted can be fixed to the joint substrate relatively easily.

According to a third aspect of the present invention, in the second aspect, there is an exposed portion where a part of a connection surface side of the drive circuit with the external wiring is exposed, and the connection wiring has the exposed portion. The inkjet recording head is characterized in that it is connected to the drive circuit.

In the third aspect, since the connection wiring is directly connected to the drive circuit at the exposed portion of the external wiring, deformation of the bonding substrate and the flow path forming substrate due to heat at that time is prevented.

A fourth aspect of the present invention is the ink jet recording head according to the third aspect, characterized in that the exposed portion is a through hole provided in a region facing the drive circuit.

In the fourth aspect, the connection wiring is directly connected to the drive circuit within the through hole of the external wiring.

According to a fifth aspect of the present invention, in the ink jet recording head according to the third or fourth aspect, the exposed portion is provided in a region facing the outer peripheral portion of the drive circuit. is there.

In the fifth aspect, the connection wiring is directly connected to the drive circuit at the outer peripheral portion of the drive circuit.

A sixth aspect of the present invention is an ink jet recording head according to the first aspect, characterized in that the surface of the external wiring on the side opposite to the drive circuit is fixed to the bonding substrate. is there.

According to the sixth aspect, the external wiring on which the drive circuit is mounted can be fixed to the joint substrate relatively easily. Further, since the drive circuit is exposed, the connection wiring can be easily connected.

The seventh aspect of the present invention is the ink jet printer according to any one of the first to sixth aspects, wherein the external wiring on which the drive circuit is mounted is fixed to the joint substrate by die bonding. On the recording head.

According to the seventh aspect, the external wiring on which the drive circuit is mounted can be fixed to the joint substrate at a relatively low temperature.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the pressure generating chamber is formed in the silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed and formed. The inkjet recording head is characterized by being formed by a lithography method.

In the eighth aspect, an ink jet recording head having high density nozzle openings can be manufactured in a large amount and relatively easily.

A ninth aspect of the present invention is an ink jet recording apparatus including the ink jet recording head according to any one of the first to eighth aspects.

In the ninth aspect, it is possible to realize an ink jet recording apparatus with stable ink ejection characteristics of the head and improved reliability.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on embodiments.

(Embodiment 1) FIG. 1 is an assembly perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view and a sectional view of FIG.

As shown in the figure, the flow path forming substrate 10 is a silicon single crystal substrate having a plane orientation (110) in this embodiment. The flow path forming substrate 10 is usually 150 to 3
A thickness of about 00 μm is used, preferably 18
The thickness is preferably about 0 to 280 μm, more preferably about 220 μm. This is because the array density can be increased while maintaining the rigidity of the partition wall between the adjacent pressure generating chambers.

One surface of the flow path forming substrate 10 is an opening surface, and the other surface is provided with an elastic film 50 having a thickness of 1 to 2 μm and made of silicon dioxide formed in advance by thermal oxidation.

On the other hand, the opening surface of the flow path forming substrate 10 is anisotropically etched to form a silicon single crystal substrate.
Pressure generating chambers 12 partitioned by a plurality of partition walls 11 are arranged side by side in the width direction, and on the outer side in the longitudinal direction, the pressure generating chambers 12 communicate with a reservoir portion of a reservoir forming substrate, which will be described later, and a common ink chamber of each pressure generating chamber 12. A communication portion 13 that forms a part of the reservoir 100 is formed, and is communicated with one end portion in the longitudinal direction of each pressure generation chamber 12 via an ink supply passage 14, respectively.

In the anisotropic etching, when a silicon single crystal substrate is dipped in an alkaline solution such as KOH, it is gradually eroded to form a first (111) plane perpendicular to the (110) plane and the first (111) plane. Of the second (1) which makes an angle of about 70 degrees with the (111) plane of
The (11) plane appears, and the etching rate of the (111) plane is about 1/1 compared to the etching rate of the (110) plane.
It is performed by utilizing the property of being 80.
By such anisotropic etching, two first (11
Precision machining can be performed on the basis of the depth machining of the parallelogram shape formed by the 1) plane and the two diagonal second (111) planes, and the pressure generating chambers 12 can be arranged at high density. it can.

In the present embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is provided in the flow path forming substrate 1
It is formed by etching through almost 0 to reach the elastic film 50. Here, the elastic film 50 is
The amount of the alkaline solution that etches the silicon single crystal substrate is extremely small. Further, each ink supply passage 14 communicating with one end of each pressure generation chamber 12 is formed shallower than the pressure generation chamber 12, and keeps the flow resistance of the ink flowing into the pressure generation chamber 12 constant. That is, the ink supply path 14 is formed by etching the silicon single crystal substrate halfway in the thickness direction (half etching). The half etching is performed by adjusting the etching time.

On the opening surface side of the flow path forming substrate 10,
A nozzle plate 20 having a nozzle opening 21 that communicates with the pressure generating chamber 12 on the side opposite to the ink supply path 14 is fixed via an adhesive or a heat-welding film. The nozzle plate 20 has a thickness of, for example, 0.1 to 1
mm, a coefficient of linear expansion of 300 ° C. or less, for example, 2.5 to
It is made of glass ceramics of 4.5 [× 10 ⁻⁶ / ° C.] or rust-free steel. The nozzle plate 20 entirely covers one surface of the flow path forming substrate 10 with one surface, and also serves as a reinforcing plate that protects the silicon single crystal substrate from impact and external force. Further, the nozzle plate 20 is used as the flow path forming substrate 10.
It may be made of a material having substantially the same thermal expansion coefficient. In this case, since the flow path forming substrate 10 and the nozzle plate 20 have substantially the same deformation due to heat, they can be easily joined using a thermosetting adhesive or the like.

Here, the size of the pressure generating chamber 12 that applies the ink droplet ejection pressure to the ink and the size of the nozzle opening 21 that ejects the ink droplet depend on the amount of the ejected ink droplet, the ejection speed, and the ejection frequency. Optimized. For example,
When recording 360 ink drops per inch, it is necessary to accurately form the nozzle openings 21 with a diameter of several tens of μm.

On the other hand, a thickness of, for example, about 0.2 μm is formed on the elastic film 50 on the side opposite to the opening surface of the flow path forming substrate 10.
The lower electrode film 60, the piezoelectric layer 70 having a thickness of, for example, about 1 μm, and the upper electrode film 80 having a thickness of, for example, about 0.1 μm are laminated in a process described below to form the piezoelectric element 30.
Configures 0. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. Generally, one of the electrodes of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. Further, here, a portion which is composed of one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric strain is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the lower electrode film 60 is the common electrode of the piezoelectric element 300, and the upper electrode film 80 is the individual electrode of the piezoelectric element 300.
There is no problem in reversing this due to the driving circuit and wiring.
In any case, the piezoelectric active portion is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by the driving of the piezoelectric element 300 are collectively referred to as a piezoelectric actuator.

Further, the piezoelectric element 300 of the flow path forming substrate 10
A reservoir forming substrate 30 having a reservoir portion 31 forming at least a part of the reservoir 100 is joined to the side. In the present embodiment, the reservoir portion 31 penetrates the reservoir forming substrate 30 in the thickness direction, and the pressure generating chamber 12
Is formed over the width direction of the pressure generation chamber 12 and communicates with the communication portion 13 of the flow path forming substrate 10 as described above.
A reservoir 100 that serves as a common ink chamber of the above is configured.

As the reservoir forming substrate 30, it is preferable to use a material having substantially the same coefficient of thermal expansion as that of the passage forming substrate 10, such as glass or a ceramic material. It was formed using a silicon single crystal substrate of the same material. As a result, as in the case of the nozzle plate 20 described above, it is possible to reliably bond the two even by using a thermosetting adhesive at a high temperature. Therefore, the manufacturing process can be simplified.

Further, a compliance substrate 40 composed of a sealing film 41 and a fixing plate 42 is bonded to a region of the reservoir forming substrate 30 corresponding to each reservoir portion 31. Here, the sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm).
The one surface of the reservoir portion 31 is sealed by. The fixing plate 42 is formed of a hard material such as metal (for example, stainless steel (SUS) having a thickness of 30 μm). Since the region of the fixing plate 42 facing the reservoir 100 is the opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed with only the flexible sealing film 41. The flexible portion 32 is deformable by the change of the internal pressure.

On the other hand, the piezoelectric element 3 of the reservoir forming substrate 30.
In a region facing 00, a piezoelectric element holding portion 33 that can seal the space is provided in a state where a space that does not hinder the movement of the piezoelectric element 300 is secured, and the piezoelectric element 300 includes the piezoelectric element holding portion 33. It is sealed inside.

Further, in this embodiment, for example, a circuit board or a semiconductor integrated circuit (IC) for driving each piezoelectric element 300 is driven in a region of the reservoir forming substrate 30 corresponding to the piezoelectric element holding portion 33. The circuit 110 is fixed. Further, on the drive circuit 110, for example,
External wiring 120 such as a flexible cable (FPC) is connected. The drive circuit 110 includes an external wiring 12
0 is mounted in advance and is electrically connected by, for example, an adhesive layer 111 made of solder or anisotropic conductive agent (ACF).

Further, the drive circuit 110 and each piezoelectric element 300
Is the connection wiring 1 extended through the exposed portion where a part of the connection surface side of the drive circuit 110 with the external wiring 120 is exposed.
It is electrically connected by 30. Specifically, in the present embodiment, the through hole 12 that exposes the drive circuit 110 is formed in a region of the external wiring 120 that faces the drive circuit 110.
1 is provided. On the other hand, from the vicinity of one end in the longitudinal direction of the upper electrode film 80 of the piezoelectric element 300 to the elastic film 50,
For example, a lead electrode 90 made of gold (Au) or the like is extended. Further, a through groove 34 penetrating the reservoir forming substrate 30 is formed in a region of the reservoir forming substrate 30 near the end of the lead electrode 90. Then, the connection wiring 130 is extended through the through groove 34 and the through hole 121 of the external wiring 120 by wire bonding, and the drive circuit 110 and the lead electrode 90 are electrically connected. That is, one end of the connection wiring 130 is directly connected to the drive circuit 110.

As a procedure for assembling such an ink jet recording head, first, the elastic film 50 and the piezoelectric element 300 are formed on one side of the flow path forming substrate 10, and thereafter, as shown in FIG. The nozzle plate 20, the reservoir forming substrate 30, and the compliance substrate 40 are bonded to the flow path forming substrate 10 with an adhesive or the like.

Next, as shown in FIG. 3B, the external wiring 120 on which the drive circuit 110 is mounted is fixed on the reservoir forming substrate 30. For example, in this embodiment, the drive circuit 110 is fixed to the reservoir forming substrate 30 by die bonding. The fixing method is not particularly limited, but it is preferable to use a method capable of fixing at a relatively low temperature.

After that, as shown in FIG. 3C, the connection wiring 130 is formed by wire bonding through the through hole 121 of the external wiring 120 and the through groove 34 of the reservoir forming substrate 30 to form the lead electrode 90. The drive circuit 110 is electrically connected.

As described above, in the present embodiment, the drive circuit 11
0 was previously mounted on the external wiring 120, and the piezoelectric element 300 and the drive circuit 110 were electrically connected by the connection wiring 130 extended by wire bonding. That is, when the drive circuit 110 is fixed to the reservoir forming substrate 30, no electrical connection is made.
It can be fixed relatively easily without heating.
Therefore, when fixing the drive circuit 110 on the reservoir forming substrate 30, the flow path forming substrate 10, the reservoir forming substrate 30, etc. are not heated.

The connection wiring 130 is formed by wire bonding, and one end of the connection wiring 130 is formed by the drive circuit 1.
10 is directly connected on. That is, the connection wiring 13
Since 0 is not connected on the reservoir forming substrate 30,
Flow path forming substrate 1 due to heat when forming connection wiring 130
0 and heating of the reservoir forming substrate 30 are suppressed.

Therefore, it is possible to prevent the flow path forming substrate 10 or the reservoir forming substrate 30 from being deformed and cracked by the heat of mounting the drive circuit 110 and the external wiring 120, and the yield is remarkably improved. You can

Further, by mounting the drive circuit 110 on the external wiring 120 in advance, the drive circuit 1 can be operated at a relatively high temperature.
Since 10 can be mounted on the external wiring 120, the bonding strength between the drive circuit 110 and the external wiring 120 can be improved.

For example, when the drive circuit 110 is mounted via the adhesive layer 111 made of solder, 180 ° C. to 210 ° C.
The adhesive layer 111 is preferably heated to about 170 ° C. when an anisotropic conductive agent (ACF) is used as the adhesive layer 111. When mounting the drive circuit and the external wiring on the reservoir forming substrate, it is necessary to determine the heating temperature in consideration of the junction temperature of each substrate. However, as in the present embodiment, the drive circuit is provided on the external wiring. By mounting in advance, the drive circuit can be mounted well at a desired temperature.

Although the connection wiring 130 is exposed in this embodiment, for example, as shown in FIG. 4, an insulating member 140 made of epoxy resin or the like is provided to cover the drive circuit 110 and the external wiring 120. The connection wiring 130 may be electrically insulated. Of course, this insulating member 140
May be provided only in a region where the connection wiring 130 is formed, but by providing the drive circuit 110 and the external wiring 120 so as to electrically insulate the connection wiring 130, the drive circuit 110 and the external wiring are provided. The 120 can be reliably fixed by the reservoir forming substrate 30.

In the present embodiment, the drive circuit 110 mounted on the external wiring 120 is fixed to the reservoir forming substrate 30, but the present invention is not limited to this, and for example, FIG.
As shown in, the surface of the external wiring 120 opposite to the drive circuit 110 may be fixed to the reservoir forming substrate 30.

Further, in this embodiment, the through hole 121 is provided in the external wiring 120 to expose the drive circuit 110, and the connection wiring 130 is connected to the drive circuit 110 in the through hole 121. Without limitation, for example, FIG.
As shown in FIG.
0 may be mounted to provide an exposed portion 115 that exposes the drive circuit 110 in a region facing the outer peripheral portion of the drive circuit 110, and the exposed portion 115 may connect the drive circuit 110 and the connection wiring 130. . Further, for example, a wiring such as an earth line that does not need to pass through the drive circuit 110 may be directly connected to the external wiring 120 by wire bonding or the like.

The ink jet recording head of the present embodiment as described above takes in ink from the external ink supply means (not shown) and fills the interior from the reservoir 100 to the nozzle openings 21 with ink, and then from the drive circuit (not shown). Pressure generation chamber 1 via external wiring according to the recording signal
2 is applied to each of the lower electrode film 60 and the upper electrode film 80 to flexibly deform the elastic film 50, the lower electrode film 60, and the piezoelectric layer 70. And the ink droplets are ejected from the nozzle openings 21.

(Other Embodiments) Although the respective embodiments of the present invention have been described above, the basic structure of the ink jet recording head is not limited to the above.

For example, in each of the above-mentioned embodiments, the thin film type ink jet recording head manufactured by applying the film formation and the lithographic process is taken as an example. However, the present invention is not limited to this and, for example, green The present invention can also be applied to a thick film type ink jet recording head formed by a method such as attaching a sheet.

The ink jet recording head of each of these embodiments constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus. Figure 7
It is a schematic diagram showing an example of the ink jet type recording device.

As shown in FIG. 7, the recording head units 1A and 1B having the ink jet recording head are provided with the cartridges 2A and 2B constituting the ink supply means in a detachable manner.
The carriage 3 on which B is mounted is provided on a carriage shaft 5 attached to the apparatus body 4 so as to be movable in the axial direction. The recording head units 1A and 1B are, for example,
The black ink composition and the color ink composition are respectively discharged.

Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears (not shown) and the timing belt 7, so that the carriage 3 having the recording head units 1A and 1B mounted thereon follows the carriage shaft 5. Be moved. On the other hand, a platen 8 is provided on the apparatus main body 4 along the carriage shaft 5, and a recording sheet S, which is a recording medium such as paper fed by a feed roller (not shown), is conveyed on the platen 8. It is like this.

[0061]

As described above, according to the present invention, the external wiring on which the drive circuit is mounted is fixed to the bonding board, and
Since the drive circuit and the lead wiring drawn from the piezoelectric element are electrically connected by wire bonding, the flow path forming substrate and the joint substrate are deformed and cracked by heat when mounting the drive circuit and external wiring. Can be prevented. Further, by mounting the drive circuit on the external wiring in advance, the drive circuit can be mounted on the external wiring at a relatively high temperature, and the bonding strength between the drive circuit and the external wiring is improved.

[Brief description of drawings]

FIG. 1 is a perspective view of an ink jet recording head according to a first embodiment of the invention.

2A and 2B are a plan view and a sectional view of the ink jet recording head according to the first embodiment of the invention.

FIG. 3 is a cross-sectional view showing an assembly process of the ink jet recording head according to the first embodiment of the invention.

FIG. 4 is a cross-sectional view showing another example of the ink jet recording head according to the first embodiment of the invention.

FIG. 5 is a sectional view showing another example of the ink jet recording head according to the first embodiment of the invention.

FIG. 6 is a cross-sectional view showing another example of the ink jet recording head according to the first embodiment of the invention.

FIG. 7 is a schematic diagram of an inkjet recording apparatus according to an embodiment of the present invention.

[Explanation of symbols]

10 Flow path forming substrate 12 Pressure generation chamber 20 nozzle plate 21 nozzle opening 30 Reservoir forming substrate 40 compliance board 60 Lower electrode film 70 Piezoelectric layer 80 Upper electrode film 100 reservoir 110 drive circuit 120 external wiring 121 through hole 130 connection wiring 140 Insulation member 300 Piezoelectric element

Claims (9)

[Claims] 1. A flow path forming substrate which defines a pressure generating chamber communicating with a nozzle opening, and a pressure change in the pressure generating chamber which is provided on one surface side of the flow path forming substrate via a vibration plate. In an ink jet type recording head including a piezoelectric element to be generated, a bonding substrate bonded to the piezoelectric element side of the flow path forming substrate is provided, and a drive circuit for driving the piezoelectric element is provided on the bonding substrate. The mounted external wiring is fixed,
Further, the ink jet recording head is characterized in that the drive circuit and the lead-out wiring led out from the piezoelectric element are electrically connected via a connection wiring formed by wire bonding. 2. The ink jet recording head according to claim 1, wherein the drive circuit mounted on the external wiring is fixed to the bonding substrate. 3. The driving circuit according to claim 2, further comprising an exposed portion that exposes a part of a connection surface side of the drive circuit with the external wiring, the connection wiring being connected to the drive circuit at the exposed portion. Inkjet recording head characterized by 4. The ink jet recording head according to claim 3, wherein the exposed portion is a through hole provided in a region facing the drive circuit. 5. The ink jet recording head according to claim 3, wherein the exposed portion is provided in a region facing an outer peripheral portion of the drive circuit. 6. The ink jet recording head according to claim 1, wherein a surface of the external wiring opposite to the drive circuit is fixed to the bonding substrate. 7. The ink jet recording head according to claim 1, wherein the external wiring on which the drive circuit is mounted is fixed to the joint substrate by die bonding. 8. The pressure generating chamber according to claim 1, wherein the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed by film formation and a lithography method. An ink jet recording head characterized by being present. 9. An ink jet recording apparatus comprising the ink jet recording head according to any one of claims 1 to 8.