JP2003059871A - Ｉｃチップの製造方法 - Google Patents

Ｉｃチップの製造方法

Info

Publication number
JP2003059871A
JP2003059871A JP2001244859A JP2001244859A JP2003059871A JP 2003059871 A JP2003059871 A JP 2003059871A JP 2001244859 A JP2001244859 A JP 2001244859A JP 2001244859 A JP2001244859 A JP 2001244859A JP 2003059871 A JP2003059871 A JP 2003059871A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
chip
reinforced
resin
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001244859A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003059871A5 (cg-RX-API-DMAC7.html
Inventor
Munehiro Hatakei
宗宏 畠井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2001244859A priority Critical patent/JP2003059871A/ja
Publication of JP2003059871A publication Critical patent/JP2003059871A/ja
Publication of JP2003059871A5 publication Critical patent/JP2003059871A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
JP2001244859A 2001-08-10 2001-08-10 Ｉｃチップの製造方法 Pending JP2003059871A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001244859A JP2003059871A (ja) 2001-08-10 2001-08-10 Ｉｃチップの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001244859A JP2003059871A (ja) 2001-08-10 2001-08-10 Ｉｃチップの製造方法

Publications (2)

Publication Number Publication Date
JP2003059871A true JP2003059871A (ja) 2003-02-28
JP2003059871A5 JP2003059871A5 (cg-RX-API-DMAC7.html) 2004-12-24

Family

ID=19074720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001244859A Pending JP2003059871A (ja) 2001-08-10 2001-08-10 Ｉｃチップの製造方法

Country Status (1)

Country Link
JP (1) JP2003059871A (cg-RX-API-DMAC7.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183764A (ja) * 2003-12-22 2005-07-07 Mitsui Chemicals Inc 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
US7713846B2 (en) 2004-12-29 2010-05-11 Siliconware Precision Industries Co., Ltd. Process applied to semiconductor
WO2010077999A3 (en) * 2008-12-16 2010-10-14 Ivi Smart Technologies, Inc. Reinforced smart cards, components, & methods of making same
US7935712B2 (en) * 2005-07-19 2011-05-03 Merck Sharp & Dohme Corp. Spirochromanone derivatives as acetyl coenzyme A carboxylase (ACC) inhibitors
JP2013108049A (ja) * 2011-11-22 2013-06-06 Nitta Corp 光学用アクリル系粘着剤組成物および光学用アクリル系粘着シート、並びにこれを用いた光学部材の取り外し方法
US9221231B2 (en) 2011-11-22 2015-12-29 Samsung Display Co., Ltd. Acrylate based adhesive composition for optical use, acrylate based adhesive sheet for optical use, and method for separating optical component using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183764A (ja) * 2003-12-22 2005-07-07 Mitsui Chemicals Inc 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
US7713846B2 (en) 2004-12-29 2010-05-11 Siliconware Precision Industries Co., Ltd. Process applied to semiconductor
US7935712B2 (en) * 2005-07-19 2011-05-03 Merck Sharp & Dohme Corp. Spirochromanone derivatives as acetyl coenzyme A carboxylase (ACC) inhibitors
WO2010077999A3 (en) * 2008-12-16 2010-10-14 Ivi Smart Technologies, Inc. Reinforced smart cards, components, & methods of making same
JP2013108049A (ja) * 2011-11-22 2013-06-06 Nitta Corp 光学用アクリル系粘着剤組成物および光学用アクリル系粘着シート、並びにこれを用いた光学部材の取り外し方法
US9221231B2 (en) 2011-11-22 2015-12-29 Samsung Display Co., Ltd. Acrylate based adhesive composition for optical use, acrylate based adhesive sheet for optical use, and method for separating optical component using the same
US9598617B2 (en) 2011-11-22 2017-03-21 Samsung Display Co., Ltd. Acrylate based adhesive composition for optical use, acrylate based adhesive sheet for optical use, and method for separating optical component using the same

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