JP2003057301A - Inspection device, method of inspecting circuit board, computer program, and computer-readable recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit inspection device and a circuit inspection method capable of inspecting easily and contactlessly the quality of the whole board including a wiring pattern of a board mounted with an integrated circuit. SOLUTION: This inspection device transmits a control procedure for an IC 100, makes an 8PIN connected to a D/A circuit 37 and an A/D circuit 38, and connects a 15PIN to grounding level signal lines of the D/A circuit 37 and the A/D circuit 38. Then, a 1PIN and a 2PIN of the IC 100 are connected foldedly in a control procedure for an IC 200. The A/D circuit of the IC 100 is connected thereafter to a constant current circuit (an ID code + an external device ID code + a closingly contacting SW number) to supply an inspection signal, the 15PIN of the IC 100 is connected to an in-measuring-circuit GND (the ID code + the external device ID code + the closingly contacting SW number), the constant current circuit of the IC 100 is turned on (the ID code + the external device ID code + a D/A operation mode + a D/A output mode), and A/D measurement is indicated to an IC 1 (the ID code + the external device ID code + an A/D operation mode + an A/D measurement executing command) to detect the signal for inspection from wiring for connection inspection.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection device capable of inspecting the state of a substrate on which an integrated circuit is mounted and a substrate inspection method.

[0002]

2. Description of the Related Art A conventional board inspection apparatus mounts a board on an inspection apparatus and energizes it to detect a signal change at a board terminal to inspect whether or not the board is operating normally. Alternatively, the measuring pins are brought into contact with the integrated circuit terminals mounted on the board to detect the state of the input / output signals of the integrated circuit to inspect the quality of the operation.

[0003]

However, it is necessary to supply electricity to the substrate and supply operation signals to the input / output terminals of the substrate to inspect the operating state, which cannot be prevented from becoming a large scale. Further, it is necessary to establish an electrically connected state with the input / output unit of the board, and the inspection system has to be individually manufactured, which is not versatile.

Although it is possible to inspect whether the operation of the entire board is good or bad, it is almost impossible to detect a defective portion. Therefore, when a specific defective portion is to be detected, a wiring pattern portion or an integrated circuit on the substrate can be detected. The inspection probe has to be brought into contact with the circuit terminal and the mounted component terminal, and the inspection has been difficult unless a dedicated inspection device is provided at the board manufacturing factory.

[0005]

The present invention has been made for the purpose of solving the above-mentioned problems, and solves the above-mentioned problems. For example, non-contact inspection is possible, and not only the manufacturer but also the board delivery destination. Even if there is, it is possible to easily pass or fail,
Moreover, it is an object of the present invention to provide an inspection device and a substrate inspection method that can easily take out inspection results.

As one means for achieving the above object, for example, the following configuration is provided.

[0007] That is, an inspection device capable of inspecting a circuit board on which an integrated circuit having a unique ID number, which incorporates a circuit inspection unit for inspecting the state of the circuit, is inspected, and the integrated circuit mounted on the circuit board. According to the control procedure transmitting means for wirelessly transmitting the inspection control procedure specified by the ID number to the circuit inspection section and executing the individual control procedure for each integrated circuit, and the control procedure transmitted by the control procedure transmitting means. It is characterized in that the state of the circuit board is inspected from the inspection result receiving means for receiving inspection result information from at least one of the integrated circuits and the inspection result received by the inspection result receiving means.

And, for example, the control procedure sending means is
In order to inspect the quality of the circuit board pattern between at least two integrated circuits, the circuit inspection section of one integrated circuit section is controlled so that the circuit inspection section in the one integrated circuit connects the two circuit board patterns. And sending the control procedure for controlling the circuit inspection unit of the other integrated circuit to output the inspection signal to the circuit board pattern in the connected state, and wirelessly transmitting the detection result of the detection signal. A feature is that the control procedure is transmitted.

Further, for example, it is characterized in that the integrated circuit is provided with a power supply means for radiating an electromagnetic wave to supply driving power to the integrated circuit in a non-contact manner.

Further, in an inspection system including an inspection device in which an integrated circuit incorporating a circuit inspection unit for realizing various functions according to the inspection procedure is mounted and which supplies operation power and operation control procedure information to the integrated circuit, The circuit inspection unit of the integrated circuit is an inspection device for inspecting a state of a holding unit that holds an ID number unique to the integrated circuit and a circuit designated by the ID number that is held by the holding unit that is wirelessly transmitted. Inspection procedure recording means for receiving and recording a procedure, switching means capable of controlling connection / disconnection between circuit patterns according to the reception inspection procedure, and signal generating means for generating an inspection signal for inspecting the state of the circuit Supplying means for supplying the inspection signal generated by the signal generating means to a predetermined portion of the circuit pattern according to the reception inspection procedure, and supplying by the supplying means. A detection means for detecting the inspection signal at another pattern portion different from the supply portion of the circuit pattern to inspect the state between the circuit patterns; and a detection result transmission means for wirelessly transmitting the detection result by the detection means. The inspection apparatus includes an inspection procedure transmitting unit that transmits an inspection procedure created based on a mounting state of the integrated circuit to an integrated circuit to be executed by an ID number and transmits the inspection sequence in an execution order, and an inspection procedure transmitting unit. An inspection result receiving means for receiving an inspection result according to the inspection procedure described above, wherein the inspection procedure transmitting means is arranged to detect the quality of a circuit board pattern between at least two integrated circuits. The circuit inspecting section sends out an inspection procedure in which the circuit inspecting section in one of the integrated circuits establishes a connection state between the two circuit board patterns, and connects to the circuit inspecting section of the other integrated circuit. Wherein sending an inspection procedure for outputting an inspection signal to the circuit board pattern in,
An inspection procedure for wirelessly transmitting the detection result of the detection signal is transmitted to the circuit inspection unit of the other integrated circuit.

Furthermore, there is provided a method for inspecting a circuit board on which an integrated circuit having a unique ID number, which incorporates a circuit inspecting section for inspecting a circuit state, is mounted. The inspection control procedure specified by the ID number is wirelessly transmitted to the circuit inspection section to execute an individual control procedure for each integrated circuit, and the inspection result information according to the control procedure is received from at least one of the integrated circuits. The circuit board is inspected based on the received inspection result.

[0012] For example, the control procedure is transmitted by controlling the circuit inspecting section of one integrated circuit section to inspect whether the circuit board pattern between at least two integrated circuits is good or bad. The circuit inspection unit sends a control procedure for connecting two circuit board patterns to each other, and controls the circuit inspection unit of the other integrated circuit to output the inspection signal to the circuit board pattern in the connected state. A control procedure for transmitting the detection result of the detection signal by radio is transmitted.

An integrated circuit incorporating a circuit inspection unit for realizing various functions according to the inspection procedure is mounted, and an inspection system including an inspection device for supplying operation power and operation control procedure information to the integrated circuit is provided. A stored computer program, wherein the circuit inspection unit of the integrated circuit has signal generation means for generating an inspection signal for inspecting the state of the circuit, and is designated by an ID number unique to the held integrated circuit. An inspection procedure recording program sequence for receiving and recording an inspection procedure for inspecting the state of a circuit, a switching program sequence for controlling connection / disconnection between circuit patterns according to the reception inspection procedure, and the signal generation means. A supply program sequence for controlling the supply of the generated inspection signal to a predetermined portion of the circuit pattern according to the reception inspection procedure; A detection program sequence for detecting the inspection signal supplied by the memory sequence in another pattern portion different from the supply part of the circuit pattern and inspecting the state between the circuit patterns, and the detection result by the detection program sequence is wirelessly transmitted. A detection result transmission program sequence, wherein the inspection apparatus identifies an integrated circuit to execute an inspection procedure created based on the mounting state of the integrated circuit by an ID number, and transmits the inspection procedure transmission program sequence; An inspection result reception program sequence for receiving an inspection result according to the inspection procedure transmitted by the inspection procedure transmission program sequence,
The inspection procedure transmission program sequence includes two circuit boards in the circuit inspection unit of one integrated circuit unit for inspecting the quality of the circuit board pattern between at least two integrated circuits. An inspection procedure for sending a connection state between the patterns is sent, and an inspection procedure for outputting the inspection signal to the circuit board pattern in the connected state is sent to the circuit inspection unit of the other integrated circuit, and a circuit inspection of the other integrated circuit is performed. An inspection system capable of executing a computer program characterized by transmitting an inspection procedure for wirelessly transmitting the detection result of the detection signal to the unit.

[0014]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. In the present embodiment, when designing an integrated circuit to be inspected,
The inspection circuit is designed beforehand according to the configuration and circuit scale of the integrated circuit, and the designed inspection circuit is incorporated into the integrated circuit.
The connection pad portion, which is the input / output terminal with the outside of the integrated circuit, and the external terminal of the inspection circuit are electrically connected.

(First Embodiment) A configuration example of an integrated circuit in which the inspection circuit of the present embodiment is incorporated will be described with reference to FIG. FIG. 1 is a diagram for explaining the configuration of an integrated circuit incorporating an inspection circuit according to an embodiment of the present invention.

In FIG. 1, 10 is an integrated circuit (IC) chip (die), 11 is a connection pad provided on the IC chip 10, 15 is an IC circuit wiring, and 20 is an integrated circuit (I).
C circuit), 30 is an inspection circuit, and 40 is an inspection wiring.

In FIG. 1, the inspection circuit 30 is shown as if it is constructed completely different from the IC circuit 20, but in reality, a part of the IC circuit is occupied in the IC circuit. And inspect circuit pattern to other IC
It is formed separately from the circuit pattern. However, it goes without saying that it may be mounted on a completely different chip.

Then, as shown in FIG. 1, the IC circuit wiring and the inspection wiring are connected in the vicinity of all the connection pads 11.

FIG. 2 shows the detailed structure of the inspection circuit of this embodiment. FIG. 2 is a diagram showing a detailed configuration of the inspection circuit and a schematic configuration of the inspection device according to the present embodiment. The inspection circuit 30 of the present embodiment can perform an inspection independently without being supplied with operating power from an IC circuit or the like.
For example, even after the IC circuit is mounted on the board, the board alone can inspect the quality.

In FIG. 2, reference numeral 31 is a power reception unit.
It has a power receiving function of receiving an electromagnetic wave to generate inspection circuit driving power and supplying it to each component of the inspection circuit 30, and a receiving function of receiving inspection circuit operation control procedure information described in detail later.

For this reason, the power receiving / receiving section 31 has a receiving antenna section for receiving an electromagnetic wave (for example, including a resonance circuit including a coil for selectively receiving an electromagnetic wave of a predetermined frequency).
That is, the power receiving function receives an electromagnetic wave from a power supply / transmission / reception antenna of an inspection device (not shown) such as a high frequency (microwave, millimeter wave, submillimeter wave) signal of a predetermined frequency by electromagnetic induction, electrostatic coupling, etc. Is converted into electric power and used as driving power for the inspection circuit. Further, the receiving function receives the operation sequence command information from the inspection device (not shown), the code information unique to the inspection circuit, etc., and outputs it to the decoder 32.

Reference numeral 32 denotes a decoder which receives and decodes the inspection circuit operation control procedure information received by the power receiving / receiving unit 31 and outputs it to the control logic 33. The code information received by the power receiving / receiving unit 31 is pre-allocated to its own circuit. If the received code is the unique code, the control logic 33 is activated, and subsequently received control procedure information is decoded and sent to the control logic.

Reference numeral 33 receives the operation control procedure information from the decoder 32 and performs control according to the control procedure.
When the control procedure to be received is complicated and a large number of controls are collectively performed, the control procedure is stored in the control procedure storage unit 34.
It is also possible to control the entire control of the inspection circuit 30 according to the control procedure stored in the control procedure storage unit 34.

Reference numeral 35 is an inspection circuit 3 from the control logic 33.
An encoder that receives and encodes the inspection result of 0 and transmits from the transmission unit 39 to an inspection device (not shown), for example, by a microwave of a frequency assigned to the inspection circuit,
36 is each inspection wiring 4 under the control of the control logic 33.
It is an analog switch (analog SW) capable of controlling connection / disconnection for each individual wiring of 0.

Reference numeral 37 is a test signal which is output from the control logic 33 as a digital signal to the test signal line 40 and is converted into a corresponding analog signal to be closed (connected) by the analog switch 36. It is a digital-analog converter (D / A) that outputs to wiring.

An analog signal 38 converts an analog signal corresponding to the inspection signal received from the inspection wiring 40 through the analog switch 36 into a corresponding digital signal under the control of the control logic 33 and outputs the digital signal to the control logic 33. Digital converter (A / D), 39 is encoder 35
It is a transmission unit that transmits inspection result information and the like output from the device as a wireless signal.

Reference numeral 200 denotes an inspection apparatus main body. The inspection apparatus main body 200 has a display section 210 capable of displaying inspection instructions and inspection results, an operation section 220 for inputting various instructions, an electromagnetic wave such as a high frequency ( Microwave, millimeter wave,
(E.g. submillimeter wave) signal is emitted and inspection circuit operation power and inspection circuit operation control instruction command are transmitted without contact,
The power supply / transmission antenna 230 for receiving the inspection result information from the inspection circuit is provided.

The inspection circuit 30 having the above configuration is incorporated in an integrated circuit by the following procedure. First, when designing and manufacturing an integrated circuit, an IC maker, who designs and manufactures the integrated circuit, requests the inspection circuit creator to install the inspection circuit (code application) after designing the integrated circuit.

Upon receipt of this request (code application) for incorporating the inspection circuit, the inspection circuit creating side designs an inspection circuit pattern to be incorporated in the integrated circuit, and the pattern connected to the output terminal portion of the integrated circuit to be inspected and the inspection circuit concerned. Peculiar I
Issue D code.

As a result, the inspection circuit shown in FIG. 1 is incorporated in the integrated circuit. This makes it possible to inspect an integrated circuit, for example, a package.

The above code application from the IC maker can be made by hand or by mail, but it can also be made online, for example, via the Internet. In this case, it is possible to avoid unauthorized use by others by encrypting and transmitting various information.

An integrated circuit inspection method using the inspection circuit 30 of the present embodiment having the above configuration will be described below with reference to the flowchart of FIG. 3 and FIG. FIG. 3 is a flow chart for explaining integrated circuit inspection control using the inspection circuit of the present embodiment, and FIG. 4 is a diagram for explaining an integrated circuit inspection method by the inspection circuit 30 of the present embodiment. .

In FIG. 4, reference numeral 40 denotes the connection pad 11 provided on the IC chip 10 and the integrated circuit package 100.
4 is an example of wire bonding for electrically connecting the connection patterns to the output terminal 110 of FIG. 4, and the example of FIG. 4 is an example in which the output terminal 6 (6 pin) and the output terminal 7 (7 pin) are short-circuited. Shows.

An integrated circuit inspection method incorporating the inspection circuit 30 designed according to the above-mentioned code application of the present embodiment will be described below with reference to the flowchart of FIG.

First, in step S1, the inspection apparatus is controlled to emit an electromagnetic wave having a desired frequency, for example, a high frequency (microwave, millimeter wave, submillimeter wave) signal to the integrated circuit shown in FIG. This high frequency signal is the inspection circuit 3
The power is received by the power reception unit 31 of 0 and is supplied to each component, for example, the decoder 32 as driving power of the inspection circuit 30 to make the inspection circuit 30 operable.

Next, in step S2, the inspection device 20
0 is a communication enable / disable signal (communication enable / disable command) for an integrated circuit incorporating a code unique to each integrated circuit issued in response to a code application at the time of designing the integrated circuit to be inspected.
To send.

It is to be noted that, thereafter, a code unique to the inspection circuit is added to the information to the inspection circuit and transmitted, and the inspection circuit recognizes the unique code information and the inspection device 20.
In the information from 0, the information including the code information that matches the code for recognizing the own circuit is fetched as the information addressed to the own circuit.

Then, the inspection device 200 of the present embodiment example
In the subsequent step S3, monitors the response from the inspection circuit to which the unique code that received the communication enable / disable signal is assigned. In the decoder 32 of the inspection circuit 30 incorporated in the integrated circuit whose power supply is started in step S1, does the information received by the power receiving / receiving unit 31 include the code information uniquely assigned to the circuit itself ( Whether the code is detected) is monitored, and if the information received by the power reception unit 31 includes code information uniquely assigned to the own circuit, the control logic 33 is activated, The control logic activates the encoder 35 to generate an inspection circuit communicable response for notifying that the own circuit is activated and the inspection according to the instruction from the inspection apparatus 200 is possible, and transmits it from the transmission unit 39.

If the inspection circuit 200 does not send the inspection circuit communicable response from the target inspection circuit 20 within the predetermined time in step S3, the inspection circuit is not powered, or the inspection circuit does not operate. Assuming that there is a cause, the process proceeds to step S4 and error processing is performed.

On the other hand, the inspection apparatus 200 proceeds to step S5 when an inspection circuit communicable response is sent from the target inspection circuit 20 in step S3 within a predetermined time.
To the responding inspection circuit, a connection command for instructing to connect the end inspection wiring and the adjacent wiring is first transmitted.

Upon receipt of this instruction, the control logic 33 of the corresponding inspection circuit stores the received command in the control procedure storage unit 34 as necessary and shifts to the mode for executing the control procedure according to the received command. This is the same when other commands are received.

In this case, the analog SW 36 is instructed to simultaneously close and inspect the switch circuit connected to the inspection wiring at the end and the inspection wiring at the end of the uninspected wiring adjacent to the inspection wiring. Control the circuit to be in conduction. For example, in the example of FIG. 4, the switch circuit of the connection wiring to the 6th pin and the connection wiring to the 7th pin are closed.

The inspection apparatus 200 instructs the connection inspection wiring to output an inspection signal in the subsequent step S6. In the inspection circuit that receives this instruction, the inspection wiring is connected to the D / A circuit 37, and an oscillation signal of a predetermined frequency is supplied to the connected inspection wiring. In the example of FIG. 4, pin 6 is D / A
Control is performed by connecting to the circuit 37 and outputting a test signal from the D / A circuit 37.

Subsequently, the inspection apparatus 200 waits for a certain period of time in step S7, and then transmits an inspection signal detection instruction command from the inspection wiring to the inspection circuit. The inspection circuit which receives this stores the received command in the control procedure storage unit 30 as necessary, and executes the process corresponding to the received command. For example, the control logic 33 connects the A / D circuit 38 to the inspection wiring at the end similarly to the D / A circuit 37 according to the received command, and at the same time, connects the uninspected wiring adjacent to the inspection wiring (in the example of FIG. 4, 7 pin connection wiring) to D / A circuit 3
7 (and A / D circuit 38) circuit-less ground wire (GND)
Connect to. This makes it possible to detect the inspection signal from the inspection wiring. Then, the A / D circuit 38 is activated to execute the inspection signal detection processing from the connection inspection wiring.

The process of connecting the wiring to each circuit may be carried out at any one of step S5 and step S6, or may be performed astride. It suffices that the A / D circuit 38 be controlled to be in the inspectable state before being activated.

The inspection apparatus 200 then transmits an inspection signal output stop instruction command after the time required for detection has elapsed in step S8. The inspection circuit which receives this stores the received command in the control procedure storage unit 30 as necessary, and executes the process corresponding to the received command. Here, the control logic 33 executes a process of stopping the output of the inspection signal from the D / A circuit 37 to the connection inspection wiring according to the received command.

In step S9, the inspection device 200 transmits an inspection result transmission instruction command instructing the inspection circuit to transmit the detection result of the inspection signal detection processing performed according to the instruction command transmitted in step S7 to the device itself. To do.

Upon receipt of this, the inspection circuit stores the received command in the control procedure storage unit 30 as necessary and executes the processing corresponding to the received command. In this case, the control logic 33 confirms the output signal level from the A / D circuit 38, and transmits the inspection signal detection result (including the detection level information) from the inspection wiring via the encoder 35 and the transmission unit 39. To do. Code information unique to the own circuit is added to this transmission information and transmitted.

In the next step S10, the inspection device receives the detection result information sent from the corresponding inspection circuit in response to the transmission instruction command in the previous step S9. When this information is received, the inspection circuit is instructed to deactivate the D / A circuit 37 and stop the output of the inspection signal.

After that, the signal received and output from the inspection wiring corresponding to the inspection signal output from the inspection circuit is examined, and the resistance value between the inspection wiring and the adjacent wiring is measured. Then, it is determined whether or not the resistance value is equal to or lower than a predetermined resistance value (almost conductive). If it is less than the predetermined value, the process proceeds to step S11, and the A / D circuit 3
It is determined that the inspection wiring controlled to the ground level of 8 and the adjacent wiring and the inspection wiring connected to the D / A circuit 37 are short-circuited (short circuit), and the process proceeds to step S13.

On the other hand, if the inspection signal is detected from the adjacent wiring in step S10, it is determined that there is no short circuit between the inspection wiring and the adjacent wiring, and the process proceeds to step S13.

In step S13, it is determined whether or not the inspection signal has been output to all the inspection wirings of the inspection circuit (to all the terminals of the integrated circuit incorporating the inspection circuit).
When the inspection signal is output to all the inspection wirings of the inspection circuit, the inspection of the inspection circuit is completed, so the processing is terminated, and if there is a short circuit between the inspection wirings, it is determined that the circuit is defective.

On the other hand, when the inspection signal is not output to all the inspection wirings of the inspection circuit in step S13, the process proceeds to step S14 and the uninspected inspection wirings connected to the inspection circuit, that is, Next, a connection command instructing to connect an uninspected inspection wiring adjacent to the inspection wiring to be inspected into the inspection circuit is transmitted.

Upon receipt of this instruction, the control logic 33 of the corresponding inspection circuit stores the received command in the control procedure storage unit 34 as necessary and shifts to the mode for executing the control procedure according to the received command. In this case, the analog SW 40 is controlled to close the switch circuit corresponding to the inspection wiring to be inspected next. For example, pin 8 in FIG. 4 is the control target wiring.

Then, in step S15, the inspection device 200
Transmits a connection opening instruction command for instructing the opening of the inspected inspection wiring connected to the D / A circuit 37 of the inspection circuit.

Upon receipt of this instruction command, the control logic 33 of the corresponding inspection circuit stores the received command in the control procedure storage unit 34 as necessary and shifts to the mode for executing the control procedure according to the received command. In this case, the analog SW 36 is instructed to open the switch circuit connected to the inspection wiring that has been inspected (6-pin connection wiring in the example of FIG. 4) to bring the inside of the inspection circuit into a disconnected state.

Then, in the subsequent step S16, the inspection device 20
0 transmits a command for setting an uninspected inspection wiring adjacent to the inspected wiring as a new inspection wiring. Control logic 3 of the corresponding inspection circuit that received this command
3, the received command is sent to the control procedure storage unit 3 as necessary.
4 and simultaneously shifts to a mode in which a control procedure according to the received command is executed. In this case, analog SW3
6, the uninspected inspection wiring (7 pins in the example of FIG. 4) adjacent to the inspected wiring is connected to the D / A circuit 37 like the 6-pin connection wiring of FIG. And step S6
Proceed to.

As described above, according to the present embodiment, a test circuit is incorporated in the integrated circuit in advance, a unique code is assigned to the test circuit, and the driving power of the test circuit and the test control procedure are all externally contactless. Then, the inspection circuit starts its operation by the supplied drive power, receives the control procedure supplied to its own circuit, and can perform the inspection according to the received control procedure.

Therefore, the inspection apparatus can supply the inspection circuit with a control procedure corresponding to the state of the inspection object and execute the inspection procedure. Also, the optimum inspection that can respond flexibly will be realized.

Further, even if a circuit defect is found, different inspection control depending on the circuit state can be executed in some cases, and an integrated circuit inspection excellent in versatility can be performed.

Since the operating power of the inspection circuit can be directly supplied to the inspection circuit, the inspection can be performed without any problem even when the integrated circuit to be inspected is not supplied with power, and the integrated circuit can be inspected. Of course, it is possible to inspect even if it is not connected to a power source or the like independently.

Therefore, if the inspection device is brought in, the inspection target can be inspected not only at the production plant but also at the customer's place or the sales store.

Further, since the inspection can be carried out without contact, positioning of the inspection object becomes almost unnecessary. Furthermore, a unique code is assigned in advance to each inspection circuit, and only a specific inspection circuit can be extracted and inspected according to this unique code. For example, circuit inspection in a flow operation is also possible.

(Second Embodiment) The above description has described the example of the inspection of the integrated circuit alone by the inspection circuit incorporated in the integrated circuit. However, the present invention is not limited to the above examples. For example, electric power required for inspection can be supplied to each integrated circuit in a non-contact manner, and different inspection control can be performed for each inspection circuit unit of a plurality of integrated circuits. It is also possible to inspect the quality of the electric circuit.

Further, the integrated circuit control procedure of the inspection circuit can be supplied from the outside of the inspection circuit. For this reason,
In addition to the inspection by the integrated circuit alone, the inspection circuits incorporated in the integrated circuits work together (integrated) even after the integrated circuits are mounted on the board. The quality including the pattern can be judged.

An inspection circuit system in which the inspection circuits of the second embodiment according to the present invention jointly perform an inspection including the assembly substrate will be described below with reference to FIG. FIG. 5 is an overall conceptual diagram of an inspection circuit system in which the inspection circuits of the second embodiment according to the present invention jointly perform an inspection including the assembly substrate.

As shown in FIG. 5, in the second embodiment as well, the procedure until the inspection circuit is incorporated in the integrated circuit may be exactly the same as in the case of the first embodiment described above, and the integrated circuit is designed. When an IC maker manufactured by designing an integrated circuit designs an integrated circuit, a request (code application) for incorporating an inspection circuit that presents a circuit pattern of the designed integrated circuit is applied to the inspection circuit maker.

The inspection circuit maker who has received this code application designs an inspection circuit to be incorporated in the IC shown in FIG. 2 and gives a unique ID code to the inspection circuit, so that the inspection circuit pattern and the ID code are integrated into the IC. Issue to the manufacturer.

The IC manufacturer incorporates (makes) the issued inspection circuit pattern into the integrated circuit, completes the integrated circuit design, and commercializes it. Then, it is commercialized as an integrated circuit in which the inspection circuit specified by the ID code is incorporated.
The control of the above-described first embodiment makes it possible to inspect the integrated circuit alone (package inspection).

An assembly maker that manufactures an electronic circuit board having a desired function by purchasing this integrated circuit selects and determines the type of integrated circuit to be mounted, and designs the circuit board using the selected integrated circuit. . Then, when the design of the circuit board is almost completed, the configuration of the electronic circuit board,
Apply to the inspection circuit maker to issue the circuit board inspection data considering the circuit pattern with the circuit pattern information and mounted component information attached.

The inspection circuit maker that has received the code application from the assembly maker analyzes the entire structure of the assembly substrate, the wiring condition between the integrated circuits, and the like to check the inspection method of the assembly substrate, and checks the inspection circuit of each integrated circuit. The board inspection method is established by examining how to operate the board to determine the board inspection procedure. Then, an inspection control procedure is created for each integrated circuit according to the established board inspection method.

Then, the inspection data including the board inspection execution procedure information for executing the inspection control procedure differently for each created integrated circuit and the inspection result information is issued and transmitted to the assembly maker.

The assembly maker, which has received the inspection data including the inspection control procedure, stores the received inspection data in the inspection device and sequentially specifies the ID code for each integrated circuit to be inspected at the time of actually executing the inspection. Each circuit outputs its own inspection procedure and controls the inspection circuit according to the inspection procedure.

In this case, each integrated circuit mounted on the board to be inspected interlocks to execute the circuit inspection. As described above, the execution procedure of the board to be inspected is wirelessly transmitted from the antenna of the inspection procedure and is the same as the designated ID.
It is received only by the integrated circuit to which D is assigned, and is recorded and executed as needed.

The above code application from the assembly maker can also be made online via the Internet. In this case, it is possible to avoid unauthorized use by others by encrypting and transmitting various information. Of course, it can be done by hand or by mail.

Even after the plurality of integrated circuits are mounted on the substrate, the inspection circuits incorporated in the plurality of integrated circuits cooperate (integrate) with each other to determine whether or not the mounting wiring pattern of the substrate is included. A second embodiment according to the present invention which can judge whether or not is described below with reference to FIG. FIG. 6 is a diagram for explaining the quality inspection including the substrate pattern according to the second embodiment of the present invention.

In the example of FIG. 6, a case where the integrated circuit 100 and the integrated circuit 200 perform a circuit test in cooperation with each other for simplification of the description, and the resistor 300 is arranged between both resistors will be described as an example. To do. However, it goes without saying that the second embodiment can be applied to any circuit wiring.

Also in the second embodiment, the supply of the inspection control procedure to the integrated circuit is the same as the control shown in FIG. 3 of the first embodiment.

When the inspection shown in FIG. 6 is performed, the inspection apparatus transmits a control procedure for the integrated circuit 100 to cause the analog switch 36 to have 8 pins, the D / A circuit 37, and the A / D circuit 38 as the first. Connection is made in the same manner as in the embodiment, and pin 15 is connected to the ground level signal lines of the D / A circuit 37 and A / D circuit 38.

Then, in the control procedure for the integrated circuit 200, the integrated circuit 10 is set to the analog switch 36.
The 1 pin connected to the 3 pin of 0 via the resistor 300 and the 2 pin connected to the pin of the integrated circuit 100 are connected and controlled to be folded.

The detailed procedure of the inspection control of the circuit shown in FIG. 6 using the two integrated circuits by the inspection device will be described below with reference to FIG. FIG. 7 is a flow chart for explaining the inspection control of the mounting board according to the second embodiment.

In step S21, both integrated circuits (hereinafter referred to as "I
Electromagnetic waves are supplied to the ICs on the substrate centering on "C") in a non-contact manner to start feeding. As a result, the inspection circuit in each IC is brought into an operating state, and is prepared for reception of a control procedure including its own circuit ID.

Subsequently, in step S22, the IC10
A communication availability confirmation signal (ID code of IC 100 + external device ID code + reception availability command) is transmitted to 0. If the IC 100 that receives the request sends a communication enable response (external device ID code + IC1 ID code + operation enable response code) if communication is possible. Therefore, the subsequent step S2
At 3, the reception of this communication enable response is monitored. If it is not sent within the fixed time, the process proceeds to step S24, and a predetermined error process is performed.

On the other hand, when the communication enable response from the IC 100 is confirmed in step S23, the process proceeds to step S25 and the IC
200 communication availability confirmation signal (ID code + external device ID
Send code + command to receive or not to receive. If the IC 200 receives this, and if communication is possible, it transmits a communication enable response (external device ID code + IC1 ID code + operation enable response code). For this reason, in subsequent step S26, it is monitored that the communication enable response is sent. If it is not sent within the fixed time, the process proceeds to step S24, and a predetermined error process is performed.

On the other hand, when the communication enable response from the IC 200 is confirmed in step S26, the process proceeds to step S27 and the IC
Instruct to analog SW of 200 (ID code + external device I
(D code + SW number to be closed) 1PIN and 2PIN
Sends the control procedure to the connection state where is short-circuited.

Then, in a succeeding step S28, the 8PIN of the IC 100 is connected to the constant current circuit output (D / A) (ID code + external device ID code + SW number to be closed / closed), and a test signal is supplied to the test circuit pattern.

Next, in step S29, the A / D of the IC100 is performed.
The circuit is connected to a constant current circuit (ID code + external device ID code + SW number to be closed / closed), and IC100
Connect the 15PIN to GND in the measurement circuit (ID code +
External device ID code + SW number to be closed / closed) to prepare for detection of inspection signal. Then, the constant current circuit of the IC100 is turned on (ID code + external device ID code + D / A operation mode + D / A output value), and after waiting for a certain time, IC1
To instruct A / D measurement (ID code + external device ID code + A / D operation mode + A / D measurement execution command) to instruct inspection signal detection from the connection inspection wiring.

Next, in step S30, the A / D is added to the IC 100.
The measurement value is instructed to be transmitted (ID code + external device ID code + A / D measurement value transmission command), and the inspection result is instructed to be transmitted. Then, in step S31, I
The A / D value sent from the C100 is received (ID code of external device + ID code of IC1 + A / D measurement value).

When the inspection result is received, the constant current circuit of the IC 100 is turned off (ID code +
The external device ID code + D / A operation mode + D / A output value) is given to give an instruction to stop the inspection signal output. In subsequent step S33, all the analog SWs of IC100 are turned off (ID
Code + external device ID code + SW all OFF command).

Next, in step S34, the resistance value of the circuit pattern is calculated from the detection result information using Ohm's law (V = IR), and it is determined whether the resistance value is within a predetermined range. However, I is the output value of the constant current circuit, and V is the measured value of A / D. If it is within the range of predetermined standard values, the process proceeds to step S35, and it is determined that the inspection pattern portion is normal. After that, if the next pattern is to be inspected, the process of FIG. 7 is performed again, and the next circuit pattern folding control and inspection signal supply control are performed.

On the other hand, if the inspection result is not within the predetermined range in step S34, a defective state is displayed to inform the user.

As described above, according to the second embodiment, not only the integrated circuit alone can be inspected, but also the quality of the entire substrate including the wiring pattern of the integrated circuit mounting substrate can be inspected easily and in a non-contact manner. Moreover, in the inspection, it is not necessary to supply operating power to the board, and the board state removed from the machine can be easily and surely checked. Therefore, even at the user site, reliable inspection is possible.

At this time as well, there is only one I depending on the ID number.
A desired inspection control procedure can be selectively transmitted only to C and executed, different inspection control can be executed for each IC, and inspection control can be executed in cooperation with each other. The inspection can also be applied by simply changing the control procedure information (inspection data) stored in the inspection device.

[0094]

As described above, according to the present invention, it is possible to cause the integrated circuits to carry out independent inspection control, so that not only the integrated circuits can be inspected, but also the integrated circuits cooperate to implement the integrated circuits. The quality of the entire substrate including the wiring pattern of the substrate can be easily inspected without contact. Moreover, in the inspection, it is not necessary to supply operating power to the board, and the board state removed from the machine can be easily and surely checked. Therefore, even at the user site, reliable inspection is possible.

Further, since the operating power of the inspection circuit can be directly supplied to the inspection circuit in a contactless manner, the inspection can be performed without any problem even when the integrated circuit to be inspected is not supplied with power. .

Therefore, if the inspection device is brought in, the inspection target can be inspected not only at the production plant but also at the customer's site or the sales store.

Furthermore, since the inspection can be performed without contact, positioning of the inspection object is almost unnecessary.

[Brief description of drawings]

FIG. 1 is a diagram for explaining the configuration of an integrated circuit in which an inspection circuit according to an embodiment of the present invention is incorporated.

FIG. 2 is a diagram showing a detailed configuration of a schematic configuration of a test circuit and a test device according to the present embodiment.

FIG. 3 is a flow chart for explaining integrated circuit inspection control using the inspection circuit of the present embodiment.

FIG. 4 is a diagram for explaining an integrated circuit inspection method by the inspection circuit 30 according to the present embodiment.

FIG. 5 is an overall conceptual diagram of an inspection circuit system in which inspection circuits of a second embodiment according to the present invention jointly perform an inspection including an assembly substrate.

FIG. 6 is a diagram for explaining a quality inspection including a substrate pattern according to a second embodiment of the present invention.

FIG. 7 is a flowchart for explaining inspection control of a mounting board according to a second embodiment.

[Explanation of symbols]

10 Integrated circuit (IC) chip (die) 11 connection pad 15 IC circuit wiring 20 Integrated circuits (IC circuits) 30 inspection circuit 31 Power receiving unit 32 decoder 33 Control logic 34 Control procedure storage 35 encoder 36 Analog Switch (Analog SW) 37 Digital-Analog Converter (D / A) 38 Analog-digital converter (A / D) 39 Transmitter 40 inspection wiring 200 Inspection device body 210 display 220 Operation part 230 power supply / reception antenna

Claims (10)

[Claims] 1. An inspection apparatus capable of inspecting a circuit board on which an integrated circuit having a unique ID number, which incorporates a circuit inspection unit for inspecting a circuit state, is inspected, the integrated circuit being mounted on the circuit board. According to the control procedure transmitting means for wirelessly transmitting the inspection control procedure specified by the ID number to the circuit inspecting section to execute an individual control procedure for each integrated circuit, and the control procedure transmitted by the control procedure transmitting means. An inspection apparatus for inspecting a state of a circuit board from an inspection result receiving unit that receives inspection result information from at least one of the integrated circuits, and an inspection result received by the inspection result receiving unit. 2. The control procedure sending means controls the circuit inspecting section of one integrated circuit section to inspect the quality of a circuit board pattern between at least two integrated circuits to control the circuit in one integrated circuit. The inspection unit sends out a control procedure for making a connection state between two circuit board patterns, and sends a control procedure for controlling the circuit inspection unit of the other integrated circuit to output the inspection signal to the connected circuit board pattern. Then, the inspection device according to claim 1, wherein a control procedure for wirelessly transmitting the detection result of the detection signal is transmitted. 3. The inspection apparatus according to claim 1, further comprising a power supply unit that radiates an electromagnetic wave to the integrated circuit to supply driving power to the integrated circuit in a contactless manner. 4. An inspection system comprising an integrated circuit in which a circuit inspection unit for realizing various functions according to an inspection procedure is installed, and an inspection device configured to supply operation power and operation control procedure information to the integrated circuit, The circuit inspection unit of the integrated circuit is an inspection device for inspecting a state of a holding unit that holds an ID number unique to the integrated circuit and a circuit designated by the ID number that is held by the holding unit that is wirelessly transmitted. Inspection procedure recording means for receiving and recording a procedure, switching means capable of controlling connection / disconnection between circuit patterns according to the reception inspection procedure, and signal generating means for generating an inspection signal for inspecting the state of the circuit Supply means for supplying the inspection signal generated by the signal generating means to a predetermined portion of the circuit pattern according to the reception inspection procedure, and the inspection signal supplied by the supplying means. A detecting means for enabling inspection of the state between the circuit pattern of the supply portion of the circuit pattern signal is detected by different other pattern portion,
A detection result transmitting unit that wirelessly transmits the detection result of the detection unit, and the inspection apparatus identifies and executes an inspection procedure created based on a mounting state of the integrated circuit as an integrated circuit to be executed by an ID number. An inspection procedure transmitting means for sequentially transmitting and an inspection result receiving means for receiving an inspection result according to the inspection procedure transmitted by the inspection procedure transmitting means, wherein the inspection procedure transmitting means is a circuit between at least two integrated circuits. In order to inspect the quality of the board pattern, the circuit inspecting section of one integrated circuit section sends out an inspecting procedure in which the circuit inspecting section in one integrated circuit establishes a connection state between two circuit board patterns, and the other is integrated. An inspection procedure for outputting the inspection signal to the circuit board pattern in the connected state is sent to the circuit inspection unit of the circuit, and the detection signal of the detection signal is connected to the circuit inspection unit of the other integrated circuit. Inspection system, characterized by the transmission of the inspection procedure to be wirelessly transmitted. 5. The inspection system according to claim 4, wherein an electromagnetic wave is emitted from the inspection device to supply drive power to the integrated circuit in a non-contact manner so that the circuit board can be inspected independently. 6. A method of inspecting a circuit board on which an integrated circuit having a unique ID number, which incorporates a circuit inspection unit for inspecting a circuit state, is mounted, wherein the circuit of the integrated circuit mounted on the circuit board is included. The inspection control procedure specified by the ID number is wirelessly transmitted to the inspection unit to execute an individual control procedure for each integrated circuit, and the inspection result information according to the control procedure is received from at least one of the integrated circuits, A method for inspecting a circuit board, which comprises inspecting the state of the circuit board based on the received inspection result. 7. The control procedure is transmitted by controlling the circuit inspecting unit of one integrated circuit unit to inspect the quality of a circuit board pattern between at least two integrated circuits, and controlling the circuit in the one integrated circuit. The inspection unit sends out a control procedure for making a connection state between two circuit board patterns, and sends a control procedure for controlling the circuit inspection unit of the other integrated circuit to output the inspection signal to the connected circuit board pattern. 7. The method of inspecting a circuit board according to claim 6, further comprising transmitting a control procedure for wirelessly transmitting the detection result of the detection signal. 8. The circuit board according to claim 6 or 7, wherein electromagnetic waves are radiated from the inspection device to supply drive power to the integrated circuit in a non-contact manner so that the circuit board alone can inspect. Inspection method. 9. An inspection system comprising an integrated circuit in which a circuit inspection unit for realizing various functions according to an inspection procedure is mounted and which is provided with an inspection device for supplying operating power and operation control procedure information to the integrated circuit. A stored computer program, wherein the circuit inspection unit of the integrated circuit has signal generation means for generating an inspection signal for inspecting the state of the circuit, and is designated by an ID number unique to the held integrated circuit. An inspection procedure recording program sequence for receiving and recording an inspection procedure for inspecting the state of a circuit, a switching program sequence for controlling connection / disconnection between circuit patterns according to the reception inspection procedure, and the signal generation means. A supply program sequence for controlling the supply of the generated inspection signal to a predetermined portion of the circuit pattern according to the reception inspection procedure, and the supply program. A detection program sequence for detecting the inspection signal supplied by the other pattern portion different from the supply part of the circuit pattern to inspect the state between the circuit patterns, and a detection result for wirelessly transmitting the detection result by the detection program sequence. A transmission program sequence, wherein the inspection apparatus identifies an integrated circuit to execute an inspection procedure created based on a mounting state of the integrated circuit by an ID number and transmits the inspection procedure transmission program sequence; An inspection result reception program sequence for receiving inspection results according to the inspection procedure transmitted by the inspection procedure transmission program sequence, wherein the inspection procedure transmission program sequence inspects the quality of the circuit board pattern between at least two integrated circuits. In order to prevent the circuit inspecting section of one integrated circuit section from intervening between two circuit board patterns in the circuit inspecting section of the one integrated circuit. A test procedure for sending a connection state is sent, a test procedure for outputting the test signal to the circuit board pattern in the connected state is sent to the circuit test section of the other integrated circuit, and the test procedure is sent to the circuit test section of the other integrated circuit. A computer program stored in an inspection system, which transmits an inspection procedure for wirelessly transmitting a detection result of a detection signal. 10. A computer-readable recording medium on which a computer program for realizing the functions according to claim 6 is recorded.