JP3107798B2 - Inspection equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an inspection apparatus for performing a function inspection of a semiconductor device formed on a wafer substrate in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art A conventional semiconductor device inspection apparatus is shown in FIGS. The inspection apparatus shown in FIG. 5 includes a prober 3 having a stage 2 for mounting a wafer substrate 1 on which a semiconductor device to be inspected is formed, a test head 5 for attaching a probe card 4, and a tester 6. On the wafer substrate 1, as shown in FIG.
A semiconductor device 7 is formed. In many cases, a plurality of such semiconductor devices 7 are formed on one wafer substrate 1. Here, one semiconductor device 7 will be described. A plurality of contact points 8 are formed on the semiconductor device 7. The arrangement of the contact points 8 differs depending on the shape of the semiconductor device 7 and the internal circuit configuration.

On the other hand, the probe card 4 has a ring 10 fitted in the center of a substrate 9 as shown in FIG. The ring 10 has a rectangular or circular window corresponding to the semiconductor device 7, and a plurality of metal probe needles 11 are fixed around the window. FIG.
FIG. 3 is a diagram of the probe card 4 set in the inspection apparatus as viewed from below. Each of the plurality of probe needles 11 is arranged at a position corresponding to each contact point 8 on the semiconductor device 7. The probe needles 11 are connected to the tester 6 via wires (not shown) provided on the substrate 9 and wires in the test head 5, respectively. The tester 6 is to perform an electrical inspection of the contact point 8 with which the probe needle 11 has contacted.

The prober 3 has a function of moving the stage 2 and automatically adjusting the relative position between the semiconductor device 7 on the wafer substrate 1 and the probe card 4. The position of the prober 3 is adjusted so that each probe needle 11 of the probe card 4 comes into contact with each contact point 8 of the semiconductor device 1. However, the arrangement of the semiconductor device 7 of the type to be inspected must be stored in the prober 3 in advance.

[0005] The operation of the above inspection apparatus will be described below.
First, the wafer base 1 is set on the stage 2 and the probe card 4 of a type suitable for the type to be inspected is mounted on the test head 5. When you start the inspection device,
The prober 3 moves the stage 2 to adjust the position of the semiconductor device 7 on the wafer base 1 with respect to the probe card 4. The prober 3 moves the stage 2 in the horizontal direction so that the semiconductor device 7 is located directly below the probe needle 11 of the probe card 4. Then, the stage 2 is moved upward to bring the probe needle 11 fixed to the ring 10 into contact with the contact point 8. When the probe needle 11 comes into contact with the contact point 8 of the semiconductor device 7, the tester 6 determines whether the semiconductor device 7 is good or bad.

[0006] As described above, when the pass / fail of one semiconductor device 7 is determined, the prober 3 sets the stage 2
Is moved vertically and horizontally, and the functions of the semiconductor devices 7 on one wafer substrate 1 are measured one after another. The measurement result of the tester 6 is transmitted to the prober 3, and from the prober 3,
It is output to a monitor or CPU. The defective product determined by the tester 6 can be confirmed on a monitor.
The prober 3 may be provided with an inker for marking a defective device. This inker is controlled by a control mechanism (not shown) connected to the prober 3.
Mark defective products with red ink. In this way, the detected defective product is discarded without proceeding to the next step.

In the above-described inspection apparatus, a probe card 4 suitable for the type to be inspected is used. However, in the inspection of the same type, one probe card 4 is used repeatedly. Reusing one probe card 4 in this way means using the same probe needle 11 many times. The probe needle 11 is worn and deformed due to repeated contact with the contact point 8. If the probe needle 11 becomes severely deformed by abrasion, the contact with the contact point 8 of the semiconductor device 7 becomes unstable or partially insufficient, so that reliable inspection cannot be performed. is there. Therefore, the probe card 4 must be replaced before the probe needle 11 is severely deformed by abrasion. In practice, a new probe card is replaced every predetermined number of times of use.

Further, even when the probe card 4 has not been used a predetermined number of times, the probe needle 11 of the probe card 4 may be bent or repaired. When the probe needle 11 is repaired, depending on the type of repair, the probe card 4 can be used even if it exceeds the original predetermined number of times of use, or on the contrary, the service life is shortened. . Therefore, the repair history also affects the replacement time of the probe card 4.

[0009]

As a guideline for replacing the probe card, it is necessary to manage the number of times each probe card is used and sometimes the repair history of the probe card. Therefore, a record book for each probe card is provided, and the number of uses and the repair history are described therein. Then, the above-mentioned record book is managed in pairs with each probe card. However, each time a semiconductor device is inspected, it is time-consuming to write the number of times it is used in the record book. In particular, the greater the number of probe cards, the greater the number of records, the more time it takes to create each record, and the more difficult it is to manage these records for each lobe card. There was a problem.

As described above, since the creation and management of the record book are complicated, it is conceivable to use a computer to manage all the probers on the network. However, in order to manage all the probe cards by such network management, a large-scale system is required, and there is a problem that the cost is excessively increased in a part other than the original purpose of the inspection of the semiconductor device. SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device inspection apparatus which can easily manage the usage history data of a probe card and which is inexpensive.

[0011]

According to a first aspect of the present invention, there is provided a stage on which a wafer substrate is placed, a probe card having probe needles opposed to the stage, and a positional relationship between the contact points of the wafer substrate and the probe needles. A prober that adjusts the probe needles to contact the contact points, and a tester for testing the function of the wafer substrate contacted with the probe needles, in a semiconductor device inspection apparatus, a storage module provided in a probe card,
A communication unit for performing data communication between the storage module and the prober, the storage module including a communication circuit, a non-volatile memory for storing data input via the communication circuit, and an inductance; Together, the communication means comprises a communication circuit and a communication port provided in the prober, and the inductance operates the communication circuit with an induced electromotive force generated by an external radio wave,
The communication circuit and the communication port are configured so that data communication can be performed in a non-contact manner.
The probe card usage history data stored in the
Input to the prober via the communication means, and after the inspection,
Use history data updated by the prober via the above communication means
And input to the storage module of the probe card .

The second invention is characterized in that the storage module is formed in a film shape and the storage module is attached to the surface of the probe card.

A third aspect of the present invention is characterized in that the frequency of a radio wave for operating a communication circuit is not included in a frequency range of an inspection signal when inspecting a wafer substrate . The fourth invention is
The intensity of the radio wave that activates the communication circuit of the storage module is
It is characterized in that it is stronger than the inspection signal intensity when inspecting a wafer substrate . The fifth invention is characterized in that radio waves for operating the storage module have directivity. 6th departure
Akira is characterized in that the storage module includes a program for operating only by a specific input signal. A seventh invention comprises a signal input means different from a prober for inputting data to the storage module and a second communication means, and the probe card of the probe card is provided via the signal input means and the second communication means. The feature is that the repair history and the number of times of use are stored in the storage module.

[0014]

1 to 4 show an embodiment of the present invention. The probe card 4 of FIG. 1 is different from the conventional probe card 4 in that a storage module 12 is provided on a substrate 9. This storage module 12, as shown in FIG.
A non-volatile memory 13 is provided, in which usage history data of the probe card 4 is stored. Further, the probe card 4 includes a communication circuit 14 for communicating data in the memory 13 and an inductance 15. An electromotive force induced by an external radio wave in the inductance 15 serves as a power supply of the communication circuit 14. Therefore, the probe card 4 includes the communication circuit 1
There is no need to provide the power supply wiring of No. 4. The memory 1
Reference numeral 3 is a non-volatile memory, and does not require power to store and hold data input via the communication circuit 14.

As shown in FIG. 3, the probe card 4 is attached to a test head 5 and is opposed to the stage 2 of the prober 3. The wafer substrate 1 is set on the stage 2 and a semiconductor device formed on the wafer substrate 1 is inspected. The wafer substrate 1 is the same as that described in the conventional example shown in FIG. A tester 6 is connected to the test head 5 and the prober 3.
The prober 3 adjusts the relative position between the probe card 4 and the wafer substrate 1, and the tester 6
The mechanism for determining a defect is the same as in the conventional example. However, the prober 3 of this embodiment has a communication port 16. The history data of the probe card 4 can be exchanged between the memory 13 and the prober 3 via the communication port 16. The history data is data indicating the number of times the probe card 4 has been used and whether the probe card 4 has been repaired before the inspection.

The operation of the above inspection apparatus will be described. The probe card 4 is attached to the test head 5, and the wafer base 1 is set on the stage 2 of the prober 3. First, the prober 3 transmits a signal from the communication port 16. This signal is a signal for extracting the history data stored in the storage module 12 of the probe card 4. That is, the signal causes the inductance 15 in the storage module 12 to generate an induced electromotive force, and the communication circuit 14 operates. When the communication circuit 14 operates, data in the memory 13 is transmitted through the communication circuit 14. The history data transmitted from the memory 13 is stored in a storage unit in the prober 3 via the communication port 16. In the memory 13 of each probe card 4, a predetermined number of times of use, which is the number of times of use of each probe card 4, is stored in advance in each memory 13 as initial data. The initial data is input to the memory 13 by a method to be described later, and is transmitted to the prober 3 together with the history data at the start of the examination.

When the data transmission from the memory 13 to the prober 3 is completed and there is no radio wave acting on the inductance 15, the operation of the communication circuit 14 stops. After the transmission of the history data from the memory 13 to the prober 3 is completed as described above, the inspection of the semiconductor device 7 is actually started. While prober 3 moves stage 2,
The contact point 8 of the semiconductor device 7 is brought into contact with the probe needle 11 fixed to the probe card 4. Then, the tester 6 determines whether the semiconductor device is good or bad and sends the determination data to the prober 3.

Further, the prober 3 counts the number of inspections, adds it to the initial number of times of use, and inputs it to the storage unit of the prober 3. The number of inspections added in this way is the number of times the probe card 4, that is, the probe needle 11, is used at that time. As described above, the number of times the probe card 4 is used is updated every moment during the inspection of the semiconductor device 7 and stored in the prober 3. Then, the operator can check the latest number of times of use on a monitor (not shown) connected to the prober 3. When the number of times of use of the probe card 4 displayed on the monitor has reached the predetermined number of uses, the operator stops the inspection device and replaces the probe card 4 with a new one.

On the other hand, when the inspection is completed while the number of times of use of the probe card 4 is less than the predetermined number of times of use, the number of times of use stored in the storage unit of the prober 3 is stored in the storage module 12 of the probe card 4. Send. This data transmission is performed in the same manner as the data transmission from the memory 13 to the prober 3. That is, the history data updated by the prober 3 is transmitted from the prober 3 via the communication port 16. By the radio wave of the history data, the inductance 15 in the storage module 12 of the probe card 4 generates an induced electromotive force, and the communication circuit 14 operates.
The communication circuit 14 receives the data signal from the prober 3 and stores the updated history data in the memory 13.
In this manner, the probe card 4 can store its own history data in the storage module 12.

Next, when testing another type, the probe card 4 attached to the test head 5 is replaced with a probe card 4 adapted to the different type. The probe card 4 removed from the test head 5 is stored with the history data stored. The above storage module 1
This is because the memory 13 of the second memory is a non-volatile memory, so that even when the probe card 4 is removed from the test head 5 and managed, the storage in the memory 13 is maintained without power supply. As described above, the usage count data of the probe card 4 is updated during use, and it can be checked whether the latest usage count has reached the predetermined usage count.

Next, a method of inputting initial data to the memory 13 of each probe card 4 and updating history data will be described. As shown in FIG.
Is placed on the support portion 18 of the inspection stand 17. The inspection stand 17 is provided with a communication port 19, and a controller 20 is connected to the communication port 19. The communication port 19 is similar to the communication port 16 of the inspection apparatus described above, and is a port for transmitting and receiving data without contact. That is, the communication port 19 and the communication circuit 14 of the probe card 4 constitute the second communication means of the present invention. Therefore, the controller 2
0 and the storage module 12 of the probe card 4 on the inspection stand 17 can transmit and receive data via the communication port 19.

To the storage module 12 of the new probe card 4, the controller 20 transmits a predetermined number of times of use corresponding to each probe card 4 and initial data of the number of times of use “0”. When the probe card 4 is repaired, the repair history data is input from the controller 20 to the storage module 12. Of course, the history data of the probe card 4 can be transmitted to the controller 20 via the communication port 19. in this way,
If the history data is transmitted to the controller 20, the history data can be rewritten by the controller 20.
For example, the controller 20 updates the repair history,
The predetermined number of times of use can be changed. The history data can be checked at any time on the monitor of the controller 20. The controller 20 constitutes another signal input means different from the prober of the present invention.

As described above, each probe card 4
The storage module 12 stores its own history data, so that it is no longer necessary to create or manage a record book for writing history data as in the related art. Further, since the storage module 12 is fixed to the probe card 4, the probe card 4 and its history data are always integrated, and there is no possibility that the storage card 12 will be scattered. Conventionally, when the probe card 4 and the record book are separated, the history data of the probe card 4 may not be understood. However, in the present invention, the history data of the probe card 4 is
It can be confirmed at any time via the prober 3 or the controller 20.

In this embodiment, since the communication circuit 14 is operated by the induced electromotive force of the inductance 15, the power supply wiring for the communication circuit 14 is unnecessary. Further, since data communication between the communication circuit 13 and the communication ports 16 and 19 is performed in a non-contact manner, no communication wiring is required. As described above, if there is no wiring, the wiring is not obstructed, the degree of freedom of the mounting position on the substrate 9 is high, and the mounting is simple. In the above embodiment,
The prober 3, the inspection stand 17, the communication port 16,
Although 19 must be provided, the cost is not increased because the change of the probe card 4 which is a consumable can be minimized. If the storage module 12 has wiring, the vibration during the measurement is transmitted to the probe card, and the vibration is larger than in the case where there is no wiring. Things happen. For this reason, the fixing to the substrate 9 must be further strengthened. However, when there is no wiring as in the above embodiment, it can be dealt with by simple bonding or the like.

If the storage module is formed on a film substrate and covered with an insulating sheet to form a film as a whole, the storage module can be attached anywhere on the probe card 4. Since the memory module can be bent,
It can be attached not only to the upper and lower bottom surfaces of the substrate 9 but also to the side surfaces. Even when the test wiring is provided on the substrate 9, it can be attached to the test wiring. If an adhesive layer is provided in advance on one side of the film-shaped storage module, the storage module can be easily attached like a seal. In particular, the communication line 14
By forming the antenna portion in a long and thin film shape and pasting it around the outer periphery of the probe card 4, high sensitivity can be achieved without disturbing the long antenna.

In the above inspection apparatus, the data in the storage module 12 is stored in the prober 3 before the inspection of the wafer.
After the inspection is completed, the data is received from the prober 3 and the data in the memory 13 is updated. That is, the circuit in the storage module 12 does not operate during the inspection of the wafer. Therefore, there is no concern that the electromagnetic waves generated during the operation of the storage module will adversely affect the inspection of the wafer substrate. However, in order to prevent the storage module 12 from malfunctioning due to external electromagnetic waves, the frequency and intensity of radio waves for operating the storage module 12 are
It is safer to change the frequency and strength of the test signal.

If the radio wave for operating the storage module is provided with directivity so that it can be operated only by a radio wave from a specific direction, during the device inspection,
The operation of the storage module 12 without permission can be prevented. Furthermore, a program that does not operate the storage module 12 unless a specific signal is input to the storage module 12 can be incorporated. With such a program, it is possible to more reliably prevent the storage module 12 from malfunctioning due to external radio waves.

When a plurality of inspection devices are installed on a semiconductor device manufacturing line, a CPU or the like is connected to each prober 3 and judgment data of the tester 6 is input to each of the CPUs to determine a defect rate of the semiconductor device. Can also be managed. In this embodiment, the operator confirms the replacement time of the probe card 4 by the monitor, but the means for notifying the worker of the replacement time is not limited to the monitor. For example, when the probe card 4 reaches a predetermined number of uses,
An alarm may be issued or the inspection device may be automatically stopped.

[0029]

According to the first aspect of the present invention, it is possible to provide a storage module in the probe card and store the history data of each probe card therein. As described above, if each history data is stored in each storage module, it is not necessary to create and manage a record book in which the history data is recorded. In addition, since the probe card and the history data are integrated, data management is easy.

Further, since a non-volatile memory is employed, a power supply for holding stored data through communication is not required. Since the storage module is provided with an inductance as a power supply for operating the communication circuit, there is no need to connect a power supply for the communication circuit. Further, since communication is performed without contact between the communication circuit and the communication port, no signal line is required. That is, no external wiring is required for the storage module. As described above, since there is no obstructive external wiring, the probe card used in the inspection apparatus of the present invention can be configured by simply attaching the storage module anywhere on the probe card without modifying the conventional probe card. be able to. In addition, after inspection of semiconductor devices
Update the history data with the prober and enter
Even the latest data can be stored.

According to the second aspect of the present invention, the memory module is formed in a film shape, so that the memory module can be made compact and flexible. Therefore,
The storage module can be easily attached to the probe card, and the size of the entire inspection apparatus can be reduced. Third to sixth departures
According to the description , since the storage module can be prevented from operating during the inspection, the storage module does not generate electromagnetic waves during the inspection and does not affect the inspection. 7th departure
According to Ming, when not using a probe card,
You can input repair history data and initialize the storage module.

[Brief description of the drawings]

FIG. 1 is a front view of a probe card used in an inspection device according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a storage module provided in the probe card according to the embodiment of the present invention.

FIG. 3 is a schematic view of an inspection apparatus according to an embodiment of the present invention.

FIG. 4 is a configuration diagram of an apparatus for inputting initial data and repair history data to the probe card according to the embodiment of the present invention.

FIG. 5 is a schematic view of a conventional inspection apparatus.

FIG. 6 is a front view of a conventional probe card.

FIG. 7 is a model diagram of a wafer base surface.

[Explanation of symbols]

 Reference Signs List 1 wafer base 2 stage 3 prober 4 probe card 6 tester 7 semiconductor device 8 contact point 11 probe needle 12 storage module 13 memory 14 communication circuit 15 inductance 16 communication port 19 communication port 20 controller

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 21/66 G01R 31/26

Claims (7)

(57) [Claims] 1. A stage on which a wafer base is placed, a probe card facing the stage and provided with probe needles, and a positional relationship between a contact point of the wafer base and the probe needles is adjusted to bring the probe needles into contact points. In a semiconductor device inspection apparatus having a prober that comes into contact with a probe, and a tester that inspects the function of a wafer substrate that has come into contact with a probe needle, a storage module provided on a probe card, and data communication between the storage module and the prober Communication means for performing, the storage module comprises a communication circuit, a nonvolatile memory for storing data input via the communication circuit, and an inductance, and the communication means, the communication circuit, And a communication port provided on the prober. The communication circuit is operated by the induced electromotive force generated by the wave, and the communication circuit and the communication port are configured to be capable of non-contact data communication .
Before starting the inspection, the probe car stored in the storage module
The usage history data of the
And the use history updated by the prober after the inspection is completed
The data is stored in the storage card of the probe card via the communication means.
An inspection apparatus for semiconductor devices, wherein the input is to a joule . 2. The semiconductor device inspection apparatus according to claim 1 , wherein the storage module is formed in a film shape, and the storage module is attached to a surface of the probe card. 3. The frequency of a radio wave for operating a communication circuit is:
3. The semiconductor device inspection apparatus according to claim 1 , wherein the inspection apparatus is not included in a frequency range of an inspection signal when inspecting a wafer substrate . 4. The semiconductor device according to claim 1 , wherein an intensity of a radio wave for operating a communication circuit of the storage module is higher than an inspection signal intensity when inspecting the wafer substrate . Inspection equipment. 5. The semiconductor device inspection apparatus according to claim 1 , wherein the radio waves for operating the storage module have directivity. 6. The semiconductor device inspection apparatus according to claim 1 , wherein the storage module has a program for operating only by a specific input signal. 7. A probe card which is different from a prober for inputting data to a storage module and which is provided with a second communication means. The probe card is repaired via the signal input means and the second communication means. The storage module according to claim 1 , wherein a history and a number of times of use are stored in the storage module .
7. The semiconductor device inspection apparatus according to any one of 6 .