JP2003057303A - Inspection system, and inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit inspection device and a circuit inspection method capable of inspecting easily and contactlessly the quality of the whole board including a wiring pattern of a board mounted with an integrated circuit. SOLUTION: An inspection circuit is built preliminarily in an integrated circuit to allocate an inherent code to the inspection circuit, an electromagnetic wave emitted from an inspection-device-power suppling.transceiving antenna is received by a power-reception and reception part of the inspection circuit to generate driving electric power for the inspection circuit, the inspection circuit starts an operation by the supplied driving power, an inspection control procedure from the inspection device is also received contactlessly by the same manner, a control logic controls respective constitutions according to the received control procedure to inspect the circuit via inspection wiring, and a result is transmitted to the inspection device via an encoder and a transmission part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection system and an inspection method capable of inspecting the state of an integrated circuit and a substrate on which the integrated circuit is mounted.

[0002]

2. Description of the Related Art In a conventional integrated circuit inspection device for inspecting disconnection / short circuit of lead patterns and connection between patterns, as in the technique disclosed in Japanese Patent Laid-Open No. Hei 10-221407, predetermined input terminals of an integrated circuit are provided. A signal is supplied to determine whether a desired signal is output to the output terminal.

When the integrated circuit is a non-volatile semiconductor memory device, an ultraviolet power generation device and a test circuit are formed on a wafer to form a non-volatile semiconductor memory device as in the invention described in Japanese Patent Laid-Open No. 2000-188311. Utilizing the feature that requires UV irradiation to initialize the memory device, obtains the drive power of the test circuit and drives the test circuit to test the circuit during UV irradiation for this initialization was there.

Further, the technique disclosed in Japanese Patent Laid-Open No. 11-31399 discloses an inspection circuit and a memory for storing an inspection result in an integrated circuit chip, and when a driving power is supplied from a pin provided in the chip, The diagnosis can be started by contact and the test result can be stored in a specific memory. Furthermore, the content of the memory that stores the inspection result can be retrieved from the inspection device, or at the time of mounting on the board or after mounting.

[0005]

However, the technique disclosed in Japanese Unexamined Patent Publication No. 10-221407 can only inspect an inter-pattern connection such as a disconnection / short circuit of a lead pattern, and can detect a signal from a signal supply portion. Only the state between the parts can be inspected. For example, it is necessary to position the inspection object on the work of a dedicated large-scale inspection device and position and contact the pad or the like to the desired inspection part for the inspection.

Further, the technique disclosed in Japanese Patent Laid-Open No. 2000-188311 is capable of inspecting the quality of the circuit by previously incorporating the inspection circuit into the circuit and supplying drive power with ultraviolet rays from the outside to inspect the circuit. Only the inspections that were previously incorporated in the inspection circuit were possible, and only the inspections that were scheduled when the circuit was designed could be performed. Moreover, the drive power source is a special ultraviolet ray that is harmful to the human body, and is a technology with no versatility that is not conceivable for use in other than the memory circuit that emits ultraviolet rays.

Further, the technique described in Japanese Patent Laid-Open No. 11-31399 requires that the driving power supply be supplied to the integrated circuit chip, and moreover, only the internal circuit of the integrated circuit chip can be inspected. The inspection result cannot be collected unless the driving power is supplied to the chip.

For example, it is necessary to provide a dedicated pin for inspection on the integrated circuit chip and perform special control such as supplying drive power from this pin, and it is premised that the dedicated chip is mounted on a dedicated inspection device. Therefore, the inspection method was only a predetermined method.

Further, for example, when a board on which a plurality of integrated circuits are mounted is inspected after the board is mounted on a machine, power is supplied to the board and signals are supplied from the board input / output terminals to obtain desired signals. Whether the board as a whole is good or bad can be determined, or a probe can be contacted with the wiring pattern of the board to supply an inspection signal, and other wiring patterns can detect this signal to determine the quality of the board. It didn't pass.

[0010]

The present invention has been made for the purpose of solving the above-mentioned problems, and solves the above-mentioned problems. For example, an integrated circuit alone, or an integrated circuit to be mounted on a substrate is mounted on the substrate. An object of the present invention is to provide an inspection system and an inspection method capable of performing an inspection and easily outputting an inspection result without supplying a circuit drive power to an integrated circuit or a substrate even after the above.

As one means for achieving the above object, for example, the following configuration is provided.

That is, the inspection system is capable of inspecting an assembly in which an integrated circuit incorporating a circuit inspection unit for receiving an execution control procedure from the outside and inspecting a circuit state is inspected. The assembly side provides the assembly design information to the side to request the assembly procedure inspection procedure, and the inspection procedure design side uses the received assembly design information based on the integrated circuit information embedded in the assembly and the mounting status between the integrated circuits. It is possible to design the inspection execution control procedure for inspecting the quality of the product, issue the specific information that identifies the target assembly, and provide the inspection execution control procedure design information. By presenting specific information identifying the above-mentioned inspection target assembly issued to Requesting the supply of the inspection execution control procedure for the assembly, receiving the assembly inspection control procedure sent to the assembly, supplying it to the desired integrated circuit of the assembly to execute the inspection procedure, and receiving the inspection result to determine whether the assembly is good or bad. Characterized by being inspectable.

Alternatively, there is provided an inspection method in an inspection system capable of inspecting an assembly in which an integrated circuit incorporating a circuit inspection unit for receiving an execution control procedure from the outside and inspecting a circuit state is inspected. The assembly design information is provided to the inspection procedure design side and the inspection procedure design side is requested to provide the inspection procedure for the assembly.
Based on the received assembly design information, design the inspection execution control procedure to inspect the quality of the assembly from the integrated circuit information embedded in the assembly and the mounting status between the integrated circuits, and issue the specific information to identify the target assembly. In addition, the inspection execution control procedure design information can be provided, and the assembly inspection side presents specific information for identifying the inspection target assembly issued earlier to the inspection procedure design side, and the inspection execution control procedure for the inspection target assembly. It is possible to inspect whether the assembly is good or bad by requesting supply, receiving the assembly inspection control procedure that is sent, supplying the assembly to a desired integrated circuit, executing the inspection procedure, and receiving the inspection result. And

For example, in the circuit inspection section incorporated in the integrated circuit, a unique identification number is assigned to the circuit inspection section supplied at the time of designing the integrated circuit,
The inspection procedure design side allocates the inspection execution control procedure to the circuit inspection section of the integrated circuit incorporated in the assembly to be inspected to the required inspection circuit section according to the unique identification number and executes the procedure, and incorporates at least two integrated circuits. It is characterized in that the circuit inspection section supplies the inspection procedure execution control procedure so that the circuit inspection section cooperates to execute the inspection.

Further, for example, in the integrated circuit built-in circuit inspection section mounted on the inspection target assembly, when the integrated circuit design side designs the integrated circuit, the integrated circuit design side provides the integrated circuit design information to request the inspection circuit design. Then, the inspection circuit design side designs the inspection circuit to be incorporated in the integrated circuit from the received integrated circuit design information for inspecting the quality of the integrated circuit and the inspection execution control procedure by the inspection circuit, and the inspection circuit design information. And issuing the inspection execution control procedure to the integrated circuit design side, and incorporating the inspection circuit designed on the integrated circuit design side to manufacture an integrated circuit.

Further, for example, on the assembly inspection side,
The inspection execution control procedure is held, and the inspection execution control procedure held at the time of the integrated circuit inspection is sequentially wirelessly transmitted to the inspection circuit to execute the circuit inspection, and the execution result is received from the inspection circuit, and the integrated circuit is received. The assembly inspection is performed by using an inspection device that executes the inspection.

Further, for example, the inspection procedure design side has an inspection execution control procedure for inspecting the quality of the assembly from the received assembly design information based on the integrated circuit information incorporated in the assembly and the mounting state between the integrated circuits. Design and hold the inspection execution control procedure for each assembly, and when receiving the specific information specifying the assembly from the assembly inspection side, correspond to the specific information specifying the assembly from the held inspection execution control procedure An inspection execution control procedure is selected and provided to the assembly inspection side.

[0018]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. In the present embodiment, when designing an integrated circuit to be inspected,
The inspection circuit is designed beforehand according to the configuration and circuit scale of the integrated circuit, and the designed inspection circuit is incorporated into the integrated circuit.
The connection pad portion, which is the input / output terminal with the outside of the integrated circuit, and the external terminal of the inspection circuit are electrically connected.

(First Embodiment) A configuration example of an integrated circuit incorporating the inspection circuit of the present embodiment will be described with reference to FIG. FIG. 1 is a diagram for explaining the configuration of an integrated circuit incorporating an inspection circuit according to an embodiment of the present invention.

In FIG. 1, 10 is an integrated circuit (IC) chip (die), 11 is a connection pad provided on the IC chip 10, 15 is an IC circuit wiring, and 20 is an integrated circuit (I).
C circuit), 30 is an inspection circuit, and 40 is an inspection wiring.

In FIG. 1, the inspection circuit 30 is shown as if it is constructed entirely different from the IC circuit 20, but in reality, a part of the IC circuit is occupied in the IC circuit. And inspect circuit pattern to other IC
It is formed separately from the circuit pattern. However, it goes without saying that it may be mounted on a completely different chip.

Then, as shown in FIG. 1, the IC circuit wiring and the inspection wiring are connected in the vicinity of all the connection pads 11.

FIG. 2 shows the detailed structure of the inspection circuit of this embodiment. FIG. 2 is a diagram showing a detailed configuration of the inspection circuit and a schematic configuration of the inspection device according to the present embodiment. The inspection circuit 30 of the present embodiment can perform an inspection independently without being supplied with operating power from an IC circuit or the like.
For example, even after the IC circuit is mounted on the board, the board alone can inspect the quality.

In FIG. 2, reference numeral 31 is a power reception unit.
It has a power receiving function of receiving an electromagnetic wave to generate inspection circuit driving power and supplying it to each component of the inspection circuit 30, and a receiving function of receiving inspection circuit operation control procedure information described in detail later.

For this reason, the power receiving / receiving section 31 has a receiving antenna section for receiving electromagnetic waves (for example, including a resonance circuit including a coil for selectively receiving electromagnetic waves of a predetermined frequency).
That is, the power receiving function receives an electromagnetic wave from a power supply / transmission / reception antenna of an inspection device (not shown) such as a high frequency (microwave, millimeter wave, submillimeter wave) signal of a predetermined frequency by electromagnetic induction, electrostatic coupling, etc. Is converted into electric power and used as driving power for the inspection circuit. Further, the receiving function receives the operation sequence command information from the inspection device (not shown), the code information unique to the inspection circuit, etc., and outputs it to the decoder 32.

A decoder 32 receives and decodes the inspection circuit operation control procedure information received by the power receiving / receiving unit 31 and outputs it to the control logic 33. The code information received by the power receiving / receiving unit 31 is pre-allocated to its own circuit. If the received code is the unique code, the control logic 33 is activated, and subsequently received control procedure information is decoded and sent to the control logic.

33 receives the operation control procedure information from the decoder 32 and performs control according to the control procedure, and
When the control procedure to be received is complicated and a large number of controls are collectively performed, the control procedure is stored in the control procedure storage unit 34.
It is also possible to control the entire control of the inspection circuit 30 according to the control procedure stored in the control procedure storage unit 34.

Reference numeral 35 is an inspection circuit 3 from the control logic 33.
An encoder for receiving and encoding the inspection result of 0 and transmitting from the transmitting unit 39, for example, a high frequency (microwave, millimeter wave, submillimeter wave, etc.) signal of the frequency assigned to the inspection circuit to the inspection device (not shown), Reference numeral 36 denotes an analog switch (analog SW) capable of controlling connection / disconnection for each individual wiring 40 of each inspection wiring under the control of the control logic 33.

Reference numeral 37 is a test signal which is output from the control logic 33 as a digital signal and converts the test signal information to the test wiring 40 into a corresponding analog signal, which is closed (connected) by the analog switch 36. It is a digital-analog converter (D / A) that outputs to wiring.

An analog signal 38 converts an analog signal corresponding to the test signal received from the test wiring 40 through the analog switch 36 into a corresponding digital signal under the control of the control logic 33 and outputs the digital signal to the control logic 33. Digital converter (A / D), 39 is encoder 35
It is a transmission unit that transmits inspection result information and the like output from the device as a wireless signal.

Reference numeral 200 denotes an inspection apparatus main body. The inspection apparatus main body 200 has a display section 210 capable of displaying inspection instructions and inspection results, an operation section 220 for inputting various instructions, an electromagnetic wave such as a high frequency ( Microwave, millimeter wave,
(E.g. submillimeter wave) signal is emitted and inspection circuit operation power and inspection circuit operation control instruction command are transmitted without contact,
The power supply / transmission antenna 230 for receiving the inspection result information from the inspection circuit is provided.

The inspection circuit 30 having the above configuration is incorporated in an integrated circuit by the following procedure. First, when designing and manufacturing an integrated circuit, an IC maker, who designs and manufactures the integrated circuit, requests the inspection circuit creator to install the inspection circuit (code application) after designing the integrated circuit.

Upon receiving the request for incorporating the inspection circuit (code application), the inspection circuit creating side designs an inspection circuit pattern to be incorporated in the integrated circuit, and selects the pattern connected to the output terminal portion of the integrated circuit to be inspected and the inspection circuit. Peculiar I
Issue D code.

As a result, the inspection circuit shown in FIG. 1 is incorporated in the integrated circuit. This makes it possible to inspect an integrated circuit, for example, a package.

The above code application from the IC maker can be made by hand or by mail, but can also be made online, for example, via the Internet. In this case, it is possible to avoid unauthorized use by others by encrypting and transmitting various information.

An integrated circuit inspection method using the inspection circuit 30 of the present embodiment having the above configuration will be described below with reference to the flowchart of FIG. 3 and FIG. FIG. 3 is a flow chart for explaining integrated circuit inspection control using the inspection circuit of the present embodiment, and FIG. 4 is a diagram for explaining an integrated circuit inspection method by the inspection circuit 30 of the present embodiment. .

In FIG. 4, reference numeral 40 denotes the connection pad 11 provided on the IC chip 10 and the integrated circuit package 100.
4 is an example of wire bonding for electrically connecting the connection patterns to the output terminal 110 of FIG. 4, and the example of FIG. 4 is an example in which the output terminal 6 (6 pin) and the output terminal 7 (7 pin) are short-circuited. Shows.

An integrated circuit inspection method incorporating the inspection circuit 30 designed according to the above-mentioned code application of the present embodiment will be described below with reference to the flowchart of FIG.

First, in step S1, the inspection apparatus is controlled to emit an electromagnetic wave having a desired frequency, for example, a high frequency (microwave, millimeter wave, submillimeter wave) signal to the integrated circuit shown in FIG. This high frequency signal is the inspection circuit 3
The power is received by the power reception unit 31 of 0 and is supplied to each component, for example, the decoder 32 as driving power of the inspection circuit 30 to make the inspection circuit 30 operable.

Next, in step S2, the inspection device 20
0 is a communication enable / disable signal (communication enable / disable command) for an integrated circuit incorporating a code unique to each integrated circuit issued in response to a code application at the time of designing the integrated circuit to be inspected.
To send.

It should be noted that, thereafter, a code unique to the inspection circuit is added to the information to the inspection circuit and transmitted, and the inspection circuit recognizes its own code information and the inspection device 20.
In the information from 0, the information including the code information that matches the code for recognizing the own circuit is fetched as the information addressed to the own circuit.

Then, the inspection apparatus 200 of the present embodiment example
In the subsequent step S3, monitors the response from the inspection circuit to which the unique code that received the communication enable / disable signal is assigned. In the decoder 32 of the inspection circuit 30 incorporated in the integrated circuit whose power supply is started in step S1, does the information received by the power receiving / receiving unit 31 include the code information uniquely assigned to the circuit itself ( Whether the code is detected) is monitored, and if the information received by the power reception unit 31 includes code information uniquely assigned to the own circuit, the control logic 33 is activated, The control logic activates the encoder 35 to generate an inspection circuit communicable response for notifying that the own circuit is activated and the inspection according to the instruction from the inspection apparatus 200 is possible, and transmits it from the transmission unit 39.

In step S3, if the inspection circuit 20 receives no response from the inspection circuit 20 in question within a predetermined time, the inspection circuit is not powered, for example, the inspection circuit does not operate. Assuming that there is a cause, the process proceeds to step S4 and error processing is performed.

On the other hand, when the inspection circuit 200 receives the inspection circuit communicable response from the target inspection circuit 20 within the predetermined time in step S3, the inspection device 200 proceeds to step S5.
To the responding inspection circuit, a connection command for instructing to connect the end inspection wiring and the adjacent wiring is first transmitted.

Upon receipt of this instruction, the control logic 33 of the corresponding inspection circuit stores the received command in the control procedure storage unit 34 as necessary and shifts to the mode for executing the control procedure according to the received command. This is the same when other commands are received.

In this case, the analog SW 36 is instructed to close and inspect the switch wiring connected to the inspection wiring at the end and the inspection wiring at the end of the uninspected wiring adjacent to the inspection wiring. Control the circuit to be in conduction. For example, in the example of FIG. 4, the switch circuit of the connection wiring to the 6th pin and the connection wiring to the 7th pin are closed.

In the next step S6, the inspection apparatus 200 instructs the connection inspection wiring to output an inspection signal. In the inspection circuit that receives this instruction, the inspection wiring is connected to the D / A circuit 37, and an oscillation signal of a predetermined frequency is supplied to the connected inspection wiring. In the example of FIG. 4, pin 6 is D / A
Control is performed by connecting to the circuit 37 and outputting a test signal from the D / A circuit 37.

Subsequently, the inspection apparatus 200 waits for a certain time in step S7 and then transmits an inspection signal detection instruction command from the inspection wiring to the inspection circuit. The inspection circuit which receives this stores the received command in the control procedure storage unit 30 as necessary, and executes the process corresponding to the received command. For example, the control logic 33 connects the A / D circuit 38 to the inspection wiring at the end similarly to the D / A circuit 37 according to the received command, and at the same time, connects the uninspected wiring adjacent to the inspection wiring (in the example of FIG. 4, 7 pin connection wiring) to D / A circuit 3
7 (and A / D circuit 38) circuit-less ground wire (GND)
Connect to. This makes it possible to detect the inspection signal from the inspection wiring. Then, the A / D circuit 38 is activated to execute the inspection signal detection processing from the connection inspection wiring.

The process of connecting the wiring to each circuit may be carried out at any one of step S5 and step S6, or may be performed astride. It suffices that the A / D circuit 38 be controlled to be in the inspectable state before being activated.

The inspection apparatus 200 then transmits an inspection signal output stop instruction command after the time required for detection has elapsed in step S8. The inspection circuit which receives this stores the received command in the control procedure storage unit 30 as necessary, and executes the process corresponding to the received command. Here, the control logic 33 executes a process of stopping the output of the inspection signal from the D / A circuit 37 to the connection inspection wiring according to the received command.

Then, in step S9, the inspection device 200 transmits an inspection result transmission instruction command instructing the inspection circuit to transmit the detection result in the inspection signal detection processing performed according to the instruction command transmitted in step S7 to the inspection device. To do.

The inspection circuit which receives this stores the received command in the control procedure storage unit 30 as necessary and executes the processing corresponding to the received command. In this case, the control logic 33 confirms the output signal level from the A / D circuit 38, and transmits the inspection signal detection result (including the detection level information) from the inspection wiring via the encoder 35 and the transmission unit 39. To do. Code information unique to the own circuit is added to this transmission information and transmitted.

At the next step S10, the inspection device receives the detection result information sent from the corresponding inspection circuit in response to the transmission instruction command at the previous step S9. When this information is received, the inspection circuit is instructed to deactivate the D / A circuit 37 and stop the output of the inspection signal.

After that, the signal received and output from the inspection wiring corresponding to the inspection signal output from the inspection circuit is examined, and the resistance value between the inspection wiring and the adjacent wiring is measured. Then, it is determined whether or not the resistance value is equal to or lower than a predetermined resistance value (almost conductive). If it is less than the predetermined value, the process proceeds to step S11, and the A / D circuit 3
It is determined that the inspection wiring controlled to the ground level of 8 and the adjacent wiring and the inspection wiring connected to the D / A circuit 37 are short-circuited (short circuit), and the process proceeds to step S13.

On the other hand, when the inspection signal is detected from the adjacent wiring in step S10, it is determined that there is no short circuit between the inspection wiring and the adjacent wiring, and the process proceeds to step S13.

In step S13, it is determined whether or not the inspection signal is output to all the inspection wirings of the inspection circuit (to all the terminals of the integrated circuit incorporating the inspection circuit).
When the inspection signal is output to all the inspection wirings of the inspection circuit, the inspection of the inspection circuit is completed, so the processing is terminated, and if there is a short circuit between the inspection wirings, it is determined that the circuit is defective.

On the other hand, when the inspection signal is not output to all the inspection wirings of the inspection circuit in step S13, the process proceeds to step S14 and the uninspected inspection wirings connected to the inspection circuit, that is, Next, a connection command instructing to connect an uninspected inspection wiring adjacent to the inspection wiring to be inspected into the inspection circuit is transmitted.

Upon receipt of this instruction, the control logic 33 of the corresponding inspection circuit stores the received command in the control procedure storage unit 34 as necessary and shifts to the mode for executing the control procedure according to the received command. In this case, the analog SW 40 is controlled to close the switch circuit corresponding to the inspection wiring to be inspected next. For example, pin 8 in FIG. 4 is the control target wiring.

Subsequently, in step S15, the inspection device 200
Transmits a connection opening instruction command for instructing the opening of the inspected inspection wiring connected to the D / A circuit 37 of the inspection circuit.

Upon receipt of this instruction command, the control logic 33 of the corresponding inspection circuit stores the received command in the control procedure storage unit 34 as necessary and shifts to the mode for executing the control procedure according to the received command. In this case, the analog SW 36 is instructed to open the switch circuit connected to the inspection wiring that has been inspected (6-pin connection wiring in the example of FIG. 4) to bring the inside of the inspection circuit into a disconnected state.

Then, in the subsequent step S16, the inspection device 20
0 transmits a command for setting an uninspected inspection wiring adjacent to the inspected wiring as a new inspection wiring. Control logic 3 of the corresponding inspection circuit that received this command
3, the received command is sent to the control procedure storage unit 3 as necessary.
4 and simultaneously shifts to a mode in which a control procedure according to the received command is executed. In this case, analog SW3
6, the uninspected inspection wiring (7 pins in the example of FIG. 4) adjacent to the inspected wiring is connected to the D / A circuit 37 like the 6-pin connection wiring of FIG. And step S6
Proceed to.

As described above, according to the present embodiment, a test circuit is incorporated in advance in an integrated circuit, a unique code is assigned to the test circuit, and the test circuit drive power and test control procedure are all externally contactless. Then, the inspection circuit starts its operation by the supplied drive power, receives the control procedure supplied to its own circuit, and can perform the inspection according to the received control procedure.

Therefore, the inspection device can supply the inspection circuit with a control procedure corresponding to the state of the inspection object and execute the control procedure, and the inspection apparatus can change the inspection procedure for any inspection object or the surrounding conditions of the inspection object. Also, the optimum inspection that can respond flexibly will be realized.

Further, even if a circuit defect is found, different inspection control depending on the circuit state can be executed in some cases, and an integrated circuit inspection excellent in versatility can be performed.

Further, since the operating power of the inspection circuit can be directly supplied to the inspection circuit, the inspection can be performed without any problem even when the integrated circuit to be inspected is not supplied with power, and the integrated circuit can be inspected. Of course, it is possible to inspect even if it is not connected to a power source or the like independently.

Therefore, if the inspection device is brought in, the inspection target can be inspected not only at the production plant but also at the customer's place or the sales store.

Furthermore, since the inspection can be carried out without contact, positioning of the inspection object is almost unnecessary. Furthermore, a unique code is assigned in advance to each inspection circuit, and only a specific inspection circuit can be extracted and inspected according to this unique code. For example, circuit inspection in a flow operation is also possible.

(Second Embodiment) In the above description, the example of the inspection of the integrated circuit alone by the inspection circuit incorporated in the integrated circuit has been described. However, the present invention is not limited to the above examples. For example, it is possible to inspect an assembly in which a plurality of integrated circuits are mounted, for example, an electronic board. In this case, the power required for inspection can be supplied to each integrated circuit of the assembly in a non-contact manner, and different inspection control can be performed for each inspection circuit unit of multiple integrated circuits. It is also possible to perform a quality inspection of an assembly (for example, an integrated circuit mounting board) including an electric circuit that connects the inspection circuits in cooperation with each other.

Further, an integrated circuit control procedure of the inspection circuit can be supplied from outside the inspection circuit. For this reason,
In addition to the inspection by the integrated circuit alone, the inspection circuits incorporated in the integrated circuits work together (integrated) even after the integrated circuits are mounted on the board. The quality including the pattern can be judged.

An inspection circuit system in which the inspection circuits of the second embodiment according to the present invention jointly perform an inspection including the assembly substrate will be described below with reference to FIG. FIG. 5 is an overall conceptual diagram of an inspection circuit system in which the inspection circuits of the second embodiment according to the present invention jointly perform an inspection including the assembly substrate.

As shown in FIG. 5, in the second embodiment as well, the procedure until the inspection circuit is incorporated in the integrated circuit may be exactly the same as in the case of the first embodiment, and the integrated circuit is designed. When an IC maker manufactured by designing an integrated circuit designs an integrated circuit, a request (code application) for incorporating an inspection circuit that presents a circuit pattern of the designed integrated circuit is applied to the inspection circuit maker.

The inspection circuit maker who has received this code application designs an inspection circuit to be incorporated in the IC shown in FIG. 2 and gives a unique ID code to the inspection circuit, so that the inspection circuit pattern and the ID code are integrated into the IC. Issue to the manufacturer.

The IC maker completes the integrated circuit design by incorporating (making) the issued inspection circuit pattern into the integrated circuit and commercializes it. Then, it is commercialized as an integrated circuit in which the inspection circuit specified by the ID code is incorporated.
The control of the above-described first embodiment makes it possible to inspect the integrated circuit alone (package inspection).

An assembly maker that manufactures an electronic circuit board having a desired function by purchasing this integrated circuit selects and determines the type of integrated circuit to be mounted, and designs the circuit board using the selected integrated circuit. . Then, when the design of the circuit board is almost completed, the configuration of the electronic circuit board,
Apply to the inspection circuit maker to issue the circuit board inspection data considering the circuit pattern with the circuit pattern information and mounted component information attached.

The inspection circuit maker that has received the code application from the assembly maker analyzes the entire structure of the assembly substrate, the wiring condition between the integrated circuits, and the like to check the inspection method of the assembly substrate, and the inspection circuit of each integrated circuit. The board inspection method is established by examining how to operate the board to determine the board inspection procedure. Then, an inspection control procedure is created for each integrated circuit according to the established board inspection method.

Then, the inspection data including the board inspection execution procedure information for executing the inspection control procedure differently for each created integrated circuit and the inspection result information is issued and transmitted to the assembly maker.

The assembly maker, which has received the inspection data including the inspection control procedure, stores the received inspection data in the inspection device and sequentially specifies the ID code for each integrated circuit to be inspected at the time of actually executing the inspection. Each circuit outputs its own inspection procedure and controls the inspection circuit according to the inspection procedure.

In this case, each integrated circuit mounted on the board to be inspected interlocks to execute the circuit inspection. As described above, the execution procedure of the board to be inspected is wirelessly transmitted from the antenna of the inspection procedure and is the same as the designated ID.
It is received only by the integrated circuit to which D is assigned, and is recorded and executed as needed.

The above code application from the assembly maker can be made online via the Internet. In this case, it is possible to avoid unauthorized use by others by encrypting and transmitting various information. Of course, it can be done by hand or by mail.

Even after the plurality of integrated circuits are mounted on the board, the inspection circuits incorporated in the plurality of integrated circuits cooperate (integrate) with each other to include the mounting wiring pattern of the board. A second embodiment according to the present invention which can judge whether or not is described below with reference to FIG. FIG. 6 is a diagram for explaining the quality inspection including the substrate pattern according to the second embodiment of the present invention.

In the example of FIG. 6, a case where the integrated circuit 100 and the integrated circuit 200 perform a circuit inspection in cooperation with each other for simplification of description, and the resistor 300 is arranged between both resistors will be described as an example. To do. However, it goes without saying that the second embodiment can be applied to any circuit wiring.

Also in the second embodiment, the supply of the inspection control procedure to the integrated circuit is the same as the control shown in FIG. 3 of the first embodiment.

When the inspection of FIG. 6 is performed, the inspection device transmits a control procedure for the integrated circuit 100 to cause the analog switch 36 to have 8 pins, the D / A circuit 37, and the A / D circuit 38 as the first. Connection is made in the same manner as in the embodiment, and pin 15 is connected to the ground level signal lines of the D / A circuit 37 and A / D circuit 38.

Next, in the control procedure for the integrated circuit 200, the integrated circuit 10 is set for the analog switch 36.
The 1 pin connected to the 3 pin of 0 via the resistor 300 and the 2 pin connected to the pin of the integrated circuit 100 are connected and controlled to be folded.

A detailed procedure of the inspection control of the circuit shown in FIG. 6 using the two integrated circuits by the inspection device will be described below with reference to FIG. FIG. 7 is a flow chart for explaining the inspection control of the mounting board according to the second embodiment.

In step S21, both integrated circuits (hereinafter referred to as "I
Electromagnetic waves are supplied to the ICs on the substrate centering on "C") in a non-contact manner to start feeding. As a result, the inspection circuit in each IC is brought into an operating state, and is prepared for reception of a control procedure including its own circuit ID.

Subsequently, in step S22, the IC10
A communication availability confirmation signal (ID code of IC 100 + external device ID code + reception availability command) is transmitted to 0. If the IC 100 that receives the request sends a communication enable response (external device ID code + IC1 ID code + operation enable response code) if communication is possible. Therefore, the subsequent step S2
At 3, the reception of this communication enable response is monitored. If it is not sent within the fixed time, the process proceeds to step S24, and a predetermined error process is performed.

On the other hand, when the communication enable response from the IC 100 is confirmed in step S23, the process proceeds to step S25 and the IC
200 communication availability confirmation signal (ID code + external device ID
Send code + command to receive or not to receive. If the IC 200 receives this, and if communication is possible, it transmits a communication enable response (external device ID code + IC1 ID code + operation enable response code). For this reason, in subsequent step S26, it is monitored that the communication enable response is sent. If it is not sent within the fixed time, the process proceeds to step S24, and a predetermined error process is performed.

On the other hand, when the communication enable response from the IC 200 is confirmed in step S26, the process proceeds to step S27 and the IC
Instruct to analog SW of 200 (ID code + external device I
(D code + SW number to be closed) 1PIN and 2PIN
Sends the control procedure to the connection state where is short-circuited.

Then, in a succeeding step S28, 8PIN of the IC 100 is connected to the constant current circuit output (D / A) (ID code + external device ID code + SW number to be closed / closed), and a test signal is supplied to the test circuit pattern.

Next, in step S29, the A / D of the IC100 is performed.
The circuit is connected to a constant current circuit (ID code + external device ID code + SW number to be closed / closed), and IC100
Connect the 15PIN to GND in the measurement circuit (ID code +
External device ID code + SW number to be closed / closed) to prepare for detection of inspection signal. Then, the constant current circuit of the IC100 is turned on (ID code + external device ID code + D / A operation mode + D / A output value), and after waiting for a certain time, IC1
To instruct A / D measurement (ID code + external device ID code + A / D operation mode + A / D measurement execution command) to instruct inspection signal detection from the connection inspection wiring.

Next, in step S30, the A / D is added to the IC 100.
The measurement value is instructed to be transmitted (ID code + external device ID code + A / D measurement value transmission command), and the inspection result is instructed to be transmitted. Then, in step S31, I
The A / D value sent from the C100 is received (ID code of external device + ID code of IC1 + A / D measurement value).

When the inspection result is received, the constant current circuit of the IC 100 is turned off (ID code +
The external device ID code + D / A operation mode + D / A output value) is given to give an instruction to stop the inspection signal output. In subsequent step S33, all the analog SWs of IC100 are turned off (ID
Code + external device ID code + SW all OFF command).

Next, in step S34, the resistance value of the circuit pattern is calculated from the detection result information using Ohm's law (V = IR), and it is determined whether or not the resistance value is within a predetermined range assumed in advance. However, I is the output value of the constant current circuit, and V is the measured value of A / D. If it is within the range of predetermined standard values, the process proceeds to step S35, and it is determined that the inspection pattern portion is normal. After that, if the next pattern is to be inspected, the process of FIG. 7 is performed again, and the next circuit pattern folding control and inspection signal supply control are performed.

On the other hand, if the inspection result is not within the predetermined range in step S34, the defective state is displayed to inform the user.

As described above, according to the second embodiment, not only the integrated circuit alone can be inspected, but also the quality of the entire substrate including the wiring pattern of the integrated circuit mounting substrate can be inspected easily and in a non-contact manner. Moreover, in the inspection, it is not necessary to supply operating power to the board, and the board state removed from the machine can be easily and surely checked. Therefore, even at the user site, reliable inspection is possible.

At this time also, there is only one I depending on the ID number.
A desired inspection control procedure can be selectively transmitted only to C and executed, different inspection control can be executed for each IC, and inspection control can be executed in cooperation with each other. The inspection can also be applied by simply changing the control procedure information (inspection data) stored in the inspection device.

That is, the second embodiment is an inspection system capable of inspecting an assembly in which an integrated circuit having a circuit inspection section for receiving an execution control procedure from the outside and inspecting the circuit state is mounted. The assembly design side provides the assembly procedure information to the inspection procedure design side and requests the assembly procedure inspection information to be provided, and the inspection procedure design side determines the integrated circuit information embedded in the assembly from the received assembly design information. Designing the inspection execution control procedure for inspecting the quality of the assembly from the mounting status between the integrated circuits, issuing the specific information that identifies the target assembly and providing the inspection execution control procedure design information, the assembly inspection side, Presents specific information that identifies the above-mentioned inspection target assembly issued to the inspection procedure design side. Request the supply of the inspection execution control procedure for the assembly to be inspected, receive the assembly inspection control procedure sent, supply it to the desired integrated circuit of the assembly, execute the inspection procedure, receive the inspection result, and assemble the assembly. The feature is that the quality of can be inspected.

(Third Embodiment) The above description has dealt with the case where the inspection apparatus independently performs all the inspections. However, the present invention is not limited to the above examples. For example,
If it is a manufacturing plant or the like, the inspection device can be made large, and the types of integrated circuits and substrates to be manufactured are limited, and it is possible to hold all the integrated circuit information and board information of the inspection target. .

However, even when the board is used for a specific product and installed at the user's place of use, for example, the integrated circuit inspection, as in the above-described embodiment,
If the board can be inspected, the state of the product can be grasped quickly and accurately.

In particular, it is possible to inspect, for example, a single board without supplying operating power to the object to be inspected. If non-contact inspection is possible, the inspection board remains attached to the product, and If the board inspection and the integrated circuit inspection can be performed without supplying the power to the product, it is possible to reliably and promptly determine which part of the product is normal operation and which part is defective.

As described above, referring to FIG. 8, a third embodiment according to the present invention is capable of easily and easily performing integrated circuit inspection and circuit board inspection even after delivery to the end user. This will be described below. FIG. 8 is a diagram for explaining the inspection system of the third embodiment according to the present invention.

As shown in FIG. 8, also in the third embodiment, the IC maker 710 supplies the IC data to the inspection circuit maker 700 with the code application at the time of the IC circuit design, the inspection circuit pattern, and the ID number. Get issued. This series of processes is similar to that of the above-described first embodiment, and for example, the IC maker 710 incorporates a circuit inspection unit in the integrated circuit to manufacture an IC by the method shown in FIG.

Similarly, the assembly maker 720 makes a circuit application with the board information added when designing the circuit board. The inspection circuit maker 700 collects the inspection data from the assembly maker 7
20 and is also supplied to the center device 600 of the third embodiment. The center device 600 stores the inspection data in association with the board or the IC so as to be searchable in the inspection procedure storage unit 610.

Note that this center device may be operated and managed by the inspection circuit maker 700 that holds inspection data. The center apparatus 600 transmits the inspection procedure stored in the inspection procedure storage unit 610 to the required inspection apparatus (500) in accordance with a request from the inspection apparatus, which will be described later in detail in the contract state.

The center device 600 also associates the inspection procedure with the inspection procedure and the guideline data of the inspection result pass / fail judgment according to the inspection result when the inspection is performed according to the inspection procedure. It is stored in the storage unit 610.

FIG. 9 shows a configuration example of a recording table relating to the board inspection of the inspection storage unit 610 according to the third embodiment. Figure 9
FIG. 16 is a diagram showing an example of a board inspection control procedure recording table configuration of an inspection storage unit 610 according to the third embodiment.

As shown in FIG. 9, a unique board number storage unit 611 assigned to each board, an integrated circuit ID storage unit 612 indicating an IC mounted on the board, and a built-in IC mounted on the board. The inspection procedure sequence storage unit 613 in which the inspection procedure sequence for performing the board inspection by cooperating with the inspection circuit is stored, for example, the execution order, and the inspection result reference storage unit in which the expected inspection result at the time of executing the inspection procedure is stored. 61
4. The result determination standard storage unit 615 stores the quality determination standard of the inspection result.

In addition to the inspection procedure sequence associated with the board numbers shown in FIG. 9, the inspection storage unit 610 inspects the integrated circuit for each integrated circuit ID described in the first embodiment. The inspection data for each integrated circuit ID, which includes the inspection procedure sequence storage unit 613, the inspection result reference storage unit 614, and the result determination reference storage unit 615 for the integrated circuit ID alone, is also stored. If the integrated circuit ID is designated and the inspection procedure sequence for the IC is supplied, the inspection for each IC is also possible.

The inspection apparatus 500 is a handy type small machine as shown in the figure. For example, in addition to a small display screen and an operation unit, the inspection apparatus 500 is built in an IC mounted on a substrate corresponding to the power supply and transmission / reception antenna of the inspection apparatus described above. A main antenna 510 for outputting, for example, a high-frequency (microwave, millimeter wave, submillimeter wave, etc.) signal for supplying operating power to the tested inspection circuit unit and for data communication with the center apparatus 600.
And an antenna unit 520 for receiving the inspection result from the inspection circuit unit of the inspection procedure to the inspection circuit unit of the mounted IC on the inspection board.

In FIG. 8, reference numeral 800 denotes a substrate which is an assembly to be inspected, and it is not necessary to keep the substrate in an operating state. Even if the substrate is a single substrate or is still attached to the apparatus. Can be inspected, and even if the board mounting machine fails and cannot be supplied with operating power, the board can be inspected without any trouble.

The details of the substrate inspection according to the third embodiment of the present invention will be described below. Also in the third embodiment, the inspection apparatus and the inspection target substrate 800 or the mounting I
The inspection procedure transmission control with the C810, 820, 830, etc., and the inspection result reception control are the same as the control with the inspection device of the second embodiment described above. Therefore, in the following description, parts different from the above-described embodiment will be mainly described.

In the third embodiment, the inspection circuit incorporated in each IC holds the ID number unique to its own inspection circuit, as in the first embodiment, and the inspection device 5
The inspection control procedure wirelessly supplied via the antenna 520 of No. 00 is received, and the inspection function is realized according to the inspection control procedure as shown in FIGS. 6 and 7, for example.

That is, the circuit inspection unit of the IC holds the ID number unique to the IC, and the ID number included in the operation control procedure information wirelessly transmitted from the inspection device 500 and the held ID number. And the analog SW 36 can be controlled according to the inspection procedure received by the receiving means and the receiving means for receiving the matched information in its own circuit, and the connection / disconnection between the circuit patterns can be controlled. The inspection signal for inspection is output from the D / A 37 and is supplied to the circuit pattern in the connected state, and the inspection signal supplied by the supply device is used by using another pattern different from the circuit pattern supply portion. Detecting means for detecting the state between the circuit patterns and detecting the detection result by the detecting means by radio transmission to the inspection device 500 under the control described in the above embodiment. And a fruit transmitting means.

On the other hand, the inspection apparatus 500 can specify a board to be inspected by, for example, including a bar code reader to read board information with this bar code reader, or with a digital camera to photograph a board specifying portion. Information transmitting means for acquiring various information and transmitting it to the center device 600, and an inspection procedure for supplying to the circuit inspection part of the mounted integrated circuit transmitted from the center device 600 corresponding to the substrate information transmitted by the substrate information transmitting means. 52 for receiving and transmitting a unique ID number to the corresponding circuit inspection unit
0, a main antenna 510 that supplies the circuit inspection unit drive power by transmitting an electromagnetic wave, for example, a high frequency (microwave, millimeter wave, submillimeter wave, etc.) signal, and receives the inspection result transmitted from the inspection circuit unit. At the same time, it includes a judging means for judging whether the quality of the inspection result of the inspection circuit section is good or bad by obtaining it from the center device.

The center device 600 stores the inspection procedure corresponding to the inspection to be executed by each circuit inspection section of the board mounting integrated circuit created from the board mounting information acquired from the assembly maker 720 in association with the board information. Selection procedure transmitting means for selectively reading from the board inspection procedure storage means, selecting an inspection procedure to be executed from the board information from the inspection apparatus, and transmitting the selected inspection procedure to the requested inspection apparatus; and specifying the inspection apparatus with the board information. And a reference transmitting means for transmitting the inspection result pass / fail judgment standard.

Then, the selection procedure transmitting means is arranged to integrate the one of the integrated circuit units in the circuit inspection unit in order to inspect the quality of the circuit board pattern between at least two integrated circuits mounted on the inspection substrate. An in-circuit circuit inspection unit sends out an inspection procedure for connecting two circuit board patterns to each other, and an inspection procedure for outputting the inspection signal to the connected circuit board pattern to the circuit inspection unit of the other integrated circuit. Then, an inspection procedure for wirelessly transmitting the detection result of the detection signal is transmitted to the circuit inspection unit of the other integrated circuit.

That is, in the inspection apparatus 500, which board is operating normally, which board is defective, or which part of the board is normal when, for example, the machine of the end user is malfunctioning. In this way, it is possible to inspect which part is defective without supplying power to the product and only with the substrate to be inspected. Furthermore, it is possible to perform an inspection while the board is mounted on the product.

Therefore, it is constructed as a portable type. It is miniaturized to be portable, and the capacity of the content memory is limited. In addition, when the delivery destination of the product is the inspection place, the number of types of boards that are inspected is large, and it is not possible to provide all the inspection procedure information and the like in the inspection device.

Therefore, in the third embodiment, the inspection device 5
If all inspection control procedures are not stored in 00, a center device (inspection procedure storage unit) is separately provided, and various databases are built in the sensor device 600 so that the inspection device 500 can access it. There is not much difficulty in making a storage device of capacity.

Therefore, when the center device 600 is provided and the board identification information from the portable inspection device 500 is input, the inspection procedure information and the inspection for each mounted IC inspection circuit specified by the board information from the inspection procedure storage unit 610. The procedure execution order information, the inspection result pass / fail judgment reference information, and the like are transmitted to the required amount inspection device 500 for each transferable amount.

In the inspection apparatus 500, the control procedure shown in FIGS. 6 and 7, for example, is executed with the inspection board 800 according to the received information.

The inspection circuit inspection device 500 compares the inspection result from the circuit inspection portion of the inspection board with the quality determination criterion from the center device 600 to determine the quality of the inspection target portion and displays the result, for example, in the display portion. To display. This inspection result judgment display is notified when the inspection of all the boards is completed or when a serious defective portion is detected.

If the inspection device 500 cannot judge the quality by itself based on the received inspection result, or if a defect is detected, the inspection device 500 sends the inspection result to the center device 600 and requests the center device 600 to make a detailed determination. You may.
This enables highly reliable inspection.

As described above, according to the third embodiment, there is no limitation on the inspection board that can be inspected, and if the inspection circuit maker is requested to issue the inspection data, it can be surely contactless. Moreover, it is not necessary to supply a special drive power source, and the quality of the substrate can be automatically determined only by the control from the inspection device.
Further, for example, it is possible to inspect the board whether the board is mounted on the apparatus or removed.

Therefore, it is possible to perform a reliable board inspection even at a user site without special equipment. Also at this time, I
A desired inspection control procedure can be selectively transmitted to and executed by only one IC by the D number, and different inspection controls can be executed for each IC, and the inspection controls can be executed in cooperation with each other. The board inspection of any specifications can be applied simply by changing the control procedure information (inspection data) supplied from the inspection device to the circuit inspection unit.

By receiving the inspection data supplied from the center device, it is possible to reliably inspect the quality of various substrates even as a small portable inspection device.

[0128]

As described above, according to the present invention, it is possible to inspect an assembly mounted with an integrated circuit incorporating a circuit inspection unit for receiving an execution control procedure from the outside and inspecting the state of the circuit. The assembly design side provides the assembly procedure information to the inspection procedure design side and requests the assembly procedure inspection information to be provided, and the inspection procedure design side determines the integrated circuit information embedded in the assembly from the received assembly design information. Designing the inspection execution control procedure for inspecting the quality of the assembly from the mounting status between the integrated circuits, issuing the specific information that identifies the target assembly and providing the inspection execution control procedure design information, the assembly inspection side, Present the specific information for identifying the inspection target assembly issued earlier to the inspection procedure designer. Request the supply of the inspection execution control procedure for the assembly to be inspected, receive the assembly inspection control procedure sent, supply it to the desired integrated circuit of the assembly to execute the inspection procedure, receive the inspection result, and receive the assembly The feature is that the quality can be inspected.

With the above configuration, it is possible to surely supply and execute the control procedure according to the state of the inspection object at the time of inspecting the assembly, and for any inspection object or the surrounding condition of the inspection object. Changes,
Optimal inspection that can respond flexibly is realized.

Therefore, it is possible to inspect not only the assembly factory but also the assembly to be inspected even after delivery to the customer.

Furthermore, since the inspection can be carried out without contact, positioning of the inspection object is almost unnecessary. Further, a unique code is assigned in advance to each inspection circuit, and the inspection target can be inspected according to this unique code.

[Brief description of drawings]

FIG. 1 is a diagram for explaining the configuration of an integrated circuit in which an inspection circuit according to an embodiment of the present invention is incorporated.

FIG. 2 is a diagram showing a detailed configuration of a schematic configuration of a test circuit and a test device according to the present embodiment.

FIG. 3 is a flow chart for explaining integrated circuit inspection control using the inspection circuit of the present embodiment.

FIG. 4 is a diagram for explaining an integrated circuit inspection method by the inspection circuit 30 according to the present embodiment.

FIG. 5 is an overall conceptual diagram of an inspection circuit system in which inspection circuits of a second embodiment according to the present invention jointly perform an inspection including an assembly substrate.

FIG. 6 is a diagram for explaining a quality inspection including a substrate pattern according to a second embodiment of the present invention.

FIG. 7 is a flowchart for explaining inspection control of a mounting board according to a second embodiment.

FIG. 8 is a diagram for explaining an inspection system according to a third embodiment of the present invention.

FIG. 9 is a diagram showing a configuration example of a board inspection control procedure recording table in an inspection storage unit of a center device according to a third embodiment.

[Explanation of symbols]

10 Integrated circuit (IC) chip (die) 11 connection pad 15 IC circuit wiring 20 Integrated circuits (IC circuits) 30 inspection circuit 31 Power receiving unit 32 decoder 33 Control logic 34 Control procedure storage 35 encoder 36 Analog Switch (Analog SW) 37 Digital-Analog Converter (D / A) 38 Analog-digital converter (A / D) 39 Transmitter 40 inspection wiring 200 Inspection device body 210 display 220 Operation part 230 power supply / reception antenna 500 Portable inspection device 510 main antenna 520 antenna 600 center equipment 610 Inspection procedure storage unit 700 Inspection circuit maker

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2G014 AA03 AA08 AA13 AB59 AC09                 2G132 AA01 AA20 AB00 AD15 AE23                       AG01 AH01 AK07 AL12

Claims (10)

[Claims] 1. An inspection system capable of inspecting an assembly having an integrated circuit in which a circuit inspection unit for receiving an execution control procedure from the outside to inspect a circuit state is inspected, wherein the assembly design side is an inspection procedure design. The assembly design information is provided to the side and the inspection procedure of the assembly is requested to be provided.The inspection procedure design side uses the received assembly design information based on the integrated circuit information embedded in the assembly and the mounting state between the integrated circuits It is possible to design the inspection execution control procedure for inspecting the quality of the product, issue specific information to identify the target assembly, and provide the inspection execution control procedure design information. The inspection target assembly by presenting specific information that identifies the above-mentioned inspection target assembly issued to Requesting the supply of the inspection execution control procedure for the assembly, receiving the assembly inspection control procedure sent to the assembly, supplying the assembly to the desired integrated circuit, executing the inspection procedure, and receiving the inspection result to inspect the quality of the assembly. An inspection system characterized by what is possible. 2. The circuit inspecting unit incorporated in the integrated circuit is assigned a unique identification number to the circuit inspecting unit supplied at the time of designing the integrated circuit. The inspection execution control procedure for the circuit inspection unit of the integrated circuit is distributed to the necessary inspection circuit unit by the unique identification number and executed, and at least two integrated circuit embedded circuit inspection units cooperate to execute the inspection. The inspection system according to claim 1, wherein the inspection procedure execution control procedure is supplied so as to perform the inspection procedure execution control procedure. 3. The integrated circuit built-in circuit inspection unit mounted on the inspection target assembly requests the inspection circuit design by providing integrated circuit design information to the inspection circuit design side when the integrated circuit design side designs the integrated circuit. , The inspection circuit design side,
Based on the received integrated circuit design information, an inspection circuit that is incorporated in the integrated circuit to inspect the quality of the integrated circuit and an inspection execution control procedure by the inspection circuit are designed, and the inspection circuit design information and the inspection execution control procedure are described above. 3. The inspection system according to claim 1, wherein the inspection system is issued to the integrated circuit designing side, and the integrated circuit is manufactured by incorporating the inspection circuit designed by the integrated circuit designing side. 4. The assembly inspection side holds the inspection execution control procedure, and sequentially transmits the inspection execution control procedure held during integrated circuit inspection to the inspection circuit to execute circuit inspection. 4. The inspection system according to claim 1, wherein the assembly inspection is performed by using an inspection device which receives the result from the inspection circuit and executes the inspection of the integrated circuit. 5. The inspection procedure designing side designs an inspection execution control procedure for inspecting the quality of an assembly from the received assembly design information based on the integrated circuit information incorporated in the assembly and the mounting status between the integrated circuits. Then
Inspection execution control corresponding to the specific information specifying the assembly from the inspection execution control procedures held when the assembly execution side holds the inspection execution control procedure and receives the specific information specifying the assembly from the assembly inspection side The inspection system according to any one of claims 1 to 4, wherein a procedure is selected and provided to the assembly inspection side. 6. An inspection method in an inspection system capable of inspecting an assembly in which an integrated circuit having a circuit inspection unit for receiving an execution control procedure from the outside to inspect a circuit state is inspected. Inspection procedure The assembly design information is provided to the design side, and the inspection procedure design request for the assembly is requested.The inspection procedure design side uses the received assembly design information and the integrated circuit information embedded in the assembly and mounting between integrated circuits. Design an inspection execution control procedure to inspect the quality of the assembly based on the situation, issue specific information that identifies the target assembly, and provide inspection execution control procedure design information.On the assembly inspection side, the inspection procedure design side is provided. On the other hand, the inspection is performed by presenting specific information for identifying the above-mentioned assembly subject to inspection. Request the supply of the inspection execution control procedure for the target assembly, receive the assembly inspection control procedure sent, supply it to the desired integrated circuit of the assembly, execute the inspection procedure, receive the inspection result, and check the quality of the assembly. An inspection method characterized by being able to inspect. 7. The circuit inspection unit incorporated in the integrated circuit is assigned a unique identification number to the circuit inspection unit supplied at the time of designing the integrated circuit. The inspection execution control procedure for the circuit inspection unit of the integrated circuit is distributed to the necessary inspection circuit unit by the unique identification number and executed, and at least two integrated circuit embedded circuit inspection units cooperate to execute the inspection. The inspection method according to claim 6, wherein the inspection procedure execution control procedure is supplied so as to perform the inspection procedure execution control procedure. 8. The integrated circuit built-in circuit inspection unit mounted on the inspection target assembly requests the inspection circuit design by providing integrated circuit design information to the inspection circuit design side when the integrated circuit design side designs the integrated circuit. , The inspection circuit design side,
Based on the received integrated circuit design information, an inspection circuit that is incorporated in the integrated circuit to inspect the quality of the integrated circuit and an inspection execution control procedure by the inspection circuit are designed, and the inspection circuit design information and the inspection execution control procedure are described above. 8. The inspection method according to claim 6 or 7, wherein the integrated circuit is manufactured by issuing the integrated circuit to the integrated circuit design side and incorporating the inspection circuit designed by the integrated circuit design side. 9. The assembly inspection side holds the inspection execution control procedure, and sequentially transmits the inspection execution control procedure held during integrated circuit inspection to the inspection circuit to execute circuit inspection. 9. The inspection method according to claim 6, wherein an assembly inspection is performed by using an inspection device which receives the result from the inspection circuit and executes the inspection of the integrated circuit. 10. The inspection procedure designing side designs an inspection execution control procedure for inspecting the quality of an assembly from the received assembly design information, based on the integrated circuit information incorporated in the assembly and the mounting state between the integrated circuits. Then, the inspection execution control procedure for each assembly is held, and the inspection corresponding to the specific information specifying the assembly is held from the held inspection execution control procedure when the specific information specifying the assembly is received from the assembly inspection side. The inspection system according to any one of claims 6 to 9, wherein an execution control procedure is selected and provided to the assembly inspection side.