JP2003046242A - Multilayer wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To resolve the problem of generation of power supply noise caused by an inductance element of a through conductor in a high frequency region of 1 GHz or more in a multilayer wiring board with a built-in capacity element. SOLUTION: In a multilayer wiring board 4, insulation layers 1a to 1e consisting of an organic material are laminated and a wiring conductor 2 is formed in the surface of the insulation layers 1a to 1e, dielectric powder of 20 or more specific inductive capacity is incorporated in at least one layer of the insulation layers 1a to 1e, and a capacitor element A is formed by holding the wiring conductor 2 coated with the insulation layer 1c up and down as an electrode 2a in opposition. In the multilayer wiring board 4, the capacity element A is connected to a wiring conductor 3 via two through conductors 3 per one electrode 2a. It is possible to reduce power source noise generated by an inductance element of the through conductor 3 negligibly and to obtain the multilayer wiring board 4 which is excellent in noise reduction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-layer wiring board used for electronic equipment such as various kinds of AV equipment, home electric appliances, communication equipment, computers and peripheral equipments thereof.

[0002]

2. Description of the Related Art Conventionally, an electronic component module such as a hybrid integrated circuit, in which a large number of active components such as semiconductor elements and passive components such as capacitance elements and resistance elements are mounted to form a predetermined electronic circuit, is usually A semiconductor element, a capacitive element, a resistance element, etc. are formed on the surface of an insulating substrate made of a ceramic material such as alumina, and a plurality of wiring conductors made of a refractory metal powder such as tungsten and molybdenum formed inside and on the surface. Are mounted and attached, and these electrodes are connected to each wiring conductor.

However, such a wiring substrate is formed by printing and applying a conductive paste whose wiring conductor is made of a refractory metal powder such as tungsten or molybdenum in a predetermined pattern by using a thick film technique such as screen printing. Therefore, there is a problem that it is difficult to miniaturize the wiring conductor and the wiring conductor cannot be formed at a high density.

Further, in the conventional wiring board, when a large number of active components such as semiconductor elements and passive components such as capacitance elements and resistance elements are mounted on the surface, the board becomes large according to the number of mounted components. He also had points.

In order to solve such a problem, Japanese Unexamined Patent Publication No. 11-68319 discloses that a plurality of organic material insulating layers and a plurality of thin film wiring conductors are alternately laminated in a multi-layer structure, and a high dielectric constant powder is used. There has been proposed a multilayer wiring board in which a capacitive element is formed inside by using an organic material insulating layer containing OH and counter electrodes sandwiching the insulating layer.

According to this multilayer wiring board, since the wiring conductor is formed of a thin film, the wiring can be miniaturized, the wiring can be formed with extremely high density, and the capacitive element is provided inside the multilayer wiring board. Since electronic components such as semiconductor elements, capacitors and resistors are mounted on the multilayer wiring board to form a multilayer wiring board such as a hybrid integrated circuit device, many capacitive elements are separately mounted on the multilayer wiring board. As a result, the number of components mounted on the multilayer wiring board can be reduced and the size can be reduced. The electrodes of the capacitive element formed inside are electrically connected to the wiring conductors formed on the front surface and the back surface of the multilayer wiring board through the penetrating conductors formed inside.

[0007]

However, in recent years,
With the increase in communication speed, electronic devices such as communication devices have come to be used in a high frequency range of 1 GHz or higher. In such a high frequency range, the inductance component of the through conductor of the multilayer wiring board is large. And ΔV = L
The power supply noise ΔV generated by the inductance component defined by dI / dt (ΔV is power supply noise, L is inductance, I is current value, and t is time) becomes too large to be ignored, and electronic devices such as communication equipment There was a problem that malfunctions were caused in the devices.

The present invention has been devised in view of the problems of the prior art, and an object thereof is to generate a small amount of noise even in a high frequency region of 1 GHz or higher and to cause malfunctions in electronic equipment such as communication equipment. It is to provide a multi-layer wiring board that does not cause it.

[0009]

In a multilayer wiring board of the present invention, a plurality of insulating layers made of an organic material are laminated, wiring conductors are formed on the surfaces of these insulating layers, and the wiring conductors are located above and below the insulating layers. At least one layer of a multilayer wiring board formed by electrically connecting wiring conductors through a through conductor formed in an insulating layer contains a dielectric powder having a relative dielectric constant of 20 or more, and the upper and lower surfaces of this insulating layer are both In a multi-layer wiring board in which a capacitive element is formed by sandwiching the deposited wiring conductor as an electrode, the capacitive element is connected to the wiring conductor through two or more penetrating conductors per electrode. To do.

In the multilayer wiring board of the present invention having the above structure, the cross-sectional shape in the thickness direction of the insulating layer of the through conductor connected to the electrode of the capacitive element is such that the lengths of the bases located on the upper and lower surfaces of the insulating layer are the same. It is characterized in that the shapes are different trapezoids, and the sizes of the lengths of the upper and lower bases of the adjacent ones are reversed.

According to the multilayer wiring board of the present invention, since the capacitive element is connected to the wiring conductor through two or more penetrating conductors per electrode, the inductance component L can be made small. As a result, it is possible to obtain a multi-layer wiring board that generates less noise even in a high frequency region of 1 GHz or higher and does not cause malfunctions in electronic devices such as communication devices.

Further, according to the multilayer wiring board of the present invention, the cross-sectional shape of the through conductor connected to the electrode of the capacitive element in the thickness direction of the insulating layer is such that the lengths of the bases located on the upper and lower surfaces of the insulating layer are different from each other. From the trapezoidal shape, when forming the through conductor by filling the through hole with the conductive paste, the conductive paste can be satisfactorily filled by filling the bottom of the through hole from the longer side. As a result, the filling factor of the conductive paste can be increased, the resistance of the through conductor can be reduced, and the inductance component can be reduced. Further, since the size relation of the lengths of the upper and lower bases of the adjacent through conductors is reversed, it is possible to arrange the through conductors at a high density, and the number of through conductors that can be arranged per unit area. Therefore, it is possible to reduce the inductance component of the through conductor connected to the electrode of the capacitive element, and as a result, it is possible to obtain a multilayer wiring board having a large noise reduction effect.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Next, a multilayer wiring board of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an example of an embodiment of a multilayer wiring board of the present invention. In the example of this figure, a semiconductor element is mounted as an electronic component on the multilayer wiring board. In this figure, 1 is an insulating substrate composed of a plurality of insulating layers, 2 is a wiring conductor, 3 is a through conductor, and these mainly constitute the multilayer wiring board 4 of the present invention.

In this example, the insulating substrate 1 is formed by laminating five layers of insulating layers 1a, 1b, 1c, 1d and 1e made of an organic material. On the surface of the insulating substrate 1, electrons such as semiconductor elements are formed. The component 5 is connected and fixed via a connecting material 6 such as solder. Also,
In this example, the insulating layers 1a, 1b, 1c, 1d constituting the insulating substrate 1
.At least one layer of 1e (insulating layer 1c in the example of this figure)
Contains a dielectric powder having a relative permittivity of 20 or more, and further sandwiches an insulating layer 1c with electrodes 2a made of a part of the wiring conductor 2 adhered to the upper and lower surfaces thereof to form a capacitive element A. Is forming.

The insulating substrate 1 is an electronic component 5 such as a semiconductor element.
This insulating base 1 has a function as a support for supporting
The insulating layers 1a, 1b, 1c, 1d, and 1e forming the are made of an organic material.

As the organic material for forming the insulating layers 1a, 1b, 1d, 1e, thermosetting resin such as epoxy resin, phenol resin, polyimide resin, allyl-modified polyphenylene ether resin, bismaleimide triazine resin, liquid crystal polyester, fluorine Thermoplastic resin such as resin, polyphenylene ether resin, polyester resin, etc. are used. Above all, workability when forming the insulating layers 1a, 1b, 1d, 1e and insulation characteristics and heat resistance of the insulating layers 1a, 1b, 1d, 1e Thermosetting resins such as epoxy resin, polyimide resin, and allyl-modified polyphenylene ether resin are preferable from the viewpoint of characteristics and mechanical characteristics.

The insulating layers 1a, 1b, 1d, 1e are made of aluminum oxide / silicon nitride / aluminum nitride / silicon carbide / titanium oxide for the purpose of adjusting the thermal expansion coefficient and / or improving the mechanical strength. Inorganic insulating powder such as barium oxide, strontium oxide, zirconium oxide, calcium oxide, zeolite, etc., filler such as glass cloth woven with cloth-like glass or non-woven fabric made of fibrous organic material, organic material and inorganic insulating powder Coupling agents such as silane-based coupling agents and titanate-based coupling agents for the purpose of improving the bonding property of the insulating substrate 1 and the mechanical strength of the insulating substrate 1, and an antioxidant for improving the thermal stability. , A light stabilizer such as an ultraviolet absorber for the purpose of improving light resistance, a halogen-based / phosphoric acid-based flame retardant for the purpose of improving flame retardancy, and Nchimon compounds, zinc borate,
Flame retardant aids such as barium metaborate and zirconium oxide,
For the purpose of improving lubricity, one or more kinds of substances having an external lubricant effect such as higher fatty acid, higher fatty acid ester, higher fatty acid metal salt, fluorocarbon-based surfactant and the like may be added if necessary.

Such an insulating substrate 1 has, for example, a grain size of 0.
Inorganic insulating powder such as aluminum oxide, silicon nitride, aluminum nitride, silicon carbide, titanium oxide, barium oxide, strontium oxide, zirconium oxide, calcium oxide, etc. of 1 to 15 μm, epoxy resin, phenol resin,
Conventionally well-known pastes obtained by adding and mixing thermosetting resins such as polyimide resins, bismaleimide resins, allyl-modified polyphenylene ether resins, etc. or thermoplastic resins such as liquid crystal polyesters, polyphenylene ether resins, etc. with solvents, plasticizers, dispersants, etc. A plurality of precursor sheets to be the insulating layers 1a, 1b, 1d, and 1e in the insulating base 1 are obtained by adopting a sheet forming method such as the doctor blade method described above to obtain a plurality of insulating sheets 1a, 1b, 1d.・ The precursor sheet to be 1e and the precursor sheet to be the insulating layer 1c to be described later were subjected to perforation processing, if necessary, by employing a conventionally known laser processing method, and the perforation processing was performed. Insulation layer 1a ・ 1b ・ 1c ・
1d and 1e are laminated and pressure-bonded in a predetermined order, and finally, the laminated and pressure-bonded insulating layers 1a, 1b, 1c, 1d and 1e are heated for 30 minutes to 24 at a temperature of about 100 to 300 ° C and a pressure of 0.4 to 10 MPa. It is manufactured by hot pressing for a period of time and heat curing.

The insulating layer 1c is made of an organic material and contains 10 to 70% by volume of dielectric powder having a relative dielectric constant of 20 or more. The capacitive element A is formed by being sandwiched between the electrodes 2a, which are partially formed.

According to the multi-layer wiring board 4 of the present invention, since such a capacitive element A is formed inside, electronic components 5 such as semiconductor elements, capacitive elements and resistors are mixedly mounted on the multi-layer wiring board 4. When manufacturing an electronic component module such as a hybrid integrated circuit, it is not necessary to separately mount a large number of capacitive elements on the multilayer wiring board 4, and as a result, the number of components mounted on the multilayer wiring board 4 is reduced, resulting in a multilayer wiring board. 4 and the electronic component module can be downsized.

As the dielectric powder having a relative dielectric constant of 20 or more contained in the insulating layer 1c, inorganic dielectric powders such as titanium oxide, barium oxide, strontium oxide, zirconium oxide, calcium oxide, etc., and their compounds / mixtures are used. Fibrous high dielectric powder such as potassium titanate whisker, aluminum borate whisker, acicular titanium oxide, silica alumina fiber, alumina fiber, barium titanate, calcium titanate, strontium titanate, barium stannate, barium zirconate・ High dielectric powder such as strontium zirconate is used, and its dielectric constant is 20 (room temperature 1 MH
If it is smaller than z), the relative dielectric constant of the insulating layer 1c becomes small, and the capacitive element A tends to become unusable. Therefore, it is important that the dielectric powder contained in the insulating layer 1c has a relative dielectric constant of 20 or more.

Further, the content of the dielectric powder is an insulating layer.
If it is less than 10% by volume with respect to 1c, the relative dielectric constant of the insulating layer 1c tends to be small, and it tends to be difficult to form the capacitor A that can be put to practical use. The kneadability of the materials tends to decrease, and it tends to be difficult to manufacture the insulating layer 1c. Therefore, the content of the dielectric powder is preferably in the range of 10 to 70% by volume.

Further, the average particle diameter of the dielectric powder is 0.1 to 1
The average particle size is preferably 0.1 μm, preferably in the range of 5 μm.
If it is less than that, the specific surface area becomes large and the viscosity of the kneaded product in which the dielectric powder is added and mixed becomes high, and as a result, the thickness of the insulating layer 1c becomes uneven when the insulating layer 1c is formed, and the predetermined It tends to be difficult to obtain a uniform thickness. On the other hand, if the average particle diameter exceeds 15 μm, irregularities due to the dielectric powder are formed on the surface of the insulating layer 1c, the relative permittivity varies in the region where the capacitive element A is formed, or the insulating layer 1c is perforated. There is a tendency that the processing accuracy at the time of applying is reduced. Therefore, the dielectric powder contained in the insulating layer 1c preferably has an average particle size in the range of 0.1 to 15 μm, and more preferably 0.3 to 10 μm.

The precursor sheet to be the insulating layer 1c is, for example, a dielectric powder such as titanium oxide or strontium titanate / calcium titanate / magnesium titanate / potassium titanate having an average particle size of about 0.1 to 15 μm. In addition, an organic material such as allyl-modified polyphenylene ether or cyanate resin, and a paste obtained by adding an appropriate solvent, plasticizer, dispersant, etc. are used to form a sheet using a conventionally known sheet forming method such as a doctor blade method. With eggplant, 60 ~
It is manufactured by heating at a temperature of 100 ° C. for 5 minutes to 3 hours.

In addition, on the insulating substrate 1 composed of the insulating layers 1a, 1b, 1c, 1d, 1e, the wiring conductor 2 is formed on the surface of the insulating layers 1a, 1b, 1c, 1d, 1e and The capacitive element A is formed by sandwiching the insulating layer 1c between the electrodes 2a which are partially formed. Furthermore, between the wiring conductors 2 located above and below with the insulating layers 1a, 1b, 1c, 1d, 1e interposed (excluding between the electrodes 2a)
Through conductors 3 for electrically connecting the above are formed.

The wiring conductor 2 and the penetrating conductor 3 have a function of electrically connecting an electronic component 5 such as a semiconductor element mounted on the multilayer wiring board 4 to an external electric circuit (not shown). A part of the conductor 2 also has a function as the electrode 2a of the capacitive element A.

Such a wiring conductor 2 has insulating layers 1a, 1b,
On the surface of multiple precursor sheets 1c, 1d, and 1e, a low resistance metal such as copper, silver, and gold is formed by a conventionally known screen printing method, or a metal foil made of patterned copper, gold, etc. is formed. It is formed by adopting a thin film forming method such as a deposition method by a transfer method, an electroless plating method, a vapor deposition method, a sputtering method or the like. In addition, the wiring conductor 2 is 1G
For the purpose of transmitting a signal in a high frequency region of Hz or higher with a further reduced loss, a line such as a conventionally known strip line, microstrip line, coplanar line, or dielectric waveguide line may be used.

In the multilayer wiring board 4 of the present invention, since the wiring conductor 2 is formed of a thin film as described above, the wiring conductor 2 can be miniaturized, and the wiring conductor 2 can be formed with extremely high density. It is possible to make a small multilayer wiring board 4.

The capacitance value of the capacitive element A is determined by the function required of the multilayer wiring board 4, and the relative permittivity and content of the dielectric powder contained, the thickness of the insulating layer 1c, the capacitance element A It is determined by appropriately determining the area and the like of the electrode 2a.

The penetrating conductor 3 has insulating layers 1a, 1b, 1c,
After forming a through hole by laser drilling on multiple precursor sheets that will be 1d and 1e, copper.
It is formed by embedding a conductive paste made of silver, gold or the like by a screen printing method or the like.

In the multilayer wiring board 4 of the present invention, it is preferable that the capacitive element A is connected to the wiring conductor 2 via two or more penetrating conductors 3 for each electrode 2a. is important.

According to the multilayer wiring board 4 of the present invention, since the capacitive element A is connected to the wiring conductor 2 through two or more penetrating conductors 3 for each electrode 2a, for example, the multilayer wiring board 4 is used. In the case where the semiconductor element 5 is mounted on, and one electrode 2a forming the capacitive element A is connected to the power supply terminal of the semiconductor element 5 and the other electrode 2a is connected to the ground terminal of the semiconductor element 5, one electrode of the capacitive element A is connected. The reciprocal of the total inductance L of the through conductors 3 connected to 2a is the sum of the reciprocals of the inductances 1 of the respective through conductors 3 (the through conductor 3 of the inductance 1
In the case where n are formed, assuming that the total inductance is L, 1 / L = 1 / l ₁ + 1 / l ₂ + ... + 1 / l _n , that is, L = 1 / n), and the inductance of the through conductor 3 The component L can be smaller than that when the electrode 2a of the capacitive element A is connected to the wiring conductor 2 through one penetrating conductor 3, and as a result, noise components are generated even in a high frequency region of 1 GHz or higher. Multi-layer wiring board 4 that rarely occurs and does not cause malfunctions in electronic devices such as communication devices
Can be

Further, in the multilayer wiring board 4 of the present invention, the insulating layer of the through conductor 3 connected to the electrode 2a of the capacitive element A is formed.
Insulating layers 1b and 1d are
It is preferable that the bases located on the upper and lower surfaces have different trapezoidal shapes.

According to the multilayer wiring board 4 of the present invention, the cross-sectional shape in the thickness direction of the insulating layers 1b and 1d of the through conductor 3 connected to the electrode 2a of the capacitive element A is located on the upper and lower surfaces of the insulating layers 1b and 1d. Since the bases having different lengths have different trapezoidal shapes, by filling the conductive paste into the through holes to form the through conductors 3, the conductive paste is filled from the longer bottom side. The filling can be excellently performed, and as a result, the filling rate of the conductive paste can be increased, the resistance of the through conductor 3 can be reduced, and the inductance component can be reduced.

Further, in the multilayer wiring board 4 of the present invention, it is preferable that the penetrating conductor 3 is formed by reversing the magnitude relationship between the lengths of the upper and lower bases of the adjacent penetrating conductors 3, and this is important. Is.

In the multilayer wiring board 4 of the present invention, since the through conductors 3 are formed by reversing the magnitude relation of the lengths of the upper and lower bases of the adjacent through conductors 3, the through conductors 3 are arranged at high density. Since it is possible to increase the number of through conductors 3 that can be arranged per unit area, it is possible to reduce the inductance component of the through conductor 3 connected to the electrode 2a of the capacitive element A. As a result, the multilayer wiring board 4 having a large noise reduction effect can be obtained.

The through conductor 3 as described above has a desired cross-sectional shape in the thickness direction of the insulating layers 1b and 1d by adjusting the laser energy or the thickness of the insulating layer by using a laser processing method. It can be trapezoidal. Then, laser drilling is performed from one surface side of the insulating layers 1b and 1d to form a through hole and a conductive paste is embedded to form a through conductor 3, and then the other of the insulating layers 1b and 1d is continuously formed. Laser drilling is performed from the front surface side to form a through hole and a conductive paste is embedded to form a through conductor 3, thereby reversing the magnitude relationship between the lengths of the upper and lower bases of the cross sectional shape of the adjacent through conductors 3. It is possible to form a plurality of penetrating conductors 3.

The through conductor 3 connected to the electrode 2a has a reduced resistance and a good conductivity.
The diameter is preferably 20 μm or more. From the viewpoint of arranging the through conductors 3 at a high density, the diameter is 250
It is preferably μm or less. Therefore, the diameter of the through conductor 3 connected to the electrode 2a is preferably 20 to 250 μm.

If the length of the longer bottom side of the through conductor 3 is less than 1.2 times the length of the shorter bottom side, the filling rate of the conductive paste decreases and the through conductor 3 The resistance value of increases and tends to cause noise. On the other hand,
When it exceeds 3 times, there is a high risk that desmear after laser drilling becomes difficult and conduction failure occurs. Therefore, the through conductor 3
The length of the longer bottom side of the cross-sectional shape is preferably 1.2 to 3 times the length of the shorter bottom side.

Further, the wiring conductor 2 and the through conductor 3 are formed by depositing nickel or gold, which has excellent corrosion resistance and a metal of good conductivity, on the exposed surface to a thickness of 1.0 to 20 μm by a plating method. And the wiring conductor 2 and the through conductor 3 can be effectively prevented from being oxidized and corroded, and the wiring conductor 2 and the through conductor 3 and the electronic component 5 such as a semiconductor element or the wiring conductor (not shown) of the external electric circuit can be firmly fixed. Can be electrically connected to. Therefore, it is preferable that the exposed surfaces of the wiring conductors 2 and the through conductors 3 are coated with a metal having excellent corrosion resistance such as nickel or gold and having a good conductivity in a thickness of 1.0 to 20 μm by a plating method. .

Thus, according to the multilayer wiring board 4 of the present invention, since the capacitive element A is connected to the wiring conductor 2 via two or more penetrating conductors 3 for each electrode 2a, the inductance component L is small. As a result, it is possible to obtain the multilayer wiring board 4 in which noise is hardly generated even in a high frequency region of 1 GHz or higher and a malfunction does not occur in electronic devices such as communication devices. Moreover, the cross-sectional shape in the thickness direction of the insulating layers 1b and 1d of the through conductor 3 connected to the electrode 2a of the capacitive element A is shown in FIG.
Since the bases located on the upper and lower surfaces of 1d have trapezoidal shapes having different lengths, when the conductive paste is filled in the through holes to form the through conductors 3, the conductive paste is not It is possible to satisfactorily fill by filling from the longer side. As a result, the filling rate of the conductive paste can be increased, the resistance of the through conductor 3 can be reduced, and the inductance component can be reduced. Further, since the magnitude relation between the lengths of the upper and lower bases of the adjacent through conductors 3 is reversed, the through conductors 3 can be arranged at a high density, and the through conductors can be arranged per unit area. Since the number of 3 can be increased, the inductance component of the through conductor connected to the electrode of the capacitive element A can be reduced, and as a result, the multilayer wiring board 4 having a large noise reduction effect can be obtained.

The multilayer wiring board 4 of the present invention is not limited to the above-mentioned embodiments, but various modifications can be made without departing from the scope of the present invention. Then, the insulating substrate 1 was manufactured by stacking 5 layers of insulating layers 1a, 1b, 1c, 1d, and 1e.
The insulating substrate 1 may be manufactured by stacking layers or 6 or more insulating layers. Further, in the above-mentioned embodiment, the insulating layer containing the dielectric powder is one layer, but it may be two layers (including a continuous layer) or more.

In the above embodiment, the capacitive element A is formed by sandwiching the insulating layer 1c containing the dielectric powder as the electrode 2a by one layer, but may be formed by sandwiching two or more layers. .

[0045]

According to the multilayer wiring board of the present invention, since the capacitive element is connected to the wiring conductor through two or more penetrating conductors per electrode, the inductance component L can be made small. As a result, it is possible to obtain a multi-layer wiring board that hardly generates noise even in a high frequency region of 1 GHz or more and does not cause malfunctions in electronic devices such as communication devices.

Further, according to the multilayer wiring board of the present invention, the cross-sectional shape of the through conductor connected to the electrode of the capacitive element in the thickness direction of the insulating layer is different in the lengths of the bases located on the upper and lower surfaces of the insulating layer from each other. From the trapezoidal shape, when forming the through conductor by filling the through hole with the conductive paste, the conductive paste can be satisfactorily filled by filling the bottom of the through hole from the longer side. As a result, the filling factor of the conductive paste can be increased, the resistance of the through conductor can be reduced, and the inductance component can be reduced. Further, since the size relation of the lengths of the upper and lower bases of the adjacent through conductors is reversed, it is possible to arrange the through conductors at a high density, and the number of through conductors that can be arranged per unit area. Therefore, it is possible to reduce the inductance component of the through conductor connected to the electrode of the capacitive element, and as a result, it is possible to obtain a multilayer wiring board having a large noise reduction effect.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of a multilayer wiring board of the present invention, which is an example in which electronic parts are mounted.

[Explanation of symbols]

1 ... Insulating substrate 1a ・ 1b ・ 1d ・ 1e ・ ・ Insulating layer Insulation layer (insulation layer containing dielectric powder) 2 ・ ・ ・ ・ ・ ・ Wiring conductor 2a ・ ・ ・ ・ ・ ・ Electrodes 3 ・ ・ ・ ・ ・ ・ Through conductor 4 ... Multi-layer wiring board A ... Capacitive element

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 5E317 AA24 BB02 BB03 BB12 BB13                       BB14 CC22 CC25 CD21 CD32                       GG11                 5E346 AA12 AA13 AA43 CC04 CC05                       CC08 CC09 CC10 CC32 CC38                       CC39 DD02 DD17 DD23 EE04                       FF18 GG15 GG28 HH02 HH06

Claims (2)

[Claims] 1. A plurality of insulating layers made of an organic material are laminated, wiring conductors are formed on the surfaces of these insulating layers, and the insulating layers are formed between the wiring conductors located above and below the insulating layer. At least one layer of a multilayer wiring board electrically connected via through conductors contains dielectric powder having a relative dielectric constant of 20 or more, and the wiring conductors adhered on the upper and lower surfaces of this insulating layer are used as electrodes. In a multilayer wiring board in which a capacitive element is formed by sandwiching it between the capacitive elements, the capacitive element is connected to the wiring conductor via two or more penetrating conductors for each electrode. . 2. The cross-sectional shape in the thickness direction of the insulating layer of the through conductor connected to the electrode is trapezoidal in which the lengths of the bottom sides located on the upper and lower surfaces of the insulating layer are different from each other, and the adjacent ones are adjacent to each other. 2. The multilayer wiring board according to claim 1, wherein the magnitude relationships of the lengths of the upper and lower bases are reversed.