JP4467612B2 - Multi-layer wiring board with built-in capacitor element - Google Patents

Description

  The present invention relates to a multilayer wiring board with a built-in capacitor element used in various AV equipment, home appliances, communication equipment, computers, and electronic equipment such as peripheral equipment.

  Conventionally, a wiring board has a plurality of wiring conductors formed inside and on the surface of an insulating layer made of a ceramic material such as alumina or an organic resin material such as glass epoxy resin, and the wiring conductors located above and below are insulated from each other. Electrical connections are made through through conductors formed in the layers, and electronic elements such as semiconductor elements, capacitors and resistance elements are mounted on the surface of the wiring board, and these electrodes are connected to the respective wiring conductors. Thus, an electronic device used for an electronic device is formed.

  However, in recent years, electronic devices have been required to be small, thin, and lightweight as represented by mobile communication devices, and wiring boards mounted on such electronic devices are also required to be small and high in density. It has come to be.

In order to meet such demands, Japanese Patent Application Laid-Open No. 11-220262 discloses a chip inside the wiring board for the purpose of reducing the number of electronic elements mounted on the surface of the wiring board and reducing the size of the wiring board. It has been proposed to mount a capacitor element.
JP-A-11-220262

  In recent years, a further miniaturization of electronic devices has been demanded, and along with the miniaturization of the wiring board, the capacitor element incorporated in the wiring board has also been demanded to be miniaturized.

  However, in order to incorporate a chip-like capacitor element as disclosed in JP-A-11-220262 in a wiring board and make an electrical connection with a wiring conductor or a through conductor inside the wiring board, It is necessary to form a surface electrode made of solder or conductive paste on the lower surface by a method such as a screen printing method. However, it is difficult to form a fine surface electrode as the capacitor element is downsized. There is a problem that it is difficult to reduce the size of the built-in capacitor element.

  Furthermore, in recent years, with the increase in communication speed, electronic devices such as communication devices have come to be used in a high frequency region having a frequency of several hundred MHz or more. An inductance component resulting from the length of a wiring conductor connecting an electronic component such as a semiconductor element cannot be ignored. For this reason, when a chip-like capacitor element is built in the wiring board, electrode lead-out from each electrode layer of the capacitor element to the end face electrode on the side surface of the capacitor element, and electrode lead-out to the upper surface and / or the lower surface of the capacitor element is performed. Since there is routing, the inductance component due to the length of the routing electrode becomes large, and is defined by ΔV = L · dI / dt (ΔV is power supply noise, L is inductance, I is current value, and t is time) As a result, the power supply noise ΔV generated by the generated inductance component becomes so large that it cannot be ignored, causing malfunctions in electronic devices such as communication devices.

  The present invention has been devised in view of the problems of the prior art, and its purpose is a small capacitor that generates less noise and does not cause malfunction in electronic devices such as communication devices. It is to provide an element.

The multilayer wiring board with a built-in capacitor element according to the present invention includes a multilayer body formed by laminating a plurality of insulating layers made of a resin , a plurality of conductors penetrating the insulating layer, a plurality of electrode layers, A capacitor body having a laminate formed by alternately laminating ceramic dielectric layers, and a plurality of lead electrode portions penetrating the laminate in the stacking direction, wherein the capacitor element is located above and below the capacitor element. The precursor sheet to be the insulating layer is stacked on the substrate , and the precursor sheet is cured to be fixed to the insulating layer and to be separated from the upper surface and the lower surface of the multilayer wiring substrate. The plurality of insulating layers have a first main surface facing the capacitor element in a vertical direction and a second main surface located on the opposite side of the first main surface. Includes an edge layer, the lead-out electrode portion, characterized in that it is connected to the conductor in the protruding portion with projecting into the second main surface side of the tip portion first major surface And

  The multilayer wiring board with a built-in capacitor element according to the present invention is characterized in that a part of the lead electrode portion protrudes outside the main surface of the multilayer body of the capacitor element and is connected to the conductor. To do.

  The multilayer wiring board with a built-in capacitor element according to the present invention is characterized in that the main surface of the multilayer body of the capacitor element is in close contact with the insulating layer.

  The multilayer wiring board with a built-in capacitor element according to the present invention is characterized in that a side surface of the multilayer body of the capacitor element is in close contact with the insulating layer.

  In the multilayer wiring board with a built-in capacitor element according to the present invention, the lead electrode portion and the conductor penetrating the insulating layer disposed immediately below the lead electrode portion are arranged in a straight line in a cross-sectional view. It is characterized by.

  The multilayer wiring board with a built-in capacitor element according to the present invention is characterized in that the surface of the protruding portion of the lead electrode portion has a curved surface and is connected to the conductor.

  The multilayer wiring board with a built-in capacitor element according to the present invention is characterized in that 0.1 t ≦ T ≦ 0.5 t is satisfied, where T is the height of the protrusion and t is the thickness of the insulating layer.

  In the multilayer wiring board with a built-in capacitor element according to the present invention, the multilayer wiring board has a part of the conductor located in the upper and lower outermost layers as a connection pad on which a chip is mounted, and the connection pad and the lead electrode portion Are connected via the conductor.

  According to the multilayer wiring board with a built-in capacitor element of the present invention, the capacitor element is built in the cavity provided in at least one layer of the insulating layer. Since there is no need to provide a surface electrode and route the electrode, it is possible to achieve a lower inductance than conventional multilayer wiring boards with a built-in capacitor element. It is possible to provide a multilayer wiring board with a built-in capacitor element that does not cause malfunctions in devices.

  Furthermore, according to the multilayer wiring board with a built-in capacitor element of the present invention, a part of the wiring conductor located on the upper and lower outermost layers is used as a connection pad connected to an external electric circuit, and the lead electrode portions on both upper and lower main surfaces of the capacitor element Since the capacitor element and the external electric circuit can be electrically connected at the shortest distance, the inductance due to the wiring length is reduced In addition, a multilayer wiring board with a built-in capacitor element that has a large noise reduction effect can be obtained.

  Next, a capacitor element and a multilayer wiring board with a built-in capacitor element according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a sectional view showing an example of an embodiment of a capacitor element of the present invention. 2 is a cross-sectional view of the multilayer wiring board with a built-in capacitor element of the present invention incorporating the capacitor element of FIG. 1. In this example, a case where one capacitor element is built is shown. In these drawings, 1 is an electrode layer, 2 is a ceramic dielectric layer, 3 is a through hole, 4 is a lead electrode portion, and these mainly constitute the capacitor element 5 of the present invention. In addition, 6 is an insulating layer, 7 is a wiring conductor, 8 is a through conductor, 9 is a connection pad, and these and the capacitor element 5 mainly constitute the multilayer wiring board 11 with a built-in capacitor element of the present invention. FIG. 2 shows a multilayer wiring board 11 with a built-in capacitor element formed by laminating three insulating layers 6. The capacitor element built-in multilayer wiring substrate 11 has a cavity 10 formed in at least one of the insulating layers 6 located inside, and the capacitor element 5 is embedded in the cavity 10.

  The capacitor element 5 is a rectangular parallelepiped having a length, width, and height of 0.3 to 5 mm, respectively, and by alternately laminating ceramic dielectric layers 2 and electrode layers 1 as shown in a sectional view in FIG. Is formed.

As the material of the ceramic dielectric layer 2, various dielectric ceramic materials can be used. For example, a ceramic composition such as BaTiO ₃ , LaTiO ₃ · CaTiO ₃ · SrTiO ₃ , or a composition of BaTiO ₃ . Examples thereof include barium titanate-based materials such as solid solutions in which Ba, which is an element, is partially substituted with Ca and Ti is partially substituted with Zr or Sn, and lead-based perovskite-type structural compounds.

  Moreover, as a material which forms the electrode layer 1, metals, such as Pd, Ag * Pt * Ni * Cu * Pb, and those alloys are used, for example.

  Further, the capacitor element 5 has a lead electrode portion 4 formed by filling a through hole 3 penetrating in the vertical direction with respect to a large number of electrode layers 1.

  According to the capacitor element 5 of the present invention, the capacitor element 5 has the extraction electrode portion 4 in which the conductor is filled in the through hole 3 penetrating in the vertical direction with respect to the multiple electrode layers 1. The fine lead electrode portion 4 having a diameter of several tens of μm can be easily formed without printing the end face electrode or the surface electrode on the capacitor element 5, so that the capacitor element 5 can be miniaturized and the capacitor element 5 It is not necessary to arrange the end face electrode or the surface electrode and route the electrode, and the lead electrode portion 4 can be formed at the shortest distance immediately above the electrode layer 1, so that the inductance component due to the length of the lead electrode can be reduced. It can be made small, and can have excellent electrical characteristics with low power supply noise even in a high frequency region.

  The number of extraction electrode portions 4 is 4 to 50, and these are classified into a first extraction electrode portion and a second extraction portion. The electrode layer 1 constituting the capacitor element 5 is also classified into a first electrode layer and a second electrode layer, and the first electrode layer is electrically connected by the first lead electrode. The second electrode layer is electrically connected by the second lead electrode, and is disposed so as to face the first electrode layer with the ceramic dielectric layer 2 interposed therebetween.

  When the number of the extraction electrode portions 4 is less than 4, the effect of reducing the inductance tends to be reduced. When the number of the extraction electrode portions 4 exceeds 50, the area of the electrode layer 1 is reduced and the capacitance of the capacitor element 5 is reduced. Tend to be smaller.

  In addition, it is important for the arrangement of the extraction electrode portion 4 that the first extraction electrode portion and the second extraction electrode portion are adjacent to each other in order to reduce the inductance, and the first extraction electrode portion and the second extraction electrode portion. However, it is preferable to arrange them so as to be positioned at adjacent lattice points of the lattice-like arrangement, since the inductance can be further reduced.

  Furthermore, the interval between adjacent extraction electrode portions 4 is 50 to 400 μm. If it is smaller than 50 μm, there is a risk of short-circuiting when the conductive paste is filled, and if it is larger than 400 μm, the effect of reducing inductance tends to be small.

  The through-hole 3 formed in such a capacitor element 5 is formed by punching a laminated body including the electrode layer 1 and the ceramic dielectric layer 2 or performing laser punching by UV-YAG laser, excimer laser, carbon dioxide gas laser, or the like. It is preferably formed by a laser drilling process in order to form the fine through-hole 3 by a method such as an installation process. Further, the diameter of the through hole 3 is several tens of μm to several mm, and may be appropriately determined according to the size of the capacitor element 5.

  The through hole 3 may be subjected to an ultrasonic cleaning process, a desmear process, or the like after the punching process or the laser drilling process in order to improve the electrical connection between the conductor filled inside and the electrode layer 1. .

  The conductor filled in the through hole 3 is made of a metal such as Pd, Ag, Pt, Ni, Cu, or Pb, or an alloy thereof. In particular, the electrical connection with the electrode layer 1 is improved. From the above, it is preferable to contain the same material as the electrode layer 1.

  The conductor filled in the through hole 3 is filled with a conductive paste in which metal powder is dispersed in an organic vehicle in which an organic binder resin is dissolved in an organic solvent by a method such as screen printing. Is formed. In addition to these, various dispersants, activators, plasticizers and the like may be added to the vehicle as necessary.

  Further, the organic binder resin used for the conductive paste has a role of uniformly dispersing the metal powder and imparting an appropriate viscosity and rheology for embedding in the through hole 3. For example, acrylic resin, phenol resin, alkyd resin, rosin Examples include ester, ethyl cellulose, methyl cellulose, PVA (polyvinyl alcohol), and polyvinyl butyrate. In particular, it is preferable to use an acrylic resin from the viewpoint of improving the dispersibility of the metal powder.

  Further, the organic solvent used in the conductive paste has a role of dissolving the organic binder resin to disperse the metal powder particles and making the entire mixed system into a paste, such as α-terpineol or benzyl alcohol. Alcohol-based, hydrocarbon-based, ether-based, ester-based such as BCA (butyl carbitol acetate), naphtha, etc. are used. Especially from the viewpoint of improving the dispersibility of metal powder, alcohol-based such as α-terpineol It is preferable to use a solvent.

  Furthermore, the conductive paste can be a paste to which glass frit or ceramic frit is added in order to increase the adhesive strength to the capacitor ceramic after embedding and firing. The glass frit or ceramic frit in this case is not particularly limited. For example, a borosilicate or zinc borosilicate glass or a titanium oxide such as titania / barium titanate is appropriately used. Can do.

  Such a capacitor element 5 is manufactured by the following method.

First, a Ni metal paste prepared by a known paste forming method is formed into a predetermined shape by a screen printing method on the surface of, for example, a BaTiO ₃ dielectric ceramic green sheet to be a ceramic dielectric layer 2 prepared by a known sheet forming method. To form an unsintered electrode layer, which are subsequently laminated in a predetermined order, and are pressed to obtain a laminate. Then, after forming a plurality of through holes 3 at predetermined positions by laser in this laminated body, the through holes 3 are washed with water by ultrasonic cleaning. The through holes 3 are made of, for example, Ni metal powder, acrylic resin, and α-terpineol. The conductive paste is filled by screen printing. Thereafter, these are manufactured by firing at a temperature of 800 to 1600 ° C.

  The conductor filled in the through hole 3 is removed from the organic binder resin and the solvent after firing to form the lead electrode portion 4.

  In the present invention, the lead electrode portion 4 is characterized by protruding outside the main surface of the capacitor element 5, and this is important in the present invention.

  According to the capacitor element 5 of the present invention, since the lead electrode portion 4 protrudes from the main surface of the capacitor element 5, when the capacitor element 5 is built in the multilayer wiring board and the capacitor element built-in multilayer wiring board 11 is manufactured, By uniformly applying pressure to the through conductor 8 formed in the insulating layer 6 in the pressurizing step when the capacitor element built-in multilayer wiring substrate 11 is produced, it is possible to increase the conductor filling density of the through conductor 8 and reduce the electric resistance. As a result, the inductance component of the through conductor 8 can be reduced, noise is less generated, and no malfunction occurs in electronic devices such as communication devices.

  In such an extraction electrode portion 4, the height T of the portion protruding to the outside of the main surface of the capacitor element 5 is in the range of 0.1 t to 0.5 t when the thickness of the insulating layer 6 is t. Is preferred. When the height T of the protruding lead electrode portion 4 is less than 0.1 t, sufficient effect is not exerted on the through conductor 8, so that the effect of increasing the conductor filling density is reduced, and the inductance of the through conductor 8 tends to increase. . On the other hand, if it exceeds 0.5 t, when the insulating layer 6 is laminated and pressed, the through conductor 8 is excessively pressurized, and the capacitor built-in multilayer substrate 11 tends to be warped. Therefore, the height T of the protruding portion of the extraction electrode portion 4 protruding outside the main surface of the capacitor element 5 is preferably in the range of 0.1 t to 0.5 t, where t is the thickness of the insulating layer 6.

  Further, the diameter of the cross section in the direction parallel to the insulating layer 6 of the extraction electrode portion 4 protruding outside the main surface of the capacitor element 5 is preferably larger than the diameter of the through conductor 8 formed in the insulating layer 6. By making the diameter larger than the diameter of the through conductor 8, when the insulating layer 6 is laminated and pressed, the through conductor 8 is uniformly pressurized, so that the density of the through conductor 8 is increased and the electrical resistance can be reduced. .

  As a method for projecting the lead electrode portion 4 outside the main surface of the capacitor element 5, the through hole 3 is formed in the ceramic green sheet laminate before firing, which becomes the ceramic dielectric layer 2, and the inside of the through hole 3 After the metal electrode is filled with the lead electrode portion 4 and before firing, the surface portion of the ceramic green sheet laminate other than the lead electrode portion 4 is subjected to a roughening treatment by brush polishing, or The lead electrode portion 4 can be protruded by irradiating the surface of the ceramic green sheet laminate with a laser to remove a part of the surface of the ceramic green sheet. Alternatively, after the through-hole 3 is formed in the ceramic green sheet laminate, a mask having a desired thickness in which the portion of the through-hole 3 is opened is placed on the surface of the ceramic green sheet, and the through-hole 3 is used from above by using a squeegee or the like. It is also possible to form the lead electrode portion 4 corresponding to the thickness of the mask by filling it with a metal conductor, and finally firing them. Furthermore, after attaching a protective film such as a resin film on the surface of the ceramic green sheet laminate, a through hole 3 is formed, a metal conductor is filled into the through hole 3 from above the protective film, and then the protective film is peeled off. Alternatively, it may be formed by baking with a protective film attached. Further, the ceramic dielectric layer 2 portion on the surface of the capacitor element 5 after firing may be removed by a chemical method such as etching, and the lead-out electric electrode portion 4 may be projected.

  The shape of the protruding portion of the extraction electrode portion 4 may be a semicircular or polygonal cross section in a direction perpendicular to the insulating layer 6, or a triangular shape with a sharp tip. From the viewpoint of increasing the contact area of 8 and strengthening the close contact between the insulating layer 6 and the capacitor element 5, the cross-sectional shape of the extraction electrode portion 4 is preferably a semicircular shape. By making such a semicircular shape, the contact area between the protruding lead electrode portion 4 and the through conductor 8 is increased. As a result, the capacitor element 5 is constrained by the through conductor 8, There is no possibility of disconnection and disconnection from the through conductor 8.

  As a method for controlling the shape of the protruding portion of the lead electrode portion 4, the through hole 3 is formed in the ceramic green sheet laminate, and the shape of the mask when the through hole 3 is filled with the metal conductor is adjusted. Or it can adjust by grind | polishing the protrusion part surface of the extraction electrode part 4 after baking.

  Next, the multilayer wiring board 11 with a built-in capacitor element according to the present invention will be described in detail with reference to FIGS. 3A to 3G are cross-sectional views for each process for manufacturing the capacitor element built-in multilayer wiring substrate 11 of FIG.

  First, as shown in a cross-sectional view in FIG. 3A, an uncured precursor sheet 6a to be an insulating layer 6 is prepared, and the precursor sheet 6a has a diameter of about 17 to 150 μm at a desired location by laser processing. The through hole 12 is drilled.

  The uncured precursor sheet 6a is made of an organic resin material such as an epoxy resin, a bismaleimide triazine resin, a thermosetting polyphenylene ether resin, or a liquid crystal polymer resin, such as silane or titanate for improving mechanical strength. Coupling agents, antioxidants to improve thermal stability, light stabilizers such as UV absorbers to improve light resistance, halogen-based or phosphoric acid-based flame retardant to improve flame retardancy Agents, flame retardant aids such as antimony compounds, zinc borate, barium metaborate, zirconium oxide, and lubricants such as higher fatty acids, higher fatty acid esters, higher fatty acid metal salts, fluorocarbon surfactants to improve lubricity Aluminum oxide / silicon oxide / titanium oxide / oxidation for adjusting thermal expansion coefficient and / or improving mechanical strength Filler such as strontium oxide, zirconium oxide, calcium oxide, zeolite, silicon nitride, aluminum nitride, silicon carbide, aluminum borate, barium stannate, barium zirconate, strontium zirconate, or fibrous glass A base material such as a glass cloth woven in or a nonwoven fabric made of a heat-resistant organic resin fiber may be contained.

  Such a precursor sheet 6a is manufactured by the following method, for example, when using a composite material of a thermosetting resin and an inorganic insulating powder as an insulating material. First, a mixture in which a thermosetting resin is added to the inorganic insulating powder described above together with a solvent so that the amount of the inorganic insulating powder is 17 to 80% by volume is obtained, and this mixture is used as a kneader (kneader) or a means such as three rolls. To make a paste. Then, this paste is formed into a sheet by using a sheet forming method such as a rolling method, an extrusion method, an injection method, or a doctor blade method, and then dried by heating to a temperature at which the thermosetting resin is not completely cured. A precursor sheet 6a to be the insulating layer 6 is manufactured. The paste is preferably added with a solvent such as toluene, butyl acetate, methyl ethyl ketone, methanol, methyl cellosolve acetate, isopropyl alcohol, methyl isobutyl ketone, dimethylformamide, etc. to a composite material of thermosetting resin and inorganic insulating powder. The fluid having a predetermined viscosity is preferably 100 to 3000 poise, although it depends on the sheet molding method.

  Next, as shown in a cross-sectional view in FIG. 3B, the through-hole 12 is filled with a conductive paste made of copper, silver, gold, solder, or the like by using a well-known screen printing method or the like. A conductor 8 is formed.

  Next, as shown in a cross-sectional view in FIG. 3C, a wiring conductor 7 to be attached to the front and back surfaces of the precursor sheet is prepared. Then, as shown in a sectional view in FIG. 3D, the wiring conductor 7 is superimposed and transferred onto the front and back surfaces of the precursor sheet so that the necessary wiring conductor 7 and the through conductor 8 are electrically connected. To do.

  In this embodiment, the wiring conductor 7 is formed by a transfer method. Such a wiring conductor 7 is formed by the method described below. First, a metal foil having a thickness of 1 to 35 μm made of one or two or more alloys selected from copper, gold, silver, aluminum and the like is bonded to the surface of the support 13 such as a release sheet, and the desired surface is adhered to the surface. After forming a resist layer so as to be a mirror image pattern of the wiring pattern, a wiring conductor 7 having a mirror image of a predetermined wiring pattern is formed by etching and resist removal. Next, the deposition of the wiring conductor 7 on the front surface and the back surface of the precursor sheet 6a is performed by superimposing the support 13 on which the wiring conductor 7 is formed on the front surface and the back surface of the precursor sheet 6a. After pressurizing and heating under conditions of 5 to 10 MPa and a temperature of 60 to 150 ° C., the support 13 is peeled off so that the wiring conductor 7 is attached to the precursor sheet as shown in the sectional view of FIG. Is done. At this time, it is important that the through conductor 8 is in an uncured state that is not completely cured.

  As the support 13, known materials such as polyethylene terephthalate, polyethylene naphthalate, polyimide, polyphenylene sulfide, vinyl chloride, and polypropylene can be used. The thickness of the support 13 is suitably 10 to 100 μm, preferably 25 to 50 μm. If the thickness of the support 13 is less than 10 μm, the wiring conductor 7 formed by deformation or bending of the support 13 is likely to break, and if the thickness exceeds 100 μm, the flexibility of the support 13 is lost. There is a tendency that peeling of the support 13 becomes difficult. In order to form the electrolytic metal foil on the surface of the support 13, a known adhesive such as acrylic, rubber, silicon, or epoxy may be used.

  3 (f), a plurality of precursor sheets 6a manufactured through the steps (a) to (f) and the capacitor element 5 are prepared. The tip of the portion 4 and the through conductor 8 are aligned and placed, and a precursor sheet is laminated, and hot pressing is performed for 30 minutes to 24 hours under conditions of a temperature of 150 to 300 ° C. and a pressure of 0.5 to 10 MPa. Then, the precursor sheet and the conductive paste are completely cured to complete the capacitor element built-in multilayer wiring board 11 of the present invention shown in a sectional view in FIG.

  Note that the cavity 10 that accommodates the capacitor element 5 may be formed by a laser method or a punching method at a location where the capacitor element 5 of the precursor sheet 6a is accommodated before the precursor sheet 6a is laminated. .

  Thus, according to the multilayer wiring board 11 with a built-in capacitor element of the present invention, since the capacitor element 5 is built in the cavity 10 provided in at least one layer of the insulating layer 6, electrodes are printed on the conventional end face. Capacitor element built-in multilayer wiring that can achieve lower inductance than multilayer circuit boards with built-in capacitor elements, generates less noise, and does not cause malfunction in electronic devices such as communication devices The substrate 11 can be obtained.

  Further, according to the multilayer wiring board 11 with a built-in capacitor element of the present invention, a part of the wiring conductor 7 located in the upper and lower outermost layers is used as the connection pad 9 connected to the external electric circuit, and the upper and lower main surfaces of the capacitor element 5 Since the lead electrode portion 4 is electrically connected to the connection pad 9 through the through conductor 8, the capacitor element 5 and the external electric circuit can be electrically connected at the shortest distance. The inductance due to the length can be reduced, and the multilayer wiring board 11 with a built-in capacitor element can be obtained that has a large noise reduction effect.

  The multilayer wiring board 11 with a built-in capacitor element according to the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, the above-described embodiment Then, the multilayer wiring board 11 with a built-in capacitor element is manufactured by laminating four insulating layers 6. However, the multilayer wiring board 11 with a built-in capacitor is fabricated by laminating two, three, or five or more insulating layers 6. May be. In the above-described embodiment, the insulating layer 6 including the capacitor element 5 is one layer, but may be two layers (including a continuous layer) or more. Furthermore, two or more lead electrode portions 4 formed on the capacitor element 5 may be formed per electrode.

It is sectional drawing which shows an example of embodiment of the capacitor | condenser element of this invention. It is sectional drawing of the multilayer wiring board with a built-in capacitor | condenser element of this invention which incorporated the capacitor | condenser element of FIG. (A)-(g) is sectional drawing for every process for demonstrating the manufacturing method of the multilayer wiring board with a built-in capacitor element of this invention, respectively.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ...... Electrode layer 2 ... Ceramic dielectric layer 3 ... Through-hole 4 ... Extraction electrode Part 5... Capacitor element 6... Insulating layer 7... Wiring conductor 8. ······································································································

Claims (8)

A multilayer wiring board having a laminate formed by laminating a plurality of insulating layers made of a resin, and a plurality of conductors penetrating the insulating layers;
A capacitor element comprising: a laminate formed by alternately laminating a large number of electrode layers and ceramic dielectric layers; and a plurality of lead electrode portions penetrating the laminate in the lamination direction;
The capacitor element is fixed to the insulating layer by stacking a precursor sheet serving as the insulating layer on top and bottom of the capacitor element and curing the precursor sheet, and from the upper and lower surfaces of the multilayer wiring board It is arranged inside the multilayer wiring board in a separated state ,
The plurality of insulating layers include an insulating layer having a first main surface facing the capacitor element in a vertical direction and a second main surface located on the opposite side of the first main surface. ,
Capacitor element built-in multilayer wiring , wherein the lead electrode portion has a tip portion protruding from the first main surface to the second main surface side and connected to the conductor at the protruding portion substrate. In the multilayer wiring board with a built-in capacitor element according to claim 1,
A part of the lead electrode portion protrudes outside the main surface of the multilayer body of the capacitor element, and is connected to the conductor. In the multilayer wiring board with a built-in capacitor element according to claim 1 or 2,
A multilayer wiring board with a built-in capacitor element, wherein a main surface of the multilayer body of the capacitor element is in close contact with the insulating layer. In the multilayer wiring board with a built-in capacitor element according to any one of claims 1 to 3,
A multilayer wiring board with a built-in capacitor element, wherein a side surface of the multilayer body of the capacitor element is in close contact with the insulating layer. In the multilayer wiring board with a built-in capacitor element according to any one of claims 1 to 4,
The multilayer wiring board with a built-in capacitor element, wherein the lead electrode portion and the conductor penetrating the insulating layer disposed immediately below the lead electrode portion are arranged in a straight line when viewed in cross section . In the multilayer wiring board with a built-in capacitor element according to claim 2,
The multilayer wiring board with a built-in capacitor element, wherein the surface of the protruding portion of the lead electrode portion has a curved surface and is connected to the conductor. In the multilayer wiring board with a built-in capacitor element according to claim 6,
A multilayer wiring board with a built-in capacitor element satisfying 0.1t ≦ T ≦ 0.5t, where T is the height of the protrusion and t is the thickness of the insulating layer. In the multilayer wiring board with a built-in capacitor element according to any one of claims 1 to 7,
In the multilayer wiring board, a part of the conductor located in the upper and lower outermost layers is used as a connection pad on which a chip is mounted, and the connection pad and the lead electrode part are connected via the conductor. A multilayer wiring board with a built-in capacitor element.

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