JP2003046220A - Method and device for inspecting substrate and method of manufacturing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for inspecting substrate by which defective can be discriminated quickly with accuracy at the time of performing visual inspections on a product for electronic equipment and, at the same time, discriminated defective can be removed efficiently from a group of nondefective, and to provide a method of manufacturing a substrate. SOLUTION: In a substrate manufacturing unit in which substrates are integrated in a preset array, whether individual work substrates are nondefective or defective are discriminated through nondestructive inspections and discriminated-result identification marks are put on the substrates. Thereafter, the unit is divided into the individual work substrates by cutting the unit, and the divided work substrates are housed in a tray without removing defective work substrates and transported to a substrate inspection device. The inspection device photographs the appearances of the work substrates, detects the discriminated-result identification marks on the photographed pictures, and discriminates the discriminated nondefective and defective work substrates in the tray. Then the device selects the nondefective and defective work substrates by removing the defective work substrates from the tray and, at the same time, a work substrate replenishing device replenishes the vacant housing spaces formed in the tray when the defective work substrates are removed from the tray with discriminated nondefective work substrates.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting an electronic device product, an inspection apparatus, and a method for manufacturing an electronic device product using the same.

[0002]

2. Description of the Related Art In the manufacture of electronic equipment products (wiring boards, plate-shaped sensors, IC devices, lead frames, etc.), a plurality of these products have a specific layout and are integrated in a plane. This is carried out by producing a substrate in a morphized form and then dividing the substrate into individual products. As described above, the method of forming the layout of each product on the plate-shaped substrate and dividing the layout can be expected to dramatically improve the yield, as compared with the case of individually manufacturing each product.

[0003]

It is not uncommon for these products to undergo a visual inspection to determine whether they are good or bad. For example, it may be checked whether or not protrusion-like deposits (hereinafter, also referred to as burrs) are formed around the product. In addition, it is necessary to detect another defect factor and determine it as a defective judgment product, remove the defective judgment product from the good judgment product group, and ship it.

However, in the past, the above-mentioned inspection was conducted by visual inspection, and a defective judgment product judged to be defective was taken by a person from the good judgment product group, so that it took time to perform the work. There was a problem that it took. In addition, there is a high possibility that an oversight will occur due to the visual inspection by human eyes.

An object of the present invention is to accurately and quickly identify defective products in the visual inspection of products for electronic devices (wiring boards, plate-shaped sensors, IC devices, lead frames, etc.). An object of the present invention is to provide an inspection method, an inspection device, and a manufacturing method for an electronic device product, which can efficiently remove a product from a shipped product (good judgment product group).

[0006]

In order to solve the above problems, in the board inspection method of the present invention, a predetermined number of work boards to be products for electronic equipment are individually determined in advance. In a board manufacturing unit integrated in an array, a non-destructive inspection judgment process is performed to judge whether each work board is good or bad, and the good or bad of each work board is based on the judgment result in the inspection judgment step. A determination identification mark applying step of applying a determination identification mark to the work substrate so that the determination result can be identified, and the inspection determination after the determination identification mark applying step or before the determination identification mark applying step. Separation step of cutting / separating the substrate manufacturing unit after the inspection judgment by the process into individual work boards, and storing the work boards after the cutting / separation in a tray without rejecting defects Based on the tray accommodating step and the determination identification mark, a defective determination product and a good determination product of the work substrate in the tray are identified, and one of them is excluded from the tray to perform a good / defective selection. And a sorting step.

The work substrate may be a product for electronic equipment used for parts of electronic equipment or the like, and more specifically, it may be a wiring board among the products for electronic equipment. it can.

The above work substrates are manufactured as a substrate manufacturing unit in which a predetermined number of these work substrates are integrated in a predetermined arrangement. In the present invention, the work substrate is separated from such a substrate manufacturing unit. First, as a result of the quality judgment being made in the inspection judgment step, a judgment identification mark for identifying these is formed in the work board by the judgment identification mark giving step. The determination identification mark giving step may be performed before separating each work substrate from the substrate manufacturing unit, or may be performed on each work substrate after separating the work substrate from the substrate manufacturing unit. Good. However, it is easier to perform the determination identification mark applying step in the substrate manufacturing unit than to apply the determination identification mark to the separated work substrate. Therefore, it is preferable to separate the work substrate from the substrate manufacturing unit after applying the determination identification mark.

According to the inspection method of the present invention, a plurality of work substrates to be inspected can be accommodated in the tray in the tray accommodation process and the inspection can be performed collectively, so that the time required for the inspection process can be reduced. Is possible. further,
In the present invention, since the good judgment product or the defective judgment product is identified by the judgment identification mark given based on the good / defective judgment result, and either of these is removed from the tray, the defective judgment product Alternatively, it is possible to use it in the subsequent step in a state where only the good judgment product is stored in the tray.

Further, in the present invention, the work substrate is accommodated in the tray in a form that does not eliminate defects. A work board that is a defective judgment product is also stored in a tray together with a work board that is a good judgment product, and in that state, the judgment identification mark formed on the work board is detected, and the defective judgment product is excluded. I have to. According to this, it is possible to omit the step of removing the defective product at the stage before the work substrate is stored in the tray. In such a process, the size of the work substrate becomes small and the handling becomes difficult. Therefore, it is not easy to determine the defect and remove the defective product. According to the present invention, since a plurality of work substrates are accommodated in the tray and the defect determination and the defect-determined product removal are performed in the tray, the work substrates can be easily handled.

The work substrate to which the present invention is applied has a front surface and a back surface that can be distinguished from each other. The determination identification mark formed on the work substrate is a front surface before the work substrate is individually separated from the substrate manufacturing unit. It can be formed so as to be aligned with either the back surface or the back surface. According to this, the determination identification mark is formed only on one surface regardless of which surface of the work substrate has the defect, and therefore only that surface is to be inspected. The mark can be easily detected. Further, since the judgment identification mark is applied in the state of the board manufacturing unit before being individually separated, the judgment identification mark applying step should be performed before the separation step of separating the work board from the board manufacturing unit. Therefore, the simplification of the determination identification mark providing step can be expected.

Further, in the selection step in the method of inspecting a substrate of the present invention, the work substrate (defective determination product) determined to be defective is removed, and in the tray from which the defective determination product is excluded, the defective determination product is excluded. It is preferable to replenish the resulting vacant accommodating portion with a work substrate that has been determined to be good (good determination product). A work substrate as a product for electronic devices may be shipped by being housed in a container such as a tray in a state of being individually separated from the substrate manufacturing unit. In such a case, by adopting the above method and diverting the tray as it is as a shipping tray, it is possible to ship the electronic device product in a state where only the good judgment product is accommodated in the tray. You can

Further, in the board inspection apparatus of the present invention, a predetermined number of work boards which are to be products for electronic equipment are individually separated from board manufacturing units integrated in a predetermined arrangement. A board inspection device in which a judgment identification mark is formed on the board to identify whether the work board is defective or not, and the appearance of the work board housed in a state where defects are not excluded in a tray in a separated state is shown. Appearance photographing means for photographing and obtaining appearance photographed image, good / defective decision means for detecting the judgment identification mark from the board image on the appearance photographed image, and judging the good / defective, and the good / defective judgment A work board removing means for removing either a defective judgment product or a good judgment product of the work board from the inside of the tray based on the judgment result by the means; With respect to the tray after removing the above, the work substrate in the tray is unified into either a good judgment product or a defective judgment product, that is, a good judgment product or a defective judgment product of the work substrate. And a work substrate replenishing means for replenishing either of them.

As described above, in the board inspection apparatus of the present invention, the appearance photographing means for photographing the appearance of the work board and the judgment identification mark are detected from the appearance photographed image obtained by the appearance photographing means, and the detection result is obtained. It has a good / defective judging means for judging good / bad of the work substrate based on the above. Further, it has a work board removing means for removing either a good judgment product or a defective judgment product of the work board from the tray based on the judgment result, and further, the work board in the tray judges whether the work board is a good judgment product or a defect judgment product. In order to unify it with any of the products, in the empty accommodation part by the removed work board,
It has a work substrate replenishing means for replenishing a good judgment product or a defective judgment product. By using such an inspection device, the above-described inspection method of the present invention can be effectively realized, and automation is also easy.

Further, in the substrate manufacturing method of the present invention based on the above-described substrate inspection method, a predetermined number of work substrates to be individually manufactured as electronic device products are integrated in a predetermined arrangement. A substrate manufacturing process for manufacturing a manufacturing unit, an inspection determination process for determining whether each work substrate is good or defective by a nondestructive inspection in the substrate manufacturing unit, and each work substrate based on the determination result in the inspection determination process. Goodness of
A judgment identification mark applying step of applying a judgment identification mark to the work substrate so that the failure judgment result can be identified, and the inspection after the judgment identification mark applying step or before the judgment identification mark applying step. A separation step of cutting / separating the substrate manufacturing unit after the inspection judgment by the judgment step into individual work boards; a tray accommodation step of accommodating the work boards after the cutting / separation in a tray without rejecting defects; A selection step of identifying a defective judgment product and a good judgment product of the work substrate in the tray on the basis of an identification mark and excluding either of them from the tray to judge whether the product is good or defective. Is characterized by.

In this way, after the work substrate is manufactured, it is judged whether the work substrate is good or bad by the above-mentioned inspection method,
By selecting these based on the result, the good judgment products can be shipped thereafter, and the defective judgment products can be selected to pursue the cause of the defect.

Further, a direction identification mark for identifying the in-plane direction and / or front / back direction of the work substrate is formed on the work substrate for identifying the accommodation direction of the work substrate with respect to the tray. The direction identification mark is detected for the accommodated work substrates, the accommodating direction of each work substrate with respect to the tray is determined based on the detection result, and the direction of the work substrates in the tray is corrected based on the determination result. Good to do. For example, there is a case where the accommodation direction of the work substrate with respect to the tray is considered. In such a case, as described above, the accommodation direction of the work substrate accommodated in the tray is determined, and the direction correction processing is performed based on the determination result to determine the accommodation direction of the work substrate accommodated in the tray. Make it the desired one. In such a direction correction process, the work substrate that needs the direction correction (hereinafter referred to as the substrate to be corrected) is removed from the tray, and the empty storage part after the removal is adjusted in advance so that it faces the normal direction. It is better to replenish another work substrate that has been removed. By adopting such a direction correction processing method, the step can be performed only by transferring and removing the substrate to be corrected from the tray, and the simplification of the step can be expected.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an example of a ceramic wiring board in which a work substrate 10 which is an object of the inspection method, the inspection apparatus, and the manufacturing method of the present invention is integrated. The ceramic wiring board 20 is formed by laminating a plurality of ceramic sheets as layers, and further, a board manufacturing unit 15 (enclosed by a black frame in FIG. 1) in which the work boards 10 to be products are integrally assembled. A plurality of portions (eight in FIG. 1) are included. The substrate manufacturing unit 15 is separated into individual work substrates 10, the work substrates 10 are housed in a tray described later, and are inspected by the inspection apparatus of the present invention by the method of the present invention. As shown in FIG. 2A, the substrate manufacturing unit 15 has work substrates 10 formed in a predetermined array.

As shown in FIG. 2 (b), the work substrate 10 provided in the substrate manufacturing unit 15 has a cavity 11 as a concave portion which is open to the uppermost layer side. This cavity 11 has an uppermost layer hole 11a penetrating the uppermost layer 12 and a second layer hole 11b penetrating the second layer 14 as a bonding pad layer, as shown in the sectional view taken along line AA of FIG. The second layer 14 is formed at a position corresponding to each other so that the second layer 14 is exposed.
It is a form that forms the bottom of. In addition, each layer (layer)
The number of laminated layers is not limited to this, and may be changed to an appropriate number (for example, 2 to 6 layers). Further, in the above description, the shape of the cavity 11 formed is a substantially rectangular shape, but the shape is not limited to this, and a suitable shape can be adopted as appropriate.

As shown in FIG. 2D, the surface of the work substrate 10 in which the cavity 11 (recess) is formed is marked as shown in FIG. 2D. On the surface M, the determination identification mark 5 is formed in the cavity 11 by using the marking ink in the determination identification mark applying step. Depending on the presence / absence of the judgment identification mark 5, a pass / fail judgment to be described later is made. In addition, in the present embodiment, the case where the determination identification mark 5 is formed on the defective determination product is described, but the present invention is not limited to this, and the determination identification mark is determined on the good determination product. A form in which 5 is formed may be adopted. In this case, the determination identification mark 5 can be formed by a method other than forming the determination identification mark 5 in the cavity 11 formed on the work substrate 10.

The determination identification mark 5 is formed by the work substrate 1
It is performed in the state before 0 is separated from the substrate manufacturing unit 15. The outline of a specific determination identification mark giving step and the steps performed before that are shown below. The board manufacturing unit 15 as shown in FIG. 1 is conveyed to an inspection determination device (not shown), and the appearances of the front and back sides of the board manufacturing unit 15 are photographed. Then, an inspection / determination process of good / defective of each work substrate 10 is performed based on the acquired appearance photographed image of the substrate manufacturing unit 15, and in the present embodiment, the work substrate 10 determined to be defective is processed. As a result, the determination identification mark 5 is attached to the work substrate 10.

The work substrate 10 having the determination identification mark 5 formed on the defective product as described above is individually divided from the substrate manufacturing unit 15 and the tray 30 shown in FIG. It is accommodated in the concave portion 31 as a work substrate accommodating portion. Further, the work substrate 10 separated from the substrate manufacturing unit 15 is accommodated in the tray in a form in which the in-plane direction and the front and back are aligned. The surface 30a of the tray 30 is formed with a plurality of such concave portions 31 arranged in a lattice pattern.
One work substrate 10 is accommodated in each of these recesses.

In addition, the above-mentioned determination identification mark giving step is
As shown in the present embodiment, it is desirable to carry out before separating the work substrate 10 from the substrate manufacturing unit 15 because it is possible to easily perform the pass / fail determination and the determination identification mark 5 is given. Board manufacturing unit 15 to work board 1
It may be performed after separating 0. For example, after accommodating the work substrate 10 in the tray 30 as described above,
The determination identification mark 5 may be provided by performing the inspection determination process of each work substrate 10. In this case, the order of the tray accommodation step, the inspection determination step and the determination identification mark giving step is opposite to that of the present embodiment.

Further, the work substrate 10 has directionality in its plane due to the relation of the form of its wiring and the like. FIG. 3B shows a work substrate 1 having directionality.
0 is an example. For example, a cutout portion 17 is formed in the exposed portion of the second layer 14, and the cutout portion 17 serves as a direction identification mark 17 for identifying the in-plane directionality of the work substrate 10 and / or the front and back sides. ing. Further, when the directionality can be identified, a work substrate 10 ′ as shown in FIG. 3C can also be exemplified. The work substrate 10 'has a rectangular appearance,
Therefore, vertical and horizontal identification is possible, and furthermore, the exposed form of the surface 14a of the second layer 14 in the cavity is different depending on the direction. In the work substrate 10 ′ having such a directivity, in order to facilitate detection of the accommodation direction of the work substrate with respect to the tray 30 as described later, the surface of the work substrate 10 ′ (for example, the surface 12a of the uppermost layer 12). ), The direction identification mark 18 may be formed. The direction identification marks 17 and 18 are preferably formed at the four corners of the work substrate 10 'in order to facilitate the discrimination of the in-plane direction of the work substrate.
Furthermore, by forming these direction identification marks 17 and 18 on only one side of the work substrates 10 and 10 ', it is possible to determine the front and back of the work substrates 10 and 10' based on their presence or absence.

In this way, the work substrate 10 accommodated in the tray 30 is sorted into the good judgment product and the defective judgment product by the following method or apparatus. FIG. 4 shows an example of the board inspection apparatus of the present invention. The board inspection apparatus 50 shown in FIG. 4 has an appearance inspection apparatus 51 that inspects the work board 10 in the tray 30.
On the basis of the detection result of the defective judgment product by the above, a work substrate removing device 52 as a work substrate removing means for removing the defective judgment product is provided, and the tray 30 after the work substrate removing device 52 removes The work substrate 10 contained in the tray 30 is a good judgment product which is accommodated in another tray so as to be unified as a good judgment product.
It has a work substrate replenishing device 53 for replenishing.

Further, the appearance inspection apparatus 51 includes appearance photographing means 51a for photographing the appearance of the work substrate 10, and the detection of the identification mark 5 from the appearance photographing image acquired by the appearance photographing means 51a. Based on the result, a computer 54 incorporating a microprocessor (not shown) as a good / defective determination means is connected. The determination result by the microprocessor is
In the removal of the work substrate 10 by the work substrate removing device 52 and the work substrate replenishing device 53 which are stored in the memory of the computer 54 and are also connected to the computer 54, the position of the removal target is determined in the replenishment of the work substrate 10, and It is used to determine the position of the empty storage unit to be replenished.

Hereinafter, a schematic view of the board inspection apparatus 50 of FIG.
The outline of the inspection method of the present invention will be described with reference to FIG. First, in S11 of FIG. 5, the work substrate 10 to be inspected is supplied to the substrate inspection apparatus 50 in a form of being accommodated in the tray 30. Then, the tray 30 accommodating the work substrate 10 is conveyed to each region set so that each process is performed, and each process is performed.

As shown in FIG. 5, the inspection 1 is performed in S12.
As the determination identification mark 5 and the direction identification mark 17, 1
8 is detected, and the outer peripheral edge of the work substrate 10 is detected as inspection 2 in S13. Then, based on these detection results, in S14, it is determined whether or not there is a work substrate 10 (corrected substrate) in the tray 30 that is not in the normal storage direction. The storage direction of 10 is corrected (S15).

The appearance photographing means 51a for photographing the appearance of the work substrate 10 can detect the judgment identification mark 5, the direction identification marks 17 and 18, and the outer peripheral edge of the work substrate 10 as an appearance photographed image which can be identified. To use. Specifically, appearance photographing means 51a such as a CCD camera
Can be adopted. Further, in the present embodiment, the appearance photographing means 5 for photographing the appearance of the work substrate 10 is used.
Reference numeral 1a denotes a first appearance photographing means 51a 'for detecting the judgment identification mark 5 and the direction identification marks 17, 18 formed on the work substrate 10, and an outer peripheral edge of the work substrate 10 on an appearance photographed image. Second appearance photographing means 51 for
a ''. The appearance photographing device 51a
Is a first appearance photographing means 51a ′ and a second appearance photographing means 51
a '' are connected by the connecting portion 51d and are integrated, and are simultaneously moved by the driving portions 51b and 51c to perform the same plane movement on the tray 30 and the individual work substrates accommodated in the tray 30. The appearance is photographed for 10. After this step, the tray 30 is conveyed to the work substrate removing device 52 and the work substrate replenishing device 53 shown in FIG. 4, and the next process is performed.

In the determination result of the storage direction in S14, if there is a substrate to be corrected in the tray 30 that needs the direction correction, the storage direction is corrected (S15). The orientation of the work substrate is corrected in the form shown in FIG. Figure 6
In the work substrate 10 having the directionality shown in (a),
The direction of the side on which the cutout portion 17 is formed is the reference direction of the work substrate 10. Such a work substrate 1
When 0 is accommodated in the tray 30 as shown in FIG. 6B, it is assumed that the normal accommodation direction is when all the work substrates in the tray 30 are accommodated in the same direction. The work substrate 35 accommodated in a direction relatively different from that of the other work substrates 10 is a substrate to be corrected whose accommodation direction needs to be corrected. The accommodation direction of the work substrate 10 can be determined by the position of the direction identification marks 17 and 18 on the external appearance photographed image. Then, in the direction correcting process, the work substrate 10 whose relative relationship in the in-plane direction with respect to the tray 30 is determined to be abnormal as shown in FIG. 7 is temporarily taken out from the tray 30 and the direction is corrected by the in-plane direction process. Then tray 30
The process of returning to can be performed. By such steps, the accommodation direction of the substrate to be repaired 35 is corrected as shown in FIG.

Similarly, it is detected from the appearance observation image by the first appearance photographing means 51a 'whether or not the judgment identification mark 5 for identifying the good or bad of the work substrate 10 is formed on each work substrate 10, and the work is detected. Whether the substrate 10 is good or bad is determined (S16). In the present embodiment, FIG.
As shown in (a), the work substrate 10 ′ on which the determination identification mark 5 is formed is defined as the defect determination product 10 ′, and in S 17, the defect determination product 1 accommodated in the tray 30.
0 ′ drives the work substrate removing arm 52a of the work substrate removing apparatus 52 shown in FIG.
To discharge. At this time, the work substrate removing apparatus 52 uses the arm driving units 52c and 52d under the control of the computer 54 based on the determination result on the appearance photographed image by the appearance inspection apparatus 51.
Move the plane. The work substrate removing arm 52 is placed at a position in the tray 30 where the defective product 10 ′ exists.
The defective judgment product 10 'is held by driving a, and then the defective judgment product 1 is placed in the defective box 52b.
Discharge 0 '.

As described above, the defective judgment product 10 'is the tray 3
After being removed from within 0, as shown in FIG.
An empty accommodation portion 11 ′ is formed on the tray 30. Such a vacant accommodating portion 11 'is replenished with good judgment products by the work substrate auxiliary device 53 in the replenishment process of the work substrate 10 described later (S24). The process of replenishing the work substrate 10 will be described later in detail.

Further, in the present embodiment, the direction identification marks 17 and 18 are used to identify the front and back of the work substrate 10, and the substrate to be repaired removed from the tray 30 is turned upside down. It may be housed in 30. As shown in S18 of FIG. 5, it is determined whether the work substrate 10 is accommodated on the tray 30 upside down. Based on the detection result of the direction identification marks 17, 18 from the appearance photographed image by the first appearance photographing means 51a ′, it can be known whether the work substrate 10 is accommodated in the tray 30 in a normal state. When the direction identification marks 17, 18 as shown in FIG. 3 are not detected in the appearance photographed image by the first appearance photographing means 51a, such a work substrate 10 is a surface on which the direction discrimination marks 17, 18 are formed. It is determined that the tray 30 is housed in such a manner that its opposite surface is exposed on the surface of the tray 30. Accordingly, when the surface on which the direction identification marks 17 and 18 are not defined is defined as the back surface of the work substrate, as shown in FIG. 9A, the work substrate 10 ′ (hatched) which is housed in the tray 30 faces the back side. The work substrate) indicated by is the substrate to be modified 10 '. Then, as shown in FIG. 9B, the target substrate 10 '
Are transferred to the re-inspection tray 30 ′ shown in FIG. 4 by the work substrate removing device 52 (S20). After that, non-defective products are replenished in a replenishing process of the work substrate 10 described later. Transferring the work substrate 10 ′, which is housed in the reverse side, to the re-inspection tray 30 ′ is such a work substrate 10 ′.
This is because, basically, no defect has occurred, so that the front and back sides are reversed and the tray 30 is stored again.

Further, based on the detection result of the outer peripheral edge of the work substrate 10 by the second appearance photographing means 51a ″ in the inspection 2 of S13, it is determined whether or not a protrusion-like adhered substance (burr) is formed on the work substrate 10. A determination is made (S19).
As shown in FIG. 11A, on the outer peripheral edge of the work substrate 10 separated from the substrate manufacturing unit 15, the protrusion-like adhered matters (burrs) 37 due to the work substrates 10 being integrated. May have been formed. In the present embodiment, the work substrate 10 in the tray 30.
The appearance of the front surface or the back surface of the work is photographed, and the presence or absence of protruding deposits (burrs) 37 on the outer peripheral edge of the work substrate 10 is detected in the substrate image on the appearance photographed image obtained by the photograph, and the work is detected based on the detection result. The substrate 10 is newly treated as a defective product, and the sorting process is performed. Specifically, as shown in FIG. 11B, an edge line 38 of the work substrate 10 is determined on the board image, and a circumscribing reference line 39 parallel to the edge line 38 is drawn on the board image. The defect determination is performed according to the distance (hereinafter, also referred to as burr length) t between the circumscribing reference line 39 and the edge line 38. That is, the burr length t is
If the burr length t defined by the number of pixels between the edge line 38 and the circumscribing reference line 39 is greater than or equal to the specific length, the work having such a burr 37 is formed. The substrate 10 is a defective product. Such detection of the burr 37 is performed on all the outer peripheral edges of the work substrate 10, and a product in which even one burr having a length t of a specific length or more is detected is determined as a defective determination product. Then, the work substrate 10 determined as a defective product due to the formation of the burr 37 is transferred to the re-inspection tray 30 ′ by the work substrate removing device 52 shown in FIG. 4 in order to pursue the cause of the burr 37. To be done.

As a result of the above judgment, the tray 30 from which the defective products, the reversed products and the like are removed is conveyed to the work substrate replenishing device 53 and the work substrate 10 replenishing process is performed. In the present embodiment, a part of the tray from which defective products have been eliminated as described above is diverted as a replenishment good product tray 30 ″ as shown in FIG. 4, and the good products in the replenishment good product tray are The other tray 30 is replenished to the empty storage portion 11 'generated by the rejection of defective products.

Specifically, the replenishment of the work substrate 10 to the tray 30 having the empty accommodating portion 11 'is performed as follows. As shown in S21 of FIG. 5, first, it is determined whether or not the good replenishment tray 30 ″ exists in the good replenishment tray stock 53b, and the good replenishment tray 30 ″ is supplied.
Is not present in the good replenishment tray stock 53b, the tray 3 being conveyed to the work substrate replenishing device 53
0 is newly diverted as the replenishment good product tray 30 ″ and moved to the replenishment good product tray stock 53b (S2
2). If the good replenishment tray 30 ″ already exists, it is determined in S23 whether or not the tray 30 has an empty accommodation portion 11 ′. Strictly speaking, in the present embodiment, in each of the determination steps S16, S18, and S19, it is in a state in which the position on the tray 30 at which the empty accommodation portion 11 'is formed has already been determined. Vacant storage unit 1
When the existence of 1'is confirmed, the work substrate replenishing arm 53a shown in FIG. 4 is driven by the arm driving portions 53c and 53d, and as shown in FIGS. 8 (c) and 9 (c), The non-defective product tray 30 ″ stores the non-defective product in the empty accommodation portion 11 ′.
Will be replenished. During the replenishment process, when no good products are stored in the replenishment good product tray 30 ″, the empty replenishment good product tray 30 ″ is moved to the replenished empty tray stock 53e. Then, the work substrate replenishing device 5
Tray 30 existing in No. 3 is newly added as a good quality tray for replenishment 3
It is diverted as 0 ''.

As described above, the empty storage portion 1 of the tray 30.
When all non-defective products are replenished in 1 ′, the work substrate 10 determined to be non-defective products as shown in FIG. 4 in S25 of FIG.
The non-defective tray 33 containing only the above is ejected from the substrate inspection apparatus 50 by the ejection mechanism 55.

When the accommodation direction of the work substrate 10 accommodated in the tray 30 is corrected, it is also possible to correct it as shown in FIG. That is, the work substrate 35 for which the relative positional relationship in the in-plane direction with respect to the tray 30 shown in FIG.
As shown in FIG. 10B, another work substrate 10 that is adjusted in advance so as to face a normal direction may be replenished.

In the above embodiment, the ceramic wiring board is described as an example of the board, but the present invention is not limited to this. For example, among the wiring boards, those made of a heat resistant resin plate, a fiber reinforced resin plate or the like can be preferably used, and further, a plurality of works such as a plate sensor, an IC device such as an IC chip and a lead frame can be used. The present invention can be widely applied to a multi-cavity electronic device product in which an integrated product unit is manufactured in a manufacturing process while maintaining a planar layout.

[Brief description of drawings]

FIG. 1 is a schematic view showing an example of a ceramic wiring board.

FIG. 2 is a diagram showing an example of a work substrate.

FIG. 3 is a schematic diagram showing an example of how a work substrate is accommodated in a tray and an example of a direction identification mark formed on the work substrate.

FIG. 4 is a schematic diagram showing an inspection apparatus of the present invention.

FIG. 5 is a flowchart showing the flow of the inspection method of the present invention.

FIG. 6 is a schematic diagram illustrating an example of a form of accommodating a work substrate having directionality in a tray and an example of direction correction processing.

FIG. 7 is a schematic diagram showing one form of a direction correction process.

FIG. 8 is a view showing an example of a work substrate removing step and a replenishing step.

FIG. 9 is a diagram showing an example of a work substrate removing process and a replenishing process different from those in FIG. 8;

FIG. 10 is a diagram illustrating an example of direction correction processing.

FIG. 11 is a diagram illustrating a burr formation mode and a burr length detection method.

[Explanation of symbols]

5 Judgment identification mark 10, 10 'work board (product for electronic equipment) 11 Cavities (recesses) 11 empty accommodation 12 Top layer 12a Top layer surface 14 Second layer 14a Second layer surface 16 First Layer 16a First layer surface 15 Board manufacturing unit (board) 17 Notch (direction identification mark) 18 direction identification mark 30 trays 30 're-inspection tray 30 ″ good tray for replenishment 33 Good tray 37 Adhesion on the protrusion (burr) 38 Edge line 39 circumscribed reference line 50 board inspection equipment 51 Visual inspection device 51a Appearance photographing means 52 Work substrate removing device (work substrate removing means) 53 Work substrate replenishing device (work substrate replenishing means)

Claims (13)

[Claims] 1. A non-destructive inspection of good or defective individual work boards in a board manufacturing unit in which a predetermined number of work boards to be individually manufactured as electronic device products are integrated in a predetermined arrangement. An inspection determination step of determining, and a determination identification mark applying step of assigning a determination identification mark to the work substrate so that the quality determination result of each work substrate can be identified based on the determination result in the inspection determination step. And a separation step of cutting / separating the substrate manufacturing unit after the inspection determination by the inspection determination step into individual work substrates after the determination identification mark application step or prior to the determination identification mark application step, A tray accommodation step of accommodating the work substrate after cutting / separating in a tray in a manner that does not eliminate defects, and the work substrate in the tray is determined based on the judgment identification mark. Identifying a determining product and the good judgment products, inspection method of a substrate for a sorting step of performing selection of good or bad by eliminating the one from the tray, characterized in that it comprises a. 2. The work substrate has a front surface and a back surface that can be distinguished from each other, and the determination identification mark is formed between the front surface and the back surface before the work substrate is individually separated from the substrate manufacturing unit. The method for inspecting a substrate according to claim 1, wherein the substrate is formed so as to be aligned with any one of them. 3. The work substrate (defective determination product) determined to be defective from the tray in the sorting step is excluded, and the tray from which the defective determination product is excluded is emptied into a vacant accommodating portion caused by the rejection of defective determination product. The board inspection method according to claim 1 or 2, wherein the work board (good judgment product) judged to be good is replenished. 4. A part of the tray from which the defective judgment product has been eliminated is diverted as a good judgment product tray for replenishment, and a good judgment product in the good judgment product tray for replenishment is judged as a defective judgment product in another tray. 4. The method for inspecting a substrate according to claim 1, wherein the empty accommodation portion generated by the removal is replenished. 5. The work substrate is provided with a direction identification mark for identifying at least one of an in-plane direction and a front surface of the work substrate for identifying a housing direction of the work substrate with respect to the tray, For the work substrate accommodated in the tray, the direction identification mark is detected, and the accommodating direction for the tray of each work substrate is determined based on the detection result, and based on the determination result, the The method for inspecting a substrate according to any one of claims 1 to 4, wherein the process for correcting the direction of the work substrate in the tray is performed. 6. In the direction correcting process, the work substrate (hereinafter, referred to as a substrate to be corrected) that needs the direction correction is removed from the tray, and the empty storage part after the removal is directed in a normal direction in advance. The method for inspecting a substrate according to claim 5, wherein another work substrate adjusted in step 1 is replenished. 7. The direction identification mark is for identifying the front and back of the work substrate, and the substrate to be repaired removed from the tray is accommodated in the tray with the front and back reversed. Item 7. A method for inspecting a substrate according to Item 6. 8. The work substrate, in which the relative positional relationship in the in-plane direction with respect to the tray is determined to be abnormal in the direction correcting process, is temporarily taken out from the tray and the direction is corrected by an in-plane rotating process, and then the tray is placed on the tray. The method for inspecting a substrate according to claim 6, wherein the returning process is performed. 9. The appearance of the front surface or the back surface of the work substrate is photographed in the tray, and the presence or absence of a protrusion-like adhered substance on the outer peripheral edge of the work substrate is detected on a substrate image obtained thereby, and the detection is performed. 9. The work substrate is newly determined to be the defective determination product based on the result, and a sorting process is performed.
The method for inspecting a substrate according to any one of 1. 10. An edge line of the work substrate is determined on the substrate image, and a circumscribing reference line parallel to the edge line is drawn on the substrate image to determine a distance between the circumscribing reference line and the edge line. The method of inspecting a substrate according to claim 9, wherein the defect determination is performed according to the defect determination. 11. In the substrate manufacturing unit, the work substrates are integrated so that the front and back sides are aligned, and the work substrates separated from the substrate manufacturing unit are aligned in the in-plane direction and the front and back sides. The tray is housed in a tray.
0. The method for inspecting a substrate according to any one of 0. 12. A predetermined number of work boards to be individually manufactured as electronic device products are provided on the work boards, each of which is separated from a board manufacturing unit integrated in a predetermined arrangement.
A device for inspecting a substrate on which a judgment identification mark for distinguishing between good and defective is formed, and an image of the appearance of the work substrate housed in a state where defects are not excluded in a tray in a separated state is taken, Appearance photographing means for acquiring the appearance photographed image, good / defective judgment means for detecting the judgment identification mark from the board image on the appearance photographed image, and judging its good / defective, judgment by the good / defective judgment means Based on the result, the work substrate removing means for removing either the defective judgment product or the good judgment product of the work substrate from the inside of the tray, and the tray after the removal of either the good judgment product or the defective judgment product On the other hand, either the good judgment product or the defective judgment product of the work substrate is selected so that the work substrate in the tray is unified as a good judgment product or a defective judgment product. And a work board replenishing means for replenishing the work board. 13. A substrate manufacturing step of manufacturing a substrate manufacturing unit in which a predetermined number of work substrates to be individually manufactured as electronic device products are integrated in a predetermined arrangement, and in each of the substrate manufacturing units, Of the work board so that the good / defective judgment result of each work board can be discriminated based on the judgment result by the non-destructive inspection. A determination identification mark applying step of applying the determination identification mark to, and before or after the determination identification mark applying step, the substrate manufacturing unit after the inspection determination by the inspection determination step A separation step of cutting / separating the work board, a tray accommodating step of accommodating the work board after the cutting / separation in a tray so as not to reject defects, and the judgment identification mark A work board in the tray based on which a defective judgment product and a good judgment product are discriminated, and one of them is excluded from the tray to perform a good / defective selection process. Substrate manufacturing method.